Bart Vandevelde

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Antonio La Manna

> Home > Persons > Bart Vandevelde

Publications

2012
[c4]
- view
  authority control:
- export record
  dblp key:
  - conf/icicdt/GuoPIECWMGCRBJV12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icicdt/GuoPIECWMGCRBJV12
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4
2011
[c3]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/IvankovicPMCCMMGEZBDMVBBVWV11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/IvankovicPMCCMMGEZBDMVBBVWV11
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.