POWER TRANSISTORS
Power transistors are devices that have controlled turn-on and turn-off characteristics.
These devices are used a switching devices and are operated in the saturation region resulting
in low on-state voltage drop. They are turned on when a current signal is given to base or
control terminal. The transistor remains on so long as the control signal is present. The
switching speed of modern transistors is much higher than that of Thyristors and are used
extensively in dc-dc and dc-ac converters. However their voltage and current ratings are
lower than those of thyristors and are therefore used in low to medium power applications.
Power transistors are classified as follows
Bipolar junction transistors(BJTs)
Metal-oxide semiconductor filed-effect transistors(MOSFETs)
Static Induction transistors(SITs)
Insulated-gate bipolar transistors(IGBTs)
2.1 Bipolar Junction Transistors
The need for a large blocking voltage in the off state and a high current carrying
capability in the on state means that a power BJT must have substantially different structure
than its small signal equivalent. The modified structure leads to significant differences in the
I-V characteristics and switching behavior between power transistors and its logic level
counterpart.
2.1.1 Power Transistor Structure
If we recall the structure of conventional transistor we see a thin p-layer is
sandwiched between two n-layers or vice versa to form a three terminal device with the
terminals named as Emitter, Base and Collector. The structure of a power transistor is as
shown below.
Collector Collector
Base npn BJT Base pnp BJT
Emitter Emitter
Base Emitter
+ 19 -3
10 m n 10 cm
Base 5-20 m 16 -3
Thickness p 10 cm
50-200 m n
–
10
14
cm
-3
(Collector drift
region)
+ 19 -3
250 m n 10 cm
Collector
Fig.2.1: Structure of Power Transistor
The difference in the two structures is obvious.
A power transistor is a vertically oriented four layer structure of alternating p-type and n-
type. The vertical structure is preferred because it maximizes the cross sectional area and
through which the current in the device is flowing. This also minimizes on-state resistance
and thus power dissipation in the transistor.
The doping of emitter layer and collector layer is quite large typically 1019 cm-3. A special
layer called the collector drift region (n-) has a light doping level of 1014.
The thickness of the drift region determines the breakdown voltage of the transistor. The base
thickness is made as small as possible in order to have good amplification capabilities,
however if the base thickness is small the breakdown voltage capability of the transistor is
compromised.
2.1.2Steady State Characteristics
Figure 3(a) shows the circuit to obtain the steady state characteristics. Fig 3(b) shows
the input characteristics of the transistor which is a plot of I B versus VBE . Fig 3(c) shows the
output characteristics of the transistor which is a plot I C versus VCE . The characteristics
shown are that for a signal level transistor.
The power transistor has steady state characteristics almost similar to signal level transistors
except that the V-I characteristics has a region of quasi saturation as shown by figure 4.
Fig 2.2. Steady State Characteristics of Power Transistor
There are four regions clearly shown: Cutoff region, Active region, quasi saturation
and hard saturation. The cutoff region is the area where base current is almost zero. Hence no
collector current flows and transistor is off. In the quasi saturation and hard saturation, the
base drive is applied and transistor is said to be on. Hence collector current flows depending
upon the load.
Quasi-saturation
Hard - 1/Rd
Saturation
Second breakdown
iC
IB5 >IB4 ,etc.
IB5
IB4
Active region Primary
IB3
breakdown
IB2
IB1
I B<0
IB=0
IB=0
0
BVCEO vCE
BVSUS BVCBO
Fig. 2.3: Characteristics of NPN Power Transistors
The power BJT is never operated in the active region (i.e. as an amplifier) it is always
operated between cutoff and saturation. The BVSUS is the maximum collector to emitter
voltage that can be sustained when BJT is carrying substantial collector current. The BVCEO is
the maximum collector to emitter breakdown voltage that can be sustained when base current
is zero and BVCBO is the collector base breakdown voltage when the emitter is open circuited.
The primary breakdown shown takes place because of avalanche breakdown of collector base
junction. Large power dissipation normally leads to primary breakdown.
The second breakdown shown is due to localized thermal runaway.
Transfer Characteristics
Fig. 2.4: Transfer Characteristics
IE IC IB
IC
h fE
IB
IC IB I CEO
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