Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via.

Kuo-Hsinag Hsu Srivatsa Rangachar Srinivasa Karthik Mohan Wei-Hao Chen Kuo-Hsinag Hsu Xueqing Li 0002 Meng-Fan Chang Sumeet Kumar Gupta John Sampson Vijaykrishnan Narayanan Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via. 128-133 2017 ISVLSI https://doi.org/10.1109/ISVLSI.2017.31 https://doi.ieeecomputersociety.org/10.1109/ISVLSI.2017.31 conf/isvlsi/2017 db/conf/isvlsi/isvlsi2017.html#SrinivasaMCHLCG17 Meng-Fan Chang Wei-Hao Chen Sumeet Kumar Gupta Xueqing Li 0002 Karthik Mohan Jack SampsonJohn Sampson Srivatsa Rangachar Srinivasa Narayanan VijaykrishnanVijaykrishnan Narayanan