<?xml version="1.0" encoding="US-ASCII"?>
<dblp>
<article key="journals/or/ChenWC18" mdate="2024-05-07">
<author orcid="0000-0002-5608-5176">Toly Chen</author>
<author>Li-Chih Wang</author>
<author orcid="0000-0001-6938-2391">Min-Chi Chiu</author>
<title>A multi-granularity approach for estimating the sustainability of a factory simulation model: semiconductor packaging as an example.</title>
<pages>711-729</pages>
<year>2018</year>
<volume>18</volume>
<journal>Oper. Res.</journal>
<number>3</number>
<ee>https://doi.org/10.1007/s12351-017-0342-5</ee>
<url>db/journals/or/or18.html#ChenWC18</url>
</article>
</dblp>
