Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits.

Erik Jan Marinissen Ferenc Fodor Arnita Podpod Michele Stucchi Yu-Rong Jian Cheng-Wen Wu Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. 1-10 2018 ITC https://doi.org/10.1109/TEST.2018.8624731 conf/itc/2018 db/conf/itc/itc2018.html#MarinissenFPSJW18