"A novel mechanical diced trench structure for warpage reduction in wafer ..."

Chunsheng Zhu et al. (2015)

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DOI: 10.1016/J.MICROREL.2014.11.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chunsheng Zhu, Heng Li, Gaowei Xu, Le Luo:
A novel mechanical diced trench structure for warpage reduction in wafer level packaging process. Microelectron. Reliab. 55(2): 418-423 (2015)

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