NASA MIL-STD-975L EEE Parts Standard
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MIL-STD-975L (NASA)
31 JANUARY 1994
SUPERSEDING
MIL-STD-975K (NASA)
19 FEBRUARY 1993
I
MILITARY STANDARD
NASA STANDARD ELECTRICAL, ELECTRONIC,
I
AND ELECTROMECHANICAL (EEE) PARTS LIST
AMSC N/A FSG-59GP
DISTRIBUTION STATEMENT A. Approved for public release; distribution k unlimited.
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MIL-STD-975L (NASA)
NATIONAL AERONAUTICS AND SPACE “ADMINISTRATION
WASHINGTON, D.C. 20S46
I NASA Standard Electrical, Electronic, and Electromechanical (EEE) Paris List
1 MIL-sm-975L (NAsA)
1 1. Tbk military standard is appmve.d for use by all elements of the National Aeronautics and Space
Administration and is available for use by all departments and agencies of the Department of Defense.
2. Beneficial comments (recommendations, additions, deletions) and any pertinent data which IIIEYbe of
I use in improving this document should he addressed to:
MANAGER (31O.A)
NASA PARTS PROJE~ OFFICE
GODDARD SPACE FLIGHT CENTER
GREENBELT, MARYLAND 20771
I
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MIL-STD-975L (NASA)
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MIL-STD-975L (NASA)
FOREWORD
This standard is the technical baseline for standardization of Electrical, Electronic, and Electro-
mwh.mical (EEE) Paris The intent of thk effort is to focus parl selection cm EEE parts used in the design and
construction of space flight hardware w well m mksion-tkd ground support equipment (GSE). The overall
objectives are to: 1. Provide the d~igner with a list of acceptable parin and the specifications for procuring
those parts for space flight missions. 2. Reduce the quantity of part numbers used in space ffight missions in
order to derive tbe benefits ttssociated with standardization. The result of this effort should provide the designer
with a standardkd selection of EEE parts, including the n-ry criteria pertaining to use, choice, and
application.
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MIL-STD-975L (NASA)
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MIL-STD-975L (NASA)
PART I - STANDARD EEE PARTS
CONTENTS
Page
Paragraph 1. SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...1
1.2 Furfxxe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...1
1.3 Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. REFERENCEDDOCUMENTS . . . . . . . . . . . . . . . . . . ...2
3. DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...6
3.1 Standardpart . . . . . . . . . . . . .’ . . . . . . . . . . . . . ...6
3.2 Nonst.andmdf)afi . . . . . . . . . . . . . . . . . . . . . . . . ...6
3.3 Gmde l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...6
3.4 Gmde2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...7
3.5 Pre.ferrednonstandardparts... . . . . . . . . . . . . . . . . . 8
4. GENERALREQUIREMENTS .,. . . . . . . . . . . . . . . . ...9
4.1 Criteriaforstandardpartslisting. . . . . . . . . . . . . . . . . 9
4.2 Partsprocurement . . . . . . . . . . . . . . . . . . . . . . . ...10
4.3 Partsapplication . . . . . . . . . . . . . . . . . . . . . . . . ...11
4.4 Nonstandardpartsu.sage . . . . . . . . . . . . . . . . . . . ...11
4.5 Gmflictofdata. . . . . . . . . . . . . . . . . . . . . . . . . ...12
4.6 Pmblemrepordngpmcedure . . . . . . . . . . . . . . . . ...12
4.7 Malerialtestrequiremenls . . . . . . . . . . . . . . . . . . ...12
PART II - PREFERRED NONSTANDARD EEE PARTS
CONTENTS
5. SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...13
5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...13
5.2 Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...13
5.3 CINilicatiOn . . . . . . . . . . . . . . . . . . . . . . . . . . ...13
5.4 BeneficialCmnmenls. . . . . . . . . . . . . . . . . . . . . ...13
6. REFERENCEDDOCUMENTS ..., . . . . . . . . . . . . . . ...13
7. Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...13
8. CWTERIAFORPREFERRED
NONSTANDARDPARTSLLSTING . . . . . . . . . . . ...14
8.1 LktingCriteria . . . . . . . . . . . . . . . . . . . . . . . . . ...14
8.2 RemovalofNonstandardPart.. . . . . . . . . . . . . . . ...14
9. REQUIREMENTSFORUSE . . . . . . . . . . . . . . . . . . . ...14
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MIL-STD-975L (NASA)
PART I - SECTIONS
Section 1 Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...1.1
2 Comectom . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . ...2.1
3 C~smlsmd C~s@l O=illatom . . . . . . . . . . . . . . . . . . . 3.1
4 Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...4.1
5 Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...5.1
6 fnductors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...6.1
7 Micmcimuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...7.1
8 Protectivedevices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.1
9 Relays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...9.1
10 Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1
11 Tbennistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1
12 Tmnsfonnem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.1
13 Transistor s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.1
14 Wire&Cnble . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14,1
15 Pbotonics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.1
16-20 Reserved forFutureUse
PARTII-SECTIONS
Section 21 AMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...21.1
22 HighNASAUsage . . . . . . . . . . . . . . . . . . . . . . . . . . . 22.1
APPENDICES
Appendix A Deratingcriteria . . . . . . . . . . . . . . . . . . . . . . . . . . . ..A.1
B Screeningprocdures . . . . . . . . . . . . . . . . . . . . . . . . ..B.1
c Special requirements forcustom electromagnetic devic& . . . . C.]
D JANClassSStockProgmm . . . . . . . . . . . . . . . . . . . . ..D.1
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MIL-STD-975L (NASA) - Part I
STANDARD PAR’lS
L SCOPE
1.1 Genemf. This standard establishes a list of Electrical, Electronic, and Electmmecbnnicnf (EEE) Parts
for use in the selection, procurement, and appIicntion for flight md mission-essential ground mppori
equipment. The list is limited to the following Federal Stock CIa.s-sew
Pm-t TYLIe.s FsC
* Capacitors 5910
● Chxit Breakers 592s
● connectors 5935
* Crystals and Crystal Oscillators 5955
* Diodes 5961
● Fiber Optics 60GP (FSG)
● Filters 5915
● Fuses 5920
* Inductors 5950
● Microcircuits 5962
● Relays 5945
● Resistors 5905
* Thermistors 5905
* Tmnsfcmne~ 5950
* Tmnsistor6 5961
* Wire and cable 6145
1.2 Purpose. The purpose of this sttmdsrd is us followx
a. To provide equipment designers and mmufachwws with a list of electronic parts having two
quality levels considered to be most acceptable for flight and mission-ntial ground support
equipment.
b. To control and minimize the variety of electronic part types used by govemm.ent activities in
order to maximize economic suppori of, concentzste improvement on, andfacilitate eff=tive
logistic suppart of the electronic parw listed in MS standard.
1.3 Classification. Two levels of quality are used in this standard. Grade 2 parts are high quality,
government specification ccmtmlled parts forum in applications not requiring Grade 1 parts. Grade 1
parts are higher quality; government specification controlled parts intended for critical applications.
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MIL-STD-975L (NASA) - Psrt I
2. REFERENCED DOCUMENTS
Issues of documenLs. The following documents of tie issue in effect on the date of invitation for bids m
request for pmposnl form a part of this standard to the extent specified herein.
CAPAC~ORS (FSC5910)
MIL-C-20 Capacitors, Fixed, Ceramic Dielectric (Temperature Compensating),
E.stablisbed and Non-established Reliability, General Specification for.
MIL-C-123 Capacitors, Fixed, Ceramic Dielechic, (Tempemture Stable and Genemf
Purpose), High Reliability, General Specification for.
MIL-C-23269 Capacitors, Fixed, Glass Dielectric, Established Reliability, General
Specification for.
MIL-C-39003 Capacitom, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established
Reliability, General Specification for.
MIL-C-390M Capacitom, Fixed, Electrolytic (Nonsolid Elwtrolyte), Tmwnfum, Established
Reliability, GenemI Specification for.
MIL-C-39014 Capacitors, Fixed, ceramic Dielectric (General Purpose), Established
Reliability, General Specification for.
MIL-C-55365 Capacitors, Chip, Fixed, Tsntdum, Established Refiabllity, Generel
Specification for.
MfL-c-55681 Capacitor, flip, Multiple Layer, Fixed, Unencapsulated, Ceramic Dielectric,
Established Reliability, General Specification for.
MIL-C-83421 Capacitors, Fixed, Metnllized Plastic Film Dielectric, (de, EC, or dc and at),
Hermetically Sealed in Metal CJWes, Established Reliability, General
Specification for.
MIL-C-87217 Capacitors, Fixed, Supemne@dlized Plastic Film Dielectric, DkecI Current
for Low Energy, High Impedance Applimticms, Hermetically .%ded in Metal
Cases, High Reliability, General S~ifimtion for.
CONNECTORS (FSC 5935)
MSFC 40M38277 - Comectors, Electrical, Circular, Miniature, High Density, Environment
Resisting, Specification for.
MSFC 40M36298 - Connectors, Electrical, Special, Miniature Ckcular, Environment Raisting.
I
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MIL-STD-975L (NASA) - ParI I
MSFC 40M39569 - Candors, Electrical, Miniamre. Circulsr, Environment Resisting, 200”C,
Specification for.
GSFC S-31 1-P-4 - Connectors (sod Cmtscts), Electrical, Rectnogular, for Space Flight Use,
General Specification for.
GSFC S-311-P-1O - Comectcm, Subminiature, Electrical snd Cosxisl Cnntsct, for Space Flight
use.
MIL-C-5015 - Cnnnector, Electrical, Chdar Threaded, AN Type, General Specification
for.
MIL-C-22992 - Connector, Plugs snd Rezeptscles, Electrical, Waterproof, ~tck Disconnect,
Heavy Duty Type, GenersI Speciticstion for.
MIL-C-24308 - Comex?tor, Electric, Rectangular, Miniamre Polarimd Shell, Rack snd Psnel,
General Speciticstion for.
MIL-C-26482 - Connector, Electrical, (Circular, Miniature, Quick Disconnect, Envimrunent
Resisting) Receptacles snd Plugs, Genersl .s~ification for.
MIL-C-83513 - Connector, Electrical, Redangulsr Microminiature, Pcdsrized Shell, Crimp
snd Solder Cmntscts, Genersl Specification for.
MIL-C-38999 - Connector, Electrical, Cirmdsr, Miiature, High Dea.sity, Quick Dkconnect:
(Bayonet, Threaded snd Breech Coupling), Envimmnent Resistant,
Removable Crimp snd Hermetic Solder Cnntacts, Genersl Specification for.
MIL-C-39012 - Connector, Coaxial, Radio Frequency, Gmersl Specification for.
MIL-C-39029 - Contacts, Electrical Connector, Genersl Specifkstion for.
MIL-C-55302 - Connectors, Printed Ch’cuit Subassembly snd Accessories, General
SpecificstiOn for.
MIL-C-85049 - Comector Accessories, Electrical, General Specification for.
CRYSTALS & CRYflAL OSCILLATORS(FSC5955)
MIL-C-49468 - Crystal Units, QUSrtz, P-ision, General Specification for.
MIL-O-5531O - Oscillators, Crystal, General Specification for.
DIODES(FSC5961)
MIL-S-19500 - Semimnductor Devices, General Specification for.
3
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MIL-STD-975L (NASA) - Part I
FILTERS(FSC5915)
MIL-F-28a61 - Filters and capacitors, Radio Frqueticy/Electromagnetic Interference
Suppression, Specification for.
INDUCTORS(FSC5950)
MIL-STD-98
I - Design Manufacturing and Quality Standards for Custom Electromagnetic
Devices for Space Applications.
MfL-C-3W10 - Coils, fixed, Radio Frequency, Molded, Established Reliability, General
Specification for.
MIL-C-83446 - Coils, Chip, FLxcd or Variable, General Specification for.
MfCROCfRCUfTS (FSC 5962)
MIL-M-38510 - Microcircuits, General Specification for.
MIL-H-38534 - Hybrid Microcircuits, General Sp.xificntion for.
MIL-I-38535 - lntegmlcd Ch’cuits (Microcircuits) Manufacturing, General Specification for
PROTECTIVE DEVICES (FSC 5920 and 5925)
MfL-F-23419 - Fuses, Im.tmment Type, General Specification for.
MIL-C-39019 - Cimuit Breakers, Magnetic, Low-Power, Scnled, Trip-Free, General
Specification for.
RELAYS (FSC 5945)
MIL-R-39016 - Relays, Electromagnetic, Established Reliability, General Specification for.
RESISTORS (FSC 5905)
MIL-R-39005 - Resistors, Fixzd, Wke-Wound (Accurate), Established ReliabOity, General
Specification for.
MIL-R-39037 - Resistors, FIxcd, Wh’e-Wound (Power Type), Established Reliability,
General Specification for.
4
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MIL-STD-975L (NASA) - Part I
MIL-R-39008 Resistors, Fixed Composition (insulated), Established Reliability, General
Specification for.
MIL-R-39009 Resistors, Fixed, Wi~Wound (Power Type, chassis Mounted), Established
Reliability, General S~ific.ation for.
MIL-R-39015 Resistors, Variable, W,re-Wound (Lead Screw Actuated), Established
Reliability, General Specification for.
MIL-R-39017 Resistom, Fixed, Film (Imulated), Established Reliability, General
SpxificntiOn for.
MIL-R-39032 Resistors, Packa@!8 of.
ML-R-55 182 Resistors, Fixed, Film, Established Reliability, General Spezificstion for.
MIL-R-55342 Resistors, Fixed, Film, Chip, Established Reliability, Geneml Specification
for.
. MIL-R-83401 Resistor Networks, Fixed, Film, General Specification for.
THERM3Sl_ORS
(FSC 5905)
MIL-T-23648 - Thermistor (TbermnlIy Sensitive Resistor), Insulated, General Specification
for.
GSFC S-3 11-P-18 - Thermistor (l%ernmlly Sensitive Resistor), Insulated, Negative Temperance
Coefficient, Style 3 11P18, Specification for.
TRANSFORMERS(FSC5950)
MIL-STD-981 - Design, ManufacNring and Quality Standards for Custom Electromagnetic
Devices for Space Applications.
TRANSI=ORS (FSC 5961)
MfL-S-195C0 - Semiconductor Devices, General Spezificntion for.
WIRE & CABLE (FSC 6145)
MIL-C-17 - Cable, Radio Frequency, Flexible and Semirigid, General Specification for.
MIL-W-5086 - Wire, Electric, PolyvinyI CbIoride Insulated, Copper or Copper Alloy.
5
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ML-STT3-975L (NASA) -Pm I
MIL-W-22759 - Wire, Electric, Fluorocarbon Insulated, Copper or Copper Alloy.
MfL-C-27500 - Cable, Electrical, Shielded md Unshielded, Aerospace.
OTHER DOCUMENTS
ASTM E 595 - Standard Test Method for Total Mass Loss and Collected Volatile
Condensable Material Fmm Outgassing in a Vacuum Environment,
MIL-HDBK-978 - Parts Application Handbook
NHB8060. I - F1-bilitv. . . Odor. Offm.ssine and Comuatibilitv
. . Rmuircments
. and Test
Procedures for Matcrials:m En~lmnmettts that Support Combustion.
I (Copies of specifications, standards, drawings, and publications requested by contractors in comw!ion with
specific procurement functions should be obtained from the procuring activity or as d]rected by the
contracting officer. )
NOTE Addltiond copies may be obtained fmm the following center:
STANDARDIZATION DOCUMENTS ORDER DESK
BUILDING 4, SECTION D
7CKIROBBINS AVENUE
PHILADELPHIA, PA 19 I I I-5094
3. DEFINITIONS
3.1 Standard Part. An EEE part which is listed in Part I of this standard.
3.2 Nomtandard Part. An EEE part that is not listed in Part I of thk smdard. Grade 2 parts used in
Grade 1 applications.
3.3 Grade 1 parts. ‘fhis is the classification used for parts of higher quality than Grade 2. They arc
standard parls intended for applications that the responsible NASA project office bas determined to be
critical. Grade I parts cm also be used in applications designated as Grade 2.
3.3.1 Capacitors. These are military established reliability (ER) parts purchased to either S or C
failure rates except where specifically noted.
6
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MIL-STD-975L (NASA) - Psrt I
I 3.3.2 Connectors.
NASAIGSFC
‘fhsss am connectors thatwe procussble
‘S-311” specifications.
to NASAIMSFC “40M” snd
1
3.3.3 Crystals and Crystnl OSciIlatms. There ass no Grade 1 crystsls listed in tbk standard.
Crystal oscillators are Class S quslifisdtoMIL-O-55310
3.3.4 Diodes These are diodes that me. .MIL-S-19500 JANS quslified.
I
I 3.3.5 Filters. There ars no Grade 1 fikers listed in this stsndsrd.
3.3.6 3nductors and Coils. These ass military estsblisbed reliability (ER) parts pm-cbsed 10 S
failure rate.
3.3.7 MicrociscuiLs. Tbess areMIL-M-38510 JAN Claw S qualified devices.
3.3.8 Protective Devices. There are no Gisde 1 protcc!ive devices listed in this stsndard.
3.3.9 Relays. There are no Gmde 1 days listed in this standard.
3.3.10 Reistoss. TIIess are military established reliability (ER) parts purchssed to S failure rste
exept where specifically noted.
3.3.11 Thermistors. Tbess are thermistors tbst are pmcursble to NASA/GSFC specification
S-311-P-18,
3.3.12 ‘JiBsMfomners. This stsndard contains no trsnsfomers. All transformers must bs pmcused
to the sequirsments ofMIL-STD-981.
3.3.13 Tsamistom. Thsse are transistors that are MIL-S-19500 JANS quslified.
3.3.14 Wire and Cnhle. This is wire quslifisd to MIL-W-22759 and cable qualified to MIL-C-17
snd MIL-C-27500.
3.3.15 F]ber Optics. Them are no Grsde 1 fiber optics listsd in this stsndsrd.
3.4 Gsnde 2 parts. This is the clsssificition used for stsndard parts which meet the criteria for inclusion
in this st.andsrd snd are intended for applications not requiring Gssde 1 parts. Pam intermdlate in
quslity bstwsen Grsde 1 snd Grsde 2 msy also be used in applications designated ss Gmde 2.
(Exsmple: If S failure rsle is Grade 1 snd P failure rste is Gmde 2, pints with an R failure rate can
be used in Grsde 2 applimticms.)
3.4.1 Capacitors. These are military established reliability (ER) parts purcbssed to either P or B
failure sate level.
3.4.2 Connectors. ‘flmsc am connectors tbst me procurable to NASAfMSFC “40M, ”
NASA/GSFC “s-31 1,” MfL-C-5015, MIL-C-24308, MIL-C-264S2, MIL-C-38999,
MIL-C-39012, MIL-C-39029, MIL-C-55302, and MIL-C-S3513 specifications.
7
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MIL-STD-975L (liASA) - Part I
3.4.3 Cryslafs andCrystaloscillators.There we no Grsde 2 ct-ystds listed in this stsndard.
Crystal oscillators arc Class B qualified to MIL-O-55310.
3.4.4 Diodes. These are JANTXV diodes that bsve been evaluated in accordance with the
additional testing requirements of section 4 of Part I herein.
3.4.5 filters. TIIese are filters lhst am qualified to MIL-F-28861.
3.4.6 Conductors and Coils. These are militmy establish reliability (ER) parts purdmsed to P
failure rate except whet-e specifically noted.
3.4.7 Microcircuits. l%- me microcircuits which am quslified to MIL-M-3S51O Class B
specifications.
3.4.8 Protective Devices. These are devices that are qwdified to MfL-F-234 19/8 and
MIL-C-39019/l through MIL-C-39019/6.
3.4.9 Relays. These me parts qualified to MfL-R-39016 failure ml. level (FRL) P.
3.4.10 Resistors. These are military established reliability (ER) parts pumhssed to P failure mte
levels.
3.4.11 Thermistors. These are thermistors that are procurable to military control specification
MfL-T-23648t19.
3.4.12 Transformers. This stsndsrd contsins no transformers. All transformers must be
procured to the ~uirements of MIL-STD-981.
3.4.13 Transistors. These mm JANTXV trsnsistom that have hem evalusted in accordance. with
the additional testing requirements of section 13 of Pm-t I herein.
3.4.14 Wirs andCable. This is wire qw+lified 10 MIL-W-22759 snd cable quslified 10 MIL-C-17
and ML-C-27500.
3.4.15 Fher Optics. There are no Grsde 2 fiber optics listed in this standard
3.5 Preferred Nonstandard Parts. These arc EEE paris fisted in Part fl of this stmdard.
8
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MIL-STD-975L (NASA) - ParI I
4. GENERAL REQUIREMENTS
4.1 Criteria for standard parts listing. Pm-sgrsph 4.1.1 through 4.1.3 define the criteria which must be
I
met for listiag a part in this standsrd.
4.1.1 Criteria for candidate parts selection. A patl will become a candidste for listing in this
standmd only if it meets all of the criteria in 4.1.1.1 through 4.1.1.4.
4.1.1.1 Application nerxf. There must be multiple supplications requiring the specific
performance capability pezuliar to the part proposed for listing. Cmsiderstion
will be given to selecting psrts capable of sstis~ing the widast zange of design
applications, ~d whm applicable, parts should be compatible with existing listings
(e.g., select a reference diode that is m extension of a listed series or a
microcircuit that is generic to a fsmily aheady listed). A deride need is assumed
to exist for a part that hss been used successfully in several r-t space
applications, if it is nonredundmt (with respect toform, fit, m function) to
existing listings or provides other compelling sdvmtages (e.g., continuing
availabllit y) over sach listings. In the latter case, deletion of the original listing
msy be in order.
4.1.1.2 Technological maturity. The design of the pari must be finalid snd must
utilize proven materials snd technologies. It must have ken b production for a
period sufficient to provide sssursnce that the critical de.siga md process
parameters have been identified and adquste controls have been developed. l%.
tecbnolog y also must have demonstrated suitability y for flight hardware or
mission-essential ground support equipment use.
4.1.1.3 Availability of manufacturers. The part should be in production by at least one
snd preferably two msnufactmws whose previous performance indkstea that they
am cspable of qualifying their product to specifications adqustc for listing in this
standard.
4.1.1.4 Test or usage history. There must be sufficient m-t or ussgc experience with the
part to:
a. Determine predominant failure modes and mechanisms.
b. Provide reasonable contidenm that the part will perform reliably when
mpplid tO Sn Sdeqaatc. Spccificstion.
c. Identify the dersdng and application restrsintx necessary for reliable use in
flight hardwsrc or mission-essential ground support equipment e.nvimnments.
4.1.2 Criteria for standard parts approval. ‘TIIe criteria of 4.1.2.1 through 4.1.2.4 should te
met before a candidate part cm be approved and listed in this standard.
9
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MIL-STD-975L (NASA) - Part I
4.1.2.1 Characterization data. A comprehensive parameter characterimtion test program
has been conducted to identify the part’s performance capability through the
operating tempemture spectrum and over long life. This data must indicate that
the part parameters me stable during the operating tempemture range and life, and
must reveal peculiarities tit should be considered or avoided in usage.
4.1.2.2 Evaluation tests. An envimnmmtal test progmm is usodly conducted to
determine actual stress levels at which the part ftils or degrades significantly.
4.1.2.3 Specification. Tbe part shall have an adequate government speciticntion tbnt
detimes performance, design, materials, quality controls, and test requirements.
Parameters in the specification shall realistically characterize the part during its
~ge of SPecifid environment and operating conditions.
4.1.2.4 Qualification. The pm-t should be qualified to the applicable specification, and
this qualification must be maintained in .msmdrmce with qualification retention
requimmen~. Some pafi may be listed when there is an indication that a QPL
listing is imminent. QPL Iistiog shall be reviewed by the user for Iat=t
qualification status.
4.1,3 Standard part renoval criteria. A pal listed in this standard may be removed for any of
the following reasons
a. T’bc pml becom- obsolete
b. There are no longer any qoalified sourms for the part.
c. ‘GM part is replaeed with a fictionally similar device having improved characteristics
or better reliability.
d. The part exhibits reliability problems for which no economically adequate controls or
screens have been developed.
4.2 Parts procurement. The user is responsible for procurement of Standard Parts
4.2.1 Correlation of circuit mquirtments and detaiI specification test conditions. VtlIen m
application COndltion vm’ie5 fmm the detail specification test condhion(s), it shrill LWthe
responsibility of the mntmctor (or hardware d=igner.builder) to mtablisb a satisfactory
correlation between the cimuit requirements aod the detail specification requirements.
4.2.2 Specification. All parts listed herein must be p-wed to the applicable detailed
government specifications and be marked titb the JAN b-d (or approved abb~iatiOn),
NASA part number, which signifies satisfactory complima with all tbe specification
requirements.
4.2.3 Additional testing. Appendix B defmm the additional testing that is required for the parts
wbicb do not fully meet the requirements for NASA programs. AN parls indkatcd shall be
sobjected to these additional tests prior to use.
10
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MIL-STD-975L (NASA) - Put I
4.2.4 QPL Qualified manufacturers. QWfied manufacturers for Quslitied Products List
(QPL) are listed in the appropriate QPL. When purchasing QPL puts, the procuring
activity shall solicit bids from suurces listed in the applicable QPL for the ~ific pmt.
“Sole source” procurements sm. discouraged except when only one quslified suurce exists.
Tim qualifying activity may be contacted to determine if qualification has hen granted to
additional manufacturers for the part under procurement subsequent to the publication of the
current QPL, or if the previous qunlificstion ststus of my listed manufacturers has chsmged.
The qualifying activity for most QPL’s is the Defense Eldronics Supply Center
(DESC-EQ), Dayton, Ohio 45444.
4.2.5 Receiving inspection. Receiving inspection should be performed on Stsndard Psrts and
should include:
a. Review of dstn shipped with parls for mmplisnce.
h. Part munt.
c. Inspedion for part markings snd external defects.
d. Elextricsl measurement (100%) of critical parameters, except ssmpling which may be
approved hy NASA pmjeds.
Adequste security, such ss m envimmnentslly controlled bcmdsd storage mea, should be
provided for storing the received parts until use, to msintain their integrity snd -bility.
4.3 Purtsapplication. The Stsndsrd Parts listed herein must be properly applied by the user in order tu
give sstisfuctory end reliable performance. The equipment sbsll be. designed so that it wifl meet the
specified performance snd reliability requirements when using Stsndard Parts. Stsmfsrd Parts must
be used only f6r those characteristics m parsmetem which we controlled by the applicable detsil
specifications. The use of .Nandsrd Parts, as required by this standard, dues not relieve the mntractur
(or hardware designerllmilder) of the responsibility for complying with all equipment performance and
other requirements set forth in the applicable system/quipment specification und conkucl.
4.3.1 Minimi2i~ parts count. The variety of Stsndsrd Put t~ used in space quipment
design should be the minimum neec.wmy to provide satisfactory performance, and the user
should exerciss all reasonable design choices to achieve this objective.
4.3.2 Application guidslims. The application guidelines pmvidcd in MfL-HDBK-97S, “NASA
Parts Application Handbook, ” are recommended.
4.3.3 Purts demting. To achieve high reliability snd goad performance, dersting from the
quslified maximum rstings is required. All parts shall be dersled in accordance with the
derating criteria in Appmdix A.
4.4 Nomtnndard parts usage. Nonstandard parts shall be used only after they are approved hy the
responsible government sctivit y.
11
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M2L-STD-975L (NASA) - Part I
4.5 Conflict of data. In the event of conflict between the tednkal description of Standard Parts
described in IMs standard and the applicable specification, tbe specification shall govern.
4.6 PmbIfm reporting procedure - Standardization Document finpmvement Prapnsal, (DD Form
142fi). Consistent with the parts staudnrdimtion program, the use of the attached .%andardimtion
Docummt Improvement Pmpusal (DD form 1426) is encouraged as a communique for parts and
commodity experience. Experience need not’be restricted to problems which may lead to a pmt
removal request, but may also include pmi or commodity additions to the standard. As a minimum,
the “Remarks” paragraph should include the following (when appropriate.): commodity ID, generic
part number, user part number, and any pertinent data which may be of use for approving your
request.
Reply to attention ok
MANAGER (31O.A)
NASA PARTS PROJECT “OFFICE
GODDARD SPACE FLIGHT CENTER
GREENBELT, MARYLAND 20771
4.7 Materitd test requirements. Requirements imposed on materials to be used in tbe space
environment (i.e., thermal vacuum nutgassing, flammability, smoke, odor, toxicity) are
applimtion specific. EEE parts that are con formnlly coated by a material that meets project
requirements do not need to be tested for compliance to those material requirements, if
appmv~ by the specific project.
12
I
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MIL-STD-975L (NASA) - ParI I
PREFERRED NOhTSTANDARD PARTS
5. SCOPE
5.1 General., Part II of this stmdmd establishes ‘a list of nonstandard EEE parts which are preferred for
use in flight and mission essential ground suppnrt equipment, when a standard part is not available for
listing in Part L
5.2 Purpose. The purp&c of Part 11 is to prnvide equipment designers and manufacturers with a Iist of
prefemed electronic patts that am advanced microcircuits which have not yet becnme fully spprnved
or parts in common use by NASA pmgrmns but are not available in Part I of this standard. ‘f%is
section is @tended to encourage standardization of device types end specifications. fn addition,
pntenlial prngmm savings can be reafimd tbmugh shared qualification and other relevant data. The
nvailabllity of this data will meamfine the Nonstandard Part Approval Request (NSPAR) process for
listed part types.
5.3 Cln.ssiflcation. These parts do not carry any level of classification and require a Nonstandard Part
Approval Request (NSPAR) prior In use on NASA programs.
5.4 Benefkkd mmments (recommendations, sdditions, deletions), inquiries shut the partE Iisted (except
Advanced Microcircuit Parts Listing) and my pertinent data which may be of use in impmving Part II
of this dcxument should be addressed m follows
MANAGER (310. A)
NASA PARTS PROJECT OFFICE
GODDARD SPACE FLfGHT CENTER
GREENBELT, MARYLAND 20771
6. REFERENCED DOCUMENTS
See individual sections.
7. DEFSN3TIONS
7.1 Preferred Nomtandnrd Part. This is a part that dries not meet all criteria for Part I listing m a
standard part, but is being recommended for use to cnmumge STANDARf31ZATfON.
7.2 NSPARS. Nonstandard Part Approval Request, re+imi for afl parIs in Pari 11 of this standard.
13
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:!..
MIL-STD-975L (NASA) - Part I
8. CRITERIA FOR PREFERRED NONSTANDARD PARTS LISTING
8.1 Lkting criteria. Sn order for a part tn be listed in this section the following criteria must be met.
(i) The pari wadis listed in the Cnndidate Part List (CPL)
(ii) Application need has been identified
(iii) A suitable specification must be available for procurement of the part
(iv) Suitable NASA or government approved and NASA mn+eyed manufacturers exist
(v) Successful qualification to the suitable specification must have been accomplished
8.2 Removal of a nomtandard part. A part may be removed fmm this section if serious quality or
reliability problems have been found which are of general concern.
9. REQUIREh5NTS FOR USE. All pmjwts are responsible to ensure that their program parts
requirements are met by these park and procurement specifications prior to use. A NSPAR is required
and NASA approval needed unless specifically waived by the progmm.
14
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11.6
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MIL-STD-975L (NASA) - Part I
SECTION 12: SUMMARY OF STANDARD TRANSFORMERS
This standard contains no uansformers. All transformers must be procured to the
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application information and Appendix C for special requirements.
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14.16
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MIL-STD-975L (NASA) - Pan 1
I
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MIL-STD-975L (NASA) - Part I
14.18
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MJL-STD-975L (NASA) - Part 1
Summary of Standard Photonic Parts
There are no Grade 1 or Grade 2 photonic pans acceptable as NASA Standard
Parts. The Candidate Parts List for this document includes connector, terrnini,
fiber and cable specifications that have been developed for NASA use. Consult
the project parrs engineer for a listing of these specifications.
15.1
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MIL-STD-975L (NASA) - Part 1
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15.2
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MIL-STD-975L @L%SA) - ParI II
SECTION 21: ADVANCED MICROCIRCUIT PARTS LISTING (ML)
1.0 SCOPE
‘l%e Advmced Microcircuit P.m-tsf-king (AMPL) section of MfL-STD-975 contains advarIccd microcircuits not listed
~ QpL-385 10. Tfw P_@ COD~~ in the AMPL arc =msidemd nonstandard and w such sbnll require a
Nonstandard Parl Approval Request for usage.
1.1 Definition of Advanced Microcircuit. An advanced microcircuit is defied for the purposes of this
dwumcnt RSany device that meets one of the following characteristics
a. A monolithic digital microcircuit
(1) with more than 2,000 active transistors, or
(2) intended for use as a peripheral to a microcircuit m defied in (1) shove, regardless of
number of transistors, provided it is manufactured on the same production Iiie using the
same prc.cexses, or
(3) having 32 or more active pins exclusive of power and ground.
b. A monolithic memory microcircuit meeting any of the following criteria
(1) Static RAM with 64 Wits or mom.
(2) Dynamic RAM with 1 Mbit or mom.
(3) Fusible link PROM with 16 Kbits or more.
(4) EPROM with 256 Rbits or mom.
(5) Spczialkcd memo~ (FfFO, dud-port, etc.) with 4 K&is or more.
c. A monolithic finearkmlog microcimuit that combines two or more. Iimctions to form a mom
complex timction and has 20 or more active pins exclusive of power and ground.
d. A monolithic mixed-sigoal microcircuit (such as an a.nak.g-todigitd or digitnkto-tmafog
converter) capable of bandliig 12 m mom bits on the dlgitrd side.
e. A multicbip or hybrid microcircuit that meets one or both of&e following criteria
(1) Gmteins at least one die meeting the monolithic microcim.it criteria defied in a, b, c,
m d atmvc.
(2) Gantains three or more internally interconnected micmcirc.it d,. of any si.m and has 32 or
more active pins exclusive of power and ground.
1.2 RequEsfs for Adding Parlx to tbe Listing. Recmmncmlations for addition of a part to the AMPL sbafl
be submitted in written form b
21.1
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MIL-STD-975L (NASA) - ParkII
AMPL Task Manager
Jet Propulsion fAmmtov
M/S 125-105
4SC0 O& Grove Drive
Pasadena, CA 91109
FAX: (818)393-5245
Submissions should include identification of the part (part number and description), manufacturer, and
specification number. Information reganfiig the project and application for the part may akso be
included.
‘2.0 PART SPECfFfCATIONS, PROCIJREMENT, AND APPLICATION
2.1 Part Specifications. kmorder to be appmvcd and listed in this standard, a part shall have a specification
that defies physical design, material, quakity, controls, test requirements, as well as perforrosncc and
function over maximum operating ranges. ‘llc specification may be my one of the following type.x
a. A NASA Detail Specification prepared in tu%mdance with this document.
b. A Quahfied Mmmfacturcr’s List (QML) .%ndardizcd Military Drawing (SMD) prepared in
accordance with MIIA-38535 or MfbH-38534.
c. A %urce Control flawing (SCD) with requirements for wafer lot acceptance, screening and at
least the life test portion of lot acceptance testing (Quality Canfcmmance knspecticm (QC1) or
TecbnoloD conformance Inspection @cI)) essentially similar to those of MIL-M-3851O Class
S, Mkl.A-38535 Class V or MfL-H-38534 Claw K. The SCD may be prepared by a NASA
center, a NASA contractor m a contractor for military or commercial spacecratl systems.
2.2 Procur6nent. AU parts listwl herein sbakl be pman’ed to tbc applicable detd specifications and shall be
marked with a part number that signifies that tbe part meets all specification rcquiremen~. l%c
“Ordering Data” paragraph of tbe detail spcci fications should be consulted t6 assure that proper
information is kistcd in the purcbnse order or contract. Jn the event of conflict between the tecbniwd
description of a part in this kisting and the applicable detail specification, the detail specification shall
govern.
2.3 Application. Toe NASA Advanced Microcircuits listed herein must be pmpcrly applied by the acquiring
activity in order to obtain satisfactory and reliable performance. When an application ccdkion varies
from the detail specification test condition(s), it sbrdl be the responsibility of the acquiring activity to
establisb a satisfactory correlation between the circuit requirements and the detail part specification
requirements.
21.2
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MIL-STD-975L (NASA) - Put It
3.0 PARTS LISYfNG CRITEIUA
The criteria of 3.1, 3.2, or 3.3 as applim’ble shall be. met before an advanced microcimuit is approved and listed in
this standard.
3. I U,sti% Criteria for Parts with NASA Detail SpIAticatiOns
3.1.1 Vendor Vafkkttion. The NASA WL preparing activily shall conduct an on-site vendor
validation suwey in the. areas of fabrication, assembly and test, design, and organization, to
verify the vendor’s conformance to paragmpbs 3.1.2 through 3.1.5. When the validation survey
is scheduled, NPPO and the NASA center that requested the part shall be notified and invited to
participate.
3.1.1.1 Delkkcy Correction Prucedums. If, at any time during the initial vendor vtdidation
s-mrvey,the vendor is found to be deficient in any was that are required in this listing,
the vendor sbnll produce a plan for mrrecting tbcsc deficiencies. Two copies of this
plan shall be provided by the manufacturer to the qualifying activity. If all deficiencies
are not corrected and duly documented within six (6) months after the ‘survey, the
vendor shall not be listed on this standard and a new on-site valh+ation survey shall be
required before considering the parts for listing.
3.1.2 Qttdty Assurance Program. Tim manufacturer shall have a quality assurance program plan
equivalent to that in MIL-M-385 10, Appendix A, or a quafity management pmgmm plsn
equivalent to that in MU--1-38535, or MfbH-38534.
3.1.2.1 Configuration Management and Ttaceabtity. lle vendor shall have a wnftgmntion
management system in place to ensure traceability of all materials, procedura and test
information through the part serial number and date code.
3.1.2.2 Field Failures. I%e manufacturer shall bsve a documented oroccdum for k?ine and
dispmitioning of field failures returned by tbe customer, inciuding the capati~y ~
perform failure mmlysis. Failure amdysis reports shall be made available to any
acquiring activity upon request
3.1.3 Device Maturity. The manufacturer SW have fabricated the product on n production line
using proven materials and technology. TIc critid design and process parameters shall be
identified and contmllcd.
3.1.4 Cltaricterkntion Data. The AMPL validation tcum shall review characterization data from the
I!WtUfacNRr and any characterization data pmvidcd by NASA cutters or other agencies. The
data shall indicate the consistency of the pad pammetem when operating over the full
kvmmm, vol~ge, and current ranges. Operation over the full military operating range is a
sOd and not a requirement.
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MIL-STD-975L (NASA) - Put JI
3.1.5 QuaMicntion. The part shall be qualified to method 5005 of MIL-STD-883. The inspections
shall include groups A, B, D, and E (group E when applicable) as specified in MfL-STD-883 for
Class S devices.
3.1.5.1 Pending Qualification. Parts may also be listed when qudficntion hw not ken
~@et~. ~ ~ch =, m appmpria~”nomtiOn will be included in the listing,
indkating either that qualification is in process or under contract, or that the
manufacturer will qualify the part on the first lot of parts procured to the specification.
3.2 Luting Criteria for Parts with QML SMDs
3.2.1 Quahfled Manufacturer% L~t (QML). Advanced micrc.cimuits as defined above (paragraph
1.1) that am listed in QML-38535 or QML-38534 shall be considmmd for inclusion in this
listing.
3.2.2 Vendor Validation. Listing of the. manufacturer in QMb38535 or QML-38534 shall be
considered evidence of the adquacy of the quality management pmgmm plan and of the
manufwNrer’s capability to produce parts of suitable quality and reliability for space
applications.
3.3 Listing Criteria for Parts with SCDs
3.3.1 Consent of Preparing Activity. Prior to listing of any pm-t controlled by a NASA cater or
mntmctor SCD, the preparing activity shall furnish written consent for the use of the SCD to
procure parts for use by other NASA centers or contractors. Copies of the consent shall be sent
to the AMPL Task Mmmger at the address provided in pamgrapb 1.2 above and to the
manufacturer.
3.3.2 Vendor Vnfklation. The SCD preparing activity shall indicate the proccdurc used to validate the
vendor, such as on-site visits, w of information provided by other wm. DESC certification,
etc.
3.3.3 QuafVication. The SCD preparing activity shall indicate the current status of qualiticatioo in
mm-dance with the SCD. The status should be classified in one of the folfowing categories,
which shall be indicated in the listing.
a. successfully completed.
b. In process.
c. Under contract.
d. contract in negotiation.
e. Rquircd on the first lots of parts procured to the specification,
3.3.4 Chaqp. Any revision to the SCD or change in the qudficaticm status should be promptly
reported tO the AMPL Task Manager at the address given in paragraph 1.2 above.
21.4
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MIL-STD-975L (NASA) - Psrt II
~ 4.0 LISTED PART REMOVAL CRITERIA
A part listed in this standard may be removed for any of the following masons
a. ‘fhe part becomes obsolete.
I
b. There arc no longer any qualified SCW-CC9
for the pmt.
c. Tlte part is replaced with a ftmctioually similar device having markedly improved characteristics
or better reliabWy.
d. ‘he part exhibits functionality or rdiabWy problems.
I
e. Failure of the manufacturer to re-sp-andto a Govcnuncnt-industry Data Exchange program
(GIDEP) Alert or to take cor-mctivc action.
f. If, at a later date, a part on this listing attains qualification for QPb38510 it Ml then be
removed from this section and added to the Part 1 microcircuit section of this standard.
4.1 Pmblan Reporting. ‘fhe GIDEP Alert ptugmin provides a mccbanism to report problems with the
performance or reliability of a part. ‘I%eNASA AMPL preparing activity will evaluate all Alerts and
other problem reports issued against parts listed in the AMPL.
1“ 5.0 PART NUMBERING SYS1’EM
‘fle numbering system for NASA Detail Specifications follows the basic format of the SMD one part, one parl numkr
system. AU parts bearing the NASA Spezifimtion pm-t number shall be in full conformance with the applicable detail
specification. The part number consists of two segments, the specification number and the pari suffix. For
pamgmpb.$ 5.1 thMU&Th 5.2.4, NA62-WWXXX ZZSYY will be used a9 no example part number.
5.1 Spwiflcation Number. The specification number consists of the first ten symbols in the part number.
‘l%e specification number would therefore be NA62-WWXXX.
5.1.1 Stool Class Designator. NA indicates NASA and 62 are the Imsttwo digits of the federal stock
class designator (5962). NA bas been substituted for 59 to avoid conflict with numbem assigned
by DESC.
5.1.2 Radiation Hmdnfss Designator. The dash position indicates the mdiation-bardncss of the pnrt.
A dash mean?+the part is not radkion-hwd. If the part is assured to be radhtion-hard, the
followhg lettem would take the place of the dash in the pari numbm
3kntd M l~kmd R
5kmd N mokrad s
IOkmd D 300kmd T
20krad E 5ookmd u
30kmd F 10@3kmd H
50kmd G
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MIL-STD-975L (NASA) - Part II
5.1.3 Drawing Number Year. W am the last two digits of the calendar year in wbicb the drawing
number was assigned.
5.1.4 Drawing Number. XXX is a sequential drawing number within the calendar year.
5.1.5 Revi.4on Letter. Revisions to the spwification =“ indicated by a sequential revision letter. ‘he
revision letter is not a part of the part number.
5.2 Part Number Suffii. ‘3%.part number suffix consists of the last five symbols in the part number. The
pm-inumber suffix would therefore be ZZSYY.
5.2.1 Type Number. ZZ is the type number within the drawing.
5.2.2 Class Designator. S is the cl= designator (since the parts am Class S quivalent).
5.2.3 Package Designator. ‘lhe first Y is the package designator (case outliie Ietrem) in accordance
with MfbM-38510 and h41fSTD-1 835.
5.2.4 Lead Finish Designator. lle second Y is the lead finish designator in accortfamc with
MIL-M-385 10.
21.6
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MIL-STD-975L (NASA) - Part H
,,
21.7
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MIL-STD-975L (NASA) - Part II
L 21.8
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MIL-STD-975L (NASA) - Pan II
21.9
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MIL-STD-975L (NASA) - Part II
:1
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MIL-STD-975L (NASA) - ParI II
21.12
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MIL-STD-975L (NASA) - Part II
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MIL-STD-975L (NASA) - Pan II
1
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L 1
21.14
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MIL-STD-975L (NASA) - Part II
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MIL-STD-975L (NASA) - Part II
z
n
>
=1
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MIL-STD-975L (NASA) - Part II
21.17
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MIL-STO-975L (NASA) - Part II
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MfL-STD-975L (NASA) - Pan II
SECTION 22: HIGH NASA USAGE
The following pans are in common usc by various NASA space centers. contrwxms and subcontmc(ors. They m:!y be
procared to the Iistcd specifications, bul arc considered nonstandard. Nonstandard Pans Approwd RcquesIs (NSPARS)
must be submitted (ii accordance with tbe individual pmgmm requirements) in erder to usc tbe.se parts since they do not
meet the requirements ncce.ssary for listing in P,an I of tftis sLmdard (see parigmph 4.O of Part f).
Specification
I
Generic Number Number Description of P:m Type
REF-ol 5962-89S8102 Microcirctil. Voltage Reference, Adjusmble. + 10V
AMP-OIA 5962.8863001 Microcircuit. Instrumentation Amp. kw Noise
LM104 S962-8760501 Microcircuit. Voltage ReguLmor. AdjusLtile. Neg.
LM105 5962-8958801 Micnxircuit. Voltage ReguL?wr, AdjusL*le. Pm.
LMI 10 S962-8760601 Microcircuit, Voltage Foflower. High Speed
LM136A 841RIJ)1 Microcircuit, k’OIL1gL! Reference. Precision, 2.5V
LMIS8A S962-877 1002 M]crocircuil. OP Amp. Du:II, Low Power
26LS31 780230 I Microcircuit, Dlfferenthl Line Driver. Qu,ad
26LS32 7802!JJ1 MicrocircaiI. DWerentii Line Receiver. Quad
22.1
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MIL-STD-975L (NASA) - Part II
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22.2
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MIL-STD-975L (NASA)
APPENDIX A
STANDARD PARTS DERATING
I A. 1
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MIL-STD-975L (NASA)
APPENDIX A
STAND- PARTS DERATfNG
INDEX
Page No.
1.0 scope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.3
2.0 Introductio n . . . . . . . . . . . . . . . . . . . . . . ..A.3
3.0 DemdngCriteria . . . . . . . . . . . . . . . . . . . . ..A.3
3.1 Capacitms . . . . . . . . . . . . . . . . . . . . . . . . ..A.4
3.1.1 CapacimrDemdngCharts . . . . . . . . . . . . . ..A.5
3.1.2 Capacitor Demdng Example . . . . . . . . . . . . . . .A.5
3.2 Connecum. . . . . . . . . . . . . . . . . . . . . . . . ..A.6
3.2.1 Connector Exmnple . . . . . . . . . . . . . . . . . ..A.7
3.3 Crysml s . . . . . . . . . . . . . . . . . . . . . . . . . ..A.8
3.3.1 Crymf Example . . . . . . . . . . . . . . . . . . . . . A.9
3.4 Dbdes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.1O
3.4.1 Diode Exmnple . . . . . . . . . . . . . . . . . . . . .. A.11
3.5 Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.12
3.5. I Filter Example . . . . . . . . . . . . . . . . . . . . . .. A.13
3.6 lnducoms/Coils . . . . . . . . . . . . . . . . . . . . .. A.14
3.6.1 lnduclor Example . . . . . . . . . . . . . . . . . . . .. A.15
3.7 fWcmcirctits, Linear . . . . . . . . . . . . . . . . .. A.16
3.7.1 Microcircuit. Linear Exansple . . . . . . . . . . . . A.17
3.8 Microcircuits, Digital . . . . . . . . . . . . . . . . . .. A.18
3.8. I Micrmircub, Dlgiud Example . . . . . . . . . . . . A.19
3.9 Protective Deviccs . . . . . . . . . . . . . . . . . . . . . A.20
3.9.1 protective Device Esmnple . . . . . . . . . . . . . . A.21
3.10 Rekeys . . . . . . . . . . . . . . . . . . . . . . . . . . . .. A.22
3.10.1 Relay Example . . . . . . . . . . . . . . . . . . . . .. A.23
3.11 Resis[om . . . . . . . . . . . . . . . . . . . . . . . . . .. A.24
3.11. I Resislor Example . . . . . . . . . . . . . . . . . . . .. A.26
3.12 Switches . . . . . . . . . . . . . . . . . . . . . . . . . .. A.27
3.12.1 Switch Exiunple . . . . . . . . . . . . . . . . . . . . .. A.28
3.13 Thennislom . . . . . . . . . . . . . . . . . . . . . . . .. A.29
3.13.1 Thermistor Exanple . . . . . . . . . . . . . . . . . .. A.30
3.14 Tmnsforrnem . . . . . . . . . . . . . . . . . . . . . . .. A.31
3.14.1 Tmnsformer Example . . . . . . . . . . . . . . . . .. A.32
3.1s Transistors . . . . . . . . . . . . . . . . . . . . . . . .. A.33
3.15.1 Transistor Example . . . . . . . . . . . . . . . . . . A.34
3.16 Wire and Cable . . . . . . . . . . . . . . . . . . . . . .. A.35
3.16.1 Wire nnd Cable Example . . . . . . . . . . . . . .. A.36
A.2
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MIL-STD-975L (NASA)
STANDARD PARTS DERATfNG
1.0 SCOPE. hrclusion of pans in tbii smndard is based on the psemise Ifrm certain characteristics of the
parts me derated for refirdde operation.
2.0 lNTRODUCTfON. Demdng is the reduction of elecrncaf, thernmf. and mech~icaf smesscs appfied to a
P.MIin order to decrease the degradation mte and psolong Ihe expected life of the part. Demting increnscs the
masgirr of ssfety between the operating so’ess level mrd the amuaf failure level for the part. providing ~dded
I protection from system wromafies unforeseen by the designer. The following guidelines give basic information
for the demting of component parts. Tire specified demting percentages rmd notes wiff assist the designer in
obtaining refiible opcraiion of parts used in space equipmeni. h must be emphasized tit the user shoufd
evsfuate nff parts to Lheproject requirements nnd assure that adequate demtings am accomplished. Thssc
recommended demdng fnctors we bzsed on the best information curmmfy wmifable.
3.0 DERAITNG CRITERfA. The demdng crireria contained herein inrficatc lhe maximum recommended stress
vrdues and do not preclude fustfrer demting. When demting, the designee must fu’s.tmke into account ~he
specified environment mrd opemting condition rating factors.. coosider the actual environmental and opemdng
conditions of tie appficmion, and then apply the recommended demdrrg criteria contained herein. Parts not
ripf!em’ingin these guidefiies MCfaeking in empiricaf data mrd failurs history. ‘fle demdrrg instructions are.
l&d for each commcdity in the following paragraphs.
NOTE 1: To nssurc that these demdng crimia arc observed, an EEE parts fist (item by item) shaff he
generated for each hardware ns-scmbly. Thii fist shafl, as a minimum. contain the maximum mted
capabMty (such as voltage, current. power, temperature, etc.) of the PM in compm-ismr with the
design requirements of the application, indicating conformance to the denting criteria speciticd
herein.
NOTE 2: fn the foffowing demting sections. lhe term %mbient tempemtwe” m appfisd to low pressure. or
space vacuum opmlion, is defined as foUows:
For operation under conditions of very low atmospheric pressure. or space vecuum. heat loss by
convection is essemiaffy ZXO,w ambient tempemturc is the maximum tcmpemtwe of the heat sink
or other mounling surface in contad with the pmt. or Ihe temperature of Lhesurfnce of the parl
ilself (case tempemnrm).
A.3
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MIL-STD-975L (NASA)
3.1 CAPACITOR DERATING CR3TEfUA
~
Voltage derating is accomplished by multiplying the maximum opcradrrg voltage by the appropriw
demtirrg factor appring in the than below.
Ma?.imum
Military Voltage Demdtrg Ambient
Type Style Factor (2) SpeciIicatiOn Tempcmturs
CCR (3) 0.60 MIL-C-20 11O’C
Cemmic
CKS
CKR (3)
CDR (3)
0.60
0.60
iWL-C- 123
MILi-39014 I
IItTc
llIYC I
Glass CYR
cm
Plastic fdrrr
CHS
CLR25
CLR27 0.50 MLL-C-390062 7tYc
Tantalum. foil CLR35 0.50 MIL-C-390tM/3 7P c
CLR37 0.50 MfL-c-390C6/4 Iv c
CLR79 0.60 M3L-C-39006/Z2 7tYc
0.40 IltTc
Tamalum, we! slug CLR81 0.60 MIL-C.390W-25 7(Yc
0.40 Ilo’c
(
CSR (1)
Css (1)
0.50
0.30
0.50
MfL-c.39003/l.2
M3L-c-39003/lo
7P c
IlfYc
7W c
1
Tantalum. solid 0.30 llVC
CWR (1) 0.50 ML-C-55365 7V c
0.30 lltYc
(1) For applications where tbe effective circuit resistance is less than 1 ohm ~r volt,
Corrlact frmrs sfrecialis[.
(2) Applies tu the sum of peak AC ripple and DC @riziig volrages.
(3) For low-voltage applications (<10 Vdc). rated voltage shall bs at Icasl 100 Vdc.
A.4
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MIL-STD-975L (NASA)
3.1.1 CAPACITOR DEIL4TfNG CEARIX
Tantalum, Solid (C.SRICSSICWR)
~,eVolt.,. Demt[., %clor
,,, ifi~
,,4 1111.—y.
0.3 —
II!{
*. ..:. —
,! : ,..
ii,
---- — ...T. — .-. —T —-
0.2 :
i:!! i:, l !
i
,
0.1 -
01s3!4sMiln T,
63 70 7S
Temperature (“C)
83
I
95 10s’’”113 113
3.1.2 CAPACITOR DERATLNG EXAMPIE
lle principsl strc&spsmmetem for cspihs tire Wnpetature and DC sod/or AC voltage.
Ex81nplc: A CYR style glass mpmitcc mtcd at 10 pF, 103 VDC is opemtcd St a ❑sximum of
7W C ambient tempmatum.
Applying the 030 daatig fhcfor, (03 x 100 VDC) gives a dcmted msximum voltsgc
of 50 VDc.
lle 7LYC smbicnt tcmpmture is within Um maximum sllovmd.
A5
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MIL-STD-975L (NASA)
3.2 CONNECTOR DERATING CRfTERIA
=
Connectors are dermed by Iiiiting the tempemtm seen by the dielectric ken due [o mnbiem
tempmmre and the effems of resistive heating. See 3.16 for current demdng of wire and cable.
f)pemdng voltage demling 25% of tie rated Dielecrnc Withstanding Voltage w Sea Level.
Tempmwre rating of Lhedielectric insert
T{@a) + T(ti ~@ + 5fP C
L...:
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1 MIL-STD-975L (NASA)
1 3.2.1 CONNECTOR DERATING EXAMPLE
Temperature Derating
H
To choose an Wpmpriate comeclor tempcmture rating for a 10WC opemung temfmmurc (ambient +
I ohmic heating lempcmtures):
T{.- = connector tempemturc +50”C
= ICo”c+ 50”C
= 150”C
I
Choose a connemr hat has an opemdng rcmpcmttme rating of gmter than 15WC
Voltage Dera[ing
To chomc an appropriate connector voltage rating for a 100 Vdc maximum appficadon voltage
V,”ti . V(max Opemting)A1.Z5
= lCO Vdc/O.25
I = 4tXl Vdc
I _.
-. Choose a connector IhaI has a Dielecrnc Withstanding Voltage (at Sea Level) rating greater than
400 Vdc.
A.7
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MIL-STD-975L (NASA)
3.3 CRYSTAL AND CRYSTAL OSCILLATOR DERATING CRfTEfUA
m
Prmenlly Ihem. me no approved crystafs in MIL.STD-975L.
Crysud oscifhuors shafl be denmd to tie individual component level. Crystal current shafl te fimited to
50% of tie med wdue. In cases where. start up dme is critical, 75% of the rued value can be used.
A.8
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MIL-STD-975L (NASA)
33.1 CRYSTAL AND CRYSTAL OSCILLATOR DERATING EXAMPLE
m
Presently there are no approved crysmls in MIL-STD-975L.
This page is intended for future use.
A.9
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MIL-STD-975L (NASA)
3.4 DIODE DERAI’ING CRITERIA
~
Demdng is accomplished by multiplying the critiud stress parameter by the ,appmprizte demdng factor
appearing in (he chart below,
CrilicaJ Stress Maximum Junction
Diode Type Pammeler Demting Tempcmmrc
General .mumose.
. PIV 0.70
Rectifier. Swi[cl&g,
Surge current 0.50
Pin/Schottky, 125°C
and Thyl’iS[OIS Forward current 0.50 (all Iypes)
Power 0.50
V<mtor Reverse voltage I 0.75 125°C
Focwrd current 0.75
voltage Power 0.50 125°C
Regulator Zener current 0.5(~max+@0m)
Voltage reference Zener current NIA (1) 125°C
Zener Voltage Power dissipation 0.50 125°C
suppressor
Bidirectional Voltage Power di.ssipalion 0.50 125°C
.$upprcssor
FET Current Regulator Peak operating voltage 0.80 125°C
(1) operate a! the mtm.fwurcr’s specified zcner current (Im) to optimize tempenuurc
compensation.
A.10
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MIL-STD-975L (NASA)
3.4.1 DIODEDERATING EXAMPLE
m
For sificon-switching and smafl-signd diodes, temperature, voltage, and current are the principal SUESS
parameters. High junction Wnpemtmz is the most dcsuwxive stress for diudes. Junction tcmpermurc
musl also be cidculmed and mnimaincd below the limits aJlowed.
Examplti A general purpose diode mtcd at 1 A, 200 VDC, with n thermal resisumce fjunction to
air) e,, of 0.3”C/mW, is operating in an ambiem tempcmsurc of 30°C (T,J
. Applying the demdng crhcria we havti
CurrcnC 0.5 A max. (.5 x 1.0 A) = 0.5 A
PIV: 140 VDC max. (.7 x 200 VDC)= 140 VDC
Note that the maximum forward voltnge (typicaffy 0.7 V) and demted forward current
(0.5 A) will give an expended fmwer of 350 mW.
Cafcufming the junction tcmpera!um;
T, = TA+ f3,,*W
T, . 3fPC + (350 mW)(O.3”C/mW)
T, = 3fYC + 105”C
T, = 135°C
This is grater than the allowable junction tempcmturc of 125”C. so we must reduce
the junction tcmpcmturc by 1(FC by reducing the forwmd current to 0.45 A.
Decreasing the current md recalculating T, we have
T, = T. +13,.*W
T,= 30’C + (315 mW)(O.3”C/mW) (0.45 A*O.7 V)=315 mW
T, = 3(YC + 94.5°C
T, = 124.5°C
This is less than the mmimum alfowable junction tcmpsraumc of 125°C
All
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MIL-STD-975L (NASA)
3.5 FILTER DERATING CRITERIA
w
Demting is accomplished by multiplying lht current and voltage by tie appmpriaie dtming facmr
appearing in Lhechtm below.
Chss Demdng FacIor (1) Maxiium Ambient Tempemture
0.50 of raked currem
AO + 85” c
0.50 of mled voltage
(1) Rmed op.aadng current or voltage, not absolute. maximum,
A.12
II
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1 MIL-STD-975L (NASA)
3.5.1 FILTER DERATING EXAMPLE
m
The critical parwneten are dielectric voltage. current, and tempemmre.
I ExamPltY An EMI filter med at 10 A, 220 WC. and 105”C shall be derated 50% and used LU
no more dmn 5 A and 110 VDC. The ambient temperat~ shall be limited to 85” C
masimum.
1.
I
I
A.13
I
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MIL-STD-975L (NASA)
3.6 INDUCTOR DERATfNG CRfTEfUA
E
Insulation CLWS Maximum Clperating Pmametem
MLC-3901O MfL-c-15305 Rated Derated @rating Voltage
C@’sting Operating
Temperature Termperatum
0 +85° C +65” C
A A +105° C +85° C Demte 10 50% of tie
rated Dielectric
B B +125°C +105” C Withsomding Voltage
F +150” C +130” C
“Induc[ors are demted by reducing the maximum opemdng temperannt based on the insulation class
used md reducing tie opemdng VOILTge. See notes below.”
@ Maximum operaling Iemperatws equals ambient temperature plus lem~ramre rise, plus 10”C
(alfowance for hot spot). Compu[e temperature rise as follows
Temperature Rise Test (per MfL-T-27. pam 4.8.12)
Tempcmmm rise (“C) = _(R - r) (, + 234,S°C ) - (T ‘1)
r
Where R = winding resistance al elevated tempesamm
r . winding resistance at ambient temperature I
i = specified inkial ambiem temperamre (“C)
T = maximum ambient lempemmre (“C) at time of power shutoff.
T skdl not differ from I by mare tian 5°C
b) The insulation CIZSSSSof MlL-style inductive parts generally have maximum opxadng
temperature ratings hosed on a life expectancy of 10,CS3O hours. The maximum operating
temperatures in IMs table am selecIcd to extend the life expccmncy 1050,000 hours.
c) Custom-made inductive devices shafl be evaluated on a matmiafs bask and stressed m levefs
below the maximum rated operating tempxmure for the materials used. Devices having a
maximum rated o~mting temperamre in the mnge from +854 to +13tTC shall be desated as
follows maximum opating tempsmtum. ~ C) equals 0.75 limes maximum mled operating
tempemnu’e ~ C). For devices witi mzsimum rated temperatures owside lKs lem~mture
range, consuft tbe project parts engineer for tempemture denting recommendations.
A.14
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MIL-STD-975L (NASA)
3.6.1 INDUCTOR DERATING EXAMPLE
l.&!!zl
The pammeters to he demmd are dielectric stress (volmge), maximum current, and tempemture.
Examfk A coil msed at 1 A. 10Qvolts. and 105”C shall be used at no mcmethan 1.0 A and 50
volts (50’%of 100 V). The lempmmre rise and maximum operating tempemture are
czlculamd as foUows, using the tempcmture rise L@ described in pamgraph 4.8.12 of
MILT-27. The following is a typical exnmple.
If R=l 7 ohms winding resistance al the elevakd tempaatum of 25”C, twd I= 15 ohms
.. winding resistance at 21“ C, then:
(R -‘) (, + 234.5aC ) - (T - 1)
T ruse = — r
(17 - 15) @~OC + ‘234,5°C ) - (25°C - 21°C )
‘~
. 0. 1333(255.5” C) - 4°C
= 34.05WC - 4“ c
T WE = 30.058° C
Max. operating temfmatum = T, + Tkl~~+ lIYC
= 21”C+ 30.06”C+ I(TC
= 61.064C
The coil is wound with 105”C (chss B) insulation, which can handle weff over the
calculated maximum operating tempcmmre of 61.06” C. In fact, cfass O (65”C)
insulation would bc sufficient ha-e.
A.15
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MfL-STD-975L (NASA)
Microcircuits
3.7 LINEAR MICROCIRCUIT DERATING CRITERIA
Linear
m
Demting of microci~uits is accomplished by multiplying lhe appropriate pmameter by tie demting
factor listed below. Junction temperature must be calculated and maimained below the fimit of 10fPC.
operational
or
Differential Sense Current Voltage Analog
Parameters Ampliliem Companuors Amplifiers Amp fifiWs Regukors Switches
Absolute maximum NJA
0.80 0.90 0.80 0.80 0.90
supply voltage (2)
Power di.ssipadon
(percent of rwd
power m mzximum 0.75 0.75 0.75 0.75 0.80 0.80
operating
lempemture)
AC input voltage (1) 1.00 1al 1.Ou 1.00 NJA NjA
Output voltage 1.00 NIA NIA 1.00 NIA NIA
Open colkmr (or
&in) DC ouIpuI \ N/A { 0.90 I 0.90 I N/A I N/A NIA
vO]Llge
Operating AC or DC
0.80 0.80 0.80 0.80 0.80 0.80
oummt current
Minimum
shon+ircuit output
current
Maxiium junction
I 0.90
I
!
0.90
I
\
0.90
I
!
0.90
I
,
0.90 NIA
100”C lWC 100”C 100”C 100”C Ioo”c
temp.
(1) Under no circumsmnces shall the input vohage be aflowed m exceed the supply
voltage.
(2) Vl~ - Vom should be demted 0.80.
A.16
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MIL-STD-975L (NASA)
3.7.1 LfNEAR ~CROCIRCUIT DERATDW EXAMPLE
H
The principals- parameters for linear miaucircmits are the supply voltage, input voilagc, output
cwrcrd, lolal device power, and junclica Iunpualure.
Note IMI package thermal rating will aff.zl the junction tcmp&sturc and Iimil the ou!put m~l and
power allowed.
Example: A vA741 op smp is rated al:
v+ . +22 VDC supply votige, (max)
v. . -22 VDC supply voltagq (max)
‘ID = ●3O VDC input dfiermtial voltage (max)
~ = 20 mA output sbon-it currcm (max)
● 14 VDC output vollage awing (typical)
‘J = 175°C metal package @3-5)
w = 3@3mW
e JC = 7CPCAV dx.zmsl rcsialance (case jundicm) above 70” C duate al -143 mW~ C
Applying lhe dcrsting aitmis,liatcd in lhc T amp column on tic prcvioua page., we have
Va = +17.6 VDC (maximum) (0.8 x 22 VW)
VEE = -17.6 VDC (maximum) (0.8x 22 VDC)
~ ‘ ::&c (0.9 x 20 mA)
. (1.0 x 14 VDc)
T, . la3”c l~C ismax
w . 375 mW @lfWC @.75 x 500 mW)
Opusling the junction at lC& C wilh a ca$c (cmpmwum of 89” C, our maximum
allowable devicx wattage S
‘J . T= + W*13X (vacuum, no ambient air)
T] - T=
Orw =—
‘JC
1C13°C- Lure
w. 70”CIW
w .0.2857 W .285.7 mW
2&5.7 mW is * maximum sllcrwablc wattsgc a a case temperature of WC.
M Cms.idcring temperature and pwer, the PA741 op amp must be opa’alcd within M
.
, dasting auve shown bc.lmv.
P
:
.
,
:
P
●
!
I 0
I \\ ,0s I
0. Z94063S01C4 Iznlullm
:
CAM Tmtmru!av. c
(nw
A.17
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MIL-STD-975L (NASA)
3.8 DIGITAL MICROCIRCUfT DERATING CRfTEfUA
I Microcircuits
Digital
Demdng of microcircuits is accomplished by muhiplying the appropriate pwwnewr by its derming factor
fiited below. Junction temperature must also be calculated and maintained below the maximum findL
Gme
CMOS CMOS CMOS Line Arrays
4000 A&B HC & Ha AC & ACT DliVeI’Sand Bipcdm
Pammeters (1) (2) Bipolar MOS (3) (4) (5) Receivem MOS
1 1 1
Maxiium junction I lotrc I Ioo”c I 100”C Iflrc 100”C lWJ”C 10ITC
lempemture Ill ,
open co ffecmr (or dmin) 0.80 NIA NIA N/A N/A 0.75 0.80
DC ouqmt voltage (6)
@mtb)g AC or DC 0.80 0.80 0.80 0.80 0.80 0.80 0.80
output current or fanout (7) (7) (7) (7) (7)
Maximum clwk NIA 0.85 0.85 0.85 0.85 0.80 0.80
frequency
(1) Under no circumsomces shall the input vohage bc aflowed 10 exceed the supply
voltage.
(2) For those technologies where no supply vollage derating is given, in no case shalf tie
device be opmoed a (he absolute maximum supply voltage.
(3) The operating supply voltage shall no[ exceed 70% of the absolute maximum voltage.
(4) The operating supply voltage shalf not exceed 799. of the absolute maximum vohage.
(5) The operating supply voltage shaff not exceed 92% of the absolute maximum voltage.
(6) The demting factor for TfL open collector devices sfmfl be 0.75.
(7) Further deraring may be required for radiation environments (i.e.. mtilmum Vcc to
insure minimum DC reference for bansienls).
A.18
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MIL-STD-975L (NASA)
3.8.1 D1fXTAL MICROCIRCUIT DERATING EXAMPLE
m
I 1
The. principal stress pmametws for digital microcircuits are [he output current (fanom). total device
power, ‘andjunction tempcrmure. Note tit package thermal mung will affect the junction temperature
and Iimii the output current and power allowed.
ExamfdH A ‘fTL S402 quad two-input NOR gate is rated m
v CC= 5.0 + 5% VDC SUpply VU]Ulge
Im = 27 mA supply current
v,” = 2.0 VDC (rein) input high
v,, = 0.8 VDC (m.ax) input low
v OH “= 2.4 VDC (rein) output high
v OL = 0,4 VDC (m.ax) ompm low
I . 1.6 mA each OUIPU[
:&out = 20 TfZ Loads
T, = 175°C maximum.
e=
lC 28° C/W, (14 pin CER-DIP)
Applying the demting criteria. we have:
FanOut = 16 (0.8 x 20)
T, = 100”C (maximum)
For wm’sr-cmc packge powec
v ~ =5.OV )
la =27mA ] (5.0 V*27 mA) = 135 mW
Fmmm =16 ]
v .L=o.4vt 16(0.4 V* 1.6 mA) = 10.24 mW
~, = 1.6 mA )
kfaxii~ dissipated power. 145.24 mW. (1)
Ope.mting the junction m 10VC, and assuming there is no contribution from ambient
air (no convection) in space
T,= T=+ W*9,G
Note that W*13,C= 0.145 W (28°C~ = 4.W”C rise. T, = l~”C and ICO”C -
4.06°C . 95.94°C TG which is the maximum alfowable cw tcmpcmttue we may
operate wilh.
Ah note that the device. wattage (output current) must k dccrcased as cw
tempcmturc incrcascs to maimain the junction temperature. T,. below 10fYC.
(1) For MOS opaation flso calculate and add the AC wattage conrnbmion.
A.19
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MIL-STD-975L (NASA)
3.9 PROTECTfVE DEVfCE DERATING CRITERIA
I
Protective
Devices
I
A. FUSeS
Fuses arc demted by multiplying the rated ampsrcs by the appropriate DemIing Factor Iistcd below.
Fuse Current Demting
Rating Factor
(amperes) (1) (2) Remarks
1 & 1.5 0.45
E=l=l
Rating at 2S”C ambient. Demting of fuses
0.5 & 0.75 0.40 alfows for loss of pressure, which lowers the
0.375 0.35 blow current rating and Wows for a decrease. of
cument capability wilh time. (1) (3)
0.25 0.30
0.125 0.25
(1) If cafculntions rcsuft in fractional vafues, use the next highest standard fuse
rating.
(2) Demting factors we. based on duo from fuses mounted on prin[ed circuit
boards and confornmfly coated. For other types of mounting, consult the
project parts engineer for recommentilons.
(3) Then? is an additional denting of 0.5 pzcen~ C for m increase in tie
ambient tempemturc above 25”C.
B. Cmui[ Breakers
Cmuit breaker contains are demted by multiplying the maximum rated contact current (resistive) by the
~PFOPfiIC contact derming factor Iisd bdow.
Contact Contact Dersring Maxiium Ambient
Application Factor Tcmpemture
Resistive 0.75
Cqxtcilive 0.75 (4) 20”C below
Inductive
I
0.40 the maximum I
Motor 0.20 specified
F&unenl 0.10 I
(4) Series resistance shall be used to assure that circuiLs do not exceed
Lhedemtcd level.
A.20
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I
1 MLL-STD-975L (NASA)
Protective
3.9.1 PROTECTIVE DEVfCE DERAITNG EXAMPLE
Devices
D
A. Fuses
1“ The principal stress parameter is current.
Examplti A buard expected to be opemting M 80”C ambient has a calculated maximum cument
of 0.9 A. ?he additional demting required due to Iempemtm is cafcufated as shown.
0.5% ~C x (80”C - 25”C) = 27.5%
The to@ deradng factur is cafcufated as follow$
50% - 27.5% = 22.5%
and the fuse rating is cafcufatcd as shown:
0.9/0.225 = 4 A
A fuse with rating equal to or greater than 4 A must be used in this circuit.
B. Cimuil Breakers
Cmwtct current is tie @ncifml stress pammeter. Demting level is predicated on application load.
Maximum ambiem temfxxature affowed is reduced 2t7’C frum the specification fimit.
Example: A circuit breaker is 10 lx. selected to cuntml an electrical motur rak.d at 17 A, fuU
load. 24 Vdc. The circuit breaker is tu be installed in an environment with an ambient
temperature ranging bum 10”C to 30”C.
The temperature derming isz
.-. 3fPc+ 20”C = 50”C
The contact current demting is;
17 AJO.20= 85 A
A circuit breaker with maximum ratings equaf to or greater than 5fPC and 85 A must
be USc4ffor this application.
Vendor information must be consulted to determine the prupcr trip currentltiie curve
of the aclected circuit breaker. ‘flernmf circuit breaketx may have an additional
deradng or trip time due m ambient temperance effects.
A.21
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MIL-STD-975L (NASA)
3.10 RELAY DERATfNG CRfTERIA
m
The dcratcd contact current (ID,) is found by multiplying the contact rating (1) and the prcduct of T, R,
and L from the following tables.
- Table T, Ambient Operating Temperanms
- Table R, Cycle Rale
- Table L. Load Application
I., =Ix TxRx L
TABLE T(Tempemturc)
Temp Rwge -6S°C [o -21°C -2Crc 10 +39°c MY c 10 +85° C 10
+84” c +12S” C
Factor 0.85 0.9 0.85 0.7
TABLE R (Cycle Rate)
Cycle tats pm hour <1.0 1.01010 >10
Factor 0.85 0.9 0.85
TABLE L (bad)
A B c
Load Application to 0.5 sex to 5.0 min Other
Factor 1.0 1.5 0.8
Load A. Make, break nndkr cnrry loads with an on-time durntion of O to 500 milliseconds. Off-time is
equal IOor greaer than on-time.
Load B. C.mry-ordy (1) loads. Relay does not make or break [he load. Maximum on-time is 5 minutes.
Off-time is equal 10 or greater than on-time
Load C. Make, break andlor carry. Those loads that do not fafl into the catego~ of loads A or B.
(Limimd use)
(1) “Carry-only” means that the relay contacts arc cloxcd before there is current flowing
through the conums.
A.22
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MIL-STD-975L (NASA)
I 3.10.1 RELAY DERA?TNG EXAMPLE
m
I ~epticipd s-spmetm mcontinuous conmctcwni mdmm~mtw. Using reduced coil
voltages and abnomwd contact voltages can reduce the fife of the refay and, compromise relay operation.
Exmnple 1: A 1.0 A relay is operated in m envisonmem with is Iempemtum of +7tT C. The relay
is cycled at a rate of 5 cycles per hour. The bad application is make, break, and
CWTY, witi a time duration of 400 msec.
I From Table T select the +4W C to +S4°C factor.
From Table R and Table L sclecl the wfnupriate factom.
I
Conract derming factor is T x R x L = 0.S5 x 0.9 x 1.0= 0.765. lle demmd CmLWI
load k 0.765 x 1.0A = 0.765 A.
,; EXilIllDle ~ A 10 A relav. is oocmted
. in an environment with a tcmcem.we of -4P C. The rclaY
is turned on for 3 minutes once evcrv 2 bmus. The load amfictiion is carrv-only.
. .
Selecr (he appmprimc factors from T-ahles T, R. and L. “”
Contact demting factor= 0.85 x 0.85 x 1.5 = 1.0838.
The demtcd comact load is 1.0838 x 10 A = 10.84 A.
NOTE Ahhough tie relay is a 10 A rated mfay, tie dcmtcd contact load capability is
10.84 A when this unique low-use Wplication is considered.
A.23
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MIL-STD-975L (NASA)
3.11 RESISTOR DERATING CHARTS I Resistms I
I I
The demted power level of a resistor is obtined by multiplying (be resistor’s nominal power mting by
the appropriime power ratio found on ihe (y) w.is in Lhegraphs below and on the next page. Ilis ra[io
is also a function of (he resistor’s ambient temperature maximum (x axis).
The vollage applied to resistors must afso k controlled. The m=imum applied vollage should not
exceed 80’% of the specification maximum voltage rating or f_PR whichever is less. whe~
P = Demted fJOW~(WZWS).
R = Resismnce of lhat fmfiion of Lheelemen! amwdfy active in tie circuit.
This volmge deroting opplies 10 dc and regular wavefomn ac applications. For puke and other irregular
wavefom applicmions. consult MIL-HDBK-978 Vol. 1 3.1.6.2 (genemJ), 3.2.5.2 (NUL-R-39008), 3.2.5.3
(MIL-R-55182 and 39017) or consult the manufacturer.
METAL FILM FIXED WIRE WOUND
MIL-R-39017 MIL-R-39005
Type RIR TYm W
-0 20 +0 00 60 w mo 120 ,,0 *O. -0 m 40 *O 80 !00 no Uo ISO
Temperature (Cl T.mper.twe [C)
A.24
I
I
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MIL-STD-975L (NASA)
3.11 RESISTOR DERATING CHARTS
P.E.!d
POWER WIRE-WOUND
M1l--$3<~O7
0.7 ,,:; ;
*,30!;!; ~i~
.=_r-. _r_. .-4_ .--._.& ~,:.....-.......-._.&..__
;;; :
, .3 ..__ .. . . . . . . . .. ..... .... ......... ... .... ....
: :;!;; ::
: m. .--~-—--.; - -. :-. -.... .... ...... ... ...... ....... . . . . .. . ..
~:; ~j
I ; ,,;
:.,
,;:
i
,::
: .s ---—-.* ----*.-.-.{ -..-.+- . ......---------------
;:; j
0 u —-.—-.;—-;-. --.-y---T ........... . ..... ......
ii ;;. j
!: ;;:
. .. _-+ ... ......+. .+.-
I l!: :!! ; ,7
D :!
“raaco-w “e.o.ona
,S”,,w””e l-c,
POWER, FIXED WIRE-WOUND ( 1) RESISTOR NETWORK
M!!4:-3~:09 Mll#8&Ol
I
: -’t---T-------m-’--r-”-’--1
‘ d-----:r-’-”””-;”---l--’-wv-l
q-.:--.&-
;--””t-””’’”!-””-””’r<-::]
<i., mAnmE *“I
FIXED FILM CHIP
Ml L&l:55~42
I
I
I
I
I
(1) Chmis mounl
1 A.25
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MIL-STD-975L (NASA)
3.11.1 RESISTOR DERA1’fNG EXAMPLE
E
Power and ambient tempaamre are the principal smess parameters.
Example 1: A 0.5 W metal fifm resis!or, rype RNR70C l~lFM, is used in CMapplication where
the ambient lempemture is 13WC.
The derating than for RNR resistors on page A.24 indicates tfm at an ambient
temperature of 131YC, this resistor should be derated ro 0.5 of its rated power.
I llrereforti P = (0.5 x 0.5 W) = 0.25 watt
Cument must be fimiled 10 maintain lhe dented power at 0.25 W.
I !. Exmnple 2 A 0.1W metal Iifm resistor type RNC55H4753FP, is used in an ‘application where rhe
ambient temperature is 10@C.
The derming ch,art for RNC resistoa on page A.24 indicates that a! an ambient
temperature of 1(KPC, this resistor should be demted to 0.6 of its rated power. This
resistor hm a value of 475RQ wrd a specification maximum voltage riuing of 200
Volls.
Demled ~wer P = (0.6 x 0.1 W) = 0.06 W
At tbk power, tie appfied volrage EWV=(0.06 x 475,000)
= 16$.8 VOhS
But 80% of specification maximum volrage rating is 160 volts. So this resistor cannot
& used akwe a continuous power level of ~= 0.054 W,
475,000
or 0.54 of its mw.inrum rated puwer.
A.26
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MIL-STD-975L (NASA)
3.12 SWITCH DERATING CRITERIA
Presemly there are no approved switches for inclusion in MIL-STD-975L.
This sheet is intended for fumre use.
A.27
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MIL-STD-975L (NASA)
3.12.1 SWITCH DERATfNG EXAMPLE I Switches I
Presently them are no approved switches for inclusion in MHA71T3-975L.
‘fhk sheet is intended for future use.
A.28
I
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MIL-STD-975L (NASA)
3.13 TfIERMfSTOR DERATfNG CRfTERM (1)
k!!!zl
Positive Tempcrat.m Coefficient (FTC)
Positive Irrnpemlurc coefficient thrrmis!om arc gcnually opcrztrd in the self-brat mndc. Drralc 1050
prt’cznl of the ma! pwcr, or as rquircd by the detailed s~”.atiom
Negative Tunpctaturc Coc~cirnl (NTC)
Negative trmperaturc coefficient lhumislora opixalrd in lhc seff-hral mode shaf.1k dust.xl in
accorckmce with lhc figurr bclnw 10 prcvrnt lbennal mnaway. Such pals ahnuld be dualrd 10 a power
level msing a maximum imxrasc of 50 limes the rikipmicm czmsta~ or a maximum parl tempxahm
of 10Wc whichrwer is lraa.
DERATING CURVE FOR NEGATfVE COEmWfENT ~RS
x
1.00
D
i 80
Sc
so 60
in
ps 40
at
ta 20
in
Ot 0 ---- -- ---- - ---- ---- --- --
n 0 - ~-. ~.
25 7 1$!5 lbo 175 200
CaS~ Temper~ture l’fC)
(1) Applkd vofrage should .@ em?cd 30% of tie maximum raling.(EM#l.W?R)
A-29
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MUAHD-975L (NASA)
3.13.1 THERMISTOR DERATING EXAMPLE
Power and ambient temfx?mture are the principaf stress parameters.
Examplti Negmive Temperature Coefficient
A 0.15 Wan NTC tiermi.stor mted at 5000 ohms m 258C hm an openuing
rempemtum mnge of Am C 10 +20fYC and a dissipation constant of 0.8 mW~ C.
For power demdng multiply the dissipation constant by 50.
(50)(0.8 mW~C) = 40 mW
The thennismr should & fimited to a maximum power dissipation of 40 mW. The
gmph on page A.29 indicates thal at a vafue of 40. the Thermistor is limited in use 10
125°C max. This is above the maximum aflowable defied temperature of lLKI”C,aa
stated in the crir.wia, page A.29. so IO@C is used.
A.30
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MIL-STD-975L (NASA)
3.14 TRANSFORMER DERATING CRITERIA
H
Tsansformem we derated by limiting the maximum opcradng tempmture based on the insukuion class
used, md limiting Lherated opemdng voltage 10 50% of is maximum.
Demted Maximum Operating
Insulation Class Parameters
Dlelecuic WilhsLandmg
MfL-T-27 MU-T-21038 Tempcmfure Voltage
Q (85”C) Q (B5”C) + 65°C
R (105”C) R (105”C) + 85”C
50% of maximum
s (130ac) s (130°c) + I05°C
med opcmting voltage
v (15S”C) T (15S”C) + 130°c
T (170°C) u (170”C) + 155°C
d Maxiium opamting lempesntum equals ambient temperature plus Iempemture rise. plus llY C
(aflownnce for hot s@. Compute temperature rise. ns follows
Tempemtum rise test (per MIL-T-27, pm 4.8.12)
Tempcmmre sise ~ C) = _(R - ‘) (, + ‘Z34.50C ) - (T - 1)
r
Where R = winding resistance m elevated tcmpmmurc
r . no-load winding resistance at ambient tempcmlure f
t . initial ambient temperature (“C)
7’ = maximum ambient tempermum (“C) at time of power shutoff.
T shall not diffw fmm I by more than +5” C.
b) The insulation classes of ML-style inductive parts generidfy have maximum operating
tempcmture mtings based on a life expscumcy of m least 10,000 hours. The maximum
O~ting ~mw-s in WE table .ars selected to extend the life expectancy to 50,000 hours.
@ Custom-made inductive devices shall be evaluated on a matcrkds basis and sb’essed m levels
below the maximum mted operating tcmpnmre for the mnterizk used. Devices having a
mzximum mted operating tempmmm in the moge tlom +85” C to +13~C, sbafl be dented as
follows maximum opcsadng tempemture CC) cquafs 0.75 times mzximum rated opemting
temperature CC). For devices with maximum mcd tempemmrcs outside thii tempcmtw’e
range. consuh the project pasts engineer for tempemtum desming recommendations.
A.31
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MIL-STD-975L (NASA)
3.14. ITRANSFORMER DERATING EXAMPLE
1===’1
L 1
The parameters to be demted arc temperature and dielectric stress. Frequency and winding voltage are
not demted.
Example A I IO VAC / 24 VAC step-down tmnsformer is to operate in an ambient tcmpemmre
of 4WC.
Insulation is cla$s Q.
Winding resistance is 2.5 ohms wi[h no load (r), 2.95 ohms under load (R).
Ma?.imum ambient tempemturc T reached, when loaded. was 3W C.
Ambient temperature t for the tempcranm rise test was 25”C.
Cqkwkuing the temperature rise pcr MfL-T-27, pamgmph 4.8.1A
6T . (R - ‘) (, + Z34.5eC ) - (T - 1)
r
6T . (2.95 - 2.5) @O c + 234.5°C ) - (3@ C - 25°C )
2.5
6T = ~ (259.5° C ) - 5“ C
6T = 0.18 (259.5”C) - 5°C t = 25°C
6T = 46.7°C - 5“C
tIT = 41.7°C
The maximum operating tempemture for this application is41 .7°C + 40” C + 10”C =
91.7” C. Class Q insulation is not adequate since irs demmd maximum opmating
temperature is only 65” C. CliLSsS insukuion (105” C) must be used. The dielecrnc
withstanding voltage of the insulation must be mted at 220 VAC. (220 VAC x 50%
= 110 VAC).
A.32
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MIL-STD-975L (NASA)
3.15 TRANSISTOR DERATING CRfTERIA
1===1
Demdrrg of b’mrsi.worsis accomplished by multiplying the appropriwc sue.ss parameter by irs derating
factor. ~mrclion tempmmre must afse k calc~a~d and mh~rred below i25”C.
Critical Stress Demdrrg Maxiium Junction
Trnnsisrer Type Pmzurretcr Factor Tempemwm
BIPOLAR
I .. General pwpose, Power 0.50
I Swi[chhg, &nd Current I 0.75 I
\
(1) Werw-case combimuion of DC, AC, and Uansiem voltages should be no
greater dmrr the demred Iimi!.
I
(2) For power MOSFET devices, ef.w dcmte the gate to source voltage (Vm)to
60% of the maximum rated.
I
1.
A.33
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MIL-STD-975L (NASA)
3.15. ITRANSISTOR DERATING EXAMPLE
‘=
Junction temperature is the most destructive mess for transistors. Ilis pammeter along with power.
voltage, and current (safe op.%xing area) must be. demted.
Example A 2N6756 MOS power nansismr is dm-medas follows
MAXIMUM RATINGS DERATLNGS
Power 75 W (75 x 0.5) = 37.5 w
Currem, [D: 14 A (14 x 0.75) = 10.5 A
Voltage, Vm: lCKIV (1OO x 0.75) =75V
I
A.34
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MIL-STD-975L (NASA)
3.16 WIRE AND CABLE DERATING CRITERIA I Wire/Cable I
1 Deradng is accomplished by determining a single wire masimum cmmm frem a combination of wire
size and bundfe size m listed below. AdjusImems me made if Ibe insulation is other than Teflon*.
(see semmk 3 below)
I Simzle Wm I
Wire Size Ctim (lsw)
Remirrks
a
(AWG) (A)
I 30 1.3 1. Currem mtinr?s are bawd on wires at +70” C in a hard w!cmrm.
I
(lcr’10 10’ t&r).
28 1.8
26 2.5 2. When wires are bundfed, the maximum design cumem for each
I
individual wire shafl be demted according 10
24 3.3
FOR1<NSIS whew
22 4.5
I~w= I,w x (29-N)IZ8 N = number of wises
20 6.5
FOR N >15 I . current. bundled wire
18 9.2 IBW= (O.s)l,w l~w’l ursrem. single wire
a
%=RS13
12 25.0
Demdngs listed are for Teflon* insufated wire (TYPE TFE)
rated fer +20D”C
a. For lS@ C wire, use 80% of wdue shown in table.
10 33.0
b. For 135”C wire, use 70% of vafue shown in table.
8 44.0
6 60.0 c. For 105”C wire. use 50% of value shewn in table.
4 81.0 4, Dielecoic wiIhstnnding volcrge mting required: m least two
times tie highest application voltage.
2 108.0
0 147.0 5. Denting wdues fisted apply only to round single conducmrs on
heficaffy wound bundles. See project pans engineer for demting
00 169.0 information for ribbon cable and flat conductors.
* Reg. Tmdemark. E.I. DuPont Chemicaf Co.
A.35
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MIL-STD-975L (NASA)
3.16.1 WIRE AND CABLE DERATING EXAMPLE
m
Parameters 10 be demted are conductor current. insulmion dielectric withstanding voltage, and
temperature
Exnmplti A wising bundfe is made up of 5 conductors which will carry tie following currents 1 aI 1
MIIWI’CS.2 at 6 nMPCITS~d 2 aI 8 ~PCI~. me maximum ambient mmpe.rahm wio be 7WC. The
highest voltage will bc 100 V.
Solve for Ibe single wire cumcnt (l~w).The table on A.35 gives the wire size aflowed for use.
For a 704c ~tien[ tempc~ure, 2@3”c, 150”C or 135”C rated insulation may be UCWJ(see Remark ~,
3, page A.35).
Case 1: 200° C rated insulation:
1BW(M) = I,w X (29 - N)/28 where N . 5 and
8A = &w x 0.86 I,.(W) = 8 amperes
1Sw = 8 AID.86
ISW = 9.33 A
The table on page A.3S gives size 16 WiIEm Ibe smalfest size wire tbw should be used for 8
amperes of appficalion cm-tent.
I BW(6A, = I,w X (29 - N)/28 where N = 5 and
6A = I~wx 0.86 1,W<aj= 6 mnpcres
1Sw = 6 .AIO.86
ISw = 7.00 A
The tile on page A.3S gives sise 18 wire m the smaffcst size wire lIWIshould be used for 6
amperes of application current.
IBwoA, = I,w X (29 - N)/28 where N = 5 nnd
1A = l,W X 0.86 1~w(,~l= 1 mnpcrc
ISw = 1 A/D.86
1Sw =1.17A
The mble on page A.35 gives size 30 wire as tie smtdlc.msize wire lbat should be used for 1
mnpcre of application cm-rem.
A.36
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MIL-STD-975L(NASA)
Csse 2 wd Case 3: 150”C and 135”C rated insulations
The mble on page A.35 dctines I,w vafues for lhcse insulations as 80% snd 70’%,respectively,
of the I~wvalues shown for the 2LKPC mtcd insulation. To determine wire sizes rwuimd for
150’ C and 135°C rated insulation, divide the smswers found above ss folfows
tnsdadon Temperature Rating
Application
Current 200” c 150”C 135°C
Wire Size Wire Size Wire Size
(A) (!Z Required ;r) Required 2) Required
8 9.33 16 11.66 16 13.34 14
6 7.00 18 8.75 18 10.01 16
1 1.17 30 1.46 28 1.67 28
The minimum dielectric withsmnding voltage of the insulation must lxx ICO VD.5 . 2(!OV
Chow wire tha is mad for a minimum of 200 V dielectric withstandingvohage. The choice
of insulation may funher be defined by other makrial requirements such as weighl,
flammability or dumblhy.
A.37
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MIL-STD-975L(NASA)
THIS PAGE INTENTIONALLY LEIT BLANK
A.38
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MIL-STD-975L(NASA)
APPENDIX B
ADDITIONAL TESTING REQUIREMENTS
B.1
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MIL-STD-975L(NASA)
Additional TESTING REQUIREMENTS
1.0 SCOPE
Thii appcndu contains addiriomd testing requirements for parts to be used in the design mrd
construction of space hardware, as well as essential ground support cquipmem.
2.0 GENERAL
2.1 Introduction. To suppon the designs required by NASA Progrmms, this Standard Parts List includes
pans that require additional testing prior to USC. llercfom, rlre spcitbd additiorml tests must be fully complied
with in order w usc a pan for applicable gmde level, and part documentation shall rcfkxl the successful
completion of additional testing requirements.
2.2 Murking. Upon successful completion of additional tcsdng. each part shnfl be permanently and legibly
marked with a NU, except when the contractor udfizes a Part Contrul Prccedure to implemem these requirements
and specifies a unique mwking, so that the part may be idcmificd and controlled. The marking shall be legible
(with a wntmsdrrg color), nontoxic, mrd psmranent such that it meets the resiscmce-to-solvents requirements of
MIL-STD-883. Method 2015. In addition, lhe marking shall meet the following outgassing critcti a maximum
total mxss loss of 1.0 percent and a maximum of 0.10 percent volatile condensable matcriafs when tested in
accordance with American Society for Testing and Material (ASTM) Standard Test Method E595.
Alternate methods of pm marking shall be approved by the NASA Pmjccr Parts Engineer.
3.0 Additional TESTfNG REQUIREMENTS
.3.1 Additional Testing RequiremenL$ for Grade 1 Applications.
3.1.1 CapacitOm
3.1.1.1 Capacitors, Freed, Tantalum (Solid) Electrolytic, (CSR). Each pan shafi he subjected to a surge
cumcnt best of five charge/discharge surge current cycles of at least 1 second each per cycle al +25” C, -55” C.
and +85” C and masimum rated voltage. ] The surge current test circuit shall comply with the following
conditions
A. The puwer supply used fur chmging the capacitors shafl hc capable of supplying a mgulatcd
*t voltage, variable from O to 150 volrs, at a 15 amp minimum current cafrabiity.
B. The energy stomge bank shall be placed across the dc-Wwer supply. It shafl consist of pamllel
afuminum electrolytic capacitom having an aggregate capacitance of 100,000pF. -O, +30
percent, rated at 1S0 volts dc working or higher.
‘Dcfmition of surge current (inrush current) is the peak current, for a given duration. that Lfrecapacimr will
receive from the turn-on of a barrk of 100,OOOPF aluminum eleco’cdytic capacitors charged to the rated voltage
of a given capacitor under test with a moximum series msismnce of less than or equal to 0.3 ohm including the
mercury rcfay, fuse, and wire.
B.2
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MIL-STD-975L(NASA)
c. A 30-ampere. mercury day shafl bc used to switch the capacitor under test to Lheenergy bank
for charge and into a short circuit for discharge.
D. fie total resistance of all wiring bchwen the energy some and tie capacimra under Icst.
including the mcrcmy relays but excluding fuses, shafl ‘not exceed 0.1 ohm.
E. The fuacs irr the test circuit shaO have a mring of not less dmn 1 amp, nor more than 5 amps.
A fuse shall be pfaced in series with each ct@citor undergoing the surge current tesI. Each
I fuse shall have a maximum resistance of not mom than 0.2 ohm.
F. A capacitor undm test shaO bc considered a failure either when a fuse blows or the dc leakage
I current is excccdcd or bnth.
3.1.12 Capacitom, Fixed, Ceramic, (CDR). Parts shall meet Oredestructive physiti analysis criteria given in
Table X, Group A Inspection, of ML-C-123, and the humidity. steady soste, low voltage criteria given in Table
X1, Grnup B Inspection of ML-c-123. Samples subjccrcd m humidity, sttmdy-state. low voltage wsI shall not be
used.
32 Additional Testing Requimmen@ ror Gmrde 2 Application.
32.1 Resistor Networks. ‘fle requirements for screening resistnr networks (MIL-R-83401) for usc in Grade
2 npplicatinns we shown in Table 3.1.
TABLE 3.1. Additional Screening Requirements for Networks
(MIL-R.83401) Prior To Use in Grade 2 Applications
Scrccning pm MfL-STD-202 (100%)
I Semen I Method RequircmenLs 1
Thcnrraf shock 107 Test Condition B Paragraph 4.6.3 nf MIL-R-83401
Burn-in 108 MfL-R-83401 (150 hours)
ElecuicaJ MILR-83401 Shall bc witMn spec limits before
Group A and after screen
Marking
1 I
A nnique mwkirrg to signify cnmpfiance with these requirements: Scc Pam 2.2.
3.2.2 Crystal Oscillatnm. The requirements fnr screening the type 1 wstal oaciflrmm for usc in Grade 2
apphcations shall ~ as follows.
32.2.1 Particle Impact Noise Detection (FIND). Each part shall be subjected m the PfND test in accordance
wi~ MIL-STO-883, method 2020, test condition B. The tc.st shtdl be performed using five irrdependcm passes
and all failures found at the end of each pass mc rejected. The survivors of the fast PUS we considered
acceptable.
B.3
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MIL-STD-975L (NASA)
3.2.2.2 Radiogmphy. Each pans shafl be subjected 10 the mdiogmphic examination in accordance with
MfL-STD-883. methd 2012. two views 90 degrew apart.
3.2.2.3 Internal Water Vapor Content. Pans shafl be subjected to the intemaf water vapor test in accordance
with MIL-SII) -883, method 1018. .%unples of three devices with zero failures or five devices with one faifure
shaff be used for thii teSL
3.2.2.4 Marking. A unique mmking to signify compliance with these requirement. See pamgraph 2.2.
B.4
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MIL-STD-975L (NASA)
APPENDIX C
SPECIAL REQUIREMENTS FOR
CUSTOM ELECTROMAGNETIC DEVICES
c. 1
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MIL-STD-975L(NASA)
C.2
I
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MIL-STD-975L (NASA)
I
I
C.3
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MIL-STD-975L (NASA)
THIS PAGE INTENTIONALLY LEFT BLANK
C.4
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MIL-STD-975L (NASA)
APPENDIX D
JAN CLASS S STOCK PROGRAM
D. 1
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A41L-STD-975L (NASA)
JAN CLASS S =OCK PROGRAM
1.0 SCOPE.
This nppadix explains tbe procedures for obtaining JAN Class S mic~ircuits and semiconductors from the
JAN Class S Stock program with as little as a ten (10) day delivery time. Included are simple instructions on
obtaining a DoDMC, requisitioning parts from stcwk,knd pursuing emergency procurement wiibout a
DoDA.4C.
2.0 iNTRODUCTION.
This pmgmm was cstablisbed co stock JAN Class S (spare. quality) parts. It wa$ idiated in 1985 by NASA,
the Defense Logistics Agency (DLA), and the Space and Mksile Systems Center (SMUSDFP), specifically for
NASA, SMC/SDFP, appmvcd contractors ad their supporting cantmctors, and manufacture.rs of expendable
Iauncb vehicles.
2.1 Purpose. The pmgrmn allows JAN Class S parts to be obtained with reduced lead times and costs
@mpm’Cdto typical acquisition from manufactwws.
2.2 Advantages. l%e prugmm provides the following advantagcx
1) Reduced procurement lead time - as little as ten (10) days.
2) Avoidance of minimum-buy requirements imposed by the parts mmmfacmrem - buy
onky what is absolutely needed.
,
3) Rapid availability of spare parts for maintenance amd emergencies.
.
.. 4) Substantially reduced ovemIl procurement costs.
2.3 D&nitims.
1) MJ35TRJP/FEDSTRJP - Milifmy/Fti’eml Standard Rquisitiming and Issue
Procedure.
2) f30DMC - Department of Defense. Activity Address Code issued to contractors and
subcontractors as ~ access code to the JAN Class S stock.
3) LOA - bttcr of Authorization written by the NASA mntmct officer to the
ccmtmctorkdcontmctor, authorizing the contmctorhbccmtmctor to buy parts fmm
the JAN Class S stock.
D.2
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MIL-STD-975L (NASA)
3.0 OBTAINING ACCESS TO THE PROGRAM.
To buy fmm tbe JAN Class S Stock, you must have a DoDAAC and a LOA. These can be. obtained through
the NASA contract officer for the prime contract. It generally takes three (3) months to obtain a DoDAAC, but
if time is critical, tbcn the process can be expedkuk by the NASA mntmct officer stating 00 the request for a
DoDAAC that tbe t-quest be expedited.
4.0 EMERGENCY PROCUREMENT WITHOUT A DoDAAC.
Under the following conditions, parts may be obtained without a DoDAAC:
1) A small amount of parts are ncedd.
2) Failure to -t delivery dates will involve a substantial cost increase to the
Government.
3) processes must be initiated to obtain the normally required DoDAAC.
Cdl tbeNASA JAN S Support Desk for more information. (See Famgraph 8.0.)
5.0 PROCEDURES FOR REQUfSITIONfNG.
Once. a DoDAAC is obtained, orders for the JAN Class S Stock should be through C!olene L-edbetter,
AF-SMUSDFP, (310) 363-24X2. To place an order, tbe following information is required on a MILTITUP
Form DD 1348:
1) DoDAAC.
2) National Stock Number (NSN).
I
3) Quantity.
4) Bdliog Address.
!
5) Shipping Address.
6.0 USING THE JAN CLASS S ~OCK BULLETIN BOARD.
Tle Space and MissiJe Systems Center, Cmnpmmnt Engineering Group provides an electronic bulletin bout+ for
tbcJAN S Stock program. This system MS the current availabtity and prim of stocked parts. It displays the
NSNS, MMsry specification part numbm, generic part numbers, devim descriptions, prices, number of parts
in Destructive Physical Analysis testing, and number of Pam in stink.
D.3
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MU-STD-975L (NASA)
6.1 ACCESS. To com.xt to the bulletin bnard, use a mcdem to dial 310-363-1914/1915 (if you have
AUTOVON access, dkl 833-1914/1915) with the following modem settings:
Terminal emulntion: VT220
Saud rate 2400 (or 12CO)
Data bits 8
Parity: none
Stop bits: 1
once comcxted, you will see the word “CONNEC7”. press < return> twice, wait two sccon& and press
.< rc.Nm > twice more.. You will ~ “ENTER USERNAME >”. Enter anything here and press < return>.
At the ‘LOCU” prompt, type “C SD” or “C SPACE” and pm.w <return>. Wait wo seconds and press
< return> ngain. You will be prompted for the 0SS “USERNAME” and n first “PASSWORIl”. Entec
USERNAME OSSUSER
PASSWORD
Next you will see the Authorization Form smeen and ngain be pmmptcd by “USERNAME” and a second
“PASSWORD: “. Eotec
USERNAME OSSUSER
PASSWORD LAFREE
You will then be at the JAN Class S Stnck main menu. To obtain a ‘listing of available parts, cbocmc the first
cboicc on each nf the first tbmc screens (“Status Report-), then you can make your desired choices. It is
suggcstti to down-load the list to a tile and then print the file using your Id word processor, mtber tb~ h
print dhectly to the printer.
If YOUhave prnblems accessing the bulletin board, call Colcne Lcdbetter at (310) 363-24SQ or Dave Davis at
I (310) 363-2406 of the SMC/SDFP.
~ 7.0 PARTS DATA ACQIJMTION PROCEDURES.
Destructive Physical Analysis (DPA) is performed by DESC cm each lot. copies of the DPA repts and
~]ty ~nfO~= in.sp=tion (QCI) data can be obtained free of charge on request fmm the NASA JAN S
Support Desk. (See paragraph 8.0.) screening data should be obtained from the manufacturer.
8.0 NASA JAN S SUPPORT DESK,
Cantact the following office for all questions regardiig the JAN Class S Stnck program
NASA Parts project Office
Pmramax Systems, UNISYS C4wpcnation
4700 B.xton Way
Ham, Mazyland 20706
Poe: JAN S suppc!li Desk
Phone (301) 731-g918or731-8692
FAX: (301) 731-86433
D.4
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1’ MIL-STD-975L(NASA)
9.0 JAN CLASS S SI’OCK PROGRAM FLOW.
The flowclvw on the following page demonstrates the pm of obtaining a DoDAAC and J-OA, ordering parts
from DESC, and checking the status of orders. The next pages are form letters that the NASA contract officer
sends to the DoDAAC coordinator of their NASA center to process requests for DoDAACs. These letters
should be sufficient for the mntmct officer to simply add the appropriate information (eg., DoDAAC,
contractor, contract number, contract dates).
I ‘fle first letter is the Determination and Findings (D & F), which explains that it is in the best interest of the
Government to allow the contractor to acquire parts Iimm the JAN Class S Stock Pr%gmm. ‘J%cse+and letter is
used to extend the authority of a f30DAAC to include the acquisition of JAN Class S parts from this Program.
l%. thiml letter is tbc LGA written to the contmctor/subcontmctor that needs to be. sent to the DoDAAC
coordinator along with the D & F letter snd the fourth letter. ‘J%efourth letter is the request for a DoDAAC,
which is to be wmt to the NASA center’s DoDAAC cam’diiatar (see below). ‘k fifth letter is to help prime
contractors and subwnt@om assist their subcontractor in obtaining a DoDAAC. AU subcontractors must
have the NASA prime mntractor request the NASA contmct officer to submit Form Letter 4 with the enclosures
to the appmpiiate DoDAAC coordinator.
The following is a list of tbe DoDAAC coordinators for each NASA center.
NA SA Center DoDMC Cmordiiator b Cndemf ail stop
r &nm Research Center Pd Pimula (415) 604-5206 AEL 255-3
: —.–- Fkbt
“Goddard Since Center Glem Harris i301) 286-3385 235.3
Hmdquartm Gloria Taliafemo @2j 35w306 JIE
Jet Propulsion bb Frank Maliiowski (g18) 3544970 MLs: 1s0s01
Jobnsmn Space Center Gloria Cmwston (713) 483-6694 JF-5
Kemedy Space tinter MAc Murray (407) g67-3493 SI-SAT-1
Iagley R-b Center susaIl C4mpbell (804) W4-3572 3go
HIS Research Center CbarIe.s Noc (216) 433-3079 WS: 21-9
Marshall Space Flight Center Pegi Dunnigan (205) 544-5658 CN44
Stmnis Space Center Don Griffetb (601) 68g-2144 GA20
D.5
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MILSTD-975L (NASA)
JAN Class S Stock Program Flow
i
First tier subcontractor sends Prime contractor wa.ls
request to prim contractor t. buy parts frcm tha
(Form Letter 5) JAN Cl as> S Stock
~’
+
WSA contract .rflcer sends
request for hct 1.ity Address
Cod., CForm Letter 4) with
● nclosures:
Determlnatlon and Findings
(Form Letter 1)
Letter or Aulhorlz.tlon
(Form Letter 3)
to the NASA Center-s O.DAAC
coordinator (see Page 0.5)
[r
Norrn.1 1Y about 3 nIonitI$
(About 3 weeks if process
1, ,Xc.edited In every
NASk contr.ct Qrrlcer recetves
D.aDAACrrm! 00DAAC coocdin. tor
I
I
L-]
AuthOrt Z.tt Cm 10 th.
c.”traclOr/subcontractor
-*
t
I 1
-1 Receive C1.ss S Parts
I
D.6
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MXL-STD-975L (NASA)
FORM LEJ’TER 1
Smmm. Detennhtkn
wnd Fmdmgs Suppott”mg Issuance of Autborimtion to Use Government Supply
Sources (JAN CltISS S Stock program)
l%is Octerminiaton and Findings is to provide authorization under NASA contract number
for the ccmtmctorkubcontrnctor .l%is isa
.xmt-reimbursement contract. ‘he following is in accordance with tbe FAR 51.102, and supports issuarxx of
autborimtioo to requisition and use the JAN Claw S Stock Pmgrtun maintained by ~e DLA, DESC.
FfNDINGS
Administrative costs of placing orders with the JAN Clsss S Stock program m-ccnmpatable to those casts the
contractorktbcattmctor would incur when ordering direct from a manufacturer or distributor. AU ordcm must
have prior approval by the NASA contract officer.
‘JIIc following factnm were found to support authorization:
a. Lnwer 0s1 of Items Available Tbrougb Government Supply Source. lle incrca.ud use of the standard
parts available in the JAN Class S Stock Progmm would save money by reducing the need for expensive
nonstandard parts and their associated engin=tig cost. Actual costs of items available from the Government
SUPPIY SOUI’IX will bC compm=ble to costs of similar items available from iodustry; however, mbstantial cost
savings will be rwdii since contractor will be able to order smaller quantities hum tbe Government supply
source, thus avoiding minimum buy requirements impowd by part manufacture.
b. Suitabii@ of Items Available TIMougb Government Supply Smnce. lhe Department of the Air Force,
Space Systems Divisicm commander’s Policy, SDR 540-12, requires the use of JAN Class S parts cm all USAF
space systems. The NASA Associate Administrator for Safety, Reliabfity, MaintainaMity, and Quality
ASSurance (SRM&QA), encourages the use of JAN Class S parts on all NASA space systems and requires their
use on certain systems. JAN Class S parts arc military standard high reliability electronic parts. hey am
bought to fully utilize military specifications, built on government audited and certified production lines, and
qualified for listing on the military qualified products list (QPL). JAN Cl-s S parts inc- reliability and
reduce life cycle c0st9 through stan~lzition.
c. Delivery Factors Such as Cm.t and lime. Procurement lead time for contractor acquisition of the P
will be reduced by appmxixnatcly one yew the parts will have already undergone the required stringent testing
and will be delivered 8 to 31 days after the requisition date. Parts analysis reports arc available free of charge
upon request. Contact the NASA JAN S Support Desk (301-731-8918).
d. RccamncnMIom of Contractors. ‘f%eJAN Clnss S Stock program was initiatd at a Senior Executive
Forum hosted by the Commander of United Stntw Air Force Space Systems Division. Industry executives
specifically requested that n program such as this be implemented m soon m possible. By agreement between
the DIA and NASA, this stnck is also made available to autborizd NASA and NASA mntractor activities.
D~A’llON
Bad on UK foregoing, 1 hereby determine that it is in tbe best interest of the Governmen t, consistent with
NASA’s policy as set fcwtb in NASA FAR Supplement 18-51.102, to authorize the contractor/6uhcontmctor
to obti and w the JAN Class S Stock program under
government contmct number
For timber information contact
(Contract Officer)
D.7
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M2L-STD-975L(NASA)
FORM WITEfl 2
I have previously determined, in accordance with the Federal Acquisition Regulation (FAR) 51.102, that it is in
the Government’s best interest to authorize [w”tmctor/m&o”tmctor) to obtain materiafs required in the
Pcrforman= of the subject contract from government murces.
@mtmctOr’slSubwntw. ctOr’s) authorization under Activity Address Code is hereby extended
to include the acquisition of JAN Class S r.arts in Federal Stock Code ff3Cl 5961 (semiconductors> ., and
—.. FSC
.—
5962 (microcimu~ts) from the Defense l-m~stics Agency (13M), Def= E~ectm~~ Supply Center (DESC).
JAN Class S parts m used in this authorization arc space-qti]ty military standard electronic parts - described
by MILS-19500 for semicnnductom and MfL-M-31f510 for microcircuits, and a.mxiatcd specifications for
passive electronic parts.
AN orders must have prior approval by the contract officer. Orders for JAN Class S parts shall be placed in
accomlance with the requisitioning procedures specified by the acquisition activi~. For information concerning
pr.audurcs, mntact the Defense Imgistics Agency, Defense Electronics Supply Center, DESC-OMA,
1507 Wbington Pike, Dayton, OH 45444-5CK)0,phone (513) 296-6005. For information concerning parts
(stock availability), contact the Space and Mksile Systems Center, Component Engineering Gm.p
(SMC/SDFF), P.O. Box 92960, Los Angeles AFB, CA 90009-2960, phone (310) 363-2492. Bills from DE.sC
shall be paid promptly upon receipt of biffings. WI payments shall be addressed to the Defense Electronics
Supply Center, 1507 W&mington Pike, Dayton, OH 45444-5~.
JP$4 Claw s parts procured pursuant to the authorization SW be used solely in performance of Cam-act No.
This authority hereby granted is not transferable or assignable.
Chntract Officer/In5taJlati0n
D.8
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MLL-STD-975L(NASA)
FORM LETl%R 3
SUBJE~ AutAori?ation to purchase From Government Supply Source
You am hereby authorized tn utilize Government sources in performing under NASA cnntract number’
fmm (start datel tblvugb (end date)
in suppoli of ~ s 89 follows
a. Definition: “JAN Class S parts- m used in this authorization arc spacequality military s~dard
electronic parts u describd by MIL-S-195W for semiconductors and MLM-38510 for microcircuits.
b. fContractOr/SubccmtmctOr)
is nutlarized to aquim IAN Clm” S parts in Federal Stnck Code FSC-5961 (semiconductors) md FSC-5962
(microcircuits) fmm the Defense Electronics Supply Center @lZ.SC). JAN Class S parts prnc.rcd pursuant to
this autborimtion shall be used solely in performance of the contract identified above.
AO ordem must be PIA in accordance with the following prncedurcx
a. Ctrdem will be plnccd in accordance with the Federal Stamdnrd Requisitioning and Issue Procedure.s
(FEDSflUPYMliw Stidd Requisitioning and Issue Prnced.res (MLSTJUP) and this authorization.
FEDSTRIP parallels tie MU-STRIP of the Department of Defense. Orders shall include the assigned Activily
Address Code (AAC). For information concerning pmwedures contact Defense Logistics Agency, Defense
Electronics Supply Cder, DESC-OMA, 1507 Whdngton Pike, Dayton, OH 45444-5000, phone (513) 296-
6005. For information mnceming parts’ data, contact the NASA JAN S Support Desk, 4700 Boston Way,
Ianbam, MD 20706, phone (301) 731-8918.
b. BI1lswill not be issued by the Government supply soume until after the supplies have been ship@
payment sb@l be made prnmptly upon receipt of bdliigs. payment shall be addressed to
The Def~ Elcctmnics Supply center
1507 W1bningtOn Pike
Daytnn, OH 45444-XXY3
I
I
l%is authnrity bercby granted is not transferable or assignable.
Use of the Federal Standard Requisitioning and Issue Promlurcs (FEDSJIUP) system is mandatory for all
civilian agencies and their authorid contractors. An Activity Address Code (AAC) is required to obtain
6uPPfim ad equipment hugb the FEDSJTUP system fmm GSA and DoD sources. A,%O arc assigned
through this office and NASA Headquarters by the General services Administration (GSA) Central Office. This
authorization is provided for in FPRM 101-26.2, snd DoD Activity Addres Code, and the NASA Materials
hlVUltOW Handbook (?4HB 4100. lB Draft).
This authorization expires upon termination or completion of the contract specified in the first paragmph above.
Contract Officer
D.9
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MIL-STD-975L (NASA)
FORM LITER 4
To: NASA Hcadquartem
NH3LSupplySystems Analyst
‘TnRU: In.XnW3tion AAC COOrdii$or
FROM: (NASA Cantract Officer)
SUJ3JJZI) Request for FEDSTRIP/MHSTRJ P Activity Address Code for
(ContractOrlSubcOntmctOr) under contract number
1,have determined in accordance with tbe Federal Acquisition Regulation (FAR) 51.102, tbnt it is in tbe
Government’s best interest to authorize the contractor to obtain applies required in tbe performance of the
subject contract from a government source under .wntmct number
llm wntractor’s autbori?ation includes use of tbe Federal Standard Requisitioning and Issue procedures
@EDSTRJP)/blilitmy Stamdard Requisitioning and Issue Procedures (MUSflUP) tn requisition JAN Class S
parts in Federal S@k code (FSC) 5961 (semiconductors) and FSC 5962 (micmcimuits) from the Defem
fmgistics Agency (DLA), Dcfe& Electronics Supply Center (DESC). llercfore, please obtain a
FEDSTRJP/MILSTRfP Activity Address Code tium the General services Administration for tbe subject
contractor.
‘l’be Determination and Fmdmgs (D & FJ and the “mtcndcdLetter of Authm’htion (J-CIA)to tbe contractor am
enclosed. lle duration of this authorization is from (start date) through (end date)
The contractor’s mmplete name and address to wbicb mail, frcigbt, and btlling documents am to be dkected am
8.9 follows.
MAUJ
FRETGH’R
BILUNG:
Please contact me at (contract Officer Information) , if tlnber information is
needed rcgardiig this request.
cam-act officer
2 Enclosures
1. Determination and Findings
2. Letter of Authorization
I L
I D.10
I
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MIIAWD-975L (NASA)
FORM LE’lTER 5
‘1-o (NASA Contract Officer)
FROM: (Prime Contractor)
SUBJECTRequest to obtain an Activity Address Code for our subcontractor
under NASA contract number
@rime Contractor) certific9 that (Subcontractor) is a subccmtmctor under the NASA contract
(Contract Name) with NASA contract numkm In order for (Subcnntmctor]
@ PcfiO~ tbe n~ @ks to complete this pmgmm 1 request that you submit the attached letter
with its enclosures to the Activity Address Code Coordiitor for s
(NAAltl stallation)
Plea-w contact me if further information is needed regardiig thi9 request.
@ime Contract Administmtor)
Attachment Request for Activity Address C$de
Octcrmination and Findings
Letter of Autbmimtioo
D.11
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MIL-STD-975L (NASA)
CONCLUDINGMATERIAL
Custodian: Preparing Activity:
NASA-NA NASA-NA
Project 59GP-K122
D.12
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STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
JNSTR UCTfONS
. The preparing actNii must complete blocks 1, 2,3, and 8 in block 1, both the document number and revision
letter should be gtien.
!.The submitter of this form must complete blocks 4, 5, 6, and 7.
The preparing activity must provide a repty within 30 days from receipt of the form.
IOTE: Thk form may not be used to request copies of documents, nor to request watiera, or clarification of
zquirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waNe
fly Portion of the referenced document(s) or to amend contracfuat requirements.
1. DOCUMENT NUMBER 2. DOCUMENT DATE IWMMDD]
RECOMMEND A CHANGE” MIL5KI-975 L m1210
DOCUMENT TITLE
NASA standard Etectricaf, EtSCtEUIliC, and EfacWmdWM “cat (EEE) Perta List
NATURE OF CHANOE (identify p.r.~raPh n.mb.rand incl.d. ProPosed r.writ., ilP.=ibl.. A-ch.xtr. ah.ets . . . ..).d.)
,,
REAeON FOR$lECOMtAENDATlON
aUBMITTER
,,.,,.Y ,.
NAME (ha!. Firs!. Mlddlol nitill b, oUOANIZATION ,.. .,
,,,:W ‘r ,t
ADDRESS( include Zip C.de) d. TELEPHONE (id.deAreaC. d.) 7. OATESUBMllTED
(1] Comm.t.ial (YYMMDD) .“
,,, ,,, .,,. ,.
,,, ,,, ,“, :,,:
; ,(2) AUTOVOU
(1 r+pl=) ,: ,,!
PREPARINO ACTIVITY
b. TELEPHONE (include Area Code)
‘AME NASA Parte Project Office (2) A~OVON
“$y%l&iLIO
:. ADDREe!3 (Incl.da ZiP Cod.) ~g~ @ OA) IF YOU DO NOT RECEIVE A REPLY WITHIN 45 OAYS, CONTACR
0.1. . .. Quality and “Stmdardlzati.n Office
NASA Parts Project office 5Z03 LeesburQ Pike, Suits 1403, F.lls Church, VA 22041.3486
Goddard Spsce Ffigfrt Center T.lePhom (703) 756-Z340 AUTOVON 289.2340
Greanbeft, MD 20771
--m- -
)D Form ~426, OCT 89
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