GaAs MMIC Double Balanced Mixer MM1-0222HSM
1. Device Overview
1.1 General Description
The MM1-0222HSM is a GaAs MMIC double balanced mixer
that features excellent conversion loss, superior isolations and
spurious performance across a broad bandwidth. QFN
MM1-0222HSM works well as both an up and down converter
through Ku band and beyond. The MM1-0222HSM is recommend
for moderate power applications that demand high linearity. If a
lower LO drive is required, the MM1-0222LSM offers similar
specs in the same surface mount package. The MM1-0222HSM
is available in a 3x3 mm QFN package. Evaluation boards are also
available. For a list of recommended LO driver amps for all mixers
and IQ mixers, see here.
1.2 Features 1.3 Applications
Parameter Typical ▪ Test and measurement equipment
RF/LO response 2GHz - 22GHz ▪ SATCOM
IF response DC – 3.5 GHz ▪ Radar
Conversion Loss 7.5 dB ▪ Electronic Warfare
LO to RF Isolation 50dB
1.4 Functional Block Diagram
1.5 Part Ordering Options1
Part Product Export
Description Package Green Status
Number Lifecycle Classification
MM1-0222HSM-2 3x3 mm QFN SM Active EAR99
RoHS
Connectorized
EVAL-MM1-0222H Eval Active EAR99
Evaluation Fixture
1
Refer to our website for a list of definitions for terminology presented in this table.
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3.6 Typical Performance Plots ............... 6
Table of Contents
3.6.1 Typical Performance Plots: IP3 .. 8
3.6.2 Typical Performance Plots: LO
1. Device Overview ............................... 1
Harmonic Isolation............................. 9
1.1 General Description ........................ 1
3.6.3 Typical Spurious Performance:
1.2 Features ....................................... 1 Down-Conversion ............................ 10
1.3 Applications ................................... 1 3.6.4 Typical Spurious Performance: Up-
1.4 Functional Block Diagram ................ 1 Conversion ..................................... 10
1.5 Part Ordering Options ..................... 1 4. Operation ....................................... 11
2. Port Configurations and Functions ...... 3 4.1 Application Circuit ........................ 11
2.1 Port Diagram ................................. 3 4.2 Ports Operation ........................... 11
2.2 Port Functions ............................... 3 5. Mechanical Data ............................. 12
3. Specifications ................................... 4 5.1 SM Package Outline Drawing ......... 12
3.1 Absolute Maximum Ratings .............. 4 5.2 SM Package Footprint .................. 12
3.2 Package Information ....................... 4 5.3 Evaluation Board Outline Drawing ... 13
3.3 Recommended Operating Conditions . 4
3.4 Sequencing Requirements ............... 4
3.5 Electrical Specifications .................. 5
Revision History
Revision Code Revision Date Comment
- September 2019 Datasheet Initial Release
Max DC current added
A January 2020
Updated landing pattern
B March 2020 Power Handling Updated
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2. Port Configurations and Functions
2.1 Port Diagram
A bottom-up view of the MM1-0222HSM’s SM package outline drawing is shown below.
The MM1-0222HSM has the input and output ports given in Port Functions. The MM1-
0222HSM can be used in either an up or down conversion. For configuration A, input the
LO into pin 3, use pin 10 for the RF, and port 6 for the IF. For configuration B, input the
LO into pin 10, use pin 3 for the RF, and pin 6 for the IF.
2.2 Port Functions
Equivalent Circuit
Port Function Description
for Package
LO
Pin 3 is DC short and AC matched to
(Configuration A)
Pin 3 50 Ohms from 2 to 22 GHz. Blocking
RF
capacitor is optional.
(Configuration B)
Pin 6 is DC coupled to the diodes.
Pin 6 IF
Blocking capacitor is optional.
RF
Pin 10 is DC short and AC matched to
(Configuration A)
Pin 10 50 Ohms from 2 to 22 GHz. Blocking
LO
capacitor is optional.
(Configuration B)
SM package ground path is provided
GND Ground
through the ground paddle.
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3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the
device. If these limits are exceeded, the device may be inoperable or have a reduced
lifetime.
Parameter Maximum Rating Units
Pin 3 DC Current 30 mA
Pin 6 DC Current 30 mA
Pin 10 DC Current 30 mA
Power Handling, at any Port +30 dBm
Operating Temperature -55 to +100 °C
Storage Temperature -65 to +125 ºC
3.2 Package Information
Parameter Details Rating
ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 1A
Weight EVAL package 11g
3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should
be operated, to guarantee the performance given in Electrical Specifications Operating
outside these limits may not necessarily cause damage to the device, but the
performance may degrade outside the limits of the electrical specifications. For limits,
above which damage may occur, see Absolute Maximum Ratings.
Min Nominal Max Units
TA, Ambient Temperature -55 +25 +100 °C
LO Input Power +12 +20 dBm
3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it is
recommended to provide a 50Ω termination to each port before applying power. This is a
passive diode mixer that requires no DC bias.
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3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is
for a down conversion application with a +15dBm sine wave LO input. Specifications
shown for configuration A (B).
Parameter Test Conditions Min Typical Max Units
RF (Pin 10) Frequency Range 2 22
LO (Pin 3) Frequency Range 2 22 GHz
I (Pin 6) Frequency Range 0 3.5
RF/LO = 2 - 22 GHz 7.5 11.5
Conversion Loss (CL)2 dB
I = DC - 0.2 GHz (9) (12)
RF/LO = 2 - 22 GHz
Noise Figure (NF)3 7.5 dB
I = DC - 0.2 GHz
LO to RF RF/LO = 2 - 22 GHz 50
Isolation LO to IF IF/LO = 2 - 22 GHz 27 dB
RF to IF RF/IF = 2 - 22 GHz 30
RF/LO = 2 - 22 GHz +20
Input IP3 (IIP3) dBm
I = DC - 0.2 GHz (+23)
Input 1 dB Gain Compression Point +9
dBm
(P1dB) (+11)
2
Measured as a down converter to a fixed 91MHz IF.
3
Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater
than 5 MHz.
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3.6 Typical Performance Plots
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3.6.1 Typical Performance Plots: IP3
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3.6.2 Typical Performance Plots: LO Harmonic Isolation
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3.6.3 Typical Spurious Performance: Down-Conversion
Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the
RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full
spurious band and the mean is calculated. The numbers shown in the table below are for a -10
dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is
the RF spur order. For example, the 2RF x 2LO spur is 69 dBc for a -10 dBm input, so a -20
dBm RF input creates a spur that is (2-1) x (-10 dB) lower, or 79 dBc. Data is shown for the
frequency plan in 3.6 Typical Performance. mLOx0RF plots can be found in section 3.6.2 Typical
Performance Plots: LO Harmonic Isolation. 0LOx1RF plot is identical to the plot of LO-RF
isolation.
Typical Down-conversion spurious suppression (dBc): Config A (B)
-10 dBm
0xLO 1xLO 2xLO 3xLO 4xLO 5xLO
RF Input
1xRF 20 (16) Reference 29 (34) 13 (12) 38 (39) 24 (16)
2xRF 66 (74) 51 (50) 69 (79) 59 (57) 70 (74) 59 (54)
3xRF 80 (94) 71 (81) 86 (105) 79 (90) 89 (101) 77 (86)
4xRF 121 (134) 119 (123) 122 (132) 177 (122) 126 (132) 119 (122)
5xRF 137 (149) 132 (143) 135 (150) 130 (144) 138 (150) 130 (146)
3.6.4 Typical Spurious Performance: Up-Conversion
Typical spurious data is taken by mixing an input within the IF band, with LO frequencies
(± m*LO ± n*IF), to create a spurious output within the RF output band. The mixer is swept
across the full spurious output band and the mean is calculated. The numbers shown in the table
below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels
by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 69 dBc for a -
10 dBm input with a sine-wave LO, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB)
lower, or 79 dBc. Data is shown for the frequency plan in 3.6 Typical Performance.
Typical Up-conversion spurious suppression (dBc): Config A (B)
-10 dBm
0xLO 1xLO 2xLO 3xLO 4xLO 5xLO
IF Input
1xIF 27 (18) Reference 49 (56) 47 (50) 57 (59) 63 (62)
2xIF 57 (62) 69 (70) 59 (51) 63 (71) 48 (45) 66 (68)
3xIF 120 (96) 76 (78) 86 (94) 68 (73) 84 (89) 69 (71)
4xIF 130 (128) 123 (128) 115 (111) 118 (126) 104 (103) 114 (119)
5xIF 151 (156) 126 (129) 135 (147) 115 (124) 126 (139) 108 (118)
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4. Operation
4.1 Application Circuit
4.2 Ports Operation
IF Port – Used as input on an upconversion, output on downconversion, or LO port in a band shifting
application. Signals should be connected by 50 ohm microstrip or coplanar traces to well matched broadband
50 ohm sources and loads. Blocking capacitor is recommended if DC voltage is present on the line.
RF Port – Used as input on a downconversion, output on upconversion, or output in a band shifting
application. Signals should be connected by 50 ohm microstrip or coplanar traces to well matched broadband
50 ohm sources and loads.
Filtering and Matching- Filtering is generally desired for spurious and image removal on the output port of the
mixer. Reflective filters can cause out of band signals to reflect back into the mixer and cause conversion loss
ripple, erroneous spurs, and other undesired behaviors. To eliminate these problems it is recommend that the
filters be placed as close to the output port as possible. If undesired behavior is still observed, a diplexer with
one port terminated or a 1-3 dB attenuator may reduce this problem.
RF Ground – The ground paddle of the QFN should be connected to a low noise RF ground with very low
electrical resistance for high frequency operation.
LO Port – The noise floor of the LO input signal should be less than the value of the noise floor plus isolation
of the mixer, or a filter is recommended to prevent reduction in dynamic range. An LO amplifier is required if
the LO power is below the recommended drive level. It is important to use an amplifier with a broadband 50
ohm match such that it does not reflect spurious signals back into the mixer or other system circuitry.
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5. Mechanical Data
5.1 SM Package Outline Drawing
1. Substrate material is LCP.
2. I/O Leads and Ground Paddle plating is (from base to finish):
Ni: 0.5um MIN
Pd: 0.02um MIN
Au 0.05um MAX
3. All unconnected pads should be connected to PCB RF ground.
5.2 SM Package Footprint
QFN-Package Surface-Mount Landing Pattern
Click here for a DXF of the above layout.
Click here for leaded solder reflow. Click here for lead-free solder reflow.
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5.3 Evaluation Board Outline Drawing
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.
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