Soichiro Ibaraki
Keiji Matsumoto
Soichiro Ibaraki
Kuniaki Sueoka
Katsuyuki Sakuma
Hidekazu Kikuchi
Hiroyuki Mori
Yasumitsu Orii
Fumiaki Yamada
Kohei Fujihara
Junichi Takamatsu
Koji Kondo
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.
1-8
2013
3DIC
https://doi.org/10.1109/3DIC.2013.6702329
conf/3dic/2013
db/conf/3dic/3dic2013.html#MatsumotoISSKMOYFTK13
Keiji Matsumoto
Soichiro Ibaraki
Katsuyuki Sakuma
Fumiaki Yamada
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.
1-5
2009
3DIC
https://doi.org/10.1109/3DIC.2009.5306546
conf/3dic/2009
db/conf/3dic/3dic2009.html#MatsumotoISY09
Kohei Fujihara
Hidekazu Kikuchi
Koji Kondo
Keiji Matsumoto
Hiroyuki Mori
Yasumitsu Orii
Katsuyuki Sakuma
Kuniaki Sueoka
Junichi Takamatsu
Fumiaki Yamada