Void control during plating process and thermal annealing of through-mask electroplated copper interconnects.

Wed, 01 Jan 2014 00:00:00 +0100

Chunsheng Zhu , Wenguo Ning, Heng Li, Tao Zheng, Gaowei Xu, Le Luo:
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects. Microelectron. Reliab. 54(4): 773-777 (2014)