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BGA Reflow & Rework Recommend

Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of packages that have already been soldered to the board is not practical in most cases. Reflow: Use caution when profiling to insure minimal temperature difference (15degC and preferably 10degC) between components.

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479 views1 page

BGA Reflow & Rework Recommend

Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of packages that have already been soldered to the board is not practical in most cases. Reflow: Use caution when profiling to insure minimal temperature difference (15degC and preferably 10degC) between components.

Uploaded by

Bela Cseke
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© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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BGA Solder Reflow and

Rework Recommendations
BGA Reflow Soldering Recommendations BGA Rework Recommendations
Reflow: Removal and replacement of BGA packages on printed
• Use caution when profiling to insure minimal tem- circuit boards is fairly straightforward. However, reat-
perature difference (<15°C and preferably <10°C) tachment or touch-up of BGA packages that have already
between components been soldered to the board is not practical in most cases.
• Forced convection reflow with nitrogen preferred Three important criteria should be considered when
(50 – 75 PPM) choosing a rework system:
• Preheat stage temperature ramp rate: <2°C per • Minimize the change in temperature across the
second solder joint array to promote good solder joint forma-
• Time required in Flux Activation stage: 150 to 180 tion, minimize intermetallic growth, improve
seconds solderability and minimize component warpage
• Flux Activation stage temperature range: 150 to • Minimize die temperature to prevent die delamina-
183°C tion and wire bond failure
• Time required in Solder stage: 60 seconds • Minimize board temperature adjacent to the rework
site to reduce intermetallic growth, prevent second-
• Maximum temperature 210 - 220°C (Do not exceed
ary reflow, and prevent possible component
10 seconds at maximum temperature)
delamination
• Cool-Down stage temperature reduction rate: <2°C
per second Refer to Applications Notes on Surface Mount Assembly
of Amkor/Anam PBGA and SuperBGA® Packages in the
Inspection: Applications Notes section of the Lattice web site for
• Inspection of pre-processed solder bumps more complete information. The Lattice web site is lo-
• Visual solder deposit inspection cated at www.latticesemi.com.
• Use machine vision for solder bump identification
during placement
• Use recommended assembly process and process
parameters coupled with electrical testing (100%
post-process inspection is not recommended)

Figure 1. BGA Recommended Solder Reflow Profile


250

Maximum Package Body Temperature

200
Solder Temperature Melting Point

150
1° to 3° C
Temperature 150 - 180 Seconds per Second
(° C)
100
<2° C
per Second

50 <2° C
per Second

Preheat Flux Activation Solder Cool-Down

0
0 100 200 300 400 500
Time (Seconds)

solder_01 1 August 1998

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