Bing Dang

According to our database¹, Bing Dang authored at least 18 papers between 2005 and 2025.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Timeline

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PhD thesis

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On csauthors.net:

Bibliography

2025

A Cloud-Based, Multi-Modal Data Architecture for Post-Transplant Diabetes Management.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2025

Feasibility Study of Seizure Detection Using Commercial Smartwatches in Patients with Epilepsy.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2025

Predicting Glucose Levels in Diabetic Kidney Transplant Recipients Using Multivariate Temporal Modeling Across Clinically Defined Subcohorts.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2025

2024

API Management in Digital Health: Exploring IBM API Connect and IBM API Hub in Enabling Healthcare Innovation.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2024

2023

Health Guardian: Using Multi-modal Data to Understand Individual Health.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2023

A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2023

2022

Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Digital Health, 2022

2021

Development of a Smart Sleep Mask with Multiple Sensors.

[BibT_eX]

[DOI]

Proceedings of the 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2021

2020

NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing.

[BibT_eX]

[DOI]

Remote. Sens., 2020

2015

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors.

[BibT_eX]

[DOI]

Proceedings of the Symposium on VLSI Circuits, 2015

2012

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.

[BibT_eX]

[DOI]

John U. Knickerbocker

Daniel J. Friedman

IEEE J. Solid State Circuits, 2012

2008

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.

[BibT_eX]

[DOI]

John U. Knickerbocker

IBM J. Res. Dev., 2008

Three-dimensional silicon integration.

[BibT_eX]

[DOI]

John U. Knickerbocker

IBM J. Res. Dev., 2008

3D chip stacking with C4 technology.

[BibT_eX]

[DOI]

John U. Knickerbocker

IBM J. Res. Dev., 2008

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.

[BibT_eX]

[DOI]

IBM J. Res. Dev., 2008

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation.

[BibT_eX]

[DOI]

Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008

2007

Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems.

[BibT_eX]

[DOI]

Muhannad S. Bakir

Bing Dang

James D. Meindl

Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007

2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

[BibT_eX]

[DOI]

IBM J. Res. Dev., 2005

Bing Dang

Timeline

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