Only Three Days to Go! TSMC China OIP is just around the corner, taking place this year in Nanjing—the final OIP event of 2025. We warmly invite you to visit GUC #Booth25, where our team will showcase cutting-edge innovations in advanced ASIC and 3DIC design. Don’t miss this opportunity to explore how GUC enables next-generation IC design excellence through high-performance IP, advanced packaging, and system-level integration. We look forward to meeting you onsite and discussing how GUC can help accelerate your future designs. See you in Nanjing! 👋🏻 #GUC #TSMCOIP #China #Booth25
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