AN OVERVIEW OF ENIG PROCESS 2023-24

CHAPTER 1
ABOUT COMPANY

1.1 AT&S Introduction and History

Since AT&S was founded in 1987, we have grown to become a leading supplier of high-end
PCBs and IC substrates. Our technologies appear in every area of modern life – from mobile
phones and computers to vehicles, industrial robotics, medical devices, aeroplanes and satellites.
In addition, we make a crucial contribution to efficiency gains and energy savings.
The quality and speed of services make AT&S one of the leading suppliers in our industry. They
develop solutions that set benchmarks in terms of miniaturization and modularization, power and
efficiency, safety and sustainability. Achieving this means keeping their ear to the ground and
identifying market challenges and trends at an early stage. The printed circuit boards and
substrates not only ensure rapid data processing, but also make a real contribution to keeping
energy consumption as low as possible through further miniaturization. By making the utmost
demands of ourselves and our suppliers in terms of environmental responsibility, AT&S always
ensures that our technological advances do not come at the expense of the environment. We take
a holistic approach to the world of tomorrow. See our comprehensive concept for sustainable
production, which is constantly being expanded to include more environmentally friendly
materials and energy-saving infrastructure. They are proactive in ensuring that the future not only
brings progress, but also remains worth living in.

Fig 1.1. Logo of AT&S company

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AT&S history

1987 Founding of the Group, emerging from several companies owned by the Austrian State-
Owned Industries

1994 Privatization and acquisition by Messrs Androsch, Dorflinger, Zoidl

1999 Initial public offering an Frankfurt Stock Exchange. Acquisition of IndaI Electronics
Ltd.
Largest Indian printed circuit board plant (Nanjangud)-today, AT&S India Pvt.Ltd.
2002 Start of production at new Shanghai facility – one of the leading HDI production sites
in the world

2006 Acquisition of Korean flexible printed circuit board manufacturer, Tofic Co. Ltd. – today,
AT&S Korea Co.,Ltd.

2008 AT&S change to Vienna Stock Exchange

2009 New production direction: Austrian plants produce for high-value niches in the
automotive and industrial segment; Shanghai focuses on the high-end mobile devices
segment.
2010 Start of production at plant 2 in India

2011 Construction starts on new plant in Chongqing, China

Capacity increase in Shanghai by 30%
2013 AT&S enters the IC substrate market in cooperation with a leading manufacturer of
semiconductors

2015 AT&S again achieves record high sales and earnings for financial year 2014/15 and
decides to increase the investment program in Chongqing from 350 million to €480
million

2016 AT&S starts serial production of IC substrates at the plant in Chongqing

2017 Successful introduction and optimisation of mSAP technology in Shanghai and

Chongqing

2019 Construction begins on Factory 3 in Chongqing for IC substrates

2021 Groundbreaking for new factory in Kulim, Malaysia

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1.2 AT&S Worldwide

INTERNATIONAL PRODUCTION PLANTS

The AT&S Group has production facilities in Europe and Asia: Leoben and Fehring in Austria,
Ansan in Korea, Nanjangud in India, Shanghai and Chongqing in China. AT&S employs 9,500
people worldwide.
Each of the plants concentrates on a specific portfolio of technologies. The Austrian plants are
geared to the European market and also, increasingly, to the American one. Short production
times, special applications and a greater emphasis on suppliers’ closeness to customers are
typical for Europe. The plants in Austria, India and Korea usually concentrate on small and
medium-sized batches for industrial and automotive customers, while in China the focus is on
large volumes for mobile communications customers.
Shanghai and Leoben are a major innovative force within the AT&S Group thanks to their
research and development facilities.

Facts Technologies Certifications

Staff: 1,122 Standard multilayer ISO 9001:2015
Opened: 1999 circuit boards IATF 16949:2016
Customer orientation: Double-sided plated- ISO 14001:2015
60% through printed circuit OHSAS 18001:2007
Automotive, 40% boards with reinforcement UL Listing
Industrial

1.3 Business Ethics

AT&S Code of Business Ethics and Conduct
The purpose of this Code of Business Ethics and Conduct is to describe how AT&S conducts
its business in an ethical socially responsible way. This policy is applied to all AT&S´s
activities globally. Every AT&S employee is expected to conduct himself or herself, in his
or her business and daily work, in line with this code without exception. Stricter guidelines
or more detailed instructions may be defined for certain regions, countries or functions, but
they shall be in line with this corporate policy.

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1.4 Vision and Mission

Fig 1.4. Vision and mission of AT&S company

1.5 Trends and AT&S development areas

• Miniaturization and functional integration
Electronic devices are becoming smaller and more lightweight while simultaneously providing an
ever-growing array of functions. We lay the foundations for this ongoing development by supplying
solutions to increase the packing density and efficiency of the overall system.

• Rapid signal lines

New connection solutions facilitate low-loss signal lines with low latency. This represents a
significant contribution to achieving the best possible signal integrity with high data transmission
rates of more than 10 Gbps and in high-frequency ranges of over 30 GHz. This makes applications
more precise and markedly reduces energy consumption.

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• Power and efficiency

In the field of electrification, there is a strong trend towards carbon-neutral energy generation,
alternative energy sources and electric drive systems. AT&S concentrates its development activities
on systems that deliver optimal power supplies with minimal electrical losses.

• Manufacturing of the future

Over the next ten years, industrial production processes will increasingly utilise artificial intelligence
and put sustainability front and centre. We are working on new solutions that facilitate efficient and
flexible production while keeping the consumption of resources (whether raw materials, water or
energy) to a minimum. This includes using vast quantities of data to digitally optimise and enhance
processes.

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Chapter 2

Tasks Performed
2.1 Introduction to PCB

The PCB Manufacturing Process

The Printed Circuit Board (PCB) acts as the linchpin for almost all of today’s modern
electronics. If the device needs to do some sort of computation — such as is the case even with
simple items like a digital clock — chances are there’s a PCB inside of it. PCBs bring
electronics to life by routing electrical signals where they need to go to satisfy all of the device’s
electronic requirements. For this to happen, PCBs are laid with a network of paths outlined in
the traces. It’s these copper pathways that allow PCBs to direct electrical currents around their
surface.
There are three main types of circuit boards that get manufactured on a consistent basis, and
it’s important to understand the differences between each so you can decide the right circuit
board for your requirements. The three main types of circuit boards in current manufacture are:

• Single-Sided Circuit Boards: These boards when made with a FR4 base have rigid
laminate of woven glass epoxy material, which is then covered on one side with a
copper coating that is applied in varying thicknesses depending on the application.

• Double-Sided Circuit Boards: Double-sided boards have the same woven glass epoxy
base as single-sided boards — however, in the case of a double-sided board, there is
copper coating on both sides of the board, also to varying thicknesses depending on the
application.

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• Multilayer- Boards: These use the same base material as single and double-sided
boards, but are made with copper foil instead of copper coating — the copper foil is
used to make “layers,” alternating between base material and copper foil until the
number of desired layers is reached.

What Are the Parts of a PCB?

There are four main parts to a PCB:

• Substrate: The first, and most important, is the substrate, usually made of fiberglass.
Fiberglass is used because it provides a core strength to the PCB and helps resist
breakage. Think of the substrate as the PCB’s “skeleton”.
• Copper Layer: Depending on the board type, this layer can either be copper foil or a
full-on copper coating. Regardless of which approach is used, the point of the copper is
still the same — to carry electrical signals to and from the PCB, much like your nervous
system carries signals between your brain and your muscles.
• Solder Mask: The third piece of the PCB is the solder mask, which is a layer of polymer
that helps protect the copper so that it doesn’t short-circuit from coming into contact
with the environment. In this way, the solder mask acts as the PCB’s “skin”.
• Silkscreen: The final part of the circuit board is the silkscreen. The silkscreen is usually
on the component side of the board used to show part numbers, logos, symbols switch
settings, component reference and test points. The silkscreen can also be known as
legend or nomenclature.

Now that we’ve gone over the basics of PCBs and PCB anatomy, we’ll walk through the
whole process of how to build a PCB.

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2.2 PCB Manufacture steps

The steps of the PCB manufacturing process are as follows:
Step One: Designing the PCB
The beginning step of any PCB manufacture is, of course, the design. PCB manufacture and
design always starts with a plan: the designer lays out a blueprint for the PCB that fulfills all
the requirements as outlined. The most commonly-used design software used by PCB designers
is a software called Extended Gerber — also known as IX274X.

When it comes to PCB design, Extended Gerber is an excellent piece of software because it
also works as an output format. Extended Gerber encodes all the information that the designer
needs, such as the number of copper layers, the amount of solder masks needed and the other
pieces of component notation. Once a design blueprint for the PCB is encoded by the Gerber
Extended software, all the different parts and aspects of the design are checked over to make
sure that there are no errors.
Once the examination by the designer is complete, the finished PCB design is sent off to a PCB
fabrication house so that the PCB can be built. On arrival, the PCB design plan undergoes a
second check by the fabricator, known as a Design for Manufacture (DFM) check. A proper
DFM check ensures that the PCB design fulfils, at minimum, the tolerances required for
manufacture.

Step Two: Printing the PCB Design

After all the checks are complete, the PCB design can be printed. Unlike other plans, like
architectural drawings, PCB plans don’t print out on a regular 8.5 x 11 sheet of paper. Instead,
a special kind of printer, known as a plotter printer, is used. A plotter printer makes a “film” of
the PCB. The final product of this “film” looks much like the transparencies that used to be
used in schools — it’s essentially a photo negative of the board itself.
The inside layers of the PCB are represented in two ink colors:

• Black Ink: Used for the copper traces and circuits of the PCB

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• Clear Ink: Denotes the non-conductive areas of the PCB, like the fiberglass base

On the outer layers of the PCB design, this trend is reversed — clear ink refers to the line of
copper pathways, but black ink also refers to areas where copper will be removed.
Each PCB layer and the accompanying solder mask gets its own film, so a simple two-layer
PCB needs four sheets — one for each layer and one each for the accompanying solder mask.
After the film is printed, they’re lined up and a hole, known as a registration hole, is punched
through them. The registration hole is used as guide to align the films later on in the process.

Step Three: Printing the Copper for the Interior Layers

Step three is the first step in the process where the manufacturer starts to make the PCB. After
the PCB design is printed onto a piece of laminate, copper is then pre-bonded to that same piece
of laminate, which serves as the structure for the PCB. The copper is then etched away to reveal
the blueprint from earlier.
Next, the laminate panel is covered by a type of photo-sensitive film called the resist. The resist
is made of a layer of photo-reactive chemicals that harden after they’re exposed to ultraviolet
light. The resist allows technicians to get a perfect match between the photos of the blueprint
and what’s printed to the photo resist.
Once the resist and the laminate are lined up — using the holes from earlier — they receive a
blast of ultraviolet light. The ultraviolet light passes through the translucent parts of the film,
hardening the photo resist. This indicates areas of copper that are meant to be kept as pathways.
In contrast, the black ink prevents any light from getting to the areas that aren’t meant to harden
so that they can later be removed.
Once the board has been prepared, it is washed with an alkaline solution to remove any of the
leftover photo resist. The board is then pressure-washed to remove anything left on the surface
and left to dry.
After drying, the only resist that should be left on the PCB is on top the copper that remains as
part of the PCB when it’s finally popped free. A technician looks over the PCBs to make that
there are no errors. If no errors are present, then it’s on to the next step.

Step Four: Getting Rid of the Unneeded Copper

The next stage in the process is that of removing the unwanted copper. Much like the alkaline
solution from earlier, another powerful chemical is used to eat away at the copper that is not
covered by photo resist. Once the unprotected copper is removed, the hardened photo resist

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from earlier needs to be removed, as well. Another solvent is used, leaving only the copper
necessary for the PCB.
Note that when it comes to removing the unwanted copper from your PCB, heavier boards may
require more copper solvent or more exposure to the solvent.

Step Five: Inspection and Layer Alignment

After each of the PCB’s layers have been cleaned, they’re ready for layer alignment and an
optical inspection. The holes from earlier are used to align the inner and outer layers. To align
the layers, a technician places them on a type of punch machine known as an optical punch.
The optical punch drives a pin down through the holes to line up the layers of the PCB.

Following the optical punch, another machine performs an optical inspection to make sure there
are no defects. This optical inspect is incredibly important because once the layers are placed
together, any errors that exist can’t be corrected. To confirm that there are no defects, the AOI
machine compares the PCB to be inspected with the Extended Gerber design, which serves as
the manufacturer’s model.
After the PCB has passed inspection — that is, neither the technician nor the AOI machine
found any defects — it moves onto the last couple steps of PCB manufacture and production.
Step Six: Laminating the PCB Layers

At step six in the process, the PCB layers are all together, waiting to be laminated. Once the
layers have been confirmed as being defect-free, they’re ready to be fused together. The PCB
laminating process is done in two steps: the lay-up step and the laminating step.
The outside of the PCB is made of pieces of fiberglass that have been pre-soaked/pre-coated
with an epoxy resin. The original piece of substrate is also covered in a layer of thin copper foil
that now contains the etchings for the copper traces. Once the outer and inner layers are ready,
it’s time to push them together.

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The sandwiching of these layers is done using metal clamps on a special press table. Each layer
fits onto the table using a specialized pin. The technician doing the laminating process starts by
placing a layer of pre-coated epoxy resin — known as pre-impregnated or prepreg — on the
alignment basin of the table. A layer of substrate is placed over the pre-impregnated resin,
followed by a layer of copper foil. The copper foil is in turn followed by more sheets of
reimpregnated resin, which are then finished off with a piece of and one last piece of copper
known as a press plate.
Once the copper press plate is in place, the stack is ready to be pressed. The technician takes it
over to a mechanical press and presses the layers down and together. As part of this process,
pins are then punched down through the stack of layers to ensure that they’re fixed properly.
If the layers are fixed properly, the PCB stack is taken to the next press, a laminating press.
The laminating press uses a pair of heated plates to apply both heat and pressure to the stack of
layers. The heat of the plates melts the epoxy inside of the prepreg — it and the pressure from
the press combine to fuse the stack of PCB layers together.
Once the PCB layers are pressed together, there’s a little bit of unpacking that needs to be done.
The technician needs to remove the top press plate and the pins from earlier, which then allows
them to pull the actual PCB free.

Step Seven: Drilling

Before drilling, an X-ray machine is used to locate the drill spots. Then, registration/guiding
holes are drilled so that the PCB stack can be secured before the more specific holes are drilled.
When it comes time to drill these holes, a computer-guided drill is used to make the holes
themselves, using the file from the Extended Gerber design as a guide.
Once the drilling is complete, any additional copper that’s left over at the edges is filed off.

Step Eight: PCB Plating

After the panel has been drilled, it’s ready to be plated. The plating process uses a chemical to
fuse all of the different layers of the PCB together. After being cleaned thoroughly, the PCB is
bathed in a series of chemicals. Part of this bathing process coats the panel in a micron-thick
layer of copper, which is deposited over the top-most layer and into the holes that have just
been drilled.

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Before the holes are filled with copper, they simply serve to expose the fiber glass substrate
that makes up the panel’s insides. Bathing those holes in copper covers the walls of the
previously-drilled holes.

Steps Nine and Ten: Imaging and Plating the Outer Layer

Earlier in the process (Step 3) a photo resist was applied to the PCB panel. In Step 9, it’s time
to apply another layer of photo resist. However, this time the photo resist is only applied to the
outside layer, since it still needs to be imaged. Once the outer layers have been coated in photo
resist and imaged, they’re plated in the exact same way the interior layers of the PCB were
plated in the previous step. However, while the process is the same, the outer layers get a plating
of tin to help guard the copper of the outside layer.

Step Eleven: The Last Etching

When it comes time to etch the outside layer for the last time, the tin guard is used to help
protect the copper during the etching process. Any unwanted copper is removed using the same
copper solvent from earlier, with the tin protecting the valued copper of the etching area.

Once all the unwanted copper is removed, the PCB’s connections have been properly
established and it’s ready for solder masking.

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Step Twelve: Applying the Solder Mask

To make the panels ready for solder mask application, they’re cleaned. Once the PCB panels
have been cleaned, an ink epoxy is applied, along with a solder mask film. The boards are
blasted with ultraviolet light to mark out certain portions of the solder mask for removal.
After the unwanted pieces of solder mask have been removed, the PCB is placed into an oven
and baked so that the solder mask will cure.

Steps Thirteen and Fourteen: Finishing the PCB and Silk screening

As part of the finishing process, the PCB is plated with gold, silver, or HASL so the components
are able to be soldered to the pads created and to protect the copper.
After the PCB has been gold or silver-plated, as necessary, it is silk-screened. The silk-screening
process prints all of the vital information on the PCB, such as manufacturer marks, company
ID numbers and warning labels.
Once the PCB has been plated and silk-screened with the correct information, it can be sent
along to the final curing stage.
Step Fifteen: Electrical Reliability Testing

After the PCB has been coated and cured (if necessary), a technician performs a battery of
electrical tests on the different areas of the PCB to ensure functionality. The main tests that are
performed are the circuit continuity and isolation tests. The circuit continuity test checks for
any disconnections in the PCB, known as “opens.” The circuit isolation test, on the other hand,
checks the isolation values of the PCB’s various parts in order to check if there are any shorts.
While the electrical tests mainly exist to ensure functionality, they also work as test of how well
the initial PCB design stood up to the manufacturing process.

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In addition to basic electrical reliability testing, there are other tests that can be used to
determine if a PCB is functional. One of the main tests used to do this is known as the “bed of
nails” test. During this text, several spring fixtures are attached to the test points on the circuit
board. The spring fixtures then subject the test points on the circuit board with up to 200g of
pressure to see how well the PCB stands up to high-pressure contact at its test points.
If the PCB has passed its electrical reliability testing — and any other testing the manufacturer
chooses to implement — it can be moved on to the next step: cutting.
Step Sixteen: Cutting and Profiling
The last step of the PCB manufacturing process is the cutting and scoring of the PCB. This
involves cutting out the different PCBs from original panel. There are two ways that PCBs can
be cut from their original panels:
• Using a CNC machine or router, which cuts out small tabs around the edges of the PCB

• Using a V-groove, which cuts a diagonal channel along the sides of the board

No matter which way you use, your PCB will be able to easily come free of the construction
paneling.
Once the boards are broken off the construction board, there comes a final inspection phase:

• The boards are checked over for general cleanliness to ensure that there are no sharp
edges, burrs or other manufacturing hazards.
• Slots, chamfers, bevels and countersinks are added during the routing and fabrication
process, as necessary
• If possible, any shorts are repaired — the shorted boards are then re-tested using the
same electrical reliability tests from above
• A visual inspection can be conducted, if necessary, to ensure that boards meet industry
specifications and match up to the details laid out in Gerber data: the technician can
also use the visual inspection to verify the hole sizes and the physical dimensions of the
PCB, if required.

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CHAPTER 3
IMPLEMENTATION

SURFACE FINISHING- OVER OF ENIG PROCESS

[Electroless Nickel Immersion Gold]

3.1 What is ENIG?

Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold
(Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed
circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts
and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer
of gold, which protects the nickel from oxidation. The gold is typically applied by quick
immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the
gold is reduced to metallic state. A variant of this process adds a thin layer of electroless
palladium over the nickel, a process known by the acronym ENEPIG.
ENIG can be applied before or after the solder mask, also known as "overall" or "selective chemical
Ni/Au," respectively. The latter type is more common and significantly cheaper as less gold is needed
to cover only the solder pads.
Why use ENIG PCB?

When it comes to selecting the right surface finish for Printed Circuit Boards (PCBs), ENIG offers
a range of benefits that make it a top choice for many businesses. Let's explore some of the key
advantages of ENIG PCBs:
• Superior Conductivity: Gold, being a top-notch conductor of electricity, ensures that
signals pass through the PCB without any hitches. This means devices work smoothly and
efficiently.
• Long-lasting: The combination of nickel and gold is like a protective shield. Nickel acts
tough, guarding the PCB's base material, while gold prevents tarnishing. Together, they
ensure the PCB remains in top condition for a long time.
• Flat Surface: ENIG provides a level surface, which is essential for components like Ball
Grid Arrays (BGAs) that need a smooth area to attach. A flat surface also means fewer
defects during the assembly process.
• Resistant to Corrosion: Gold doesn't corrode easily. This resistance to corrosion means
that the PCB is less likely to face issues due to environmental factors, ensuring a longer
life for electronic devices. Learn more about PCB Corrosion

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• Suitable for Fine Pitch Components: As electronics become more advanced,

components get smaller and more intricate. ENIG's smooth surface is perfect for these
tiny components, ensuring they fit and function correctly.
• Lead-Free: In today's world, being environmentally friendly is crucial. ENIG is a lead-
free finish, aligning with global standards and regulations that aim to reduce harmful
substances in electronics.

Fig.3.1 ENIG LINE

Fig 3.1.1 ENIG LINE

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3.2 FLOWCHART

Steps followed in the process:

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Fig.3.2: After PCB surface finishing

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3.3 Process involved in ENIG Process and results

Basic description of the equipment/process:

1) Acid cleaner: Mild surface oxidation, dirt etc., are removed at this stage. This is a
special cleaner which also deactivates palladium residue in the non PTH holes (from
electroless copper process) where electroless nickel gold is not supposed to deposit.
2) Micro etch: It removes 1,5-d microns of cu and is responsible for a good adhesion
between Cu and Ni.
3) Hot Sulphuric acid: This process ensure removal of entrapped micro-etch solution is
the partially tested or tested holes thereby eliminating galvanic effect. This step is
essential to eliminate skip plating on the pads, which are connected to these partially or
fully tested holes.
4) Pre-dip: It deoxidise the Cu and acidify the surface of the panel to prevent formation of
palladium hydroxide in the activator bath.
5) Activator: This is one of the very important stages it contains palladium ion and dilute
sulphuric acid. A thin layer of the palladium gets deposited on the copper surface and
activator it to receive subsequent electroless Nickel deposit.
6) Post dip: This stage removes the excessive palladium solution from the surface at the
panel before it goes to the subsequent rinse stage.
7) Electroless nickel: In this stage electroless nickel gets deposited by electroless method.
The electroless nickel bath is always associated with phosphorous in it. Hypophosphite
is responsible for the reduction of nickel from its ion stage to metallic stage. In this
process phosphorous is also gets co-deposited.
8) Immersion gold: In this stage gold gets deposited on the nickel surface by displacement
reaction. This thickness of gold deposition is very important here.
9) Drying: The panels are dried to avoid the water stains on the gold deposit and have good
legend landing. Sufficient drying is also required to maintain the cleanliness of the
workplace.
10) Rinses: After each of the above chemical process water rinse is provided to avoid cross
contamination. However, after pre-dip beards are not rinsed, they go directly to next
process(activation).
• ENIG is one of the most popular widely-used circuit board finishes available today.
Constructed with two layers of coating, ENIG places 2-4 μ” Au over 120-200 μ” Ni. The gold
protects the nickel from corrosion and the nickel protects the base metal board and allows for
circuits to be securely soldered to its surface.

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3.4 PARAMETERS MAINTAINED IN EACH STAGE:

Module Module name Process Unit Specification

No. characteristics

09 Acid cleaner Bath temperature Deg C Psi 45-50

Filter Pressure ON/OFF 10.0 -15.0
Air Agitation gpl Should be OFF
Proactive DP 350-383-450-517550
(concentration) gpl 50-52-55-58-60
Sulphuric acid
(concentration)

10 Triple Rinse Water flow rate Air lpm 1–4

11 Agitation ON/OFF Should be OFF
12
13 Micro-Etch Temperature Air Deg C 32 - 40
Agitation ON/OFF Should be ON
Securiganth C gpl 40-45-55-65-70
(Concentration)
Sulphuric acid gpl 2.0-3.0
(Concentration)
Etch rate microns 1.4 -1.8

14 DI Rinse Water flow rate Air lpm 1-4

Agitation ON/OFF Should be ON

15 Hot sulphuric Temperature Air Deg C 65 - 72

acid Agitation ON/OFF Should be ON
Sulphuric acid % 5.0-6.0-7.5-9.0-10.0
(concentration)

16 Double cascade Water flow rate Air Lpm 1 – 4 Should be ON

17 Rinse Agitation ON/OFF

18 Predip Temperature Air Deg C 65 - 72

Agitation ON/OFF Should be ON
Sulphuric acid % 4.0-4.5-5.0-6.0
(concentration)

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19 Activator Temperature Deg C 65 – 72

Filter Pressure Psi 10 - 20
Air Agitation ON/OFF Should be ON
Palladium gpl 40-46-60-69-75
(concentration)
Sulphuric acid gpl 40-43-45.8-55-60
(concentration)

20 Water Rinse Water flow rate Air lpm 1.0– 4.0 Should
Agitation ON/OFF be ON

21 Post dip Air Agitation ON/OFF % Should be OFF 3-4-

Sulphuric acid 4.5-5-6
(concentration )

23 Double cascade Water flow rate Air lpm 1.0– 4.0 Should
24 Rinse Agitation ON/OFF be ON

25 Nickel Bath pH of Ni bath NA 4.7 -5.2

26 Temperature Ni Deg C 82 -92
Concentration % 90-95-100-105-110

27 Rectifier/Ni Hypo gpl microns 30-33-40-47-50

28 Controller Ni thickness volts amps 3–8
Voltage 0.8-1.5
Current 0.0-5.0

29 Triple cascade Water Flow rate Air lpm 1.0- 4.0 Should be
30 rinse Agitation ON/Off ON
31
08 Gold bath Temperature pH Deg C NA 85-92
07 of Au bath micron 5.5 -6.0
Gold thickness 0.05 -0.12

06 Gold drag out Samples for analysis NA

05 Water rinse Air Agitation ON\OFF lpm Should be ON

04 Water flow rate 1.0 – 4.0

03 Hot water rinse Temperature Water Deg C lpm 45 - 60

flow rate 1.0 – 3.0

02 Dryer Temperature Deg C 95 - 100

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3.5 Common PCB Issues:

1. Starved thermals
Starved thermals occur when the thermal relief traces connected to a pad are not properly
connected to the associated copper plane. Quite often, the spacing between vias will pass a
basic design rule check, but the attached thermal relief traces will be interrupted and the
effected vias will be inappropriately isolated from their assigned copper pours. This issue is
most commonly seen when multiple vias are placed in proximity to each other.

2. Acid traps
When two traces are joined at a highly acute angle it is possible that the etching solution used
to remove copper from the blank board will get "trapped" at these junctions. This trap is
commonly referred to as an acid trap. Acid traps can cause traces to become disconnected from
their assigned nets and leave these traces open circuited. The issue of Acid traps has been
reduced in recent years by fabricators switching to the use of photo activated etching solutions.
So, while it is still a good idea to make sure that your traces do not meet acute angles, the issue
is less of a worry than it had been in the past.

3. Silvers
If very small portions of a copper pour are only connected to larger portions of the same copper
pour through a narrow trace, it is possible for them to break off during fabrication, "float" to
other parts of the board and cause unintended shorts. The problems presented by silvers have
been reduced in recent years by fabricators switching to the use of photo activated etching
solutions. So while silvers are still to be avoided in designs, they are not as predominate of an
issue as in the past.

4. Insufficient annular ring

Vias are made by drilling through pads on either side of a board and plating the walls of these
holes to connect the two sides of the board. If the pad size called out in the design is too small,
the via may fail due to the drill hole taking up too large of a portion of the pads. Minimum
annular ring size is commonly part of the DRC process. This issue is mentioned here because
of the not uncommon occurrence of missed drill hits in prototyping boards.

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5. Via in Pads
Occasionally it may be convenient to design via to be positioned within a PCB pad. However, via in
pads can cause issues when the time comes for the board to be assembled. Via will draw solder away
from the pad and cause the component associated with the pad to be improperly mounted.
The image below shows difference between via in pad PCB and normal PCB.

Fig.3.3.5: Difference between via in pad PCB and normal PCB

6. Copper too close to board edge

Normally caught during design rule checks, placing copper layers too close to the edge of a board
can cause those layers to short together when the board is cut to size during the fabrication process.
While this sort of error should be caught using DRC features typically available in PCB design
software, a PCB fabricator that does a DFM check will also catch this issue.
7. Missing solder mask between pads
In very tightly spaced, small pin pitch devices, it is quite common for there to be no solder mask
between pins due to standard design settings. The omission of said solder mask can lead to solder
bridges forming more easily when the fine pin pitched component is attached to the
PCB during assembly.

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We has been providing professional PCB assembly services for years, we are capable to refrain from
missing solder mask between pads. The image below shows our high precise solder mask between
0.4 pitch QFN pads.

Fig.3.5: High precise solder mask

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CHAPTER 4
ADVANTAGES, DISADVANTAGES AND APPLICATIONS
4.1 Advantages and Disadvantages
Advantages of ENIG finish
• One of the primary benefits of ENIG is its excellent surface planarity. This makes it
particularly suitable for PCBs with fine-pitch components, where the flatness of the surface is
critical for ensuring good electrical contact. The uniformity of the ENIG finish also contributes
to its excellent solderability, allowing for reliable solder joints.

• Another advantage of ENIG is its compatibility with both lead and lead-free solders. This
versatility makes it a suitable choice for various applications, from consumer electronics to
aerospace and defense systems. The end result is RoHS compliant, which makes this finish
more important.

• ENIG also provides a robust barrier against oxidation. The nickel layer acts as a barrier to
prevent copper from the PCB from oxidizing, while the thin layer of gold protects the nickel
from oxidation. This dual layer of protection enhances the longevity of the PCB, making ENIG
a good choice for applications where durability is important.

1. Durability and Longevity

The ENIG finish is renowned for its durability and longevity, two of its standout features.
The nickel layer in ENIG provides a hard and wear-resistant surface that can withstand mechanical
stress. This makes ENIG-finished PCBs ideal for through holes, vias, connectors or Ball Grid Arrays
(BGA) used in harsh environments. This PCB surface finish has a long shelf life of 12+ months.

The gold layer, although thin, provides excellent protection against corrosion. Gold is highly resistant
to oxidation and tarnish, which helps to maintain the electrical performance of the PCB over time.
This is particularly important in applications where the PCB is exposed to harsh environments, such
as industrial or outdoor applications.

Furthermore, the electroless deposition process used in ENIG ensures a uniform and continuous
coverage of the PCB surface, even in the presence of complex geometries. This uniform coverage

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further enhances the durability and longevity of the PCB by ensuring that all areas of the PCB surface
are adequately protected.

In terms of longevity, ENIG-finished PCBs can maintain their performance for many years, even
under challenging conditions. This long lifespan makes ENIG a cost-effective choice in the long run,
despite its higher upfront cost than other surface finishes. ENIG is also a good surface finish for high-
volume manufacturing, which is common in China.

2. Superior Performance

One of the key performance advantages of ENIG is its exceptional electrical conductivity. The gold
layer in ENIG provides a highly conductive surface, which is crucial for the efficient operation of
electronic devices. This high conductivity ensures minimal signal loss, particularly in high-frequency
applications.

Another performance advantage of ENIG is its excellent thermal stability. The nickel layer in ENIG
has a high melting point, which allows ENIG-finished PCBs to withstand high temperatures during
soldering and operation. This thermal stability is critical in applications where the PCBs are exposed
to high temperatures, such as in power electronics.

ENIG also offers superior performance in terms of surface flatness. The electroless deposition process
ensures a uniform and flat surface, essential for the reliable assembly of fine-pitch components. This
surface flatness contributes to the high yield and reliability of ENIG-finished PCBs.

Furthermore, ENIG provides excellent wetting properties, which facilitate the formation of reliable
solder joints. This is particularly important in surface mount technology (SMT), where the quality of
the solder joints directly affects the performance and reliability of the assembled devices.

3. Compatibility

In terms of compatibility, ENIG is compatible with a wide range of materials and processes. It can be
used with both lead and lead-free solders, and it is compatible with various types of solder pastes and
fluxes. This compatibility makes ENIG a versatile choice that can meet the diverse requirements of
different applications.

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The nickel layer in ENIG provides excellent corrosion protection, making it ideal for PCBs in
challenging environments. ENIG's surface is highly conductive and easy to bond, making it perfect
for wire bonding. It also provides a smooth surface for chip-scale packages (CSPs) and other
applications that require a smooth finish. ENIG can withstand multiple reflow cycles, making it a top
choice for projects that require frequent assembly.

Overall, the superior performance of ENIG in terms of electrical conductivity, thermal stability,
surface flatness, wetting properties, and compatibility contributes to its widespread use in the
electronics industry.

Disadvantages and Challenges of ENIG finish

While the Electroless Nickel Immersion Gold finish offers numerous advantages, it also has certain
disadvantages and challenges that must be considered when selecting a surface finish for printed
circuit boards (PCBs).
• Cost Implications
One of the primary drawbacks of ENIG is its higher cost than other surface finishes, such as HASL
(Hot Air Solder Leveling) or OSP (Organic Solderability Preservative). The ENIG process involves
the deposition of both nickel and gold layers, which contributes to the increased cost. Additionally,
the chemicals used in the electroless deposition process can be expensive, further driving up the
overall cost of the finish. The higher cost of ENIG may not be justified for all applications, particularly
for low-cost consumer electronics or projects with tight budget constraints. In such cases, more cost-
effective surface finishes may be preferred. ENIG is more expensive and more complex to apply than
immersion tin. However, it is essential to weigh the cost implications against the performance benefits
and durability offered by ENIG. In some cases, the long-term benefits of using ENIG, such as
improved reliability and longevity, may outweigh the initial cost difference. This is especially true for
high-performance applications or those requiring a high level of reliability and durability.

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• Black Pad Phenomenon

Another challenge with ENIG is the potential for "black pad" syndrome, a defect that can occur during
electroless nickel deposition. This defect is characterized by a brittle, non-uniform nickel layer, which
can lead to poor solder joint reliability and potential failure of the PCB. [6] This issue occurs during
the electroless nickel deposition process and can lead to poor solder joint reliability and potential
failure of the printed circuitry. The root cause of the black pad phenomenon is often attributed to the
presence of contaminants or impurities in the electroless nickel plating bath, as well as inadequate
process control during the deposition process.

To mitigate the risk of black pad syndrome, several measures can be taken:

1. Strict process control: Ensuring that the electroless nickel plating bath is maintained within
the specified operating parameters, such as temperature, pH, and concentration of chemicals,
is crucial for preventing black pad formation. Regular monitoring and adjustments of the
plating bath can help maintain optimal conditions for the deposition process.
2. Bath maintenance: Regularly replenishing the plating bath with fresh chemicals and removing
contaminants can help maintain the quality of the nickel layer. This includes filtering the bath
to remove particulate matter and monitoring the concentration of metal ions to ensure that they
remain within the specified limits.
3. Surface preparation: Properly cleaning and preparing the copper surface before the deposition
process can help reduce the risk of black pad formation. This may involve using appropriate
cleaning agents and rinsing procedures to remove residual contaminants from the copper
surface.
4. Quality control: Implementing rigorous quality control measures, such as visual inspection
and solderability testing, can help identify and address black pad issues before the PCBs are
assembled and deployed.

By taking these precautions and maintaining strict process control, the risk of the black pad
phenomenon can be minimized, ensuring the reliability and performance of ENIG-finished PCBs. In
summary, while ENIG offers several advantages in terms of performance, durability, and
compatibility, it also comes with certain disadvantages and challenges, such as higher cost and the
potential for black pad syndrome. These factors should be carefully considered when selecting a
surface finish for PCBs.

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4.2 Applications of ENIG PCB

The Electroless Nickel Immersion Gold (ENIG) surface finish is not just a random choice in the world
of electronics and other industries. Its unique properties make it a preferred choice for several
applications across different sectors. Here's a closer look at how various industries leverage the
benefits of ENIG PCBs.
Electronics Industry
The electronics sector stands as a major beneficiary of the ENIG finish. Components like printed
circuit boards (PCBs), integrated circuits (ICs), and connectors heavily rely on immersion gold. The
primary reasons include its superior corrosion resistance, even surface, and consistent thickness.
These attributes are vital for components demanding high reliability, especially when they are to
function in challenging conditions.
Medical Industry
Medical devices, including pacemakers, defibrillators, and heart monitors, demand utmost reliability
and longevity. The ENIG finish, with its excellent corrosion resistance and flat surface, ensures these
devices perform optimally.
Aerospace Industry
In the aerospace sector, the stakes are high. Devices and components need to be durable, reliable, and
safe. Given the extreme conditions these components are exposed to, the corrosion resistance and
uniform thickness provided by the ENIG finish become indispensable. It ensures aerospace products
remain functional and safe, even in the most demanding situations.
Telecommunications Industry
The world of telecommunications is all about speed, reliability, and performance. Devices like
routers, switches, and servers are at the heart of this industry. The uniform layer thickness offered by
the ENIG finish is crucial for fine-pitch surface mount technology. Additionally, its excellent wire
bonding properties are vital for ensuring high-speed data transmission.
Automotive Industry
Systems like engine control units (ECUs), airbag sensors, and anti-lock brake systems (ABS) are
integral to modern vehicles. Given the varying conditions these electronics are exposed to, the ENIG
finish, with its corrosion resistance, flat surfaces, and consistent thickness, becomes crucial

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REFLECTION NOTES

• Practical Skills:
Opportunities to converse and interact with a large pool of talented experienced department members
has provided a deeper insight to the overall operation, and valuable pool of resources to assist in
completion of internship program. This internship program was exactly what I needed to nurture my
practical skills. I have acquired practical experience to complement the theoretical content of my
studies.
• Interpersonal Communication Skills:
Through this internship, I found that I matured and I gained many new perspectives, such as problem-
solving skill, diversity, effective communication, teamwork and service recovery, attention to detail,
time management, personal empowerment, self-confidence, responsibility and cultural sensitivity.
• Leadership Skills
It can be said that the most successful leaders are those that drive other to achieve their own success.
I gained leadership skills from my supervisor during the internship period which includes managing
time, motivating individuals, giving feedback and giving effective guidance.
• Work Ethical Related Issue
I have seen the willingness to work hard from my supervisor during my internship period. In addition
to working hard it is also important to work smart. This means I acquired the most efficient way to
complete tasks and ending ways to save time while completing daily assignments.
• Writing Skills
The Internship program contributed towards enhancing our writing skills while asking all the
interns to prepare a report for the given topic which was taught in classroom by collecting extra
information about the given topic and we need to prepare presentation on that topic. I would like
to highlight the advantageous part of this activity.

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CONCLUSION

Electroless Nickel Immersion Gold (ENIG) is a widely used surface finish for printed circuit boards
(PCBs) due to its numerous advantages, such as excellent surface planarity, compatibility with various
materials and processes, and superior performance in terms of electrical conductivity, thermal
stability, and solderability. However, ENIG has some disadvantages and challenges, including higher
costs and the potential for the black pad phenomenon. When selecting a surface finish for PCBs, it is
essential to consider the specific requirements of the application and weigh the advantages and
disadvantages of various finishes, such as Hot Air Solder Leveling (HASL), Organic Solderability
Preservative (OSP), and Immersion Silver (ImAg). Each finish has its unique characteristics, and the
choice depends on factors such as cost, performance, durability, and compatibility with the intended
application.

As you can see in this slide, PCB fabrication involves several time-consuming steps that must be done
with utmost care. Any flaw in these manufacturing process will affect the performance, functionality
and durability of the final assembly. PCBs that are fabricated following the right fabrication process
will last long and offer superior performance for many years.

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REFERENCES

[1] Sierra Circuits. Thickness specifications in ENIG surface finish [Cited 2023 October 31]

[2] Science Direct. Corrosion protection of ENIG surface finishing using electrochemical methods
[Cited 2023 October 31]

[3] ROWSUM. COMPARING PCB SURFACE FINISHES: ENIG VS. HASL, OSP, AND MORE
[Cited 2023 October 31]

[4] Wikipedia. Electroless Nickel Immersion Gold [Cited 2023 October 31]

[5] Our PCB. 13 Advantages Kinds of About Enig Plating Immersion Hard Gold PCB [Cited 2023
October 31]

[6] MCL. ENIG Black Pad [Cited 2023 October 31]

[7] Wevolver. HASL vs ENIG Surface Finishes: Understanding the difference [Cited 2023 October
31]

Dept. of ECE, AIT, CKM 33