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Kingston 8GB DDR3-1600 Memory Module

This document provides specifications for an 8GB DDR3-1600 memory module from Kingston. The key specifications include a CL latency of 10, minimum refresh to active/refresh time of 260ns, maximum operating power of 2.460W, and operating temperature range of 0°C to 85°C. The module has 8GB of memory across sixteen 512M x 8-bit components running at 1.5V with a data rate of 1333Mb/sec/pin.

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Andrei Neagu
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322 views2 pages

Kingston 8GB DDR3-1600 Memory Module

This document provides specifications for an 8GB DDR3-1600 memory module from Kingston. The key specifications include a CL latency of 10, minimum refresh to active/refresh time of 260ns, maximum operating power of 2.460W, and operating temperature range of 0°C to 85°C. The module has 8GB of memory across sixteen 512M x 8-bit components running at 1.5V with a data rate of 1333Mb/sec/pin.

Uploaded by

Andrei Neagu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Memory Module Specifications

KHX1600C10D3B1/8G
8GB 2Rx8 1G x 64-Bit DDR3-1600
CL10 240-Pin DIMM

SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.460 W*
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.

DESCRIPTION FEATURES
This document describes Kingston's 1G x 64-bit (8GB) • JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
DDR3-1600 CL10 SDRAM (Synchronous DRAM), 2Rx8 memory
• VDDQ = 1.5V (1.425V ~ 1.575V)
module, based on sixteen 512M x 8-bit FBGA components. This
module has been tested to run at DDR3-1600 at a low latency • 667MHz fCK for 1333Mb/sec/pin

timing of 10-10-10 at [Link] SPD is programmed to JEDEC • 8 independent internal bank


standard latency DDR3-1333 timing of 9-9-9 at 1.5V. This 240- • Programmable CAS Latency: 9, 8, 7, 6
pin DIMM uses gold contact fingers. The JEDEC electrical and • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
mechanical specifications are as follows:
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component

Continued >>

Document No. 4806365-001.C00 06/14/12 Page 1


continued HyperX

MODULE DIMENSIONS

T E C H N O L O G Y

Units: millimeters 133.35


30.00

18.80
15.80
11.00
8.00

0.00
0.00

54.70

MODULE WITH HEAT SPREADER

FOR MORE INFORMATION, GO TO [Link]

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

Document No. 4806365-001.C00 Page 2

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