{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T13:19:41Z","timestamp":1725455981631},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/icecs.2014.7050069","type":"proceedings-article","created":{"date-parts":[[2015,3,3]],"date-time":"2015-03-03T15:03:03Z","timestamp":1425394983000},"page":"650-653","source":"Crossref","is-referenced-by-count":1,"title":["An energy efficient multi-bit TSV transmitter using capacitive coupling"],"prefix":"10.1109","author":[{"given":"Johannes","family":"Gorner","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sebastian","family":"Hoppner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dennis","family":"Walter","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michael","family":"Haas","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dirk","family":"Plettemeier","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rene","family":"Schuffny","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.910807"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176900"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2013.2278123"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176902"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2076382"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2010.5642598"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1109\/3DIC.2012.6262963","article-title":"6 Tbps\/W, 1 Tbps\/mm2, 3D interconnect using adaptive timing control and low capacitance TSV","author":"furuta","year":"2012","journal-title":"3D Systems Integration Conference (3DIC) 2011 IEEE International"}],"event":{"name":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","start":{"date-parts":[[2014,12,7]]},"location":"Marseille, France","end":{"date-parts":[[2014,12,10]]}},"container-title":["2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)"],"original-title":[],"link":[{"URL":"https:\/\/2.zoppoz.workers.dev:443\/http\/xplorestaging.ieee.org\/ielx7\/7041007\/7049902\/07050069.pdf?arnumber=7050069","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T02:37:49Z","timestamp":1498185469000},"score":1,"resource":{"primary":{"URL":"https:\/\/2.zoppoz.workers.dev:443\/http\/ieeexplore.ieee.org\/document\/7050069\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":7,"URL":"https:\/\/2.zoppoz.workers.dev:443\/https\/doi.org\/10.1109\/icecs.2014.7050069","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}