"Analysing inspection frequency for wafer bumping process and an empirical ..."

Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin (2008)

> Home

Details and statistics

DOI: 10.1504/IJMTM.2008.017491

access: closed

type: Journal Article

metadata version: 2022-10-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijmtm/ChienHL08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijmtm/ChienHL08
Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin:
Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework. Int. J. Manuf. Technol. Manag. 14(1/2): 130-144 (2008)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.