An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer.

Wed, 01 Jan 2020 00:00:00 +0100

Weibo Zhang, Jiebin Gu, Gaowei Xu, Le Luo, Xinxin Li:
An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer. Microelectron. J. 101: 104798 (2020)