{"id":"https://openalex.org/W2016268517","doi":"https://doi.org/10.1016/j.microrel.2012.08.006","title":"Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile","display_name":"Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile","publication_year":2012,"publication_date":"2012-09-08","ids":{"openalex":"https://openalex.org/W2016268517","doi":"https://doi.org/10.1016/j.microrel.2012.08.006","mag":"2016268517"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2012.08.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2012.08.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113725869","display_name":"Tong Hong Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Tong Hong Wang","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047292781","display_name":"Ching-I Tsai","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ching-I Tsai","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108432302","display_name":"Chang-Chi Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chang-Chi Lee","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103561002","display_name":"Yi\u2010Shao Lai","orcid":null},"institutions":[{"id":"https://openalex.org/I2799432993","display_name":"Advanced Semiconductor Engineering (Taiwan)","ror":"https://ror.org/04rgfzt17","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Shao Lai","raw_affiliation_strings":["Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan","institution_ids":["https://openalex.org/I2799432993"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5113725869"],"corresponding_institution_ids":["https://openalex.org/I2799432993"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.2455,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.58373719,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"53","issue":"2","first_page":"297","last_page":"302"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.983299970626831,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.7997559309005737},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7497482299804688},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.6133471727371216},{"id":"https://openalex.org/keywords/reflow-soldering","display_name":"Reflow soldering","score":0.5718410611152649},{"id":"https://openalex.org/keywords/viscoelasticity","display_name":"Viscoelasticity","score":0.5567994713783264},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.4702429175376892}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7997559309005737},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7497482299804688},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6133471727371216},{"id":"https://openalex.org/C2778413121","wikidata":"https://www.wikidata.org/wiki/Q2136790","display_name":"Reflow soldering","level":3,"score":0.5718410611152649},{"id":"https://openalex.org/C186541917","wikidata":"https://www.wikidata.org/wiki/Q910483","display_name":"Viscoelasticity","level":2,"score":0.5567994713783264},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.4702429175376892}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2012.08.006","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2012.08.006","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2043888773","https://openalex.org/W2083985126","https://openalex.org/W2143089665","https://openalex.org/W6671248484"],"related_works":["https://openalex.org/W2068324376","https://openalex.org/W2108840767","https://openalex.org/W2384982389","https://openalex.org/W2363558728","https://openalex.org/W2353288894","https://openalex.org/W2135237503","https://openalex.org/W2053798023","https://openalex.org/W2766117518","https://openalex.org/W1024385675","https://openalex.org/W2275302036"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1}],"updated_date":"2026-01-15T23:16:33.117629","created_date":"2025-10-10T00:00:00"}