Dell EMC PowerEdge

C6400 and C6420 Technical Guide

Regulatory Model: Regulatory Model: E68S

Regulatory Type: Regulatory Type: E68S001
Nov 2022
Rev. A07
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

Copyright © 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents

Tables........................................................................................................................................... 5

Figures.......................................................................................................................................... 7

Chapter 1: System overview.......................................................................................................... 8

Introduction...........................................................................................................................................................................8
New technologies................................................................................................................................................................ 8

Chapter 2: System features......................................................................................................... 10

Comparison of PowerEdge systems..............................................................................................................................10
Specifications.......................................................................................................................................................................11

Chapter 3: Chassis views and features......................................................................................... 13

Chassis views...................................................................................................................................................................... 13
Back view....................................................................................................................................................................... 14
Accessing system information by using QRL.............................................................................................................. 16
Security features................................................................................................................................................................16

Chapter 4: Processor................................................................................................................... 17
Processor Features............................................................................................................................................................17
Supported processors.......................................................................................................................................................18
Processor installation....................................................................................................................................................... 20
Processor configurations.................................................................................................................................................20
Chipset..................................................................................................................................................................................21

Chapter 5: Memory..................................................................................................................... 22

Chapter 6: Storage...................................................................................................................... 23
Supported drives............................................................................................................................................................... 23
RAID Configurations......................................................................................................................................................... 30
Internal storage..................................................................................................................................................................30
Lifecycle Controller 3.0...............................................................................................................................................31
Optical Drives......................................................................................................................................................................31
Tape drive............................................................................................................................................................................ 31

Chapter 7: Networking and PCIe..................................................................................................32

Network card options.......................................................................................................................................................32
PCIe expansion cards....................................................................................................................................................... 32

Chapter 8: Power, Thermal, and Acoustics.................................................................................. 34

Power consumption and energy efficiency................................................................................................................. 34
Power supply units............................................................................................................................................................35
Thermal and Acoustics.....................................................................................................................................................35
Thermal design............................................................................................................................................................. 35

Contents 3
 Acoustical design......................................................................................................................................................... 36
Inlet temperature guidelines and requirements..........................................................................................................36

Chapter 9: Rack rails systems..................................................................................................... 57

Chapter 10: Operating systems and virtualization........................................................................58

Supported operating systems........................................................................................................................................ 58
Supported virtualization.................................................................................................................................................. 58

Chapter 11: Dell EMC OpenManage systems management............................................................59

OpenManage systems management............................................................................................................................ 60
iDRAC9 with Lifecycle Controller..................................................................................................................................60
Agent-free management................................................................................................................................................. 63
Agent-based management.............................................................................................................................................. 63
Dell EMC consoles.............................................................................................................................................................63
Automation Enablers........................................................................................................................................................ 63
Integration with third-party consoles...........................................................................................................................63
Connections for third-party consoles.......................................................................................................................... 64
Dell EMC server management operations...................................................................................................................64

Chapter 12: Appendix A. Additional specifications....................................................................... 66

Chassis dimensions........................................................................................................................................................... 66
Power supply specifications............................................................................................................................................67
Environmental specifications.......................................................................................................................................... 67
Video specifications.......................................................................................................................................................... 67
USB peripherals................................................................................................................................................................. 68
PCIe card dimensions....................................................................................................................................................... 68

Chapter 13: Appendix B. Standards compliance........................................................................... 69

Chapter 14: Appendix C Additional resources...............................................................................70

Chapter 15: Appendix D. Support and Deployment Services .........................................................71

Server Deployment Services........................................................................................................................................... 71
Remote Consulting Services............................................................................................................................................71
Data Migration Service...............................................................................................................................................72
ProSupport Enterprise Suite...........................................................................................................................................72
ProSupport Plus........................................................................................................................................................... 72
ProSupport.................................................................................................................................................................... 73
ProSupport Flex for Data Center.............................................................................................................................73
Additional professional services..................................................................................................................................... 73
Dell EMC Education Services................................................................................................................................... 73
Dell EMC Global Infrastructure Consulting Services...........................................................................................74
Dell EMC managed services......................................................................................................................................74

4 Contents
 Tables

1 New technologies.......................................................................................................................................................8
2 PowerEdge C6320 and C6420 product Comparison...................................................................................... 10
3 Technical Specifications.......................................................................................................................................... 11
4 Back panel features................................................................................................................................................. 14
5 Security features...................................................................................................................................................... 16
6 Processor Features.................................................................................................................................................. 17
7 Supported processors............................................................................................................................................. 18
8 Fabric SKUs...............................................................................................................................................................20
9 Allowed Mixed Processor Configurations.......................................................................................................... 20
10 Memory technologies supported......................................................................................................................... 22
11 DIMMs supported.................................................................................................................................................... 22
12 Supported NVMe Drives........................................................................................................................................ 23
13 Supported Solid State Drives (SSDs)................................................................................................................. 23
14 Supported 2.5" Hard Disk Drives (HDDs)..........................................................................................................26
15 Supported 3.5" Hard Disk Drives (HDDs)..........................................................................................................28
16 Supported RAID Levels.......................................................................................................................................... 30
17 Mezzanine and Daughtercard Options............................................................................................................... 32
18 Supported expansion cards................................................................................................................................... 32
19 Power tools and technologies...............................................................................................................................34
20 Acoustical reference points and output comparisons.....................................................................................36
21 Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds
with Dual Processors.............................................................................................................................................. 36
22 Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds
with Single Processor............................................................................................................................................. 42
23 Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute............................................................. 45
24 Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute............................................................. 50
25 Configuration Restrictions with Mellanox ConnectX-4 EDR Dual Port Card with Active
(Optical) connectivity.............................................................................................................................................56
26 Rail adjustability range............................................................................................................................................ 57
27 Supported operating systems...............................................................................................................................58
28 Supported virtualization......................................................................................................................................... 58
29 Feature comparison for Dell EMC BMC and iDRAC9 Enterprise.................................................................60
30 One-to-one and one-to-many operations..........................................................................................................64
31 Chassis Dimensions (mm)......................................................................................................................................66
32 Chassis weight..........................................................................................................................................................67
33 Power supply specifications.................................................................................................................................. 67
34 Supported video resolution options.....................................................................................................................67
35 PCIe card dimensions............................................................................................................................................. 68

Tables 5
 36 Industry standard documents............................................................................................................................... 69
37 Additional resources................................................................................................................................................ 70
38 Server deployment capabilities..............................................................................................................................71

6 Tables
 Figures

1 Front panel features and indicators of the 24 x 2.5 inch hard drive enclosure........................................ 13
2 Front panel features and indicators of the 12 x 3.5 inch hard drive enclosure......................................... 13
3 System sled enumeration........................................................................................................................................14
4 Back view of the PowerEdge C6420 sled.......................................................................................................... 14
5 M.2 Boot Device Riser............................................................................................................................................30
6 M.2 Boot Device installed in buried x16 PCIe slot........................................................................................... 30
7 M.2 Boot drive SATA cabling.................................................................................................................................31
8 Static rail.................................................................................................................................................................... 57
9 Dell EMC OpenManage Portfolio......................................................................................................................... 59
10 Systems management server lifecycle............................................................................................................... 64
11 Chassis dimensions..................................................................................................................................................66
12 ProSupport Enterprise Suite................................................................................................................................. 72
13 ProSupport Enterprise Suite comparison...........................................................................................................73

Figures 7
 1
System overview
Topics:
• Introduction
• New technologies

Introduction
The PowerEdge C6400 is an ultra-dense, 2U enclosure that supports up to four independent (C6420), hot-swappable two-
socket (2S) sleds.
The system (C6400 and C6420) is optimized for the most demanding workloads, such as:
● High performance computing (HPC)
● High Performance Data Analytics (HPDA)
● Analytics and Big Data
● Web 2.0
● Web scale applications, SaaS, and IaaS
● Software defined storage
● Private cloud
● Financial Analysis and High Frequency Trading (HFT)
● Hyper Converged Infrastructure (HCI), vSAN
With flexible configurations and hyper-scale capabilities, the system is the ideal choice for hyper-converged infrastructures
including validated, pre-bundled Dell EMC HPC solutions, VxRail and VxRack and the Dell EMC XC Series.
The system offers the following features:
● Latest generation of Intel ® Xeon ® processors with up to 205W processors and 28 cores per processor.
● Supports up to 512 GB memory per node.
● Offers flexible I/O options including, low-latency InfiniBand ™ and next-generation Intel Omni-Path.
● Provides new Direct Contact Liquid Cooling options for improved power efficiency and thermal efficiency.

New technologies
Table 1. New technologies
New technology Detailed description
Intel ® Xeon ® processor series The processor product family has embedded PCIe lanes for
improved I/O performance. For details, see the Processor
section.
Intel C621 series chipset The system uses the Intel 620 family of Platform Controller
Hub (PCH).
2666 MT/s 16x DDR4 memory, 3200 MT/s 16x DDR4 memory The processor product family supports 2666 MT/s memory
and 3200 MT/s memory. The system supports ECC DDR4
(RDIMM/LRDIMM). For details, see the Memory section.
iDRAC9 with Lifecycle Controller The new embedded systems management solution for Dell
EMC servers features hardware and firmware inventory and
in-depth memory alerting, data center level power monitoring,
faster performance and many more features. For details, see
the Dell EMC OpenManage systems management section.

8 System overview
Table 1. New technologies (continued)
New technology Detailed description
USB 3.0 USB 3.0 can operate in both USB 2.0 and USB 3.0 speed
modes. USB 3.0 driver is required to control USB device in
USB 3.0 speed mode.
Micro USB 1x micro USB CONN type-AB for iDRAC direct.
miniDP video Digital video with smaller connector to improve thermals at
the exit.
M.2 Internal SATA boot, Larger capacity (upto 240 G).
Native fabric support from INTEL Omnipath direct from CPU.

System overview 9
 2
System features
Compared to previous generations, C6420 offers faster processing power and advanced system management.
Topics:
• Comparison of PowerEdge systems
• Specifications

Comparison of PowerEdge systems

The following table compares some of the features of the PowerEdge C6320 with PowerEdge C6420.

Table 2. PowerEdge C6320 and C6420 product Comparison

Feature PowerEdge C6320 PowerEdge C6420
Processor Intel Xeon E5-2600v3 and v4 Series Intel XeonScalable Family Processor
Series
Front Side Bus Intel QuickPath Interconnect (QPI) Intel Ultra Path Interconnect (UPI)
Sockets 2 2
Cores 4, 6, 8, 10, 12, 14, 16, 18, 20, 22 core 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 28 core
L2/L3 Cache 10 MB, 15 MB, 20 MB, 25 MB, 30 MB, 8, 11, 16, 16.5, 19, 19.25, 22, 27 20, 22,
35 MB, 40 MB, or 45 MB 24.75. 25, 2730, 33, 36, or 38MB
Chipset Intel C612 chipset Intel C621 Chipset
DIMMs 16 x DDR4 1600MHz/1866/2133MHz/ 16 x DDR4 2666 MT/s
2400MHz
Min/Max RAM 4GB / 512GB 8GB/1024GB
Hard Drive Bays 4-node: Up to 6 x 2.5-in. or 3 x 3.5-in. 4-node: Up to 6 x 2.5-in. or 3 x 3.5-in.
hot-swap HDDs hot-swap HDDs
Hard Drive Types SAS/SATA SAS/SATA/NVMe
External Drive Bay None None
Internal Boot Drive SATA DOM (64GB) or 1.8" SSD options 1 x 120/240GB M.2 Boot Drive
2 x 120/240GB M.2 Boot Drives in RAID
1

Embedded Hard Drive Controller Chipset-based SATA Chipset-based SATA

Optional Storage Controller NON-RAID: Intel C612 RAID: All @ 6Gbs NON-RAID: Intel C621, HBA330 RAID:
- LSI 2008 Mezzanine, PERC H330, PERC H330, PERC H730p Mezz,
PERC H730 HBA355e external PERC, and S140
SWRAID
Availability Hot-plug HDD and PSU; Redundant PSU Hot-plug HDD and PSU; Fault Tolerant
Redundant PSU
Server Management iDRAC8 (Express, Enterprise) editions BMC (including virtual media and
console), iDRAC9 Enterprise

10 System features
Table 2. PowerEdge C6320 and C6420 product Comparison (continued)
Feature PowerEdge C6320 PowerEdge C6420
I/O Slots 1U sled: One x PCIe x16 Gen3 (half One x16 PCIe Gen3 riser (low profile,
height, half length)+ One x PCIe x8 half height and half length)+ One x8
Gen3 (mezzanine) PCIe Gen3 Mezzanine (for storage
controller)+ One x16 PCIe Gen3 OCP
Mezzanine (for network controller)+
One x16 PCIe Gen3 riser (for M.2 Boot
Device)
NIC/LOM 2x Intel® 82599ES 10GbE (SFP+) 1 x 1 Gb Ethernet RJ45.
Multiplexed between LOM and dedicated
system management ports.

USB 1 rear per server 2 x USB 3.0 ports per C6420

Power Supplies Hot-Swap Redundant, 1400W (80+ Hot-Swap Fault Tolerant Redundant
Platinum) Redundant, 1600W (80+ 2600W/1600W (Titanium),Fault Tolerant
Platinum) (200~240VAC or 240VDC) Redundant 2600W/1600W (80+
Platinum), Fault Tolerant Redundant
2000W/2400W (200~240VAC or
240VDC)
Fans 4 x 60 mm, Non-redundant, non-hot 4x60 mm dual rotor redundant, non-hot
Swappable swappble fans
Form Factor 2U Rack 2U Rack
Dimension (HxWxD) 87 mm x 448 mm x 790 cm 86.8 mm x 448 mm x 790 mm
Weight Max: 41 Kg (90.4 lbs) 24 x 2.5 HDD chassis - 41.6 Kg /
91.71232 lb
12 x 3.5 HDD chassis - 43.62 Kg /
96.1656 lb
No Backplane - 34.56 Kg / 76.1917 lb

Specifications
Table 3. Technical Specifications
Feature PowerEdge C6400 and C6420 technical specification
Form factor Up to four 2-socket C6420 servers per C6400 chassis
Processor Intel ® Xeon ® E5- 2600 Scalable family series + Fabric SKU in
each of the four independent sleds
Chipset Intel C621 chipset
Memory 16 x DDR4 RDIMM (2677 MT/s); 4 slots capable of Apache
Pass (AEP) DIMM, DDR4 RDIMM (3200 MT/s)
I/O slots ● 1 x16 PCIe Gen 3 LP HH riser slot
● 1 x16 OCP Mezz slot (for network controller)
● 1 x8 Mezz slot (for storage controller)
● 1 x16 PCIe Gen 3 buried slot (for M.2 Boot device)
I/O adapter options ● 1 Gb Ethernet
● 10/25/40/100Gb Ethernet
● InfiniBand
● Omni-Path
C6400 Chassis Configurations ● No backplane chassis

System features 11
Table 3. Technical Specifications (continued)
Feature PowerEdge C6400 and C6420 technical specification
● 24 x 2.5 inch SAS/SATA drives with up to six drives per
sled
● 24 x 25 inch SAS/SATA drives with Expander Backplane
with either four sleds each with six 2.5 inch drives or two
sleds each with 12 2.5 inch drives
● 24 x 2.5 inch drives with up to two NVMe drives and four
SAS/SATA drives per sled
● 12 x 3.5 inch drives with up to three drives per sled
Operating systems ● Microsoft Windows Server 2012 R2
● Microsoft Windows Server 2016
● Novell SuSE Linux Enterprise Server 11 (with PLDP) SP4
x86_64
● Novell SuSE Linux Enterprise Server 12 SP2 x86_64
● RedHat Enterprise Linux 7.3 Server x86_64
● Ubuntu 16.04 LTS
Virtualization options:
● Citrix Xen Server 7.1.x
● VMWare vSphere 2016 U1 (ESXi 6.5 U1)
● VMWare vSphere 2015 U3 (ESXi 6.0 U3)

Storage Controllers ● S140 Software RAID

● PERC H330 x8 Mezz Card
● PERC H730p x8 Mezz Card
● SAS HBA330
● 12 Gb SAS HBA x16 PCIe Adapter
● HBA355e HBA: External adapter x8 Low Profile
Embedded NIC Intel i350 1 GbE (single port)
Power supplies ● Dual hot-plug non-redundant high-efficiency 1600W PSU
● Dual hot-plug fault tolerant redundant high-efficiency
1600W/2000W/2400W PSUs
● 2600 W PSU (supported only on Dell EMC PowerEdge
C6525 and Dell EMC PowerEdge C6520 sleds)
Availability ● Hot-plug hard drives
● Hot-plug redundant power
● ECC memory
● Single device data correction (SDDC)
● Dual Rotor redundant fans
Systems management ● BMC or iDRAC9 Enterprise with 1 x 1Gbps RJ45 connector
● Intel Node Manager 3.0 compliant
Chassis Dimensions ● Height: 86.8 mm (3.41 in)
● width: 448 mm (17.63 in)
● Chassis depth: 797 mm (31.3 cm)
Recommended support Dell EMC ProSupport Plus for critical systems or Dell EMC
ProSupport for premium hardware and software support
for your PowerEdge solution. Consulting and deployment
offerings are also available. Contact your Dell representative
today for more information. Availability and terms of Dell
Services vary by region. For more information, visit [Link]/
ServiceDescriptions .

12 System features
 3
Chassis views and features
The C6400 chassis is an ultra-dense 2U enclosure that supports up to four independent two-socket (2S) sleds connected to a
direct backplane.
Topics:
• Chassis views
• Accessing system information by using QRL
• Security features

Chassis views
Front panel view and features
The C6400 chassis offers four sled options.

Figure 1. Front panel features and indicators of the 24 x 2.5 inch hard drive enclosure
1. left control panel 2. drive bay
3. right control panel 4. information tag

Figure 2. Front panel features and indicators of the 12 x 3.5 inch hard drive enclosure
1. left control panel 2. drive bay
3. right control panel 4. information tag

Chassis views and features 13

System sled enumeration
The enumeration for the motherboards is:

Figure 3. System sled enumeration

1U sled are shipped from the factory in:

● 1- node, 2- node, 3- node, and 4- node configurations only with 2.5 inch backplanes, 2.5 inch with NVMe backplanes and 3.5
inch backplanes.
○ Only 1- node, and 3-node applies to the 2.5 inch expander backplane.
● The empty slots in 1- node, 2- node, and 3- node configurations are filled with the dummy or blank sleds.

Back view

Figure 4. Back view of the PowerEdge C6420 sled

Table 4. Back panel features

Item Indicator, button, or Icon Description
connector
1 mezzanine card slot N/A Enables you to connect
mezzanine expansion cards.
For more information, see
the Technical specifications
section.

2 sled release handle N/A Enables you to remove the

sled from the enclosure.

3 Low Profile PCIe card slot N/A Enables you to connect

PCI Express expansion cards.
For more information, see

14 Chassis views and features

Table 4. Back panel features (continued)
Item Indicator, button, or Icon Description
connector

the Technical specifications

section.

4 sled release lock N/A Enables you to remove the

sled from the enclosure.

5 rear power button N/A Enables you to power on the

sled while accessing it from
the rear.

6 iDRAC or NIC port Enables you to remotely

access iDRAC. For
more information, see
the iDRAC User’s
Guide at [Link]/
poweredgemanuals.

7 mini display port Enables you to connect a

display device to the system.
For more information, see
the Technical specifications
section.
8 iDRAC Direct micro USB port Enables you to connect a
portable device to the sled.

9 OCP or OPA card slot N/A Enables you to connect

Open Compute Project (OCP)
or Omni-Path Architecture
(OPA) expansion cards.
For more information, see
the Technical specifications
section.

10 EST pull out tab N/A This tab has the unique
Express Service Code,
Service Tag, and MAC
address labels.
11 system id indicator and button The System Identification
(ID) button is available on
the front and back of the
systems. Press the button to
identify a system in a rack
by turning on the system ID
button. You can also use the
system ID button to reset
iDRAC and to access BIOS
using the step through mode.

12 USB 3.0 port (2) The USB ports are 9-pin and
3.0-compliant. These ports
enable you to connect USB
devices to the system.

Chassis views and features 15

Accessing system information by using QRL
You can use the Quick Resource Locator (QRL) to get immediate access to the information about your system. The QRL is
located on the top of the system cover and provides access to generic information about your system. If you want to access
information specific to the system service tag, such as configuration and warranty, you can access QR code located on the
system Information tag.
Ensure that your smart phone or tablet has the QR code scanner installed.
The QRL includes the following information about your system:
● How-to videos
● Reference materials, including the Owner’s Manual and mechanical overview
● A direct link to Dell to contact technical assistance and sales teams
1. Go to [Link]/QRL and navigate to your specific product or
2. Use your smart phone or tablet to scan the model-specific Quick Resource (QR) code on your PowerEdge system or in the
Quick Resource Locator section.

Security features
The latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data center.
List of the security features:
● PowerEdge Secure Boot
● System Erase
● System Lockdown
● Drift Detection
● BIOS and OS Recovery
● Active Directory/LDAP
● two-factor authentication (TFA)
● SSH with Public Key Authentication (PKA)
● TLS 1.2
● SNMP v3
● Self-Encrypting and Instant Secure Erase (ISE) Drives

Table 5. Security features

Security feature Description
Power-off security BIOS has the ability to disable the power button function.
Secure mode BIOS has the ability to enter a secure boot mode via Setup.
This mode includes the option to lock out the power and NMI
switches on the Control Panel or set up a system password.

16 Chassis views and features

 4
Processor
Intel Xeon processor
The C6420 sled supports up to two Intel Xeon E5- 2600 or 2600 F product family processors in each of the four independent
sleds. Each processor supports up to 28 cores.
Topics:
• Processor Features
• Supported processors
• Processor installation
• Processor configurations
• Chipset

Processor Features
Based on Intel's 14nm fabrication technology, the Intel ® Xeon ® processor family introduced a new micro-architecture that
provides significant performance advantages and new features targeted for a range of workloads such as: High Performance
Computing (HPC), Enterprise applications, Cloud service providers, storage, network applications, Internet of Things (IoT), and
many more. The following table summarizes key features of the processor family.

Table 6. Processor Features

Category Feature Function
Compute Additional Cores Up to 28C
Intel ® AVX-512 512-bit instructions
MLC Optimization Acceleration of enterprise-class and
HPC workloads
Heterogeneous support with converged
programming environment
Higher 'private-local' ratio in cache
Lower power
Intel ® Ultra Path Interconnect (UPI) Increases bandwidth: up to 10.4 GT/s
(replaces QPI)
Memory & Security Memory Capacity and Bandwidth Up to DDR4 2666 MHz (11% increase)
increase
Up to 6 channels (50% increase)
MPX (Memory Protection Extensions) Prevents buffer overflow
I/O Fabric Integration On package integration of next-
generation Intel® Omni-Path Fabric
controller
PCIe Bandwidth Up to 48 PCIe lanes; 3.0 speed 79 GB/s
bi-directional pipeline (from 53 GB/s on
BDW)
Separate Reference with Independent Eliminates clock in PCIe cables
Spread Spectrum Clocking (SRIS)

Processor 17
Table 6. Processor Features (continued)
Category Feature Function
MCTP Scaling 256 PCIe buses, up to 8 segments
Storage Non-Transparent Bridge (NTB) 3 full-duplex NTBs and 32 MSI-X vectors
Enhancements
Crystal Beach DMA (CBDMA) Adds MMIO -> mem transfer support
2X performance increase vs. prior gen
platform
Intel ® Volume Management Device Manages CPU attached PCIe NVMe
(Intel ® VMD) SSDs: Provides robust hot-plug
capability
Enclosure Management and Error
isolation

Supported processors
The system supports the following processors:

Table 7. Supported processors

SKU Class Frequency (GHz) Number of Cores TDP Watts

8176 Platinum 2.1 28 165

8176M Platinum 2.1 28 165

8170M Platinum 2.1 26 165

8170 Platinum 2.1 26 165

8164 Platinum 2 26 150

8160M Platinum 2.1 24 150

8160 Platinum 2.1 24 150

8153 Platinum 2 16 125

6152 Gold 2.1 22 140

6138 Gold 2 20 125

6140M Gold 2.3 18 140

6140 Gold 2.3 18 140

6130 Gold 2.1 16 135

5120 Gold 2.2 14 105

5118 Gold 2.3 12 105

5115 Gold 2.4 10 85

4116 Silver 2.1 12 85

18 Processor
Table 7. Supported processors (continued)
SKU Class Frequency (GHz) Number of Cores TDP Watts

4114 Silver 2.2 10 85

4112 Silver 2.6 4 85

4110 Silver 2.1 8 85

4108 Silver 1.8 8 85

3106 Bronze 1.7 8 85

3104 Bronze 1.7 6 85

8180 Platinum 2.5 28 205

8180M Platinum 2.5 28 205

8176M Platinum 2.1 28 165

8168 Platinum 2.7 24 205

8158 Platinum 3 12 150

8156 Platinum 3.6 4 105

6148 Gold 2.4 20 150

6154 Gold 3 18 200

6150 Gold 2.7 18 165

6142 Gold 2.6 16 150

6132 Gold 2.6 14 140

6146 Gold 12

6136 Gold 3 12 150

6126 Gold 2.6 12 125

6144 Gold 8

6134 Gold 3.2 8 130

6128 Gold 3.4 6 115

5122 Gold 3.6 4 105

8176F Platinum 2.1 28 173

8160F Platinum 2.1 24 160

6138F Platinum 2 20 135

6130F Platinum 2.1 16 135

6148F Gold 20 2.4 160

Processor 19
Table 7. Supported processors (continued)
SKU Class Frequency (GHz) Number of Cores TDP Watts

6142F Gold 16 2.6 160

6126F Gold 12 2.6 135

Processor installation
For processor installation instructions see the Dell EMC PowerEdge C6420 Installation and Service Manual.

Processor configurations
The system offers the following processor configurations:
● Non Fabric Processor Configuration — The system is available in single and dual non Fabric processor configurations. In
the dual non Fabric processor configuration, both the processors should match.
● Omni-Path Fabric Processor Configuration — The system is available in dual Omni-Path Fabric processors. The
following table lists the available Stock Keeping Units (SKUs):

Table 8. Fabric SKUs

Type SKU
Fabric 8176F
Fabric 8160F
Fabric 6138F
Fabric 6130F
Fabric/Frequency Optimized 6148F
Fabric/Frequency Optimized 6142F
Fabric/Frequency Optimized 6126F

NOTE:
○ Single processor configuration using an Omni-Path fabric CPU is not a supported configuration.
○ When an Omni-Path fabric CPU is configured, the C6420 compute sled cannot be configured with the OCP Mezz
card. So, for additional networking, the x16 PCIe LP slot must be used.
● Fabric and Non-Fabric Mixed Processor Configurations — The system can be configured to have one non-fabric
CPU and one Omni-Path fabric CPU. The following table shows the allowed CPU SKUs for mixing fabric and non-fabric
processors:

Table 9. Allowed Mixed Processor Configurations

SKU for CPU1 Allowed SKU for CPU2
6126 12C 2.6GHz 125W 6126F 12C 2.6GHz 135W
6130 16C 2.1GHz 125W 6130F 16C 2.1GHz 135W
6138 20C 2.0GHz 125W 6138F 20C 2.0GHz 135W
6142 16C 2.6GHz 150W 6162F 16C 2.6GHz 160W
6148 20C 2.4GHz 150W 4148F 20C 2.4GHz 160W
8160 24C 2.1GHz 150W 8160F 24C 2.1GHz 160W
8176 28C 2.1GHz 165W 8176F 28C 2.1GHz 173W

20 Processor
 NOTE:
○ In mixed fabric and non-fabric CPU configurations, CPU2 will be always populated with an Omni-Path fabric CPU.
○ When an Omni-Path fabric CPU is configured, the C6420 compute sled cannot be configured with the OCP Mezz
card. So, for additional networking, the x16 PCIe LP slot must be used.

Chipset
The C6400 and C6420 uses the Intel C620 chipset. For more information, visit [Link].

Processor 21
 5
Memory
The system supports up to 512 GB of memory and speeds up to 3200 MT/s, providing high performance in a variety of
applications. High memory density means there is no compromise when it comes to virtualization.
The system supports both registered DIMMs (RDIMM) and load-reduced DIMMs (LRDIMMs). Unbuffered DIMMs (UDIMMs) are
not supported.

DIMMs supported
Table 10. Memory technologies supported
Feature RDIMM LRDIMM
Register Yes Yes
Buffer No No
Frequencies Up to 2666 MT/s Up to 2666 MT/s
Ranks supported Single or dual rank Dual Rank
Capacity per DIMM Upto 32GB Upto 64 GB
Maximum DIMMs per channel per 2 2
sled
DRAM technology x4 or x8 x4
Error Correction Code (ECC) Yes Yes

The C6420 supports the following DIMMs. For the latest information on supported memory, visit the C6420 page on [Link].

Table 11. DIMMs supported.

DIMM Capacity DIMM Speed DIMM Type Ranks Per DIMM Data width Voltage (V)
8 GB 2666 MT/s RDIMM Single Rank x8 1.2
16 GB 2666 MT/s RDIMM Dual Rank x8 1.2
32 GB 2666 MT/s RDIMM Dual Rank x4 1.2
32 GB 3200 MT/s RDIMM Dual Rank x8 1.2
64 GB 2666 MT/s LRDIMM Dual Rank x4 1.2

NOTE: The older 32 GB capacity RDIMM memory with x4 data width and 8Gb DRAM density cannot be mixed with the
newer 32GB capacity RDIMM memory with x8 data width and 16Gb DRAM density in the same AMD EPYC™ processor unit.

22 Memory
 6
Storage
The system enables multiple storage configurations to tune the system configuration for a wide variety of workloads. The C6400
chassis is available in the following configuration types:
● No hard drives in a No-Backplane Configuration
● 24 x 2.5" Direct Backplane configuration with up to 6 SAS/SATA drives per node
● 24 x 2.5" Expander Backplane configuration with up to 12 SAS/SATA drives per node and two nodes per chassis
● 24 x 2.5" NVMe Backplane configuration with up to 6 drives per node out of which two drives can be NVMe drives
● 12 x 3.5" Direct Backplane configuration with up to 3 SAS/SATA drives per node
Topics:
• Supported drives
• RAID Configurations
• Internal storage
• Optical Drives
• Tape drive

Supported drives
The system supports the following drives:

Table 12. Supported NVMe Drives

Vendor Description Capacity Type Interface
Samsung SSDR, 1.6T, NVME, PCIE, 2.5, 1.6TB MU PCIe
PM1725
Samsung SSDR, 1.6T, NVME, PCIE, 2.5, 1.6TB MU PCIe
PM1725A
Samsung SSDR, 3.2, NVME, PCIE, 2.5, 3.2TB MU PCIe
PM1725A
Samsung SSDR, 3.2, NVME, PCIE, 2.5, 3.2TB MU PCIe
PM1725
Samsung SSDR, 800G, NVME, PCIE, 800GB MU PCIe
2.5, PM1725
Samsung SSDR, 800G, NVME, PCIE, 800GB MU PCIe
2.5, PM1725A

Table 13. Supported Solid State Drives (SSDs)

Vendor Description Capacity Type FIPS Interface

Intel Downieville S3520 120GB Boot No SATA

Boot, SSD, 6Gbps
SATA, 2.5, 512n,
ISE

Samsung SM863a MU, SSD, 960GB MU No SATA

6Gbps SATA, 2.5,
512n, ISE

Storage 23
Table 13. Supported Solid State Drives (SSDs) (continued)
Vendor Description Capacity Type FIPS Interface

TOS Phoenix M4 MU, 960GB MU No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Intel Haleyville S3610 800GB MU No SATA

MU (ND), SSD,
6Gbps SATA, 2.5,
512n, ISE

Samsung PM1635a MU, SSD, 800GB MU Yes SAS

12Gbps SAS, 2.5,
512e, FIPS-140

Samsung PM1635a MU, SSD, 800GB MU No SAS

12Gbps SAS, 2.5,
512e, ISE

Samsung SM863a MU, SSD, 480GB MU No SATA

6Gbps SATA, 2.5,
512n, ISE

TOS Phoenix M4 MU, 480GB MU No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Samsung PM1635a MU, SSD, 400GB MU No SAS

12Gbps SAS, 2.5,
512e, ISE

TOS Phoenix M3 MU, 400GB MU No SAS

SSD, 12Gbps SAS,
2.5, 512n

Samsung SM863a MU, SSD, 240GB MU No SATA

6Gbps SATA, 2.5,
512n, ISE

Samsung SM863a MU, SSD, 1.92TB MU No SATA

6Gbps SATA, 2.5,
512n, ISE

TOS Phoenix M4 MU, 1.92TB MU No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Samsung PM1635a MU, SSD, 1.6TB MU Yes SAS

12Gbps SAS, 2.5,
512e, FIPS-140

Samsung PM1635a MU, SSD, 1.6TB MU No SAS

12Gbps SAS, 2.5,
512e, ISE

Samsung PM863a RI, SSD, 960GB RI No SATA

6Gbps SATA, 2.5,
512n, ISE

24 Storage
Table 13. Supported Solid State Drives (SSDs) (continued)
Vendor Description Capacity Type FIPS Interface

Intel Downieville S3520 960GB RI No SATA

RI, SSD, 6Gbps
SATA, 2.5, 512n,
ISE

TOS Phoenix M4 RI, 960GB RI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Samsung PM1633a RI, SSD, 960GB RI No SAS

12Gbps SAS, 2.5,
512e, ISE

Intel Downieville S3520 800GB RI No SATA

RI, SSD, 6Gbps
SATA, 2.5, 512n,
ISE

Intel Downieville S3520 480GB RI No SATA

RI, SSD, 6Gbps
SATA, 2.5, 512n,
ISE

Samsung PM863a RI, SSD, 480GB RI No SATA

6Gbps SATA, 2.5,
512n, ISE

Samsung PM863a RI, SSD, 3.84TB RI No SATA

6Gbps SATA, 2.5,
512n, ISE

TOS Phoenix M4 RI, 3.84TB RI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Samsung PM1633a RI, SSD, 3.84TB RI No SAS

12Gbps SAS, 2.5,
512e, ISE

Samsung PM863a RI, SSD, 1.92TB RI No SATA

6Gbps SATA, 2.5,
512n, ISE

Samsung PM1633a RI, SSD, 1.92TB RI No SAS

12Gbps SAS, 2.5,
512e, ISE

TOS Phoenix M4 RI, 1.92TB RI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Intel Downieville S3520 1.6TB RI No SATA

RI, SSD, 6Gbps
SATA, 2.5, 512n,
ISE

TOS Phoenix M4 WI, 800GB WI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Storage 25
Table 13. Supported Solid State Drives (SSDs) (continued)
Vendor Description Capacity Type FIPS Interface

TOS Phoenix M4 WI, 400GB WI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

TOS Phoenix M3 WI, 400GB WI No SAS

SSD, 12Gbps SAS,
2.5, 512n

TOS Phoenix M4 WI, 1.6TB WI No SAS

SSD, 12Gbps SAS,
2.5, 512n, ISE

Table 14. Supported 2.5" Hard Disk Drives (HDDs)

Vendor Description Capacity Speed Interface

TOS AL13SX MLK, HDD, 300GB 15K SAS

12Gbps SAS, 2.5, 15K,
512n, ISE

STX Kestrel, HDD, 12Gbps 300GB 15K SAS

SAS, 2.5, 15K, 512n, ISE

STX Avenger, HDD, 12Gbps 2TB 7.2K SAS

SAS, 2.5, 7.2K, 512n,
FIPS-140

TOS AL14SE, HDD, 12Gbps 1.8TB 10K SAS

SAS, 2.5, 10K, 512e, ISE

HGST Cobra F, HDD, 12Gbps 600GB 10K SAS

SAS, 2.5, 10K, 512n, ISE

STX Avenger, HDD, 12Gbps 1TB 7.2K SAS

SAS, 2.5, 7.2K, 512n,
ISE

HGST King Cobra F, HDD, 300GB 15K SAS

12Gbps SAS, 2.5, 15K,
512n, ISE

TOS AL14SE-Lite, HDD, 1.2TB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

STX Kestrel TEC, HDD, 900GB 15K SAS

12Gbps SAS, 2.5, 15K,
512e, ISE

TX Kestrel, HDD, 12Gbps 900GB 15K SAS

SAS, 2.5, 15K, 512n, ISE

HGST Cobra F, HDD, 12Gbps 300GB 10K SAS

SAS, 2.5, 10K, 512n, ISE

STX Kestrel, HDD, 12Gbps 600GB 15K SAS

SAS, 2.5, 15K, 512n, ISE

26 Storage
Table 14. Supported 2.5" Hard Disk Drives (HDDs) (continued)
Vendor Description Capacity Speed Interface

STX Kestrel, HDD, 12Gbps 900GB 15K SAS

SAS, 2.5, 15K, 512n,
FIPS-140

STX Thunderbug, HDD, 600GB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

TX Thunderbug, HDD, 300GB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

STX Avenger, HDD, 12Gbps 2TB 7.2K SAS

SAS, 2.5, 7.2K, 512n,
ISE

STX Thunderbolt, HDD, 1.2TB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, FIPS-140

HGST Cobra F, HDD, 12Gbps 1.2TB 10K SAS

SAS, 2.5, 10K, 512n, ISE

STX Avenger, HDD, 12Gbps 2TB 7.2K SAS

SAS, 2.5, 7.2K, 4096n,
ISE

HGST King Cobra F, HDD, 600GB 15K SAS

12Gbps SAS, 2.5, 15K,
512n, ISE

TOS AL13SX MLK, HDD, 600GB 15K SAS

12Gbps SAS, 2.5, 15K,
512n, ISE

TOS AL14SE-Lite, HDD, 600GB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

STX Kestrel, HDD, 12Gbps 900GB 15K SAS

SAS, 2.5, 15K, 4096n,
ISE

STX Avenger, HDD, 6Gbps 1TB 7.2K SATA

SATA, 2.5, 7.2K, 512n,
ISE

STX Thunderbolt, HDD, 1.2TB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

STX Thunderbolt 2, HDD, 1.8TB 10K SAS

12Gbps SAS, 2.5, 10K,
512e, ISE

TOS AL14SE-Lite, HDD, 300GB 10K SAS

12Gbps SAS, 2.5, 10K,
512n, ISE

Storage 27
Table 14. Supported 2.5" Hard Disk Drives (HDDs) (continued)
Vendor Description Capacity Speed Interface

HGST King Cobra F, HDD, 600GB 15K SAS

12Gbps SAS, 2.5, 15K,
512n

Table 15. Supported 3.5" Hard Disk Drives (HDDs)

Vendor Description Capacity Speed Interface

STX Makara Plus, HDD, 8TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512e, ISE

STX Makara Plus, HDD, 8TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512e, FIPS-140

HGST Libra HE10, HDD, 8TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
4096n, ISE

HGST Libra HE10, HDD, 8TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512e, ISE

STX Makara Plus, HDD, 8TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
4096n, ISE

STX Makara Plus, HDD, 8TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512e, ISE

HGST Libra HE10, HDD, 8TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512e, ISE

TOS Tomcat R, HDD, 4TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

STX Makara BP, HDD, 4TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

HGST Aries K Plus, HDD, 4TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

STX Makara BP, HDD, 4TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, FIPS-140

STX Makara BP, HDD, 4TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

HGST Aries K Plus, HDD, 4TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

28 Storage
Table 15. Supported 3.5" Hard Disk Drives (HDDs) (continued)
Vendor Description Capacity Speed Interface

STX Makara BP, HDD, 2TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

HGST Aries K Plus, HDD, 2TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

TOS Tomcat R, HDD, 2TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

HGST Aries K Plus, HDD, 2TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

HGST Rainier MLK, HDD, 2TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

STX Nemo, HDD, 6Gbps 2TB 7.2K SATA

SATA, 3.5, 7.2K, 512n,
ISE

STX Makara BP, HDD, 2TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

STX Makara BP, HDD, 1TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512n, ISE

STX Nemo, HDD, 6Gbps 1TB 7.2K SATA

SATA, 3.5, 7.2K, 512n,
ISE

STX Makara BP, HDD, 1TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n

HGST Rainier MLK, HDD, 1TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512n, ISE

STX Tatsu, HDD, 12Gbps 10TB 7.2K SAS

SAS, 3.5, 7.2K, 512e,
ISE

HGST Libra HE10, HDD, 10TB 7.2K SAS

12Gbps SAS, 3.5, 7.2K,
512e, ISE

HGST Libra HE10, HDD, 10TB 7.2K SATA

6Gbps SATA, 3.5, 7.2K,
512e, ISE

STX Tatsu, HDD, 6Gbps 10TB 7.2K SATA

SATA, 3.5, 7.2K, 512e,
ISE

Storage 29
RAID Configurations
The system supports the following RAID configurations:

Table 16. Supported RAID Levels

Storage Controller Supported RAID Levels
Chipset SATA RAID 0, 1, 10, 5 (Software RAID Only)
PERC H330 Mezz RAID 0, 1, 5, 10, 50
PERC H730p Mezz RAID 0, 1, 5, 6, 10, 50, 60

NOTE: RAID using a PERC controller is not supported on NVMe drives

Internal storage
The C6420 introduces support for internal boot storage using the M.2 boot device. A single M.2 boot drive can be configured
for each C6420 node. The boot device uses a PCIe riser which, in turn uses the x16 PCIe buried riser. Note that the M.2 boot
device is not a PCIe devices, but a SATA device and connects to the SATA port.
M.2 Boot Storage
PowerEdge C6420 introduces support for internal boot storage using the M.2 boot device. A single M.2 boot drive can be
configured for each C6420 node. The boot device uses a PCIe riser which uses the x16 PCIe buried riser. Note that the M.2
boot device is not a PCIe devices, but a SATA device and connects to the SATA port. The available M.2 capacity is 120 GB.

Figure 5. M.2 Boot Device Riser

Figure 6. M.2 Boot Device installed in buried x16 PCIe slot

30 Storage
Figure 7. M.2 Boot drive SATA cabling

NOTE:
● The x16 PCIe riser used for M.2 device uses PCIe lanes from CPU2, hence C6420 configurations using an M.2 device
must have both CPUs populated.
● Currently support for dual M.2 devices in a RAID 1 configuration is not available.
MicroSD card storage
The PCI Express riser which is optional on the C6420 includes a MicroSD card reader slot. An SD card can be ordered and
installed in this slot to be used for storing an embedded hypervisor. SD cards with capacity of 16GB, 32GB and 64GB are
available on C6420.

Lifecycle Controller 3.0

For more information on LC 3.0, visit [Link]
lifecycle-controller-integration-for-configuration-manager

Optical Drives
The system does not support optical drives.

Tape drive
The system does not support an internal tape drive. External storage peripherals are not directly validated.

Storage 31
 7
Networking and PCIe
The C6400 and C6420 offers a choice of integrated, low latency I/O fabric (Omni-Path integrated on the CPU and in PCIe card
form factor, InfiniBand in a PCIe card form factor), for balanced processing that fuels performance acceleration.

NOTE: The C6420 does not support hot-swapping of PCIe cards.

Topics:
• Network card options
• PCIe expansion cards

Network card options

The system supports the following IO slots:

Table 17. Mezzanine and Daughtercard Options

Slot Description Standard Usage
x8 Mezz PCI-e Riser One x8 PCIe Gen3 for Mezz (x8 lanes) Storage Controller
x16 (x8+x8) OCP Mezz Riser X8 + X8 PCIe Gen3 for OCP Mezz (x16 Network card for host
lanes max)
x16 PCI-e Main Riser (plug-in) One x16 PCIe Gen3 for LP from CPU 1 Half Height Low Profile PCIe Adapter
(x16 lanes)
x16 buried PCI-e Riser One x16 PCIe Gen3 for specific form M.2 SATA Boot Device
factor (x16 lanes)

PCIe expansion cards

The system supports one PCIe card and one mezzanine card. There is no slot priority concern as the sled has a single PCIe slot.

Table 18. Supported expansion cards

Description Type Form Factor
Intel 1Gb Dual Port Ethernet LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Broadcom 1Gb Dual Port Ethernet LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Intel X710 Dual Port 10Gb SFP+ OCP Ethernet Open Compute Project (OCP) Mezzanine Card
Mezzanine Adapter
Intel Dual Port 10Gb SFP+ LP PCIe Adapter Ethernet Low Profile PCIe Adapter
Intel Dual Port 10Gb BASE-T LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Intel Quad Port 10Gb BASE-T LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Broadcom 57402 10Gb SFP+ LP PCIe Ethernet Low Profile PCIe Adapter
Adapter

32 Networking and PCIe

Table 18. Supported expansion cards (continued)
Broadcom 57406 10Gb BASE-T LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
SolarFlare SFN8002F Dual Port 10Gb SFP+ Ethernet Low Profile PCIe Adapter
LP PCIe Adapter
Mellanox 10Gb Dual Port ConnectX-3 LP Ethernet Low Profile PCIe Adapter
PCIe Adapter
Broadcom Dual Port 25Gbps SFP PCIe Ethernet Low Profile PCIe Adapter
Adapter
QLogic Dual Port 25Gbps SFP LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Mellanox Dual Port 25Gbps SFP LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Mellanox Dual Port 40Gbps QSFP LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Intel Dual Port 40Gbps QSFP LP PCIe Ethernet Low Profile PCIe Adapter
Adapter
Mellanox ConnectX-4 Dual Port 100Gb Ethernet Low Profile PCIe Adapter
QSFP28 LP PCIe Adapter
Mellanox ConnectX3 VPI QSFP+ Single Port InfiniBand Low Profile PCIe Adapter
FDR LP PCIe Adapter
Mellanox ConnectX-4 Single Port VPI InfiniBand Low Profile PCIe Adapter
QSFP28 EDR LP PCIe Adapter
Mellanox ConnectX-4 Dual Port VPI QSFP28 InfiniBand Low Profile PCIe Adapter
EDR LP PCIe Adapter
Intel Omni-Path Single Port Host Fabric OmniPath Low Profile PCIe Adapter
Adapter 100 Series LP PCIe Adapter
Samsung PM1725 1.6 TB NVMe Low Profile, Half Height, Half Length PCIe controller
cards
Samsung PM1725A 3.2 TB NVMe Low Profile, Half Height, Half Length PCIe controller
cards
Samsung PM1725 3.2 TB NVMe Low Profile, Half Height, Half Length PCIe controller
cards
Samsung PM1725A 1.6 TB NVMe Low Profile, Half Height, Half Length PCIe controller
cards

Networking and PCIe 33

 8
Power, Thermal, and Acoustics
The lower overall system-level power draw is a result of the breakthrough system design developed by Dell EMC. The system
aims to maximize performance per watt through a combination of energy efficient technologies, optimized thermal designs and
intelligent fan control algorithms. The system fan control algorithms use an extensive array of sensors that automatically monitor
power and thermal activity to minimize fan speeds based on system cooling requirements, reducing the power required for
cooling.
Topics:
• Power consumption and energy efficiency
• Power supply units
• Thermal and Acoustics
• Inlet temperature guidelines and requirements

Power consumption and energy efficiency

With the rise in the cost of energy that is coupled with increasing data center density, Dell EMC provides tools and technologies
to help you realize greater performance with lower energy cost and wastage. More efficient data center usage can reduce costs
by slowing the need for additional data center space. The following table lists the tools and technologies that Dell EMC offers to
help you achieve your data center goals by lowering power consumption and increasing energy efficiency.

Table 19. Power tools and technologies

Feature Description
Power supply units (PSU) portfolio PSU portfolio includes intelligent features such as dynamically
optimizing efficiency while maintaining availability and
redundancy.
Tools for right-sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool
that helps you to plan and tune your computer and
infrastructure equipment for maximum efficiency. EIPT helps
you by calculating hardware power consumption, power
infrastructure, and storage. You can learn more at [Link]/
calc
Industry compliance Dell EMC's servers are compliant with all relevant industry
certifications and guidelines, including 80 PLUS, Climate
Savers, and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:
● Power monitoring accuracy of 1%, whereas the industry
standard is 5%
● More accurate reporting of power
● Better performance under a power cap
Power capping Use Dell EMC's systems management to set the power cap
limit for your systems to limit the output of a PSU and
reduce system power consumption. Dell is the first hardware
vendor to leverage Intel Node Manager for circuit-breaker fast
capping.
Systems management Dell EMC's servers are compliant with all relevant industry
certifications and guidelines, including 80 PLUS, Climate
Savers, and ENERGY STAR.

34 Power, Thermal, and Acoustics

Table 19. Power tools and technologies (continued)
Feature Description

Dell OpenManage Power Center delivers group power

management at the rack, row, and data center level for
servers, power distribution units, and uninterruptible power
supplies.

Active power management Intel® Node Manager is an embedded technology that

provides individual server- level power reporting and
power limiting functionality. Dell offers a complete power
management solution that is comprised of Intel Node
Manager that is accessed through Dell iDRAC9 Enterprise
and OpenManage Power Center that allows policy- based
management of power and thermals at the individual server,
rack, and data center level. Hot spare reduces power
consumption of redundant power supplies.
Thermal control of fan speed optimizes the thermal settings
for your environment to reduce fan consumption and lower
system power consumption. Idle power enables Dell servers to
run as efficiently when idle as when at full workload.

Fresh Air cooling FAC is supported with certain configuration limitations. With
the thermal design and reliability of Dell products, you
can have the capability to operate at excursion- based
temperatures beyond the industry standard of 35°C (95°F)
without impacting your availability model. This solution
takes into account servers, networking, storage, and other
infrastructure.

Rack infrastructure Dell EMC offers some of the industry's highest- efficiency
power infrastructure solutions, including:
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy smart containment rack enclosures

Power supply units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining
availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency
power conversion and advanced thermal-management techniques, and embedded power-management features including high-
accuracy power monitoring.
The system supports two hot-swappable AC power supplies with 1 + 1 redundancy, auto-sensing and auto-switching capability.

Thermal and Acoustics

The system's thermal management delivers high performance through optimized cooling of components at the lowest fan
speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature
ranges. These optimizations result in lower fan power consumption which translate to lower system power and data center
power consumption.

Thermal design
The thermal design of the system reflects the following:
● Optimized thermal design: The system layout is architected for optimum thermal design. System component placement
and layout are designed to provide maximum airflow coverage to critical components with minimal expense of fan power.

Power, Thermal, and Acoustics 35

● Comprehensive thermal management: The thermal control system regulates the system fan speeds based on feedback
from system component temperature sensors, as well as for system inventory and subsystem power draw. Temperature
monitoring includes components such as processors, DIMMs, chipset, system inlet air temperature and hard disk drives.
● Open and closed loop fan speed control: Open loop fan control uses system configuration to determine fan speed based
on system inlet air temperature. Closed loop thermal control uses temperature feedback to dynamically adjust fan speeds
based on system activity and cooling requirements.
● User-configurable settings: With the understanding and realization that every customer has a unique set of
circumstances or expectations from the system, in this generation of servers, we have introduced limited user-configurable
settings in the iDRAC9 BIOS setup screen. For more information, see the Dell EMC PowerEdge system Installation and
Service Manual on [Link]/Support/Manuals and “Advanced Thermal Control: Optimizing across Environments and Power
Goals” on [Link].
● Cooling redundancy: The system allows N+1 fan redundancy, allowing continuous operation with one fan failure in the
system.

Acoustical design
Dell EMC focuses on sound quality in addition to sound power level and sound pressure level. Sound quality describes how
disturbing or pleasing a sound is interpreted, and Dell EMC references several psychacoustical metrics and thresholds in
delivering to it. Tone prominence is one such metric. Sound power and sound pressure levels increase with greater populations
or higher utilization, while sound quality remains good even as the frequency content changes. A reference for comparison to
sound pressure levels for familiar noise sources is given in the following table. An extensive description of Dell EMC Enterprise
acoustical design and metrics is available in the Dell Enterprise Acoustics white paper.

Table 20. Acoustical reference points and output comparisons

Value measured at your ears Equivalent familiar noise experience
LpA, dBA, re 20 μPa Loudness, sones
90 80 Loud concert
75 39 Data center, vacuum cleaner, voice must be elevated to be
heard
60 10 Conversation levels
45 4 Whispering, open office layout, normal living room
35 2 Quiet office
30 1 Quiet library
20 0 Recording studio

Inlet temperature guidelines and requirements

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8180 2.5 28 205 CPU1: C30 Not Not Not Not C20 C21 or C21 or C21 C21 or
um 6| Suppo Suppo Suppo Suppo or lower lower or lower
CPU2 rted rted rted rted lower lower
:8 C5 or C13 or C14 or C19
lower lower lower

36 Power, Thermal, and Acoustics

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

or
lower

Platin 8180 2.5 28 205 CPU1: C30 Not Not Not Not C20 C21 or C21 or C21 C21 or
um M 6| Suppo Suppo Suppo Suppo or lower lower or lower
CPU2 rted rted rted rted lower lower
:8 C5 or C13 or C14 or C19
lower lower lower or
lower

Platin 8168 2.7 24 205 CPU1: C30 Not Not Not Not C20 C21 or C21 or C21 C21 or
um 6| Suppo Suppo Suppo Suppo or lower lower or lower
CPU2 rted rted rted rted lower lower
:8 C5 or C13 or C14 or C19
lower lower lower or
lower

Gold 6154 3 18 200 CPU1: C30 Not Not Not C20 C21 or C22 C22 C22 C22
6| Suppo Suppo Suppo or lower or or or or
CPU2 rted rted rted lower lower lower lower lower
:8 C6 or C14 or C15
lower lower or
lower

Gold 6150 2.7 18 165 CPU1: C35 Not Not Not C30 C30 C30 C30 C30 C35
8| Suppo Suppo Suppo
CPU2 rted rted rted
:8 C11 or C18 or C19
lower lower or
lower

Platin 8158 3 12 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
um 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Gold 6148 2.4 20 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Gold 6146 3.2 12 165 CPU1: C35 Not Not Not C30 C30 C30 C30 C30 C35
8| Suppo Suppo Suppo
CPU2 rted rted rted
:8 C11 or C18 or C19
lower lower or
lower

Power, Thermal, and Acoustics 37

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6144 3.5 8 150 CPU1: C35 Not Not C20 C30 C30 C30 C30 C30 C35
6| Suppo Suppo or
CPU2 rted rted lower
:8 C14 or C18 or
lower lower

Gold 6142 2.6 16 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
6| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Gold 6136 3 12 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Gold 6132 2.6 14 140 CPU1: C35 Not C25 C25 C30 C30 C35 C35 C35 C35
8| Suppo
CPU2 rted
:8 C16
or
lower

Gold 6134 3.2 8 130 CPU1: C35 Not C25 C25 C30 C30 C35 C35 C35 C35
8| Suppo
CPU2 rted
:8 C18 or
lower

Gold 6126 2.6 12 125 CPU1: C35 C25 C30 C30 C30 C30 C35 C35 C35 C35
8|
CPU2
:8

Gold 6128 3.4 6 115 CPU1: C35 C25 C30 C30 C30 C30 C35 C35 C35 C35
6|
CPU2
:8

Platin 8156 3.6 4 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 6|
CPU2
:8

Gold 5122 3.6 4 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
6|
CPU2
:8

38 Power, Thermal, and Acoustics

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8176 2.1 28 165 CPU1: C35 Not C21 or C22 C30 C30 C30 C30 C30 C35
um 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8176 2.1 28 165 CPU1: C35 Not C21 or C22 C30 C30 C30 C30 C30 C35
um M 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8170 2.1 26 165 CPU1: C35 Not C21 or C22 C30 C30 C30 C30 C30 C35
um M 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8170 2.1 26 165 CPU1: C35 Not C21 or C22 C30 C30 C30 C30 C30 C35
um 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8164 2 26 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
um 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8160 2.1 24 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
um M 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Platin 8160 2.1 24 150 CPU1: C35 Not C21 or C23 C30 C30 C30 C30 C30 C35
um 8| Suppo lower or
CPU2 rted lower
:8 C14 or
lower

Gold 6152 2.1 22 140 CPU1: C35 Not C25 C25 C30 C30 C35 C35 C35 C35
8| Suppo
CPU2 rted
:8 C16
or
lower

Power, Thermal, and Acoustics 39

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6140 2.3 18 140 CPU1: C35 Not C25 C25 C30 C30 C35 C35 C35 C35
M 8| Suppo
CPU2 rted
:8 C16
or
lower

Gold 6140 2.3 18 140 CPU1: C35 Not C25 C25 C30 C30 C35 C35 C35 C35
8| Suppo
CPU2 rted
:8 C16
or
lower

Gold 6130 2.1 16 135 CPU1: C35 C25 C30 C30 C30 C30 C35 C35 C35 C35
8|
CPU2
:8

Platin 8153 2 16 125 CPU1: C35 C25 C30 C30 C30 C30 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6138 2 20 125 CPU1: C35 C25 C30 C30 C30 C30 C35 C35 C35 C35
8|
CPU2
:8

Gold 5120 2.2 14 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5118 2.3 12 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5115 2.4 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4116 2.1 12 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

40 Power, Thermal, and Acoustics

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Silver 4114 2.2 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4112 2.6 4 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4110 2.1 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4108 1.8 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Bronz 3106 1.7 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Bronz 3104 1.7 6 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Platin 8176F 2.1 28 173 CPU1: C30 Not Not Not C20 C21 or C22 C22 C25 C25
um 6| Availa Availa Availa or lower or or
CPU2 ble ble ble lower lower lower
:8

Platin 8160F 2.1 24 160 CPU1: C30 Not Not Not C25 C25 C25 C25 C25 C30
um 6| Availa Availa Availa
CPU2 ble ble ble
:8

Platin 6138F 2 20 135 CPU1: C35 Not Not Not C30 C30 C30 C30 C30 C35
um 8| Availa Availa Availa
CPU2 ble ble ble
:8

Platin 6130F 2.1 16 135 CPU1: C35 Not Not Not C30 C30 C30 C30 C30 C35
um 8| Availa Availa Availa
CPU2 ble ble ble
:8

Power, Thermal, and Acoustics 41

Table 21. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Dual Processors (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6148F 2.4 20 160 CPU1: C30 Not Not Not C25 C25 C25 C25 C25 C30
6| Availa Availa Availa
CPU2 ble ble ble
:8

Gold 6142F 2.6 16 160 CPU1: C30 Not Not Not C25 C25 C25 C25 C25 C30
6| Availa Availa Availa
CPU2 ble ble ble
:8

Gold 6126F 2.6 12 135 CPU1: C35 Not Not Not C30 C30 C30 C30 C30 C35
8| Availa Availa Availa
CPU2 ble ble ble
:8

Silver 4109T 2 8 70 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Table 22. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Single Processor
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8180 2.5 28 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um 6

Platin 8180 2.5 28 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um M 6

Platin 8168 2.7 24 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um 6

Gold 6154 3 18 200 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
6

Gold 6150 2.7 18 165 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8

Platin 8158 3 12 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 8

42 Power, Thermal, and Acoustics

Table 22. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Single Processor (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6148 2.4 20 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6146 3.2 12 165 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
6

Gold 6144 3.5 8 150 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
6

Gold 6142 2.6 16 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6136 3 12 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6132 2.6 14 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6134 3.2 8 130 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6126 2.6 12 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6128 3.4 6 115 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
6

Platin 8156 3.6 4 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 6

Gold 5122 3.6 4 105 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
6

Platin 8176 2.1 28 165 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 8

Platin 8176 2.1 28 165 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um M 8

Platin 8170 2.1 26 165 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um M 8

Platin 8170 2.1 26 165 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 8

Platin 8164 2 26 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 8

Platin 8160 2.1 24 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um M 8

Power, Thermal, and Acoustics 43

Table 22. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Single Processor (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8160 2.1 24 150 CPU1: C35 C30 C35 C35 C35 C35 C35 C35 C35 C35
um 8

Gold 6152 2.1 22 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
M 8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 6130 2.1 16 135 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Platin 8153 2 16 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8

Gold 6138 2 20 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 5120 2.2 14 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 5118 2.3 12 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Gold 5115 2.4 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Silver 4116 2.1 12 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Silver 4114 2.2 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Silver 4112 2.6 4 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Silver 4110 2.1 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Silver 4108 1.8 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Bronz 3106 1.7 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8

Bronz 3104 1.7 6 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8

44 Power, Thermal, and Acoustics

Table 22. Maximum continuous operating inlet air temperature (°C) with for Air Cooled C6420 Sleds with
Single Processor (continued)
Class SKU Frequ Core Watt Max No- 3.5" Chassis with 2.5" (Direct BP/EXP/NVMe) Chassis with
ency s s DIM BP Air Cooled Sleds Air Cooled Sleds
(GHz M Air
) Coun Coole
ts d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8176F 2.1 28 173 NA NA NA NA NA NA NA NA NA NA NA

um

Platin 8160F 2.1 24 160 NA NA NA NA NA NA NA NA NA NA NA

um

Platin 6138F 2 20 135 NA NA NA NA NA NA NA NA NA NA NA

um

Platin 6130F 2.1 16 135 NA NA NA NA NA NA NA NA NA NA NA

um

Gold 6148F 2.4 20 160 NA NA NA NA NA NA NA NA NA NA NA

Gold 6142F 2.6 16 160 NA NA NA NA NA NA NA NA NA NA NA

Gold 6126F 2.6 12 135 NA NA NA NA NA NA NA NA NA NA NA

Silver 4109T 2 8 70 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8180 2.5 28 205 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8180 2.5 28 205 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8168 2.7 24 205 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Power, Thermal, and Acoustics 45

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute (continued)
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8158 3 12 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8156 3.6 4 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6148 2.4 20 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6146 3.2 12 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6144 3.5 8 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6154 3 18 200 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6150 2.7 18 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6142 2.6 16 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6132 2.6 14 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6136 3 12 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

46 Power, Thermal, and Acoustics

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute (continued)
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6126 2.6 12 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6134 3.2 8 130 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6128 3.4 6 115 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5122 3.6 4 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Platin 8176 2.1 28 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8176 2.1 28 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8170 2.1 26 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8170 2.1 26 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8164 2 26 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8160 2.1 24 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Power, Thermal, and Acoustics 47

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute (continued)
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8160 2.1 24 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8153 2 16 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6152 2.1 22 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6138 2 20 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
M 8|
CPU2
:8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6130 2.1 16 135 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5120 2.2 14 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5118 2.3 12 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5115 2.4 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

48 Power, Thermal, and Acoustics

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute (continued)
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Silver 4116 2.1 12 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4114 2.2 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4112 2.6 4 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4110 2.1 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4108 1.8 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Bronz 3106 1.7 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Bronz 3104 1.7 6 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Platin 8176F 2.1 28 173 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8160F 2.1 24 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 6138F 2 20 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Power, Thermal, and Acoustics 49

Table 23. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 45°C coolant entering cold plate at .48L/minute (continued)
Class SKU Frequ Numb TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
ency er of Watt DIM BP Liquid Cooled Sleds Cooled Sleds
(GHz Cores s M Liqui
) Coun d
ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 6130F 2.1 16 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6148F 20 2.4 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6142F 16 2.6 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6126F 12 2.6 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4109T 2 8 70 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8180 2.5 28 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8180 2.5 28 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

50 Power, Thermal, and Acoustics

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute (continued)
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8168 2.7 24 205 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8158 3 12 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8156 3.6 4 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6148 2.4 20 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6146 3.2 12 165 CPU1: C35* C35* C35* C35* C35* C35* C35* C35* C35* C35*
8|
CPU2
:8

Gold 6144 3.5 8 150 CPU1: C35* C35* C35* C35* C35* C35* C35* C35* C35* C35*
8|
CPU2
:8

Gold 6154 3 18 200 CPU1: C35 C30 C30 C30 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6150 2.7 18 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6142 2.6 16 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6132 2.6 14 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Power, Thermal, and Acoustics 51

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute (continued)
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 6136 3 12 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6126 2.6 12 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6134 3.2 8 130 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6128 3.4 6 115 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5122 3.6 4 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Platin 8176 2.1 28 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8176 2.1 28 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8170 2.1 26 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8170 2.1 26 165 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8164 2 26 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

52 Power, Thermal, and Acoustics

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute (continued)
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 8160 2.1 24 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um M 8|
CPU2
:8

Platin 8160 2.1 24 150 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8153 2 16 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6152 2.1 22 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6138 2 20 125 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
M 8|
CPU2
:8

Gold 6140 2.3 18 140 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6130 2.1 16 135 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5120 2.2 14 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 5118 2.3 12 105 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Power, Thermal, and Acoustics 53

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute (continued)
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Gold 5115 2.4 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4116 2.1 12 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4114 2.2 10 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4112 2.6 4 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4110 2.1 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4108 1.8 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Bronz 3106 1.7 8 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Bronz 3104 1.7 6 85 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
e 8|
CPU2
:8

Platin 8176F 2.1 28 173 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 8160F 2.1 24 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

54 Power, Thermal, and Acoustics

Table 24. Maximum continuous operating inlet air temperature (°C) for C6420 Sleds with Dual
Processors and 57°C coolant entering cold plate at .48L/minute (continued)
Class SKU Freq Num TDP Max No- 3.5" Chassis with 2.5" (Direct BP) Chassis with Liquid
uenc ber Watt DIM BP Liquid Cooled Sleds Cooled Sleds
y of s M Liqui
(GHz Cores Coun d
) ts Coole
d
Chas
sis

NA 12 8 4 24 20 16 12 8 4
HDD HDD HDD HDD HDD HDD HDD HDD HDD

Platin 6138F 2 20 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Platin 6130F 2.1 16 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
um 8|
CPU2
:8

Gold 6148F 20 2.4 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6142F 16 2.6 160 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Gold 6126F 12 2.6 135 CPU1: C35 NA NA NA C35 C35 C35 C35 C35 C35
8|
CPU2
:8

Silver 4109T 2 8 70 CPU1: C35 C35 C35 C35 C35 C35 C35 C35 C35 C35
8|
CPU2
:8

PowerEdge C6420 has the following restrictions when deployed in a

configuration compliant with Fresh Air:
PERC Restriction:
● Support 105W CPUs without H730. H330 can be supported.
● Support 85W and less TDP CPUs without PERC restrictions.
General restrictions
● CPUs with TDP > 105W are not supported
● 3.5” HDD chassis is not supported
● NVMe SSDs are not supported
● 114mm HSK (FMM2M) is required for CPU#1
● OCP Mezz card is not supported
● X8 M.2 on DCS Mezz slot is not supported
● LR DIMMs are not supported
● PCIe cards >25W are not supported

Power, Thermal, and Acoustics 55

Table 25. Configuration Restrictions with Mellanox ConnectX-4 EDR Dual Port Card with Active (Optical)
connectivity
CPU TDP 3.5" Chassis 2.5" Chassis No BP

12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A

205W Not Not Not Not Not Not Not 23

supported supported supported supported supported supported supported

200W Not Not Not Not Not Not Not 23

supported supported supported supported supported supported supported

173W Not Not Not Not Not 24 24 28

supported supported supported supported supported

165W Not Not Not 24 25 25 26 29

supported supported supported

160W Not Not Not 24 25 26 26 30

supported supported supported

150W Not Not Not 26 27 28 28 31

supported supported supported

140W Not 23 25 28 29 29 30 33
supported

135W Not 24 25 29 30 30 31 33
supported

130W Not 24 26 30 31 31 31 34
supported

125W 20 25 27 30 31 32 32 35

115W 21 27 28 32 33 34 34 35

113W 21 27 28 32 33 34 34 35

105W 22 28 30 34 35 35 35 35

85W 23 32 33 35 35 35 35 35

70W 25 34 35 35 35 35 35 35

56 Power, Thermal, and Acoustics

 9
Rack rails systems
The rack rail systems for C6400 server provide tool-less support for 4-post racks with square or unthreaded round holes. There
is no support for cable management arms (CMA). The static rails supports a wider variety of racks.

Figure 8. Static rail

The key factor in selecting the proper rails is identifying the type of rack in which they are installed. The static rail supports
tool-less mounting in 19"-wide, EIA-310-E compliant square hole and unthreaded round hole 4-post racks. The static rail also
supports tooled mounting in threaded-hole 4-post racks including all Dell EMC 42xx and 24xx racks.

NOTE: APC racks are also supported.

Table 26. Rail adjustability range

Product Rail Mounting Rail type Rail adjustability range (mm) Rail depth
identifier Interface (mm)
Square Rounded without
CMA
Min Max Min Max
C6400 N/A Tool-less Static 582 mm 822 mm 582 mm 822 mm 602 mm

Other key factors governing proper rail selection include the spacing between the front and rear mounting flanges of the rack,
the type and location of any equipment mounted in the back of the rack, such as power distribution units, and the overall depth
of the rack. Due to their reduced complexity and lack of need for CMA support, the static rails offer a greater adjustability range
and a smaller overall mounting footprint than the sliding rails.
For information about installing the system in a rack, see the Dell EMC PowerEdge Rack Installation Guide on [Link]/
Support/Manuals.

Rack rails systems 57

 10
Operating systems and virtualization
The Dell EMC PowerEdge C6400 and C6420 supports a wide range of industry-standard operating systems and virtualization
software.
Topics:
• Supported operating systems
• Supported virtualization

Supported operating systems

The following table lists the supported operating systems.

Table 27. Supported operating systems

Operating system Platform Edition
Microsoft Windows Server 2016 x64 Standard Datacenter
Microsoft Windows Server 2012 R2 x64 Standard Datacenter
RedHat Enterprise Linux 6.9 x86 x64 N/A
RedHat Enterprise Linux 7.3 x86 x64 N/A
Novell SuSE Linux Enterprise Server 11 x64 N/A
(with PLDP) SP4 x86
Novell SuSE Linux Enterprise Server 12 x64 N/A
SP2 x86
Ubuntu 16.04 LTS x64 N/A

Supported virtualization
The following table lists the supported virtualization.

Table 28. Supported virtualization

Operating system Install version
VMWare vSphere 2016 U1 (ESXi 6.5 U1)
VMWare vSphere 2015 U3 (ESXi 6.0 U3)
Citrix Xen Server 7.1.x

58 Operating systems and virtualization

 11
Dell EMC OpenManage systems management

Figure 9. Dell EMC OpenManage Portfolio

Dell EMC delivers management solutions that help IT Administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell EMC servers
effectively and efficiently; in physical, virtual, local, and remote environments, operating in-band, and out-of-band (agent-free).
The OpenManage portfolio includes innovative embedded management tools such as the integrated Dell Remote Access
Controller (iDRAC), Chassis Management Controller and Consoles like OpenManage Enterprise, OpenManage Power Manager
plug in, and tools like Repository Manager.
Dell EMC has developed comprehensive systems management solutions based on open standards and has integrated with
management consoles that can perform advanced management of Dell hardware. Dell EMC has connected or integrated the
advanced management capabilities of Dell hardware into offerings from the industry's top systems management vendors and
frameworks such as Ansible, thus making Dell EMC platforms easy to deploy, update, monitor, and manage.
The key tools for managing Dell EMC PowerEdge servers are iDRAC and the one-to-many OpenManage Enterprise console.
OpenManage Enterprise helps the system administrators in complete lifecycle management of multiple generations of
PowerEdge servers. Other tools such as Repository Manager, which enables simple yet comprehensive change management.
OpenManage tools integrate with systems management framework from other vendors such as VMware, Microsoft, Ansible, and
ServiceNow. This enables you to use the skills of the IT staff to efficiently manage Dell EMC PowerEdge servers.
Topics:
• OpenManage systems management
• iDRAC9 with Lifecycle Controller
• Agent-free management
• Agent-based management
• Dell EMC consoles
• Automation Enablers
• Integration with third-party consoles
• Connections for third-party consoles
• Dell EMC server management operations

Dell EMC OpenManage systems management 59

OpenManage systems management
The Dell EMC OpenManage systems management portfolio includes powerful hardware and software management tools and
consoles. OpenManage simplifies the lifecycle of deploying, updating, monitoring and maintaining your Dell EMC PowerEdge
servers.

iDRAC9 with Lifecycle Controller

The Integrated Dell Remote Access Controller 9 (iDRAC9) with Lifecycle Controller, the embedded intelligence of every Dell
EMC PowerEdge 14th generation server, helps you manage Dell EMC servers agent-free or with a systems management
agent, within physical, virtual, local and remote environments. iDRAC9 alerts server issues, enables remote server management
and reduces the need to physically visit the server. iDRAC9 with Lifecycle Controller is part of Dell EMC comprehensive
OpenManage portfolio and works as a stand-alone or in conjunction with other components such as OpenManage Essentials,
OpenManage Mobile, OpenManage Power Center, Chassis Management Controller, and OpenManage Integrations for Microsoft,
VMware and BMC consoles to simplify, automate and streamline IT operations.
Dell EMC BMC and iDRAC9 feature comparison
iDRAC9 Enterprise is available for the system. Dell EMC also offers BMC. A detailed feature comparison for Dell EMC BMC and
iDRAC9 Express is shown in the following table

Table 29. Feature comparison for Dell EMC BMC and iDRAC9 Enterprise
Feature Dell EMC BMC iDRAC9 Enterprise
Interfaces / Standards
IPMI 2.0 Yes Yes
DCMI 1.5 Yes Yes
Web-based GUI Yes Yes
Racadm command line (local/remote) Yes Yes
SMASH-CLP (SSH-only) Yes Yes
Telnet Yes Yes
SSH Yes Yes
WSMAN Yes Yes
RedFish API Yes Yes
Network Time Protocol Yes Yes
Connectivity
Shared NIC Yes Yes
Dedicated NIC (with Ports card) Yes Yes
VLAN tagging Yes Yes
IPv4 Yes Yes
IPv6 Yes Yes
DHCP Yes Yes
Dynamic DNS Yes Yes
OS pass-through Yes Yes
Security
Role-based authority Yes Yes
Local users Yes Yes

60 Dell EMC OpenManage systems management

Table 29. Feature comparison for Dell EMC BMC and iDRAC9 Enterprise (continued)
SSL encryption Yes Yes
IP blocking Yes Yes
Directory services (AD, LDAP) No Yes
Two-factor authentication No Yes
Single sign-on No Yes
PK authentication Yes Yes
14G: Configuration Lockdown No Yes
14G: System Erase of internal storage Yes Yes
devices
Remote Presence
Power control Yes Yes
Boot control Yes Yes
Serial-over-LAN Yes Yes
Virtual Media No Yes
Virtual Folders No Yes
Remote File Share No Yes
Virtual Console Yes Yes
VNC connection to OS No Yes
Quality/bandwidth control No Yes
Virtual Console collaboration (6 users) No Yes
Virtual Console chat No Yes
Power & Thermal
Real-time power meter Yes Yes
Power thresholds & alerts Yes Yes
Real-time power graphing Yes Yes
Historical power counters Yes Yes
Power capping Yes Yes
Power Center integration Yes Yes
Temperature monitoring Yes Yes
Temperature graphing Yes Yes
Health Monitoring
Full agent-free monitoring Yes Yes
Predictive failure monitoring Yes Yes
SNMPv1, v2, and v3 (traps and gets) Yes Yes
Email Alerting Yes Yes
Configurable thresholds Yes Yes
Fan monitoring Yes Yes
Power Supply monitoring Yes Yes
Memory monitoring Yes Yes

Dell EMC OpenManage systems management 61

Table 29. Feature comparison for Dell EMC BMC and iDRAC9 Enterprise (continued)
CPU monitoring Yes Yes
RAID monitoring (PERC) Yes Yes
NIC monitoring Yes Yes
HD monitoring ( (including JBOD Yes Yes
enclosure)
Out of Band Performance Monitoring No Yes
Update
Remote agent-free update Yes Yes
Embedded update tools No Yes
Sync with repository (scheduled No Yes
updates)
Auto-update No Yes
Deployment & Configuration
Embedded OS deployment tools No Yes
Embedded configuration tools No Yes
Auto-Discovery No Yes
Remote OS deployment (vMedia) No Yes
Embedded driver pack Yes Yes
Full configuration inventory Yes Yes
Inventory export Yes Yes
Remote configuration Yes Yes
Zerotouch configuration No Yes
System Retire/Repurpose Yes Yes
14G: iDRAC Connection View No Yes
14G: BIOS configuration page in iDRAC Yes Yes
GUI
Diagnostics, Service, & Logging
Embedded diagnostic tools Yes Yes
Part Replacement No Yes
Server Configuration Backup No Yes
Server Configuration Restore Yes Yes
Easy Restore (system configuration) - Yes Yes
USB and rSPI
Health LED only Yes Yes
14G: Quick Sync 2.0 NA NA
14G: iDRAC Direct 2.0 (micro USB port Yes Yes
on rear)
iDRAC Service Module (iSM) Yes Yes
Embedded Tech Support Report Yes Yes
Crash screen capture No Yes

62 Dell EMC OpenManage systems management

Table 29. Feature comparison for Dell EMC BMC and iDRAC9 Enterprise (continued)
Crash video capture (requires iSM or No Yes
OMSA)
Boot capture No Yes
Manual reset for iDRAC Yes Yes
Virtual NMI Yes Yes
OS watchdog (requires iSM or OMSA) Yes Yes
System Event Log Yes Yes
Lifecycle Log Yes Yes
Work notes Yes Yes
Remote Syslog No Yes
License management Yes Yes

Agent-free management
As Dell EMC PowerEdge servers have embedded server lifecycle management, in many cases, there is no need to install an
OpenManage systems management software agent into the operating system of a Dell EMC PowerEdge server. This greatly
simplifies and streamlines the management footprint.

Agent-based management
Most systems management solutions require pieces of software, called agents, to be installed on each node in order to be
managed within the IT environment. Additionally, the same agent is often used as a local interface into the hardware health
and may be accessed remotely as a management interface, typically referred to as a one-to-one interface. For customers that
continue to use agent-based solutions, Dell EMC provides OpenManage Server Administrator.

Dell EMC consoles

● Dell EMC OpenManage Enterprise
● Dell EMC Repository Manager (DRM)
● Dell EMC OpenManage Enterprise Power Manager plugin to OpenManage Enterprise
● Dell EMC OpenManage Mobile (OMM)

Automation Enablers
● OpenManage Ansible Modules
● iDRAC RESTful APIs (Redfish)
● Standards-based APIs (Python, PowerShell)
● RACADM Command Line Interface (CLI)
● GitHub Scripting Libraries

Integration with third-party consoles

● Dell EMC OpenManage Integrations with Microsoft System Center
● Dell EMC OpenManage Integration for VMware vCenter (OMIVV)
● Dell EMC OpenManage Ansible Modules
● Dell EMC OpenManage Integration with ServiceNow

Dell EMC OpenManage systems management 63

Connections for third-party consoles
● Micro Focus and other HPE tools
● OpenManage Connection for IBM Tivoli
● OpenManage Plug-in for Nagios Core and XI

Dell EMC server management operations

Dell EMC OpenManage systems management is centered on automating the server management lifecycle — deploy, update,
monitor and maintain. To manage an infrastructure properly and efficiently, you must perform all of these functions easily and
quickly. iDRAC9 with Lifecycle Controller technology provides you with these intelligent capabilities embedded within the server
infrastructure. This allows you to invest more time and energy on business improvements and less on maintenance.

Figure 10. Systems management server lifecycle

The following table lists the products that are available for one-to-one and one-to-many operations, and when they are used in
the server’s lifecycle.

Table 30. One-to-one and one-to-many operations

Operation One-to-one One-to-many
Deploy ● Lifecycle Controller GUI ● OpenManage Integration for VMware vCenter
● DTK ● OpenManage Integration for BMC BladeLogic
● OpenManage Integration for Microsoft
System Center Configuration Manager
Update ● iDRAC9 with Lifecycle Controller ● Dell EMC OpenManage Essentials
● Repository Manager ● OpenManage Integration for Microsoft
● DUP System Center Configuration Manager
● SUU
● OpenManage Integration for VMware vCenter
Monitor ● iDRAC9 with Lifecycle Controller ● Dell EMC OpenManage Essentials
● OMSA ● Dell EMC OpenManage Power Center
● OpenManage Integration for VMware vCenter
● OpenManage Integration for Microsoft
System Center Operations Manager
Maintain ● iDRAC9 with Lifecycle Controller ● Lifecycle Controller Remote Services
● IPMI Remediate and replace parts:

64 Dell EMC OpenManage systems management

Table 30. One-to-one and one-to-many operations (continued)
Operation One-to-one One-to-many
● OpenManage Integration for Microsoft
System Center Virtual Machine Manager
(SCVMM)
● Server Pro Management Pack and Lifecycle
Controller Integration (DLCI)

For additional detailed information on Dell EMC systems management portfolio, visit [Link]/OpenManage.

Dell EMC OpenManage systems management 65

 12
Appendix A. Additional specifications
Topics:
• Chassis dimensions
• Power supply specifications
• Environmental specifications
• Video specifications
• USB peripherals
• PCIe card dimensions

Chassis dimensions

Figure 11. Chassis dimensions

Table 31. Chassis Dimensions (mm)

Chassis dimensions (mm)
Xa Xb Y Za without bezel Zb Zc
482.6 mm 448.0 mm 86.8 mm 26.8 mm 763.2 mm 797.3 mm

66 Appendix A. Additional specifications

Table 32. Chassis weight
Configuration Weight
24 x 2.5 HDD chassis 8.7717 Kg (19.32 lb)
12 x 3.5 HDD chassis 8.7717 Kg (19.32 lb)

Power supply specifications

The following table lists power supply specifications.

Table 33. Power supply specifications

Specification 1600 W Platinum 2000 W Platinum 2400 W Platinum
Power factor Active Active Active
correction
FCC Class A Class A Class A
classification
Max Output 131.15 A (180-264 V AC) 163.93 A (180-264 V AC) 196.72 A (180-264 V AC)
Current
65.57 A (90-140 V AC) 81.97 A (90-140 V AC) 114.75 A (90-140 V AC)

Input voltage 90-264 V AC 47-63 Hz 90-264 V AC 47-63 Hz 90-264 V AC 47-63 Hz

range
Iin for rating 10.0 A 11.5 A 16.0 A
on safety label
Initial in-rush 25 A (peak) 25 A (peak) 35 A (peak)
current
Secondary in- 25 A (peak) 45 A (peak) 45 A (peak)
rush current

Environmental specifications
See Dell EMC PowerEdge C6420 Owner’s Manual on [Link]/Support/Manuals for detailed environmental specifications.

Video specifications
The Dell EMC PowerEdge C6420 iDRAC incorporates an integrated video subsystem, connected to the south bridge via PCI
Express and internal PCIe Switch and PCIe to PCI Bridge. The graphics controller is the 2D Matrox® G200. The video frame
buffer (16MB) is contained within the iDRAC RAM (256MB) device. The system supports the 2D graphics video modes listed in
the following table.

Table 34. Supported video resolution options

Resolution Refresh rate (Hz) Color depth (bits)
640 x 480 60, 72 8, 16, 24
800 x 600 60, 75, 85 8, 16, 24
1024 x 768 60, 75, 85 8, 16, 24
1152 x 864 60, 75, 85 8, 16, 24
1280 x 1024 60, 75 8, 16, 24

Appendix A. Additional specifications 67

USB peripherals
USB peripherals are supported through the front USB ports on the C6420 sled. The ports are USB 3.0 compliant. The system
also supports Micro USB for iDRAC direct.

PCIe card dimensions

The following table provides the dimensions of the PCIe cards supported by the C6420.

Table 35. PCIe card dimensions

Type Height Length
Half-height, half-length 68.90 mm (2.731 inches) max 167.65 mm (6.600 inches) max
card

68 Appendix A. Additional specifications

 13
Appendix B. Standards compliance
The Dell EMC PowerEdge C6400 and C6420 conforms to the following industry standards.

Table 36. Industry standard documents

Standard URL for information and specifications
ACPI Advance Configuration and Power Interface [Link]
Specification, v2.0c
Ethernet IEEE 802.3-2005 [Link]/getieee802/[Link]
HDG Hardware Design Guide Version 3.0 for Microsoft [Link]/whdc/system/platform/pcdesign/desguide/
Windows Server [Link]
IPMI Intelligent Platform Management Interface, v2.0 [Link]/design/servers/ipmi
DDR4 Memory DDR4 SDRAM Specification [Link]/standards-documents/docs/[Link]
PCI Express PCI Express Base Specification Rev. 2.0 and 3.0 [Link]/specifications/pciexpress
PMBus Power System Management Protocol Specification, [Link]/[Link]
v1.2
SAS Serial Attached SCSI, v1.1 [Link]
SATA Serial ATA Rev. 2.6; SATA II, SATA 1.0a Extensions, [Link]
Rev. 1.2
SMBIOS System Management BIOS Reference Specification, [Link]/standards/smbios
v2.7
TPM Trusted Platform Module Specification, v1.2 and v2.0 [Link]
UEFI Unified Extensible Firmware Interface Specification, v2.1 [Link]/specifications
USB Universal Serial Bus Specification, Rev. 2.0 [Link]/developers/docs

Appendix B. Standards compliance 69

 14
Appendix C Additional resources
The following table provides a list of documents and web sites that provide more information.

Table 37. Additional resources

Resource Description of contents Location
PowerEdge Istallation and This manual, available in PDF format, provides the following [Link]/Support/Manuals
Service Manual information:
● Chassis features
● System Setup program
● System messages
● System codes and indicators
● System BIOS
● Remove and replace procedures
● Troubleshooting
● Diagnostics
● Jumpers and connectors
PowerEdge Getting Started This guide ships with the system, and is also available in PDF [Link]/Support/Manuals
Guide format. This guide provides the following information:
● Initial setup steps
● Key system features
● Technical specifications
Rack Installation Instructions This document ships with the rack kits, and provides [Link]/Support/Manuals
instructions for installing a server in a rack.
Information Update This document ships with the system, is also available in PDF [Link]/Support/Manuals
format online, and provides information on system updates.
System Information Label The system information label documents the system board Inside the system chassis
layout and system jumper settings. Text is minimized due cover
to space limitations and translation considerations. The label
size is standardized across platforms.
Quick Resource Locator (QRL) This code on the chassis can be scanned by a phone Inside the system chassis
application to access additional information and resources for cover
the server, including videos, reference materials, service tag
information, and Dell contact information.
Enterprise Infrastructure The Dell online EIPT enables easier and more meaningful [Link]/calc
Planning Tool (EIPT) estimates to help you determine the most efficient
configuration possible. Use EIPT to calculate the power
consumption of your hardware, power infrastructure, and
storage.

70 Appendix C Additional resources

 15
Appendix D. Support and Deployment
Services
Dell EMC Global Services include a wide, customizable range of service choices to simplify the assessment, design,
implementation, management and maintenance of your IT environment and to help you transition from platform to platform.
Depending on your current business requirements and the level of service you want, we can provide you with factory, on-site,
remote, modular and specialized services that fit your needs and budget. We'll help you with a little or a lot - your choice - and
provide you with access to our global resources.
Topics:
• Server Deployment Services
• Remote Consulting Services
• ProSupport Enterprise Suite
• Additional professional services

Server Deployment Services

Our Server Deployment Services can maximize the value of your servers quickly using our expert server deployment engineers.
With over 10,000 server deployment projects each year, we have experience, best practices, and comprehensive deployment
tools to install, configure, and integrate your new solution optimally and correctly. Our deployment experts will assess your
environment and understand your goals, then design and integrate your server solution for you.

Table 38. Server deployment capabilities

Server Installation Server Integration
Place single server in target workspace Yes
Rack, cable, and label servers Yes
Install image Yes
Connect to network Yes Yes
Test and validate connection Yes Yes
Install operating system Yes
Install applications Yes
Perform advanced configuration services Yes
Remote configuration services Yes
Virtualization Yes
Converged infrastructure Yes
Test and validate data center integration Yes

Remote Consulting Services

When you are in the final stages of your PowerEdge server implementation, you can rely on Dell EMC Remote Consulting and
our certified technical experts to help you optimize your configuration with best practices for your software, virtualization,
server, storage, networking, and systems management.

Appendix D. Support and Deployment Services 71

Data Migration Service
Protect your business and data with our single point of contact to manage your data migration project. Your project manager will
work with our experienced team of experts to create a plan using industry-leading tools and proven processes based on global
best practices to migrate your existing files and data, so your business gets up and running quickly and smoothly.

ProSupport Enterprise Suite

With Dell EMC ProSupport Services, we can help you keep your operation running smoothly, so you can focus on running your
business. We will help you maintain peak performance and availability of your most essential workloads. Dell EMC ProSupport
is a suite of support services that enable you to build the solution that is right for your organization. Choose support models
based on how you use technology and where you want to allocate resources. From the desktop to the data center, address
everyday IT challenges, such as unplanned downtime, mission-critical needs, data and asset protection, support planning,
resource allocation, software application management and more. Optimize your IT resources by choosing the right support
model.

Figure 12. ProSupport Enterprise Suite

ProSupport Plus
When you purchase your PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support for your
business-critical systems. Dell EMC ProSupport Plus provides you with all the benefits of ProSupport, plus access to a dedicated
Technical Account Manager and our elite ProSupport Plus engineers. ProSupport Plus gives you quick and efficient resolutions,
working along with our SupportAssist technology that enables us to get ahead of issues in your environment before they
become problems.

72 Appendix D. Support and Deployment Services

ProSupport
Our ProSupport service offers highly trained experts around the clock and around the globe to address your IT needs. We will
help you minimize disruptions and maximize availability of your PowerEdge server workloads with:
● 24x7x365 access to certified hardware experts
● Collaborative support assistance with over 195 third-party vendors
● Hypervisor and operating system support
● Onsite parts and labor response options including next business day or four-hour mission critical

ProSupport Flex for Data Center

Dell EMC ProSupport Flex for Data Center offers flexible site-wide support for hyperscale data centers with more than 1,000
assets. Built on standard Dell EMC ProSupport components, Flex for Data Center leverages our global scale while being tailored
to suit your needs. While not for everyone, it offers a flexible solution for those with large and complex environments. When you
choose Dell EMC ProSupport Flex for Data Center, you will get:
● Enterprise-wide support that covers your entire data center.
● A dedicated Technical Account Manager with remote, on-site, part-time and full-time options.
● Dedicated elite ProSupport Flex technical and field engineers who are trained on your environment and configurations.
● Flexible on-site support and parts options that fit your operational model
● A tailored support plan for your operations staff.

Figure 13. ProSupport Enterprise Suite comparison

Additional professional services

Dell EMC Education Services
Dell EMC Education Services offers the PowerEdge server training courses designed to help you achieve more with your
hardware investment. The curriculum is designed in conjunction with the server development team, as well as Dell EMC’s
technical support team, to ensure that the training delivers the information and practical, hands-on skills you and your team
need to confidently manage and maintain your Dell EMC server solution.

Appendix D. Support and Deployment Services 73

Dell EMC Global Infrastructure Consulting Services
Dell EMC Global Infrastructure Consulting Services use skilled solution architects, innovative tools, automated analysis and Dell
EMC’s intellectual property to give you rapid insight into the root causes of unnecessary complexity. We seek better answers
than traditional service models, and our strategy is to help you quickly identify high-impact, short-duration projects that deliver
return on investment (ROI) and free up resources. The results are practical, action-oriented plans with specific, predictable,
measurable outcomes. From data center optimization to server virtualization to systems management, our consulting services
can help you build a more efficient enterprise.

Dell EMC managed services

Dell EMC Managed Services are a modular set of lifecycle services designed to help you automate and centrally configure,
deploy, and manage your day-to-day data center operations. These services extend your existing on-premise IT infrastructure
with off-premise cloud services designed to better address challenges with mobility, highly distributed organizations, security,
compliance, business continuity, and disaster preparedness.

74 Appendix D. Support and Deployment Services