{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T10:24:25Z","timestamp":1780050265507,"version":"3.53.1"},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"19","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2025,10,10]]},"DOI":"10.1587\/elex.22.20250308","type":"journal-article","created":{"date-parts":[[2025,7,9]],"date-time":"2025-07-09T22:10:20Z","timestamp":1752099020000},"page":"20250308-20250308","source":"Crossref","is-referenced-by-count":1,"title":["A novel T-P&amp;S hybrid thermal management structure for HPD-PCB and experimental investigation"],"prefix":"10.1587","volume":"22","author":[{"given":"Jianing","family":"Wang","sequence":"first","affiliation":[{"name":"School of Mechanical and Electrical Engineering, Beijing Institute of Graphic Communication"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dejun","family":"Ba","sequence":"additional","affiliation":[{"name":"School of Aeronautics and Astronautics, Zhejiang University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mingming","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Mechanical and Electrical Engineering, Beijing Institute of Graphic Communication"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mei","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Mechanical and Electrical Engineering, Beijing Institute of Graphic Communication"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] L. He, <i>et al.<\/i>: \u201cPerformance study of the MPC based on BPNN prediction model in thermal management system of battery electric vehicles,\u201d J. Therm. Sci. <b>33<\/b> (2024) 2318 (DOI: 10.1007\/s11630-024-2036-7).","DOI":"10.1007\/s11630-024-2036-7"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] S.K. Samal, <i>et al<\/i>.: \u201cThermal management of data centers: chip-scale cooling using novel distributed inlet-outlet jet impingement liquid cold plate,\u201d Applied Thermal Engineering <b>271<\/b> (2025) 126360 (DOI: 10.1016\/j.applthermaleng.2025.126360).","DOI":"10.1016\/j.applthermaleng.2025.126360"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] T. Dbouk and O. Mourad: \u201cA review on thermal management and heat dissipation strategies for 5G and 6G base stations: challenges and solutions,\u201d Energies <b>18<\/b> (2025) 1355 (DOI: 10.3390\/en18061355).","DOI":"10.3390\/en18061355"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] L. Shen, <i>et al<\/i>.: \u201cCollaborative thermal- and traffic-aware adaptive routing scheme for 3D network-on-chip systems,\u201d IEICE Electron. Express <b>18<\/b> (2021) 20200425 (DOI: 10.1587\/elex.18.20200425).","DOI":"10.1587\/elex.18.20200425"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] Q. Shi, <i>et al<\/i>.: \u201cSi3N4 fiber-reinforced epoxy resin composites with different c-BN content for printed circuit board applications,\u201d Composites Communications <b>56<\/b> (2025) 102355 (DOI: 10.1016\/j.coco.2025.102355).","DOI":"10.1016\/j.coco.2025.102355"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] J.W. Xian, <i>et al<\/i>.: \u201cThe role of microstructure in the thermal fatigue of solder joints,\u201d Nat. Commun. <b>15<\/b> (2024) 4258 (DOI: 10.1038\/s41467-024-48532-6).","DOI":"10.1038\/s41467-024-48532-6"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] J. Depiver, <i>et al<\/i>.: \u201cSolder joint failures under thermo-mechanical loading conditions\u2006\u2014\u2006a review,\u201d Advances in Materials and Processing Technologies, <b>7<\/b> (2020) 1 (DOI: 10.1080\/2374068X.2020.1751514).","DOI":"10.1080\/2374068X.2020.1751514"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] A.R. Dhumal, <i>et al<\/i>.: \u201cA comprehensive review on thermal management of electronic devices,\u201d J. Eng. Appl. Sci. <b>70<\/b> (2023) 140 (DOI: 10.1186\/s44147-023-00309-2).","DOI":"10.1186\/s44147-023-00309-2"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] Y. Zhang: \u201cImproved numerical-analytical thermal modeling method of the PCB with considering radiation heat transfer and calculation of components\u2019 temperature,\u201d IEEE Access <b>9<\/b> (2021) 92925 (DOI: 10.1109\/ACCESS.2021.3093098).","DOI":"10.1109\/ACCESS.2021.3093098"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] Y. Shen, <i>et al<\/i>.: \u201cThermal modeling and design optimization of PCB vias and pads,\u201d IEEE Trans. Power Electron. <b>35<\/b> (2020) 882 (DOI: 10.1109\/TPEL.2019.2915029).","DOI":"10.1109\/TPEL.2019.2915029"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] C. Deng, <i>et al<\/i>.: \u201cNumerical and experimental study of an integrated thermoelectric active cooling system for ultra-high temperature downhole electronics,\u201d Applied Thermal Engineering <b>271<\/b> (2025) 126341 (DOI: 10.1016\/j.applthermaleng.2025.126341).","DOI":"10.1016\/j.applthermaleng.2025.126341"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] L. Wang, <i>et al<\/i>.: \u201cActivate radiative cooling technology for data center cooling and energy efficiency analysis,\u201d J. Therm. Sci. <b>34<\/b> (2025) 1129 (DOI: 10.1007\/s11630-025-2146-x).","DOI":"10.1007\/s11630-025-2146-x"},{"key":"13","doi-asserted-by":"crossref","unstructured":"[13] A. Kumar, <i>et al<\/i>.: \u201cA comparative study and optimization of phase change material based heat sinks for thermal management of electronic components,\u201d Journal of Energy Storage <b>43<\/b> (2021) 103224 (DOI: 10.1016\/j.est.2021.103224).","DOI":"10.1016\/j.est.2021.103224"},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] S. Ali, <i>et al<\/i>.: \u201cA review of graphene reinforced Cu matrix composites for thermal management of smart electronics,\u201d Composites Part A: Applied Science and Manufacturing <b>144<\/b> (2021) 106357 (DOI: 10.1016\/j.compositesa.2021.106357).","DOI":"10.1016\/j.compositesa.2021.106357"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] W. Niu, <i>et al<\/i>.: \u201cOptimizing thermal performance in high-power-density 3D integrated circuits through advanced microchannel structures and multi-layer cooling,\u201d Applied Thermal Engineering <b>262<\/b> (2025) 125281 (DOI: 10.1016\/j.applthermaleng.2024.125281).","DOI":"10.1016\/j.applthermaleng.2024.125281"},{"key":"16","doi-asserted-by":"crossref","unstructured":"[16] J. Du, <i>et al<\/i>.: \u201cOptimization of embedded cooling for hotspots based on compound plate thermal spreading model,\u201d International Journal of Heat and Mass Transfer <b>231<\/b> (2024) 125866 (DOI: 10.1016\/j.ijheatmasstransfer.2024.125866).","DOI":"10.1016\/j.ijheatmasstransfer.2024.125866"},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] H. Hu, <i>et al<\/i>.: \u201cInterfacial delamination propagation in multi-layered high-density wiring electronic packaging structures,\u201d Proc. ASME 2000 International Mechanical Engineering Congress and Exposition (2000) 103 (DOI: 10.1115\/imece2000-2251).","DOI":"10.1115\/IMECE2000-2251"},{"key":"18","doi-asserted-by":"crossref","unstructured":"[18] Y. Cai, <i>et al<\/i>.: \u201cImproved thermal conductivities of vertically aligned carbon nanotube arrays using three-dimensional carbon nanotube networks,\u201d Carbon <b>196<\/b> (2022) 902 (DOI: 10.1016\/j.carbon.2022.05.050).","DOI":"10.1016\/j.carbon.2022.05.050"},{"key":"19","doi-asserted-by":"crossref","unstructured":"[19] K. Kim and J. Kim: \u201cMagnetic aligned AlN\/epoxy composite for thermal conductivity enhancement at low filler content,\u201d Composites Part B: Engineering <b>93<\/b> (2016) 67 (DOI: 10.1016\/j.compositesb.2016.02.052).","DOI":"10.1016\/j.compositesb.2016.02.052"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] Y. Inaki, <i>et al<\/i>.: \u201cAlN filler for high thermal conductive resin materials,\u201d 2020 International Symposium on Semiconductor Manufacturing (ISSM) (2020) 1 (DOI: 10.1109\/ISSM51728.2020.9377531).","DOI":"10.1109\/ISSM51728.2020.9377531"},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] Z. Xu, <i>et al<\/i>.: \u201cMultiphysics tensorial network analysis applied to PCB interconnect fatigue under thermal cycle aggression,\u201d IEEE Trans. Electromagn. Compat. <b>61<\/b> (2019) 1253 (DOI: 10.1109\/TEMC.2019.2911873).","DOI":"10.1109\/TEMC.2019.2911873"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] G. Lee, <i>et al<\/i>.: \u201cEnhanced thermal conductivity of polymer composites filled with hybrid filler,\u201d Composites Part A: Applied Science and Manufacturing <b>37<\/b> (2006) 727 (DOI: 10.1016\/j.compositesa.2005.07.006).","DOI":"10.1016\/j.compositesa.2005.07.006"},{"key":"23","doi-asserted-by":"crossref","unstructured":"[23] K.M. Lee, <i>et al<\/i>.: \u201cAdaptive thermal property control technique for holistic thermal management of mobile devices,\u201d IEICE Electron. Express <b>15<\/b> (2018) 20180187 (DOI: 10.1587\/elex.15.20180187).","DOI":"10.1587\/elex.15.20180187"},{"key":"24","doi-asserted-by":"crossref","unstructured":"[24] K. Matsuhashi, <i>et al<\/i>.: \u201cEffective methods to promote heat dissipation of wrist wearables,\u201d IEICE Electron. Express <b>18<\/b> (2021) 20210017 (DOI: 10.1587\/elex.18.20210017).","DOI":"10.1587\/elex.18.20210017"},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] D. Ba, <i>et al<\/i>.: \u201cComparative study of the effects of HFT(PCB) parasitics on single-ended forward DC\/DC converters,\u201d IEICE Electron. Express <b>21<\/b> (2024) 20240380 (DOI: 10.1587\/elex.21.20240380).","DOI":"10.1587\/elex.21.20240380"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] R. Hu, <i>et al<\/i>.: \u201cEmbedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips,\u201d IEICE Electron. Express <b>21<\/b> (2024) 20240442 (DOI: 10.1587\/elex.21.20240442).","DOI":"10.1587\/elex.21.20240442"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] Y. Satomi, <i>et al<\/i>.: \u201cThermal placement on PCB of components including 3D ICs,\u201d IEICE Electron. Express <b>17<\/b> (2020) 20190737 (DOI: 10.1587\/elex.17.20190737).","DOI":"10.1587\/elex.17.20190737"},{"key":"28","doi-asserted-by":"crossref","unstructured":"[28] S. Lu, <i>et al<\/i>.: \u201cImproved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials,\u201d IEEE Trans. Power Electron. <b>37<\/b> (2022) 6285 (DOI: 10.1109\/TPEL.2022.3142273).","DOI":"10.1109\/TPEL.2022.3142273"},{"key":"29","doi-asserted-by":"crossref","unstructured":"[29] H. Ma, <i>et al<\/i>.: \u201cA Fourier series-based steady-state thermal resistance model for power module,\u201d IEEE J. Emerg. Sel. Topics Power Electron. <b>12<\/b> (2024) 3912 (DOI: 10.1109\/JESTPE.2024.3398440).","DOI":"10.1109\/JESTPE.2024.3398440"},{"key":"30","doi-asserted-by":"crossref","unstructured":"[30] T. Piovesan, <i>et al<\/i>.: \u201cAnalytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters,\u201d IEEE J. Emerg. Sel. Topics Power Electron. <b>12<\/b> (2024) 4979 (DOI: 10.1109\/JESTPE.2024.3424588).","DOI":"10.1109\/JESTPE.2024.3424588"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/2.zoppoz.workers.dev:443\/https\/www.jstage.jst.go.jp\/article\/elex\/22\/19\/22_22.20250308\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T04:15:45Z","timestamp":1760156145000},"score":1,"resource":{"primary":{"URL":"https:\/\/2.zoppoz.workers.dev:443\/https\/www.jstage.jst.go.jp\/article\/elex\/22\/19\/22_22.20250308\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10,10]]},"references-count":30,"journal-issue":{"issue":"19","published-print":{"date-parts":[[2025]]}},"URL":"https:\/\/2.zoppoz.workers.dev:443\/https\/doi.org\/10.1587\/elex.22.20250308","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,10,10]]},"article-number":"22.20250308"}}