A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.

Thu, 01 Jan 2015 00:00:00 +0100

Chunsheng Zhu , Heng Li, Gaowei Xu, Le Luo:
A novel mechanical diced trench structure for warpage reduction in wafer level packaging process. Microelectron. Reliab. 55(2): 418-423 (2015)