ZXGD3009E6

40V 1A GATE DRIVER IN SOT26

Description Features
ZXGD3009E6 is a high-speed non-inverting single gate driver for • High-Gain Buffer With Typically 500mA Output from 10mA Input
switching MOSFETs. It can transfer up to 1A peak source/sink current • Rugged Emitter-Follower to Latch-up/Shoot-Through Issues
into the gate for effective charging and discharging the capacitive gate • Wide Supply Voltage to Minimize On-Losses
load. • Optimized Pin-Out to Simplify PCB Layout and Reduce
Parasitic Trace Inductances
This gate driver ensures rapid switching of the MOSFET to minimize • Near-Zero Quiescent Supply Current
power losses and distortion in high current switching applications. It • Qualified to AEC-Q101 Standards for High Reliability
can typically drive 500mA into the low gate impedance with just 10mA • Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
input from a controller. The turn-on and turn-off switching behavior of • Halogen and Antimony Free. “Green” Device (Note 3)
the MOSFET can be individually tailored to suit an application. By
defining the switching characteristics appropriately, EMI and cross
conduction can be reduced.

Applications Mechanical Data

Power MOSFET Gate Driving in: • Case: SOT26
• AC-DC Power Supplies (SMPS) • Case Material: Molded Plastic. “Green” Molding Compound
• DC-DC Converters UL Flammability Rating 94V-0
• DC-AC Inverters (i.e. Solar) • Moisture Sensitivity: Level 1 per J-STD-020
• 1-, 2-, and 3-Phase Motor Control Circuits • Terminals: Finish—Matte Tin Plated Leads. Solderable per
• Amplifier Output Stages MIL-STD-202, Method 208
• Weight: 0.018 grams (Approximate)

SOT26
Pin Name Pin Function
V CC SOURCE
VCC Supply Voltage High
Not Internally
IN IN Driver Input
Connected
VEE Supply Voltage Low
VEE SINK SOURCE Source Current Output *
SINK Sink Current Output *
Top View * Typically connect SOURCE & SINK together
Internal Device Pin-Out
Top View
Schematic

Ordering Information (Note 4)

Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
ZXGD3009E6TA AEC-Q101 3009 7 8 3000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

ZXGD3009E6 1 of 8 July 2018

Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Marking Information

3009 = Product Type Marking Code

YM
3009 YM = Date Code Marking
Y or Y = Year (ex: E = 2017)
M or M = Month (ex: 9 = September)
Date Code Key
Year 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028
Code F G H I J K L M N P Q
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D

Typical Application Circuit

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Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Supply Voltage, with Respect to VEE VCC 40 V
Input Voltage, with Respect to VEE VIN 40 V
Output Difference Voltage (Source – Sink) ∆V(source-sink) ±7 V
Peak Pulsed Output Current (Source and Sink) IOM ±2 A
Peak Pulsed Input Current IIM ±1 A

Thermal Characteristics (@ TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Power Dissipation (Notes 5 & 6) 1.1 W
PD
Linear Derating Factor 8.8 mW/°C
Thermal Resistance, Junction to Ambient (Notes 5 & 6) RϴJA 113
°C/W
Thermal Resistance, Junction to Lead (Note 7) RϴJL 105
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C

ESD Ratings (Note 8)

Characteristics Symbols Value Unit JEDEC Class
Electrostatic Discharge—Human Body Model ESD HBM 4000 V 3A
Electrostatic Discharge—Machine Model ESD MM 400 V C

Notes: 5. For a device mounted with pin 1 (VCC) and pin 3 (VEE) on 25mm × 25mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; the device is measured
under still air conditions whilst operating in steady-state. The heatsink is split in half with pin 1 (VCC) and pin 3 (VEE) connected separately to each half.
6. For device with two active die running at equal power.
7. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (VEE).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

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Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Electrical Characteristics (@ TA = +25°C, unless otherwise specified.)

Characteristic Symbol Min Typ Max Unit Test Condition
Output Voltage, High VOH VCC - 0.8 VCC - 0.4 — I(source) = 1µA, VIN = VCC
V
Output Voltage, Low VOL — VEE + 0.2 VEE + 0.5 I(sink) = 1µA, VIN = VEE
40 — — IQ = 100µA, VIN = VCC
Supply Breakdown Voltage BVCC V
40 — — IQ = 100µA, VIN = VEE = 0V
— — 20 VCC = 32V, VIN = VCC
Quiescent Supply Current IQ nA
— — 20 VCC= 32V, VIN = VEE = 0V
Peak Pulsed Source Current I(source)M — 0.98 — IIN= 10mA, VCC = 5V, VOUT= 0V
A
Peak Pulsed Sink Current I(sink)M — 0.78 — IIN= -10mA, VEE = 0V, VOUT= 5V
Peak Pulsed Source Current I(source)M — 1.58 — IIN= 50mA, VCC = 5V, VOUT= 0V
A
Peak Pulsed Sink Current I(sink)M — 1.38 — IIN= -50mA, VEE = 0V, VOUT= 5V
VCC = 15V, VEE = 0V
0.74 RIN = 100Ω
Peak Pulsed Source Current VIN = 15V
I(source)M — 0.175 — A RIN = 1kΩ
with Varying Input Resistances CL =1nF, RL = 0.18Ω
0.019 RIN = 10kΩ
RSOURCE = 0Ω, RSINK = 0Ω
VCC = 15V, VEE = 0V
1.05 RIN = 100Ω
Peak Pulsed Sink Current VIN = 15V
I(sink)M — 0.22 — A RIN = 1kΩ
with Varying Input Resistances CL =1nF, RL = 0.18Ω
0.025 RIN = 10kΩ
RSOURCE = 0Ω, RSINK = 0Ω
VCC = 12V, VEE = 0V
td(rise) 3.8
VIN = 0 to 10V
Switching Times tr 15
— — ns RIN = 25Ω
with Low Input Resistance td(fall) 4
15 CL = 1nF, RL = 0.18Ω
tf
RSOURCE = 0Ω, RSINK = 0Ω
VCC = 15V, VEE = 0V
td(rise) 18
VIN = 0 to 15V
Switching Times tr 36
— — ns RIN = 1kΩ
with Low Load Capacitance CL = 1nF td(fall) 16
40 CL = 1nF, RL = 0.18Ω
tf
RSOURCE = 0Ω, RSINK = 0Ω
VCC = 15V, VEE = 0V
td(rise) 47
Switching Times VIN = 0 to 15V
tr 210
with High Load Capacitance CL = 10nF — — ns RIN = 1kΩ
td(fall) 39
240 CL = 10nF, RL = 0.18Ω
tf
RSOURCE = 0Ω, RSINK = 0Ω

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Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Switching Test Circuit and Timing Diagram

VCC
90%

VIN VCC VIN

VOUT
RSOURCE
SOURCE
50Ω RIN
IN 10%
ZXGD3009
SINK td(rise) td(fall)
V RSINK CL

VEE 90% 90%

50Ω
RL
VOUT

10% 10%

tr tf

Typical Switching Characteristics (@ TA = +25°C, unless otherwise specified.)

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Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Typical Switching Characteristics (@ TA = +25°C, unless otherwise specified.)

10 10
Peak Source Current (A)

TA = 25°C

Peak Sink Current (A)

TA = 25°C
VCC= 15V
VCC= 15
1 VIN = 15V
1 CL=10nF VIN = 15V
CL=10nF RL = 0.18Ω
RL = 0.18Ω

0.1 0.1
CL=1nF
CL=1nF
CL=0.1nF CL=0.1nF
0.01 0.01
100 1k 10k 100 1k 10k
RIN Input Resistance (Ω) RIN Input Resistance (Ω)
Source Current vs. Input Resistance Sink Current vs. Input Resistance
1000 1000
RIN=10kΩ
RIN=10kΩ
100 100
td(fall) (ns)
td(rise) (ns)

10 TA = 25°C 10 TA = 25°C
VCC= 15V VCC= 15V
RIN=1kΩ VIN = 15V RIN=1kΩ VIN = 15V
RIN=100Ω RL = 0.18Ω RIN=100Ω RL = 0.18Ω
1
0.1 1 10 1
0.1 1 10
CL Load Capacitance (nF) CL Load Capacitance (nF)
Turn-On Delay Time Turn-Off Delay Time
1000 1000

RIN=10kΩ RIN=10kΩ

100 RIN=1kΩ 100 RIN=1kΩ

tf (ns)
tr (ns)

TA = 25°C TA = 25°C
VCC= 15V VCC= 15V
10 VIN = 15V 10 VIN = 15V
RIN=100Ω RIN=100Ω
RL = 0.18Ω RL = 0.18Ω
0.1 1 10 0.1 1 10
CL Load Capacitance (nF) CL Load Capacitance (nF)
Turn-On Rise Time Turn-Off Fall Time

ZXGD3009E6 6 of 8 July 2018

Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT26 (SC74R)
D

SOT26 (SC74R)
Dim Min Max Typ
A1 0.013 0.10 0.05
E1 E A2 1.00 1.30 1.10
A3 0.70 0.80 0.75
b 0.35 0.50 0.38
c 0.10 0.20 0.15
D 2.90 3.10 3.00
b
e — — 0.95
a1 e1 — — 1.90
e1 E 2.70 3.00 2.80
E1 1.50 1.70 1.60
L 0.35 0.55 0.40
a — — 8°
A2 a1 — — 7°
A3 A1
All Dimensions in mm
Seating Plane a
L
e c

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT26 (SC74R)

C1

Dimensions Value (in mm)

C 2.40
C1 0.95
Y1 G C G 1.60
X 0.55
Y 0.80
Y1 3.20
Y

ZXGD3009E6 7 of 8 July 2018

Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated
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(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

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labeling can be reasonably expected to result in significant injury to the user.

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failure of the life support device or to affect its safety or effectiveness.

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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2018, Diodes Incorporated

www.diodes.com

ZXGD3009E6 8 of 8 July 2018

Datasheet Number: DS36885 Rev. 3 - 2 www.diodes.com © Diodes Incorporated