IPC-4556

Specification for
Electroless Nickel/
Electroless Palladium/
Immersion Gold (ENEPIG)
Plating for Printed Circuit
Boards

Developed by the Plating Processes Subcommittee (4-14) of the

Fabrication Processes Committee (4-10) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
January 2013 IPC-4556

Table of Contents
1 SCOPE ...................................................................... 1 3.2.5 Use of Non-Statistical Thickness
1.1 Statement of Scope .............................................. 1 Specification ......................................................... 8
1.2 Description ........................................................... 1 3.2.6 Production Overruns and/or Inventory Items ..... 8
1.2.1 Electroless Nickel Reducing Agents - 3.3 Porosity ................................................................ 8
Phosphorus Content ............................................. 1
3.4 Adhesion .............................................................. 8
1.2.2 Electroless Palladium Reducing Agents ............. 1
3.5 Solderability ......................................................... 9
1.3 Objective .............................................................. 1
3.5.1 Force Measurement Testing (Wetting Balance
1.3.1 Order of Precedence ............................................ 1
Testing) ................................................................. 9
[Link] Appendices ........................................................... 1
3.6 Cleanliness ........................................................... 9
1.4 Performance Functions ........................................ 1
3.7 Electrolytic Corrosion .......................................... 9
1.4.1 Solderability ......................................................... 1
1.4.2 Wire Bonding ....................................................... 2 4 QUALITY ASSURANCE PROVISIONS .................... 9
1.4.3 Contact Surface .................................................... 2 4.1 General Quality Assurance Provisions ................ 9
[Link] Membrane Switches ............................................. 2 4.1.1 Qualification Recommendations .......................... 9
[Link] Metallic Dome Contacts ...................................... 2 4.1.2 Sample Test Coupons ........................................ 10
1.4.4 EMI Shielding ...................................................... 2 4.2 Quality Conformance Testing ............................ 11
1.4.5 Interface for Conductive and/or Anisotropic
4.2.1 Thickness Measurements ................................... 11
Adhesives ............................................................. 2
1.4.6 Connectors ........................................................... 2 4.2.2 Qualified Processes ............................................ 11
[Link] Press-Fit Applications .......................................... 2 APPENDIX 1 Chemical Definitions and Process
[Link] Edge Tab Contact Applications ........................... 2 Sequence .......................................... 12
1.4.7 Limitations of ENEPIG ....................................... 2
APPENDIX 2 Round Robin Test Summary ........... 14
[Link] Creep Corrosion/Chemical Resistance ................ 2
[Link] High Frequency Signal Loss ............................... 3 APPENDIX 3 ENEPIG PWB Surface Finish XRF
Round Robin Testing ....................... 16
2 APPLICABLE DOCUMENTS AND TERMS AND
DEFINITIONS ............................................................ 3 APPENDIX 4 Factors Affecting Measurement
Accuracy of ENEPIG Coatings
2.1 IPC ....................................................................... 3 by XRF ............................................... 23
2.2 American Society for Testing and Materials
(ASTM International) .......................................... 3 APPENDIX 5 ENEPIG PWB Surface Finish
2.3 JEDEC .................................................................. 3 Wetting Balance Testing .................. 32

2.4 Defense Standardization Program ....................... 3 APPENDIX 6 Solder Spread Testing ..................... 40
2.5 Telcordia Technologies, Inc. ................................ 3
APPENDIX 7 ENEPIG PWB Surface Finish
2.6 International Organization for Standardization Shear Test Project ............................ 48
(ISO) ..................................................................... 3
2.7 Terms, Definitions and Acronyms ....................... 4 APPENDIX 8 Gold Wire Bonding .......................... 58

3 REQUIREMENTS ...................................................... 4 APPENDIX 9 XRF Thickness Measurements

3.1 Visual ................................................................... 5 of thin Au and Pd (ENEPIG):
Recommendations for
3.1.1 High Magnification Reference Images ............... 6 Instrumentation (Detectors)
3.2 Finish Thickness .................................................. 7 and their Limitations ........................ 64

3.2.1 Electroless Nickel Thickness ............................... 7 APPENDIX 10 Gage Capability. Gage R&R
3.2.2 Electroless Palladium Thickness ......................... 7 Type 1 Study ..................................... 66
3.2.3 Immersion Gold Thickness .................................. 7 APPENDIX 11 Solderability Testing Helps Select
3.2.4 XRF Calibration Standards ................................. 8 Surface Finishes ............................... 69

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Figures Figure A5-5 Metronelec ST88 Wetting Balance

Used for the Testing ..................................... 33
Figure 3-1 Uniform Plating .............................................. 5
Figure A5-6 Example of the Wetting Performance for
Figure 3-2 Extraneous Plating or Nickel Foot ................. 5 a Nominal 4 µin Electroless Palladium
Figure 3-3 Edge Pull Back .............................................. 5 Tested with SnPb Solder .............................. 34
Figure 3-4 Skip Plating .................................................... 5 Figure A5-7 Example of the Wetting Performance for
a Nominal 8 µin Electroless Palladium
Figure 3-5 Skip Plating of Gold Over Palladium ............. 6
Tested with SnPb Solder .............................. 34
Figure 3-6 Skip Plating of Gold Over a Palladium
Figure A5-8 Example of the Wetting Performance for
Deposit ........................................................... 6
a Nominal 20 µin Electroless Palladium
Figure 3-7 1000X SEM Image of a Normal ENEPIG Tested with SnPb Solder .............................. 35
Surface ........................................................... 6
Figure A5-9 Example of the Wetting Performance for
Figure 3-8 4000X SEM Image of a Normal ENEPIG a Nominal 4 µin Electroless Palladium
Surface ........................................................... 6 Tested with SAC305 Solder ......................... 35
Figure 3-9 2500X FIB Image of a Normal ENEPIG Figure A5-10 Example of the Wetting Performance for
Deposit ........................................................... 6 a Nominal 8 µin Electroless Palladium
Figure 3-10 100,000X FIB Image of a Normal ENEPIG Tested with SAC305 Solder ......................... 36
Deposit ........................................................... 6 Figure A5-11 Example of the Wetting Performance for
Figure 3-11 TEM Image of a Normal ENEPIG Deposit .... 7 a Nominal 12 µin Palladium Tested with
SAC305 Solder ............................................ 36
Figure 3-12 2500X Image of Nickel that is
Hyper-Corroded ............................................. 7 Figure A5-12 Example of a Nominal 4 µin Electroless
Palladium ENEPIG Post Temperature and
Figure 3-13 The Standard IPC Force Measurement Humidity Stressing, Tested with SnPb -
Coupon ........................................................... 9 Showing Excellent Robustness .................... 37
Figure A3-1 Test Coupon Used for XRF Round Robin Figure A5-13 Example of a Nominal 4 µin Electroless
Measurements ............................................. 16 Palladium ENEPIG, with Very Thin
Figure A3-2 Immersion Gold Thickness Readings in Immersion Gold after Temperature and
Microinches for the Sixteen Test Pads Humidity Stressing & Tested with SnPb ...... 38
Where C Is the Reference XRF ................... 18 Figure A5-14 Example of a Nominal 6 µin ENEPIG
Figure A3-3 Electroless Palladium Thickness Readings Deposit Tested with SAC305 Post
in Microinches for the Sixteen Test Pads Stressing – Showing Excellent
Where C Is the Reference XRF ................... 19 Robustness of Deposit ................................. 38
Figure A3-4 Electroless Nickel Thickness Readings Figure A5-15 Performance of Sample Group 20 (with
in Microinches for the Sixteen Test Pads thin gold) with SAC305 Post Stressing ........ 39
Where C Is the Reference XRF ................... 20 Figure A6-1 Layout of Test Board Used for Solder
Figure A3-5 The Impact of Feature Size on Electroless Spread and Wetting Balance Testing .......... 41
Palladium and Immersion Gold Deposition Figure A6-2 Solder Spread Pattern and Paste Stencil .... 41
Thickness Plated on the Same PB .............. 22
Figure A6-3 An Actual Solder Spread Result Showing
Figure A4-SS1 XRF Spectra of 1/2 oz Cu/Epoxy vs. the Deposits Counted for Each Line of
1 oz Cu/Epoxy ............................................. 28 the Pattern ................................................... 42
Figure A4-SS2 XRF Spectra of ENEPIG Plated on Cu
Figure A6-4 Solder Spread Results Using an ROL1
(No Epoxy) vs. 1/2 oz Cu/Epoxy ................. 29
Sn/Pb/Ag Solder Paste on ENEPIG
Figure A4-SS3 XRF Spectra of ENEPIG Plated on Cu Deposits ....................................................... 43
(No Epoxy) vs. ENEPIG Plated on 1 oz
Figure A6-5 Solder Spread Results Using an ROL0
Cu/Epoxy ...................................................... 30
Pb-free Solder Paste of the SAC 300
Figure A4-SS4 XRF Spectrum of ENEPIG Plated on Family on ENEPIG Deposits ........................ 44
1 oz Cu/Epoxy ............................................. 31
Figure A6-6 Solder Spread for Lowest Spread ENEPIG
Figure A5-1 Example of the Wetting Balance Coupon Sample Showing Evidence of High Contact
Used for the Testing of ENEPIG .................. 32 Angle and Dewetting for Some Areas of
Figure A5-2 XRF Measurements of Gold and the Printed Board ......................................... 45
Palladium Thicknesses Supplied Figure A6-7 Solder Spread Results for Pb-free Solder
as Nominal 0.1 micron Electroless Paste as a Function of the EN Layer
Palladium ..................................................... 33 Thickness in the ENEPIG Deposit ............... 46
Figure A5-3 XRF Measurements of Gold and Figure A7-1 Shear Test Coupon ...................................... 48
Palladium Thicknesses Supplied
as Nominal 0.2 micron Electroless Figure A7-2 DAGE 5000 Shear Test System .................. 49
Palladium ..................................................... 33 Figure A7-3 Solderball Shear Results ............................. 49
Figure A5-4 XRF Measurements of Gold and Figure A7-4 Sn63Pb37 Test Coupon 19 .......................... 52
Palladium Thicknesses Supplied
Figure A7-5 Sn63Pb37 Test Coupons 1 & 2 ................... 52
as Nominal 0.3 micron Electroless
Palladium ..................................................... 33 Figure A7-6 Sn63Pb37 Test Coupons 3 & 4 ................... 52

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Figure A7-7 Sn63Pb37 Test Coupons 5 & 6 ................... 53 Table 4-2 C=0 Sampling Plan (Sample Size for Specific
Figure A7-8 Sn63Pb37 Test Coupons 7 & 8 ................... 53 Index Value1) .................................................... 11

Figure A7-9 Sn63Pb37 Test Coupon 18 .......................... 53 Table A3-1 Comparison of the Accuracy of Measurements
Relative to the C Readings for All Three
Figure A7-10 Sn63Pb37 Test Coupon 19 .......................... 54 Deposits ........................................................... 21
Figure A7-11 SAC305 Test Coupons 1 & 2 ....................... 54 Table A4-1 Summary of XRF Configuration Solutions
Figure A7-12 SAC305 Test Coupons 3 & 4 ....................... 54 Offered for Measurement of ENEPIG
Plating on PCB’s with Advantages and
Figure A7-13 SAC305 Test Coupons 5 & 6 ....................... 55 Disadvantages ................................................. 27
Figure A7-14 SAC305 Test Coupons 16 & 17 ................... 55 Table A5-1 XRF Measurements of the Nominal
Figure A7-15 SAC305 Test Coupon 18 ............................. 55 0.5 micron Electroless Palladium
Figure A7-16 SAC305 Test Coupon 19 ............................. 56 Samples ........................................................... 32

Figure A7-17 Solderball Shear Force as a Function of Table A6-S1 Preconditioning and Solder Paste Matrix
Palladium Plating Thickness ........................ 56 Used for Solder Spread Testing for a
Given ENEPIG Chemistry and Electroless
Figure A8-1 Wire Bond Test Vehicle Showing pin #1, Palladium Thickness ........................................ 40
quadrants 1, 2, 3 and 4 ............................... 58
Table A7-1 Test Coupon Serial Number and Palladium
Figure A8-2 Example of 6 in x 8 in Panel Containing Thickness ......................................................... 48
1 in x 1in ENEPIG Wire Bond Coupons ...... 60
Table A7-2 Sn63Pb37 Solderball Shear Test Results
Figure A8-3 Visual Evaluation of Wire Bonding Coupon Set 1 (grams) ..................................... 50
Showing Classical Crescents Resulting
Table A7-3 Sn63Pb37 Solderball Shear Test Results
in Neck Breaks ............................................. 61
Coupon Set 2 (grams) ..................................... 50
Figure A8-4 (Top) Summary of 1 mil Gold Wire
Table A7-4 SAC305 Solderball Shear Test Results
ENEPIG Destructive Pull Test (DPT)
Coupon Set 1 (grams) ..................................... 51
Results and (Lower) Comparison of
X-Y Directional DPT Values ......................... 62 Table A7-5 SAC305 Solderball Shear Test Results
Coupon Set 2 (grams) ..................................... 51
Figure A11-1a Meniscometer ............................................... 70
Table A8-I Twenty-one Panels Marked (a) Whole
Figure A11-1b Wetting Balance ........................................... 70 Panel, (b) Array and (c) Hand Cut ................... 59
Figure A11-2 ENEPIG with Thin and Thick Pd from Table A8-II Destructive Wire Bond Pull Test Force
Vendors 1 & 2 .............................................. 71 (grams) Results for All 21 ENEPIG
Figure A11-3 Wetting Rate as a Function of Battelle Test Groups ..................................................... 60
Class 2 Aging ............................................... 72 Table A8-III Summary of Plating Finish Thicknesses for
Samples Wire Bonded ..................................... 63
Tables Table A9-1 XRF Detectors and Their Limitations at
Typical Count Rates ......................................... 64
Table 3-1 Requirements of Electroless Nickel Electroless
Table A11-1 ‘‘Relative Wettability Guideline,’’ Using
Palladium Immersion Gold (ENEPIG) Plating ... 4
Contact Angle (θC) As ‘‘General’’ Metric .......... 70
Table 4-1 Suggested Fabricator Qualification Plan ......... 10

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January 2013 IPC-4556

Specification for Electroless Nickel/Electroless Palladium/

Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

1 SCOPE

1.1 Statement of Scope This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/
Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification sets requirements for ENEPIG deposit
thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical
suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers
(OEM).

1.2 Description ENEPIG is a tertiary layered surface finish plated over copper as the basis metal. ENEPIG consists of an
electroless nickel base layer over which is plated an electroless palladium barrier layer followed by a deposit of a thin
immersion gold as the final outer layer. For deposition process details, see APPENDIX 1 of this specification. It is a multi-
functional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the
mating surface for soft membrane and steel dome contacts. Additional applications include use in Low Insertion Force (LIF)
and Zero Insertion Force (ZIF) edge connectors and for press-fit applications. The electroless palladium layer forms a dif-
fusion barrier that impedes nickel diffusion to the gold surface. The immersion gold protects the palladium layer from react-
ing with contaminants prior to processing that might otherwise affect joining processes, such as wire bonding and soldering.

1.2.1 Electroless Nickel Reducing Agents - Phosphorus Content Phosphorus-containing, reducing agents are typically
used for the reduction of the electroless nickel during the deposition process and phosphorus is incorporated in the nickel
deposit. The level of this co-deposited element should be controlled within the suppliers specified process limits. Variation of
phosphorus levels outside the specified process limits may have adverse effects on the performance of the finish.

1.2.2 Electroless Palladium Reducing Agents There are two distinct classes of reducing agents used in electroless pal-
ladium baths currently available for use in the ENEPIG process, those that produce deposits that contain a co-deposited ele-
ment such as phosphorus, and those that produce an essentially pure palladium deposit. The level of the co-deposited ele-
ments should be controlled within the specified process limits. Examples of electroless palladium deposit from both these
classes have been evaluated during the development of this specification and no perceivable differences in performance were
observed in the tests of solderability or wire bondability

1.3 Objective This specification sets the requirements for ENEPIG as a surface finish (see Table 3-1 for a summary of
these requirements). As additional surface finishes require specifications, they will be addressed by the IPC Plating Processes
Subcommittee as part of the IPC-455X specification family. This and other surface finish specifications are under continuous
review. The 4-14 subcommittee will make appropriate amendments or revisions to these documents as required. The 4-14
Plating Processes Subcommittee undertook a ‘‘Round Robin’’ study to generate data to support the recommendations sited
for the various aspects of this specification. For an outline of the study, refer to APPENDIX 2.

1.3.1 Order of Precedence In the event of conflict, the following order of precedence shall apply:
1. The purchase order. This includes AABUS exceptions to this specification.
2. The master drawing. This includes AABUS exceptions to this specification.
3. This specification.
4. Applicable documents as detailed in Section 2 of this document.

[Link] Appendices This specification contains eleven Appendices provided for information which are included after the
main body of this document. Be aware that none of the content of these appendices are binding requirements unless sepa-
rately and specifically specified herein, or as required by purchase order, master drawing, other applicable documents, or as
established AABUS.
1.4 Performance Functions

1.4.1 Solderability One of the two primary functions of ENEPIG is to provide a solderable surface finish capable of pro-
viding IPC Category 3 shelf life (minimum 12 months) per IPC-J-STD-003 testing. This shelf life is suitable for all surface
mount, hybrid and through-hole assembly applications. The use of electroless palladium as a diffusion barrier between the