<?xml version="1.0"?>
<dblpperson name="Chenfeng Ye" pid="430/2514" n="1">
<person key="homepages/430/2514" mdate="2026-03-25">
<author pid="430/2514">Chenfeng Ye</author>
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<r><article key="journals/tvlsi/ZhangJLYHZHTCZ25" mdate="2026-03-31">
<author orcid="0009-0002-0364-797X" pid="85/7697">Pengju Zhang</author>
<author orcid="0009-0009-0007-2796" pid="430/0305">Kuoyuan Jia</author>
<author pid="340/5468">Yubiao Liu</author>
<author pid="430/2514">Chenfeng Ye</author>
<author pid="353/7159">Junhan Huang</author>
<author orcid="0000-0002-8698-0024" pid="80/773">Wenxing Zhu</author>
<author orcid="0000-0001-6704-2721" pid="12/4049">Li Huang</author>
<author orcid="0000-0002-0716-912X" pid="88/5071">Min Tang</author>
<author orcid="0000-0002-5373-0328" pid="01/5394-25">Liang Chen 0025</author>
<author orcid="0000-0003-0484-6188" pid="55/2363">Jianhua Zhang</author>
<title>An Analytical 3D-IC Thermal Simulation Framework Using Adaptive Rectangular Approximation and Conformal Mesh Method.</title>
<year>2025</year>
<pages>3018-3031</pages>
<volume>33</volume>
<journal>IEEE Trans. Very Large Scale Integr. Syst.</journal>
<number>11</number>
<ee>https://doi.org/10.1109/tvlsi.2025.3590814</ee>
<url>db/journals/tvlsi/tvlsi33.html#ZhangJLYHZHTCZ25</url>
<stream>streams/journals/tvlsi</stream>
</article>
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<coauthors n="9" nc="1">
<co c="0"><na f="c/Chen_0025:Liang" pid="01/5394-25">Liang Chen 0025</na></co>
<co c="0"><na f="h/Huang:Junhan" pid="353/7159">Junhan Huang</na></co>
<co c="0"><na f="h/Huang:Li" pid="12/4049">Li Huang</na></co>
<co c="0"><na f="j/Jia:Kuoyuan" pid="430/0305">Kuoyuan Jia</na></co>
<co c="0"><na f="l/Liu:Yubiao" pid="340/5468">Yubiao Liu</na></co>
<co c="0"><na f="t/Tang:Min" pid="88/5071">Min Tang</na></co>
<co c="0"><na f="z/Zhang:Jianhua" pid="55/2363">Jianhua Zhang</na></co>
<co c="0"><na f="z/Zhang:Pengju" pid="85/7697">Pengju Zhang</na></co>
<co c="0"><na f="z/Zhu:Wenxing" pid="80/773">Wenxing Zhu</na></co>
</coauthors>
</dblpperson>

