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: 3DS_Document_2015
Broadband Macromodeling
with IdEM
Speaker: Michelangelo Bandinu
Start time: 8 am PT, 11 am ET, 5 pm CET
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3DS.COM © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
Broadband Macromodeling
with IdEM
Michelangelo Bandinu
Outline
Introduction to Macromodeling
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
Passivity and Causality
IdEM flow
Demo: building macromodels with IdEM
An application
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IdemWorks
IdemWorks was born as SpinOff from Mission: IdemWorks provides modeling tools
Politecnico di Torino, Italy and services for electronic design automation
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
flows, helping hardware manufacturers to
Founded in 2007 produce better products with a reduced time to
market.
Customers: Leading worldwide companies in
the computer, networking, communications,
consumer electronics, and automotive
markets.
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Designing a complex high-speed link
Data transmission: integrity of the signal through lines, bends, vias, connectors, transitions, …
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
Need modeling for: coupling, dispersion, losses, delays, discontinuities, power/ground
structures, nonlinear terminations, …
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The main objective
Efficient Signal and Power integrity analysis
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requires reliable and accurate models both
in pre-layout and post-layout phases.
Main Objective: enabling fast and accurate
circuit-level simulations.
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Interconnects: showcase
Connectors
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S-parameter
(tabulated)
Vias, via fields
EM SIMULATION
Packages
PDN
Backplane links
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Frequency and Time domain “interplay”
Electrical interconnect characterizations are typically available in the frequency- domain, often in
terms of scattering parameters. Conversely, system-level simulations require time-domain analysis
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
due to the presence of nonlinear driver/receiver circuitry.
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Frequency and Time domain “interplay”
Electrical interconnect characterizations are typically available in the frequency- domain, often in
terms of scattering parameters. Conversely, system-level simulations require time-domain analysis
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
due to the presence of nonlinear driver/receiver circuitry.
S-parameter block
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Frequency and Time domain “interplay”
Electrical interconnect characterizations are typically available in the frequency- domain, often in
terms of scattering parameters. Conversely, system-level simulations require time-domain analysis
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
due to the presence of nonlinear driver/receiver circuitry.
Black-box macromodel
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Passivity and causality: requirements
SI/PI analysis requires PASSIVE and CAUSAL models to enable reliable and fast system level
simulations
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Transient voltage
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Non-passive model
Passive model
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Voltage [mV]
-2
-4
0 200 400 600 800 1000
Time [ns]
PASSIVITY: Electrical interconnects never amplify CAUSALITY: Electrical interconnects never
signals. Non-passive models lead to time-domain provide a response that anticipates in time their
convergence problems and are non physical excitations
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Passivity and causality issues: why?
When data come from measurements the passivity/causality violations may be due to:
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
improper calibration and de-embedding
human mistakes
measurement noise
When data come from simulations the passivity/causality violations may be due to:
poor meshing
inaccurate solver
bad models or assumptions on material properties
(e.g. dielectrics with a tandelta which is constant in frequency)
human mistakes
improper use of data interpolation or extrapolation features of the solver
(often based on ill-defined and non-causal interpolation rules)
putting together results from two solvers
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Validation of S-parameter Data
“Energy gain” is a necessary, but not sufficient condition for passivity.
Causality is a prerequisite for Passivity.
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Passivity ”Energy gain” Causality “Hilbert-based check”
All the models generated by IdEM are CAUSAL by construction. The causality condition is enforced during
the macromodel generation.
The model is also PASSIVE if the passivity enforcement has been enforced by IdEM.
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IdEM: bridging the gap
Frequency-domain Time-domain
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IdEM validates S-parameters: IdEM delivers reliable models:
Passive
PASSIVITY check Causal
Energy gain Stable
Accurate
CAUSALITY check
SPICE-ready
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IdEM-based simulation flow
EM Simulation / Measurement
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H( j) f domain
Passive and Causal
Macromodel
SI/PI analysis • Data certification
• Rational approximation
• Passivity enforcement
IdEM
Circuit solver • Synthesis
Time domain simulation
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The IdEM flow
IdEM work-flow
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1. Import Touchstone file 2
3 4 5 6
2. Check data passivity
3. Check data causality
4. Model build
5. Check model passivity
6. Enforce model passivity
SPICE netlist
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IdEM: unique data certification engine
Touchstone file
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Data Passivity Check Data Causality Check
Singular values of S matrix Maximum Causality Check Error (dB)
1 15
S(1,2)
0.95
IdEM 10
S(3,3)
S(4,3)
0.9
0
-5
0.85
-10
0.8
-15
0.75 -20
0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3
Frequency [GHz] Frequency [GHz]
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IdEM: model generation
Data responses Model responses
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Scattering matrix entries, magnitude Scattering matrix entries, magnitude
1 1
S(1,1)
S(1,2)
IdEM
0.5 0.5
0 0
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
S(1,1), data
Scattering matrix entries, phase (degrees) Scattering matrix entries, phase (degrees) S(1,1), model
200 200 S(1,2), data
S(1,1) S(1,2), model
100 S(1,2) 100
0 0
-100 -100
-200 -200
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Frequency [GHz] Frequency [GHz]
Accurate – Stable – Causal – Passive
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IdEM: model synthesis
IdEM spice subcircuit Time domain simulation
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
****************************************
* STATE-SPACE REALIZATION *
* This file is automatically generated *
****************************************
* Created by IdEM
****************************************
***********************************
* Interface (ports specification) *
***********************************
SPICE
.subckt passive_circuit
+ a_1 a_2 a_3 a_4 ref
******************************************
* Main circuit connected to output nodes *
******************************************
* Port 1
VI_1 a_1 NI_1 0
RI_1 NI_1 b_1 5.0000000000000000e+001
GC_1_1 b_1 NI_1 NS_1 0 2.5693083123524896e-001
GC_1_2 b_1 NI_1 NS_2 0 -5.6469170068284752e-002
GC_1_3 b_1 NI_1 NS_3 0 4.8926190008399095e-002
GC_1_4 b_1 NI_1 NS_4 0 -5.2083718292784568e-002
GC_1_5 b_1 NI_1 NS_5 0 1.4574389378577475e-005
GC_1_6 b_1 NI_1 NS_6 0 -2.1775247527891126e-005
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Building macromodels with IdEM
Model generation with DC point constraints
Advanced feature: the DC response of a model can be constrained to the data DC point
value. The DC point can be preserved both during fitting and passivity enforcement.
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Advanced fitting options Advanced passivity options
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Multi-processing
IdEM enables multi-processing capabilities that allows handling even large structures with
an extraordinary speed-up in simulation runtime.
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Application: interconnect link
PCB A BackPlane PCB B
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Connector
Connector
1 2
3 4
GND PCB A GND PCB B
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Application: interconnect link
PCB A BackPlane PCB B
3DS.COM/SIMULIA © Dassault Systèmes | 3/3/2017 | ref.: 3DS_Document_2015
Connector
Connector
DRV RCV
1 2
3 4
GND PCB A GND PCB B
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Application: interconnect link
1 GBps 2 GBps 2.5 GBps
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2 GBps + aggressors 2 GBps + differential + aggressors
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