Edmund J. Sprogis

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Bing Dang

> Home > Persons > Edmund J. Sprogis

Publications

2008
[j7]
- view
  authority control:
- export record
  dblp key:
  - journals/ibmrd/KnickerbockerADHIPPSSSSSTTWW08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/KnickerbockerADHIPPSSSSSTTWW08
John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright:
Three-dimensional silicon integration. IBM J. Res. Dev. 52(6): 553-569 (2008)
[j6]
- view
  authority control:
- export record
  dblp key:
  - journals/ibmrd/AndryTWSWDM08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/AndryTWSWDM08
Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer:
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52(6): 571-581 (2008)
[j4]
- view
  authority control:
- export record
  dblp key:
  - journals/ibmrd/DangWASTIWPHPSZSK08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/DangWASTIWPHPSZSK08
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008)
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/ibmrd/SakumaATWDPWMSKPHK08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/SakumaATWDPWMSKPHK08
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52(6): 611-622 (2008)
2005
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/ibmrd/KnickerbockerABDHJKMPPSSSSTWWMSD05
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/KnickerbockerABDHJKMPPSSSSTWWMSD05
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.