"Time and temperature-dependent mechanical behavior of underfill materials ..."

Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang (2004)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2003.10.005

access: closed

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/KuoYC04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/KuoYC04
Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang:
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectron. Reliab. 44(4): 627-638 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.