<?xml version="1.0" encoding="US-ASCII"?>
<dblp>
<inproceedings key="conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09" mdate="2025-07-08">
<author>Uksong Kang</author>
<author>Hoeju Chung</author>
<author>Seongmoo Heo</author>
<author>Soon-Hong Ahn</author>
<author>Hoon Lee</author>
<author>Sooho Cha</author>
<author>Jaesung Ahn</author>
<author>Dukmin Kwon</author>
<author>Jin Ho Kim</author>
<author>Jae-Wook Lee 0007</author>
<author>Han-Sung Joo</author>
<author>Woo-Seop Kim</author>
<author>Hyun-Kyung Kim</author>
<author>Eun-Mi Lee</author>
<author>So-Ra Kim</author>
<author>Keum-Hee Ma</author>
<author>Dong-Hyun Jang</author>
<author>Nam-Seog Kim</author>
<author>Man-Sik Choi</author>
<author>Sae-Jang Oh</author>
<author>Jung-Bae Lee</author>
<author>Tae-Kyung Jung</author>
<author>Jei-Hwan Yoo</author>
<author>Changhyun Kim</author>
<title>8Gb 3D DDR3 DRAM using through-silicon-via technology.</title>
<pages>130-131</pages>
<year>2009</year>
<booktitle>ISSCC</booktitle>
<ee>https://doi.org/10.1109/ISSCC.2009.4977342</ee>
<crossref>conf/isscc/2009</crossref>
<url>db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09</url>
</inproceedings>
</dblp>
