OptiX OSN 1500 Intelligent Optical Transmission System

V100R008

Hardware Description

Issue 02
Date 2007-03-29
Part Number 00384267

Huawei Proprietary and Confidential

Copyright © Huawei Technologies Co., Ltd
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recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Proprietary and Confidential

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Contents

Contents

About This Document.....................................................................................................................1

1 Equipment Structure.................................................................................................................1-1
2 Cabinet.........................................................................................................................................2-1
2.1 Cabinet Type...................................................................................................................................................2-2
2.2 Cabinet Configuration.....................................................................................................................................2-2
2.2.1 Cabinet Indicator....................................................................................................................................2-3
2.2.2 DC PDU.................................................................................................................................................2-3
2.2.3 Other Configuration...............................................................................................................................2-4
2.3 Technical Specifications.................................................................................................................................2-5

3 Subrack.........................................................................................................................................3-1
3.1 Structure..........................................................................................................................................................3-2
3.2 Capacity...........................................................................................................................................................3-3
3.3 Slot Allocation.................................................................................................................................................3-4
3.4 Slot Allocation...............................................................................................................................................3-13
3.5 Technical Specifications...............................................................................................................................3-24

4 Board List and Classification...................................................................................................4-1

4.1 Appearance and Dimensions of Boards..........................................................................................................4-2
4.2 Description of the Barcode on the Board........................................................................................................4-3
4.3 Board Classification........................................................................................................................................4-4
4.3.1 SDH Processing Boards.........................................................................................................................4-4
4.3.2 PDH Processing Boards.........................................................................................................................4-6
4.3.3 Data Processing Boards..........................................................................................................................4-7
4.3.4 Interface Boards and Switching Boards.................................................................................................4-9
4.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-10
4.3.6 Auxiliary Boards..................................................................................................................................4-10
4.3.7 WDM Processing Boards.....................................................................................................................4-11
4.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-12
4.3.9 Power Interface Boards........................................................................................................................4-12

5 SDH Processing Boards............................................................................................................5-1

5.1 SL1..................................................................................................................................................................5-3
5.1.1 Version Description................................................................................................................................5-3

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 OptiX OSN 1500 Intelligent Optical Transmission System
Contents Hardware Description

5.1.2 Function and Feature..............................................................................................................................5-4

5.1.3 Working Principle and Signal Flow.......................................................................................................5-5
5.1.4 Front Panel.............................................................................................................................................5-7
5.1.5 Valid Slots..............................................................................................................................................5-8
5.1.6 Board Feature Code................................................................................................................................5-9
5.1.7 Board Configuration Reference.............................................................................................................5-9
5.1.8 Technical Specifications........................................................................................................................5-9
5.2 SL1A.............................................................................................................................................................5-11
5.2.1 Version Description..............................................................................................................................5-11
5.2.2 Function and Feature............................................................................................................................5-11
5.2.3 Working Principle and Signal Flow.....................................................................................................5-12
5.2.4 Front Panel...........................................................................................................................................5-14
5.2.5 Valid Slots............................................................................................................................................5-15
5.2.6 Board Feature Code..............................................................................................................................5-15
5.2.7 Board Configuration Reference...........................................................................................................5-15
5.2.8 Technical Specifications......................................................................................................................5-15
5.3 SLQ1.............................................................................................................................................................5-17
5.3.1 Version Description..............................................................................................................................5-17
5.3.2 Function and Feature............................................................................................................................5-18
5.3.3 Working Principle and Signal Flow.....................................................................................................5-19
5.3.4 Front Panel...........................................................................................................................................5-21
5.3.5 Valid Slots............................................................................................................................................5-22
5.3.6 Board Feature Code..............................................................................................................................5-23
5.3.7 Board Configuration Reference...........................................................................................................5-23
5.3.8 Technical Specifications......................................................................................................................5-24
5.4 SLQ1A..........................................................................................................................................................5-25
5.4.1 Version Description..............................................................................................................................5-26
5.4.2 Function and Feature............................................................................................................................5-26
5.4.3 Working Principle and Signal Flow.....................................................................................................5-27
5.4.4 Front Panel...........................................................................................................................................5-28
5.4.5 Valid Slots............................................................................................................................................5-30
5.4.6 Board Feature Code..............................................................................................................................5-30
5.4.7 Board Configuration Reference...........................................................................................................5-30
5.4.8 Technical Specifications......................................................................................................................5-30
5.5 SLO1.............................................................................................................................................................5-32
5.5.1 Version Description..............................................................................................................................5-32
5.5.2 Function and Feature............................................................................................................................5-32
5.5.3 Working Principle and Signal Flow.....................................................................................................5-33
5.5.4 Front Panel...........................................................................................................................................5-35
5.5.5 Valid Slots............................................................................................................................................5-37
5.5.6 Board Feature Code..............................................................................................................................5-37
5.5.7 Board Configuration Reference...........................................................................................................5-37

ii Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Contents

5.5.8 Technical Specifications......................................................................................................................5-38

5.6 SLT1..............................................................................................................................................................5-39
5.6.1 Version Description..............................................................................................................................5-39
5.6.2 Function and Feature............................................................................................................................5-39
5.6.3 Working Principle and Signal Flow.....................................................................................................5-40
5.6.4 Front Panel...........................................................................................................................................5-42
5.6.5 Valid Slots............................................................................................................................................5-44
5.6.6 Board Configuration Reference...........................................................................................................5-44
5.6.7 Technical Specifications......................................................................................................................5-44
5.7 SEP1..............................................................................................................................................................5-45
5.7.1 Version Description..............................................................................................................................5-46
5.7.2 Function and Feature............................................................................................................................5-46
5.7.3 Working Principle and Signal Flow.....................................................................................................5-47
5.7.4 Front Panel...........................................................................................................................................5-50
5.7.5 Valid Slots............................................................................................................................................5-52
5.7.6 TPS Protection for the Board...............................................................................................................5-52
5.7.7 Board Configuration Reference...........................................................................................................5-53
5.7.8 Technical Specifications......................................................................................................................5-54
5.8 SL4................................................................................................................................................................5-54
5.8.1 Version Description..............................................................................................................................5-55
5.8.2 Function and Feature............................................................................................................................5-55
5.8.3 Working Principle and Signal Flow.....................................................................................................5-56
5.8.4 Front Panel...........................................................................................................................................5-58
5.8.5 Valid Slots............................................................................................................................................5-60
5.8.6 Board Feature Code..............................................................................................................................5-60
5.8.7 Board Configuration Reference...........................................................................................................5-61
5.8.8 Technical Specifications......................................................................................................................5-61
5.9 SL4A.............................................................................................................................................................5-62
5.9.1 Version Description..............................................................................................................................5-63
5.9.2 Function and Feature............................................................................................................................5-63
5.9.3 Working Principle and Signal Flow.....................................................................................................5-64
5.9.4 Front Panel...........................................................................................................................................5-65
5.9.5 Valid Slots............................................................................................................................................5-67
5.9.6 Board Feature Code..............................................................................................................................5-67
5.9.7 Board Configuration Reference...........................................................................................................5-67
5.9.8 Technical Specifications......................................................................................................................5-67
5.10 SLD4...........................................................................................................................................................5-68
5.10.1 Version Description............................................................................................................................5-69
5.10.2 Function and Feature..........................................................................................................................5-70
5.10.3 Working Principle and Signal Flow...................................................................................................5-71
5.10.4 Front Panel.........................................................................................................................................5-73
5.10.5 Valid Slots..........................................................................................................................................5-74

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 OptiX OSN 1500 Intelligent Optical Transmission System
Contents Hardware Description

5.10.6 Board Feature Code............................................................................................................................5-75

5.10.7 Board Configuration Reference.........................................................................................................5-75
5.10.8 Technical Specifications....................................................................................................................5-76
5.11 SLD4A........................................................................................................................................................5-77
5.11.1 Version Description............................................................................................................................5-77
5.11.2 Function and Feature..........................................................................................................................5-77
5.11.3 Working Principle and Signal Flow...................................................................................................5-78
5.11.4 Front Panel.........................................................................................................................................5-79
5.11.5 Valid Slots..........................................................................................................................................5-81
5.11.6 Board Feature Code............................................................................................................................5-81
5.11.7 Board Configuration Reference.........................................................................................................5-81
5.11.8 Technical Specifications....................................................................................................................5-81
5.12 SLQ4...........................................................................................................................................................5-83
5.12.1 Version Description............................................................................................................................5-83
5.12.2 Function and Feature..........................................................................................................................5-84
5.12.3 Working Principle and Signal Flow...................................................................................................5-85
5.12.4 Front Panel.........................................................................................................................................5-87
5.12.5 Valid Slots..........................................................................................................................................5-88
5.12.6 Board Feature Code............................................................................................................................5-88
5.12.7 Board Configuration Reference.........................................................................................................5-89
5.12.8 Technical Specifications....................................................................................................................5-89
5.13 SLQ4A........................................................................................................................................................5-90
5.13.1 Version Description............................................................................................................................5-90
5.13.2 Function and Feature..........................................................................................................................5-91
5.13.3 Working Principle and Signal Flow...................................................................................................5-92
5.13.4 Front Panel.........................................................................................................................................5-93
5.13.5 Valid Slots..........................................................................................................................................5-94
5.13.6 Board Feature Code............................................................................................................................5-94
5.13.7 Board Configuration Reference.........................................................................................................5-94
5.13.8 Technical Specifications....................................................................................................................5-95
5.14 SL16............................................................................................................................................................5-96
5.14.1 Version Description............................................................................................................................5-96
5.14.2 Function and Feature..........................................................................................................................5-97
5.14.3 Working Principle and Signal Flow...................................................................................................5-98
5.14.4 Front Panel.......................................................................................................................................5-100
5.14.5 Valid Slots........................................................................................................................................5-102
5.14.6 Board Feature Code..........................................................................................................................5-102
5.14.7 Board Configuration Reference.......................................................................................................5-102
5.14.8 Technical Specifications..................................................................................................................5-102
5.15 SL16A.......................................................................................................................................................5-104
5.15.1 Version Description..........................................................................................................................5-105
5.15.2 Function and Feature........................................................................................................................5-105

iv Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Contents

5.15.3 Working Principle and Signal Flow.................................................................................................5-106

5.15.4 Front Panel.......................................................................................................................................5-109
5.15.5 Valid Slots........................................................................................................................................5-110
5.15.6 Board Feature Code..........................................................................................................................5-110
5.15.7 Board Configuration Reference.......................................................................................................5-111
5.15.8 Technical Specifications..................................................................................................................5-111
5.16 SF16..........................................................................................................................................................5-112
5.16.1 Version Description..........................................................................................................................5-113
5.16.2 Function and Feature........................................................................................................................5-113
5.16.3 Working Principle and Signal Flow.................................................................................................5-114
5.16.4 Front Panel.......................................................................................................................................5-116
5.16.5 Valid Slots........................................................................................................................................5-118
5.16.6 Board Configuration Reference.......................................................................................................5-118
5.16.7 Technical Specifications..................................................................................................................5-118

6 PDH Processing Boards............................................................................................................6-1

6.1 PL1..................................................................................................................................................................6-3
6.1.1 Version Description................................................................................................................................6-3
6.1.2 Function and Feature..............................................................................................................................6-3
6.1.3 Working Principle and Signal Flow.......................................................................................................6-4
6.1.4 Front Panel.............................................................................................................................................6-6
6.1.5 Valid Slots..............................................................................................................................................6-7
6.1.6 Board Feature Code................................................................................................................................6-7
6.1.7 Board Configuration Reference.............................................................................................................6-7
6.1.8 Technical Specifications........................................................................................................................6-8
6.2 PD1 .................................................................................................................................................................6-8
6.2.1 Version Description................................................................................................................................6-9
6.2.2 Function and Feature..............................................................................................................................6-9
6.2.3 Working Principle and Signal Flow.....................................................................................................6-10
6.2.4 Front Panel...........................................................................................................................................6-13
6.2.5 Valid Slots............................................................................................................................................6-13
6.2.6 Board Feature Code..............................................................................................................................6-14
6.2.7 TPS Protection for the Board...............................................................................................................6-15
6.2.8 Board Configuration Reference...........................................................................................................6-17
6.2.9 Technical Specifications......................................................................................................................6-17
6.3 PQ1................................................................................................................................................................6-18
6.3.1 Version Description..............................................................................................................................6-18
6.3.2 Function and Feature............................................................................................................................6-19
6.3.3 Working Principle and Signal Flow.....................................................................................................6-20
6.3.4 Front Panel...........................................................................................................................................6-22
6.3.5 Valid Slots............................................................................................................................................6-23
6.3.6 Board Feature Code..............................................................................................................................6-24
6.3.7 TPS Protection for the Board...............................................................................................................6-24

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 OptiX OSN 1500 Intelligent Optical Transmission System
Contents Hardware Description

6.3.8 Board Configuration Reference...........................................................................................................6-26

6.3.9 Technical Specifications......................................................................................................................6-26
6.4 PQM .............................................................................................................................................................6-27
6.4.1 Version Description..............................................................................................................................6-27
6.4.2 Function and Feature............................................................................................................................6-27
6.4.3 Working Principle and Signal Flow.....................................................................................................6-28
6.4.4 Front Panel...........................................................................................................................................6-31
6.4.5 Valid Slots............................................................................................................................................6-32
6.4.6 TPS Protection for the Board...............................................................................................................6-32
6.4.7 Board Configuration Reference...........................................................................................................6-34
6.4.8 Technical Specifications......................................................................................................................6-34
6.5 PL3................................................................................................................................................................6-35
6.5.1 Version Description..............................................................................................................................6-35
6.5.2 Function and Feature............................................................................................................................6-36
6.5.3 Working Principle and Signal Flow.....................................................................................................6-36
6.5.4 Front Panel...........................................................................................................................................6-39
6.5.5 Valid Slots............................................................................................................................................6-40
6.5.6 TPS Protection for the Board...............................................................................................................6-40
6.5.7 Board Configuration Reference...........................................................................................................6-42
6.5.8 Technical Specifications......................................................................................................................6-42
6.6 PL3A.............................................................................................................................................................6-43
6.6.1 Version Description..............................................................................................................................6-43
6.6.2 Function and Feature............................................................................................................................6-44
6.6.3 Working Principle and Signal Flow.....................................................................................................6-45
6.6.4 Front Panel...........................................................................................................................................6-47
6.6.5 Valid Slots............................................................................................................................................6-48
6.6.6 Board Configuration Reference...........................................................................................................6-49
6.6.7 Technical Specifications......................................................................................................................6-49
6.7 PD3................................................................................................................................................................6-50
6.7.1 Version Description..............................................................................................................................6-50
6.7.2 Function and Feature............................................................................................................................6-51
6.7.3 Working Principle and Signal Flow.....................................................................................................6-51
6.7.4 Front Panel...........................................................................................................................................6-54
6.7.5 Valid Slots............................................................................................................................................6-55
6.7.6 TPS Protection for the Board...............................................................................................................6-55
6.7.7 Board Configuration Reference...........................................................................................................6-57
6.7.8 Technical Specifications......................................................................................................................6-57
6.8 PQ3................................................................................................................................................................6-57
6.8.1 Version Description..............................................................................................................................6-58
6.8.2 Function and Feature............................................................................................................................6-58
6.8.3 Working Principle and Signal Flow.....................................................................................................6-59
6.8.4 Front Panel...........................................................................................................................................6-61

vi Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Contents

6.8.5 Valid Slots............................................................................................................................................6-62

6.8.6 TPS Protection for the Board...............................................................................................................6-63
6.8.7 Board Configuration Reference...........................................................................................................6-64
6.8.8 Technical Specifications......................................................................................................................6-65
6.9 DX1...............................................................................................................................................................6-65
6.9.1 Version Description..............................................................................................................................6-66
6.9.2 Function and Feature............................................................................................................................6-66
6.9.3 Working Principle and Signal Flow.....................................................................................................6-66
6.9.4 Front Panel...........................................................................................................................................6-68
6.9.5 Valid Slots............................................................................................................................................6-69
6.9.6 Board Feature Code..............................................................................................................................6-69
6.9.7 TPS Protection for the Board...............................................................................................................6-70
6.9.8 Board Configuration Reference...........................................................................................................6-71
6.9.9 Technical Specifications......................................................................................................................6-71
6.10 DXA............................................................................................................................................................6-72
6.10.1 Version Description............................................................................................................................6-72
6.10.2 Function and Feature..........................................................................................................................6-73
6.10.3 Working Principle and Signal Flow...................................................................................................6-73
6.10.4 Front Panel.........................................................................................................................................6-74
6.10.5 Valid Slots..........................................................................................................................................6-75
6.10.6 Board Configuration Reference.........................................................................................................6-76
6.10.7 Technical Specifications....................................................................................................................6-76
6.11 SPQ4............................................................................................................................................................6-76
6.11.1 Version Description............................................................................................................................6-77
6.11.2 Function and Feature..........................................................................................................................6-77
6.11.3 Working Principle and Signal Flow...................................................................................................6-78
6.11.4 Front Panel.........................................................................................................................................6-82
6.11.5 Valid Slots..........................................................................................................................................6-83
6.11.6 TPS Protection for the Board.............................................................................................................6-84
6.11.7 Board Configuration Reference.........................................................................................................6-85
6.11.8 Technical Specifications....................................................................................................................6-85

7 Data Processing Boards.............................................................................................................7-1

7.1 EFT4................................................................................................................................................................7-3
7.1.1 Version Description................................................................................................................................7-3
7.1.2 Function and Feature..............................................................................................................................7-3
7.1.3 Working Principle and Signal Flow.......................................................................................................7-4
7.1.4 Front Panel.............................................................................................................................................7-6
7.1.5 Valid Slots..............................................................................................................................................7-8
7.1.6 Board Configuration Reference.............................................................................................................7-8
7.1.7 Technical Specifications........................................................................................................................7-8
7.2 EFT8................................................................................................................................................................7-9
7.2.1 Version Description................................................................................................................................7-9

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 OptiX OSN 1500 Intelligent Optical Transmission System
Contents Hardware Description

7.2.2 Function and Feature..............................................................................................................................7-9

7.2.3 Working Principle and Signal Flow.....................................................................................................7-11
7.2.4 Front Panel...........................................................................................................................................7-12
7.2.5 Valid Slots............................................................................................................................................7-14
7.2.6 Board Configuration Reference...........................................................................................................7-15
7.2.7 Technical Specifications......................................................................................................................7-15
7.3 EFT8A...........................................................................................................................................................7-16
7.3.1 Version Description..............................................................................................................................7-16
7.3.2 Function and Feature............................................................................................................................7-16
7.3.3 Working Principle and Signal Flow.....................................................................................................7-17
7.3.4 Front Panel...........................................................................................................................................7-19
7.3.5 Valid Slots............................................................................................................................................7-21
7.3.6 Board Configuration Reference...........................................................................................................7-22
7.3.7 Technical Specifications......................................................................................................................7-22
7.4 EGT2.............................................................................................................................................................7-22
7.4.1 Version Description..............................................................................................................................7-23
7.4.2 Function and Feature............................................................................................................................7-23
7.4.3 Working Principle and Signal Flow.....................................................................................................7-24
7.4.4 Front Panel...........................................................................................................................................7-26
7.4.5 Valid Slots............................................................................................................................................7-28
7.4.6 Board Feature Code..............................................................................................................................7-28
7.4.7 Board Configuration Reference...........................................................................................................7-28
7.4.8 Technical Specifications......................................................................................................................7-28
7.5 EFS0..............................................................................................................................................................7-30
7.5.1 Version Description..............................................................................................................................7-30
7.5.2 Function and Feature............................................................................................................................7-31
7.5.3 Working Principle and Signal Flow.....................................................................................................7-33
7.5.4 Front Panel...........................................................................................................................................7-36
7.5.5 Valid Slots............................................................................................................................................7-37
7.5.6 TPS Protection......................................................................................................................................7-37
7.5.7 Board Configuration Reference...........................................................................................................7-38
7.5.8 Technical Specifications......................................................................................................................7-38
7.6 EFS4..............................................................................................................................................................7-38
7.6.1 Version Description..............................................................................................................................7-39
7.6.2 Function and Feature............................................................................................................................7-39
7.6.3 Working Principle and Signal Flow.....................................................................................................7-41
7.6.4 Front Panel...........................................................................................................................................7-44
7.6.5 Valid Slots............................................................................................................................................7-46
7.6.6 Board Configuration Reference...........................................................................................................7-46
7.6.7 Technical Specifications......................................................................................................................7-46
7.7 EGS2.............................................................................................................................................................7-46
7.7.1 Version Description..............................................................................................................................7-47

viii Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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Hardware Description Contents

7.7.2 Function and Feature............................................................................................................................7-47

7.7.3 Working Principle and Signal Flow.....................................................................................................7-50
7.7.4 Front Panel...........................................................................................................................................7-52
7.7.5 Valid Slots............................................................................................................................................7-54
7.7.6 Board Feature Code..............................................................................................................................7-54
7.7.7 Board Configuration Reference...........................................................................................................7-54
7.7.8 Technical Specifications......................................................................................................................7-54
7.8 EMS4.............................................................................................................................................................7-55
7.8.1 Version Description..............................................................................................................................7-56
7.8.2 Function and Feature............................................................................................................................7-56
7.8.3 Working Principle and Signal Flow.....................................................................................................7-59
7.8.4 Front Panel...........................................................................................................................................7-61
7.8.5 Valid Slots............................................................................................................................................7-63
7.8.6 Board Feature Code..............................................................................................................................7-64
7.8.7 Board Protection...................................................................................................................................7-64
7.8.8 Board Configuration Reference...........................................................................................................7-67
7.8.9 Technical Specifications......................................................................................................................7-68
7.9 EGS4.............................................................................................................................................................7-69
7.9.1 Version Description..............................................................................................................................7-69
7.9.2 Function and Feature............................................................................................................................7-70
7.9.3 Working Principle and Signal Flow.....................................................................................................7-72
7.9.4 Front Panel...........................................................................................................................................7-75
7.9.5 Valid Slots............................................................................................................................................7-77
7.9.6 Board Feature Code..............................................................................................................................7-77
7.9.7 Board Protection...................................................................................................................................7-77
7.9.8 Board Configuration Reference...........................................................................................................7-80
7.9.9 Technical Specifications......................................................................................................................7-81
7.10 EGS4A........................................................................................................................................................7-82
7.10.1 Version Description............................................................................................................................7-82
7.10.2 Function and Feature..........................................................................................................................7-82
7.10.3 Working Principle and Signal Flow...................................................................................................7-84
7.10.4 Front Panel.........................................................................................................................................7-87
7.10.5 Valid Slots..........................................................................................................................................7-89
7.10.6 Board Feature Code............................................................................................................................7-89
7.10.7 Board Protection.................................................................................................................................7-89
7.10.8 Board Configuration Reference.........................................................................................................7-91
7.10.9 Technical Specifications....................................................................................................................7-92
7.11 EGR2...........................................................................................................................................................7-93
7.11.1 Version Description............................................................................................................................7-93
7.11.2 Function and Feature..........................................................................................................................7-93
7.11.3 Working Principle and Signal Flow...................................................................................................7-96
7.11.4 Front Panel.........................................................................................................................................7-98

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Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
Contents Hardware Description

7.11.5 Valid Slots........................................................................................................................................7-100

7.11.6 Board Feature Code..........................................................................................................................7-100
7.11.7 Board Configuration Reference.......................................................................................................7-100
7.11.8 Technical Specifications..................................................................................................................7-100
7.12 EMR0........................................................................................................................................................7-101
7.12.1 Version Description..........................................................................................................................7-102
7.12.2 Function and Feature........................................................................................................................7-103
7.12.3 Working Principle and Signal Flow.................................................................................................7-106
7.12.4 Front Panel.......................................................................................................................................7-108
7.12.5 Valid Slots........................................................................................................................................7-111
7.12.6 Board Feature Code..........................................................................................................................7-112
7.12.7 Board Configuration Reference.......................................................................................................7-112
7.12.8 Technical Specifications..................................................................................................................7-112
7.13 ADL4.........................................................................................................................................................7-113
7.13.1 Version Description..........................................................................................................................7-114
7.13.2 Function and Feature........................................................................................................................7-114
7.13.3 Working Principle and Signal Flow.................................................................................................7-115
7.13.4 Front Panel.......................................................................................................................................7-117
7.13.5 Valid Slots........................................................................................................................................7-119
7.13.6 Board Feature Code..........................................................................................................................7-119
7.13.7 Board Configuration Reference.......................................................................................................7-119
7.13.8 Technical Specifications..................................................................................................................7-120
7.14 ADQ1........................................................................................................................................................7-121
7.14.1 Version Description..........................................................................................................................7-121
7.14.2 Function and Feature........................................................................................................................7-121
7.14.3 Working Principle and Signal Flow.................................................................................................7-122
7.14.4 Front Panel.......................................................................................................................................7-124
7.14.5 Valid Slots........................................................................................................................................7-126
7.14.6 Board Feature Code..........................................................................................................................7-126
7.14.7 Board Configuration Reference.......................................................................................................7-126
7.14.8 Technical Specifications..................................................................................................................7-127
7.15 IDL4..........................................................................................................................................................7-128
7.15.1 Version Description..........................................................................................................................7-128
7.15.2 Function and Feature........................................................................................................................7-128
7.15.3 Working Principle ...........................................................................................................................7-130
7.15.4 Front Panel.......................................................................................................................................7-132
7.15.5 Valid Slots........................................................................................................................................7-134
7.15.6 Board Feature Code..........................................................................................................................7-134
7.15.7 Board Protection...............................................................................................................................7-134
7.15.8 Board Configuration Reference.......................................................................................................7-134
7.15.9 Technical Specifications..................................................................................................................7-135
7.16 IDQ1..........................................................................................................................................................7-136

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Hardware Description Contents

7.16.1 Version Description..........................................................................................................................7-136

7.16.2 Function and Feature........................................................................................................................7-136
7.16.3 Working Principle and Signal Flow.................................................................................................7-138
7.16.4 Front Panel.......................................................................................................................................7-140
7.16.5 Valid Slots........................................................................................................................................7-142
7.16.6 Board Feature Code..........................................................................................................................7-142
7.16.7 Board Protection...............................................................................................................................7-142
7.16.8 Board Configuration Reference.......................................................................................................7-142
7.16.9 Technical Specifications..................................................................................................................7-143
7.17 MST4.........................................................................................................................................................7-144
7.17.1 Version Description..........................................................................................................................7-144
7.17.2 Function and Feature........................................................................................................................7-144
7.17.3 Working Principle and Signal Flow.................................................................................................7-146
7.17.4 Front Panel.......................................................................................................................................7-148
7.17.5 Valid Slots........................................................................................................................................7-149
7.17.6 Board Feature Code..........................................................................................................................7-149
7.17.7 Board Configuration Reference.......................................................................................................7-150
7.17.8 Technical Specifications..................................................................................................................7-150

8 Interface Boards and Switching Boards.................................................................................8-1

8.1 L12S................................................................................................................................................................8-3
8.1.1 Version Description................................................................................................................................8-3
8.1.2 Function and Feature..............................................................................................................................8-3
8.1.3 Working Principle and Signal Flow.......................................................................................................8-3
8.1.4 Front Panel............................................................................................................................................. 8-4
8.1.5 Valid Slots..............................................................................................................................................8-5
8.1.6 Technical Specifications........................................................................................................................ 8-5
8.2 D12B............................................................................................................................................................... 8-5
8.2.1 Version Description................................................................................................................................8-6
8.2.2 Function and Feature..............................................................................................................................8-6
8.2.3 Working Principle and Signal Flow.......................................................................................................8-6
8.2.4 Front Panel............................................................................................................................................. 8-6
8.2.5 Valid Slots..............................................................................................................................................8-8
8.2.6 Technical Specifications........................................................................................................................ 8-9
8.3 D12S................................................................................................................................................................8-9
8.3.1 Version Description................................................................................................................................8-9
8.3.2 Function and Feature..............................................................................................................................8-9
8.3.3 Working Principle and Signal Flow.......................................................................................................8-9
8.3.4 Front Panel...........................................................................................................................................8-10
8.3.5 Valid Slots............................................................................................................................................8-12
8.3.6 Technical Specifications......................................................................................................................8-13
8.4 L75S..............................................................................................................................................................8-13
8.4.1 Version Description..............................................................................................................................8-13

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8.4.2 Function and Feature............................................................................................................................8-13

8.4.3 Working Principle and Signal Flow.....................................................................................................8-14
8.4.4 Front Panel...........................................................................................................................................8-14
8.4.5 Valid Slots............................................................................................................................................8-15
8.4.6 Technical Specifications......................................................................................................................8-15
8.5 D75S..............................................................................................................................................................8-16
8.5.1 Version Description..............................................................................................................................8-16
8.5.2 Function and Feature............................................................................................................................8-16
8.5.3 Working Principle and Signal Flow.....................................................................................................8-16
8.5.4 Front Panel...........................................................................................................................................8-17
8.5.5 Valid Slots............................................................................................................................................8-19
8.5.6 Technical Specifications......................................................................................................................8-20
8.6 D34S..............................................................................................................................................................8-20
8.6.1 Version Description..............................................................................................................................8-20
8.6.2 Function and Feature............................................................................................................................8-20
8.6.3 Working Principle and Signal Flow.....................................................................................................8-20
8.6.4 Front Panel...........................................................................................................................................8-21
8.6.5 Valid Slots............................................................................................................................................8-22
8.6.6 Technical Specifications......................................................................................................................8-22
8.7 C34S..............................................................................................................................................................8-23
8.7.1 Version Description..............................................................................................................................8-24
8.7.2 Function and Feature............................................................................................................................8-24
8.7.3 Working Principle and Signal Flow.....................................................................................................8-24
8.7.4 Front Panel...........................................................................................................................................8-25
8.7.5 Valid Slots............................................................................................................................................8-26
8.7.6 Technical Specifications......................................................................................................................8-26
8.8 EU04..............................................................................................................................................................8-27
8.8.1 Version Description..............................................................................................................................8-27
8.8.2 Function and Feature............................................................................................................................8-27
8.8.3 Working Principle and Signal Flow.....................................................................................................8-27
8.8.4 Front Panel...........................................................................................................................................8-28
8.8.5 Valid Slots............................................................................................................................................8-29
8.8.6 Technical Specifications......................................................................................................................8-30
8.9 EU08..............................................................................................................................................................8-30
8.9.1 Version Description..............................................................................................................................8-31
8.9.2 Function and Feature............................................................................................................................8-31
8.9.3 Working Principle and Signal Flow.....................................................................................................8-31
8.9.4 Front Panel...........................................................................................................................................8-32
8.9.5 Valid Slots............................................................................................................................................8-33
8.9.6 Technical Specifications......................................................................................................................8-33
8.10 OU08 ..........................................................................................................................................................8-34
8.10.1 Version Description............................................................................................................................8-34

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Hardware Description Contents

8.10.2 Function and Feature..........................................................................................................................8-35

8.10.3 Working Principle and Signal Flow...................................................................................................8-35
8.10.4 Front Panel.........................................................................................................................................8-36
8.10.5 Valid Slots..........................................................................................................................................8-38
8.10.6 Technical Specifications....................................................................................................................8-38
8.11 MU04..........................................................................................................................................................8-39
8.11.1 Version Description............................................................................................................................8-39
8.11.2 Function and Feature..........................................................................................................................8-39
8.11.3 Working Principle and Signal Flow...................................................................................................8-40
8.11.4 Front Panel.........................................................................................................................................8-40
8.11.5 Valid Slots..........................................................................................................................................8-41
8.11.6 Technical Specifications....................................................................................................................8-42
8.12 TSB4............................................................................................................................................................8-42
8.12.1 Version Description............................................................................................................................8-43
8.12.2 Function and Feature..........................................................................................................................8-43
8.12.3 Working Principle and Signal Flow...................................................................................................8-43
8.12.4 Front Panel.........................................................................................................................................8-44
8.12.5 Valid Slots..........................................................................................................................................8-45
8.12.6 Technical Specifications....................................................................................................................8-45
8.13 TSB8............................................................................................................................................................8-46
8.13.1 Version Description............................................................................................................................8-46
8.13.2 Function and Feature..........................................................................................................................8-46
8.13.3 Working Principle and Signal Flow...................................................................................................8-46
8.13.4 Front Panel.........................................................................................................................................8-47
8.13.5 Valid Slots..........................................................................................................................................8-48
8.13.6 Technical Specifications....................................................................................................................8-50
8.14 EFF8............................................................................................................................................................8-50
8.14.1 Version Description............................................................................................................................8-51
8.14.2 Function and Feature..........................................................................................................................8-51
8.14.3 Working Principle and Signal Flow...................................................................................................8-51
8.14.4 Front Panel.........................................................................................................................................8-52
8.14.5 Valid Slots..........................................................................................................................................8-53
8.14.6 Technical Specifications....................................................................................................................8-54
8.15 ETF8............................................................................................................................................................8-55
8.15.1 Version Description............................................................................................................................8-55
8.15.2 Function and Feature..........................................................................................................................8-55
8.15.3 Working Principle and Signal Flow...................................................................................................8-56
8.15.4 Front Panel.........................................................................................................................................8-56
8.15.5 Valid Slots..........................................................................................................................................8-58
8.15.6 Technical Specifications....................................................................................................................8-59
8.16 ETS8............................................................................................................................................................8-60
8.16.1 Version Description............................................................................................................................8-60

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8.16.2 Function and Feature..........................................................................................................................8-60

8.16.3 Working Principle and Signal Flow...................................................................................................8-60
8.16.4 Front Panel......................................................................................................................................... 8-61
8.16.5 Valid Slots..........................................................................................................................................8-63
8.16.6 Technical Specifications.................................................................................................................... 8-63
8.17 DM12.......................................................................................................................................................... 8-64
8.17.1 Version Description............................................................................................................................8-64
8.17.2 Function and Feature..........................................................................................................................8-64
8.17.3 Working Principle and Signal Flow...................................................................................................8-65
8.17.4 Front Panel......................................................................................................................................... 8-65
8.17.5 Valid Slots..........................................................................................................................................8-68
8.17.6 Technical Specifications.................................................................................................................... 8-68

9 Cross-Connect and System Control Boards..........................................................................9-1

9.1 CXL1...............................................................................................................................................................9-3
9.1.1 Version Description................................................................................................................................9-3
9.1.2 Function and Feature..............................................................................................................................9-4
9.1.3 Working Principle and Signal Flow.......................................................................................................9-7
9.1.4 Jumper and DIP Switch........................................................................................................................9-12
9.1.5 Front Panel........................................................................................................................................... 9-14
9.1.6 Valid Slots............................................................................................................................................9-18
9.1.7 Board Feature Code..............................................................................................................................9-18
9.1.8 Board Configuration Reference........................................................................................................... 9-18
9.1.9 Technical Specifications...................................................................................................................... 9-19
9.2 CXL4.............................................................................................................................................................9-20
9.2.1 Version Description..............................................................................................................................9-21
9.2.2 Function and Feature............................................................................................................................9-22
9.2.3 Working Principle and Signal Flow.....................................................................................................9-25
9.2.4 Jumper and DIP Switch........................................................................................................................9-30
9.2.5 Front Panel........................................................................................................................................... 9-32
9.2.6 Valid Slots............................................................................................................................................9-36
9.2.7 Board Feature Code..............................................................................................................................9-36
9.2.8 Board Configuration Reference........................................................................................................... 9-36
9.2.9 Technical Specifications...................................................................................................................... 9-37
9.3 CXL16...........................................................................................................................................................9-38
9.3.1 Version Description..............................................................................................................................9-39
9.3.2 Function and Feature............................................................................................................................9-40
9.3.3 Working Principle and Signal Flow.....................................................................................................9-43
9.3.4 Jumper and DIP Switch........................................................................................................................9-48
9.3.5 Front Panel........................................................................................................................................... 9-50
9.3.6 Valid Slots............................................................................................................................................9-54
9.3.7 Board Feature Code..............................................................................................................................9-54
9.3.8 Board Configuration Reference........................................................................................................... 9-54

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Hardware Description Contents

9.3.9 Technical Specifications......................................................................................................................9-55

9.4 CXLL1..........................................................................................................................................................9-56
9.4.1 Version Description..............................................................................................................................9-57
9.4.2 Function and Feature............................................................................................................................9-57
9.4.3 Working Principle and Signal Flow.....................................................................................................9-60
9.4.4 Jumper and DIP Switch........................................................................................................................9-65
9.4.5 Front Panel...........................................................................................................................................9-66
9.4.6 Valid Slots............................................................................................................................................9-68
9.4.7 Board Feature Code..............................................................................................................................9-68
9.4.8 Board Configuration Reference...........................................................................................................9-69
9.4.9 Technical Specifications......................................................................................................................9-69
9.5 CXLL4..........................................................................................................................................................9-71
9.5.1 Version Description..............................................................................................................................9-71
9.5.2 Function and Feature............................................................................................................................9-71
9.5.3 Working Principle and Signal Flow.....................................................................................................9-74
9.5.4 Jumper and DIP Switch........................................................................................................................9-79
9.5.5 Front Panel...........................................................................................................................................9-80
9.5.6 Valid Slots............................................................................................................................................9-82
9.5.7 Board Feature Code..............................................................................................................................9-82
9.5.8 Board Configuration Reference...........................................................................................................9-83
9.5.9 Technical Specifications......................................................................................................................9-83
9.6 CXLL16........................................................................................................................................................9-85
9.6.1 Version Description..............................................................................................................................9-85
9.6.2 Function and Feature............................................................................................................................9-85
9.6.3 Working Principle and Signal Flow.....................................................................................................9-88
9.6.4 Jumper and DIP Switch........................................................................................................................9-93
9.6.5 Front Panel...........................................................................................................................................9-94
9.6.6 Valid Slots............................................................................................................................................9-96
9.6.7 Board Feature Code..............................................................................................................................9-96
9.6.8 Board Configuration Reference...........................................................................................................9-97
9.6.9 Technical Specifications......................................................................................................................9-97
9.7 CXLD1..........................................................................................................................................................9-99
9.7.1 Version Description..............................................................................................................................9-99
9.7.2 Function and Feature............................................................................................................................9-99
9.7.3 Working Principle and Signal Flow...................................................................................................9-102
9.7.4 Jumper and DIP Switch......................................................................................................................9-107
9.7.5 Front Panel.........................................................................................................................................9-108
9.7.6 Valid Slots..........................................................................................................................................9-110
9.7.7 Board Feature Code............................................................................................................................9-110
9.7.8 Board Configuration Reference.........................................................................................................9-111
9.7.9 Technical Specifications....................................................................................................................9-111
9.8 CXLD4........................................................................................................................................................9-113

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9.8.1 Version Description............................................................................................................................9-113

9.8.2 Function and Feature..........................................................................................................................9-113
9.8.3 Working Principle and Signal Flow...................................................................................................9-116
9.8.4 Jumper and DIP Switch......................................................................................................................9-121
9.8.5 Front Panel.........................................................................................................................................9-122
9.8.6 Valid Slots..........................................................................................................................................9-124
9.8.7 Board Feature Code............................................................................................................................9-124
9.8.8 Board Configuration Reference.........................................................................................................9-125
9.8.9 Technical Specifications....................................................................................................................9-125
9.9 CXLQ1........................................................................................................................................................9-127
9.9.1 Version Description............................................................................................................................9-127
9.9.2 Function and Feature..........................................................................................................................9-127
9.9.3 Working Principle and Signal Flow...................................................................................................9-130
9.9.4 Jumper and DIP Switch......................................................................................................................9-135
9.9.5 Front Panel.........................................................................................................................................9-136
9.9.6 Valid Slots..........................................................................................................................................9-138
9.9.7 Board Feature Code............................................................................................................................9-138
9.9.8 Board Configuration Reference.........................................................................................................9-139
9.9.9 Technical Specifications....................................................................................................................9-139
9.10 CXLQ4......................................................................................................................................................9-141
9.10.1 Version Description..........................................................................................................................9-141
9.10.2 Function and Feature........................................................................................................................9-141
9.10.3 Working Principle and Signal Flow.................................................................................................9-144
9.10.4 Jumper and DIP Switch....................................................................................................................9-149
9.10.5 Front Panel.......................................................................................................................................9-150
9.10.6 Valid Slots........................................................................................................................................9-152
9.10.7 Board Feature Code..........................................................................................................................9-152
9.10.8 Board Configuration Reference.......................................................................................................9-153
9.10.9 Technical Specifications..................................................................................................................9-153

10 Auxiliary Boards.....................................................................................................................10-1
10.1 EOW............................................................................................................................................................10-2
10.1.1 Version Description............................................................................................................................10-2
10.1.2 Function and Feature..........................................................................................................................10-2
10.1.3 Working Principle and Signal Flow...................................................................................................10-3
10.1.4 Front Panel......................................................................................................................................... 10-4
10.1.5 Valid Slots..........................................................................................................................................10-6
10.1.6 Technical Specifications.................................................................................................................... 10-6
10.2 AUX............................................................................................................................................................10-6
10.2.1 Version Description............................................................................................................................10-6
10.2.2 Function and Feature..........................................................................................................................10-7
10.2.3 Working Principle and Signal Flow...................................................................................................10-7
10.2.4 Front Panel.......................................................................................................................................10-11

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Hardware Description Contents

10.2.5 Valid Slots........................................................................................................................................10-14

10.2.6 Technical Specifications..................................................................................................................10-14
10.3 AMU..........................................................................................................................................................10-14
10.3.1 Version Description..........................................................................................................................10-15
10.3.2 Function and Feature........................................................................................................................10-15
10.3.3 Working Principle and Signal Flow.................................................................................................10-15
10.3.4 Front Panel.......................................................................................................................................10-17
10.3.5 Valid Slots........................................................................................................................................10-20
10.3.6 Technical Specifications..................................................................................................................10-20
10.4 FAN...........................................................................................................................................................10-20
10.4.1 Version Description..........................................................................................................................10-20
10.4.2 Function and Feature........................................................................................................................10-20
10.4.3 Working Principle and Signal Flow.................................................................................................10-21
10.4.4 Front Panel.......................................................................................................................................10-21
10.4.5 Valid Slots........................................................................................................................................10-22
10.4.6 Technical Specifications..................................................................................................................10-22

11 WDM Processing Boards......................................................................................................11-1

11.1 CMR2..........................................................................................................................................................11-3
11.1.1 Version Description............................................................................................................................11-3
11.1.2 Function and Feature..........................................................................................................................11-3
11.1.3 Working Principle and Signal Flow...................................................................................................11-4
11.1.4 Front Panel.........................................................................................................................................11-5
11.1.5 Valid Slots..........................................................................................................................................11-7
11.1.6 Board Feature Code............................................................................................................................11-7
11.1.7 Technical Specifications....................................................................................................................11-8
11.2 CMR4..........................................................................................................................................................11-9
11.2.1 Version Description............................................................................................................................11-9
11.2.2 Function and Feature..........................................................................................................................11-9
11.2.3 Working Principle and Signal Flow.................................................................................................11-10
11.2.4 Front Panel.......................................................................................................................................11-11
11.2.5 Valid Slots........................................................................................................................................11-13
11.2.6 Board Feature Code..........................................................................................................................11-13
11.2.7 Technical Specifications..................................................................................................................11-14
11.3 MR2...........................................................................................................................................................11-15
11.3.1 Version Description..........................................................................................................................11-16
11.3.2 Function and Feature........................................................................................................................11-16
11.3.3 Working Principle and Signal Flow.................................................................................................11-16
11.3.4 Front Panel.......................................................................................................................................11-17
11.3.5 Valid Slots........................................................................................................................................11-19
11.3.6 Board Feature Code..........................................................................................................................11-19
11.3.7 Technical Specifications..................................................................................................................11-20
11.4 MR2A........................................................................................................................................................11-21

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11.4.1 Version Description..........................................................................................................................11-21

11.4.2 Function and Feature........................................................................................................................11-21
11.4.3 Working Principle and Signal Flow.................................................................................................11-23
11.4.4 Front Panel.......................................................................................................................................11-24
11.4.5 Valid Slots........................................................................................................................................11-25
11.4.6 Technical Specifications..................................................................................................................11-25
11.5 MR2B........................................................................................................................................................11-26
11.5.1 Version Description..........................................................................................................................11-27
11.5.2 Function and Feature........................................................................................................................11-27
11.5.3 Working Principle and Signal Flow.................................................................................................11-28
11.5.4 Front Panel.......................................................................................................................................11-29
11.5.5 Valid Slots........................................................................................................................................11-30
11.5.6 Technical Specifications..................................................................................................................11-30
11.6 MR2C........................................................................................................................................................11-31
11.6.1 Version Description..........................................................................................................................11-32
11.6.2 Function and Feature........................................................................................................................11-32
11.6.3 Working Principle and Signal Flow.................................................................................................11-33
11.6.4 Front Panel.......................................................................................................................................11-34
11.6.5 Valid Slots........................................................................................................................................11-36
11.6.6 Technical Specifications..................................................................................................................11-36
11.7 MR4...........................................................................................................................................................11-37
11.7.1 Version Description..........................................................................................................................11-37
11.7.2 Function and Feature........................................................................................................................11-37
11.7.3 Working Principle and Signal Flow.................................................................................................11-38
11.7.4 Front Panel.......................................................................................................................................11-39
11.7.5 Valid Slots........................................................................................................................................11-40
11.7.6 Board Feature Code..........................................................................................................................11-40
11.7.7 Technical Specifications..................................................................................................................11-41
11.8 LWX..........................................................................................................................................................11-42
11.8.1 Version Description..........................................................................................................................11-43
11.8.2 Function and Feature........................................................................................................................11-43
11.8.3 Working Principle and Signal Flow.................................................................................................11-44
11.8.4 Front Panel.......................................................................................................................................11-46
11.8.5 Valid Slots........................................................................................................................................11-48
11.8.6 Board Feature Code..........................................................................................................................11-48
11.8.7 Technical Specifications..................................................................................................................11-48
11.9 OBU1........................................................................................................................................................11-51
11.9.1 Version Description..........................................................................................................................11-52
11.9.2 Function and Feature........................................................................................................................11-52
11.9.3 Working Principle and Signal Flow.................................................................................................11-53
11.9.4 Front Panel.......................................................................................................................................11-54
11.9.5 Valid Slots........................................................................................................................................11-56

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11.9.6 Board Feature Code..........................................................................................................................11-56

11.9.7 Technical Specifications..................................................................................................................11-56
11.10 FIB...........................................................................................................................................................11-58
11.10.1 Version Description........................................................................................................................11-58
11.10.2 Function and Feature......................................................................................................................11-58
11.10.3 Working Principle and Signal Flow...............................................................................................11-59
11.10.4 Front Panel.....................................................................................................................................11-59
11.10.5 Valid Slots......................................................................................................................................11-60
11.10.6 Technical Specifications................................................................................................................11-61

12 Optical Amplifier Boards and Dispersion Compensation Boards...............................12-1

12.1 BA2............................................................................................................................................................. 12-2
12.1.1 Version Description............................................................................................................................12-2
12.1.2 Function and Feature..........................................................................................................................12-2
12.1.3 Working Principle and Signal Flow...................................................................................................12-3
12.1.4 Front Panel......................................................................................................................................... 12-5
12.1.5 Valid Slots..........................................................................................................................................12-8
12.1.6 Board Feature Code............................................................................................................................12-8
12.1.7 Technical Specifications.................................................................................................................... 12-9
12.2 BPA...........................................................................................................................................................12-10
12.2.1 Version Description..........................................................................................................................12-10
12.2.2 Function and Feature........................................................................................................................12-11
12.2.3 Working Principle and Signal Flow.................................................................................................12-12
12.2.4 Front Panel.......................................................................................................................................12-13
12.2.5 Valid Slots........................................................................................................................................12-15
12.2.6 Board Feature Code..........................................................................................................................12-15
12.2.7 Technical Specifications..................................................................................................................12-15
12.3 COA..........................................................................................................................................................12-16
12.3.1 Version Description..........................................................................................................................12-17
12.3.2 Function and Feature........................................................................................................................12-17
12.3.3 Working Principle and Signal Flow.................................................................................................12-20
12.3.4 Front Panel.......................................................................................................................................12-22
12.3.5 Installation Position..........................................................................................................................12-26
12.3.6 Board Feature Code..........................................................................................................................12-27
12.3.7 Technical Specifications..................................................................................................................12-27

13 Power Interface Boards.........................................................................................................13-1

13.1 UPM............................................................................................................................................................13-2
13.1.1 Version Description............................................................................................................................13-2
13.1.2 Function and Feature..........................................................................................................................13-2
13.1.3 Working Principle and Signal Flow...................................................................................................13-3
13.1.4 Rear Panel.......................................................................................................................................... 13-4
13.1.5 Valid Slots..........................................................................................................................................13-6
13.1.6 Technical Specifications.................................................................................................................... 13-6

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13.2 PIU..............................................................................................................................................................13-7
13.2.1 Version Description............................................................................................................................13-8
13.2.2 Function and Feature..........................................................................................................................13-8
13.2.3 Working Principle and Signal Flow...................................................................................................13-8
13.2.4 Front Panel.........................................................................................................................................13-9
13.2.5 Valid Slots........................................................................................................................................13-10
13.2.6 Technical Specifications..................................................................................................................13-10
13.3 PIUA..........................................................................................................................................................13-11
13.3.1 Version Description..........................................................................................................................13-11
13.3.2 Function and Feature........................................................................................................................13-12
13.3.3 Working Principle and Signal Flow.................................................................................................13-12
13.3.4 Front Panel.......................................................................................................................................13-13
13.3.5 Valid Slots........................................................................................................................................13-14
13.3.6 Technical Specifications..................................................................................................................13-14

14 Cables.......................................................................................................................................14-1
14.1 Fiber Jumper................................................................................................................................................14-2
14.1.1 Types of Fiber Jumpers......................................................................................................................14-2
14.1.2 Connector...........................................................................................................................................14-3
14.2 Power Cables and Grounding Cables..........................................................................................................14-5
14.2.1 Cabinet –48 V/BGND/PGND Power Cable.......................................................................................14-5
14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable......................................................14-7
14.2.3 UPM Power Cable..............................................................................................................................14-9
14.3 Alarm Cable..............................................................................................................................................14-10
14.3.1 Alarm Input/Output Cable................................................................................................................14-10
14.4 Management Cable....................................................................................................................................14-12
14.4.1 OAM Serial Port Cable....................................................................................................................14-13
14.4.2 Serial 1–4/F1/F&f Serial Port Cable................................................................................................14-14
14.4.3 RS232/RS422 Serial Port Cable.......................................................................................................14-15
14.4.4 Ordinary Telephone Wire.................................................................................................................14-17
14.4.5 COA Concatenating Cable...............................................................................................................14-18
14.4.6 Straight Through Cable....................................................................................................................14-19
14.4.7 Crossover Cable...............................................................................................................................14-20
14.5 Signal Cable..............................................................................................................................................14-21
14.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-22
14.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-24
14.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-26
14.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-28
14.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-31
14.5.6 Framed E1 Cable..............................................................................................................................14-32
14.5.7 N x 64 kbit/s Cables.........................................................................................................................14-32
14.6 Clock Cable...............................................................................................................................................14-49
14.6.1 Clock Cable......................................................................................................................................14-49

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Hardware Description Contents

14.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-51

A Equipment and Board Alarm Indicators.............................................................................A-1

A.1 Indicators on the Cabinet...............................................................................................................................A-2
A.2 Board Alarm Indicator...................................................................................................................................A-2

B Labels..........................................................................................................................................B-1
B.1 Safety Label...................................................................................................................................................B-2
B.1.1 Label Description..................................................................................................................................B-2
B.1.2 Label Position.......................................................................................................................................B-3
B.2 Optical Module Labels...................................................................................................................................B-5
B.3 Engineering Labels........................................................................................................................................B-7

C Power Consumption and Weight of Boards........................................................................C-1

D Board Version Configuration................................................................................................D-1
E Board Loopbacks.......................................................................................................................E-1
F Board Configuration Reference..............................................................................................F-1
F.1 SDH Processing Boards..................................................................................................................................F-2
F.2 PDH Processing Board...................................................................................................................................F-2
F.3 Data Processing Board....................................................................................................................................F-4
F.3.1 SDH Parameters.....................................................................................................................................F-5
F.3.2 Ethernet Parameters...............................................................................................................................F-6
F.3.3 ATM Parameter.....................................................................................................................................F-7
F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8

G Glossary.....................................................................................................................................G-1
H Acronyms and Abbreviations...............................................................................................H-1
Index.................................................................................................................................................i-1

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Hardware Description Figures

Figures

Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1

Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1
Figure 2-1 ETSI cabinet.......................................................................................................................................2-2
Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4
Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2
Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3
Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4
Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4
Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5
Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5
Figure 3-7 Slot layout of the OptiX OSN 1500B subrack.................................................................................3-13
Figure 3-8 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-13
Figure 4-1 Barcode of a board..............................................................................................................................4-3
Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5
Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7
Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8
Figure 5-4 Block diagram for the working principle of the SL1A.....................................................................5-13
Figure 5-5 Front panel of the SL1A...................................................................................................................5-14
Figure 5-6 Block diagram for the working principle of the SLQ1.....................................................................5-19
Figure 5-7 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-21
Figure 5-8 Front panel of the R1SLQ1..............................................................................................................5-22
Figure 5-9 Block diagram for the working principle of the SLQ1A board........................................................5-27
Figure 5-10 Front panel of the SLQ1A board....................................................................................................5-29
Figure 5-11 Block diagram for the working principle of the SLO1...................................................................5-34
Figure 5-12 Front panel of the SLO1.................................................................................................................5-36
Figure 5-13 Block diagram for the working principle of the SLT1...................................................................5-41
Figure 5-14 Front panel of the SLT1..................................................................................................................5-43
Figure 5-15 Block diagram for the working principle of the SEP1...................................................................5-48
Figure 5-16 Block diagram for the working principle of the SEP used with the EU08.....................................5-48
Figure 5-17 Block diagram for the working principle of the SEP used with the OU08....................................5-49
Figure 5-18 Front panel of the SEP1..................................................................................................................5-51
Figure 5-19 Principle of the TPS protection for the SEP1 ................................................................................5-52
Figure 5-20 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-53

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Figures Hardware Description

Figure 5-21 Block diagram for the working principle of the SL4......................................................................5-57
Figure 5-22 Front panel of the N1SL4/N2SL4..................................................................................................5-59
Figure 5-23 Front panel of the R1SL4...............................................................................................................5-59
Figure 5-24 Block diagram for the working principle of the SL4A...................................................................5-64
Figure 5-25 Front panel of the SL4A board.......................................................................................................5-66
Figure 5-26 Block diagram for the working principle of the SLD4...................................................................5-71
Figure 5-27 Front panel of the N1SLD4/N2SLD4.............................................................................................5-73
Figure 5-28 Front panel of the R1SLD4............................................................................................................5-74
Figure 5-29 Block diagram for the working principle of the SL4A board.........................................................5-79
Figure 5-30 Front panel of the SLD4A board....................................................................................................5-80
Figure 5-31 Block diagram for the working principle of the SLQ4...................................................................5-85
Figure 5-32 Front panel of the SLQ4.................................................................................................................5-87
Figure 5-33 Block diagram for the working principle of the SLQ4A................................................................5-92
Figure 5-34 Front panel of the SLQ4A board....................................................................................................5-93
Figure 5-35 Block diagram for the working principle of the SL16....................................................................5-99
Figure 5-36 Front panel of the SL16................................................................................................................5-101
Figure 5-37 Block diagram for the working principle of the N1SL16A and N2SL16A..................................5-107
Figure 5-38 Block diagram for the working principle of the N3SL16A..........................................................5-107
Figure 5-39 Front panel of the SL16A.............................................................................................................5-109
Figure 5-40 Block diagram for the working principle of the SF16..................................................................5-114
Figure 5-41 Front panel of the SF16................................................................................................................5-117
Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4
Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5
Figure 6-3 Front panel of the PL1........................................................................................................................6-6
Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11
Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11
Figure 6-6 Front panel of the PD1......................................................................................................................6-13
Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15
Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16
Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16
Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20
Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21
Figure 6-12 Front panel of the PQ1....................................................................................................................6-23
Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25
Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26
Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-29
Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29
Figure 6-17 Front panel of the PQM..................................................................................................................6-31
Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33
Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-34
Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37
Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37

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Hardware Description Figures

Figure 6-22 Front panel of the PL3....................................................................................................................6-39

Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41
Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42
Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45
Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-46
Figure 6-27 Front panel of the PL3A.................................................................................................................6-48
Figure 6-28 Block diagram for the functions of the PD3...................................................................................6-52
Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52
Figure 6-30 Front panel of the PD3....................................................................................................................6-54
Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55
Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-56
Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59
Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-60
Figure 6-35 Front panel of the PQ3....................................................................................................................6-62
Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-63
Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-64
Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-67
Figure 6-39 Front panel of the DX1...................................................................................................................6-68
Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-70
Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-71
Figure 6-42 Block diagram for the functions of the DXA.................................................................................6-73
Figure 6-43 Front panel of the DXA..................................................................................................................6-75
Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-79
Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-79
Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-80
Figure 6-47 Front panel of the SPQ4.................................................................................................................6-83
Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack.........................6-84
Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-85
Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5
Figure 7-2 Front panel of the EFT4......................................................................................................................7-7
Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11
Figure 7-4 Front panel of the EFT8....................................................................................................................7-13
Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18
Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20
Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-25
Figure 7-8 Front panel of the EGT2...................................................................................................................7-27
Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-34
Figure 7-10 Front panel of the EFS0..................................................................................................................7-36
Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................7-38

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Figures Hardware Description

Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-42

Figure 7-13 Front panel of the EFS4..................................................................................................................7-44
Figure 7-14 Block diagram for the functions of the EGS2................................................................................7-50
Figure 7-15 Front panel of the EGS2.................................................................................................................7-53
Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-59
Figure 7-17 Front panel of the EMS4................................................................................................................7-62
Figure 7-18 Normal working of the EMS4........................................................................................................7-65
Figure 7-19 Principle of the BPS protection for the EMS4...............................................................................7-66
Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-67
Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-73
Figure 7-22 Front panel of the EGS4.................................................................................................................7-76
Figure 7-23 Normal working of the EGS4.........................................................................................................7-78
Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-79
Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-80
Figure 7-26 Block diagram for the functions of the EGS4A..............................................................................7-85
Figure 7-27 Front panel of the EGS4A..............................................................................................................7-88
Figure 7-28 Normal working of the EGS4A......................................................................................................7-90
Figure 7-29 Principle of the BPS protection for the EGS4A.............................................................................7-91
Figure 7-30 Block diagram for the functions of the EGR2................................................................................7-96
Figure 7-31 Front panel of the EGR2.................................................................................................................7-99
Figure 7-32 Block diagram for the functions of the EMR0.............................................................................7-106
Figure 7-33 Front panel of the N1EMR0.........................................................................................................7-109
Figure 7-34 Front panel of the N2EMR0.........................................................................................................7-110
Figure 7-35 Block diagram for the functions of the ADL4..............................................................................7-116
Figure 7-36 Front panel of the ADL4.............................................................................................................. 7-118
Figure 7-37 Block diagram for the functions of the ADQ1............................................................................. 7-123
Figure 7-38 Front panel of the ADQ1..............................................................................................................7-125
Figure 7-39 Block diagram for the functions of the IDL4............................................................................... 7-131
Figure 7-40 Front panel of the IDL4................................................................................................................7-133
Figure 7-41 Block diagram for the functions of the IDQ1...............................................................................7-139
Figure 7-42 Front panel of the IDQ1................................................................................................................7-141
Figure 7-43 Block diagram for the functions of the MST4..............................................................................7-146
Figure 7-44 Front panel of the MST4.............................................................................................................. 7-148
Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3
Figure 8-2 Front panel of the L12S......................................................................................................................8-4
Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6
Figure 8-4 Front panel of the D12B.....................................................................................................................8-7
Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10
Figure 8-6 Front panel of the D12S....................................................................................................................8-11
Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14
Figure 8-8 Front panel of the L75S....................................................................................................................8-15
Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17

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Hardware Description Figures

Figure 8-10 Front panel of the D75S..................................................................................................................8-18

Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21
Figure 8-12 Front panel of the D34S..................................................................................................................8-22
Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24
Figure 8-14 Front panel of the C34S..................................................................................................................8-25
Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28
Figure 8-16 Front panel of the EU04.................................................................................................................8-29
Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31
Figure 8-18 Front panel of the EU08.................................................................................................................8-32
Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35
Figure 8-20 Front panel of the N1OU08............................................................................................................8-36
Figure 8-21 Front panel of the N2OU08............................................................................................................8-37
Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40
Figure 8-23 Front panel of the MU04................................................................................................................8-41
Figure 8-24 Block diagram for the functions of the TSB4.................................................................................8-43
Figure 8-25 Front panel of the TSB4.................................................................................................................8-44
Figure 8-26 Block diagram for the functions of the TSB8.................................................................................8-47
Figure 8-27 Front panel of the TSB8.................................................................................................................8-48
Figure 8-28 Block diagram for the functions of the EFF8.................................................................................8-51
Figure 8-29 Front panel of the EFF8..................................................................................................................8-52
Figure 8-30 Block diagram for the functions of the ETF8.................................................................................8-56
Figure 8-31 Front panel of the ETF8..................................................................................................................8-57
Figure 8-32 Block diagram for the functions of the ETS8.................................................................................8-61
Figure 8-33 Front panel of the ETS8..................................................................................................................8-62
Figure 8-34 Block diagram for the functions of the DM12................................................................................8-65
Figure 8-35 Front panel of the DM12................................................................................................................8-66
Figure 9-1 Block diagram for the functions of the Q2CXL1...............................................................................9-7
Figure 9-2 Block diagram for the functions of the Q3CXL1 board.....................................................................9-8
Figure 9-3 Block diagram of higher and lower order cross-connect modules..................................................9-11
Figure 9-4 Jumper and DIP switch of the CXL1 board.....................................................................................9-13
Figure 9-5 Front panel of the Q2CXL1..............................................................................................................9-15
Figure 9-6 Front panel the Q3CXL1 board .......................................................................................................9-16
Figure 9-7 Block diagram for the functions of the Q2CXL4.............................................................................9-25
Figure 9-8 Block diagram for the functions of the Q3CXL4 board...................................................................9-26
Figure 9-9 Block diagram of higher and lower order cross-connect modules..................................................9-29
Figure 9-10 Jumper and DIP switch of the CXL4 board...................................................................................9-31
Figure 9-11 Front panel of the Q2CXL4............................................................................................................9-33
Figure 9-12 Front panel the Q3CXL4 board .....................................................................................................9-34
Figure 9-13 Block diagram for the functions of the Q2CXL16.........................................................................9-43
Figure 9-14 Block diagram for the functions of the Q3CXL16 board...............................................................9-44
Figure 9-15 Block diagram of higher and lower order cross-connect modules................................................9-47
Figure 9-16 Jumper and DIP switch of the CXL16 board.................................................................................9-49

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Figures Hardware Description

Figure 9-17 Front panel of the Q2CXL16..........................................................................................................9-51

Figure 9-18 Front panel the Q3CXL16 board ...................................................................................................9-52
Figure 9-19 Block diagram for the functions of the CXLL1..............................................................................9-61
Figure 9-20 Block diagram of higher and lower order cross-connect modules................................................9-64
Figure 9-21 Jumper and DIP switch of the CXL board.....................................................................................9-65
Figure 9-22 Front panel the CXLL1 board .......................................................................................................9-67
Figure 9-23 Block diagram for the functions of the CXLL4..............................................................................9-75
Figure 9-24 Block diagram of higher and lower order cross-connect modules................................................9-78
Figure 9-25 Jumper and DIP switch of the CXL board.....................................................................................9-79
Figure 9-26 Front panel the CXLL4 board .......................................................................................................9-81
Figure 9-27 Block diagram for the functions of the CXLL16............................................................................9-89
Figure 9-28 Block diagram of higher and lower order cross-connect modules................................................9-92
Figure 9-29 Jumper and DIP switch of the CXL board.....................................................................................9-93
Figure 9-30 Front panel the CXLL16 board .....................................................................................................9-95
Figure 9-31 Block diagram for the functions of the CXLD1...........................................................................9-103
Figure 9-32 Block diagram of higher and lower order cross-connect modules..............................................9-106
Figure 9-33 Jumper and DIP switch of the CXL board...................................................................................9-107
Figure 9-34 Front panel the CXLD1 board .....................................................................................................9-109
Figure 9-35 Block diagram for the functions of the CXLD4...........................................................................9-117
Figure 9-36 Block diagram of higher and lower order cross-connect modules..............................................9-120
Figure 9-37 Jumper and DIP switch of the CXLD4 board...............................................................................9-121
Figure 9-38 Front panel the CXLD4 board .....................................................................................................9-123
Figure 9-39 Block diagram for the functions of the CXLQ1...........................................................................9-131
Figure 9-40 Block diagram of higher and lower order cross-connect modules..............................................9-134
Figure 9-41 Jumper and DIP switch of the CXLQ1 board...............................................................................9-135
Figure 9-42 Front panel the CXLQ1 board .....................................................................................................9-137
Figure 9-43 Block diagram for the functions of the CXLQ4...........................................................................9-145
Figure 9-44 Block diagram of higher and lower order cross-connect modules..............................................9-148
Figure 9-45 Jumper and DIP switch of the CXLQ4 board...............................................................................9-149
Figure 9-46 Front panel the CXLQ4 board .....................................................................................................9-151
Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3
Figure 10-2 Front panel of the EOW..................................................................................................................10-4
Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8
Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9
Figure 10-5 Front panel of the AUX................................................................................................................10-11
Figure 10-6 Block diagram for the functions of the AMU...............................................................................10-16
Figure 10-7 Positions of orderwire bytes in the SDH frame............................................................................10-16
Figure 10-8 Front panel of the AMU...............................................................................................................10-17
Figure 10-9 Connection of the cabinet alarm indicators..................................................................................10-19
Figure 10-10 Block diagram for the functions of the FAN..............................................................................10-21
Figure 10-11 Front panel of the FAN...............................................................................................................10-22
Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4

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Hardware Description Figures

Figure 11-2 Front panel of the CMR2................................................................................................................11-6

Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10
Figure 11-4 Front panel of the CMR4..............................................................................................................11-12
Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17
Figure 11-6 Front panel of the MR2................................................................................................................ 11-18
Figure 11-7 MR2A used as the OTM station...................................................................................................11-22
Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22
Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23
Figure 11-10 Front panel of the MR2A............................................................................................................11-24
Figure 11-11 MR2B used as the OTM station.................................................................................................11-27
Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28
Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28
Figure 11-14 Front panel of the MR2B............................................................................................................11-29
Figure 11-15 MR2C used as the OTM station.................................................................................................11-32
Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX
...........................................................................................................................................................................11-33
Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33
Figure 11-18 Front panel of the MR2C............................................................................................................11-35
Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38
Figure 11-20 Front panel of the MR4.............................................................................................................. 11-39
Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45
Figure 11-22 Front panel of the LWX..............................................................................................................11-47
Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53
Figure 11-24 Front panel of the OBU1............................................................................................................11-55
Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-58
Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-59
Figure 11-27 Front panel of the FIB................................................................................................................ 11-60
Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2
Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4
Figure 12-3 Front panel of the single-interface BA2.........................................................................................12-6
Figure 12-4 Front panel of the double-interface BA2........................................................................................12-7
Figure 12-5 Location of the BA and PA in the optical transmission system...................................................12-11
Figure 12-6 Block diagram for the working principle of the N1BPA..............................................................12-12
Figure 12-7 Block diagram for the working principle of the N2BPA..............................................................12-13
Figure 12-8 Front panel of the BPA.................................................................................................................12-14
Figure 12-9 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-18
Figure 12-10 Appearance of the case-shaped 62COA.....................................................................................12-19
Figure 12-11 Application of the optical Raman amplifier (62COA)...............................................................12-19
Figure 12-12 Block diagram for the functions of the 61COA and N1COA.................................................... 12-21
Figure 12-13 Front panel of the 61COA and N1COA.....................................................................................12-22
Figure 12-14 Front panel of the 62COA..........................................................................................................12-23
Figure 12-15 SC/PC fiber connector................................................................................................................12-24
Figure 12-16 LSH flange and fiber connector..................................................................................................12-24

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Figures Hardware Description

Figure 12-17 Position of the 61COA in the ETSI cabinet...............................................................................12-27

Figure 13-1 Appearance of the power supply case............................................................................................13-2
Figure 13-2 Rear view of the UPM....................................................................................................................13-4
Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9
Figure 13-4 Front panel of the PIU..................................................................................................................13-10
Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12
Figure 13-6 Front panel of the PIUA...............................................................................................................13-13
Figure 14-1 LC/PC optical connector................................................................................................................14-3
Figure 14-2 SC/PC optical connector.................................................................................................................14-4
Figure 14-3 FC/PC optical connector.................................................................................................................14-4
Figure 14-4 LSH/APC optical connector...........................................................................................................14-5
Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable....................................................14-6
Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6
Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6
Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable..................................................................14-8
Figure 14-9 PGND power cable.........................................................................................................................14-8
Figure 14-10 Structure of the UPM power cable...............................................................................................14-9
Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11
Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13
Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable..................................................................14-14
Figure 14-14 Structure of the RS232/RS422 serial port cable.........................................................................14-16
Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17
Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18
Figure 14-17 Structure of the straight through cable........................................................................................14-19
Figure 14-18 Structure of the crossover cable..................................................................................................14-20
Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22
Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24
Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-27
Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-29
Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-31
Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-34
Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35
Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-37
Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38
Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-40
Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-41
Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42
Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-44
Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-46
Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-48
Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-50
Figure 14-35 Structure of the 120-ohm clock cable.........................................................................................14-50

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Hardware Description Figures

Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-51
Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-52
Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4
Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4
Figure B-3 Labels on a board..............................................................................................................................B-5
Figure B-4 Optical module labels........................................................................................................................B-5

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Hardware Description Tables

Tables

Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3

Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4
Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5
Table 3-1 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX
OSN 1500A...........................................................................................................................................................3-5
Table 3-2 CXL series boards and their valid slots of the OptiX OSN 1500A.....................................................3-6
Table 3-3 SDH processing boards and their valid slots of the OptiX OSN 1500A.............................................3-7
Table 3-4 PDH processing boards and their valid slots of the OptiX OSN 1500A.............................................3-8
Table 3-5 Interface Boards and their valid slots of the OptiX OSN 1500A.........................................................3-9
Table 3-6 Data processing boards and their valid slots of the OptiX OSN 1500A..............................................3-9
Table 3-7 WDM boards and their valid slots of the OptiX OSN 1500A...........................................................3-11
Table 3-8 Optical booster amplifier boards and their valid slots of the OptiX OSN 1500A.............................3-12
Table 3-9 Auxiliary boards and their valid slots of the OptiX OSN 1500A......................................................3-12
Table 3-10 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX
OSN 1500B.........................................................................................................................................................3-14
Table 3-11 CXL series boards and their valid slots for the OptiX OSN 1500B................................................3-14
Table 3-12 SDH processing boards and their valid slots for the OptiX OSN 1500B........................................3-15
Table 3-13 PDH processing boards and their valid slots for the OptiX OSN 1500B........................................3-17
Table 3-14 Interface/protection switching boards and their valid slots for the OptiX OSN 1500B..................3-18
Table 3-15 Data processing boards and their valid slots for the OptiX OSN 1500B.........................................3-19
Table 3-16 WDM boards and their valid slots for the OptiX OSN 1500B........................................................3-23
Table 3-17 Optical booster amplifier boards and their valid slots for the OptiX OSN 1500B..........................3-23
Table 3-18 Auxiliary boards and their valid slots for the OptiX OSN 1500B...................................................3-24
Table 3-19 Technical specifications of the OptiX OSN 1500A subrack............................................................3-24
Table 3-20 Maximum power consumption of the OptiX OSN 1500A subrack.................................................3-24
Table 3-21 Technical specifications of the OptiX OSN 1500B subrack............................................................3-25
Table 3-22 Maximum power consumption of the OptiX OSN 1500B subrack.................................................3-25
Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2
Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4
Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5
Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7
Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7
Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8
Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8

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Tables Hardware Description

Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9
Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9
Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B
.............................................................................................................................................................................4-10
Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-11
Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11
Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11
Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B
.............................................................................................................................................................................4-12
Table 5-1 Version Description of the SL1............................................................................................................5-3
Table 5-2 Functions and features of the SL1........................................................................................................5-4
Table 5-3 Optical interfaces of the SL1................................................................................................................5-8
Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9
Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10
Table 5-6 Functions and features of the SL16A board.......................................................................................5-12
Table 5-7 Optical interfaces of the SL1A...........................................................................................................5-15
Table 5-8 Relation between the board feature code and optical interface type of the SL1A.............................5-15
Table 5-9 Specifications of the optical interfaces of the SL1A board................................................................5-16
Table 5-10 Version Description of the SLQ1.....................................................................................................5-18
Table 5-11 Functions and features of the SLQ1.................................................................................................5-18
Table 5-12 Optical interfaces of the SLQ1.........................................................................................................5-22
Table 5-13 Relation between the board feature code and the optical interface type..........................................5-23
Table 5-14 Specifications of the optical interfaces of the SLQ1........................................................................5-24
Table 5-15 Functions and features of the SLQ1A board....................................................................................5-26
Table 5-16 Optical interfaces of the SLQ1A board............................................................................................5-29
Table 5-17 Relation between the board feature code and optical interface type of the SLQ1A........................5-30
Table 5-18 Specifications of the optical interfaces of the SLQ1A board...........................................................5-31
Table 5-19 Functions and features of the SLO1 board.......................................................................................5-33
Table 5-20 Optical interfaces of the SLO1.........................................................................................................5-36
Table 5-21 Relation between the board feature code and the optical interface type..........................................5-37
Table 5-22 Specifications of the optical interfaces of the SLO1........................................................................5-38
Table 5-23 Functions and features of the SLT1.................................................................................................5-39
Table 5-24 Optical interfaces of the SLT1.........................................................................................................5-43
Table 5-25 Specifications of the optical interfaces of the SLT1........................................................................5-44
Table 5-26 Functions and features of the SEP1.................................................................................................5-46
Table 5-27 Access capabilities for the SEP1......................................................................................................5-47
Table 5-28 Electrical interfaces of the SEP1......................................................................................................5-52
Table 5-29 Slots for the SEP1, EU08 and TSB8................................................................................................5-53
Table 5-30 Technical specifications of the SEP1 board.....................................................................................5-54
Table 5-31 Version Description of the SL4........................................................................................................5-55
Table 5-32 Functions and features of the SL4....................................................................................................5-56
Table 5-33 Optical interfaces of the SL4............................................................................................................5-60
Table 5-34 Relation between the board feature code and the optical interface type of the SL4........................5-60

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Hardware Description Tables

Table 5-35 Specifications of the optical interfaces of the SL4...........................................................................5-61

Table 5-36 Functions and features of the SL4A.................................................................................................5-63
Table 5-37 Optical interfaces of the SL4A.........................................................................................................5-66
Table 5-38 Relation between the board feature code and optical interface type of the SL4A...........................5-67
Table 5-39 Specifications of the optical interfaces of the SL4A board..............................................................5-68
Table 5-40 Version Description of the SLD4.....................................................................................................5-69
Table 5-41 Functions and features of the SLD4.................................................................................................5-70
Table 5-42 Optical interfaces of the SLD4.........................................................................................................5-74
Table 5-43 Relation between the board feature code and the optical interface type of the SLD4.....................5-75
Table 5-44 Specifications of the optical interfaces of the SLD4........................................................................5-76
Table 5-45 Functions and features of the SLD4A board....................................................................................5-78
Table 5-46 Optical interfaces of the SLD4A board............................................................................................5-80
Table 5-47 Relation between the board feature code and optical interface type of the SLD4A........................5-81
Table 5-48 Specifications of the optical interfaces of the SLD4A board...........................................................5-82
Table 5-49 Version Description of the SLQ4.....................................................................................................5-83
Table 5-50 Functions and features of the SLQ4.................................................................................................5-84
Table 5-51 Optical interfaces of the SLQ4.........................................................................................................5-88
Table 5-52 Relation between the board feature code and the optical interface type of the SLQ4.....................5-88
Table 5-53 Specifications of the optical interfaces of the SLQ4........................................................................5-89
Table 5-54 Functions and features of the SLQ4A board....................................................................................5-91
Table 5-55 Optical interfaces of the SLQ4A board............................................................................................5-94
Table 5-56 Relation between the board feature code and optical interface type of the SLQ4A........................5-94
Table 5-57 Specifications of the optical interfaces of the SLQ4A board...........................................................5-95
Table 5-58 Version Description of the SL16......................................................................................................5-97
Table 5-59 Functions and features of the SL16..................................................................................................5-97
Table 5-60 Optical interfaces of the SL16........................................................................................................5-101
Table 5-61 Relation between the board feature code and the optical interface type for the SL16...................5-102
Table 5-62 Specifications of the optical interfaces of the SL16.......................................................................5-103
Table 5-63 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths
...........................................................................................................................................................................5-103
Table 5-64 Version Description of the SL16A.................................................................................................5-105
Table 5-65 Functions and features of the SL16A.............................................................................................5-106
Table 5-66 Optical interfaces of the SL16A.....................................................................................................5-110
Table 5-67 Relation between the board feature code and the optical interface type........................................5-110
Table 5-68 Specifications of the optical interfaces of the SL16A....................................................................5-111
Table 5-69 Functions and features of the SF16................................................................................................5-113
Table 5-70 Optical interfaces of the SF16........................................................................................................5-118
Table 5-71 Specifications of the optical interfaces of the SF16.......................................................................5-118
Table 5-72 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths
...........................................................................................................................................................................5-119
Table 6-1 Functions and features of the PL1........................................................................................................6-3
Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7
Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7

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Tables Hardware Description

Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8

Table 6-5 Version Description of the PD1...........................................................................................................6-9
Table 6-6 Functions and features of the PD1.....................................................................................................6-10
Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack
.............................................................................................................................................................................6-14
Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-14
Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15
Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-17
Table 6-11 Version Description of the PQ1.......................................................................................................6-19
Table 6-12 Functions and features of the PQ1...................................................................................................6-19
Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B
subrack................................................................................................................................................................6-24
Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24
Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-25
Table 6-16 Functions and features of the PQM..................................................................................................6-27
Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B
subrack................................................................................................................................................................6-32
Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-33
Table 6-19 Version description of the PL3........................................................................................................6-35
Table 6-20 Functions and features of the PL3....................................................................................................6-36
Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-40
Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-41
Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42
Table 6-24 Version description of the PL3A......................................................................................................6-44
Table 6-25 Functions and features of the PL3A.................................................................................................6-44
Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-49
Table 6-27 Version Description of the PD3.......................................................................................................6-50
Table 6-28 Functions and features of the PD3...................................................................................................6-51
Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-55
Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-56
Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56
Table 6-32 Functions and features of the PQ3...................................................................................................6-58
Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-63
Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-64
Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-64
Table 6-36 Functions and features of the DX1...................................................................................................6-66

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Hardware Description Tables

Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-69
Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69
Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-71
Table 6-40 Functions and features of the DXA..................................................................................................6-73
Table 6-41 Version Description of the SPQ4.....................................................................................................6-77
Table 6-42 Functions and features of the SPQ4.................................................................................................6-77
Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-84
Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-85
Table 7-1 Functions and features of the EFT4.....................................................................................................7-3
Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7
Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8
Table 7-4 Functions and features of the EFT8.....................................................................................................7-9
Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14
Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14
Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
.............................................................................................................................................................................7-15
Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
.............................................................................................................................................................................7-15
Table 7-9 Functions and features of the EFT8A................................................................................................7-16
Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21
Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21
Table 7-12 Functions and features of the EGT2.................................................................................................7-23
Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-28
Table 7-14 Relation between the board feature code and the optical interface type..........................................7-28
Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-29
Table 7-16 Version Description of the EFS0.....................................................................................................7-30
Table 7-17 Functions and features of the EFS0.................................................................................................7-31
Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and ETS8 in the OptiX OSN
1500B subrack.....................................................................................................................................................7-37
Table 7-19 Version Description of the EFS4.....................................................................................................7-39
Table 7-20 Functions and features of the EFS4.................................................................................................7-40
Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-45
Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-45
Table 7-23 Version Description of the EGS2.....................................................................................................7-47
Table 7-24 Functions and features of the EGS2.................................................................................................7-48
Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-54
Table 7-26 Relation between the board feature code and the optical interface type..........................................7-54
Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-55
Table 7-28 Functions and features of the EMS4................................................................................................7-56
Table 7-29 Optical interfaces of the EMS4........................................................................................................7-63
Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
subrack................................................................................................................................................................7-63

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Tables Hardware Description

Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
subrack................................................................................................................................................................7-63
Table 7-32 Relation between the board feature code and the optical interface type..........................................7-64
Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-68
Table 7-34 Version Description of the EGS4.....................................................................................................7-70
Table 7-35 Functions and features of the EGS4.................................................................................................7-70
Table 7-36 Optical interfaces of the EGS4.........................................................................................................7-77
Table 7-37 Relation between the board feature code and the optical interface type..........................................7-77
Table 7-38 Specifications of the optical interfaces of the EGS4........................................................................7-81
Table 7-39 Functions and features of the EGS4A..............................................................................................7-83
Table 7-40 Optical interfaces of the EGS4A......................................................................................................7-89
Table 7-41 Relation between the board feature code and the optical interface type..........................................7-89
Table 7-42 Specifications of the optical interfaces of the EGS4A.....................................................................7-92
Table 7-43 Functions and features of the EGR2................................................................................................7-93
Table 7-44 Optical interfaces of the EGR2 .....................................................................................................7-100
Table 7-45 Relation between the board feature code and the optical interface type........................................7-100
Table 7-46 Specifications of the interfaces of the EGR2.................................................................................7-101
Table 7-47 Version description of the EMR0..................................................................................................7-102
Table 7-48 Comparison of features of the N1EMR0 and N2EMR0................................................................7-102
Table 7-49 Functions and features of the EMR0..............................................................................................7-103
Table 7-50 Optical interfaces of the EMR0 .....................................................................................................7-111
Table 7-51 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
subrack..............................................................................................................................................................7-111
Table 7-52 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
subrack..............................................................................................................................................................7-111
Table 7-53 Relation between the board feature code and the optical interface type........................................7-112
Table 7-54 Specifications of the optical interfaces of the EMR0.....................................................................7-113
Table 7-55 Functions and features of the ADL4..............................................................................................7-114
Table 7-56 Optical interface of the ADL4 .......................................................................................................7-119
Table 7-57 Relation between the board feature code and the optical interface type........................................7-119
Table 7-58 Specifications of the optical interfaces of the ADL4.....................................................................7-120
Table 7-59 Functions and features of the ADQ1..............................................................................................7-121
Table 7-60 Optical interfaces of the ADQ1 .....................................................................................................7-126
Table 7-61 Relation between the board feature code and the optical interface type........................................7-126
Table 7-62 Specifications of the optical interfaces of the ADQ1.....................................................................7-127
Table 7-63 Functions and features of the IDL4................................................................................................7-129
Table 7-64 Optical interface of the IDL4 ........................................................................................................7-134
Table 7-65 Relation between the board feature code and the optical interface type........................................7-134
Table 7-66 Specifications of the optical interfaces of the IDL4.......................................................................7-135
Table 7-67 Functions and features of the IDQ1...............................................................................................7-137
Table 7-68 Optical interfaces of the IDQ1 ......................................................................................................7-142
Table 7-69 Relation between the board feature code and the optical interface type........................................7-142
Table 7-70 Specifications of the optical interfaces of the IDQ1......................................................................7-143

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Hardware Description Tables

Table 7-71 Functions and features of the MST4..............................................................................................7-145

Table 7-72 Services and service rates provided by the MST4.........................................................................7-145
Table 7-73 Optical interfaces of the MST4......................................................................................................7-149
Table 7-74 Relation between the board feature code and service type............................................................7-149
Table 7-75 Specifications of the optical interfaces of the MST4.....................................................................7-150
Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack
...............................................................................................................................................................................8-5
Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7
Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8
Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack
...............................................................................................................................................................................8-8
Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11
Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12
Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-12
Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15
Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18
Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19
Table 8-11 Valid slots for the PQ1 and corresponding slots for the D75S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-19
Table 8-12 Interfaces of the D34S......................................................................................................................8-22
Table 8-13 Specifications of the electrical interfaces of the D34S....................................................................8-23
Table 8-14 Interfaces of the C34S......................................................................................................................8-25
Table 8-15 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-26
Table 8-16 Specifications of the electrical interfaces of the C34S.....................................................................8-26
Table 8-17 Interfaces of the EU04.....................................................................................................................8-29
Table 8-18 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30
Table 8-19 Specifications of the electrical interfaces of the EU04....................................................................8-30
Table 8-20 Interfaces of the EU08.....................................................................................................................8-33
Table 8-21 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33
Table 8-22 Specifications of the electrical interfaces of the EU08....................................................................8-33
Table 8-23 Version description of the OU08.....................................................................................................8-35
Table 8-24 Interfaces of the N1OU08................................................................................................................8-37
Table 8-25 Interfaces of the N2OU08................................................................................................................8-38
Table 8-26 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38
Table 8-27 Specifications of the optical interfaces of the OU08........................................................................8-38
Table 8-28 Interfaces of the MU04....................................................................................................................8-41
Table 8-29 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42
Table 8-30 Specifications of the electrical interfaces of the MU04...................................................................8-42
Table 8-31 Valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04....................................8-45
Table 8-32 Valid slots for the TSB4 and corresponding slots for the SEP and EU04.......................................8-45
Table 8-33 Valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8.....................................8-45
Table 8-34 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-48

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Table 8-35 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-49
Table 8-36 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-49
Table 8-37 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-49
Table 8-38 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-49
Table 8-39 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-50
Table 8-40 Valid slots for the TSB8 and corresponding slots for the PQ3 and D34S.......................................8-50
Table 8-41 Interfaces of the EFF8......................................................................................................................8-53
Table 8-42 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-53
Table 8-43 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-53
Table 8-44 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-54
Table 8-45 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-54
Table 8-46 Specifications of the optical interfaces of the EFF8........................................................................8-54
Table 8-47 Interfaces of the ETF8......................................................................................................................8-57
Table 8-48 Pins of the RJ-45 connector of the ETF8.........................................................................................8-58
Table 8-49 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-58
Table 8-50 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-59
Table 8-51 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-59
Table 8-52 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-59
Table 8-53 Specifications of the electrical interfaces of the ETF8....................................................................8-59
Table 8-54 Interfaces of the ETS8......................................................................................................................8-62
Table 8-55 Pins of the RJ-45 connector of the ETS8.........................................................................................8-63
Table 8-56 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-63
Table 8-57 Specifications of the electrical interfaces of the ETS8....................................................................8-63
Table 8-58 Interfaces on the front panel of the DM12.......................................................................................8-66
Table 8-59 Pins of the DB44 interfaces of the DM12........................................................................................8-67
Table 8-60 Pins of the DB28 interfaces of the DM12........................................................................................8-68
Table 8-61 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-68
Table 9-1 Version description of the CXL1 board...............................................................................................9-4
Table 9-2 Function and feature of the SDH processing unit of the CXL1...........................................................9-4
Table 9-3 Function and feature of the SCC unit of the CXL1............................................................................. 9-5
Table 9-4 Function and feature of the cross-connect unit of the CXL1...............................................................9-6
Table 9-5 Function and feature of the clock unit of the CXL1............................................................................ 9-6
Table 9-6 Jumper on the CXL1 board................................................................................................................9-13
Table 9-7 DIP switch on the CXL1 board..........................................................................................................9-13
Table 9-8 Description of the DIP switch SW1...................................................................................................9-14
Table 9-9 Optical interface and switches on the CXL1......................................................................................9-17
Table 9-10 Relation between the board feature code and the optical interface type..........................................9-18
Table 9-11 Logical slots displayed on the T2000 for the CXL1........................................................................9-19
Table 9-12 Specifications for the optical interfaces of the CXL1......................................................................9-19
Table 9-13 Version description of the CXL4 board...........................................................................................9-21
Table 9-14 Function and feature of the SDH processing unit of the CXL4.......................................................9-22
Table 9-15 Function and feature of the SCC unit of the CXL4.........................................................................9-23

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Table 9-16 Function and feature of the cross-connect unit of the CXL4...........................................................9-24
Table 9-17 Function and feature of the clock unit of the CXL4........................................................................9-24
Table 9-18 Jumper on the CXL4 board..............................................................................................................9-31
Table 9-19 DIP switch on the CXL4 board........................................................................................................9-31
Table 9-20 Description of DIP switch SW1.......................................................................................................9-32
Table 9-21 Optical interface and switches on the CXL4....................................................................................9-35
Table 9-22 Relation between the board feature code and the optical interface type..........................................9-36
Table 9-23 Logical slots displayed on the T2000 for the CXL4........................................................................9-37
Table 9-24 Specifications for the optical interfaces of the CXL4......................................................................9-37
Table 9-25 Version description of the CXL16 board.........................................................................................9-39
Table 9-26 Function and feature of the SDH processing unit of the CXL16.....................................................9-40
Table 9-27 Function and feature of the SCC unit of the CXL16.......................................................................9-41
Table 9-28 Function and feature of the cross-connect unit of the CXL16.........................................................9-42
Table 9-29 Function and feature of the clock unit of the CXL16......................................................................9-42
Table 9-30 Jumper on the CXL16 board............................................................................................................9-49
Table 9-31 DIP switch on the CXL16 board......................................................................................................9-49
Table 9-32 Description of the DIP switch SW1.................................................................................................9-50
Table 9-33 Optical interface and switches on the CXL16..................................................................................9-53
Table 9-34 Relation between the board feature code and the optical interface type..........................................9-54
Table 9-35 Logical slots displayed on the T2000 for the CXL16......................................................................9-54
Table 9-36 Specifications for the optical interfaces of the CXL16....................................................................9-55
Table 9-37 Function and feature of the SDH processing unit of the CXLL1.....................................................9-57
Table 9-38 Function and feature of the SCC unit of the CXLL1.......................................................................9-58
Table 9-39 Function and feature of the cross-connect unit of the CXLL1.........................................................9-59
Table 9-40 Function and feature of the clock unit of the CXLL1......................................................................9-59
Table 9-41 Jumper on the CXL board................................................................................................................9-66
Table 9-42 DIP switch on the CXL board..........................................................................................................9-66
Table 9-43 Description of the DIP switch SW2.................................................................................................9-66
Table 9-44 Optical interface and switches on the CXLL1.................................................................................9-68
Table 9-45 Relation between the board feature code and the optical interface type..........................................9-69
Table 9-46 Logical slots displayed on the T2000 for the CXLL1......................................................................9-69
Table 9-47 Specifications for the optical interfaces of the CXLL1....................................................................9-70
Table 9-48 Function and feature of the SDH processing unit of the CXLL4.....................................................9-72
Table 9-49 Function and feature of the SCC unit of the CXLL4.......................................................................9-73
Table 9-50 Function and feature of the cross-connect unit of the CXLL4.........................................................9-73
Table 9-51 Function and feature of the clock unit of the CXLL4......................................................................9-74
Table 9-52 Jumper on the CXL board................................................................................................................9-80
Table 9-53 DIP switch on the CXL board..........................................................................................................9-80
Table 9-54 Description of DIP switch SW2.......................................................................................................9-80
Table 9-55 Optical interface and switches on the CXLL4.................................................................................9-82
Table 9-56 Relation between the board feature code and the optical interface type..........................................9-83
Table 9-57 Logical slots displayed on the T2000 for the CXLL4......................................................................9-83

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Table 9-58 Specifications for the optical interfaces of the CXLL4....................................................................9-84

Table 9-59 Function and feature of the SDH processing unit of the CXLL16...................................................9-86
Table 9-60 Function and feature of the SCC unit of the CXLL16.....................................................................9-87
Table 9-61 Function and feature of the cross-connect unit of the CXLL16.......................................................9-87
Table 9-62 Function and feature of the clock unit of the CXLL16....................................................................9-88
Table 9-63 Jumper on the CXL board................................................................................................................9-94
Table 9-64 DIP switch on the CXL board..........................................................................................................9-94
Table 9-65 Description of the DIP switch SW2.................................................................................................9-94
Table 9-66 Optical interface and switches on the CXLL16...............................................................................9-96
Table 9-67 Relation between the board feature code and the optical interface type..........................................9-97
Table 9-68 Logical slots displayed on the T2000 for the CXLL16....................................................................9-97
Table 9-69 Specifications for the optical interfaces of the CXLL16..................................................................9-98
Table 9-70 Function and feature of the SDH processing unit of the CXLD1..................................................9-100
Table 9-71 Function and feature of the SCC unit of the CXLD1.....................................................................9-100
Table 9-72 Function and feature of the cross-connect unit of the CXLD1......................................................9-101
Table 9-73 Function and feature of the clock unit of the CXLD1....................................................................9-102
Table 9-74 Jumper on the CXL board..............................................................................................................9-108
Table 9-75 DIP switch on the CXL board........................................................................................................9-108
Table 9-76 Description of DIP switch SW2.....................................................................................................9-108
Table 9-77 Optical interface and switches on the CXLD1...............................................................................9-110
Table 9-78 Relation between the board feature code and the optical interface type........................................9-111
Table 9-79 Logical slots displayed on the T2000 for the CXLD1...................................................................9-111
Table 9-80 Specifications for the optical interfaces of the CXLD1.................................................................9-112
Table 9-81 Function and feature of the SDH processing unit of the CXLD4..................................................9-114
Table 9-82 Function and feature of the SCC unit of the CXLD4.....................................................................9-115
Table 9-83 Function and feature of the cross-connect unit of the CXLD4......................................................9-115
Table 9-84 Function and feature of the clock unit of the CXLD4....................................................................9-116
Table 9-85 Jumper on the CXLD4 board.........................................................................................................9-122
Table 9-86 DIP switch on the CXLD4 board...................................................................................................9-122
Table 9-87 Description of DIP switch SW2.....................................................................................................9-122
Table 9-88 Optical interface and switches on the CXLD4...............................................................................9-124
Table 9-89 Relation between the board feature code and the optical interface type........................................9-125
Table 9-90 Logical slots displayed on the T2000 for the CXLD1...................................................................9-125
Table 9-91 Specifications for the optical interfaces of the CXLD4.................................................................9-126
Table 9-92 Function and feature of the SDH processing unit of the CXLQ1..................................................9-128
Table 9-93 Function and feature of the SCC unit of the CXLQ1.....................................................................9-129
Table 9-94 Function and feature of the cross-connect unit of the CXLQ1......................................................9-129
Table 9-95 Function and feature of the clock unit of the CXLQ1....................................................................9-130
Table 9-96 Jumper on the CXLQ1 board.........................................................................................................9-136
Table 9-97 DIP switch on the CXLQ1 board...................................................................................................9-136
Table 9-98 Description of DIP switch SW2.....................................................................................................9-136
Table 9-99 Optical interface and switches on the CXLQ1...............................................................................9-138

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Hardware Description Tables

Table 9-100 Relation between the board feature code and the optical interface type......................................9-139
Table 9-101 Logical slots displayed on the T2000 for the CXLQ1.................................................................9-139
Table 9-102 Specifications for the optical interfaces of the CXLQ1...............................................................9-140
Table 9-103 Function and feature of the SDH processing unit of the CXLQ4................................................9-142
Table 9-104 Function and feature of the SCC unit of the CXLQ4...................................................................9-143
Table 9-105 Function and feature of the cross-connect unit of the CXLQ4....................................................9-143
Table 9-106 Function and feature of the clock unit of the CXLQ4..................................................................9-144
Table 9-107 Jumper on the CXLQ4 board.......................................................................................................9-150
Table 9-108 DIP switch on the CXLQ4 board.................................................................................................9-150
Table 9-109 Description of DIP switch SW2...................................................................................................9-150
Table 9-110 Optical interface and switches on the CXLQ4.............................................................................9-152
Table 9-111 Relation between the board feature code and the optical interface type......................................9-153
Table 9-112 Logical slots displayed on the T2000 for the CXLQ1.................................................................9-153
Table 9-113 Specifications for the optical interfaces of the CXLQ4...............................................................9-154
Table 10-1 Functions and features of the EOW.................................................................................................10-2
Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-5
Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5
Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5
Table 10-5 Functions and features of the AUX..................................................................................................10-7
Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12
Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-12
Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-12
Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13
Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-13
Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14
Table 10-12 Functions and features of the AMU.............................................................................................10-15
Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-17
Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-18
Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-18
Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19
Table 10-17 Functions and features of the FAN..............................................................................................10-21
Table 11-1 Functions and features of the CMR2...............................................................................................11-3
Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7
Table 11-3 Feature code of the CMR2...............................................................................................................11-7
Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8
Table 11-5 Functions and features of the CMR4.............................................................................................11-10
Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13
Table 11-7 Feature code of the CMR4.............................................................................................................11-13
Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14
Table 11-9 Functions and features of the MR2................................................................................................11-16
Table 11-10 Optical interfaces of the MR2......................................................................................................11-19
Table 11-11 Feature code of the MR2..............................................................................................................11-19

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Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20

Table 11-13 Functions and features of the MR2A...........................................................................................11-22
Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25
Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25
Table 11-16 Functions and features of the MR2B...........................................................................................11-27
Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30
Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30
Table 11-19 Functions and features of the MR2C...........................................................................................11-32
Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35
Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36
Table 11-22 Functions and features of the MR4..............................................................................................11-37
Table 11-23 Optical interfaces of the MR4......................................................................................................11-40
Table 11-24 Board feature code.......................................................................................................................11-41
Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-41
Table 11-26 Functions and features of the LWX.............................................................................................11-43
Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48
Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48
Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-49
Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-50
Table 11-31 Functions and features of the OBU1............................................................................................11-52
Table 11-32 Optical interfaces of the OBU1....................................................................................................11-56
Table 11-33 Feature code of the OBU1............................................................................................................11-56
Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-57
Table 11-35 Functions and features of the FIB................................................................................................11-59
Table 11-36 Optical interfaces of the FIB .......................................................................................................11-60
Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-61
Table 12-1 Functions and features of the BA2...................................................................................................12-3
Table 12-2 Optical interfaces of the single-interface BA2.................................................................................12-8
Table 12-3 Optical interfaces of the double-interface BA2................................................................................12-8
Table 12-4 Relation between the board feature code and output optical power for the BA2............................12-9
Table 12-5 Specifications of the optical interfaces of the BA2..........................................................................12-9
Table 12-6 Version description of the BPA board...........................................................................................12-10
Table 12-7 Functions and features of the BPA.................................................................................................12-11
Table 12-8 Optical interfaces of the BPA .......................................................................................................12-14
Table 12-9 Relation between the board feature code and output optical power of the BPA...........................12-15
Table 12-10 Specifications for the optical interfaces of the BPA....................................................................12-16
Table 12-11 Version Description of the COA..................................................................................................12-17
Table 12-12 Functions and features of the 61COA and N1COA.....................................................................12-18
Table 12-13 Functions and features of the 62COA..........................................................................................12-20
Table 12-14 Pins of the RS232 interface..........................................................................................................12-25
Table 12-15 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-25
Table 12-16 Pins of the RJ-45 connector of the 62COA..................................................................................12-26

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Table 12-17 Relation between the board feature code and output optical power for the 61COA...................12-27
Table 12-18 Specifications of the optical interfaces of the COA.....................................................................12-28
Table 13-1 Functions and features of the UPM..................................................................................................13-3
Table 13-2 Interfaces on the rear panel of the UPM.......................................................................................... 13-5
Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5
Table 13-4 Specifications of the power supply of the UPM.............................................................................. 13-6
Table 13-5 Functions and features of the PIU....................................................................................................13-8
Table 13-6 Interfaces on the front panel of the PIU.........................................................................................13-10
Table 13-7 Functions and features of the PIUA...............................................................................................13-12
Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14
Table 14-1 Types of fiber jumpers.....................................................................................................................14-2
Table 14-2 Types of connectors......................................................................................................................... 14-3
Table 14-3 Equipment –48 V/–60 V power cable..............................................................................................14-8
Table 14-4 Connection of the UPM power cable...............................................................................................14-9
Table 14-5 Specifications of the UPM power cable.........................................................................................14-10
Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11
Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13
Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable............................................................14-15
Table 14-9 Pin assignment of the RS232/RS422 serial port cable...................................................................14-16
Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17
Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18
Table 14-12 Pin assignment of the straight through cable...............................................................................14-19
Table 14-13 Pin assignment of the crossover cable.........................................................................................14-21
Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-23
Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24
Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27
Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-29
Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-32
Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-34
Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-36
Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-37
Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-38
Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38
Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-39
Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-40
Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40
Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41
Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-42
Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-43
Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43
Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-44
Table 14-32 Specifications of the RS449 DTE cable.......................................................................................14-45

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Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-46

Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-47
Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-48
Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-49
Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-50
Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-52
Table B-1 Labels on the equipment.....................................................................................................................B-2
Table B-2 Optical module code and type mapping table.....................................................................................B-5
Table B-3 Huawei specifications for engineering labels.....................................................................................B-7
Table C-1 Power consumption and weight of the boards....................................................................................C-1
Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1
Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1
Table E-2 the capability of inserting the AUAIS to port.....................................................................................E-3
Table E-3 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-4
Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-5
Table E-5 Loopbacks of the ATM/IMA boards for the OptiX OSN equipment.................................................E-6
Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2
Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3
Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3
Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6

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Hardware Description About This Document

About This Document

Overview
This document describes the equipment structure, subrack structure and board classification.
This document also describes each board of different classes in details.

This document helps you get the detailed information on the equipment hardware.

Product Versions
The following table lists the product versions related to this document.

Product Name Version

OptiX OSN 1500 V100R008

OptiX iManager T2000 V200R006C03

Intended Audience
The intended audiences of this document are:

l Network planning engineer

l Hardware installation engineer

Organization
This document describes the cabinet, subrack, boards and each unit of the boards in terms of the
function and working principle.

Chapter Description

1 Equipment Structure This chapter describes the structure of the equipment.

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About This Document Hardware Description

Chapter Description

2 Cabinet This chapter describes the dimensions, appearance and

technical specifications of the cabinet. This chapter also
describes the configuration of the equipment in each
cabinet.

3 Subrack This chapter describes the structure of the subrack.

4 Board List and This chapter describes the classification of boards and
Classification appearance of the boards.

5 SDH Processing Boards This chapter describes the SDH processing boards in terms
of the function, principle, front panel, interface and
technical specifications.

6 PDH Processing Boards This chapter describes the PDH processing boards in terms
of the function, principle, front panel, interface and
technical specifications.

7 Data Processing Boards This chapter describes the data processing boards in terms
of the function, principle, front panel, interface and
technical specifications.

8 Interface Boards and This chapter describes the interface boards and switching
Switching Boards boards in terms of the function, principle, front panel,
interface and technical specifications.

9 Cross-Connect and System This chapter describes the cross-connect and system control
Control Boards boards in terms of the function, principle, front panel,
interface and technical specifications.

10 Auxiliary Boards This chapter describes the auxiliary boards in terms of the
function, principle, front panel, interface and technical
specifications.

11 WDM Processing Boards This chapter describes the WDM processing boards in
terms of the function, principle, front panel, interface and
technical specifications.

12 Optical Amplifier Boards This chapter describes the optical amplifier boards and
and Dispersion dispersion compensation boards in terms of the function,
Compensation Boards principle, front panel, interface and technical
specifications.

13 Power Interface Boards This chapter describes the power interface boards in terms
of the function, principle, front panel, interface and
technical specifications.

14 Cables This chapter describes the external cables and internal

cables in terms of the structure, appearance, pin assignment
and technical specifications.

A Equipment and Board This appendix describes the indication of the equipment and
Alarm Indicators board alarm indicators.

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Chapter Description

B Labels This appendix describes the safety labels, optical module

labels and engineering labels.

C Power Consumption and This appendix describes the power consumption and weight
Weight of Boards of each board.

D Board Version This appendix describes the compatibility among the

Configuration product versions.

E Board Loopbacks This appendix describes the loopback capabilities of the

boards.

F Board Configuration This appendix describes the parameters that can be

Reference configured by using the T2000.

G Glossary This appendix lists the terms used in this document.

H Acronyms and This appendix lists the acronyms and abbreviations used in
Abbreviations this document.

Conventions
Symbol Conventions
The following symbols may be found in this document. They are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk which, if not

avoided, will result in death or serious injury.
DANGER

Indicates a hazard with a medium or low level of risk which,

if not avoided, could result in minor or moderate injury.
WARNING

Indicates a potentially hazardous situation that, if not

avoided, could cause equipment damage, data loss, and
CAUTION
performance degradation, or unexpected results.
TIP Indicates a tip that may help you solve a problem or save
you time.

NOTE Provides additional information to emphasize or

supplement important points of the main text.

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 OptiX OSN 1500 Intelligent Optical Transmission System
About This Document Hardware Description

General Conventions
Convention Description

Times New Roman Normal paragraphs are in Times New Roman.

Boldface Names of files, directories, folders, and users are in boldface. For
example, log in as user root.

Italic Book titles are in italics.

Courier New Terminal display is in Courier New.

Command Conventions
Convention Description

Boldface The keywords of a command line are in boldface.

Italic Command arguments are in italic.

[] Items (keywords or arguments) in square brackets [ ] are optional.

{ x | y | ... } Alternative items are grouped in braces and separated by vertical bars.
One is selected.

[ x | y | ... ] Optional alternative items are grouped in square brackets and

separated by vertical bars. One or none is selected.

{ x | y | ... } * Alternative items are grouped in braces and separated by vertical bars.
A minimum of one or a maximum of all can be selected.

GUI Conventions
Convention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titles are in
boldface. For example, click OK.

> Multi-level menus are in boldface and separated by the “>” signs. For
example, choose File > Create > Folder.

Keyboard Operation
Format Description

Key Press the key. For example, press Enter and press Tab.

Key 1+Key 2 Press the keys concurrently. For example, pressing Ctrl+Alt+A means
the three keys should be pressed concurrently.

4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description About This Document

Format Description

Key 1, Key 2 Press the keys in turn. For example, pressing Alt, A means the two keys
should be pressed in turn.

Mouse Operation
Action Description

Click Select and release the primary mouse button without moving the pointer.

Double-click Press the primary mouse button twice continuously and quickly without
moving the pointer.

Drag Press and hold the primary mouse button and move the pointer to a certain
position.

Update History
Updates between document versions are cumulative. Therefore, the latest document version
contains all updates made to previous versions.

Updates in Issue 02 (2008-03-29) Based on Product Version V100R008

This document of the V100R008 version is of the second release. The updated contents are as
follows.
N2EGS4A, R1CXLL1, R1CXLL4, R1CXLL16, R1CXLD1, R1CXLD4, R1CXLQ1,
R1CXLQ4 are added.

Updates in Issue 01 (2007-12-25) Based on Product Version V100R008

This document of the V100R008 version is of the first release.Compared with the V100R007,
this version has the following new or optimized content:
The N1SL1A, N1SLQ1A, N1SL4A, N1SLD4A, N1SLQ4A, Q3CXL1, Q3CXL4, Q3CXL16,
N2BPA are added.

Updates in Issue 03 (2007-12-15) Based on Product Version V100R007

This document of the V100R007 version is of the third release. The updated contents are as
follows.
l The N3EGS4 board is added.
l Several bugs are fixed.

Updates in Issue 02 (2007-09-10) Based on Product Version V100R007

This document of the V100R007 version is of the second release. The updated contents are as
follows.

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Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
About This Document Hardware Description

This release of the document fixes several bugs, adds product labels. It also checks the parameters
of the dimensions and weight.

Updates in Issue 01 (2007-06-15) Based on Product Version V100R007

This document of the V100R007 version is of the first release. Compared with the V100R006,
this version has the following new or optimized content:
l The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2,
TN11MR4, TN11CMR2, TN11CMR4 are added.
l Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are
added.
l The structure of the board description is adjusted and optimized. First the board version is
described, and then the board function and feature, working principle and signal flow, front
panel, valid slots, board feature code, board configuration reference, technical
specifications and so on are described.

Updates in Issue 03 (2007-03-30) Based on Product Version V100R006

The updated contents are as follows.
This release of the document fixes several bugs, adds product labels. It also checks the parameters
of the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.

Updates in Issue 02 (2007-01-10) Based on Product Version V100R006

The updated contents are as follows.
This release of the document fixes several bugs in the document of previous version. The T2000
is upgraded from V200R003C02 to V200R004C01.

Updates in Issue 01 (2006-09-20) Based on Product Version V100R006

This document of the V100R006 version is of the first release.

6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 1 Equipment Structure

1 Equipment Structure

The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiX
OSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inch
cabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500A
can be installed on the desk.

Figure 1-1 shows the appearance of the OptiX OSN 1500A.

Figure 1-1 Appearance of the OptiX OSN 1500A

Figure 1-2 shows the appearance of the OptiX OSN 1500B.

Figure 1-2 Appearance of the OptiX OSN 1500B

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 2 Cabinet

2 Cabinet

About This Chapter

The OptiX OSN subracks are installed in the cabinets.

2.1 Cabinet Type

The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch
cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack
can be installed against the wall.
2.2 Cabinet Configuration
On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit
(PDU).
2.3 Technical Specifications
The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

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 OptiX OSN 1500 Intelligent Optical Transmission System
2 Cabinet Hardware Description

2.1 Cabinet Type

The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch
cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack
can be installed against the wall.
The OptiX OSN 1500 can be installed in the following cabinets:
l 300-mm deep ETSI cabinet
l 600-mm deep ETSI cabinet
l 19-inch cabinet
l Cabinet used for the access network equipment

2.2 Cabinet Configuration

On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit
(PDU).
Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet.

Figure 2-1 ETSI cabinet

1

PowerCritical MajorMinor

Power distribution unit

W D

1. Cabinet indicator 2. DC PDU

2.2.1 Cabinet Indicator

The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.
2.2.2 DC PDU
The DC PDU is on the top of the cabinet and used to supply power for the equipment.
2.2.3 Other Configuration

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Hardware Description 2 Cabinet

The external case-shaped devices can be installed in the cabinet as required.

2.2.1 Cabinet Indicator

The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.

Table 2-1 lists the information about the indicators on the ETSI cabinet.

Table 2-1 Indicators on the ETSI cabinet

Indicator State Indication

Normal power supply indicator: Power Lit The power is supplied

(green) to the equipment.

Unlit No power is supplied to

the equipment.

Critical alarm indicator: Critical (red) Lit Critical alarms are

generated in the
equipment.

Unlit No critical alarms are

generated in the
equipment.

Major alarm indicator: Major (orange) Lit Major alarms are

generated in the
equipment.

Unlit No major alarms are

generated in the
equipment.

Minor alarm indicator: Minor (yellow) Lit Minor alarms are

generated in the
equipment.

Unlit No minor alarms are

generated in the
equipment.

CAUTION
The cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after the
cables are correctly connected and the subrack is powered on.

2.2.2 DC PDU
The DC PDU is on the top of the cabinet and used to supply power for the equipment.

Figure 2-2 shows the appearance of the DC PDU.

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 OptiX OSN 1500 Intelligent Optical Transmission System
2 Cabinet Hardware Description

Figure 2-2 Appearance of the DC PDU

1 7 2 3 4 5 8 6

1 2 3
OUTPUT
4
A B 1 2 3
OUTPUT
4

ON ON

RTN1(+) RTN2(+) NEG1(-) NEG2(-)

OFF OFF
INPUT
32A 32A 20A 20A 32A 32A 20A 20A

1. Power terminal (A) 2. Power cable RTN1 (+)

3. Power cable RTN2 (+) 4. Power cable NEG1 (–)
5. Power cable NEG2 (–) 6. Power terminal (B)
7. PGND 8. Power switch

For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIU
boards at side A and side B of the subrack respectively. Table 2-2 shows the connections of the
power terminals at side A and side B.
For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boards
at the upper and lower subrack respectively.

Table 2-2 Connection of power terminals at side A and side B

Power Corresponding Subrack Power Corresponding Subrack
Terminal at and PIU Board Terminal and PIU Board
Side A at Side B

1 The PIU board at side A of 1 The PIU board at side B of

the first subrack the first subrack

2 The PIU board at side A of 2 The PIU board at side B of

the second subrack the second subrack

3 The PIU board at side A of 3 The PIU board at side B of

the third subrack the third subrack

4 The PIU board at side A of 4 The PIU board at side B of

the fourth subrack the fourth subrack

2.2.3 Other Configuration

The external case-shaped devices can be installed in the cabinet as required.
l UPM
The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPM
directly converts the 220 V mains supply to the –48 V DC power supply required by the

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 2 Cabinet

communication equipment. If operators cannot provide the –48 V DC power supply for the
equipment or require that the battery be used, the UPM can be applied.
l COA
l Fiber management spool, which is used to spool the redundant fibers inside the cabinet.

2.3 Technical Specifications

The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.
Table 2-3 lists the technical specifications of the ETSI cabinet.

Table 2-3 Technical specifications of the ETSI cabinet

Dimensions (mm) Weight (kg) Number of Allowed OptiX
OSN 1500A/1500B Subracks

600 (W) x 300 (D) x 2000 (H) 55 The number of allowed OptiX
OSN 1500A/1500B subracks
600 (W) x 600 (D) x 2000 (H) 79 varies with the cabinet capacity
600 (W) x 300 (D) x 2200 (H) 60 and the number of the power
supplies.
600 (W) x 600 (D) x 2200 (H) 84

600 (W) x 300 (D) x 2600 (H) 70

600 (W) x 600 (D) x 2600 (H) 94

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 3 Subrack

3 Subrack

About This Chapter

This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technical
specifications.

3.1 Structure
The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area
for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack
is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area
for interface boards, slot area for the auxiliary interface board, power supply area and fan area.
3.2 Capacity
Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-
width slots. These slots have different service access capacities before and after the slot division.
3.3 Slot Allocation
The OptiX OSN 1500A subrack has only one layer, where 12 slots are available before the
division of slots.
3.4 Slot Allocation
The OptiX OSN 1500B subrack has two layers. The upper layer of the subrack, where four slots
are present, is the slot area for the interface boards and PIU boards. The lower layer of the
subrack, where ten slots are available before the division of slots (including slots 4 and 5), is the
slot area for the processing boards and auxiliary boards.
3.5 Technical Specifications
The specifications of the subrack cover dimensions, weight and maximum power consumption.

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 OptiX OSN 1500 Intelligent Optical Transmission System
3 Subrack Hardware Description

3.1 Structure
The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area
for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack
is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area
for interface boards, slot area for the auxiliary interface board, power supply area and fan area.
Figure 3-1 shows the structure of the OptiX OSN 1500A subrack.

Figure 3-1 Structure of the OptiX OSN 1500A subrack

2
3 H
4 W
D
6

1. Fan area 2. Slot area for boards 3. Power supply area

4. Slot area for interface boards 5. Fiber routing area 6. Mounting ear

The functions of these areas are as follows:

l Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A.
l Fan area: This area is used to house one fan module, which dissipates heat generated by
the equipment.
l Power supply area: This area is used to house two PIU boards, which are used to supply
power for the equipment.
l Fiber routing area: This area is used to route fibers and cables in the subrack.

Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 3 Subrack

Figure 3-2 Structure of the OptiX OSN 1500B subrack

2
3

4
4
H

W
5 D
7

1. Slot area for interface boards 2. Power supply area 3. Fan area
4. Slot area for processing boards 5. Slot area for the auxiliary interface board 6. Fiber routing area
7. Mounting ear

The functions of these areas are as follows:

l Slot area for interface boards: This area is used to house the tributary interface boards and
Ethernet interface boards for the OptiX OSN 1500B.
l Slot area for processing boards: This area is used to house the line, tributary and Ethernet
processing boards for the OptiX OSN 1500B.
l Fan area: This area is used to house one fan module, which dissipates heat generated by
the equipment.
l Slot area for the auxiliary interface board: This area is used to house the auxiliary interface
board, which provides alarm interfaces, orderwire phone interface, management and
maintenance interface, and clock interface.
l Power supply area: This area is used to house two PIU boards, which are used to supply
power for the equipment.
l Fiber routing area: This area is used to route fibers and cables in the subrack.

3.2 Capacity
Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-
width slots. These slots have different service access capacities before and after the slot division.

In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In the
OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots. Figure 3-3 shows

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 OptiX OSN 1500 Intelligent Optical Transmission System
3 Subrack Hardware Description

the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity of
the OptiX OSN 1500B.

In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots.

l When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.
l When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.
l When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s.
l When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/
s.

In the OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots.

l When slot 11 is divided, the two half-width slots are numbered slot 1 and slot 11.
l When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.
l When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.
l When slots 11–13 are not divided, the access capacity of each slot is 2.5 Gbit/s.
l When slots 11–13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

Figure 3-3 Slot access capacity of the OptiX OSN 1500A

XCS1A PIU XCS B

Slot Slot 11 PIU Slot 6 1.25Gbit/s

Slot 2/12 2.5Gbit/s Slot 7 1.25Gbit/s

Slot20
Slot 3/13 2.5Gbit/s Slot 8 1.25Gbit/s
FAN
Slot 4 2.5Gbit/s Slot 9 1.25Gbit/s

Slot 5 2.5Gbit/s Slot 10 AUX

Figure 3-4 Slot access capacity of the OptiX OSN 1500B

Slot 14
Slot 18 PIU
Slot 15

Slot 16
Slot 19 PIU
Slot 17

Slot 1/11 2.5Gbit/s Slot 6 622Mbit/s

Slot 20 Slot 2/12 2.5Gbit/s Slot 7 622Mbit/s

Slot 3/13 2.5Gbit/s Slot 8 622Mbit/s

FAN Slot 4 Slot 9
2.5Gbit/s 622Mbit/s
Slot 5 2.5Gbit/s Slot 10 AUX

3.3 Slot Allocation

The OptiX OSN 1500A subrack has only one layer, where 12 slots are available before the
division of slots.

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 3 Subrack

Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack.

Figure 3-5 Slot layout of the OptiX OSN 1500A subrack

Slot 1 Slot 11 Slot 6

Slot 20 Slot 12 Slot 7

Slot 13 Slot 8
FAN Slot 4 CXL Slot 9 EOW
Slot 5 CXL Slot 10 AUX

Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slots. See
Figure 3-6.

Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots
Slot 1 Slot 11 Slot 6

Slot 20 Slot 2 Slot 12 Slot 7

Slot 3 Slot 13 Slot 8
FAN Slot 4 CXL Slot 9 EOW
Slot 5 CXL Slot 10 AUX

The slots in the OptiX OSN 1500A subrack are allocated as follows:
l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5
l Slots for processing boards before the division of slots: slots 6–9 and 12–13
l Slots for processing boards after the division of slots: slots 6–9, 12–13, and 2–3
l Slot for the orderwire board: slot 9 (also for the processing board)
l Slot for the auxiliary interface board: slot 10
l Slots for PIU boards: slots 1 and 11
l Slots for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing
Boards
Table 3-1 lists the mapping relation between slots for the interface boards and slots for the
processing boards of the OptiX OSN 1500A.

Table 3-1 Mapping relation between slots for the interface boards and slots for the processing
boards of the OptiX OSN 1500A.
Slots for Processing Boards Slots for Interface Boards

Slot 12 Slots 6 and 7

Boards and Their Valid Slots

Table 3-2 lists the CXL series boards and their valid slots of the OptiX OSN 1500A.

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 OptiX OSN 1500 Intelligent Optical Transmission System
3 Subrack Hardware Description

Table 3-2 CXL series boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

Q2CXL16, 1 x STM-16 integrated board of Slots 4 and 5

Q3CXL16 the SCC, cross-connect, timing
and line units

R1CXLL16 1 x STM-16 integrated board of Slots 4 and 5

the SCC, cross-connect, timing
and line units

Q2CXL4, Q3CXL4 1 x STM-4 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLL4 1 x STM-4 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLD4 2 x STM-4 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLQ4 4 x STM-4 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

Q2CXL1, Q3CXL1 1 x STM-1 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLL1 1 x STM-1 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLD1 2 x STM-1 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units

R1CXLQ1 4 x STM-1 integrated board of the Slots 4 and 5

SCC, cross-connect, timing and
line units
NOTE
a: The CXL is a board that integrates the SCC, cross-connect, timing, and line units for the OptiX OSN
1500A. It is one physical board and can be housed in slot 4 or slot 5 on the subrack. On the T2000, the Q2/
Q3CXL is displayed as ECXL, GSCC and SL1/SL4/SL16, and the R1CXL is displayed as RCXL, GSCC
and SLN/SLD41/SLQ41, seated in the logical slots 80–81, 82–83 and 4–5.

Table 3-3 lists the SDH processing boards and their valid slots of the OptiX OSN 1500A.

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Table 3-3 SDH processing boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

N1SL16, N2SL16, 1 x STM-16 optical interface Valid slots when the cross-
N3SL16 board connect capacity is 20 Gbit/s:
slots 12 and 13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SL16A, 1 x STM-16 optical interface Valid slots when the cross-

N2SL16A, board connect capacity is 20 Gbit/s:
N3SL16A slots 12 and 13.
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SF16 1 x STM-16 optical interface Valid slots when the cross-

board (with FEC) connect capacity is 20 Gbit/s:
slots 12 and 13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SLQ4, N2SLQ4, 4 x STM-4 optical interface board Valid slots when the cross-
N1SLQ4A connect capacity is 20 Gbit/s:
slots 12 and 13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SLD4, 2 x STM-4 optical interface board Slots 12 and 13

N1SLD4A,
N2SLD4

R1SLD4 2 x STM-4 optical interface board Valid slots when the cross-
(half-width) connect capacity is 20 Gbit/s:
slots 2–3, 6–9, and 12–13
Valid slots when the cross-
connect capacity is 15 Gbit/s:
slots 12–13

N1SL4, N1SL4A, 1 x STM-4 optical interface board Slots 12 and 13

N2SL4

R1SL4 1 x STM-4 optical interface board Valid slots when the cross-
(half-width) connect capacity is 20 Gbit/s: slot
2-3, 6-9, 12-13
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
2, 6-8, 12-13

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Board Full Name Valid Slots

N1SLT1 12 x STM-1 optical interface Valid slots when the cross-

board connect capacity is 20 Gbit/s:
slots 12 and 13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N2SLO1 8 x STM-1 optical interface board Slots 12 and 13

N1SLQ1, 4 x STM-1 optical interface board Slots 12 and 13

N1SLQ1A,
N2SLQ1

R1SLQ1 4 x STM-1 optical interface board Valid slots when the cross-
(half-width) connect capacity is 20 Gbit/s: slot
2-3, 6-9, 12-13
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
2, 6-8, 12-13

N1SL1, N1SL1A, 1 x STM-1 optical interface board Slots 12 and 13

N2SL1

R1SL1 1 x STM-1 optical interface board Valid slots when the cross-
(half-width) connect capacity is 20 Gbit/s: slot
2-3, 6-9, 12-13
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
2, 6-8, 12-13

N1SEP1 2 x STM-1 line processing board Slots 12 and 13

Table 3-4 lists the PDH processing boards and their valid slots of the OptiX OSN 1500A.

Table 3-4 PDH processing boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

N1PL3A (not used 3 x E3/T3 processing board Slots 12 and 13

with the interface
board)

N2PL3A (not used 3 x E3/T3 processing board Slots 12 and 13

with the interface
board)

R1PD1(A/B) 32 x E1 75-ohm/120-ohm Slots 2 and 12

processing board (half-width)

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Board Full Name Valid Slots

R2PD1(A/B) 32 x E1 75-ohm/120-ohm Slots 2 and 12

processing board (half-width )

R1PL1(A/B) 16 x E1 75-ohm/120-ohm Valid slots when the cross-

processing board (half-width) connect capacity is 20 Gbit/s: slot
6-9
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
6-8

N1DXA DDN service convergence and Slots 12 and 13

processing board

Table 3-5 lists the interface boards and their valid slots of the OptiX OSN 1500A.

Table 3-5 Interface Boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

R1L75S 16 x EI 75-ohm interface board Slots 6 and 7

(half-width)

R1L12S 16 x E1 120-ohm interface board Slots 6 and 7

(half-width)

Table 3-6 lists the data processing boards and their valid slots of the OptiX OSN 1500A.

Table 3-6 Data processing boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

N1EMS4 4 x GE Ethernet processing board Valid slots when the cross-

with Lanswitch connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N2EGS2 2 x GE Ethernet processing board Valid slots when the cross-

with Lanswitch connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

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Board Full Name Valid Slots

N1EGS4 4 x GE Ethernet processing board Valid slots when the cross-

with Lanswitch connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N3EGS4 4 x GE Ethernet processing board Valid slots when the cross-

with Lanswitch connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N2EGS4A 4 x GE Ethernet processing board Valid slots when the cross-

with Lanswitch connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N1EGT2 2 x GE Ethernet transparent Valid slots when the cross-

transmission board connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N1EFS4 4 x FE Ethernet processing board Slots 12 and 13

with Lanswitch

N2EFS4 4 x FE Ethernet processing board Slots 12 and 13 (1.25 Gbit/s)

with Lanswitch

R1EFT4 4 x FE Ethernet transparent Valid slots when the cross-

transmission board (half-width) connect capacity is 20 Gbit/s: slot
2–3, 6–9 and 12–13 (622 Mbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
2, 6–8 and 12–13 (622 Mbit/s)

N1EFT8 (not used 8 x FE Ethernet transparent Slots 12–13 (622 Mbit/s)

with the interface transmission board
board)

N1EFT8A 8 x FE transparent transmission Slots 12 and 13 (622 Mbit/s)

board (interfaces are available on
the front panel)

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Board Full Name Valid Slots

N2EGR2 2 x GE Ethernet ring processing Valid slots when the cross-

board connect capacity is 20 Gbit/s: slot
12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N2EMR0 (not used 1 x GE and 4 x FE Ethernet Valid slots when the cross-
with the interface processing board connect capacity is 20 Gbit/s: slot
board) 12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

N1ADL4 1 x STM-4 ATM processing Slots 12 and 13 (1.25 Gbit/s)

board

N1ADQ1 4 x STM-1 ATM processing Slots 12 and 13 (1.25 Gbit/s)

board

N1IDL4 1 x STM-4 IMA processing board Slots 12 and 13 (1.25 Gbit/s)

N1IDQ1 4 x STM-1 IMA processing board Slots 12 and 13 (1.25 Gbit/s)

N1MST4 4-channel multiservice (SAN or Valid slots when the cross-

video service) transparent connect capacity is 20 Gbit/s: slot
transmission board 12-13 (2.5 Gbit/s)
Valid slots when the cross-
connect capacity is 15 Gbit/s: slot
12-13 (1.25 Gbit/s)

Table 3-7 lists the WDM boards and their valid slots of the OptiX OSN 1500A.

Table 3-7 WDM boards and their valid slots of the OptiX OSN 1500A

Board Full Name Valid Slots

N1LWX Arbitrary rate access board Slots 12 and 13

TN11OBU1 Optical booster amplifier board Slots 12 and 13

N1FIB Filter isolating board Slots 12 and 13

N1MR2A Arbitrary two-wavelength add/ Slots 12 and 13

drop board (processing board)

N1MR2B Arbitrary two-wavelength add/ slot 2-3, 6–9 and 12–13 (622
drop board (half-width) Mbit/s)

TN11MR2 2-channel optical add/drop Slots 12 and 13

multiplexing board

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Board Full Name Valid Slots

TN11MR4 4-channel optical add/drop Slots 12 and 13

multiplexing board

TN11CMR2 2-channel CWDM optical add/ Slots 12 and 13

drop multiplexing board

TN11CMR4 4-channel CWDM optical add/ Slots 12 and 13

drop multiplexing board

Table 3-8 lists the optical booster amplifier boards and their valid slots of the OptiX OSN 1500A.

Table 3-8 Optical booster amplifier boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

N1BA2 2-channel optical booster Slots 12 and 13

amplifier board

N1BPA, N2BPA 1-channel amplifier and 1- Slots 12 and 13

channel preamplifier board

61COA, 62COA, COA board Slots 101 and 102

N1COA

ROP Single wavelength long-haul Slot 103 (external)

board (remote pumping)

Table 3-9 lists the auxiliary boards and their valid slots of the OptiX OSN 1500A.

Table 3-9 Auxiliary boards and their valid slots of the OptiX OSN 1500A
Board Full Name Valid Slots

R1AMU Orderwire processing or alarm Slot 9

concatenation board

R1AUX System auxiliary processing unit Slot 10

R2AUX System auxiliary processing unit Slot 10

R1PIUA PIU board Slots 1 and 11

R1FAN Fan board Slot 20

R1EOW Orderwire communication board Slot 9

UPMa Uninterruptable power module Slot 50

a: The UPM is in case shape. On the T2000, it is displayed as CAU board seated in the logical
slot 50.

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3.4 Slot Allocation

The OptiX OSN 1500B subrack has two layers. The upper layer of the subrack, where four slots
are present, is the slot area for the interface boards and PIU boards. The lower layer of the
subrack, where ten slots are available before the division of slots (including slots 4 and 5), is the
slot area for the processing boards and auxiliary boards.
Figure 3-7 shows the slot layout of the OptiX OSN 1500B subrack.

Figure 3-7 Slot layout of the OptiX OSN 1500B subrack

Slot 14
Slot 18 PIU
Slot 15
Slot 16
Slot 19 PIU
Slot 17
Slot 11 Slot 6

Slot 20 Slot 12 Slot 7

Slot 13 Slot 8
FAN Slot 4 CXL Slot 9 EOW
Slot 5 CXL Slot 10 AUX

Slots 11-13 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-8, the
divided slots are in the dashed area. The slots in the left portion of the original slots are slots
1-3, and the slots in the right portion of the original slots are slots 11-13.

Figure 3-8 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14
Slot 18 PIU
Slot 15
Slot 16
Slot 19 PIU
Slot 17
Slot 1 Slot 11 Slot 6

Slot 20 Slot 2 Slot 12 Slot 7

Slot 3 Slot 13 Slot 8
FAN Slot 4 CXL Slot 9 EOW
Slot 5 CXL Slot 10 AUX

The slots in the OptiX OSN 1500B subrack are allocated as follows:
l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4-5
l Slots for processing boards before the division of slots: slots 6-9 and 11-13
l Slots for processing boards after the division of slots: slots 1-9 and 11-13
l Slots for the interface boards: slots 14-17
l Slot for the orderwire board: slot 9 (also for the processing board)
l Slot for the auxiliary interface board: slot 10
l Slots for PIU boards: slots 18 and 19

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l Slot for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing
Boards
Table 3-10 lists the mapping relation between slots for the interface boards and slots for the
processing boards of the OptiX OSN 1500B.

Table 3-10 Mapping relation between slots for the interface boards and slots for the processing
boards of the OptiX OSN 1500B.

Slots for Slots for Interface Slots for Slots for Interface
Processing Boards Processing Boards
Boards Boards

Slot 2 Slot 14 Slot 3 Slot 16

Slot 7 Slot 15 Slot 8 Slot 17

Slot 12 Slots 14 and 15 Slot 13 Slots 16 and 17

The corresponding interface boards of the PD3, PL3, SEP, and SPQ4 can be housed only in slots
of even numbers.

For the OptiX OSN 1500B, the boards housed in slots 12 and 7 share the same interface board
housed in slot 15, and the boards housed in slots 13 and 8 share the same interface board housed
in slot 17. Therefore, when you configure the boards, ensure the following:

l If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot house
any board used with an interface board.
l If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot house
any board used with an interface board.

Boards and Their Valid Slots

Table 3-11 lists the CXL series boards and their valid slots for the OptiX OSN 1500B.

Table 3-11 CXL series boards and their valid slots for the OptiX OSN 1500B

Board Full Name Valid Slots

Q2CXL16, 1 x STM-16 integrated board of the SCC, Slots 4 and 5

Q3CXL16 cross-connect, timing and line units

R1CXLL16 1 x STM-16 integrated board of the SCC, Slots 4 and 5

cross-connect, timing and line units

Q2CXL4, 1 x STM-4 integrated board of the SCC, cross- Slots 4 and 5

Q3CXL4 connect, timing and line units

R1CXLL4 1 x STM-4 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units

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Board Full Name Valid Slots

R1CXLD4 2 x STM-4 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units

R1CXLQ4 4 x STM-4 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units

Q2CXL1, 1 x STM-1 integrated board of the SCC, cross- Slots 4 and 5

Q3CXL1 connect, timing and line units

R1CXLL1 1 x STM-1 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units

R1CXLD1 2 x STM-1 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units

R1CXLQ1 4 x STM-1 integrated board of the SCC, cross- Slots 4 and 5

connect, timing and line units
NOTE
a: The CXL is a board that integrates the SCC, cross-connect, timing, and line units for the OptiX OSN
1500B. It is one physical board and can be housed in slot 4 or slot 5 on the subrack. On the T2000, the Q2/
Q3CXL is displayed as ECXL, GSCC and SL1/SL4/SL16, and the R1CXL is displayed as RCXL, GSCC
and SLN/SLD41/SLQ41, seated in the logical slots 80–81, 82–83 and 4–5.

Table 3-12 lists the SDH processing boards and their valid slots for the OptiX OSN 1500B.

Table 3-12 SDH processing boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

N1SL16, N2SL16, 1 x STM-16 optical interface Valid slots if the cross-connect

N3SL16 board capacity is 20 Gbit/s: slots 11-13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SL16A, 1 x STM-16 optical interface Valid slots if the cross-connect

N2SL16A, board capacity is 20 Gbit/s: slots 11-13
N3SL16A If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SF16 1 x STM-16 outband optical Valid slots if the cross-connect

interface board (with FEC) capacity is 20 Gbit/s: slots 11-13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

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Board Full Name Valid Slots

N1SLQ4, 4 x STM-4 optical interface board Valid slots if the cross-connect

N1SLQ4A, capacity is 20 Gbit/s: slots 11-13
N2SLQ4 If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N1SLD4, 2 x STM-4 optical interface board Valid slots if the cross-connect

N2SLD4A, capacity is 20 Gbit/s: slots 11-13
N2SLD4 Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 12-13

N1SL4, N1SL4A, 1 x STM-4 optical interface board Slots 11-13

N2SL4

R1SLD4 2 x STM-4 optical interface board Valid slots if the cross-connect

(half-width) capacity is 20 Gbit/s: slots 1-3,
11-13 (up to two optical
interfaces can be configured),
slots 6-9 (one optical interfaces
can be configured).
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (one
optical interfaces can be
configured), slots 12-13 (up to
two optical interfaces can be
configured).

R1SL4 1 x STM-4 optical interface board Valid slots if the cross-connect

(half-width) capacity is 20 Gbit/s: slots 1-3,
6-9, 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13

N1SLT1 12 x STM-1 optical interface Valid slots if the cross-connect

board capacity is 20 Gbit/s: slots 11-13
If the cross-connect capacity is
15 Gbit/s, these slots are
unavailable.

N2SLO1 8 x AU-3 high density access Valid slots if the cross-connect

board capacity is 20 Gbit/s: slots 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 12-13

N1SLQ1, 4 x STM-1 optical interface board Slots 11-13

N1SLQ1A,
N2SLQ1

N1SL1, N1SL1A, 1 x STM-1 optical interface board Slots 11-13

N2SL1

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Board Full Name Valid Slots

R1SLQ1 4 x STM-1 optical interface board Valid slots if the cross-connect

(half-width) capacity is 20 Gbit/s: slots 1-3,
6-9, 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13

R1SL1 1 x STM-1 optical interface board Valid slots if the cross-connect

(half-width) capacity is 20 Gbit/s: slots 1-3,
6-9, 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13

N1SEP (used with 8 x STM-1 (e) processing board Slots 12–13

the interface board)a

N1SEP1 (not used 2 x STM-1 (e) processing board Slots 11–13

with the interface
board)a

a: The SEP1 board is displayed as the SEP1 or SEP on the T2000, depending on the interfacing
mode of the board. When the SEP1 provides interfaces on the front panel, it is displayed as
the SEP1 on the T2000. When the SEP1 is used with an interface board, it is displayed as the
SEP on the T2000.

Table 3-13 lists the PDH processing boards and their valid slots for the OptiX OSN 1500B.

Table 3-13 PDH processing boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

N1SPQ4 4 x E4/STM-1 processing board Slots 12 and 13

N2SPQ4 (used with 4 x E4/STM-1 processing board Slots 12 and 13

the interface board)

R1PL1(A/B) 16 x E1 75-ohm/120-ohm Slots 6–9

(interfaces available interface and processing board
on the front panel)

N2PQ3 12 x E3/T3 processing board Slots 12 and 13

N1PD3 6 x E3/T3 processing board Slots 12 and 13

N2PD3 6 x E3/T3 processing board Slots 12 and 13

N2PL3 3 x E3/T3 processing board Slots 12 and 13

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Board Full Name Valid Slots

N1PL3A (not used 3 x E3/T3 processing board Slots 11–13

with the interface
board)

N2PL3A (not used 3 x E3/T3 processing board Slots 11–13

with the interface
board)

N1PL3 3 x E3/T3 processing board Slots 12 and 13

N1PQ1(A/B) 63 x E1 75-ohm/120-ohm Slots 11–13

processing board

N2PQ1(A/B) 63 x E1 75-ohm/120-ohm Slots 11–13

processing board

R1PD1(A/B) 32 x E1 75-ohm/120-ohm Valid slots if the cross-connect

processing board (half-width) capacity is 20 Gbit/s: slots 1-3,
6-8, 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13

R2PD1(A/B) 32 x E1 75-ohm/120-ohm Valid slots if the cross-connect

processing board (half-width) capacity is 20 Gbit/s: slots 1-3,
6-8, 11-13
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13

N1PQM 63 x E1/T1 processing board Slots 11–13

N1DX1 DDN service access and Slots 11-13

convergence board

N1DXA DDN service convergence and Slots 11-13

processing board

Table 3-14 lists the interface boards or protection switching boards and their valid slots for the
OptiX OSN 1500B.

Table 3-14 Interface/protection switching boards and their valid slots for the OptiX OSN 1500B

Board Full Name Valid Slots

N1EU08 8 x STM-1 (e) electrical interface Slots 14 and 16

board

N1OU08 8 x STM-1 optical interface board Slots 14 and 16

N2OU08 8 x STM-1 optical interface board Slots 14 and 16

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Board Full Name Valid Slots

N1EU04 4 x STM-1 (e) electrical interface Slots 14 and 16

board

N1MU04 4 x E4/STM-1 interface board Slots 14 and 16

N1C34S 3 x 34M/45M electrical interface Slots 14 and 16

switching board

N1D34S 6 x 34M/45M electrical interface Slots 14–17

switching board

N1D75S 32 x E1/T1 75-ohm electrical Slots 14-17

interface switching board

N1D12S 32 x E1/T1 120-ohm electrical Slots 14-17

interface switching board

N1D12B 32 x E1/T1 120-ohm electrical Slots 14-17

interface board

N1DM12 DDN service interface board Slots 14-17

N1TSB8 8-channel electrical interface Slots 14 and 15

switching board

N1TSB4 4-channel electrical interface Slot 14

switching board

N1ETF8 8 x FE Ethernet electrical interface Slots 14–17

board

N1EFF8 8-channel Ethernet optical Slots 14–17

interface board

N1ETS8 8 x 10/100M Ethernet twisted pair Slots 14 and 16

interface switching board

Table 3-15 lists the data processing boards and their valid slots for the OptiX OSN 1500B.

Table 3-15 Data processing boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

N1EMS4 (used with 4 x GE and 16 x FE Ethernet Valid slots if the cross-connect

the interface board) processing board with Lanswitch capacity is 20 Gbit/s: slots 12-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 12-13
(1.25 Gbit/s)

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Board Full Name Valid Slots

N1EMS4 (not used 4 x GE Ethernet processing board Valid slots if the cross-connect
with the interface with Lanswitch capacity is 20 Gbit/s: slots 11-13
board) (2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EGS4 4 x GE Ethernet processing board Valid slots if the cross-connect

with Lanswitch capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N3EGS4 4 x GE Ethernet processing board Valid slots if the cross-connect

with Lanswitch capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N2EGS4A 4 x GE Ethernet processing board Valid slots if the cross-connect

with Lanswitch capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N2EGS2 2 x GE Ethernet processing board Valid slots if the cross-connect

with Lanswitch capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 11
(622 Mbit/s), 12-13 (1.25 Gbit/s)

N1EGT2 2 x GE Ethernet transparent Valid slots if the cross-connect

transmission board capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 11
(622 Mbit/s), 12-13 (1.25 Gbit/s)

N1EFS4 4 x FE Ethernet processing board Slots 11–13

with Lanswitch

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Board Full Name Valid Slots

N2EFS4 4 x FE Ethernet processing board Valid slots if the cross-connect

with Lanswitch capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EFS0 (used with 8 x FE Ethernet processing board Slots 12–13 (622 Mbit/s)
the interface board) with Lanswitch

N2EFS0 (used with 8 x FE Ethernet processing board Slots 12–13 (1.25 Gbit/s)
the interface board) with Lanswitch

N4EFS0 (used with 8 x FE Ethernet processing board Valid slots if the cross-connect
the interface board) with Lanswitch capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EFT8 (not used 8 x 10M/100M Ethernet Slots 11–13 (622 Mbit/s)

with the interface transparent transmission board
board)

N1EFT8 (used with 16 x 10M/100M Ethernet Slots 12 and 13 (1.25 Gbit/s)

the interface board) transparent transmission board

N1EFT8A 8 x FE transparent transmission Slots 11–13 (622 Mbit/s)

(interfaces available board
on the front panel)

N2EGR2 2 x GE Ethernet ring processing Valid slots if the cross-connect

board capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slot 12-13 (1.25 Gbit/s)

N2EMR0 (used with 1 x GE and 12 x FE Ethernet Valid slots if the cross-connect

the interface board) processing board capacity is 20 Gbit/s: slots 12-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 12-13
(1.25 Gbit/s)

N2EMR0 (not used 1 x GE and 4 x FE Ethernet Valid slots if the cross-connect

with the interface processing board capacity is 20 Gbit/s: slots 11-13
board) (2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

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Board Full Name Valid Slots

R1EFT4 (interfaces 4 x FE processing board Valid slots if the cross-connect

available on the front capacity is 20 Gbit/s: slots 1-3,
panel) 6-9, 11-13 (622 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 6-8,
11-13 (622 Gbit/s)

N1EFF8 8-channel Ethernet optical Slots 14–17

interface board

N1ETS8 8 x 10/100M Ethernet twisted pair Slots 14 and 16

interface switching board

N1MST4 4-channel multiservice Valid slots if the cross-connect

transparent transmission board capacity is 20 Gbit/s: slots 11-13
(2.5 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 11
(622 Mbit/s), 12-13 (1.25 Gbit/s)

N1ADQ1 4 x STM-1 ATM processing board Valid slots if the cross-connect

capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N1ADL4 1 x STM-4 ATM processing board Valid slots if the cross-connect

capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slot 11 (622
Mbit/s), slots 12-13 (1.25 Gbit/s)

N1IDQ1 4 x STM-1 IMA processing board Valid slots if the cross-connect

capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 12-13
(1.25 Gbit/s)

N1IDL4 1 x STM-4 IMA processing board Valid slots if the cross-connect

capacity is 20 Gbit/s: slots 11-13
(1.25 Gbit/s)
Valid slots if the cross-connect
capacity is 15 Gbit/s: slots 12-13
(1.25 Gbit/s)

Table 3-16 lists the WDM boards and their valid slots for the OptiX OSN 1500B.

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Table 3-16 WDM boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

N1LWX Arbitrary rate access board Slots 11–13

N1MR2A Arbitrary two-wavelength add/ Slots 11–13

drop board

N1MR2B Arbitrary two-wavelength add/ Slots 1–3, 6–9 and 11–13

drop board (half-width)

N1MR2C Arbitrary two-wavelength add/ Slots 14–17

drop board

TN11MR2 2-channel optical add/drop Slots 11–13

multiplexing board

TN11MR4 4-channel optical add/drop Slots 11–13

multiplexing board

TN11CMR2 2-channel CWDM optical add/ Slots 11–13

drop multiplexing board

TN11CMR4 4-channel CWDM optical add/ Slots 11–13

drop multiplexing board

Table 3-17 lists the optical booster amplifier boards and their valid slots for the OptiX OSN
1500B.

Table 3-17 Optical booster amplifier boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

N1BA2 2-channel optical booster Slots 11–13

amplifier board

N1BPA, N2BPA Optical booster preamplifier Slots 11–13

board

TN11OBU1 Optical booster amplifier board Slots 11–13

N1FIB Filter isolating board Slots 12 and 13

61COA, 62COA, COA board Slots 101–102

N1COA

ROP Single wavelength long-haul Slot 103 (external)

board (remote pumping)

Table 3-18 lists the auxiliary boards and their valid slots for the OptiX OSN 1500B.

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3 Subrack Hardware Description

Table 3-18 Auxiliary boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots

R1AMU Orderwire processing or alarm Slot 9

concatenation board

R1AUX System auxiliary processing unit Slot 10

R2AUX System auxiliary interface board Slot 10

R1FAN Fan board Slot 20

R1EOW Orderwire communication board Slot 9

R1PIU PIU board Slots 18–19

UPMa Uninterruptable power module Slot 50

a: The UPM is in case shape. On the T2000, it is displayed as CAU board seated in the logical
slot 50.

3.5 Technical Specifications

The specifications of the subrack cover dimensions, weight and maximum power consumption.
Table 3-19 lists the technical specifications of the OptiX OSN 1500A subrack.

Table 3-19 Technical specifications of the OptiX OSN 1500A subrack

Dimensions (mm) Weight (kg)

444 (W) x 262 (D) x 131 (H) 8 (the backplane, fans and two PIU
boards included)

Table 3-20 lists power consumption of the OptiX OSN 1500A subrack.

Table 3-20 Maximum power consumption of the OptiX OSN 1500A subrack
Subrack Type Maximum Power Fuse Capacity
Consumption

OptiX OSN 1500A general 200 W 20 A

subrack

Table 3-21 lists the technical specifications of the OptiX OSN 1500B subrack.

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Table 3-21 Technical specifications of the OptiX OSN 1500B subrack

Dimensions (mm) Weight (kg)

444 (W) x 263 (D) x 221 (H) 9 (the backplane, fans and two PIU
boards included)

Table 3-22 lists power consumption of the OptiX OSN 1500B subrack.

Table 3-22 Maximum power consumption of the OptiX OSN 1500B subrack
Subrack Type Maximum Power Fuse Capacity
Consumption

OptiX OSN 1500B general 280 W 20 A

subrack

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Hardware Description 4 Board List and Classification

4 Board List and Classification

About This Chapter

This chapter describes the appearance, barcode and classification of boards used for the OptiX
OSN systems.

4.1 Appearance and Dimensions of Boards

Different boards have different appearance and dimensions.
4.2 Description of the Barcode on the Board
The barcode on the front panel of the board indicates the board version, name and board features.
4.3 Board Classification
By function, the boards can be classified into SDH processing boards, PDH processing boards,
data processing boards, WDM processing boards and auxiliary boards.

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4.1 Appearance and Dimensions of Boards

Different boards have different appearance and dimensions.
Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500.

Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500
Item Appearance and Dimensions

Board
appearance

Board Integrated board of the Board housed in a divided Service interface

classificatio SCC, cross-connect and slot (PD1/PIUA/AUX/ board (D75S, for
n line units (CXL) EOW) example)

Height 262.05 111.8 262.05

(mm)

Depth (mm) 220 220 110

Width (mm) 25.4 25.4 22

Note: The figure in the right cell illustrates the three dimensions. The H
height and width are measured for the front panel and the depth is
measured for the printed circuit board (PCB). D W

CAUTION
Wear the anti-static wrist strap when holding the board with hands. Make sure that the anti-static
wrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.

DANGER
Avoid direct eye exposure to laser beams launched from the optical interface board or optical
interfaces. Otherwise, damage may be caused to the eyes.

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CAUTION
l Do not directly insert the attenuators into the level optical modules. If the attenuators are
required, use the attenautors at the ODF side.
l If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT
interface.
l When performing the loopback, use attenuators to prevent damage to the optical modules.

4.2 Description of the Barcode on the Board

The barcode on the front panel of the board indicates the board version, name and board features.
Two types of barcodes are used for the boards of the OptiX OSN 1500.
l 16-character manufacturing code + board version + board name + board feature code
l 20-character manufacturing code + board version + board name + board feature code

The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-character
manufacturing code.

Figure 4-1 Barcode of a board

Bar code

0364401055000015 -SSN3SL16A01
① ② ③ ④ 5

① Last 6-character serial code of BOM

② Internal code
③ Board version
④ Board name
5 Board feature code

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4 Board List and Classification Hardware Description

NOTE

For details on the board feature code, see the section that describes the board feature code for each board.

4.3 Board Classification

By function, the boards can be classified into SDH processing boards, PDH processing boards,
data processing boards, WDM processing boards and auxiliary boards.

4.3.1 SDH Processing Boards

The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1
levels.
4.3.2 PDH Processing Boards
The OptiX OSN 1500 supports PDH processing boards at different rates and of different
impedance.
4.3.3 Data Processing Boards
The OptiX OSN 1500 supports data processing boards with the transparent transmission,
switching or RPR function.
4.3.4 Interface Boards and Switching Boards
The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and
switching boards.
4.3.5 Cross-Connect Boards and SCC Boards
The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units
at different rates.
4.3.6 Auxiliary Boards
The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards
and fan boards.
4.3.7 WDM Processing Boards
The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop
multiplexing boards and optical power amplifier boards.
4.3.8 Optical Amplifier Boards and Dispersion Compensation Board
The OptiX OSN 1500 supports several optical booster amplifier boards.
4.3.9 Power Interface Boards
The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the
UPM and R1PIU.

4.3.1 SDH Processing Boards

The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1
levels.
Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A.

Table 4-2 SDH processing boards for the OptiX OSN 1500A
Board Full Name

N1SL16 1 x STM-16 optical interface board

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Board Full Name

N2SL16 1 x STM-16 optical interface board

N3SL16 1 x STM-16 optical interface board

N1SL16A 1 x STM-16 optical interface board

N2SL16A 1 x STM-16 optical interface board

N3SL16A 1 x STM-16 optical interface board

N1SF16 1 x STM-16 optical interface board (with FEC)

N1SL4(A) 1 x STM-4 optical interface board

N2SL4 1 x STM-4 optical interface board

R1SL4 1 x STM-4 optical interface board (half-width)

N1SLQ4(A) 1 x STM-4 optical interface board

N2SLQ4 4 x STM-4 optical interface board

N1SLD4(A) 2 x STM-4 optical interface board

N2SLD4 2 x STM-4 optical interface board

R1SLD4 2 x STM-4 optical interface board (half-width)

N1SLT1 12 x STM-1 optical interface board

N1SLQ1(A) 4 x STM-1 optical interface board

N2SLQ1 4 x STM-1 optical interface board

R1SLQ1 4 x STM-1 optical interface board (half-width)

N1SL1(A) 1 x STM-1 optical interface board

N2SL1 1 x STM-1 optical interface board

R1SL1 1 x STM-1 optical interface board (half-width)

N1SEP1 2 x STM-1 line processing board when interfaces are available

on the front panel

N2SLO1 8 x STM-1 optical interface board

Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B.

Table 4-3 SDH processing boards for the OptiX OSN 1500B

Board Full Name

N1SL16 1 x STM-16 optical interface board

N2SL16 1 x STM-16 optical interface board

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Board Full Name

N3SL16 1 x STM-16 optical interface board

N1SL16A 1 x STM-16 optical interface board

N2SL16A 1 x STM-16 optical interface board

N3SL16A 1 x STM-16 optical interface board

N1SF16 1 x STM-16 optical interface board (with FEC)

N1SL4(A) 1 x STM-4 optical interface board

N2SL4 1 x STM-4 optical interface board

R1SL4 1 x STM-4 optical interface board (half-width)

N1SLQ4(A) 4 x STM-4 optical interface board

N2SLQ4 4 x STM-4 optical interface board

N1SLD4(A) 2 x STM-4 optical interface board

N2SLD4 2 x STM-4 optical interface board

R1SLD4 2 x STM-4 optical interface board (half-width)

N1SLT1 12 x STM-1 optical interface board

N1SLQ1(A) 4 x STM-1 optical interface board

N2SLQ1 4 x STM-1 optical interface board

R1SLQ1 4 x STM-1 optical interface board (half-width)

N1SL1(A) 1 x STM-1 optical interface board

N2SL1 1 x STM-1 optical interface board

R1SL1 1 x STM-1 optical interface board (half-width)

N1SEP1 2 x STM-1 line processing board when interfaces are available

on the front panel
8 x STM-1 line processing board when used with an interface
board

N2SLO1 8 x STM-1 optical interface board

4.3.2 PDH Processing Boards

The OptiX OSN 1500 supports PDH processing boards at different rates and of different
impedance.
Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.

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Table 4-4 PDH processing boards for the OptiX OSN 1500A
Board Full Name Board Full Name

R1PL1 16 x E1 processing board N1PL3A 3 x E3/T3 processing board

(interfaces available on the
front panel)

R1PD1 32 x E1 processing board N2PL3A 3 x E3/T3 processing board

(interfaces available on the
front panel)

R2PD1 32 x E1 processing board N1DXA DDN service convergence

board

Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B.

Table 4-5 PDH processing boards for the OptiX OSN 1500B
Board Full Name Board Full Name

R1PL1 16 x E1 processing board N2PL3A 3 x E3/T3 processing board

(interfaces available on the
front panel)

R1PD1 32 x E1 processing board N1PD3 6 x E3/T3 processing board

R2PD1 32 x E1 processing board N2PD3 6 x E3/T3 processing board

N1PQ1 63 x E1 processing board N2PQ3 12 x E3/T3 processing board

N2PQ1 63 x E1 processing board N1DX1 DDN service access and

convergence board

N1PQM 63 x E1/T1 processing board N1DXA DDN service convergence

board

N1PL3 3 x E3/T3 processing board N1SPQ4 4 x E4/STM-1 electrical

processing board

N2PL3 3 x E3/T3 processing board N2SPQ4 4 x E4/STM-1 electrical

processing board

N1PL3A 3 x E3/T3 processing board - -

(interfaces available on the front
panel)

4.3.3 Data Processing Boards

The OptiX OSN 1500 supports data processing boards with the transparent transmission,
switching or RPR function.
Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.

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Table 4-6 Data processing boards for the OptiX OSN 1500A
Board Full Name Board Full Name

N1EFT4 4 x FE Ethernet transparent N1EGS4 4 x GE Ethernet convergence

transmission board (half- board
width)

N1EFT8 8 x FE Ethernet transparent N3EGS4 4 x GE Ethernet convergence

transmission board board

N2EGS4A 4 x GE Ethernet convergence N2EGR2 2 x GE Ethernet ring processing

board board

N1EFT8A 8 x FE Ethernet transparent N2EMR0 4 x FE and 1 x GE Ethernet ring

transmission board processing board

N1EGT2 2 x GE Ethernet transparent N1ADL4 1 x STM-4 ATM processing

transmission board board

N1EFS4 4 x FE Ethernet processing N1ADQ1 1 x STM-4 ATM processing

board with Lanswitch board

N2EFS4 4 x FE Ethernet processing N1IDL4 1 x STM-4 ATM processing

board with Lanswitch board

N2EGS2 2 x GE Ethernet processing N1IDQ1 4 x STM-1 ATM processing

board with Lanswitch board

N1EMS4 4 x GE Ethernet transparent N1MST4 4-port multi-service

transmission and convergence transparent transmission board
board

Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B.

Table 4-7 Data processing boards for the OptiX OSN 1500B
Board Full Name Board Full Name

N1EFT4 4 x FE Ethernet transparent N1EMS4 4 x GE and 16 x FE Ethernet

transmission board (half- transparent transmission and
width) convergence board

N1EFT8 8 x FE or 16 x FE Ethernet N1EGS4 4 x GE Ethernet convergence

transparent transmission board board

N1EFT8A 8 x FE Ethernet transparent N3EGS4 4 x GE Ethernet convergence

transmission board board

N2EGS4A 4 x GE Ethernet convergence N2EGR2 2 x GE Ethernet ring processing

board board

N1EGT2 2 x GE Ethernet transparent N2EMR0 12 x FE and 1 x GE Ethernet

transmission board ring processing board

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Board Full Name Board Full Name

N1EFS0 8-port Fast Ethernet processing N1ADL4 1 x STM-4 ATM processing

board with Lanswitch board

N2EFS0 8 x FE Ethernet processing N1ADQ1 1 x STM-4 ATM processing

board with Lanswitch board

N4EFS0 8 x FE Ethernet processing N1IDL4 1 x STM-4 ATM processing

board with Lanswitch board

N1EFS4 4 x FE Ethernet processing N1IDQ1 4 x STM-1 ATM processing

board with Lanswitch board

N2EFS4 4 x FE Ethernet processing N1MST4 4-port multi-service

board with Lanswitch transparent transmission board

N2EGS2 2 x GE Ethernet processing - -

board with Lanswitch

4.3.4 Interface Boards and Switching Boards

The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and
switching boards.

Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A.

Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A

Board Full Name

R1L12S 16 x E1/T1 120-ohm electrical interface switching board

R1L75S 16 x E1 75-ohm electrical interface switching board

Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B.

Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B

Board Full Name Board Full Name

N1EU08 8 x STM-1 electrical interface N1D12S 32 x E1/T1 120-ohm

board electrical interface switching
board

N1OU08 8 x STM-1 optical interface N1D12B 32 x E1/T1 120-ohm

board (LC) electrical interface board

N2OU08 8 x STM-1 optical interface N1EFF8 8 x 100M Ethernet optical

board (SC) interface board

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Board Full Name Board Full Name

N1D75S 32 x E1/T1 75-ohm electrical N1ETF8 8 x 100M Ethernet twisted

interface switching board pair interface board

N1MU04 4 x STM-1 electrical interface N1ETS8 8 x 10/100M Ethernet

board twisted pair interface
switching board

N1D34S 6 x E3/T3 electrical interface N1DM12 DDN service interface board

switching board

N1C34S 3 x E3/T3 electrical interface N1TSB4 4-channel electrical

switching board interface switching board

N1EU04 4 x STM-1 electrical interface N1TSB8 8-channel electrical

board interface switching board

4.3.5 Cross-Connect Boards and SCC Boards

The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units
at different rates.
Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500A
and the OptiX OSN 1500B.

Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the
OptiX OSN 1500B
Board Full Name

Q2CXL1, Q3CXL1, Integrated board of the SCC, cross-connect and line units at the
R1CXLL1, R1CXLD1, STM-1 level
R1CXLQ1

Q2CXL4, Q3CXL4, Integrated board of the SCC, cross-connect and line units at the
R1CXLL4, R1CXLD4, STM-4 level
R1CXLQ4

Q2CXL16, Q3CXL16, Integrated board of the SCC, cross-connect and line units at the
R1CXLL16 STM-16 level

4.3.6 Auxiliary Boards

The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards
and fan boards.
Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN
1500B.

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Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B

Board Full Name Board Full Name

R1EOW Orderwire phone R1AUX/ System auxiliary

processing board R2AUX interface board

R1AMU Orderwire processing or R1FAN Fan board

alarm concatenation
board

4.3.7 WDM Processing Boards

The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop
multiplexing boards and optical power amplifier boards.

Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A.

Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A

Board Full Name Board Full Name

TN11CMR2 2-channel optical add/drop N1MR2C 2-channel optical add/drop

multiplexing board multiplexing board

TN11CMR4 4-channel optical add/drop N1LWX Arbitrary bit rate wavelength

multiplexing board conversion board

TN11MR2 2-channel optical add/drop TN11OBU1 Optical booster amplifier

multiplexing board board

TN11MR4 4-channel optical add/drop N1FIB Filter isolating board

multiplexing board

N1MR2A 2-channel optical add/drop - -

multiplexing board

Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B.

Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B

Board Full Name Board Full Name

TN11CMR2 2-channel optical add/drop N1MR2B 2-channel optical add/drop

multiplexing board multiplexing board

TN11CMR4 4-channel optical add/drop N1MR2C 2-channel optical add/drop

multiplexing board multiplexing board

TN11MR2 2-channel optical add/drop N1LWX Arbitrary bit rate wavelength

multiplexing board conversion board

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Board Full Name Board Full Name

TN11MR4 42-channel optical add/drop TN11OBU1 Optical booster amplifier

multiplexing board board

N1MR2A 2-channel optical add/drop N1FIB Filter isolating board

multiplexing board

4.3.8 Optical Amplifier Boards and Dispersion Compensation

Board
The OptiX OSN 1500 supports several optical booster amplifier boards.
Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported by
the OptiX OSN 1500A and the OptiX OSN 1500B.

Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX
OSN 1500A/B
Board Full Name

N1BPA, N2BPA Optical booster and pre-amplifier board

N1BA2 Optical booster amplifier board

N1COA, 61COA, 62COA Case-shaped optical amplifier

4.3.9 Power Interface Boards

The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the
UPM and R1PIU.
The UPM is an uninterruptible power module.
The R1PIUA is used for the OptiX OSN 1500A as the power interface board.
The R1PIU is used for the OptiX OSN 1500B as the power interface board.

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Hardware Description 5 SDH Processing Boards

5 SDH Processing Boards

About This Chapter

This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels.

5.1 SL1
This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.2 SL1A
This section describes the SL1A, a 1 x STM-1 optical interface board, in terms of version,
function, principle, front panel and technical specifications.
5.3 SLQ1
This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.4 SLQ1A
This section describes the SLQ1A, a 4 x STM-1 optical interface board, in terms of version,
function, principle, front panel and technical specifications.
5.5 SLO1
This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.6 SLT1
This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.7 SEP1
This section describes the SEP1 board, in terms of the version, function, working principle, front
panel, and specifications.
5.8 SL4
This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.9 SL4A
This section describes the SL4A, a 1 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

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5.10 SLD4
This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.11 SLD4A
This section describes the SLD4A, a 2 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.
5.12 SLQ4
This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.13 SLQ4A
This section describes the SLQ4A, a 4 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.
5.14 SL16
This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.15 SL16A
This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.16 SF16
This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC
function, in terms of the version, function, working principle, front panel and specifications.

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Hardware Description 5 SDH Processing Boards

5.1 SL1
This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.1.1 Version Description

The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which
is housed in a divided slot in a subrack.
5.1.2 Function and Feature
The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.1.3 Working Principle and Signal Flow
The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
5.1.4 Front Panel
On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety
class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.
5.1.5 Valid Slots
The slots valid for the SL1 vary with the version of the board.
5.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1 indicates the optical interface type.
5.1.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL1.
5.1.8 Technical Specifications
The technical specifications of the SL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.1.1 Version Description

The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which
is housed in a divided slot in a subrack.

Table 5-1 lists the details on the versions of the SL1 board.

Table 5-1 Version Description of the SL1

Item Description

Functional The SL1 has three versions, R1, N1 and N2.

version

Difference The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do not
support the TCM function. The R1SL1 is housed in a divided slot.

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Item Description

Replaceability The versions cannot be replaced by each other.

NOTE
The N2SL1 board supports the TCM function, which are not supported by the N1SL1 or R1SL1 board.
For this reason, when configuring MSP and SNCP, you cannot configure the N1SL1 or R1SL1 board as
the protection board if the working board is N2SL1 configured with the TCM service . Otherwise, the
service may be interrupted due to the switching operation.

5.1.2 Function and Feature

The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-2 lists the functions and features of the SL1.

Table 5-2 Functions and features of the SL1

Function and SL1
Feature

Basic function Transmits and receives 1 x STM-1 optical signals.

Specification of Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and
the optical Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types
interface comply with ITU-T G.957 in features. The optical interface of the Ve-1.2
type complies with the standards defined by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical Supports the usage and detection of the pluggable optical module SFP for
module easy maintenance.
The optical interface supports the function of setting the on/off state of the
laser and the ALS function.

Service Supports the processing of the VC-12, VC-3 and VC-4 services.
processing

Overhead Supports the processing of the SOH bytes of the STM-1 signals.
processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the two-fiber bidirectional MSP protection ring, four-fiber MSP
scheme protection ring, linear MPS, SNCP, SNCTP and SNCMP.

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Function and SL1

Feature

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.1.3 Working Principle and Signal Flow

The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.

Figure 5-1 shows the block diagram for the working principle of the SL1.

Figure 5-1 Block diagram for the working principle of the SL1

155 MHz Reference clock

155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-1 units are described below:

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O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.

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l Controls the laser.

l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.1.4 Front Panel

On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety
class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1.

Figure 5-2 Front panel of the N1SL1/N2SL1

SL1
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT

IN

SL1

Figure 5-3 shows the appearance of the front panel of the R1SL1.

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Figure 5-3 Front panel of the R1SL1

SL1
STAT
ACT
PROG
SRV

OUT IN

SL1

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type and
usage of the optical interfaces.

Table 5-3 Optical interfaces of the SL1

Interfaces on the Interface Type Usage

Front Panel

IN LC Receives optical signals.

OUT LC Transmits optical signals.

5.1.5 Valid Slots

The slots valid for the SL1 vary with the version of the board.

The slots valid for the SL1 are as follows:

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l The R1SL1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A
subrack.
l The N1SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SL1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B
subrack.
l The N1SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1 indicates the optical interface type.

Table 5-4 lists the relation between the board feature code and optical interface type for the SL1.

Table 5-4 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN1SL110, SSN2SL110 10 S-1.1

SSN1SL111, SSN2SL111 11 L-1.1

SSN1SL112, SSN2SL112 12 L-1.2

SSN1SL113, SSN2SL113 13 Ve-1.2

SSN1SL114, SSN2SL114 14 I-1

5.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL1.

You can use the T2000 to set the following parameters for the SL1:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.1.8 Technical Specifications

The technical specifications of the SL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-5 lists the specifications of the optical interfaces of the SL1.

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Table 5-5 Specifications of the optical interfaces of the SL1

Item Specification

Nominal 155.52 Mbit/s

bit rate

Line code NRZ

Optical I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

interface
type

Optical MLM MLM MLM, SLM SLM SLM

source type

Working 1260–1360 1261–1360 1263–1360 1480–1580 1480–1580

wavelengt
h (nm)

Launched –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical
power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity
(dBm)

Overload –8 –8 –10 –10 –10

optical
power
(dBm)

Min. 8.2 8.2 10 10 10

extinction
ratio (dB)

Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinal
mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL1/N2SL1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

The mechanical specifications of the R1SL1 are as follows:

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l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.3

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL1/N2SL1 is
14 W.
In the normal temperature (25℃), the maximum power consumption of the R1SL1 is 10.3 W.

5.2 SL1A
This section describes the SL1A, a 1 x STM-1 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

5.2.1 Version Description

The functional version of the SL1A board is N1.
5.2.2 Function and Feature
The SL1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.2.3 Working Principle and Signal Flow
The SL1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead
processing module, logic control module and power supply module.
5.2.4 Front Panel
On the front panel of the SL1A board, there are indicators, interfaces, barcode and laser safety
class label.
5.2.5 Valid Slots
The SL1A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and
any of slots 11–13 in the OptiX OSN 1500B subrack.
5.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1A indicates the optical interface type.
5.2.7 Board Configuration Reference
You can set parameters for the SL1A board on the T2000.
5.2.8 Technical Specifications
The technical specifications of the SL1A board cover the optical interface specifications, board
dimensions, weight and power consumption.

5.2.1 Version Description

The functional version of the SL1A board is N1.

5.2.2 Function and Feature

The SL1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-6 lists the functions and features of the SL1A board.

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Table 5-6 Functions and features of the SL1A board

Function and Description
Feature

Basic function Transmits and receives 1 x STM-1 optical signals.

Specification of Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and
the optical Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types
interface comply with ITU-T G.957 Recommendations in features. The optical
interface of the Ve-1.2 type complies with the standards defined by
Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical Supports the usage and detection of the pluggable optical module SFP for
module easy maintenance.
The optical interface supports the function of setting the on/off state of the
laser and the ALS function.

Service Supports processing the VC-12, VC-3 or VC-4 service.

processing

Overhead Supports processing the SOH bytes of the STM-1 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports setting and querying the J0, J1 or C2 byte.

Alarm and Provides abundant alarms and performance events to easily manage and
performance maintain the equipment.
event

Protection Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP
scheme protection ring, linear MSP protection ring, sub-network connection
protection (SNCP), sub-network connection tunnel protection (SNCTP),
and sub-network connection multi-protection (SNCMP).

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports querying the manufacturing information of the board.
Supports loading the FPGA in-service.
Supports upgrading the board software without affecting services.

5.2.3 Working Principle and Signal Flow

The SL1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead
processing module, logic control module and power supply module.
Figure 5-4 shows the block diagram for the working principle of the SL1A board.

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Figure 5-4 Block diagram for the working principle of the SL1A
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....
Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

In the receive direction

The O/E conversion module converts the received STM-1 optical signals into STM-1 electrical
signals and detects the R_LOS alarm.

The data clock recovery unit recovers the clock signals, and transmits the STM-1 electrical
signals along with the clock signals to the overhead processing module. The overhead processing
module detects the R_LOF and R_OOF alarm signals.

The overhead processing module also extracts overhead bytes from the received STM-1 signals
and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the cross-
connect units and then transmits the signals to the E/O conversion module. The E/O conversion
module converts the received STM-1 electrical signals into STM-1 optical signals, which are
then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.

l Logic Control Module

The logic control module traces the clock signals, which are received from the active or
standby cross-connect board, and the frame header signals. This module controls the laser
and passes through the orderwire and ECC bytes between the two optical interface boards
that form the ADM. This module also selects the clock frame headers from the active or
standby cross-connect board.
l Power Supply Module

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The power supply module provides the DC voltages required by the modules of the board.

5.2.4 Front Panel

On the front panel of the SL1A board, there are indicators, interfaces, barcode and laser safety
class label.

Appearance of the Front Panel

Figure 5-5 shows the appearance of the front panel of the SL1A.

Figure 5-5 Front panel of the SL1A

SL1A
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT

IN

SL1A

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SL1A board, there is one pair of optical interfaces. Table 5-7 lists the
type and usage of these optical interfaces.

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Table 5-7 Optical interfaces of the SL1A

Interface Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.

5.2.5 Valid Slots

The SL1A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and
any of slots 11–13 in the OptiX OSN 1500B subrack.

5.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1A indicates the optical interface type.

Table 5-8 lists the relation between the board feature code and optical interface type of the SL1A.

Table 5-8 Relation between the board feature code and optical interface type of the SL1A

Board Feature Code Optical Interface Type

SSN1SL1A10 10 S-1.1

SSN1SL1A11 11 L-1.1

SSN1SL1A12 12 L-1.2

SSN1SL1A13 13 Ve-1.2

SSN1SL1A14 14 I-1

5.2.7 Board Configuration Reference

You can set parameters for the SL1A board on the T2000.

On the T2000, you can set the following parameters for the SL1A board.

l J0
l J1
l C2

For details of the parameters, see F Board Configuration Reference.

5.2.8 Technical Specifications

The technical specifications of the SL1A board cover the optical interface specifications, board
dimensions, weight and power consumption.

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Optical Interface Specifications

Table 5-9 lists the specifications of the optical interfaces of the SL1A board.

Table 5-9 Specifications of the optical interfaces of the SL1A board

Item Specification

Nominal 155520kbit/s
bit rate

Line code NRZ

Optical I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

interface
type

Optical MLM MLM MLM, SLM SLM SLM

source type

Working 1260-1360 1261-1360 1263-1360 1480-1580 1480-1580

wavelengt
h (nm)

Launched –15-–8 –15-–8 –5-0 –5-0 –3-0

optical
power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity
(dBm)

Overload –8 –8 –10 –10 –10

optical
power
(dBm)

Minimum 8.2 8.2 10 10 10

extinction
ratio (dB)

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL1A board are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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l Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25℃), the maximum power consumption of the SL1A is 17 W.

5.3 SLQ1
This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.

5.3.1 Version Description

The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function and AU-3 service. The R1SLQ1 is a 4 x STM-1 optical
interface board, which is housed in a divided slot in a subrack.
5.3.2 Function and Feature
The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.3.3 Working Principle and Signal Flow
The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.3.4 Front Panel
On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.
5.3.5 Valid Slots
The slots valid for the SLQ1 vary with the version of the board.
5.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1 indicates the optical interface type.
5.3.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLQ1.
5.3.8 Technical Specifications
The technical specifications of the SLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.3.1 Version Description

The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function and AU-3 service. The R1SLQ1 is a 4 x STM-1 optical
interface board, which is housed in a divided slot in a subrack.
Table 5-10 lists the details on the versions of the SLQ1 board.

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Table 5-10 Version Description of the SLQ1

Item Description

Functional The SLQ1 has three versions, R1, N1 and N2.

version

Difference The N2SLQ1 supports the TCM function and AU-3 service.
The N1SLQ1 and R1SLQ1 do not support the TCM function and AU-3
service.
The R1SLQ1 is housed in a divided slot.

Replaceability The versions cannot be replaced by each other.

NOTE
The N2SLQ1 board supports the TCM function and AU-3 service, which are not supported by the N1SLQ1
or R1SLQ1 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLQ1
or R1SLQ1 board as the protection board if the working board is N2SLQ1 configured with the TCM service
or AU-3 service. Otherwise, the service may be interrupted due to the switching operation.

5.3.2 Function and Feature

The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-11 lists the functions and features of the SLQ1.

Table 5-11 Functions and features of the SLQ1

Function and SLQ1

Feature

Basic function Transmits and receives 4 x STM-1 optical signals.

Specification of Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, Ie-1
the optical and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2
interface types comply with ITU-T G.957 in features. The optical interface of the
Ve-1.2 type complies with the standards defined by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.

Service Supports the processing of the VC-12, VC-3 and VC-4 services.
processing N2SLQ1 supports AU-3 service.

Overhead Supports the processing of the SOH bytes of the STM-1 signals.
processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to four channels of ECC communication.

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Function and SLQ1

Feature

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the two-fiber unidirectional MSP protection ring, four-fiber

scheme MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.3.3 Working Principle and Signal Flow

The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.

Figure 5-6 shows the block diagram for the working principle of the SLQ1.

Figure 5-6 Block diagram for the working principle of the SLQ1

155 MHz Reference clock

155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy

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RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

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Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.3.4 Front Panel

On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-7 shows the appearance of the front panel of the N1SLQ1/N2SLQ1.

Figure 5-7 Front panel of the N1SLQ1/N2SLQ1

SLQ1
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1

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Figure 5-8 shows the appearance of the front panel of the R1SLQ1.

Figure 5-8 Front panel of the R1SLQ1

SLQ1

STAT
ACT
PROG
SRV
OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-12 lists the
type and usage of the optical interfaces.

Table 5-12 Optical interfaces of the SLQ1

Interfaces Interface Type Usage

IN1-IN4 LC Receives optical signals.

OUT1-OUT4 LC Transmits optical signals.

5.3.5 Valid Slots

The slots valid for the SLQ1 vary with the version of the board.
The slots valid for the SLQ1 are as follows:

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l The R1SLQ1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A
subrack.
l The N1SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SLQ1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B
subrack.
l The N1SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1 indicates the optical interface type.

Table 5-13 lists the relation between the board feature code and optical interface type for the
SLQ1.

Table 5-13 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN2SLQ110, 10 S-1.1
SSN1SLQ110

SSN2SLQ111, 11 L-1.1
SSN1SLQ111

SSN2SLQ112, 12 L-1.2
SSN1SLQ112

SSN2SLQ113, 13 Ve-1.2
SSN1SLQ113

SSN2SLQ114, 14 I-1
SSN1SLQ114

SSN1SLQ115 15 Ie-1

5.3.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ1.

You can use the T2000 to set the following parameters for the SLQ1:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

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5.3.8 Technical Specifications

The technical specifications of the SLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-14 lists the specifications of the optical interfaces of the SLQ1.

Table 5-14 Specifications of the optical interfaces of the SLQ1

Item Specification

Nominal bit 155.52 Mbit/s

rate

Line code NRZ

Optical I-1 S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

interface
type

Optical MLM MLM MLM, SLM SLM MLM

source type SLM

Working 1260– 1261– 1263– 1480– 1480–1580 1260 ～

wavelength 1360 1360 1360 1580 1360
(nm)

Launched –15 to – –15 to –8 –5 to 0 –5 to 0 –3 to 0 -19 ～-14

optical 8
power
(dBm)

Receiver –23 –28 –34 –34 –34 –31

sensitivity
(dBm)

Overload –8 –8 –10 –10 –10 –14

optical
power
(dBm)

Min. 8.2 8.2 10 10 10 10

extinction
ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

The mechanical specifications of the R1SLQ1 are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SLQ1/
N2SLQ1 is 15 W.

In the normal temperature (25℃), the maximum power consumption of the R1SLQ1 is 12 W.

5.4 SLQ1A
This section describes the SLQ1A, a 4 x STM-1 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

5.4.1 Version Description

The functional version of the SLQ1A board is N1.
5.4.2 Function and Feature
The SLQ1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion
for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.4.3 Working Principle and Signal Flow
The SLQ1A board consists of the O/E conversion module, data clock recovery unit, SDH
overhead processing module, logic control module, and power supply module.
5.4.4 Front Panel
On the front panel of the SLQ1A board, there are indicators, interfaces, barcode and laser safety
class label.
5.4.5 Valid Slots
The SLQ1A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and
any of slots 11–13 in the OptiX OSN 1500B subrack.
5.4.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1A indicates the optical interface type.
5.4.7 Board Configuration Reference
You can set parameters for the SLQ1A board on the T2000.
5.4.8 Technical Specifications
The technical specifications of the SLQ1A board cover the optical interface specifications, board
dimensions, weight and power consumption.

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5.4.1 Version Description

The functional version of the SLQ1A board is N1.

5.4.2 Function and Feature

The SLQ1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion
for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-15 lists the functions and features of the SLQ1A board.

Table 5-15 Functions and features of the SLQ1A board

Function and Description
Feature

Basic function Transmits and receives 4 x STM-1 optical signals.

Specification of Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, Ie-1
the optical and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2
interface types comply with ITU-T G.957 Recommendations in features. The
optical interface of the Ve-1.2 type complies with the standards defined
by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.

Service Supports processing the VC-12, VC-3 or VC-4 service.

processing

Overhead Supports processing the SOH bytes of the STM-1 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports setting and querying the J0, J1 or C2 byte.
Supports one to four channels of ECC communication.

Alarm and Provides abundant alarms and performance events to easily manage and
performance maintain the equipment.
event

Protection Supports the two-fiber unidirectional MSP protection ring, four-fiber

scheme MSP protection ring, linear MSP protection ring, sub-network connection
protection (SNCP), sub-network connection tunnel protection (SNCTP),
and sub-network connection multi-protection (SNCMP).

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Function and Description

Feature

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports inloop and outloop at a path level.
Supports warm reset and cold reset. The warm reset does not affect
services.
Supports querying the manufacturing information of the board.
Supports loading the FPGA in-service.
Supports upgrading the board software without affecting services.

5.4.3 Working Principle and Signal Flow

The SLQ1A board consists of the O/E conversion module, data clock recovery unit, SDH
overhead processing module, logic control module, and power supply module.

Figure 5-9 shows the block diagram for the working principle of the SLQ1A board.

Figure 5-9 Block diagram for the working principle of the SLQ1A board
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

In the receive direction

The O/E conversion module converts the received STM-1 optical signals into STM-1 electrical
signals and detects the R_LOS alarm.

The data clock recovery unit recovers the clock signals, and transmits the STM-1 electrical
signals along with the clock signals to the overhead processing module. The overhead processing
module detects the R_LOF and R_OOF alarm signals.

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The overhead processing module also extracts overhead bytes from the received STM-1 signals
and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the cross-
connect units and then transmits the signals to the E/O conversion module. The E/O conversion
module converts the received STM-1 electrical signals into STM-1 optical signals, which are
then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l Logic Control Module
The logic control module traces the clock signals, which are received from the active or
standby cross-connect board, and the frame header signals. This module controls the laser
and passes through the orderwire and ECC bytes between the two optical interface boards
that form the ADM. This module also selects the clock frame headers from the active or
standby cross-connect board.
l Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.

5.4.4 Front Panel

On the front panel of the SLQ1A board, there are indicators, interfaces, barcode and laser safety
class label.

Appearance of the Front Panel

Figure 5-10 shows the appearance of the front panel of the SLQ1A board.

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Figure 5-10 Front panel of the SLQ1A board

SLQ1A
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1A

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SLQ1A board, there are four pairs of optical interfaces. Table 5-16
lists the type and usage of the optical interfaces.

Table 5-16 Optical interfaces of the SLQ1A board

Interface Interface Type Usage

IN1-IN4 LC Receives optical signals.

OUT1–OUT4 LC Transmits optical signals.

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5.4.5 Valid Slots

The SLQ1A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and
any of slots 11–13 in the OptiX OSN 1500B subrack.

5.4.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1A indicates the optical interface type.

Table 5-17 lists the relation between the board feature code and optical interface type of the
SLQ1A.

Table 5-17 Relation between the board feature code and optical interface type of the SLQ1A

Board Feature Code Optical interface type

SSN1SLQ1A10 10 S-1.1

SSN1SLQ1A11 11 L-1.1

SSN1SLQ1A12 12 L-1.2

SSN1SLQ1A13 13 Ve-1.2

SSN1SLQ1A14 14 I-1

SSN1SLQ1A15 15 Ie-1

5.4.7 Board Configuration Reference

You can set parameters for the SLQ1A board on the T2000.

On the T2000, you can set the following parameters for the SLQ1A board.

l J0
l J1
l C2

For details of the parameters, see F Board Configuration Reference.

5.4.8 Technical Specifications

The technical specifications of the SLQ1A board cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-18 lists the specifications of the optical interfaces of the SLQ1A board.

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Table 5-18 Specifications of the optical interfaces of the SLQ1A board

Item Specification

Nominal bit 155520kbit/s

rate

Line code NRZ

Optical I-1 S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

interface
type

Optical MLM MLM MLM, SLM SLM MLM

source type SLM

Working 1260-13 1261-136 1263-13 1480-158 1480-1580 1260 ～

wavelength 60 0 60 0 1360
(nm)

Launched –15-–8 –15-–8 –5-0 –5-0 –3-0 -19 ～-14

optical
power
(dBm)

Receiver –23 –28 –34 –34 –34 –31

sensitivity
(dBm)

Overload –8 –8 –10 –10 –10 –14

optical
power
(dBm)

Minimum 8.2 8.2 10 10 10 10

extinction
ratio (dB)

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ1A board are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

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Power Consumption
At normal ambient temperature (25℃), the maximum power consumption of the SLQ1A board
is 17 W.

5.5 SLO1
This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.

5.5.1 Version Description

The functional version of the SLO1 board is N1.
5.5.2 Function and Feature
The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the
signals, to insert or extract the overhead bytes, and to generate alarm signals.
5.5.3 Working Principle and Signal Flow
The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.5.4 Front Panel
On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class
label.
5.5.5 Valid Slots
If the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eight
optical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiX
OSN 1500B subrack, one to eight optical interfaces can be configured.
5.5.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLO1 indicates the optical interface type.
5.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLO1.
5.5.8 Technical Specifications
The technical specifications of the SLO1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.5.1 Version Description

The functional version of the SLO1 board is N1.

5.5.2 Function and Feature

The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the
signals, to insert or extract the overhead bytes, and to generate alarm signals.
Table 5-19 lists the functions and features of the SLO1.

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Table 5-19 Functions and features of the SLO1 board

Function and SLO1
Feature

Basic function Receives and transmits 8 x STM-1 optical signals.

Specification of the Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2
optical interface and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and
L-1.2 types comply with ITU-T G.957 in features. The optical interface
of the Ve-1.2 type complies with the standards defined by Huawei.

Specification of the The optical module is pluggable. When optical modules of other types
optical module are inserted, an alarm indicating the mismatch of the optical module is
reported.
Supports detection and query of the information on the optical module.
Supports the default off state of the laser. The laser is turned off before
the software finishes the initialization when the board is powered on.
Supports the usage and detection of the pluggable optical module SFP.
Supports the setting and query of the on/off state of the laser. An alarm
is generated when the laser is turned off. Performance events are
reported to indicate the performance of the optical module.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.
Supports AU-3 services.

Overhead Supports the processing of the SOH bytes of the STM-1 signals.
processing Supports the transparent transmission and termination of the POH
bytes.
If the two SCC boards are not in service, the SLO1 does not transmit
overhead bytes (long 0s) to the two SCC boards.
Supports one to eight channels of ECC communication.

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

Protection scheme Supports the two-fiber unidirectional MSP protection ring, four-fiber
MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of
the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.5.3 Working Principle and Signal Flow

The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.

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Figure 5-11 shows the block diagram for the working principle of the SLO1.

Figure 5-11 Block diagram for the working principle of the SLO1
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....
Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

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– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.5.4 Front Panel

On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class
label.

Figure 5-12 shows the front panel of the SLO1.

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Figure 5-12 Front panel of the SLO1

SLO1
STAT
ACT
PROG
SRV

OUT1 IN1
OUT2
IN2
OUT3 IN3 OUT4
IN4
OUT5 IN5
OUT6
IN6
OUT7 IN7
OUT8 IN8

CLASS1
LASER
PRODUCT

SLO1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-20 lists the
type and usage of the optical interfaces.

Table 5-20 Optical interfaces of the SLO1

Interfaces Interface Type Usage

IN1–IN8 LC Receives optical signals.

OUT1–OUT8 LC Transmits optical signals.

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NOTE

The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 board
can use the pluggable optical modules for easy maintenance.

WARNING
The optical interfaces of the SLO1 board are level optical interfaces. Thus, use the optical
attenuator only at the ODF side.

5.5.5 Valid Slots

If the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eight
optical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiX
OSN 1500B subrack, one to eight optical interfaces can be configured.

5.5.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLO1 indicates the optical interface type.

Table 5-21 lists the relation between the board feature code and optical interface type for the
SLO1.

Table 5-21 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN2SLO110 10 S-1.1

SSN2SLO111 11 L-1.1

SSN2SLO112 12 L-1.2

SSN2SLO113 13 Ve-1.2

SSN2SLO114 14 I-1

5.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLO1.

You can use the T2000 to set the following parameters for the SLO1:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

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5.5.8 Technical Specifications

The technical specifications of the SLO1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-22 lists the specifications of the optical interfaces of the SLO1.

Table 5-22 Specifications of the optical interfaces of the SLO1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface I-1.1 S-1.1 L-1.1 L-1.2 Ve-1.2

type

Optical source type MLM MLM MLM, SLM SLM

SLM

Working 1261–1360 1261– 1263– 1480– 1480–

wavelength (nm) 1360 1360 1580 1580

Launched optical –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

power (dBm)

Receiver –23 –28 –34 –34 –34

sensitivity (dBm)

Overload optical –8 –8 –10 –10 –10

power (dBm)

Min. extinction 8.2 8.2 10 10 10

ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLO1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SLO1 is 26W.

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5.6 SLT1
This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.6.1 Version Description

The functional version of the SLT1 board is N1.
5.6.2 Function and Feature
The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.6.3 Working Principle and Signal Flow
The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on. The external services are accessed by the external interface boards EU08
and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
5.6.4 Front Panel
On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class
label.
5.6.5 Valid Slots
The SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve optical
interfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN
1500B subrack, one to twelve optical interfaces can be configured.
5.6.6 Board Configuration Reference
You can use the T2000 to set parameters for the SLT1.
5.6.7 Technical Specifications
The technical specifications of the SLT1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.6.1 Version Description

The functional version of the SLT1 board is N1.

5.6.2 Function and Feature

The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

Table 5-23 lists the functions and features of the SLT1.

Table 5-23 Functions and features of the SLT1

Function and SLT1

Feature

Basic function Transmits and receives 12 x STM-1 optical signals.

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Function and SLT1

Feature

Specification of Supports S-1.1 standard optical interfaces compliant with ITU-T G.957
the optical in features.
interface

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.

Service Supports the processing of the VC-12, VC-3 and VC-4 services.
processing

Overhead Supports the processing of the SOH bytes of the STM-1 signals.
processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
The port one to port eight support one to eight channels of ECC
communication(D1 ～ D12), The port nine to port twelve support one to
four channels of ECC communication(D1 ～ D3) .

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the two-fiber unidirectional MSP protection ring, four-fiber

scheme MSP protection ring, linear MSP protection ring, SNCP, SNCTP, and
SNCMP.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.6.3 Working Principle and Signal Flow

The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on. The external services are accessed by the external interface boards EU08
and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
Figure 5-13 shows the block diagram for the working principle of the SLT1.

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Figure 5-13 Block diagram for the working principle of the SLT1
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

155Mbit/s 155Mbit/s 155Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
155Mbit/s 155Mbit/s
O/E I

High speed bus

....

....
Cross-connect unit A

RST MST MSA HPT

High speed bus
155Mbit/s 155Mbit/s 155Mbit/s Cross-connect unit B
O/E S CDR
P
155Mbit/s I 155Mbit/s DCC
O/E SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.

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l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.6.4 Front Panel

On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-14 shows the appearance of the front panel of the SLT1.

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Figure 5-14 Front panel of the SLT1

SLT1
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6
OUT7 IN7
OUT8 IN8
OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12

SLT1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-24 lists the type
and usage of the optical interfaces.

Table 5-24 Optical interfaces of the SLT1

Interface Interface Usage

Type

IN1-IN12 LC Receives optical signals.

OUT1-OUT12 LC Transmits optical signals.

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WARNING
The optical interfaces of the SLT1 board are level optical interfaces. Thus, use the optical
attenuator only at the ODF side.

5.6.5 Valid Slots

The SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve optical
interfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN
1500B subrack, one to twelve optical interfaces can be configured.

5.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the SLT1.
You can use the T2000 to set the following parameters for the SLT1:
l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.6.7 Technical Specifications

The technical specifications of the SLT1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-25 lists the specifications of the optical interfaces of the SLT1.

Table 5-25 Specifications of the optical interfaces of the SLT1

Item Specification

Nominal bit rate 155.52 Mbit/s

Line code NRZ

Optical interface type S-1.1

Optical source type MLM

Working wavelength (nm) 1261–1360

Launched optical power (dBm) –15 to –8

Receiver sensitivity (dBm) –28

Overload optical power (dBm) –8

Min. extinction ratio (dB) 8.2

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Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLT1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.2

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SLT1 is 15 W.

5.7 SEP1
This section describes the SEP1 board, in terms of the version, function, working principle, front
panel, and specifications.

5.7.1 Version Description

The functional version of the SEP1 board is N1.
5.7.2 Function and Feature
The SEP1 board processes STM-1 electrical signals.
5.7.3 Working Principle and Signal Flow
The SEP1 board consists of the line interface module and CDR module, SDH overhead
processing module, RST and so on. The external services are accessed by the external interface
boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical
interface board.
5.7.4 Front Panel
On the front panel of the SEP1, there are indicators, interfaces and barcode.
5.7.5 Valid Slots
When the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, it
cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are
available on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When the
SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed
in any of slots 12–13.
5.7.6 TPS Protection for the Board
The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board.
5.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the SEP1.
5.7.8 Technical Specifications
The technical specifications of the SEP1 cover the board dimensions, weight and power
consumption.

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5.7.1 Version Description

The functional version of the SEP1 board is N1.
When interfaces are available on the front panel of the SEP1 (the logical board is displayed as
the SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1
is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (the
logical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electrical
signals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards for
the 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both the
SEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.

5.7.2 Function and Feature

The SEP1 board processes STM-1 electrical signals.
Table 5-26 lists the functions and features of the SEP1.

Table 5-26 Functions and features of the SEP1

Function and SEP1
Feature

Basic function Processes 2 x STM-1 signals when interfaces are available on the front
panel.
Processes 8 x STM-1 signals when used with the interface board.

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service Supports the processing of the VC-12, VC-3 and VC-4 services.
processing

Overhead Supports the processing of the SOH bytes of the STM-1 signals.
processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the TPS protection when used with the interface board and the
scheme switching board.
Supports the two-fiber unidirectional MSP protection ring, four-fiber
MSP protection ring, linear MSP protection, and SNCP.

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Function and SEP1

Feature

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

When the SEP1 is used with different interface boards and electrical interface switching boards,
the access capabilities for the STM-1 signals are different. See Table 5-27.

Table 5-27 Access capabilities for the SEP1

Interface Board SEP1

None Accesses and processes 2 x STM-1 electrical signals, and does not
support the TPS protection.

EU08 Accesses and processes 8 x STM-1 electrical signals.

OU08 Accesses and processes 8 x STM-1 optical signals.

EU08+OU08 The hybrid usage is not supported.

EU08+TSB8 Accesses and processes 8 x STM-1 electrical signals, and supports the
TPS protection for the SEP1 board.

CAUTION
When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.
The hybrid usage of the EU08 and OU08 is not supported.

5.7.3 Working Principle and Signal Flow

The SEP1 board consists of the line interface module and CDR module, SDH overhead
processing module, RST and so on. The external services are accessed by the external interface
boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical
interface board.
Figure 5-15 shows the block diagram for the working principle of the SEP1.

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Figure 5-15 Block diagram for the working principle of the SEP1

Reference clock
155 MHz PLL Cross-connect unit

SDH overhead processing module

K1 and K2 K1 and K2
insertion/extration Cross-connect unit

high speed
bus
Cross-connect
SPI
155 Mbit/s CMI NRZ 155 Mbit/s RST MST MSA HPT unit A
Transfo Encode/ CDR high speed
Port 1 155 Mbit/s Decode 155 Mbit/s
rmer bus
Cross-connect
unit B
155 Mbit/s CMI NRZ 155 Mbit/s
Encode/ CDR
Port 2 155 Mbit/s Transfor
mer Decode 155 Mbit/s
DCC
SCC unit

Frame header Cross-connect

LOS
Communication and unit
Communication
control module SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.8 V converter -48 V/ -60 V
DC/DC
converter Fuse
+3.3 V backup
power

Figure 5-16 shows the block diagram for the working principle of the SEP used with the EU08.

Figure 5-16 Block diagram for the working principle of the SEP used with the EU08

Reference clock
155 MHz PLL Cross-connect
unit
EU08
SPI
155 Mbit/s CMI 155 Mbit/s
Encode CDR SDH overhead processing
Transfo module
155 Mbit/s /
Port 1 rmer 155 Mbit/s
Decode K1 and K2 K1 and K2
insertion/extration Cross-connect
unit
155 Mbit/s 155 Mbit/s
Port 8 CMI Encode CDR
155 Mbit/s Transfo / 155 Mbit/s high speed
rmer Decode bus
Cross-connect unit
A
155 Mbit/s CMI 155 Mbit/s RST MST MSA HPT high speed
NRZ
Transfo Encode/ CDR bus
Cross-connect unit
Port 1 155 Mbit/s rmer Decode 155 Mbit/s
B

155 Mbit/s CMI 155 Mbit/s

NRZ
Port 2 CDR
155 Mbit/s Transfor Encode/ 155 Mbit/s
mer Decode DCC
SCC unit

Frame header
LOS Cross-connect unit
Communication and
control module Communication
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V

+1.8 V
converter -48 V/ -60 V
DC/DC
converter Fuse
+3.3 V backup
power

Figure 5-17 shows the block diagram for the working principle of the SEP used with the OU08.

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Figure 5-17 Block diagram for the working principle of the SEP used with the OU08

Reference clock
155 MHz PLL Cross-connect unit
OU08

155 Mbit/s O/E NRZ 155 Mbit/s

CDR SDH overhead processing module
Port 1 155 Mbit/s 155 Mbit/s
O/E K1 and K2 K1 and K2
S insertion/extration Cross-connect unit
P
I
Port 8 155 Mbit/s O/E NRZ 155 Mbit/s
CDR
155 Mbit/s 155 Mbit/s high speed
O/E bus
Cross-connect unit A

155 Mbit/s CMI

SPI NRZ 155 Mbit/s RST MST MSA HPT high speed
Port 1 Transfo CDR bus Cross-connect unit
Encode/
155 Mbit/s 155 Mbit/s B
rmer Decode
155 Mbit/s NRZ 155 Mbit/s
CMI CDR
Port 2 Encode/
155 Mbit/s Transfor 155 Mbit/s
mer Decode DCC
SCC unit

LOS Frame header

Communication and Cross-connect unit
LOS
Laser shut down control module Communication
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.8 V converter -48 V/ -60 V
DC/DC
converter Fuse
+3.3 V backup
power

The function modules are described below:

Line Interface Module and CDR Module

l In the receive direction, the received electrical signals (CMI code) are isolated through the
converter and then transmitted to the decoding unit. The CDR module then recovers the
data and clock signals after decoding.
l In the transmit direction, the SDH signals, which are processed by the overhead processing
unit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electrical
signals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA

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– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect unit.
l Controls the laser.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter Module

It provides the board with required DC voltages. It converts the –48 V/ –60 V power supply to
the following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.

5.7.4 Front Panel

On the front panel of the SEP1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-18 shows the appearance of the front panel of the SEP1.

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Figure 5-18 Front panel of the SEP1

SEP1

STAT
ACT
PROG
SRV
OUT1 IN1 OUT2 IN2

SEP1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SEP1. Table 5-28 lists the type
and usage of the optical interfaces.

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Table 5-28 Electrical interfaces of the SEP1

Interface Interface Type Usage

IN1-IN2 75-ohm SMB Receives the STM-1 signals.

OUT1-OUT2 75-ohm SMB Transmits the STM-1 signals.

Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case,
the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the two
interfaces on the front panel are invalid.

5.7.5 Valid Slots

When the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, it
cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are
available on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When the
SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed
in any of slots 12–13.

5.7.6 TPS Protection for the Board

The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board.
In this way, complex network-level protection, such as the MSP and SNCP, are not triggered,
but the reliability of the equipment can be ensured.
The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be used
with the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electrical
signals. The OptiX OSN 1500A does not support the SEP1 board.

Protection Principle
Figure 5-19 shows the principle of the TPS protection for the SEP1 board.

Figure 5-19 Principle of the TPS protection for the SEP1

8×STM-1(e)
Switch control
signal

TSB8 EU08

2 1 1 2

Cross-
connect
and timing
board

SLOT 9/10

Protection Working
SEP SEP
Fail

SLOT12 SLOT13

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l Normal state: When the working boards are running normally, the control switch of the
EU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board.
l Switching state: When a failure is detected on the working board, the working board housed
in each slot can be protected in the following ways.
– When the working board housed in slot 13 fails, the control switch of the corresponding
EU08 shifts from position 1 to position 2. At the same time, the control switch of the
TSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13
is protected by the protection board housed in slot 12.

Hardware Configuration
Figure 5-20 shows the slot configuration for the 1:1 TPS protection for the SEP1.

Figure 5-20 Slot configuration for the 1:1 TPS protection for the SEP1
Slot 14 TSB8
Slot 18 PIU
Slot 15

Slot 16 EU08
Slot 19 PIU
Slot 17
Slot 11 Slot 6
Slot 20 Slot 12 Protection Slot 7

FAN Slot 13 Working Slot 8

Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 5-20, the protection board housed in slot 12 protects the board housed in
slot 13.

Table 5-29 lists the slots for the SEP1, EU08 and TSB8.

Table 5-29 Slots for the SEP1, EU08 and TSB8

Board Protection Group

SEP1 (working board) Slot 12

TSB8 Slot 14

SEP1 (working board) Slot 13

EU08 Slot 16

5.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the SEP1.

You can use the T2000 to set the following parameters for the SEP1:

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l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.7.8 Technical Specifications

The technical specifications of the SEP1 cover the board dimensions, weight and power
consumption.

Table 5-30 Technical specifications of the SEP1 board

Item Specification

Nominal bit rate 155.520 Mbit/s

Line code Coded mark inversion (CMI), NRZ

Connector SMB

Mechanical Specifications
The mechanical specifications of the SEP1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SEP1 is 17 W.

5.8 SL4
This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.8.1 Version Description

The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is
housed in a divided slot in a subrack.
5.8.2 Function and Feature
The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead
bytes, and to perform the MSP protection.
5.8.3 Working Principle and Signal Flow
The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
5.8.4 Front Panel

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On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety
class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.
5.8.5 Valid Slots
The slots valid for the SL4 vary with the version of the board.
5.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4 indicates the optical interface type.
5.8.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL4.
5.8.8 Technical Specifications
The technical specifications of the SL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.8.1 Version Description

The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is
housed in a divided slot in a subrack.

Table 5-31 lists the details on the versions of the SL4 board.

Table 5-31 Version Description of the SL4

Item Description

Functional version The SL4 has three versions, R1, N1 and N2.

Difference The N2SL4 supports the TCM function and can be configured with
AU-3 services.
The N1 and R1SL4 do not support the TCM function and cannot be
configured with AU-3 services. The R1SL4 is housed in a divided
slot.

Replaceability The versions cannot be replaced by each other.

NOTE
The N2SL4 board supports the TCM function and AU-3 services, which are not supported by the N1SL4
or R1SL4 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL4 or
R1SL4 board as the protection board if the working board is N2SL4 configured with the TCM service .
Otherwise, the service may be interrupted due to the switching operation.

5.8.2 Function and Feature

The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead
bytes, and to perform the MSP protection.

The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.

Table 5-32 lists the functions and features of the SL4.

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Table 5-32 Functions and features of the SL4

Function and SL4
Feature

Basic function Receives and transmits 1 x STM-4 optical signals, and processes 1 x
STM-4 standard or concatenation services.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
interface types comply with ITU-T G.957 in features. The optical interface of the
Ve-4.2 type complies with the standards defined by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical module The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation
processing services.

Overhead Supports the processing of the SOH bytes of the STM-4 signals.
processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protection
ring, linear MSP, SNCP, SNCTP, and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.8.3 Working Principle and Signal Flow

The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
Figure 5-21 shows the block diagram for the working principle of the SL4.

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Figure 5-21 Block diagram for the working principle of the SL4
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

622Mbit/s 622Mbit/s 622Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
622Mbit/s I 622Mbit/s
O/E

High speed bus

....

....
Cross-connect unit A

RST MST MSA HPT

High speed bus
622Mbit/s 622Mbit/s 622Mbit/s Cross-connect unit B
O/E S CDR
P
622Mbit/s 622Mbit/s
O/E I DCC
SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.

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l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.8.4 Front Panel

On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety
class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-22 shows the appearance of the front panel of the N1SL4/N2SL4.

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Figure 5-22 Front panel of the N1SL4/N2SL4

SL4
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT

IN

SL4

Figure 5-23 shows the appearance of the front panel of the R1SL4.

Figure 5-23 Front panel of the R1SL4

SL4
STAT
ACT
PROG
SRV
OUT IN

SL4

Indicators
The following indicators are present on the front panel of the board:

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l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL4. Table 5-33 lists the type
and usage of the optical interfaces.

Table 5-33 Optical interfaces of the SL4

Interface Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.

The SL4 board can use the pluggable optical modules for easy maintenance.

5.8.5 Valid Slots

The slots valid for the SL4 vary with the version of the board.
The slots valid for the SL4 are as follows:
l The R1SL4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A
subrack.
l The N1SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SL4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B
subrack.
l The N1SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4 indicates the optical interface type.
Table 5-34 lists the relation between the board feature code and optical interface type for the
SL4.

Table 5-34 Relation between the board feature code and the optical interface type of the SL4
Board Feature Code Optical Interface Type

SSN1SL410, SSN2SL410 10 S-4.1

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Board Feature Code Optical Interface Type

SSN1SL411, SSN2SL411 11 L-4.1

SSN1SL412, SSN2SL412 12 L-4.2

SSN1SL413, SSN2SL413 13 Ve-4.2

SSN1SL414, SSN2SL414 14 I-4

5.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL4.

You can use the T2000 to set the following parameters for the SL4:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.8.8 Technical Specifications

The technical specifications of the SL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-35 lists the specifications of the optical interfaces of the SL4.

Table 5-35 Specifications of the optical interfaces of the SL4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source MLM MLM SLM SLM SLM

type

Working 1261–1360 1274–1356 1280–1335 1480–1580 1480–1580

wavelength (nm)

Launched optical –15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2

power (dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

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Item Specification

Overload optical –8 –8 –8 –8 –13

power (dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL4/N2SL4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

The mechanical specifications of the R1SL4 are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL4/N2SL4 is
15 W.
In the normal temperature (25℃), the maximum power consumption of the R1SL4 is 10 W.

5.9 SL4A
This section describes the SL4A, a 1 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

5.9.1 Version Description

The functional version of the SL4A board is N1.
5.9.2 Function and Feature
The SL4A board is used to receive and transmit 1 x STM-4 optical signals, to process the
overhead bytes, and to perform the MSP protection.
5.9.3 Working Principle and Signal Flow
The SL4A board consists of the O/E conversion module, data clock recovery unit, SDH overhead
processing module, logic control module and power supply module.
5.9.4 Front Panel
On the front panel of the SL4A board, there are indicators, interfaces, barcode and laser safety
class label.
5.9.5 Valid Slots

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The SL4A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The
SL4A board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4A indicates the optical interface type.
5.9.7 Board Configuration Reference
You can set parameters for the SL4A board on the T2000.
5.9.8 Technical Specifications
The technical specifications of the SL4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

5.9.1 Version Description

The functional version of the SL4A board is N1.

5.9.2 Function and Feature

The SL4A board is used to receive and transmit 1 x STM-4 optical signals, to process the
overhead bytes, and to perform the MSP protection.

The SL4A board is used to transmit and receive STM-4 optical signals, to perform O/E
conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.

Table 5-36 lists the functions and features of the SL4A board.

Table 5-36 Functions and features of the SL4A

Function and Description

Feature

Basic function Receives and transmits 1 x STM-4 optical signals, and processes 1 x
STM-4 standard or concatenation services.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
interface types comply with ITU-T G.957 Recommendations in features. The
optical interface of the Ve-4.2 type complies with the standards defined
by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical module The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports using and monitoring the SFP pluggable optical module.

Service Supports VC-12, VC-3, VC-4 services and VC4-4c concatenation

processing services.

Overhead Supports processing the SOH bytes of the STM-4 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0, J1 and C2 bytes.

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Function and Description

Feature

Alarm and Provides abundant alarms and performance events to easily manage and
performance maintain the equipment.
event

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protection
ring, linear MSP, sub-network connection protection (SNCP), sub-
network connection tunnel protection (SNCTP) and sub-network
connection multi-protection (SNCMP).
Supports the optical-path-shared MSP and SNCP protection.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports querying the manufacturing information of the board.
Supports loading the FPGA in-service.
Supports upgrading the board software without affecting services.

5.9.3 Working Principle and Signal Flow

The SL4A board consists of the O/E conversion module, data clock recovery unit, SDH overhead
processing module, logic control module and power supply module.

Figure 5-24 shows the block diagram for the working principle of the SL4A.

Figure 5-24 Block diagram for the working principle of the SL4A
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

622Mbit/s 622Mbit/s 622Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
622Mbit/s I 622Mbit/s
O/E

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
622Mbit/s 622Mbit/s 622Mbit/s Cross-connect unit B
O/E S CDR
P
622Mbit/s 622Mbit/s
O/E I DCC
SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

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In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical
signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH
overhead processing module. The overhead processing module detects the R_LOF and R_OOF
alarm signals.
The data clock recovery unit recovers the clock signals, and transmits the STM-4 electrical
signals along with the clock signals to the overhead processing module. The overhead processing
module detects the R_LOF and R_OOF alarm signals.
extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to
the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the cross-
connect units and then transmits the signals to the E/O conversion module.
The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical
signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l Logic Control Module
The logic control module traces the clock signals, which are received from the active or
standby cross-connect board, and the frame header signals. This module controls the laser
and passes through the orderwire and ECC bytes between the two optical interface boards
that form the ADM. This module also selects the clock frame headers from the active or
standby cross-connect board.
l Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.

5.9.4 Front Panel

On the front panel of the SL4A board, there are indicators, interfaces, barcode and laser safety
class label.

Appearance of the Front Panel

Figure 5-25 shows the appearance of the front panel of the SL4A board.

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Figure 5-25 Front panel of the SL4A board

SL4A
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT

IN

SL4A

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SL4A board, there is one pair of optical interfaces. Table 5-37 lists the
type and usage of the optical interfaces.

Table 5-37 Optical interfaces of the SL4A

Interface Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.

The SL4A board can use the pluggable optical modules for easy maintenance.

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5.9.5 Valid Slots

The SL4A board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The
SL4A board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4A indicates the optical interface type.
Table 5-38 lists the relation between the board feature code and optical interface type of the
SL4A.

Table 5-38 Relation between the board feature code and optical interface type of the SL4A
Board Feature Code Optical Interface Type

SSN1SL4A10 10 S-4.1

SSN1SL4A11 11 L-4.1

SSN1SL4A12 12 L-4.2

SSN1SL4A13 13 Ve-4.2

SSN1SL4A14 14 I-4

5.9.7 Board Configuration Reference

You can set parameters for the SL4A board on the T2000.
On the T2000, you can set the following parameters for the SL4A board.
l J0
l J1
l C2

For details of the parameters, see F Board Configuration Reference.

5.9.8 Technical Specifications

The technical specifications of the SL4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-39 lists the specifications of the optical interfaces of the SL4A board.

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Table 5-39 Specifications of the optical interfaces of the SL4A board

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source MLM MLM SLM SLM SLM

type

Working 1261-1360 1274-1356 1280-1335 1480-1580 1480-1580

wavelength (nm)

Launched optical –15-–8 –15-–8 –3-2 –3-2 –3-2

power (dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

Overload optical –8 –8 –8 –8 –13

power (dBm)

Minimum 8.2 8.2 10 10 10.5

extinction ratio
(dB)

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL4A board are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25℃), the maximum power consumption of the SL4A board
is 17 W.

5.10 SLD4
This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

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5.10.1 Version Description

The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
5.10.2 Function and Feature
The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.10.3 Working Principle and Signal Flow
The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module so on.
5.10.4 Front Panel
On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.
5.10.5 Valid Slots
The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
5.10.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4 indicates the optical interface type.
5.10.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLD4.
5.10.8 Technical Specifications
The technical specifications of the SLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.10.1 Version Description

The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
Table 5-40 lists the details on the versions of the SLD4 board.

Table 5-40 Version Description of the SLD4

Item Description

Functional version The SLD4 has three versions, R1, N1 and N2.

Difference The N2SLD4 supports the TCM function and can be configured with
AU-3 services.
The N1SLD4 and R1SLD4 do not support the TCM function and
cannot be configured with AU-3 services. The SLD4 board of the
R1SLD4 is housed in a divided slot.

Replaceability The versions cannot be replaced by each other.

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NOTE
The N2SLD4 board supports the TCM function and AU-3 services, which are not supported by the N1SLD4
or R1SLD4 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLD4
or R1SLD4 board as the protection board if the working board is N2SLD4 configured with the TCM
service .Otherwise, the service may be interrupted due to the switching operation.

5.10.2 Function and Feature

The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.

Table 5-41 lists the functions and features of the SLD4.

Table 5-41 Functions and features of the SLD4

Function and SLD4

Feature

Basic function Receives and transmits 2 x STM-4 optical signals, and processes 2 x
STM-4 standard or concatenation services.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
interface types comply with ITU-T G.957 in features. The optical interface of the
Ve-4.2 type complies with the standards defined by Huawei.

Specifications of Supports detection and query of the information on the optical module.
the optical module The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation
processing services.

Overhead Supports the processing of the SOH bytes of the STM-4 signals.
processing Supports the transparent transmission or termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to two channels of ECC communication.

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protection
ring, linear MSP, SNCP, SNCTP, and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

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5.10.3 Working Principle and Signal Flow

The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module so on.

Figure 5-26 shows the block diagram for the working principle of the SLD4.

Figure 5-26 Block diagram for the working principle of the SLD4

155 MHz Reference clock

155 MHz Cross-connect unit
PLL

622Mbit/s 622Mbit/s 622Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
622Mbit/s I 622Mbit/s
O/E

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
622Mbit/s 622Mbit/s 622Mbit/s Cross-connect unit B
O/E S CDR
P
622Mbit/s 622Mbit/s
O/E I DCC
SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

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SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

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5.10.4 Front Panel

On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-27 shows the appearance of the front panel of the N1SLD4/N2SLD4.

Figure 5-27 Front panel of the N1SLD4/N2SLD4

SLD4
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

SLD4

Figure 5-28 shows the appearance of the front panel of the R1SLD4.

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Figure 5-28 Front panel of the R1SLD4

SLD4
STAT
ACT
PROG
SRV

OUT IN
OUT IN

SLD4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SLD4. Table 5-42 lists the
type and usage of the optical interfaces.

Table 5-42 Optical interfaces of the SLD4

Interface Interface Type Usage

IN1-IN2 LC Receives optical signals.

OUT1-OUT2 LC Transmits optical signals.

The SLD4 board can use the pluggable optical modules for easy maintenance.

5.10.5 Valid Slots

The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
The slots valid for the SLD4 are as follows:

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l The R1SLD4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500A
subrack.
l The N1SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SLD4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B
subrack. For the board housed in any of slots 1–3 and 11–13, two optical interfaces can be
configured. For the board housed in any of slots 6–9, one optical interface can be configured.
l The N1SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4 indicates the optical interface type.

Table 5-43 lists the relation between the board feature code and optical interface type for the
SLD4.

Table 5-43 Relation between the board feature code and the optical interface type of the SLD4

Board Feature Code Optical Interface Type

SSN1SLD410, 10 S-4.1
SSN2SLD410

SSN1SLD411, 11 L-4.1
SSN2SLD411

SSN1SLD412, 12 L-4.2
SSN2SLD412

SSN1SLD413, 13 Ve-4.2
SSN2SLD413

SSN1SLD414, 14 I-4
SSN2SLD414

5.10.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLD4.

You can use the T2000 to set the following parameters for the SLD4:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

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5.10.8 Technical Specifications

The technical specifications of the SLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-44 lists the specifications of the optical interfaces of the SLD4.

Table 5-44 Specifications of the optical interfaces of the SLD4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

interface type

Optical source MLM MLM SLM SLM SLM

interface

Working 1261–1360 1274–1356 1280–1335 1480–1580 1480–1580

wavelength
(nm)

Launched –15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity
(dBm)

Overload –8 –8 –8 –8 –13
optical power
(dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLD4/N2SLD4 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

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The mechanical specifications of the R1SLD4 are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SLD4/N2SLD4
is 15 W.
In the normal temperature (25℃), the maximum power consumption of the R1SLD4 is 11 W.

5.11 SLD4A
This section describes the SLD4A, a 2 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

5.11.1 Version Description

The functional version of the SLD4A board is N1.
5.11.2 Function and Feature
The SLD4A board is used to transmit and receive STM-4 optical signals, to perform O/E
conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.
5.11.3 Working Principle and Signal Flow
The SLD4A board consists of the O/E conversion module, SDH overhead processing module,
logic control module and power supply module.
5.11.4 Front Panel
On the front panel of the SLD4A board, there are indicators, interfaces, barcode and laser safety
class label.
5.11.5 Valid Slots
The SLD4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL4A
board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.11.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4A indicates the optical interface type.
5.11.7 Board Configuration Reference
You can set parameters for the SLD4A board on the T2000.
5.11.8 Technical Specifications
The technical specifications of the SLD4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

5.11.1 Version Description

The functional version of the SLD4A board is N1.

5.11.2 Function and Feature

The SLD4A board is used to transmit and receive STM-4 optical signals, to perform O/E
conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.

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Table 5-45 lists the functions and features of the SLD4A board.

Table 5-45 Functions and features of the SLD4A board

Function and Description
Feature

Basic function Receives and transmits 2 x STM-4 optical signals, and processes 2 x
STM-4 standard or concatenation services.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
interface types comply with ITU-T G.957 Recommendations in features. The
optical interface of the Ve-4.2 type complies with the standards defined
by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical module The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports using and monitoring the SFP pluggable optical module.

Service Supports VC-12, VC-3, VC-4 services and VC4-4c concatenation

processing services.

Overhead Supports processing the SOH bytes of the STM-4 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports setting and querying the J0, J1 or C2 byte.
Supports one to two channels of ECC communication.

Alarm and Provides abundant alarms and performance events to easily manage and
performance event maintain the equipment.

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protection
ring, linear MSP, sub-network connection protection (SNCP), sub-
network connection tunnel protection (SNCTP) and sub-network
connection multi-protection (SNCMP).
Supports the optical-path-shared MSP and SNCP protection.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports querying the manufacturing information of the board.
Supports loading the FPGA in-service.
Supports upgrading the board software without affecting services.

5.11.3 Working Principle and Signal Flow

The SLD4A board consists of the O/E conversion module, SDH overhead processing module,
logic control module and power supply module.
Figure 5-29 shows the block diagram for the working principle of the SLD4A board.

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Figure 5-29 Block diagram for the working principle of the SL4A board
Slot 1 Slot 11 Slot 6

Slot 20 Slot 12 Slot 7

Slot 13 Slot 8
FAN Slot 4 CXL Slot 9 EOW
Slot 5 CXL Slot 10 AUX

In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical
signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH
overhead processing module. The overhead processing module detects the R_LOF and R_OOF
alarm signals.
extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to
the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the cross-
connect units and then transmits the signals to the E/O conversion module.
The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical
signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l Logic Control Module
The logic control module traces the clock signals, which are received from the active or
standby cross-connect board, and the frame header signals. This module controls the laser
and passes through the orderwire and ECC bytes between the two optical interface boards
that form the ADM. This module also selects the clock frame headers from the active or
standby cross-connect board.
l Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.

5.11.4 Front Panel

On the front panel of the SLD4A board, there are indicators, interfaces, barcode and laser safety
class label.

Appearance of the Front Panel

Figure 5-30 shows the appearance of the front panel of the SLD4A board.

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Figure 5-30 Front panel of the SLD4A board

SLD4A
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

SLD4A

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SLD4A board, there are two pairs of optical interfaces. Table 5-46
lists the type and usage of the optical interfaces.

Table 5-46 Optical interfaces of the SLD4A board

Interface Interface Type Usage

IN1–IN2 LC Receives optical signals.

OUT1–OUT2 LC Transmits optical signals.

The SLD4A board can use the pluggable optical modules for easy maintenance.

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5.11.5 Valid Slots

The SLD4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL4A
board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.11.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4A indicates the optical interface type.
Table 5-47 lists the relation between the board feature code and optical interface type of the
SLD4A.

Table 5-47 Relation between the board feature code and optical interface type of the SLD4A
Board Feature Code Optical Interface Type

SSN1SLD4A10 10 S-4.1

SSN1SLD4A11 11 L-4.1

SSN1SLD4A12 12 L-4.2

SSN1SLD4A13 13 Ve-4.2

SSN1SLD4A14 14 I-4

5.11.7 Board Configuration Reference

You can set parameters for the SLD4A board on the T2000.
On the T2000, you can set the following parameters for the SLD4A board.
l J0
l J1
l C2

For details of the parameters, see F Board Configuration Reference.

5.11.8 Technical Specifications

The technical specifications of the SLD4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-48 lists the specifications of the optical interfaces of the SLD4A board.

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Table 5-48 Specifications of the optical interfaces of the SLD4A board

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

interface type

Optical source MLM MLM SLM SLM SLM

interface

Working 1261-1360 1274-1356 1280-1335 1480-1580 1480-1580

wavelength
(nm)

Launched –15-–8 –15-–8 –3-2 –3-2 –3-2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity
(dBm)

Overload –8 –8 –8 –8 –13
optical power
(dBm)

Minimum 8.2 8.2 10 10 10.5

extinction ratio
(dB)

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLD4A board are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25℃), the maximum power consumption of the SLD4A is 17
W.

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5.12 SLQ4
This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.12.1 Version Description

The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in
the support for the TCM function.
5.12.2 Function and Feature
The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.12.3 Working Principle and Signal Flow
The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.12.4 Front Panel
On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class
label.
5.12.5 Valid Slots
The SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.12.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4 indicates the optical interface type.
5.12.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLQ4.
5.12.8 Technical Specifications
The technical specifications of the SLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.12.1 Version Description

The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in
the support for the TCM function.

Table 5-49 lists the details on the versions of the SLQ4 board.

Table 5-49 Version Description of the SLQ4

Item Description

Functional The SLQ4 has two versions, N1 and N2.

version

Difference The N2SLQ4 supports the TCM function and can be configured with
AU-3 services. The N1SLQ4 does not support the TCM function and
cannot be configured with AU-3 services.

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Item Description

Replaceability The versions cannot be replaced by each other.

NOTE
The N2SLQ4 board supports the TCM function and AU-3 services, which are not supported by the N1SLQ4
board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLQ4 board as the
protection board if the working board is N2SLQ4 configured with the TCM service or AU-3 services.
Otherwise, the service may be interrupted due to the switching operation.

5.12.2 Function and Feature

The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-50 lists the functions and features of the SLQ4.

Table 5-50 Functions and features of the SLQ4

Function and SLQ4
Feature

Basic function Transmits and receives 4 x STM-4 optical signals.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types
interface comply with ITU-T G.957 in features. The optical interface of the Ve-4.2
type complies with the standards defined by Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP .

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation
processing services.

Overhead Supports the processing of the SOH bytes of the STM-4 signals.
processing Supports the transparent transmission or termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to four channels of ECC communication.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the two-fiber MSP protection ring, four-fiber MSP protection
scheme ring, linear MSP, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

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Function and SLQ4

Feature

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.12.3 Working Principle and Signal Flow

The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.

Figure 5-31 shows the block diagram for the working principle of the SLQ4.

Figure 5-31 Block diagram for the working principle of the SLQ4

155 MHz Reference clock

155 MHz Cross-connect unit
PLL

622Mbit/s 622Mbit/s 622Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
622Mbit/s I 622Mbit/s
O/E

High speed bus

....

....

Cross-connect unit A

RST MST MSA HPT

High speed bus
622Mbit/s 622Mbit/s 622Mbit/s Cross-connect unit B
O/E S CDR
P
622Mbit/s 622Mbit/s
O/E I DCC
SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchy
RST: regenerator section MST: multiplex section termination MSA: multiplex section adaptation
termination
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-4 units are described below:

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O/E Conversion Module

l In the receive direction, the module converts the received optical signals into electrical
signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– MST provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.

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l Controls the laser.

l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.12.4 Front Panel

On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-32 shows the appearance of the front panel of the SLQ4.

Figure 5-32 Front panel of the SLQ4

SLQ4
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT
OUT1
IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.

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l Service activating state indicator (ACT), which is green when lit.

l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-51 lists the
type and usage of the optical interfaces.

Table 5-51 Optical interfaces of the SLQ4

Interface Interface Type Usage

IN1-IN4 LC Receives optical signals.

OUT1-OUT4 LC Transmits optical signals.

The SLQ4 board can use the pluggable optical modules for easy maintenance.

5.12.5 Valid Slots

The SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.12.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4 indicates the optical interface type.
Table 5-52 lists the relation between the board feature code and optical interface type for the
SLQ4.

Table 5-52 Relation between the board feature code and the optical interface type of the SLQ4
Board Feature Code Optical interface type

SSN1SLQ410, 10 S-4.1
SSN2SLQ410

SSN1SLQ411, 11 L-4.1
SSN2SLQ411

SSN1SLQ412, 12 L-4.2
SSN2SLQ412

SSN1SLQ413, 13 Ve-4.2
SSN2SLQ413

SSN1SLQ414, 14 I-4
SSN2SLQ414

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5.12.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ4.

You can use the T2000 to set the following parameters for the SLQ4:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.12.8 Technical Specifications

The technical specifications of the SLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-53 lists the specifications of the optical interfaces of the SLQ4.

Table 5-53 Specifications of the optical interfaces of the SLQ4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source MLM MLM SLM SLM SLM

type

Working 1261–1360 1274–1356 1280–1335 1480–1580 1480–1580

wavelength
(nm)

Launched –15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity
(dBm)

Overload optical –8 –8 –8 –8 –13

power (dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

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Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SLQ4 is 16 W.

5.13 SLQ4A
This section describes the SLQ4A, a 4 x STM-4 optical interface board, in terms of version,
function, principle, front panel and technical specifications.

5.13.1 Version Description

The functional version of the SLQ4A board is N1.
5.13.2 Function and Feature
The SLQ4A board is used to transmit and receive STM-4 optical signals, to perform O/E
conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.
5.13.3 Working Principle and Signal Flow
The SLQ4A board consists of the O/E conversion module, SDH overhead processing module,
logic control module and power supply module.
5.13.4 Front Panel
On the front panel of the SLQ4A board, there are indicators, interfaces, barcode and laser safety
class label.
5.13.5 Valid Slots
The SLQ4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4A
board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.13.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4A indicates the optical interface type.
5.13.7 Board Configuration Reference
You can set parameters for the SLQ4A board on the T2000.
5.13.8 Technical Specifications
The technical specifications of the SLQ4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

5.13.1 Version Description

The functional version of the SLQ4A board is N1.

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5.13.2 Function and Feature

The SLQ4A board is used to transmit and receive STM-4 optical signals, to perform O/E
conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-54 lists the functions and features of the SLQ4A board.

Table 5-54 Functions and features of the SLQ4A board

Function and Description
Feature

Basic function Transmits and receives 4 x STM-4 optical signals.

Specification of Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
the optical Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types
interface comply with ITU-T G.957 Recommendations in features. The optical
interface of the Ve-4.2 type complies with the standards defined by
Huawei.

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of
module the laser and the ALS function.
Supports using and monitoring the SFP pluggable optical module.

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation
processing services.

Overhead Supports processing the SOH bytes of the STM-4 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports setting and querying the J0, J1 or C2 byte.
Supports one to four channels of ECC communication.

Alarm and Provides abundant alarms and performance events to easily manage and
performance maintain the equipment.
event

Protection Supports the two-fiber MSP protection ring, four-fiber MSP protection
scheme ring, linear MSP, sub-network connection protection (SNCP), sub-
network connection tunnel protection (SNCTP) and sub-network
connection multi-protection (SNCMP).
Supports the optical-path-shared MSP and SNCP protection.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports querying the manufacturing information of the board.
Supports loading the FPGA in-service.
Supports upgrading the board software without affecting services.

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5.13.3 Working Principle and Signal Flow

The SLQ4A board consists of the O/E conversion module, SDH overhead processing module,
logic control module and power supply module.
Figure 5-33 shows the block diagram for the working principle of the SLQ4A board.

Figure 5-33 Block diagram for the working principle of the SLQ4A
155 MHz Reference clock
155 MHz Cross-connect unit
PLL

622Mbit/s 622Mbit/s 622Mbit/s

O/E S CDR K1 and K2
K1 and K2 insertion/extration Cross-connect unit
P
622Mbit/s I 622Mbit/s
O/E

High speed bus

....

....
Cross-connect unit A

RST MST MSA HPT

High speed bus
622Mbit/s 622Mbit/s 622Mbit/s Cross-connect unit B
O/E S CDR
P
622Mbit/s 622Mbit/s
O/E I DCC
SCC unit
SDH overhead processing module

IIC Frame header

LOS
Communication Cross-connect unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/ -60 V

DC/DC
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V
+3.3 V
backup power

In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical
signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH
overhead processing module. The overhead processing module detects the R_LOF and R_OOF
alarm signals.
extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to
the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the cross-
connect units and then transmits the signals to the E/O conversion module.
The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical
signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l Logic Control Module
The logic control module traces the clock signals, which are received from the active or
standby cross-connect board, and the frame header signals. This module controls the laser

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and passes through the orderwire and ECC bytes between the two optical interface boards
that form the ADM. This module also selects the clock frame headers from the active or
standby cross-connect board.
l Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.

5.13.4 Front Panel

On the front panel of the SLQ4A board, there are indicators, interfaces, barcode and laser safety
class label.

Appearance of the Front Panel

Figure 5-34 shows the appearance of the front panel of the SLQ4A board.

Figure 5-34 Front panel of the SLQ4A board

SLQ4A
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT
OUT1
IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4A

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
On the front panel of the SLQ4A board, there are four pairs of optical interfaces. Table 5-55
lists the type and usage of the optical interfaces.

Table 5-55 Optical interfaces of the SLQ4A board

Interface Interface Type Usage

IN1-IN4 LC Receives optical signals.

OUT1–OUT4 LC Transmits optical signals.

The SLQ4A board can use the pluggable optical modules for easy maintenance.

5.13.5 Valid Slots

The SLQ4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4A
board can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.13.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4A indicates the optical interface type.
Table 5-56 lists the relation between the board feature code and optical interface type of the
SLQ4A.

Table 5-56 Relation between the board feature code and optical interface type of the SLQ4A

Board Feature Code Optical interface type

SSN1SLQ4A10 10 S-4.1

SSN1SLQ4A11 11 L-4.1

SSN1SLQ4A12 12 L-4.2

SSN1SLQ4A13 13 Ve-4.2

SSN1SLQ4A14 14 I-4

5.13.7 Board Configuration Reference

You can set parameters for the SLQ4A board on the T2000.
On the T2000, you can set the following parameters for the SLQ4A board.
l J0
l J1
l C2

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For details of the parameters, see F Board Configuration Reference.

5.13.8 Technical Specifications

The technical specifications of the SLQ4A board cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-57 lists the specifications of the optical interfaces of the SLQ4A board.

Table 5-57 Specifications of the optical interfaces of the SLQ4A board

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source MLM MLM SLM SLM SLM

type

Working 1261-1360 1274-1356 1280-1335 1480-1580 1480-1580

wavelength
(nm)

Launched –15-–8 –15-–8 –3-2 –3-2 –3-2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity
(dBm)

Overload optical –8 –8 –8 –8 –13

power (dBm)

Minimum 8.2 8.2 10 10 10.5

extinction ratio
(dB)

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4A board are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25℃), the maximum power consumption of the SLQ4A board
is 17 W.

5.14 SL16
This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.14.1 Version Description

The SL16 board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function and AU-3 services.
5.14.2 Function and Feature
The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the
overhead.
5.14.3 Working Principle and Signal Flow
The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead
processing module, RST and so on.
5.14.4 Front Panel
On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.
5.14.5 Valid Slots
The SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and any
of slots 11–13 in the OptiX OSN 1500B subrack.
5.14.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16 indicates the optical interface type.
5.14.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL16.
5.14.8 Technical Specifications
The technical specifications of the SL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.14.1 Version Description

The SL16 board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function and AU-3 services.
Table 5-58 lists the details on the versions of the SL16 board.

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Table 5-58 Version Description of the SL16

Item Description

Functional The SL16 has three versions, N1, N2 and N3.

version

Difference The N1SL16 does not support the TCM function and AU-3 services.
The N2SL16 supports the TCM function, and it can be configured with
AU-3 services.
The TCM function and AU-3 services cannot be configured on the
N3SL16 at the same time.
The N3SL16 supports the board version replacement function.

Replaceability The N1SL16 and N2SL16 cannot be replaced by each other.

When the TCM function and AU-3 services are not required, the N3SL16
can fully replace the N2SL16 and N1SL16.
The N3SL16 supports the board version replacement function and can
replace the N1SL16. After the N1SL16 is replaced, the N3SL16 is
consistent with the N1SL16 in configuration and service status.

NOTE
The N3SL16 and N2SL16 board supports the TCM and AU3 services, which are not supported by the N1SL16
board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL16 board as the
protection board if the working board is N3SL16 or N2SL16 configured with the TCM or AU3 service.
Otherwise, the service may be interrupted due to the switching operation.

5.14.2 Function and Feature

The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the
overhead.
Table 5-59 lists the functions and features of the SL16.

Table 5-59 Functions and features of the SL16

Function and SL16
Feature

Basic function Transmits and receives 1 x STM-16 optical signals.

Specification of Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA),
the optical U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 type
interface complies with ITU-T G.957 and ITU-T G.692 in features. The optical
interfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA
and PA) comply with the standards defined by Huawei.
Supports the output of standard wavelengths that comply with ITU-T G.
692. The U-16.2Je optical interface can be directly connected to the
DWDM equipment.

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Function and SL16

Feature

Specification of Supports detection and query of the information on the optical module.
the optical The optical interface supports the function of setting the on/off state of the
module laser and the ALS function.

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and
processing VC4-16c concatenation services.
Supports AU-3 services.

Overhead Supports the processing of the SOH of the STM-16 signals.

processing Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events.

performance
event

Specifications N2SL16/N3SL16 Supports the setting and query of the REG working
of the REG mode.

Protection Supports the two-fiber MSP protection ring, four-fiber MSP protection
scheme ring, linear MSP protection, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.
Processes two sets of K bytes. One SL16 board supports a maximum of
two MSP protection rings.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

5.14.3 Working Principle and Signal Flow

The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead
processing module, RST and so on.
Figure 5-35 shows the block diagram for the working principle of the SL16.

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Figure 5-35 Block diagram for the working principle of the SL16
155 MHz 155 MHz Reference clock Cross-connect
PLL unit

K1 and K2
2.488 2.488 16 x 155 K1 and K2 insertion/extration Cross-connect
Gbit/s Gbit/s Mbit/s unit

O/E DEMUX
high speed bus Cross-connect
S unit A
P 2.488 16 x 155
2.488 I
Gbit/s Mbit/s
RST MST MSA HPT
Gbit/s high speed bus Cross-connect
O/E MUX unit B

DCC
SCC unit
SDH overhead processing module

IIC Frame header Cross-connect

LOS
Communication unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/-60 V

DC/DC
5V converter -48 V/-60 V
DC/DC
+1.8 V converter Fuse +3.3 V
+3.3 V backup power

O/E Conversion Module

l In the receive direction, it converts the received optical signals into electrical signals.
l In the transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

l RST
– In the receiving direction, RST performs frame alignment detection (A1, A2),
regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block
count.
– In the transmitting direction, RST performs frame alignment insertion, regenerator
section path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receiving direction, MST performs BIP-24 errored block count, MS_REI
recovery, MS_RDI and MS_AIS detection.

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– In the transmitting direction, MST performs calculation and insertion of BIP-24,

insertion of MS_REI MS_RDI and MS_AIS.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation,
and AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Tracing the clock signal from the active and the standby cross-connect units.
l Implements laser controlling function.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter Module

l This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides
protection for the board +3.3V power supply.

5.14.4 Front Panel

On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.

Appearance of the Front Panel

Figure 5-36 shows the appearance of the front panel of the SL16.

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Figure 5-36 Front panel of the SL16

SL16

STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

! APD
Receiver
MAX:-9dBm

OUT

IN

SL16

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16. Table 5-60 lists the type
and usage of the optical interfaces.

Table 5-60 Optical interfaces of the SL16

Interface Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.

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5.14.5 Valid Slots

The SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and any
of slots 11–13 in the OptiX OSN 1500B subrack.

5.14.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16 indicates the optical interface type.

Table 5-61 lists the relation between the board feature code and optical interface type for the
SL16.

Table 5-61 Relation between the board feature code and the optical interface type for the SL16

Board Feature Code Optical interface type

SSN1SL1601, SSN2SL1601 01 L-16.2

SSN1SL1602, 02 L-16.2Je
SSN2SL1602, SSN3SL1602

SSN1SL1603, 03 V-16.2Je
SSN2SL1603, SSN3SL1603

SSN1SL1604, 04 U-16.2
SSN2SL1604, SSN3SL1604

5.14.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL16.

You can use the T2000 to set the following parameters for the SL16:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.14.8 Technical Specifications

The technical specifications of the SL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-62 lists the specifications of the optical interfaces of the SL16.

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Table 5-62 Specifications of the optical interfaces of the SL16

Item Specification

Nominal 2488320 kbit/s

bit rate

Optical L-16.2 L-16.2Je V-16.2Je (BA) U-16.2Je (BA+PA)

Interface
Type

Optical SLM SLM SLM SLM

source type

Working 1500–1580 1530–1560 1530–1565 1550.12

wavelengt
h (nm)

Launched –2 to +3 5 to 7 –2 to +3 13 to 15 –2 to +3 15 to 18
optical (without (with BA) (without (with BA)
power BA) BA and
(dBm) PA)

Receiver –28 –28 –28 –28 –32 (with

sensitivity (without PA)
(dBm) PA and
BA)

Overload –9 –9 –9 –9 –10 (with

optical (without PA)
power PA and
(dBm) BA)

Min. 8.2 8.2 8.2 8.2

extinction
ratio (dB)

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the
L-16.2Je type.
The launched optical power of the optical interface of the V-16.2Je type is measured when
the booster amplifer (BA) is added. The launched optical power of the optical interfaces of
the V-16.2Je and U-16.2Je types ranges from –2 dBm to –3 dBm when no BA is added.

Table 5-63 Specifications of the ITU-T G.692-compliant optical interfaces that output standard
wavelengths

Item Specification

Nominal bit rate 2488320 kbit/s

Dispersion limit (km) 170 640

Mean launched optical power (dBm) –2 to +3 –5 to –1

Receiver sensitivity (dBm) –28 –28

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Item Specification

Min. overload (dBm) –9 –9

Max. allowed dispersion (ps/nm) 3400 10880

Min. extinction ratio (dB) 8.2 10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL16 is 20 W.

In the normal temperature (25℃), the maximum power consumption of the N2SL16 is 20 W.

In the normal temperature (25℃), the maximum power consumption of the N3SL16 is 22 W.

5.15 SL16A
This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.

5.15.1 Version Description

The SL16A board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function.
5.15.2 Function and Feature
The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the
overhead bytes, and to perform the MSP protection.
5.15.3 Working Principle and Signal Flow
The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH
overhead processing module, RST and so on.
5.15.4 Front Panel
On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.
5.15.5 Valid Slots
The SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

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5.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16A indicates the optical interface type.
5.15.7 Board Configuration Reference
You can use the T2000 to set the J0 parameter for the SL16A.
5.15.8 Technical Specifications
The technical specifications of the SL16A cover the optical interface specifications, board
dimensions, weight and power consumption.

5.15.1 Version Description

The SL16A board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function.
Table 5-64 lists the details on the versions of the SL16A board.

Table 5-64 Version Description of the SL16A

Item Description

Functional version The SL16A has three versions, N1, N2 and N3.

Difference The N1SL16A does not support the TCM function and AU-3 services.
The N2SL16A supports the TCM function, and it can be configured
with AU-3 services.
The TCM function and AU-3 services cannot be configured on the
N3SL16A at the same time.

Replaceability The N1SL16A and N2SL16A cannot be replaced by each other.

The N3SL16A supports the board version replacement function and
can replace the N3SL16A and N1SL16A. After the N3SL16A and
N1SL16A are replaced, the N3SL16A and N1SL16A are consistent
with the N1SL16A in configuration and service status.

NOTE
The N3SL16A and N2SL16A board supports the TCM and AU3 services, which are not supported by the
N1SL16A board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL16A
board as the protection board if the working board is N3SL16A or N2SL16A configured with the TCM or
AU3 service. Otherwise, the service may be interrupted due to the switching operation.

5.15.2 Function and Feature

The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the
overhead bytes, and to perform the MSP protection.
Table 5-65 lists the functions and features of the SL16A.

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Table 5-65 Functions and features of the SL16A

Function and SL16A
Feature

Basic function Transmit and receive 1 x STM-16 optical signals.

Specification of the Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2
optical interface types. The optical interfaces comply with ITU-T G.957 and ITU-T
G.692 in features.

Specification of the Supports detection and query of the information on the optical
optical module module.
The optical interface supports the function of setting the on/off state
of the laser and the ALS function.
Supports the usage and monitoring of the SFP pluggable optical
module.

Service processing Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c,
and VC4-16c concatenation services.

Overhead processing Supports the processing of the SOH bytes of the STM-16 signals.
Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0 bytes.

Alarm and Provides rich alarms and performance events.

performance event

Specifications of the The N2SL16A and N3SL16A support the setting and query of the
REG REG working mode.

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP
protection ring, linear MSP protection, SNCP, SNCTP and SNCMP.
Processes two sets of the K bytes.Supports the optical-path-shared
MSP and SNCP protection.

Maintenance feature Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of
the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting
services.
Supports AU-3 services.

5.15.3 Working Principle and Signal Flow

The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH
overhead processing module, RST and so on.
Figure 5-37 shows the block diagram for the working principle of the N1SL16A and N2SL16A.

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Figure 5-37 Block diagram for the working principle of the N1SL16A and N2SL16A
155 MHz 155 MHz Reference clock Cross-connect
PLL unit

K1 and K2
2.488 2.488 16 x 155 Cross-connect
Gbit/s Gbit/s Mbit/s K1 and K2 insertion/extration unit

O/E DEMUX
high speed bus Cross-connect
S unit A
P 2.488 16 x 155
2.488 I
Gbit/s Mbit/s
RST MST MSA HPT
Gbit/s high speed bus Cross-connect
O/E MUX unit B

DCC
SCC unit
SDH overhead processing module

IIC Frame header Cross-connect

LOS
Communication unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/-60 V

DC/DC
5V converter -48 V/-60 V
DC/DC
+1.8 V converter Fuse +3.3 V
+3.3 V backup power

Figure 5-38 shows the block diagram for the working principle of the N3SL16A.

Figure 5-38 Block diagram for the working principle of the N3SL16A
155 MHz 155 MHz Reference clock Cross-connect
PLL unit

K1 and K2
2.488 2.488 16 x 155 Cross-connect
Gbit/s Gbit/s Mbit/s K1 and K2 insertion/extration unit

O/E DEMUX
high speed bus Cross-connect
S unit A
P 2.488 16 x 155
2.488 I
Gbit/s Mbit/s
RST MST MSA HPT
Gbit/s high speed bus Cross-connect
O/E MUX unit B

DCC
SCC unit
SDH overhead processing module

IIC Frame header Cross-connect

LOS
Communication unit
and control Communication
Laser shut down SCC unit
module

+3.3 V Fuse -48 V/-60 V

DC/DC
5V converter -48 V/-60 V
DC/DC
+1.8 V converter Fuse +3.3 V
+3.3 V backup power

O/E Conversion Module

l In the receive direction, it converts the received optical signals into electrical signals.
l In the transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

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l The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

l RST
– In the receiving direction, RST performs frame alignment detection (A1, A2),
regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block
count.
– In the transmitting direction, RST performs frame alignment insertion, regenerator
section path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receiving direction, MST performs BIP-24 errored block count, MS_REI
recovery, MS_RDI and MS_AIS detection.
– In the transmitting direction, MST performs calculation and insertion of BIP-24,
insertion of MS_REI MS_RDI and MS_AIS.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.
– In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation,
and AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Tracing the clock signal from the active and the standby cross-connect units.
l Implements laser controlling function.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.

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l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter Module

l This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides
protection for the board +3.3V power supply.

5.15.4 Front Panel

On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.

Appearance of the Front Panel

Figure 5-39 shows the appearance of the front panel of the SL16A.

Figure 5-39 Front panel of the SL16A

SL16A

STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

! APD
Receiver
MAX:-9dBm

OUT

IN

SL16A

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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16A. Table 5-66 lists the type
and usage of the optical interfaces.

Table 5-66 Optical interfaces of the SL16A

Interface Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.

5.15.5 Valid Slots

The SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16A indicates the optical interface type.
Table 5-67 lists the relation between the board feature code and optical interface type for the
SL16A.

Table 5-67 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type

SSN1SL16A01, 01 I-16
SSN2SL16A01,
SSN3SL16A01

SSN1SL16A02, 02 S-16.1
SSN2SL16A02,
SSN3SL16A02

SSN1SL16A03, 03 L-16.1
SSN2SL16A03,
SSN3SL16A03

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Board Feature Code Optical Interface Type

SSN1SL16A04, 04 L-16.2
SSN2SL16A04,
SSN3SL16A04

5.15.7 Board Configuration Reference

You can use the T2000 to set the J0 parameter for the SL16A.

For details on the parameter, refer to F Board Configuration Reference.

5.15.8 Technical Specifications

The technical specifications of the SL16A cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-68 lists the specifications of the optical interfaces of the SL16A.

Table 5-68 Specifications of the optical interfaces of the SL16A

Item Specification

Nominal 2488320 kbit/s

bit rate

Optical I-16 S-16.1 L-16.1 L-16.2

Interface
Type

Optical MLM SLM SLM SLM

source type

Working 1266–1360 1260–1360 1280–1335 1500–1580

wavelength
(nm)

Launched –10 to –3 –5 to 0 –2 to +3 –2 to +3
optical
power
(dBm)

Receiver –18 –18 –27 –28

sensitivity
(dBm)

Overload –3 0 –9 –9
optical
power
(dBm)

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Item Specification

Min. 8.2 8.2 8.2 8.2

extinction
ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):
– N1SL16A and N2SL16A:1.1
– N3SL16A:0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL16A and
N2SL16A are 20 W.
In the normal temperature (25℃), the maximum power consumption of the N3SL16A is 17 W.

5.16 SF16
This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC
function, in terms of the version, function, working principle, front panel and specifications.

5.16.1 Version Description

The functional version of the SF16 board is N1.
5.16.2 Function and Feature
The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical
signals and to process the overhead.
5.16.3 Working Principle and Signal Flow
The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH
overhead processing module and so on.
5.16.4 Front Panel
On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class
label.
5.16.5 Valid Slots
The SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.16.6 Board Configuration Reference

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You can use the T2000 to set parameters for the SF16.
5.16.7 Technical Specifications
The technical specifications of the SF16 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.16.1 Version Description

The functional version of the SF16 board is N1.

5.16.2 Function and Feature

The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical
signals and to process the overhead.

Table 5-69 lists the functions and features of the SF16.

Table 5-69 Functions and features of the SF16

Function and SF16

Feature

Basic function Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals.
Supports the enabling or disabling of the FEC function.

Specification Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types.
of the optical The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types
interface comply with the standards defined by Huawei.
The optical interface supports the output of standard wavelengths that
comply with ITU-T G.692 and can be directly connected to the DWDM
equipment.

Specification Supports detection and query of the information on the optical module.
of the optical The optical interface supports the function of setting the on/off state of the
module laser and the ALS function.

Service Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and
processing VC4-16c concatenation services.
The SF16 board encapsulates and encodes signals with the FEC function,
and processes overhead bytes, which comply with ITU-T G.709.

Overhead Supports the processing of the OTU, ODU, and OPU overhead bytes,
processing performance monitoring, and alarm detection, which comply with ITU-T
G.709.
Supports the processing of the SOH of the STM-16 signals.
Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events.

performance Supports alarms and performance events related to the OTU, ODU, and
event OPU layers and the FEC function.

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Function and SF16

Feature

Specification Not supports.

of the REG

Protection Supports the two-fiber MSP protection ring, four-fiber MSP protection
scheme ring, linear MSP protection, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.
Processes two sets of K bytes. One SF16 board supports a maximum of two
MSP protection rings.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.16.3 Working Principle and Signal Flow

The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH
overhead processing module and so on.
Figure 5-40 shows the block diagram for the working principle of the SF16.

Figure 5-40 Block diagram for the working principle of the SF16
155 MHz Reference clock
155 MHz PLL 155 MHz PLL Cross-connect unit

K1 and K2 insertion/extration K1 and K2

2.666 2.666 16x166 16x155 Cross-connect unit
Gbit/s Gbit/s Mbit/s Mbit/s
O/E DEMUX

S high speed bus

Cross-connect unit
P FEC
2.666
I 2.666 16x166 16x155 RST MST MSA HPT
Gbit/s Gbit/s Mbit/s Mbit/s high speed bus
Cross-connect unit
O/E MUX
DCC
SCC unit
SDH overhead processing module

166 MHz PLL Frame header

IIC Communication Cross-connect unit
LOS and control Communication
Laser shut down module SCC unit

+3.3 V DC/DC Fuse -48 V/-60 V

5V converter -48 V/-60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup power

The function modules are described below:

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O/E Conversion Module

l In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals
into electrical signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.

MUX/DEMUX Module
l In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.
l In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the FEC module into high rate electrical signals.

FEC Module
l In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing chip. After frame search,
FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signals
are converted to 2.666 Gbit/s signals and then transmitted to the MUX module.
l In the upstream direction, signals take the reverse process. The FEC encoding and decoding
module receives the 2.666 Gbit/s signals from the DEMUX module. After frame search,
FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488
Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. The
frame format of the 2.666 Gbit/s signals complies with ITU G.709.
l The FEC processing module connects to the communication and control unit through a
CPU bus. The CPU controls working modes of the FEC module by configuring the internal
register. The working mode can be regenerator mode, that is, REG mode. The CPU can
monitor the performance through the internal register.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.

l RST
– In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0), mismatch detection, BIP-8 errored block count.
– In the transmit direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
l MST
– In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

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– In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring)
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect unit.
l Controls the laser.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V power
supply.

5.16.4 Front Panel

On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-41 shows the appearance of the front panel of the SF16.

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Figure 5-41 Front panel of the SF16

SF 16

STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF16

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SF16. Table 5-70 lists the type
and usage of the optical interfaces.

NOTE

The SF16 uses the unpluggable optical module.

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Table 5-70 Optical interfaces of the SF16

Interface Interface Usage

Type

IN LC Receives optical signals.

OUT LC Transmits optical signals.

5.16.5 Valid Slots

The SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.16.6 Board Configuration Reference

You can use the T2000 to set parameters for the SF16.

You can use the T2000 to set the following parameters for the SF16:

l J0
l J1
l C2

For details on the parameters, refer to F Board Configuration Reference.

5.16.7 Technical Specifications

The technical specifications of the SF16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-71 lists the specifications of the optical interfaces of the SF16.

Table 5-71 Specifications of the optical interfaces of the SF16

Item Specification

Nominal bit rate 2666057.143 kbit/s

Service processing 1 x STM-16 standard services or concatenation services

capability

Line code NRZ

Optical Interface Ve-16.2c Ve-16.2d Ve-16.2f

Typea
FEC+BA(14) FEC+BA(17) FEC+BA(17)+RA+PA
+PA +PA

Optical source type SLM SLM SLM

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Item Specification

Wavelength (nm) 1550.12

Launched optical –5 to –1 –5 to –1 –5 to –1
power (dBm)b

Launched optical 13–15 13–15 15–18

power (dBm)c

Receiver sensitivity –27.5 –27.5 –27.5

(dBm)b

Receiver sensitivity –37 –37 –42

(dBm)d

Overload optical –10 –10 –10

power (dBm)d

Min. extinction ratio 10 10 10

(dB)b

a: The numbers in the brackets indicate the specifications. For example, BA (14) indicates
that the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that the
optical interface is used with the FEC, PA, Raman amplifier and BA.
b: The specifications are for the optical module itself rather than for the amplifier.
c: The specifications are for the BA.
d: The specifications are for the PA.

Table 5-72 Specifications of the ITU-T G.692-compliant optical interfaces that output standard
wavelengths
Item Specification

Nominal bit rate 2666057.143 kbit/s

Dispersion limit (km) 640

Mean launched optical power (dBm) –5 to –1

Receiver sensitivity (dBm) –28

Min. overload (dBm) –9

Max. allowed dispersion (ps/nm) 10880

Min. extinction ratio (dB) 8.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
The mechanical specifications of the SF16 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SF16 is 26 W.

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6 PDH Processing Boards

About This Chapter

This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDN
signals.

6.1 PL1
This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.2 PD1
This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.3 PQ1
This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.4 PQM
This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.5 PL3
This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.6 PL3A
This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.7 PD3
This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.8 PQ3
This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.9 DX1

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This section describes the DX1, a DDN interface convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
6.10 DXA
This section describes the DXA, a DDN convergence board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.11 SPQ4
This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,
function, working principle, front panel and specifications.

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6.1 PL1
This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.1.1 Version Description
The functional version of the PL1 is R1.
6.1.2 Function and Feature
The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to
report alarms and performance events and to provide the maintenance features.
6.1.3 Working Principle and Signal Flow
The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
6.1.4 Front Panel
On the front panel of the PL1, there are indicators and interfaces.
6.1.5 Valid Slots
The PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN
1500B subrack.
6.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PL1 indicates the interface impedance type.
6.1.7 Board Configuration Reference
You can use the T2000 to set parameters for the PL1.
6.1.8 Technical Specifications
The technical specifications of the PL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

6.1.1 Version Description

The functional version of the PL1 is R1.

6.1.2 Function and Feature

The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to
report alarms and performance events and to provide the maintenance features.

Table 6-1 lists the functions and features of the PL1.

Table 6-1 Functions and features of the PL1

Function and PL1

Feature

Basic function Processes 16 x E1 signals (interfaces available on the front panel).

Service processing Directly accesses and processes 16 x E1 electrical signals.

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Function and PL1

Feature

Overhead processing Supports the transparent transmission and termination of POH bytes
at the VC-12 level, such as the J2 byte.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Maintenance feature Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of
the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting
services.
Supports the PRBS function.

6.1.3 Working Principle and Signal Flow

The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.

Figure 6-1 shows the block diagram for the functions of the PL1.

Figure 6-1 Block diagram for the functions of the PL1

1.5 MHz/ Reference clock

155 MHz Cross-connect unit
2 MHz
PLL
OSC

E1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit

LIU
E1 Interface
A
P
P mapping/ coversion
I demapping module
E1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit
LIU
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+2.5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

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Figure 6-2 shows the block diagram of the E1 mapping/demapping.

Figure 6-2 Block diagram of the E1 mapping/demapping

E1 mapping/demapping

E1
STM-1
LPA LPT HPA HPT

LPOH(V5/J2/N2/
K4)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(V5/J2/N2/
K4)
Extraction

E1 STM-1
LPA LPT HPA HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:

l Encodes and decodes signals.

l Recovers data and clock.
l Processes the PDH LOS signals.

E1 mapping/demapping
l LPA
l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to
be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-
AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT

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l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interface
the “E1 mapping/demapping” block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

6.1.4 Front Panel

On the front panel of the PL1, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-3 shows the appearance of the front panel of the PL1.

Figure 6-3 Front panel of the PL1

PL1
STAT
ACT
PROG
SRV
1-16

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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usage
of the interfaces.

Table 6-2 Interfaces on the front panel of the PL1

Interface Interface Usage
Type

1–8 2mmHM Receives the first eight channels (1–8) of E1 signals.

9–16 2mmHM Receives the last eight channels (9–16) of E1 signals.

6.1.5 Valid Slots

The PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN
1500B subrack.

6.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PL1 indicates the interface impedance type.
Table 6-3 lists the relation between the board feature code and interface impedance type for the
PL1.

Table 6-3 Relation between the board feature code and the optical interface type of the PL1
Board Feature Code Interface Impedance Type

SSR1PL1A01 A01 75 ohms

SSR1PL1B01 B01 120 ohms

6.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL1.
You can use the T2000 to set the following parameters for the PL1:

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l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.1.8 Technical Specifications

The technical specifications of the PL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-4 lists the specifications of the optical interfaces of the PL1.

Table 6-4 Specifications of the electrical interfaces of the PL1

Interface Code Output Allowed Allowed Input

Type Signal Bit Input Input Jitter
Rate Frequency Attenuatio Tolerance
Deviation n

2048 kbit/s HDB3 Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PL1 is 7 W.

6.2 PD1
This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.

6.2.1 Version Description

The PD1 has two versions, R1 and R2. The two versions have different functions.
6.2.2 Function and Feature
The PD1 is used to process E1 signals and the overhead, to report alarms and performance events,
and to provide the maintenance features and TPS protection.
6.2.3 Working Principle and Signal Flow

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The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,

communication and control module and so on.
6.2.4 Front Panel
On the front panel of the PD1, there are indicators.
6.2.5 Valid Slots
The PD1 must be used with the L75S or L12S.
6.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PD1 indicates the interface impedance type.
6.2.7 TPS Protection for the Board
The PD1 supports the 1:N TPS protection.
6.2.8 Board Configuration Reference
You can use the T2000 to set parameters for the PD1.
6.2.9 Technical Specifications
The technical specifications of the PD1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.2.1 Version Description

The PD1 has two versions, R1 and R2. The two versions have different functions.
Table 6-5 lists the details on the versions of the PD1 board.

Table 6-5 Version Description of the PD1

Item Description

Functional The PD1 has two versions, R1 and R2.

version

Difference The R2PD1 supports the E13 function and the board version replacement
function.

Replaceability The R1PD1A can be replaced by the R2PD1A.

The R1PD1B can be replaced by the R2PD1B.

6.2.2 Function and Feature

The PD1 is used to process E1 signals and the overhead, to report alarms and performance events,
and to provide the maintenance features and TPS protection.
Table 6-6 lists the functions and features of the PD1.

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Table 6-6 Functions and features of the PD1

Function PD1
and
Feature R1PD1 R2PD1

Basic Processes 32 x E1 Processes 32 x E1 signals.

function signals.

Service Accesses and Accesses and processes 32 x E1 electrical signals when

processing processes 32 x E1 used with the interface board.
electrical signals Supports the E13 function, which is used to converge
when used with the E1 services into E3 services.
interface board.

Overhead Supports the transparent transmission and termination of the POH bytes at the
processing VC-12 level, such as the J2 byte.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Maintenanc Supports inloop and outloop for the electrical interfaces.

e feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection Supports the TPS protection when used with the electrical interface switching
scheme board.

6.2.3 Working Principle and Signal Flow

The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-4 shows the block diagram for the functions of the PD1.

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Figure 6-4 Block diagram for the functions of the PD1

1.5 MHz/ Reference clock

155 MHz Cross-connect unit
2 MHz
PLL
OSC

E1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit

LIU
E1 Interface
A
P
P mapping/ coversion
I demapping module
E1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit
LIU
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+2.5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

Figure 6-5 shows the block diagram of the E1mapping/ demapping.

Figure 6-5 Block diagram of the E1 mapping/ demapping

E1 mapping/demapping

E1
STM-1
LPA LPT HPA HPT

LPOH(V5/J2/N2/
K4)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(V5/J2/N2/
K4)
Extraction

E1 STM-1
LPA LPT HPA HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:

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l Encodes and decodes signals.

l Recovers data and clock.
l Processes the PDH LOS signals.

E1 mapping/demapping
l LPA
l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to
be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-
AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interface
the “E1 mapping/demapping” block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

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6.2.4 Front Panel

On the front panel of the PD1, there are indicators.

Appearance of the Front Panel

Figure 6-6 shows the appearance of the front panel of the PD1.

Figure 6-6 Front panel of the PD1

PD1
STAT
ACT
PROG
SRV

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PD1.

In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75-
ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S.

In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75-
ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.

6.2.5 Valid Slots

The PD1 must be used with the L75S or L12S.

In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12.
Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S.

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Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX
OSN 1500A subrack

Valid Slot for the PD1 Corresponding Slot for the L75S and L12S

Slot 12 Slot 7 (1–16 channels services)

Slot 6 (17–32 channels services)

NOTE

Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the board
housed in slot 12.

In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 1–3, 6–8 and 11–13.
Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S.

Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX
OSN 1500B subrack

Valid Slot for the PD1 Corresponding Slot for the D75S and
D12S

Slot 2 Slot 14

Slot 3 Slot 16

Slots 7 and 12 Slot 15

Slots 8 and 13 Slot 17

NOTE

l Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots
7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the same
time.
l Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots
8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the same
time.
l Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boards
housed in slots 2 and 3.
l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.
l Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boards
housed in slots 7 and 8.

6.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PD1 indicates the interface impedance type.

Table 6-9 lists the relation between the board feature code and interface impedance type for the
PD1.

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Table 6-9 Relation between the board feature code and the interface impedance type
Board Feature Code Interface Impedance
Type

SSR1PD1A01, A01 75 ohms

SSR2PD1A01

SSR1PD1B01, B01 120 ohms

SSR2PD1B01

6.2.7 TPS Protection for the Board

The PD1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1
TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1.

Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack

S S
L L
O O
E1protection bus
T T
6 7
L75S
L75S

E1
service
S S bus
L L
O O
T T
2 12

Fail
Protection

Working

PD1 PD1
Detect
TPS
board fault
switching
Cross-connect and timing control bus
board

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N
(1≤2) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.

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Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack

E1 protection bus

D75S

D75S
E1
service bus

Fail

Protection Working Working

PD1 PD1 PD1

Detect
board fault TPS switching
control bus
Cross-connect and
timing board

When detecting a failure in the working PD1 board, the cross-connect board issues a command
to switch the services from the faulty PD1 to the protection PD1. In this way, services are
protected.

Hardware Configuration
In the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realize
the 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection for
the PD1.

Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A
subrack
Slot 1 Slot 11 Slot 6 L75S(17~32)

Slot 20 PD1(P) Slot 2 Slot 12 PD1(W) Slot 7 L75S(1~16)

Slot 3 Slot 13 Slot 8
FAN Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiX
OSN 1500B subrack.

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Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B
subrack

Board Protection Group Before Protection Group After the Slot

the Slot Division Division

PD1 Slot 6 Slot 1 Slot 11 Slot 6

(protection)

PD1 Slots 7 and 8 Slots 2 and Slots 12 and Slots 7 and

(working) 3 13 8

D75S/D12S Slots 15 and 17 Slots 14 and Slots 15 and Slots 15

16 17 and 17

The two protection groups that contain slots 6 and 11 share the protection bus and thus cannot
coexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protection
for E1 services. After the slots are divided, when Q2CXL and Q3CXL are uesd, the OptiX OSN
1500B supports a maximum of two TPS protection groups for E1 services. when R1CXL is
uesd, the OptiX OSN 1500B supports a maximum of one TPS protection group for E1 services.

6.2.8 Board Configuration Reference

You can use the T2000 to set parameters for the PD1.

You can use the T2000 to set the following parameters for the PD1:

l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.2.9 Technical Specifications

The technical specifications of the PD1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. For
specifications of the electrical interfaces, see the sections that describe these boards.

Mechanical Specifications
The mechanical specifications of the PD1 are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg)
– 0.5 (R1PD1)

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– 0.56 (R2PD1)

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the R1PD1 is 15 W.
In the normal temperature (25℃), the maximum power consumption of the R2PD1 is 10.4 W.

6.3 PQ1
This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.3.1 Version Description

The PQ1 has two versions, R1 and R2. The two versions have different functions.
6.3.2 Function and Feature
The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
6.3.3 Working Principle and Signal Flow
The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so
on.
6.3.4 Front Panel
On the front panel of the PQ1, there are indicators.
6.3.5 Valid Slots
The PQ1 must be used with the D75S, D12S or D12B.
6.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PQ1 indicates the interface impedance type.
6.3.7 TPS Protection for the Board
The PQ1 supports the 1:N TPS protection.
6.3.8 Board Configuration Reference
You can use the T2000 to set parameters for the PQ1.
6.3.9 Technical Specifications
The technical specifications of the PQ1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.3.1 Version Description

The PQ1 has two versions, R1 and R2. The two versions have different functions.
Table 6-11 lists the details on the versions of the PQ1 board.

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Table 6-11 Version Description of the PQ1

Item Description

Functional The PQ1 has two versions, N1 and N2.

version

Difference The N2PQ1 supports the E13 function and the board version replacement
function.
The N2PQ1 does not perform the tributary timing function.

Replaceability When the tributary timing function is not required, the N1PQ1A can be
replaced by the N2PQ1A.
When the tributary timing function is not required, the N1PQ1B can be
replaced by the N2PQ1B.

NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100
ohms/120 ohms) are called PQ1 hereinafter.

6.3.2 Function and Feature

The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
Table 6-12 lists the functions and features of the PQ1.

Table 6-12 Functions and features of the PQ1

Function PQ1
and
Feature N1PQ1 N2PQ1

Basic Processes 63 x E1 Processes 63 x E1 signals.

function signals.

Service Processes 63 x E1 Processes 63 x E1 electrical signals when used with an

processing electrical signals interface board.
when used with an Supports the E13 function, which is used to converge
interface board. E1 services into E3 services.

Overhead Supports the transparent transmission and termination of the POH bytes at the
processing VC-12, such as the J2 byte.

Alarm and Provides rich alarms and performance events for easy management and
performanc maintenance of the equipment.
e event

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Function PQ1
and
Feature N1PQ1 N2PQ1

Maintenan Supports inloop and outloop for electrical interfaces.

ce feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection Supports the TPS protection when used with the interface board.
scheme When the working board is the PQ1, the protection board can be the PQM. In
this way, the hybrid protection is provided.

6.3.3 Working Principle and Signal Flow

The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so
on.

Figure 6-10 shows the block diagram for the functions of the PQ1.

Figure 6-10 Block diagram for the functions of the PQ1

1.5 MHz/ Reference clock
155 MHz Cross-connect unit
2 MHz
PLL
OSC

6 x 1.5 Mbit/s/
E1/T1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit
LIU
E1/T1 Interface
A
P
P mapping/ coversion
I 6 x 1.5 Mbit/s/ demapping module
E1/T1 155 Mbit/s High speed bus Cross-connect unit
LIU 6 x 2 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+2.5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.

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Figure 6-11 Block diagram of the E1/T1 mapping/ demapping

E1/T1 mapping/demapping

E1/T1
STM-1
LPA LPT HPA HPT

LPOH(V5/J2/N2/
K4)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(V5/J2/N2/
K4)
Extraction

E1/T1 STM-1
LPA LPT HPA HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:

l Encodes and decodes signals.

l Recovers data and clock.
l Processes the PDH LOS signals.

E1/T1 mapping/demapping
l LPA
l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so as to be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-
AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT

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l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interface
the “E1/T1 mapping/demapping” block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

6.3.4 Front Panel

On the front panel of the PQ1, there are indicators.

Appearance of the Front Panel

Figure 6-12 shows the appearance of the front panel of the PQ1.

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Figure 6-12 Front panel of the PQ1

PQ1
STAT
ACT
PROG
SRV

PQ1

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQ1.

The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. For
details, see the sections that describe the D75S, D12S and D12B.

6.3.5 Valid Slots

The PQ1 must be used with the D75S, D12S or D12B.

The OptiX OSN 1500A does not support the PQ1 board.

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In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 11–13, and must be
used with the D75S, D12S or D12B.
Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B.

Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the
OptiX OSN 1500B subrack
Valid Slot for the PQ1 Corresponding Slot for the D75S, D12S
and D12B

Slot 12 Slot 14 (1–32 channels of services)

Slot 15 (33–63 channels of services)

Slot 13 Slot 16 (1–32 channels of services)

Slot 17 (33–63 channels of services)

NOTE

l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.
l If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12
and 13 cannot get the TPS protection.

6.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PQ1 indicates the interface impedance type.
Table 6-14 lists the relation between the board feature code and interface impedance type for
the PQ1.

Table 6-14 Relation between the board feature code and the interface impedance type
Board Feature Code Interface Impedance
Type

SSN1PQ1A01, A01 75 ohms

SSN2PQ1A01

SSN1PQ1B01, B01 120 ohms

SSN2PQ1B01

6.3.7 TPS Protection for the Board

The PQ1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (≤2)
TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1.

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Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack

S S S S
E1 L L L L
protection bus O O O O
T T T T
14 15 16 17

D75S
D75S

D75S
D75S
E1
service
bus

SLOT SLOT SLOT

11 12 13

Fail
Protection

Working

Working

Detect
board fault
TPS switching
Cross-connect and control bus
timing board

When detecting a failure in the working PD1 board, the cross-connect board issues a command
to switch the services from the faulty PQ1 to the protection PQ1. In this way, services are
protected.

Hardware Configuration
Table 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN
1500B subrack.

Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B
subrack
Working Board Protection Board Slot

PQ1A (75 ohms) PQ1A (75 ohms) Slot 11 can house the protection board.
The board in slot 11 protects the boards
PQ1B (120 ohms) PQ1B (120 ohms) or in slots 12 and 13. Figure 6-14 shows the
PQM slot configuration for the 1:2 TPS
protection for the PQ1.

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Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1

Slot 14 D75S
Slot 18 PIU
Slot 15 D75S

Slot 16 D75S
Slot 19 PIU
Slot 17 D75S
Slot 11 Protection Slot 6
Slot 20 Slot 12 Working Slot 7
Slot 13 Working Slot 8
FAN
Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

6.3.8 Board Configuration Reference

You can use the T2000 to set parameters for the PQ1.

You can use the T2000 to set the following parameters for the PQ1:

l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.3.9 Technical Specifications

The technical specifications of the PQ1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications of
these electrical interfaces, see the section that describes the D75S, D12S or D12B.

Mechanical Specifications
The mechanical specifications of the PQ1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PQ1 is 19 W.

In the normal temperature (25℃), the maximum power consumption of the N2PQ1 is 13 W.

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6.4 PQM
This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.4.1 Version Description

The functional version of the PQM board is N1.
6.4.2 Function and Feature
The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance
events, and to provide the maintenance features and TPS protection.
6.4.3 Working Principle and Signal Flow
The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,
communication and control module and so on.
6.4.4 Front Panel
On the front panel of the PQM, there are indicators.
6.4.5 Valid Slots
The OptiX OSN 1500A does not support the PQM board.
6.4.6 TPS Protection for the Board
The PQM supports the 1:N TPS protection.
6.4.7 Board Configuration Reference
You can use the T2000 to set parameters for the PQM.
6.4.8 Technical Specifications
The technical specifications of the PQM cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.4.1 Version Description

The functional version of the PQM board is N1.

6.4.2 Function and Feature

The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance
events, and to provide the maintenance features and TPS protection.

Table 6-16 lists the functions and features of the PQM.

Table 6-16 Functions and features of the PQM

Function PQM
and Feature

Basic function Processes 63 x E1/T1 signals.

Service The PQM accesses and processes 63 x E1/T1 electrical signals when used
processing with the interface board. Each channel can be configured as E1 or T1.

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Function PQM
and Feature

Overhead Supports the transparent transmission and termination of the POH bytes at
processing the VC-12 level, such as the J2 byte.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Maintenance Supports inloop and outloop for electrical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection When used with the interface board, the PQM supports the TPS protection.
scheme When the working board is the PQ1, the protection board can be the PQM.
In this way, the hybrid protection is provided.

6.4.3 Working Principle and Signal Flow

The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-15 shows the block diagram for the functions of the PQM.

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Figure 6-15 Block diagram for the functions of the PQM

1.5 MHz/ Reference clock
155 MHz Cross-connect unit
2 MHz
PLL
OSC

6 x 1.5 Mbit/s/
E1/T1 6 x 2 Mbit/s 155 Mbit/s High speed bus Cross-connect unit
LIU
E1/T1 Interface
A
P
P mapping/ coversion
I 6 x 1.5 Mbit/s/ demapping module
E1/T1 155 Mbit/s High speed bus Cross-connect unit
LIU 6 x 2 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+2.5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping.

Figure 6-16 Block diagram of the E1/T1 mapping/ demapping

E1/T1 mapping/demapping

E1/T1
STM-1
LPA LPT HPA HPT

LPOH(V5/J2/N2/
K4)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(V5/J2/N2/
K4)
Extraction

E1/T1 STM-1
LPA LPT HPA HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:

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l Encodes and decodes signals.

l Recovers data and clock.
l Processes the PDH LOS signals.

E1/T1 mapping/demapping
l LPA
l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so as to be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-
AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interface
the “E1/T1 mapping/demapping” block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

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6.4.4 Front Panel

On the front panel of the PQM, there are indicators.

Appearance of the Front Panel

Figure 6-17 shows the appearance of the front panel of the PQM.

Figure 6-17 Front panel of the PQM

PQM

STAT
ACT
PROG
SRV

PQM

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQM.

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The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sections
that describe the D12S and D12B.

6.4.5 Valid Slots

The OptiX OSN 1500A does not support the PQM board.
In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 11–13, and must be
used with the D12S or D12B.
Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B.

Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX
OSN 1500B subrack
Valid Slot for the PQM Corresponding Slot for the D12S and
D12B

Slot 12 Slot 14 (1–32 channels of services)

Slot 15 (33–63 channels of services)

Slot 13 Slot 16 (1–32 channels of services)

Slot 17 (33–63 channels of services)

NOTE

l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.
l If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots
12 and 13 cannot get the TPS protection.

6.4.6 TPS Protection for the Board

The PQM supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N≤
2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.

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Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack

S S S S
E1/T1 L L L L
protection bus O O O O
T T T T
14 15 16 17

D12S
D12S

D12S
D12S
E1/T1
service
bus

SLOT SLOT SLOT

11 12 13

Fail
Protection

Working

Working

Detect
board fault
TPS switching
Cross-connect and control bus
timing board

When detecting a fault in the working PQM board, the cross-connect board issues a command
to switch the services from the faulty PQM to the protection PQM. In this way, services are
protected.

Hardware Configuration
Table 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN
1500B subrack.

Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B
subrack
Working Protection Board Slot
Board

PQM (E1) PQM (E1) Slot 11 can house the protection board. The board
in slot 11 protects the boards in slots 12 and 13.
PQM (T1) PQM (T1) Figure 6-19 shows the slot configuration for the
1:2 TPS protection for the PQM.

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Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B
subrack

Slot 14 D12S
Slot 18 PIU
Slot 15 D12S

Slot 16 D12S
Slot 19 PIU
Slot 17 D12S
Slot 11 Protection Slot 6
Slot 20 Slot 12 Working Slot 7
Slot 13 Working Slot 8
FAN
Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

6.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQM.

You can use the T2000 to set the following parameters for the PQM:

l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication
l Path service type

For details on these parameters, see F Board Configuration Reference.

6.4.8 Technical Specifications

The technical specifications of the PQM cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D12S or D12B provides electrical interfaces for the PQM. For the specifications of the
electrical interfaces, see the sections that describe the D12S and D12B.

Mechanical Specifications
The mechanical specifications of the PQM are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PQM is 22 W.

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6.5 PL3
This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.5.1 Version Description

The PL3 has two versions, N1 and N2. The two versions have different functions.
6.5.2 Function and Feature
The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
6.5.3 Working Principle and Signal Flow
The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.5.4 Front Panel
On the front panel of the PL3, there are indicators.
6.5.5 Valid Slots
The OptiX OSN 1500A does not support the PL3 board.
6.5.6 TPS Protection for the Board
The PL3 supports the 1:N TPS protection.
6.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the PL3.
6.5.8 Technical Specifications
The technical specifications of the PL3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.5.1 Version Description

The PL3 has two versions, N1 and N2. The two versions have different functions.

Table 6-19 lists the details on the versions of the PL3 board.

Table 6-19 Version description of the PL3

Item Description

Functional The PL3 has two versions, N1 and N2.

version

Difference The N1PL3 does not support the E13/M13 function.

The N2PL3 supports the E13/M13 function.
The N2PL3 supports the board version replacement function and can
replace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistent
with the N1PL3 in configuration and service status.

Replaceability The N2PL3 can fully replace the N1PL3.

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6.5.2 Function and Feature

The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
Table 6-20 lists the functions and features of the PL3.

Table 6-20 Functions and features of the PL3

Function and PL3
Feature

Basic function Processes 3 x E3/T3 signals.

Service processing Accesses and processes 3 x E3/T3 electrical signals.

Overhead Supports the setting and query of all path overhead bytes at the VC-3
processing level.

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

Maintenance Supports inloop and outloop for electrical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection scheme Supports the TPS protection when used with the interface board and the
switching board.

6.5.3 Working Principle and Signal Flow

The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-20 shows the block diagram for the functions of the PL3.

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Figure 6-20 Block diagram for the functions of the PL3

34 MHz/ Reference clock
155 MHz Cross-connect unit
45 MHz
PLL
OSC

6 x 34 Mbit/s/ High
E3/T3 6 x 45 Mbit/s 2 x 155 Mbit/s speed bus Cross-connect unit
LIU
E3/T3 Interface
A
P
P mapping/ coversion
I 6 x 34 Mbit/s/ demapping module High
E3/T3 2 x 155 Mbit/s speed bus Cross-connect unit
LIU 6 x 45 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V
+1.8 V DC/DC
converter Fuse
+3.3 V backup
power

OSC: Oscillator PPI: PDH physical interface

Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-21 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3
STM-1
LPA LPT HPA HPT

LPOH(J1/C2/B3)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(J1/C2/B3)
extraction

E3/T3 STM-1
LPA LPT HPA HPT

LPA: Low order Path Adaptation LPT: Low order Path Termination
HPA: High order Path Adaptation HPT: High order Path Termination

The function modules are described as follows.

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PPI
l The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.

E3/T3 mapping/demapping
l LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.5.4 Front Panel

On the front panel of the PL3, there are indicators.

Appearance of the Front Panel

Figure 6-22 shows the appearance of the front panel of the PL3.

Figure 6-22 Front panel of the PL3

PL3
STAT
ACT
PROG
SRV

PL3

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.

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l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PL3.
The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3.
For details, see the section that describes the D34S.

6.5.5 Valid Slots

The OptiX OSN 1500A does not support the PL3 board.
In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 12–13, and must be
used with the C34S.
Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S.

Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN
1500B subrack
Valid Slot for the PL3 Corresponding Slot for the C34S

Slot 12 Slot 14

Slot 13 Slot 16

6.5.6 TPS Protection for the Board

The PL3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one
1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.

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Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack
3 xE3/T3

Switch
control
TSB8 C34S signal

1 2
3 2 1
Cross-
connect
and timing
board

SLOT 4/5

Protection Working
PL3 PL3

Fail
SLOT12 SLOT13

l Normal state
When the working boards are running normally, the control switch of the C34S is in position
1 and services are directly accessed to the PL3 board.
l Switching state
When the working board detects a fault and requires a switching, the control switch of the
C34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN
1500B subrack.

Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B
subrack
Working Protection Board Slot
Board

PL3 (E3) PL3 (E3)/PD3 (E3) If the working board is the PL3, the PD3
can be the protection board. Figure 6-24
PL3 (T3) PL3 (T3)/PD3 (T3) shows the slot configuration for the 1:1 TPS
protection for the PL3.

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Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B
subrack
Slot 14 TSB8
Slot 18 PIU
Slot 15

Slot 16 C34S
Slot 19 PIU
Slot 17
Slot 11 Slot 6
Slot 20 Slot 12 Slot 7
Protection
FAN Slot 13 Working Slot 8
Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 6-24, the protection board housed in slot 12 protects the board housed in
slot 13.

Table 6-23 lists the slots for the PL3, C34S and TSB8.

Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack

Board Protection Group

PL3 (working) Slot 13

PL3/PD3 (protection) Slot 12

TSB8 Slot 14

C34S Slot 16

6.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL3.

You can use the T2000 to set the following parameters for the PL3:

l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type

For details on these parameters, see F Board Configuration Reference.

6.5.8 Technical Specifications

The technical specifications of the PL3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

The C34S provides electrical interfaces for the PL3. For the specifications of the electrical
interfaces, see the section that describes the C34S.

Mechanical Specifications
The mechanical specifications of the PL3 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PL3 is 15 W.
In the normal temperature (25℃), the maximum power consumption of the N2PL3 is 12 W.

6.6 PL3A
This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.6.1 Version Description

The PL3A board has two functional versions, N1 and N2. The difference between the two
versions lies in the support for the E13/M13 function.
6.6.2 Function and Feature
The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.6.3 Working Principle and Signal Flow
The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.6.4 Front Panel
On the front panel of the PL3A, there are indicators and interfaces.
6.6.5 Valid Slots
The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks
6.6.6 Board Configuration Reference
You can use the T2000 to set parameters for the PL3A.
6.6.7 Technical Specifications
The technical specifications of the PL3A cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.6.1 Version Description

The PL3A board has two functional versions, N1 and N2. The difference between the two
versions lies in the support for the E13/M13 function.
Table 6-24 lists the details on the versions of the PL3A board.

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Table 6-24 Version description of the PL3A

Item Description

Functional The PL3A has two versions, N1 and N2.

version

Difference The N1PL3A does not support the E13/M13 function.

The N2PL3A supports the E13/M13 function.
The N2PL3A supports the board version replacement function and can
replace the N1PL3A. After the N1PD3A is replaced, the N2PD3A is
consistent with the N1PD3A in configuration and service status.

Replaceability The N2PD3A can fully replace the N1PD3A.

6.6.2 Function and Feature

The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-25 lists the functions and features of the PL3A.

Table 6-25 Functions and features of the PL3A

Function and PL3A
Feature

Basic function Processes 3 x E3/T3 signals.

The N2PL3A supports the E13 function, which is used to converge E1
services into E3 services.
The N2PL3A supports the M13 function, which is used to converge T1
services into T3 services.

Service Accesses and processes 3 x E3/T3 electrical signals.

processing

Overhead Supports the setting and query of all path overhead bytes at the VC-3 level.
processing

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

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Function and PL3A

Feature

Maintenance Supports inloop and outloop for electrical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

6.6.3 Working Principle and Signal Flow

The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-25 shows the block diagram for the functions of the PL3A.

Figure 6-25 Block diagram for the functions of the PL3A

34 MHz/ Reference clock
155 MHz Cross-connect unit
45 MHz
PLL
OSC

6 x 34 Mbit/s/ High
E3/T3 6 x 45 Mbit/s 2 x 155 Mbit/s speed bus Cross-connect unit
LIU
E3/T3 Interface
A
P
P mapping/ coversion
I 6 x 34 Mbit/s/ demapping module High
E3/T3 2 x 155 Mbit/s speed bus Cross-connect unit
LIU 6 x 45 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V
+1.8 V DC/DC
converter Fuse
+3.3 V backup
power

OSC: Oscillator PPI: PDH physical interface

Figure 6-26 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-26 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3
STM-1
LPA LPT HPA HPT

LPOH(J1/C2/B3)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(J1/C2/B3)
extraction

E3/T3 STM-1
LPA LPT HPA HPT

LPA: Low order Path Adaptation LPT: Low order Path Termination
HPA: High order Path Adaptation HPT: High order Path Termination

The function modules are described as follows.

PPI
l The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.

E3/T3 mapping/demapping
l LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.

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l MST and RST

l The functions are necessary to create a proprietary STM–1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.6.4 Front Panel

On the front panel of the PL3A, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-27 shows the appearance of the front panel of the PL3A.

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Figure 6-27 Front panel of the PL3A

PL3A

STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3

PL3A

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.

6.6.5 Valid Slots

The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks

The PL3A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

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The PL3A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the PL3A.

You can use the T2000 to set the following parameters for the PL3A:

l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type

For details on these parameters, see F Board Configuration Reference.

6.6.7 Technical Specifications

The technical specifications of the PL3A cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-26 lists the specifications of the electrical interfaces of the PL3A.

Table 6-26 Specifications of the electrical interfaces of the PL3A

Interface Type Code Output Allowed Allowed Input

Signal Bit Input Input Jitter
Rate Frequency Attenuatio Tolerance
Deviation n

34368 kbit/s HDB3 Compliant with ITU-T G.703

44736 kbit/s B3ZS Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the PL3A are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PL3A is 15 W.

In the normal temperature (25℃), the maximum power consumption of the N2PL3A is 12 W.

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6.7 PD3
This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.7.1 Version Description

The PD3 board has two functional versions, N1 and N2. The difference between the two versions
lies in the support for the E13/M13 function.
6.7.2 Function and Feature
The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.7.3 Working Principle and Signal Flow
The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.7.4 Front Panel
On the front panel of the PD3, there are indicators.
6.7.5 Valid Slots
The OptiX OSN 1500A does not support the PD3 board.
6.7.6 TPS Protection for the Board
The PD3 supports the 1:N TPS protection.
6.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the PD3.
6.7.8 Technical Specifications
The technical specifications of the PD3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.7.1 Version Description

The PD3 board has two functional versions, N1 and N2. The difference between the two versions
lies in the support for the E13/M13 function.
Table 6-27 lists the details on the versions of the PD3 board.

Table 6-27 Version Description of the PD3

Item Description

Functional The PD3 has two functional versions, N1 and N2.

version

Difference The N1PD3 does not support the E13/M13 function.

The N2PD3 supports the E13/M13 function.
The N2PD3 supports the board version replacement function and can
replace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistent
with the N1PD3 in configuration and service status.

Replaceability The N2PD3 can fully replace the N1PD3.

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6.7.2 Function and Feature

The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-28 lists the functions and features of the PD3.

Table 6-28 Functions and features of the PD3

Function PD3
and Feature

Basic function Processes 6 x E3/T3 signals.

Service Accesses and processes 6 x E3/T3 electrical signals.

processing The N2PD3 supports the E13 function, which is used to converge E1
services into E3 services.
The N2PD3 supports the M13 function, which is used to converge T1
services into T3 services.

Overhead Supports the setting and query of all path overhead bytes at the VC-3 level.
processing

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Maintenance Supports inloop and outloop for electrical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection Supports the TPS protection when used with the interface and switching
scheme boards.

6.7.3 Working Principle and Signal Flow

The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-28 shows the block diagram for the functions of the PD3.

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Figure 6-28 Block diagram for the functions of the PD3

34 MHz/ Reference clock
155 MHz Cross-connect unit
45 MHz
PLL
OSC

6 x 34 Mbit/s/ High
E3/T3 6 x 45 Mbit/s 2 x 155 Mbit/s speed bus Cross-connect unit
LIU
E3/T3 Interface
A
P
P mapping/ coversion
I 6 x 34 Mbit/s/ demapping module High
E3/T3 2 x 155 Mbit/s speed bus Cross-connect unit
LIU 6 x 45 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V
+1.8 V DC/DC
converter Fuse
+3.3 V backup
power

OSC: Oscillator PPI: PDH physical interface

Figure 6-29 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-29 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3
STM-1
LPA LPT HPA HPT

LPOH(J1/C2/B3)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(J1/C2/B3)
extraction

E3/T3 STM-1
LPA LPT HPA HPT

LPA: Low order Path Adaptation LPT: Low order Path Termination
HPA: High order Path Adaptation HPT: High order Path Termination

The function modules are described as follows.

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PPI
l The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.

E3/T3 mapping/demapping
l LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.
l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect the
interface conversion module.

Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.7.4 Front Panel

On the front panel of the PD3, there are indicators.

Appearance of the Front Panel

Figure 6-30 shows the appearance of the front panel of the PD3.

Figure 6-30 Front panel of the PD3

PD3
STAT
ACT
PROG
SRV

PD3

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
No interfaces are present on the front panel of the PD3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3.
For details, see the section that describes the D34S.

6.7.5 Valid Slots

The OptiX OSN 1500A does not support the PD3 board.
In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 12–13, and must be
used with the D34S.
Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S.

Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN
1500B subrack
Valid Slot for the PD3 Corresponding Slot for the D34S

Slot 12 Slot 14

Slot 13 Slot 16

6.7.6 TPS Protection for the Board

The PD3 supports the 1:N TPS protection.

Protection Principle
For the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configured
into one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection for
the PD3.

Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack
6 xE3/T3

Switch
control
TSB8 D34S signal

1 1 2
3 2
Cross-
connect
and
timing
board

SLOT 4/5
Protection Working
PD3 PD3
Fail

SLOT12 SLOT13

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l Normal state
When the working boards are running normally, the control switch of the D34S is in position
1 and services are directly accessed to the PD3 board.
l Switching state
When the working board detects a fault and requires a switching, the control switch of the
D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN
1500B subrack.

Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B
subrack

Working Protection Board Slot

Board

PD3 (E3) PD3 (E3) Figure 6-32 shows the slot configuration for
the 1:1TPS protection for the PD3
PD3 (T3) PD3 (T3)

Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B
subrack
Slot 14 TSB8
Slot 18 PIU
Slot 15

Slot 16 D34S
Slot 19 PIU
Slot 17
Slot 11 Slot 6
Slot 20 Slot 12 Protection Slot 7

FAN Slot 13 Working Slot 8

Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 6-32, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-31 lists the slots for the PD3, D34S and TSB8.

Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack

Board Protection Group

PD3 (working) Slot 13

PD3 (protection) Slot 12

TSB8 Slot 14

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Board Protection Group

D34S Slot 16

6.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the PD3.
You can use the T2000 to set the following parameters for the PD3:
l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type

For details on these parameters, see F Board Configuration Reference.

6.7.8 Technical Specifications

The technical specifications of the PD3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PD3. For the specifications of the electrical
interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PD3 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PD3 is 19 W.
In the normal temperature (25℃), the maximum power consumption of the N2PD3 is 12 W.

6.8 PQ3
This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.8.1 Version Description

The functional version of the PQ3 board is N2.
6.8.2 Function and Feature

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The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.8.3 Working Principle and Signal Flow
The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.8.4 Front Panel
On the front panel of the PQ3, there are indicators.
6.8.5 Valid Slots
The OptiX OSN 1500A does not support the PQ3 board.
6.8.6 TPS Protection for the Board
The PQ3 supports the 1:N TPS protection.
6.8.7 Board Configuration Reference
You can use the T2000 to set parameters for the PQ3.
6.8.8 Technical Specifications
The technical specifications of the PQ3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.8.1 Version Description

The functional version of the PQ3 board is N2.

6.8.2 Function and Feature

The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-32 lists the functions and features of the PQ3.

Table 6-32 Functions and features of the PQ3

Function and PQ3
Feature

Basic function Processes 12 x E3/T3 signals.

Service Accesses and processes 12 x E3/T3 electrical signals.

processing Supports the E13 function, which is used to converge E1 services into E3
services.
Supports the M13 function, which is used to converge T1 services into T3
services.

Overhead Supports the setting and query of all path overhead bytes at the VC-3 level.
processing

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

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Function and PQ3

Feature

Maintenance Supports inloop and outloop for electrical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection Supports the TPS protection when used with the interface board and the
scheme switching board.

6.8.3 Working Principle and Signal Flow

The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.

Figure 6-33 shows the block diagram for the functions of the PQ3.

Figure 6-33 Block diagram for the functions of the PQ3

34 MHz/ Reference clock
155 MHz Cross-connect unit
45 MHz
PLL
OSC

6 x 34 Mbit/s/ High
E3/T3 6 x 45 Mbit/s 2 x 155 Mbit/s speed bus Cross-connect unit
LIU
E3/T3 Interface
A
P
P mapping/ coversion
I 6 x 34 Mbit/s/ demapping module High
E3/T3 2 x 155 Mbit/s speed bus Cross-connect unit
LIU 6 x 45 Mbit/s
B

LOS Frame header

Communication and Cross-connect unit
Outloop/Inloop control control module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V
+1.8 V DC/DC
converter Fuse
+3.3 V backup
power

OSC: Oscillator PPI: PDH physical interface

Figure 6-34 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-34 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3
STM-1
LPA LPT HPA HPT

LPOH(J1/C2/B3)
insertion
PDH AIS TU-AIS/TU-LOP
Detector Detector
LPOH(J1/C2/B3)
extraction

E3/T3 STM-1
LPA LPT HPA HPT

LPA: Low order Path Adaptation LPT: Low order Path Termination
HPA: High order Path Adaptation HPT: High order Path Termination

The function modules are described as follows.

PPI
l The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.

E3/T3 mapping/demapping
l LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted
so as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM–1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM–1 period), and consists of the
C4 container and POH.

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l MST and RST

l The functions are necessary to create a proprietary STM–1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.8.4 Front Panel

On the front panel of the PQ3, there are indicators.

Appearance of the Front Panel

Figure 6-35 shows the appearance of the front panel of the PQ3.

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Figure 6-35 Front panel of the PQ3

PQ3
STAT
ACT
PROG
SRV

PQ3

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQ3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3.
For details, see the section that describes the D34S.

6.8.5 Valid Slots

The OptiX OSN 1500A does not support the PQ3 board.
In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 12–13, and must be
used with the D34S.
Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S.

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Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN
1500B subrack
Valid Slot for the PQ1 Corresponding Slot for the D34S

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

6.8.6 TPS Protection for the Board

The PQ3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one
1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3.

Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack
6 xE3/T3 6 xE3/T3

Switch
TSB8 control
TSB8 D34S D34S signal

1 2 1 2 1 2 1 2

Cross-
connect
and timing
board

SLOT 4/5
Working
Protection PQ3
PQ3
Fail

SLOT12 SLOT13

l Normal state
When the working boards are running normally, the control switch of the D34S is in position
1 and services are directly accessed to the PQ3 board.
l Switching state
When the working board detects a fault and requires a switching, the control switch of the
D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
NOTE

Two TSB8 boards are required to configure the TPS protection for the N2PQ3.

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Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN
1500B subrack.

Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B
subrack
Working Protection Board Slot
Board

PQ3 (E3) PQ3 (E3) Figure 6-37 shows the slot configuration for
the 1:3 TPS protection for the PQ3.
PQ3 (T3) PQ3 (T3)

Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B
subrack
Slot 14 TSB8
Slot 18 PIU
Slot 15 TSB8
Slot 16 D34S
Slot 19 PIU
Slot 17 D34S
Slot 11 Slot 6
Slot 20 Slot 12 Protection Slot 7

FAN Slot 13 Working Slot 8

Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 6-37, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-35 lists the slots for the PQ3, D34S and TSB8.

Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack
Board Protection Group

PQ3 (working) Slot 13

PQ3 (protection) Slot 12

TSB8 Slots 14–15

D34S Slots 16–17

6.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQ3.
You can use the T2000 to set the following parameters for the PQ3:
l J1 byte

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l C2 byte
l Tributary loopback
l Service loading indication
l Path service type

For details on these parameters, see F Board Configuration Reference.

6.8.8 Technical Specifications

The technical specifications of the PQ3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PQ3. For the specifications of the electrical
interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PQ3 is 13 W.

6.9 DX1
This section describes the DX1, a DDN interface convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
6.9.1 Version Description
The functional version of the DX1 board is N1.
6.9.2 Function and Feature
The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level
at the system side.
6.9.3 Working Principle and Signal Flow
The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module and so on.
6.9.4 Front Panel
On the front panel of the DX1, there are indicators.
6.9.5 Valid Slots
The OptiX OSN 1500A does not support the DX1 board.
6.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the DX1 indicates the interface impedance type.

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6.9.7 TPS Protection for the Board

The DX1 supports the 1:N TPS protection.
6.9.8 Board Configuration Reference
You can use the T2000 to set parameters for the DX1.
6.9.9 Technical Specifications
The technical specifications of the DX1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.9.1 Version Description

The functional version of the DX1 board is N1.

6.9.2 Function and Feature

The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level
at the system side.
Table 6-36 lists the functions and features of the DX1.

Table 6-36 Functions and features of the DX1

Function DX1
and
Feature

Basic Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services.

function Cross-connects 48 channels of N x 64 kbit/s signals at the system side.

Used with Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services and
the interface realizes the 1:N TPS protection when used with the DM12.
board One DX1 board should be used with two DM12 boards.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Connector The connectors of the DB28 and DB44 are present on the front panel of the
DM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for the
framed E1 signals.

Loopback Supports inloop and outloop.

function

PRBS self- Supported.

test

6.9.3 Working Principle and Signal Flow

The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module and so on.
Figure 6-38 shows the block diagram for the functions of the DX1.

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Figure 6-38 Block diagram for the functions of the DX1

Backplane Backplane

DX1
DM12
Frame E1
8X Frame E1
interface encoding/decoding
Frame E1 and frame
module
processing 64kbit/s
Timeslot Framing/ mapping/ Cross-
module
N x 64 kbit/s cross- deframing demapping connect unit
8X interface connect module module
Nx64 kbit/s module Nx64k bit/s module
interface and
Power frame
processing
DM12 module
8X N x 64 kbit/s
Nx64 kbit/s interface
module
Communication SCC unit
Power
and control
Frame E1 module
interface
module +3.3 V
DC/DC Fuse
-48 V/-60 V
converter -48 V/-60 V
DC/DC
Fuse
converter +3.3 V
backup
power

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,
which recovers the signals. The framing/deframing module converts the signals to framed E1
signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-
connect module cross-connects and grooms the signals in the 64 kbit/s granularities, and
transmits the services that are dropped at the NE to the interface module.

In the receive direction

The DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channels
of N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, the
DX1 recovers the clock and data signals.

The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts the
N x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/s
cross-connect module. The timeslot cross-connect module cross-connects and grooms the
signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the
signals to the framing/deframing module. The framing/deframing module then maps the signals
into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service
configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.

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6.9.4 Front Panel

On the front panel of the DX1, there are indicators.

Appearance of the Front Panel

Figure 6-39 shows the appearance of the front panel of the DX1.

Figure 6-39 Front panel of the DX1

DX1
STAT
ACT
PROG
SRV

DX1

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
There are no interfaces on the front panel of the DX1.

When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/s
signals. For details, see the section that describes the DM12.

6.9.5 Valid Slots

The OptiX OSN 1500A does not support the DX1 board.

In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 11–13, and must be
used with the DM12.

Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12.

Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN
1500B subrack

Valid Slot for the DX1 Corresponding Slot for the DM12

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

NOTE

l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.
l One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12
board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channels
of N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to access
four channels of N x 64 kbit/s signals.

6.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the DX1 indicates the interface impedance type.

Table 6-38 lists the relation between the board feature code and interface impedance type for
the DX1.

Table 6-38 Relation between the board feature code and the interface impedance type

Board Barcode Feature Code Interface Impedance

Type

SSN1DX1A01 A01 75 ohms

SSN1DX1B01 B01 120 ohms

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6.9.7 TPS Protection for the Board

The DX1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N≤
2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1.

Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack

S S S S
L L L L
protection bus O O O O
T T T T
14 15 16 17
DM12
DM12
DM12
DM12

service
bus
S S S
L L L
O O O
T T T
11 12 13

Fail
Protection

Working

Working

TPS
Detect switching
board fault control bus
Cross-connect and timing
board

When detecting a fault in the working DX1 board, the cross-connect board issues a command
to switch the services from the faulty DX1 to the protection DX1. In this way, services are
protected.

Hardware Configuration
Figure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiX
OSN 1500B subrack.

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Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B
subrack

Slot 14 DM12
Slot 18 PIU
Slot 15 DM12
Slot 16 DM12
Slot 19 PIU
Slot 17 DM12
Slot 11 Protection Slot 6
Slot Slot 12 Slot 7
Working
20
Slot 13 Working Slot 8
FAN Slot 4 CXL16/4/1 Slot 9 EOW

Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed in
slots 12–13.

Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack.

Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack

Board Protection Group

DX1 (working) Slots 12 and 13

DX1 (protection) Slot 11

DM12 Slots 14–17

6.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the DX1.

You can use the T2000 to set the following parameters for the DX1:

l J2 byte
l Tributary loopback
l Service loading indication
l Protocol mode of serial ports
l DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.9.9 Technical Specifications

The technical specifications of the DX1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

The DM12 provides electrical interfaces for the DX1. For the specifications of the electrical
interfaces, see the section that describes the DM12.

Mechanical Specifications
The mechanical specifications of the DX1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the DX1 is 15 W.

NOTE

After the TPS protection is performed, the power consumption of the DX1 is 31 W.

6.10 DXA
This section describes the DXA, a DDN convergence board, in terms of the version, function,
principle, front panel, configuration and specifications.

6.10.1 Version Description

The functional version of the DXA board is N1.
6.10.2 Function and Feature
The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level
at the system side.
6.10.3 Working Principle and Signal Flow
The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/
demapping module, control and communication module and power supply module.
6.10.4 Front Panel
On the front panel of the DXA, there are indicators.
6.10.5 Valid Slots
The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks.
6.10.6 Board Configuration Reference
You can use the T2000 to set parameters for the DXA.
6.10.7 Technical Specifications
The technical specifications of the DXA cover the optical interface specifications, board
dimensions, weight and power consumption.

6.10.1 Version Description

The functional version of the DXA board is N1.

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6.10.2 Function and Feature

The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level
at the system side.
Table 6-40 lists the functions and features of the DXA.

Table 6-40 Functions and features of the DXA

Function and DXA
Feature

Basic function Cross-connects 63 x framed E1 signals.

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

Loopback function Supports inloop and outloop.

PRBS self-test Not supported.

6.10.3 Working Principle and Signal Flow

The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/
demapping module, control and communication module and power supply module.
Figure 6-42 shows the block diagram for the functions of the DXA.

Figure 6-42 Block diagram for the functions of the DXA

Backplane

64 kbit/s
Framing/ Mapping/
timeslot Cross-
deframing demapping
crossconnect connect
module module
module unit

Control and Cross-

communication connect
module unit

+3.3 V Fuse -48 V/-60 V

DC/DC
converter -48 V/-60 V
DC/DC
converter Fuse
+3.3 V Backup
Power

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,
which recovers the signals. The framing/deframing module converts the signals to framed E1

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signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-
connect module cross-connects and grooms the signals in the 64 kbit/s granularities.

In the receive direction

The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s
granularities. The timeslot cross-connect module then transmits the signals to the framing/
deframing module. The framing/deframing module then maps the signals into the VC-4 and
transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service
configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.

6.10.4 Front Panel

On the front panel of the DXA, there are indicators.

Appearance of the Front Panel

Figure 6-43 shows the appearance of the front panel of the DXA.

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Figure 6-43 Front panel of the DXA

DXA
STAT
ACT
PROG
SRV

DXA

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the DXA.

6.10.5 Valid Slots

The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks.

The DXA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

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The DXA can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.10.6 Board Configuration Reference

You can use the T2000 to set parameters for the DXA.
You can use the T2000 to set the following parameters for the DXA:
l J2 byte
l Tributary loopback
l Service loading indication
l Protocol mode of serial ports
l DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.10.7 Technical Specifications

The technical specifications of the DXA cover the optical interface specifications, board
dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the DXA are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.8

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the DXA is 10 W.

6.11 SPQ4
This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,
function, working principle, front panel and specifications.

6.11.1 Version Description

The SPQ4 has two versions, N1 and N2. The two versions have different functions.
6.11.2 Function and Feature
The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms
and performance events, and to provide the maintenance features and protection.
6.11.3 Working Principle and Signal Flow
The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization
and scramble processing module, mapping/demapping module, SDH overhead processing
module, logic control module, and power supply module.
6.11.4 Front Panel
On the front panel of the SPQ4, there are indicators.
6.11.5 Valid Slots

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The OptiX OSN 1500A does not support the SPQ4 board.
6.11.6 TPS Protection for the Board
The SPQ4 supports the 1:N TPS protection.
6.11.7 Board Configuration Reference
You can use the T2000 to set parameters for the SPQ4.
6.11.8 Technical Specifications
The technical specifications of the SPQ4 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.11.1 Version Description

The SPQ4 has two versions, N1 and N2. The two versions have different functions.
Table 6-41 lists the details on the versions of the SPQ4 board.

Table 6-41 Version Description of the SPQ4

Item Description

Functional The SPQ4 has two versions, N1 and N2.

version

Difference The equipment of the V100R001 and V100R002 versions support the
N1SPQ4. The equipment of the V100R003 and later versions support the
N2SPQ2.

Replaceability The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 is
replaced, the NE should be upgraded.

6.11.2 Function and Feature

The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms
and performance events, and to provide the maintenance features and protection.
Table 6-42 lists the functions and features of the SPQ4.

Table 6-42 Functions and features of the SPQ4

Function and SPQ4
Feature

Basic function Processes 4 x STM-1/E4 signals.

Service Accesses and processes 4 x E4/STM-1 electrical signals. For each

processing channel, the E4 and STM-1 signals are compatible. Supports the
processing of the VC-12, VC-3 and VC-4 services.

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Function and SPQ4

Feature

Overhead Supports the processing of SOH bytes for the STM-1 signals, such as B1,
processing B2, K1, K2, M1, F1, and D1–D12.
Supports the transparent transmission and termination of POH bytes,
including J1, B3, C2, G1, and H4.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

Protection Supports the TPS protection when used with the interface board and the
scheme switching board.
Supports the two-fiber unidirectional MSP protection ring, linear MSP
protection, and SNCP.

Maintenance Supports inloop and outloop for optical interfaces.

feature Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

6.11.3 Working Principle and Signal Flow

The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization
and scramble processing module, mapping/demapping module, SDH overhead processing
module, logic control module, and power supply module.
Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the block
diagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDH
overhead processing module.

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Figure 6-44 Block diagram for the functions of the SPQ4

Cross-
34 MHz 155 MHz Reference clock
connect unit
OSC PLL

4x139 Mbit/s 140M mapping/demapping 4x155 Mbit/s High speed bus

Cross-connect
LIU P unit A
E4/STM-1 P
I/ Interface
S conversion
P module
LIU I 4x155 Mbit/s 4x155 Mbit/s High speed bus
SDH overhead processing Cross-connect
module unit B

DCC
SCC unit
K1 and K2
Cross-connect
unit

EN 140M/155M
Frame header Cross-connect
LOS Communication unit
and control Communication
Outloop/Inloop control module SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
5V
converter -48 V/ -60 V
+1.8V DC/DC
+2.5V converter Fuse
+3.3 V backup
power

Figure 6-45 Block diagram of the 140M mapping/demapping

140M mapping/demapping

139Mbit/s 155Mbit/s
LPA HPT PG MST RST

PDH AIS E4 AIS J1/C2/B3 E4 AIS

detector insertion insertion

139Mbit/s 155Mbit/s
SIPO LPA HPT MST RST

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Figure 6-46 Block diagram of the SDH overhead processing module

SDH overhead processing module

Cross-
K1 and K2 insertion/extration connect unit

155 Mbit/s
155 Mbit/s

RST MST MSA HPT

155 Mbit/s
155 Mbit/s

DCC
SCC unit

The principle of the E4/ STM-1 electrical interface units is described below.

PPI/SPI
l The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
l The SPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the R_LOS signals.

SDH Overhead Processing Module and 140M Mapping/Demapping Module

SDH Overhead Processing Module (155Mbit/s SDH Signals)

The functions required to manage 155 Mbit/s SDH signals are implemented by the SDH
overhead processing module.

RST
l In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

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MST
l In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
l Provides extraction or insertion of K1 byte and K2 byte.

MSA
l In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.

HPT
l OH termination
l J1 path trace message recover
l REI information recovering
l HP_RDI detection (path status monitoring
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count

140M mapping/demapping (140Mbit/s PDH signals)

The functions required to manage 140 Mbit/s PDH signals are implemented by the 140M
mapping/demapping module.

LPA
The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to be
transported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.

HPT
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed
within a 125 us interval (for example, one STM–1 period), and consists of the C4 container and
POH. The latter contains nine octets equally distributing within the frame. These overhead bytes
can be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstream
direction.

PG (Pointer generator)

A fixed pointer value is inserted in the SOH to structure the AU4 signal.

MST and RST

These two functions are necessary to create a proprietary STM–1 signal in order to connect with
interface conversion module. In the receive direction, MST and RST perform frame alignment
detection (A1, A2).

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Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Realizes the pass-through of orderwire and ECC bytes between the two service processing
boards constituting the ADM when the GSCC is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.

DC/DC converter module

It provides the board with required DC voltages. It converts the –48 V/–60 V power supply to
the following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V power
are provided to the board.

6.11.4 Front Panel

On the front panel of the SPQ4, there are indicators.

Appearance of the Front Panel

Figure 6-47 shows the appearance of the front panel of the SPQ4.

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Figure 6-47 Front panel of the SPQ4

SPQ4
STAT
ACT
PROG
SRV

SPQ4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4
can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.

6.11.5 Valid Slots

The OptiX OSN 1500A does not support the SPQ4 board.
In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 12–13, and must be
used with the MU04.

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Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN
1500B subrack

Valid Slot for the SPQ4 Corresponding Slot for the DMU04

Slot 12 Slot 14

Slot 13 Slot 16

6.11.6 TPS Protection for the Board

The SPQ4 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one
1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4.

Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack
4×E4/STM-1

Switch
control
TSB8 signal
MU04

1 1 2
3 2
Cross-
connect
and
timing
board
SLOT 4/5

Protection Working
SPQ4 SPQ4

Fail
SLOT12 SLOT13

l Normal state
When the working boards are running normally, the control switch of the MU04 is in
position 1 and the MU04 directly accesses the service signals to the SLH1.
l Switching state
When the working board detects a fault and requires a switching, the control switch of the
MU04 is shifted to position 2 and the control switch of the TSB8 is shifted to a
corresponding position. In this way, the protection board protects the faulty working board.

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Hardware Configuration
Figure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiX
OSN 1500B subrack.

Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4
Slot 14 TSB8
Slot 18 PIU
Slot 15

Slot 16 MU04
Slot 19 PIU
Slot 17
Slot 11 Slot 6
Slot 20 Slot 12 Slot 7
Protection

FAN Slot 13 Working Slot 8

Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 6-49, the protection board housed in slot 12 protects the board housed in
slot 13.

Table 6-44 lists the slots for the SPQ4, MU04 and TSB8.

Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack

Board Protection Group

SPQ4 (working) Slot 13

SPQ4 (protection) Slot 12

MU04 Slot 16

TSB8 Slot 14

6.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the SPQ4.

You can use the T2000 to set the following parameters for the SPQ4:

l J1 byte
l C2 byte

For details on these parameters, see F Board Configuration Reference.

6.11.8 Technical Specifications

The technical specifications of the SPQ4 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electrical
interfaces, see the section that describes the MU04.

Mechanical Specifications
The mechanical specifications of the SPQ4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SPQ4 is 24 W.

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7 Data Processing Boards

About This Chapter

This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals.

7.1 EFT4
This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.2 EFT8
This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.3 EFT8A
This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.4 EGT2
This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.5 EFS0
This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.6 EFS4
This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.7 EGS2
This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.8 EMS4
This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and
convergence board, in terms of the version, function, principle, front panel, configuration and
specifications.
7.9 EGS4

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This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.10 EGS4A
This section describes the EGS4A, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.11 EGR2
This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.12 EMR0
This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.13 ADL4
This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.14 ADQ1
This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.15 IDL4
This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.16 IDQ1
This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.17 MST4
This section describes the MST4, a 4-channel multi-service transparent transmission board, in
terms of the version, function, principle, front panel, configuration and specifications.

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7.1 EFT4
This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.

7.1.1 Version Description

The functional version of the EFT4 board is R1.
7.1.2 Function and Feature
The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.1.3 Working Principle and Signal Flow
The EFT4 consists of the ethernet access module, mapping module, interface converting module,
Communication and control module and so on.
7.1.4 Front Panel
On the front panel of the EFT4, there are indicators, interfaces and barcode.
7.1.5 Valid Slots
The EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.
The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.
7.1.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT4.
7.1.7 Technical Specifications
The specifications of the EFT4 cover the mechanical specifications and power consumption.

7.1.1 Version Description

The functional version of the EFT4 board is R1.

7.1.2 Function and Feature

The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-1 lists the functions and features of the EFT4.

Table 7-1 Functions and features of the EFT4

Function and EFT4

Feature

Basic function Transmits 4 x FE services.

Specification of Supports 10Base-T/100Base-TX signals. The optical interfaces comply

the optical with IEEE 802.3u.
interface

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.
frames Supports frames with a length ranging from 64 bytes to 9600 bytes.
Supports Jumbo frames with a length less than 9600 bytes.

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Function and EFT4

Feature

Max. uplink 622 Mbit/s.

bandwidth

Number of 4.
VCTRUNKs

Encapsulation HDLC, LAPS, GFP-F.

format

Mapping Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

granularity

Ethernet service Supports EPL.

type

MTU Supports setting of the packet length, which ranges from 1518 bytes to
1535 bytes. After the setting becomes valid, the length of the packets
that enter or exit the IP ports is limited.

MPLS Not supported.

VLAN Supports VLAN transparent transmission.

LPT Supports the LPT in the GFP-carrying mode.

CAR Not supported.

Flow control Supports the IEEE 802.3x flow control based on FE port.
function

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

ETH-OAM Not supported.

Test frame Receives and transmits Ethernet test frames.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

7.1.3 Working Principle and Signal Flow

The EFT4 consists of the ethernet access module, mapping module, interface converting module,
Communication and control module and so on.
Figure 7-1 shows the block diagram for the functions of the EFT4.

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Figure 7-1 Block diagram for the functions of the EFT4

ENCP Cross-connect unit

FE Ethernet Interface
access VCP converting
module module
DENCP Cross-connect unit

Mapping module

Laser
LOS
shutdown

Communication Communication
and control SCC unit
Reference clock and frame header
module SCC unit

+3.3 V Fuse - 48 V/-60V

DC/DC
converter - 48 V/-60V
Clock module +1.5 V
+1.8 V DC/DC Fuse +3.3 V
+2.5 V converter +3.3 V backup
power
77 125 155
MHz MHz MHz

The function modules of ethernet switching boards are described below:

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet access module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

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Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC converter module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.1.4 Front Panel

On the front panel of the EFT4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-2 shows the appearance of the front panel of the EFT4.

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Figure 7-2 Front panel of the EFT4

EFT4

STAT
ACT
PROG
SRV
FE1
FE2
FE3
FE4

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usage
of the interfaces.

Table 7-2 Optical interfaces of the EFT4

Interface Interface Type Usage

FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

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Table 7-3 lists the pins of the RJ-45 interface.

Table 7-3 Pins of the RJ-45 of the EFT4

Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

6 Receiving negative

7 Grounding

8 Grounding

7.1.5 Valid Slots

The EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.
The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.
NOTE

The slots are divided slots.

7.1.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT4.
You can use the T2000 to set the following parameters for the EFT4:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.1.7 Technical Specifications

The specifications of the EFT4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT4 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFT4 is 14 W.

7.2 EFT8
This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.

7.2.1 Version Description

The functional version of the EFT8 board is N1.
7.2.2 Function and Feature
The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.2.3 Working Principle and Signal Flow
The EFT8 consists of the ethernet access module, mapping module, interface converting module,
communication and control module and so on.
7.2.4 Front Panel
On the front panel of the EFT8, there are indicators, interfaces and barcode.
7.2.5 Valid Slots
The EFT8 can be used with the ETF8 and EFF8.
7.2.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT8.
7.2.7 Technical Specifications
The specifications of the EFT8 cover the mechanical specifications and power consumption.

7.2.1 Version Description

The functional version of the EFT8 board is N1.

7.2.2 Function and Feature

The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-4 lists the functions and features of the EFT8.

Table 7-4 Functions and features of the EFT8

Function and EFT8

Feature

Basic function Transmits 8 x FE or 16 x FE services

Used with the Accesses 8 x Ethernet signals at the electrical port.

interface board Accesses 16 x Ethernet signals at the electrical port when used with the
ETF8.
Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signals
when used with the EFF8.

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Function and EFT8

Feature

Specification of Supports the 10Base-T/100Base-TX signals when used with the ETF8.
the optical Supports the 100Base-FX/100Base-TX signals when used with the
interface EFF8. The optical interfaces comply with IEEE 802.3u.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink 1.25 Gbit/s.

bandwidth

Number of 16.
VCTRUNKs

Encapsulation Supports HDLC, LAPS, and GFP-F.

format

Mapping Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

granularity

Ethernet service Supports EPL.

type

MPLS Not supported.

VLAN Supports the VLAN transparent transmission.

LPT Supports the LPT in the GFP-carrying mode.

CAR Not supported.

ETH-OAM Supports ETH-OAM in compliance with 802.1ag. The EFT8 supports

CC for the multicast.

Flow control Supports the IEEE 802.3x flow control based on FE port.
function

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

ETH-OAM Not supported.

Test frame Receives and transmits GFP test frames.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarms and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
events

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7.2.3 Working Principle and Signal Flow

The EFT8 consists of the ethernet access module, mapping module, interface converting module,
communication and control module and so on.
Figure 7-3 shows the block diagram for the functions of the EFT8.

Figure 7-3 Block diagram for the functions of the EFT8

ENCP Cross-connect unit

FE Ethernet Interface
access VCP converting
module module
DENCP Cross-connect unit

Mapping module

Laser
LOS
shutdown

Communication Communication
and control SCC unit
Reference clock and frame header
module SCC unit

+3.3 V Fuse - 48 V/-60V

DC/DC
converter - 48 V/-60V
Clock module +1.5 V
+1.8 V DC/DC Fuse +3.3 V
+2.5 V converter +3.3 V backup
power
77 125 155
MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.

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In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:

l Manages and configures other modules of the boards.

l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

l Writes and reads register

l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.2.4 Front Panel

On the front panel of the EFT8, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-4 shows the appearance of the front panel of the EFT8.

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Figure 7-4 Front panel of the EFT8

EFT8
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage of
the interfaces.

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Table 7-5 Optical interfaces of the EFT8

Interface Interface Type Usage

FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE5 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE6 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE7 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE8 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-6 lists the pins of the RJ-45 interface.

Table 7-6 Pins of the RJ-45 of the EFT8

Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

6 Receiving negative

7 Grounding

8 Grounding

7.2.5 Valid Slots

The EFT8 can be used with the ETF8 and EFF8.

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Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8
and EFF8.

Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX
OSN 1500A
Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8

Slot 12 Without the interface board

Slot 13 Without the interface board

Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX
OSN 1500B
Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8

Slot 11 Without the interface board

Slot 12 Slot 14

Slot 13 Slot 16

7.2.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8.
You can use the T2000 to set the following parameters for the EFT8:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.2.7 Technical Specifications

The specifications of the EFT8 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFT8 is 26 W.

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7.3 EFT8A
This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.

7.3.1 Version Description

The functional version of the EFT8A board is N1.
7.3.2 Function and Feature
The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.
7.3.3 Working Principle and Signal Flow
The EFT8A consists of the ethernet access module, mapping module, interface converting
module, communication and control module and so on.
7.3.4 Front Panel
On the front panel of the EFT8A, there are indicators, interfaces and barcode.
7.3.5 Valid Slots
The EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.3.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT8A.
7.3.7 Technical Specifications
The specifications of the EFT8A cover the mechanical specifications and power consumption.

7.3.1 Version Description

The functional version of the EFT8A board is N1.

7.3.2 Function and Feature

The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-9 lists the functions and features of the EFT8A.

Table 7-9 Functions and features of the EFT8A

Function and EFT8A

Feature

Basic function Transparently transmits 8 x FE services.

Specification of the Supports 10Base-T/100Base-TX signals. The optical interfaces

optical interface comply with IEEE 802.3u.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink 622 Mbit/s.

bandwidth

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Function and EFT8A

Feature

Number of 8.
VCTRUNKs

Encapsulation Supports HDLC, LAPS, and GFP-F.

format

Mapping granularity Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

Ethernet service type Supports EPL.

MPLS Not supported.

VLAN Supports VLAN transparent transmission.

LPT Supports the LPT in the GFP-carrying mode.

CAR Not supported.

ETH-OAM Supports the ETH-OAM in compliance with 802.1ag. The EFT8

supports CC for the multicast.

Flow control Supports the IEEE 802.3x flow control based on FE port.
function

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

ETH-OAM Not supported.

Test frame Receives and transmits GFP test frames.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

7.3.3 Working Principle and Signal Flow

The EFT8A consists of the ethernet access module, mapping module, interface converting
module, communication and control module and so on.
Figure 7-5 shows the block diagram for the functions of the EFT8A.

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Figure 7-5 Block diagram for the functions of the EFT8A

ENCP Cross-connect unit

FE Ethernet Interface
access VCP converting
module module
DENCP Cross-connect unit

Mapping module

Laser
LOS
shutdown

Communication Communication
and control SCC unit
Reference clock and frame header
module SCC unit

+3.3 V Fuse - 48 V/-60V

DC/DC
converter - 48 V/-60V
Clock module +1.5 V
+1.8 V DC/DC Fuse +3.3 V
+2.5 V converter +3.3 V backup
power
77 125 155
MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.3.4 Front Panel

On the front panel of the EFT8A, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-6 shows the appearance of the front panel of the EFT8A.

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Figure 7-6 Front panel of the EFT8A

EFT8A

STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type and
usage of the interfaces.

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Table 7-10 Optical interfaces of the EFT8A

Interface Interface Type Usage

FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE5 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE6 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE7 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE8 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-11 lists the pins of the RJ-45 interface.

Table 7-11 Pins of the RJ-45 of the EFT8A

Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

6 Receiving negative

7 Grounding

8 Grounding

7.3.5 Valid Slots

The EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

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7.3.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8A.
You can use the T2000 to set the following parameters for the EFT8A:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.3.7 Technical Specifications

The specifications of the EFT8A cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFT8A is 26 W.

7.4 EGT2
This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.

7.4.1 Version Description

The functional version of the EGT2 board is N1.
7.4.2 Function and Feature
The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.4.3 Working Principle and Signal Flow
The EGT2 consists of the ethernet access module, mapping module, interface converting
module, interface converting module, Communication and Control Module and so on.
7.4.4 Front Panel
On the front panel of the EGT2, there are indicators, interfaces and barcode.
7.4.5 Valid Slots
The EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.4.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGT2 indicates the optical interface type.

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7.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGT2.
7.4.8 Technical Specifications
The specifications of the EGT2 cover the optical interface specifications, mechanical
specifications and power consumption.

7.4.1 Version Description

The functional version of the EGT2 board is N1.

7.4.2 Function and Feature

The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-12 lists the functions and features of the EGT2.

Table 7-12 Functions and features of the EGT2

Function and EGT2

Feature

Basic function Transparently transmits 2 x GE services.

Specification of The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

the optical interfaces. The optical interfaces support the auto-negotiation, compliant
interface with IEEE 802.3z. The optical interfaces use the hot-swappable optical
module SFP. When multimode optical fiber is used, the maximum
transmission distance is 550 m. When single-mode optical fiber is used,
the maximum transmission distance is 10 km. The optical modules can
be used for different requirements for the transmission distance, such as
40 km and 70 km.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink 2.5 Gbit/s.

bandwidth

Number of 2.
VCTRUNKs

Encapsulation Supports HDLC, LAPS, and GFP-F.

format

Mapping Supports VC-4, VC-3, VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

granularity

Ethernet service Supports EPL.

type

MPLS Not supported.

VLAN Supports VLAN transparent transmission.

LPT Supports the LPT in the GFP-carrying mode.

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Function and EGT2

Feature

CAR Not supported.

Flow control Supports the IEEE 802.3x flow control based on GE port.
function

LCAS Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

ETH-OAM Not supported.

Test frame Receives and transmits Ethernet test frames.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

7.4.3 Working Principle and Signal Flow

The EGT2 consists of the ethernet access module, mapping module, interface converting
module, interface converting module, Communication and Control Module and so on.
Figure 7-7 shows the block diagram for the functions of the EGT2.

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Figure 7-7 Block diagram for the functions of the EGT2

ENCP Cross-connect unit

GE Ethernet Interface
access VCP converting
module module
DENCP Cross-connect unit

Mapping module

Laser
LOS
shutdown

Communication Communication
and control SCC unit
Reference clock and frame header
module SCC unit

+3.3 V Fuse - 48 V/-60V

DC/DC
converter - 48 V/-60V
Clock module +1.5 V
+1.8 V DC/DC Fuse +3.3 V
+2.5 V converter +3.3 V backup
power
77 125 155
MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.4.4 Front Panel

On the front panel of the EGT2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-8 shows the appearance of the front panel of the EGT2.

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Figure 7-8 Front panel of the EGT2

EGT2

STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

EGT2

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usage
of the interfaces.

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Table 7-13 Optical interfaces of the EGT2

Interface Interface Type Usage

IN1/OUT1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

IN2/OUT2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.4.5 Valid Slots

The EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGT2 indicates the optical interface type.
Table 7-14 lists the relation between the board feature code and optical interface type for the
EGT2.

Table 7-14 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN1EGT210 10 1000Base-SX (0.55 km)

SSN1EGT211 11 1000Base-LX (10 km)

SSN1EGT212 12 1000Base-ZX (40 km)

SSN1EGT213 13 1000Base-ZX (70 km)

7.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGT2.
You can use the T2000 to set the following parameters for the EGT2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.4.8 Technical Specifications

The specifications of the EGT2 cover the optical interface specifications, mechanical
specifications and power consumption.

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Optical Interface Specifications

Table 7-15 lists the specifications of the interfaces of the EGT2.

Table 7-15 Specifications of the optical interfaces of the EGT2

Item Specification

Optical 1000Base-ZX 1000Base-ZX 1000Base-LX 1000Base-SX

interface type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched –4 to +2 –2 to +5 –9 to –3 –9.5 to 0
optical power
(dBm)

Central 1480 to 1580 1270 to 1355 1270 to 1355 770 to 860

wavelength
(nm)

Overload –3 –3 –3 0
optical power
(dBm)

Receiver –22 –23 –19 –17

sensitivity
(dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGT2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGT2 is 29 W.

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7.5 EFS0
This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.

7.5.1 Version Description

The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is
stopped.
7.5.2 Function and Feature
The EFS0 supports Layer 2 switching, MPLS and broadcast.
7.5.3 Working Principle and Signal Flow
The EFS0 consists of the ethernet access module, network processor module, mapping module,
interface converting module and so on.
7.5.4 Front Panel
On the front panel of the EFS0, there are indicators, interfaces and barcode.
7.5.5 Valid Slots
The EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.
7.5.6 TPS Protection
The EFS0 supports the 1:N TPS protection.
7.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the EFS0.
7.5.8 Technical Specifications
The specifications of the EFS0 cover the mechanical specifications and power consumption.

7.5.1 Version Description

The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is
stopped.

The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0.

Table 7-16 lists the details on the versions of the EFS0 board.

Table 7-16 Version Description of the EFS0

Item Description

Functional The EFS0 has three versions, N1, N2, and N4.
version

Difference The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.

The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.
The N1EFS0 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.
The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,
and port+VLAN PRI flow.

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Item Description

Replaceability The N2EFS0 supports the board version replacement function and can
replace the N1EFS0.
The N4EFS0 supports the board version replacement function and can
replace the N1EFS0 and N2EFS0.

7.5.2 Function and Feature

The EFS0 supports Layer 2 switching, MPLS and broadcast.

Table 7-17 lists the functions and features of the EFS0.

Table 7-17 Functions and features of the EFS0

Function and EFS0

Feature

Basic function Processes 8 x FE services.

Used with the Accesses 8 x FE signals at the electrical interface when used with the
interface board ETF8.
Accesses 8 x FE signals at the optical interface when used with the
EFF8.
Realizes the TPS protection for 8 x FE signals at the electrical interface
when used with the ETS8 and TSB8.

Specification of the Supports the 10Base-T/100Base-TX signals when used with the ETF8.
optical interface Supports the 100Base-FX signals when used with the EFF8. The optical
inerfaces comply with IEEE 802.3u.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames
frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo
frames with a length less than 9600 bytes.

Max. uplink The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.
bandwidth The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.
The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s.

Number of The number of the VCTRUNKs of the N1EFS0 is 12.

VCTRUNKs The number of the VCTRUNKs of the N2EFS0 is 24.
The number of the VCTRUNKs of the N4EFS0 is 24.

Mapping Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

granularity

Encapsulation GFP-F.
format

EPL Supports transparent transmission based on port.

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Function and EFS0

Feature

EVPL Supports EVPL services based on port+VLAN that use the frame
encapsulation formats of MartinioE and stack VLAN.

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.

Supports the Layer 2 forwarding function.
Supports switching at the client and SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of static MAC route.
The N1EFS0 and N2EFS0 support the dynamic query of the MAC
address.
The N4EFS0 does not support the dynamic query of the MAC address.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16. The maximum number of logical ports for
each VB is 30.

EVPLAN Supports data isolation based on VB+VLAN.

Supports the query of the number of the learned MAC addresses
according to VB+VLAN or VB+LP.

MTU The packet length can be set from 1518 bytes to 9600 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

MPLS Supported.

VLAN Compliant with IEEE 802.1q/p.

VLAN Supported (4k VLAN).

convergence

RSTP Supports broadcast packet suppression and RSTP, compliant with

IEEE 802.1w.

Multicast (IGMP Supported.

Snooping)

ETH-OAM The N4EFS0 supports CC for the multicast, LB test for the unicast,
Link Trance test(LT), loop detection (LD), auto-negotiation, fault
diagnosis, and link performance detection.

CAR Supported.
The granularity is 64 kbit/s.

Service based The N1EFS0 supports the port service, port+VLAN ID service, and
QoS flow port+VLAN PRI service.
classification The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,
and port+VLAN PRI flow.

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Function and EFS0

Feature

LCAS Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

LPT Supports the LPT function, which can be enabled or disabled.

Link Aggreation Supported.

Flow control Supports the IEEE 802.3x flow control based on port.
function

Test frame Receives and transmits Ethernet test frames.

Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).
Supports inloop and outloop at the VC-3 level.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

7.5.3 Working Principle and Signal Flow

The EFS0 consists of the ethernet access module, network processor module, mapping module,
interface converting module and so on.
Figure 7-9 shows the block diagram for the functions of the EFS0.

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Figure 7-9 Block diagram for the functions of the EFS0

E Cross-connect unit
N
C
Control P
FE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter Fuse
+3.3 V backup
power
50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:

l Multi-protocol label switching (MPLS)

l L2MPLS VPN
l Ethernet/ VLAN

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In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP-F
format. The concatenation is processed. The LCAS function is supported. Ethernet signals are
then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:

l Manages and configures other modules of the boards.

l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

l Writes and reads register

l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.5.4 Front Panel

On the front panel of the EFS0, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-10 shows the appearance of the front panel of the EFS0.

Figure 7-10 Front panel of the EFS0

EFS0

STAT
ACT
PROG
SRV

EFS0

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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8,
EFF8 or ETS8.

7.5.5 Valid Slots

The EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.
When the N1EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack, the
bandwidth is 622 Mbit/s.
When the N2EFS0 or N4EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack,
the bandwidth is 1.25 Gbit/s.
The EFS0 can be used with the ETF8, EFF8 and ETS8.
Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and
ETS8.

Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and ETS8 in
the OptiX OSN 1500B subrack
Valid Slot for the EFS0 Corresponding Slot for the ETF8, EFF8 and ETS8

Slot 12 Slot 14

Slot 13 Slot 16

7.5.6 TPS Protection

The EFS0 supports the 1:N TPS protection.
Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.

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Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B
subrack
Slot 14 TSB8
Slot 18 PIU
Slot 15

Slot 16 ETS8
Slot 19 PIU
Slot 17
Slot 11 Slot 6
Slot 20 Slot 12 EFS0 Protection Slot 7

FAN Slot 13 EFS0 Working Slot 8

Slot 4 CXL16/4/1 Slot 9 EOW
Slot 5 CXL16/4/1 Slot 10 AUX

As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed in
slot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot
14, is used with the protection EFS0.

7.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the EFS0.
You can use the T2000 to set the following parameters for the EFS0:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.5.8 Technical Specifications

The specifications of the EFS0 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS0 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFS0 is 35 W.

7.6 EFS4
This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.

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7.6.1 Version Description

The EFS4 has two functional versions, N1 and N2. The two versions have different maximum
uplink bandwidth.
7.6.2 Function and Feature
The EFS4 supports Layer 2 switching, MPLS and broadcast.
7.6.3 Working Principle and Signal Flow
The EFS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication Module and the
power supply module
7.6.4 Front Panel
On the front panel of the EFS4, there are indicators, interfaces and barcode.
7.6.5 Valid Slots
The EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.6.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFS4.
7.6.7 Technical Specifications
The specifications of the EFS4 cover the mechanical specifications and power consumption.

7.6.1 Version Description

The EFS4 has two functional versions, N1 and N2. The two versions have different maximum
uplink bandwidth.
Table 7-19 lists the details on the versions of the EFS4 board.

Table 7-19 Version Description of the EFS4

Item Description

Functional The EFS4 has two versions, N1 and N2.

version

Difference The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.

The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.
The N2EFS4 supports the board version replacement function.

Replaceability The N2EFS4 supports the board version replacement function and can
replace the N1EFS4.

7.6.2 Function and Feature

The EFS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-20 lists the functions and features of the EFS4.

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Table 7-20 Functions and features of the EFS4

Function and EFS4
Feature

Basic function Processes 4 x FE services.

Specification of Supports 10Base-T/100Base-TX signals. The optical interfaces comply

the optical with IEEE 802.3u.
interfaces

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames
frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames
with a length less than 9600 bytes.

Max. uplink The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.
bandwidth The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.

Number of The number of the VCTRUNKs of the N1EFS4 is 12.

VCTRUNKs The number of the VCTRUNKs of the N2EFS4 is 24.

Mapping Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

granularity

Encapsulation GFP-F.
format

EPL Supports transparent transmission based on port.

EVPL Supports EVPL services based on port+VLAN that use the frame
encapsulation formats of MartinioE and stack VLAN.

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.

Supports the Layer 2 forwarding function and switching at the client and
SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of static MAC route.
The N1EFS4 supports the dynamic query of the MAC address.
The N2EFS4 does not support the dynamic query of the MAC address.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16 (a maximum of two VBs for the N2EGS2). The
maximum number of logical ports for each VB is 30.

EVPLAN Supports data isolation based on VB+VLAN.

Supports the query of the number of the learned MAC addresses
according to VB+VLAN or VB+LP.

MTU The packet length can be set from 1518 bytes to 9600 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

MPLS Supported.

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Function and EFS4

Feature

VLAN Compliant with IEEE 802.1q/p.

VLAN Supported (4k VLAN).

convergence

RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE
802.1w.

Multicast (IGMP Supported.

Snooping)

ETH-OAM The N2EFS4 supports CC for the multicast, LB test for the unicast, Link
Trance test(LT), loop detection (LD), auto-negotiation, fault diagnosis,
and link performance detection.

CAR Supported.
The granularity is 64 kbit/s.

Service based The N1EFS4 supports the port service, port+VLAN ID service, and port
+VLAN PRI service.

QoS flow The N2EFS4 supports the port flow, port+VLAN ID flow, and port
classification +VLAN PRI flow.

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT Supports the LPT function, which can be enabled or disabled.

Link Aggreation Supported.

Flow control Supports the IEEE 802.3x flow control based on port.
function

Test frame Receives and transmits Ethernet test frames.

Loopback Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports
function inloop and outloop at the VC-3 level.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

7.6.3 Working Principle and Signal Flow

The EFS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication Module and the
power supply module

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Figure 7-12 shows the block diagram for the functions of the EFS4.

Figure 7-12 Block diagram for the functions of the EFS4

E Cross-connect unit
N
C
Control P
FE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter Fuse
+3.3 V backup
power
50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l Multi-protocol label switching (MPLS)
l L2MPLS VPN

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l Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP-F
format. The concatenation is processed. The LCAS function is supported. Ethernet signals are
then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.6.4 Front Panel

On the front panel of the EFS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-13 shows the appearance of the front panel of the EFS4.

Figure 7-13 Front panel of the EFS4

EFS4

STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

EFS4

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Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usage
of the interfaces.

Table 7-21 Optical interfaces of the EFS4

Interface Interface Type Usage

FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-22 lists the pins of the RJ-45 interface.

Table 7-22 Pins of the RJ-45 of the EFS4

Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

6 Receiving negative

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Pin Description

7 Grounding

8 Grounding

7.6.5 Valid Slots

The EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFS4.
You can use the T2000 to set the following parameters for the EFS4:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.6.7 Technical Specifications

The specifications of the EFS4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFS4 is 30 W.

7.7 EGS2
This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.

7.7.1 Version Description

The EGS2 has two functional versions, N1 and N2. The two versions have different functions
and features.
7.7.2 Function and Feature
The EGS2 supports Layer 2 switching, MPLS and broadcast.

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7.7.3 Working Principle and Signal Flow

The EGS2 consists of the ethernet access module, network processor module, mapping module,
interface converting module, communication and control module and so on.
7.7.4 Front Panel
On the front panel of the EGS2, there are indicators, interfaces and barcode.
7.7.5 Valid Slots
The EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.7.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS2 indicates the optical interface type.
7.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the EGS2.
7.7.8 Technical Specifications
The specifications of the EGS2 cover the optical interface specifications, mechanical
specifications and power consumption.

7.7.1 Version Description

The EGS2 has two functional versions, N1 and N2. The two versions have different functions
and features.
Table 7-23 lists the details on the versions of the EGS2 board.

Table 7-23 Version Description of the EGS2

Item Description

Functional The EGS2 has two versions, N1 and N2.

version

Difference The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. The
maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.
The number of the VCTRUNKs of the N1EGS2 is 24. The number of the
VCTRUNKs of the N2EGS2 is 48.
The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC.
The encapsulation format of the N1EGS2 is GFP.
The N1EGS2 supports the MartinioP encapsulation of the MPLS. The
N2EGS2 does not support the MartinioP encapsulation.
The N2EGS2 supports the board version replacement function.

Replaceability On certain conditions, the N2EGS2 can replace the N1EGS2. When the
N2EGS2 replaces the N1EGS2, the N1EGS2 should not be configured
with MartinioP or CoS of the MPLS.

7.7.2 Function and Feature

The EGS2 supports Layer 2 switching, MPLS and broadcast.

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Table 7-24 lists the functions and features of the EGS2.

Table 7-24 Functions and features of the EGS2

Function and EGS2
Feature

Basic function Processes 2 x GE services.

Specification of The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

the optical interfaces.
interface The optical interfaces support the auto-negotiation, compliant with IEEE
802.3z. The optical interfaces use the hot-swappable optical module
SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the maximum
transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frames
frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo
frames with a length less than 9600 bytes.

Max. uplink The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s.
bandwidth The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.

Number of The number of the VCTRUNKs of the N1EGS2 is 24.

VCTRUNKs The number of the VCTRUNKs of the N2EGS2 is 48.

Mapping Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).

granularity

Encapsulation The encapsulation formats for the N1EGS2 are GFP-F, LAPS, and
format HDLC.
The encapsulation format for the N2EGS2 is GFP-F.

EPL Supports transparent transmission based on port.

EVPL Not supported by the N1EGS2.

The N2EGS2 supports EVPL services based on port+VLAN that use the
frame encapsulation formats of MartinioE and stack VLAN.

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Function and EGS2

Feature

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.

Supports the Layer 2 forwarding function and switching at the client and
SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of the static MAC route.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 2. The maximum number of logical ports for each
VB is 30.

EVPLAN Supports data isolation based on VB+VLAN.

MTU The packet length can be set from 1518 bytes to 9600 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

MPLS Not supported by the N1EGS2.

Supported by the N2EGS2.

VLAN Compliant with IEEE 802.1q/p.

VLAN Supported (4k VLAN).

convergence

RSTP Not supported by the N1EGS2.

The N2EGS2 supports broadcast packet suppression and RSTP,
compliant with IEEE 802.1w.

Multicast (IGMP Not supported by the N1EGS2.

Snooping) Supported by the N2EGS2.

CAR Supported.
The granularity is 64 kbit/s.

Service based The N1EGS2 supports the port service, port+VLAN ID service, and port
QoS flow +VLAN PRI service.
classification The N2EGS2 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.

LCAS Not supported by the N1EGS2.

The N2EGS2 supports LCAS, compliant with ITU-T G.7042.
Dynamically increases or decreases the bandwidth, and realizes the
protection function.

LPT Supports the LPT function, which can be enabled or disabled.

Link Aggreation Supported.

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Function and EGS2

Feature

Flow control Supports the IEEE 802.3x flow control based on port.
function

Test frame Receives and transmits Ethernet test frames.

Loopback Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports
function inloop and outloop at the VC-3 level.

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
event

7.7.3 Working Principle and Signal Flow

The EGS2 consists of the ethernet access module, network processor module, mapping module,
interface converting module, communication and control module and so on.
Figure 7-14 shows the block diagram for the functions of the EGS2.

Figure 7-14 Block diagram for the functions of the EGS2

E Cross-connect unit
N
C
Control P
GE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter Fuse
+3.3 V backup
power
50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

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Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l Multi-protocol label switching (MPLS)
l L2MPLS VPN
l Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. The LCAS function is supported. Ethernet signals are then
converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

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Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.7.4 Front Panel

On the front panel of the EGS2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-15 shows the appearance of the front panel of the EGS2.

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Figure 7-15 Front panel of the EGS2

EGS2

STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

EGS2

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usage
of the interfaces.

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Table 7-25 Optical interfaces of the EGS2

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.7.5 Valid Slots

The EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.7.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS2 indicates the optical interface type.
Table 7-26 lists the relation between the board feature code and optical interface type for the
EGS2.

Table 7-26 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN2EGS210 10 1000Base-SX (0.55 km)

SSN2EGS211 11 1000Base-LX (10 km)

SSN2EGS212 12 1000Base-ZX (40 km)

SSN2EGS213 13 1000Base-ZX (70 km)

7.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGS2.
You can use the T2000 to set the following parameters for the EGS2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.7.8 Technical Specifications

The specifications of the EGS2 cover the optical interface specifications, mechanical
specifications and power consumption.

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Optical Interface Specifications

Table 7-27 lists the specifications of the interfaces of the EGS2.

Table 7-27 Specifications of the optical interfaces of the EGS2

Item Specification

Optical interface 1000Base-ZX 1000Base-ZX 1000Base-SX 1000Base-LX

type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched optical –4 to +2 –2 to +5 –9 to –3 –9.5 to 0

power (dBm)

Central 1480 to 1580 1270 to 1355 1270 to 1355 770 to 860

wavelength (nm)

Overload optical –3 –3 –3 0
power (dBm)

Receiver –22 –23 –19 –17

sensitivity (dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS2 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGS2 is 43 W.

7.8 EMS4
This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and
convergence board, in terms of the version, function, principle, front panel, configuration and
specifications.

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7.8.1 Version Description

The functional version of the EMS4 board is N1.
7.8.2 Function and Feature
The EMS4 supports Layer 2 switching, link convergence, and multicast.
7.8.3 Working Principle and Signal Flow
The EMS4 consists of the ethernet access module, mapping module, interface conversion module
and so on.
7.8.4 Front Panel
On the front panel of the EMS4, there are indicators, interfaces and barcode.
7.8.5 Valid Slots
The EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the
interface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500B
subrack.
7.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EMS4 indicates the optical interface type.
7.8.7 Board Protection
The EMS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.
7.8.8 Board Configuration Reference
You can use the T2000 to set parameters for the EMS4.
7.8.9 Technical Specifications
The specifications of the EMS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

7.8.1 Version Description

The functional version of the EMS4 board is N1.

7.8.2 Function and Feature

The EMS4 supports Layer 2 switching, link convergence, and multicast.
Table 7-28 lists the functions and features of the EMS4.

Table 7-28 Functions and features of the EMS4

Function and EMS4
Feature

Basic function Accesses and processes 4 x GE services, and processes 16 x FE

services.

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Function and EMS4

Feature

Used with the Accesses 16 x FE signals at the electrical interface when used with
interface board the ETF8.
Accesses 16 x FE signals at the optical interface when used with the
EFF8.
Accesses 8 x FE signals at the electrical interface and 8 x FE signals
at the optical interface when used with the ETF8 and EFF8.

Specification of the The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

optical interface interfaces. Supports the auto-negotiation, compliant with IEEE
802.3z.
The optical interfaces use the hot-swappable optical module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.
Supports 10Base-T/100Base-TX signals when used with the ETF8.
Supports 100Base-FX signals when used with the EFF8.
The optical interfaces are compliant with IEEE 802.3u.

Format of service Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE
frames 802.1p TAG.
Supports frames with a length ranging from 64 bytes to 9216 bytes.
Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink 2.5 Gbit/s.

bandwidth

Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC12-Xv (X≤64),

VC3-Xv (X≤24), and VC4-Xv (X≤8).

VCG A maximum of 64.

Encapsulation format Supports GFP-F, LAPS, and HDLG.

EPL Supports transparent transmission based on port. Supports 42 x

bidirectional services.

EVPL Supports EVPL services based on port+VLAN. Supports a

maximum of 8000 links.
Supports EVPL services based on QinQ. Supports service
forwarding based on port.

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Function and EMS4

Feature

EPLAN Supports the Layer 2 forwarding function and switching at the client
and SDH sides.
Supports 1k MAC switching or 4K VLAN MAC switching.
Supports the function of self-learning the source MAC address.
The length of the MAC address table is 128k. The aging time of the
MAC address can be set and queried.
The configuration of static MAC routes is supported.
Supports the creation, deletion and query of VB. The maximum
number of VBs is two.

EVPLAN Supports data isolation based on VB+VLAN.

VLAN Supports VLAN and QinQ, the addition, deletion and switching of
VLAN labels, compliant with IEEE 802.1q/p.

MTU The packet length can be set from 1518 bytes to 9216 bytes. After
the packet length setting takes effect, the maximum length of the
packets entering or going out from the IP port are limited by the MTU
setting.

RSTP Not supports broadcast packet suppression

Supports RSTP, compliant with IEEE 802.1w.

Multicast(IGMP- Supported.
Snooping)

ETH-OAM Supports CC for the multicast and LB test for the unicast, loop
detection (LD), auto-negotiation, fault diagnosis, and link
performance detection..

Test frame Supported.

Service mirroring Not supported.

Link convergence Supports manual link convergence and static link convergence.

VLAN convergence Supported (4096 VLAN) in QinQ service.

Supported (4095 VLAN) in EVPL service.

Protection Supports the 1+1 hot backup for the board and the PPS protection.

CAR Supported.
The granularity is 64 kbit/s.

Flow classification Supports the PORT flow, PORT+VLAN ID flow and PORT
+SVLAN ID flow.

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT Supported.

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Function and EMS4

Feature

Distributed link Supports inter-board link aggregation.

aggregation

Flow control function Supports the IEEE 802.3x flow control based on port.

Loopback function Supports inloop at the Ethernet port (PHY layer) and outloop at the
SDH side.

Ethernet performance Supports Ethernet performance monitoring RMON at the port level
monitoring and VCTRUNK.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

7.8.3 Working Principle and Signal Flow

The EMS4 consists of the ethernet access module, mapping module, interface conversion module
and so on.
Figure 7-16 shows the block diagram for the functions of the EMS4.

Figure 7-16 Block diagram for the functions of the EMS4

E Cross-connect unit
N
C
Control P
GE/FE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to
the EGS4 through the backplane. The interface module transmits the signals to the encapsulation

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and mapping module. The encapsulation and mapping module then compensates for the time
delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,
strips the data packets, and transmits the data packets to the service processing module. Finally,
the service processing module converges the data and transmits the data through the ethernet
physical interface.

In the Receive Direction

The interface module accesses the signals from external Ethernet device, such as the Ethernet
switch and router. The interface module then decodes the signals and converts the series signals
into parallel signals. The service processing module then aligns the frames, strips the preamble
code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance.
In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats)
according to the service type and configuration.

If the switch is not required on the local, the data services are forwarded to other local ports
according to the configuration. If the data services are to be transmitted to the upstream SDH
line, the encapsulation module encapsulates the Ethernet frames in the GFP, LAPS or HDLC
formats. Finally, the encapsulation module transmits the frames to the mapping module, which
maps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame.
The interface module then transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:

l Ethernet/ VLAN

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

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Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F or
HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet
signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V.

7.8.4 Front Panel

On the front panel of the EMS4, there are indicators, interfaces and barcode.

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Appearance of the Front Panel

Figure 7-17 shows the appearance of the front panel of the EMS4.

Figure 7-17 Front panel of the EMS4

EMS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

LINK ACT

EMS4

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

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For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists the
type and usage of the optical interfaces.

Table 7-29 Optical interfaces of the EMS4

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT3/IN3 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT4/IN4 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.8.5 Valid Slots

The EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the
interface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500B
subrack.

The EMS4 can be used with the ETF8 and EFF8.

Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for the
ETF8 and EFF8.

Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500A subrack

Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8

Slot 12 Without the interface board

Slot 13 Without the interface board

Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500B subrack

Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8

Slot 11 Without the interface board

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Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

7.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EMS4 indicates the optical interface type.
Table 7-32 lists the relation between the board feature code and optical interface type for the
EMS4.

Table 7-32 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN1EMS410 10 1000Base-LX (0.55 km)

SSN1EMS411 11 1000Base-SX (10 km)

SSN1EMS412 12 1000Base-ZX (40 km)

SSN1EMS413 13 1000Base-ZX (70 km)

7.8.7 Board Protection

The EMS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.

Protection Principle
When the BPS protection is performed to the EMS4, the GE and FE ports use the single-fed
dual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, which
may be connected to many communication devices. Normally, the active board is working and
services are transmitted in the two directions of the active link. On the backup link, the EMS4
disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdown
state. At the same time, the opposite board enables the transmission and does not transmit
services. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. The
solid lines in Figure 7-18 show how the EMS4 normally works.

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Figure 7-18 Normal working of the EMS4

Active
communication
No.1 equipment
A
Active
Standby
EMS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EMS4 No.3 communication
equipment
C
Standby
communication
equipment

l BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and
3 are all switched to the standby EMS4 and corresponding communication equipment.

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Figure 7-19 Principle of the BPS protection for the EMS4

Active
communication
No.1 equipment
A
Active
Standby
EMS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EMS4 No.3 communication
equipment
C
Standby
communication
equipment

l PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed.
Only the service numbered 1 is switched to the standby EMS4 and the standby communication
equipment.

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Figure 7-20 Principle of the PPS protection for the EMS4

Active
communication
No.1 equipment
A
Active
Standby
EMS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EMS4 No.3 communication
equipment
C
Standby
communication
equipment

The conditions that trigger the protection for the EMS4 are as follows:
l Fault at at the PHY layer of the MAC port, also Linkdown
l Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the board-level protection is performed, FE ports only support the 100M full duplex mode
and GE ports support the auto-negotiation and 1000M full duplex mode.

Board Configuration
Two EMS4 boards should be configured for the protection. One EMS4 is the active board and
the other is the standby board. For the configuration of the EMS4 board protection, it is required
that the access capacity of the protection slot must be not less than the access capacity of the
working slot.

7.8.8 Board Configuration Reference

You can use the T2000 to set parameters for the EMS4.
You can use the T2000 to set the following parameters for the EMS4:

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l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.8.9 Technical Specifications

The specifications of the EMS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-33 lists the specifications of the interfaces of the EMS4.

Table 7-33 Specifications of the optical interfaces of the EMS4

Item Specification

Optical interface 1000Base-ZX 1000Base-ZX 1000Base-SX 1000Base-LX

type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched optical –4 to +2 –2 to +5 –9 to –3 –9.5 to 0

power (dBm)

Central 1480 to 1580 1270 to 1355 1270 to 1355 770 to 860

wavelength (nm)

Overload optical –3 –3 –3 0
power (dBm)

Receiver –22 –23 –19 –17

sensitivity (dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EMS4 is 65 W if
the EMS4 is not used with an interface board.
In the normal temperature (25℃), the maximum power consumption of the EMS4 is 75 W if
the EMS4 is used with an interface board.

7.9 EGS4
This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.9.1 Version Description

The EGS4 has two functional versions, N1 and N3.
7.9.2 Function and Feature
The EGS4 supports Layer 2 switching, MPLS and broadcast.
7.9.3 Working Principle and Signal Flow
The EGS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.
7.9.4 Front Panel
On the front panel of the EGS4, there are indicators, interfaces and barcode.
7.9.5 Valid Slots
The EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4 indicates the optical interface type.
7.9.7 Board Protection
The EGS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.
7.9.8 Board Configuration Reference
You can use the T2000 to set parameters for the EGS4.
7.9.9 Technical Specifications
The specifications of the EGS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

7.9.1 Version Description

The EGS4 has two functional versions, N1 and N3.
Table 7-34 lists the details on the versions of the EGS4 board.

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Table 7-34 Version Description of the EGS4

Item Description

Functional version The EGS4 has two functional versions, N1 and N3.

Difference The N1EGS4 supports the binding to a maximum of 1008 VC12s.

The N3EGS4 supports the binding to a maximum of 504 VC12s:
l VC4/VC3:These VC4s/VC3s belong in the following two ranges:
VC4-1 to VC4-8 and VC4-9 to VC4-16. The VC4s/VC3s of only
one range can be bound at a time.
l VC12:These VC12s belong in the following two ranges: VC4-1 to
VC4-4 and VC4-9 to VC4-12. The VC12s of only one range can
be bound at a time.

Replaceability The versions cannot be replaced by each other.

7.9.2 Function and Feature

The EGS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-35 lists the functions and features of the EGS4.

Table 7-35 Functions and features of the EGS4

Function and EGS4
Feature

Basic function Accesses and processes 4 x GE services.

Specification of the The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

optical interface interfaces.
The optical interfaces support the auto-negotiation, compliant with
IEEE 802.3z. The optical interfaces use the hot-swappable optical
module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.

Format of service Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE
frames 802.1p TAG.
Supports frames with a length ranging from 64 bytes to 9216 bytes.
Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink 2.5 Gbit/s.

bandwidth

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Function and EGS4

Feature

Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC12-Xv (X≤64),

VC3-Xv (X≤24), and VC4-Xv (X≤8).

VCG 64 to the maximum.

Encapsulation format Supports GFP-F, LAPS, and HDLG.

EPL Supports transparent transmission based on port.

EVPL Supports EVPL services based on port+VLAN. Supports a maximum

of 8000 links.
Supports EVPL services based on QinQ. Supports service forwarding
based on port.

EPLAN Supports the Layer 2 forwarding function and switching at the client
and SDH sides.
Supports 1k MAC switching or 4k VLAN MAC switching.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 128k. The aging time of the MAC
address can be set and queried. The configuration of static MAC
routes is supported.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of VB. The maximum
number of VBs is two.

VLAN Supports VLAN and QinQ, the addition, deletion and switching of
VLAN labels, compliant with IEEE 802.1q/p.

MTU The packet length can be set from 1518 bytes to 9216 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

RST Not supports broadcast packet suppression

Supports RSTP, compliant with IEEE 802.1w.

Multicast(IGMP- Supported.
Snooping)

ETH-OAM Supports CC for the multicast and LB test for the unicast, loop
detection (LD), auto-negotiation, fault diagnosis, and link
performance detection...

Test frame Supported.

Service mirroring Not supported.

Link convergence Supports manual link convergence and static link convergence.

VLAN convergence Supported (4096 VLAN) in QinQ service.

Supported (4095 VLAN) in EVPL service.

Protection Supports the 1+1 hot backup for the board and the PPS protection.

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Function and EGS4

Feature

CAR Supported.
The granularity is 64 kbit/s.
N1EGS4 Supports 512 rate, EGS4 Supports 60 rate.

Flow classification Supports the port flow and port+VLAN ID flow.

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT Supported.

Distributed link Supports inter-board link aggregation.

aggregation

Flow control Supports the IEEE 802.3x flow control based on port.
function

Loopback function Supports inloop at the Ethernet port (PHY layer).

Ethernet Supports Ethernet performance monitoring RMON at the port level

performance and VCTRUNK.
monitoring

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

7.9.3 Working Principle and Signal Flow

The EGS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.
Figure 7-21 shows the block diagram for the functions of the EGS4.

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Figure 7-21 Block diagram for the functions of the EGS4

E Cross-connect unit
N
C
Control P
GE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter

50 77 125 155
MHz MHz MHz MHz

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to
the EGS4 through the backplane. The interface module transmits the signals to the encapsulation
and mapping module. The encapsulation and mapping module then compensates for the time
delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,
strips the data packets, and transmits the data packets to the service processing module. Finally,
the service processing module converges the data and transmits the data through the ethernet
physical interface.

In the Receive Direction

The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device,
such as the Ethernet switch and router. The interface module then decodes the signals and
converts the series signals into parallel signals. The service processing module then aligns the
frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics
for the Ethernet performance. In addition, the service processing module classifies the flow
(Ethernet or VLAN packet formats) according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local ports
according to the configuration. If the data services are to be transmitted to the upstream SDH
line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC
formats. Finally, the encapsulation module transmits the frames to the mapping module, which
maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then
transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E

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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:

l Ethernet/ VLAN

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F or
HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet
signals are then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:

l Manages and configures other modules of the boards.

l Performs inter-board communication through internal Ethernet interface.

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The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V.

7.9.4 Front Panel

On the front panel of the EGS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-22 shows the appearance of the front panel of the EGS4.

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Figure 7-22 Front panel of the EGS4

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

LINK ACT

EGS4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EGS4. Table 7-36 lists the
type and usage of the optical interfaces.

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Table 7-36 Optical interfaces of the EGS4

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT3/IN3 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT4/IN4 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.9.5 Valid Slots

The EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4 indicates the optical interface type.
Table 7-37 lists the relation between the board feature code and optical interface type for the
EGS4.

Table 7-37 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN1EGS410, 10 1000Base-SX (0.55 km)

SSN3EGS410

SSN1EGS411, 11 1000Base-LX (10 km)

SSN3EGS411

SSN1EGS412, 12 1000Base-ZX (40 km)

SSN3EGS412

SSN1EGS413, 13 1000Base-ZX (70 km)

SSN3EGS413

7.9.7 Board Protection

The EGS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.

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Protection Principle
When the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dual-
selective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which may
be connected to many communication devices. Normally, the active board is working and
services are transmitted in the two directions of the active link. On the standby link, the EGS4
disables the transmission of all ports. In this case, the ports of the opposite board are in the
Linkdown state. At the same time, the opposite board enables the transmission and does not
transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdown
state. The solid lines in Figure 7-23 show how the EGS4 normally works.

Figure 7-23 Normal working of the EGS4

Active
communication
No.1 equipment
A
Active Standby
EGS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EGS4 No.3 communication
equipment
C
Standby
communication
equipment

l BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The lines in Figure 7-24 show how the BPS protection is performed. The
services numbered 1, 2 and 3 are all switched to the standby EGS4 and corresponding
communication equipment.

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Figure 7-24 Principle of the BPS protection for the EGS4

Active
communication
No.1 equipment
A
Active Standby
EGS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EGS4 No.3 communication
equipment
C
Standby
communication
equipment

l PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed.
Only the service numbered 1 is switched to the standby EGS4 and the standby communication
equipment.

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Figure 7-25 Principle of the PPS protection for the EGS4

Active
communication
No.1 equipment
A
Active Standby
EGS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EGS4 No.3 communication
equipment
C
Standby
communication
equipment

The conditions that trigger the protection for the EGS4 are as follows:
l Fault at at the PHY layer of the MAC port, also Linkdown
l Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex
modes.

Board Configuration
Two EGS4 boards should be configured for the protection. One EGS4 is the active board and
the other is the standby board. For the configuration of the EGS4 board protection, it is required
that the access capacity of the protection slot must be not less than the access capacity of the
working slot.

7.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the EGS4.
You can use the T2000 to set the following parameters for the EGS4:

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l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.9.9 Technical Specifications

The specifications of the EGS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-38 lists the specifications of the interfaces of the EGS4.

Table 7-38 Specifications of the optical interfaces of the EGS4

Item Specification

Optical interface 1000Base-ZX 1000Base-ZX 1000Base-LX 1000Base-SX

type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched optical –4 to +2 –2 to +5 –9 to –3 –9.5 to 0

power (dBm)

Central 1480–1580 1270–1355 1270–1355 770–860

wavelength (nm)

Overload optical –3 –3 –3 0
power (dBm)

Receiver –22 –23 –19 –17

sensitivity (dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGS4 is 70 W.

7.10 EGS4A
This section describes the EGS4A, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.10.1 Version Description

The functional version of the EGS4A board is N2.
7.10.2 Function and Feature
The EGS4A supports Layer 2 switching, MPLS and broadcast.
7.10.3 Working Principle and Signal Flow
The EGS4A consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.
7.10.4 Front Panel
On the front panel of the EGS4A, there are indicators, interfaces and barcode.
7.10.5 Valid Slots
The EGS4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.10.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4A indicates the optical interface type.
7.10.7 Board Protection
The EGS4A supports the board protection switching (BPS).
7.10.8 Board Configuration Reference
You can use the T2000 to set parameters for the EGS4A.
7.10.9 Technical Specifications
The specifications of the EGS4A cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

7.10.1 Version Description

The functional version of the EGS4A board is N2.

7.10.2 Function and Feature

The EGS4A supports Layer 2 switching, MPLS and broadcast.
Table 7-39 lists the functions and features of the EGS4A.

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Table 7-39 Functions and features of the EGS4A

Function and EGS4A
Feature

Basic function Accesses and processes 4 x GE services.

Specification of the The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

optical interface interfaces.
The optical interfaces support the auto-negotiation, compliant with
IEEE 802.3z. The optical interfaces use the hot-swappable optical
module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.

Format of service Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE
frames 802.1p TAG.
Supports frames with a length ranging from 64 bytes to 9216 bytes.
Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink bandwidth 2.5 Gbit/s.

Mapping granularity VC4-4c, VC4-16c, VC3-Xv (X≤48), and VC4-Xv (X≤16).

VCG 32

Encapsulation format Supports GFP-F, LAPS, and HDLG.

EPL Supports transparent transmission based on port.

EVPL Support port+VLAN-based EVPL service and service forward.

Support QinQ-based EVPL service and service forward.
Support port-based service forward.

EPLAN Support Layer 2 switching.

Support self-learning of MAC address.
Support setting and querying the MAC address aging time. The
MAC address table has 64k entries.
Support configuration of static MAC route.
Support creating, deleting and querying a VB. The maximum
number of VBs is 30 and that of logic ports is 64 for each VB.

EVPLAN Support virtual bridge (VB) + VLAN based data isolation.

Support creating, deleting and querying the VLAN broadcast table.

VLAN Supports VLAN and QinQ, the addition, deletion and switching of
VLAN labels, compliant with IEEE 802.1q/p.

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Function and EGS4A

Feature

MTU The packet length can be set from 1518 bytes to 1535 bytes. After
the packet length setting takes effect, the maximum length of the
packets entering or going out from the IP port are limited by the
MTU setting.

RST Not support.

Multicast(IGMP- Not support.

Snooping)

ETH-OAM Support Multicast CC, LB testing, fault detection in compliance

with IEEE 802.1ag and 802.3ah.

Test frame Supported.

Service mirroring Not supported.

Link convergence Support manual link aggregation and static link aggregation.

VLAN convergence Supported (4096 VLAN).

Protection Supports the BPS protection.

CAR Support the settings of four parameters: CIR, CBS, PIR and PBS.

Flow classification Support the traffic classification based on PORT, PORT+VLAN,

PORT+VLAN+PRI, PORT+S and PORT+S+C.

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT Not supported.

Distributed link Supports inter-board link aggregation.

aggregation

Flow control function Supports the IEEE 802.3x flow control based on port.

Loopback function Supports inloop at the Ethernet port (PHY layer).

Ethernet performance Supports Ethernet performance monitoring RMON at the port level
monitoring and VCTRUNK.

Alarm and performance Provides rich alarms and performance events for easy management
event and maintenance of the equipment.

7.10.3 Working Principle and Signal Flow

The EGS4A consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.

Figure 7-26 shows the block diagram for the functions of the EGS4A.

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Figure 7-26 Block diagram for the functions of the EGS4A

E Cross-connect unit
N
C
Control P
GE Ethernet V Interface
Network Switch C
access processor fabric coversion
module D P module
Data E Cross-connect unit
N
C
P
Network processor module Mapping module

Laser
LOS
shutdown

Communication
Communication SCC unit
and control module Reference clock and frame header
SCC unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
Clock module +1.8 V DC/DC
+2.5 V converter

50 77 125 155
MHz MHz MHz MHz

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to
the EGS4A through the backplane. The interface module transmits the signals to the
encapsulation and mapping module. The encapsulation and mapping module then compensates
for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates
the frames, strips the data packets, and transmits the data packets to the service processing
module. Finally, the service processing module converges the data and transmits the data through
the ethernet physical interface.

In the Receive Direction

The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device,
such as the Ethernet switch and router. The interface module then decodes the signals and
converts the series signals into parallel signals. The service processing module then aligns the
frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics
for the Ethernet performance. In addition, the service processing module classifies the flow
(Ethernet or VLAN packet formats) according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local ports
according to the configuration. If the data services are to be transmitted to the upstream SDH
line, the encapsulation module encapsulates the Ethernet frames in the GFP, LAPS or HDLC
formats. Finally, the encapsulation module transmits the frames to the mapping module, which
maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then
transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E

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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:

l Ethernet/ VLAN

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC
format. The concatenation is processed. The LCAS function is supported. Ethernet signals are
then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:

l Manages and configures other modules of the boards.

l Performs inter-board communication through internal Ethernet interface.

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The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V.

7.10.4 Front Panel

On the front panel of the EGS4A, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-27 shows the appearance of the front panel of the EGS4A.

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Figure 7-27 Front panel of the EGS4A

EGS4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

LINK ACT

EGS4A

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EGS4A. Table 7-40 lists the
type and usage of the optical interfaces.

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Table 7-40 Optical interfaces of the EGS4A

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT3/IN3 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT4/IN4 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.10.5 Valid Slots

The EGS4A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4A
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4A indicates the optical interface type.
Table 7-41 lists the relation between the board feature code and optical interface type for the
EGS4A.

Table 7-41 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN1EGS4A10 10 1000Base-SX (0.55 km)

SSN1EGS4A11 11 1000Base-LX (10 km)

SSN1EGS4A12 12 1000Base-ZX (40 km)

SSN1EGS4A13 13 1000Base-ZX (70 km)

7.10.7 Board Protection

The EGS4A supports the board protection switching (BPS).

Protection Principle
When the BPS protection is performed to the EGS4A, the GE and FE ports use the single-fed
dual-selective scheme to get protected. The EGS4A has four four GE ports and 16 FE ports,
which may be connected to many communication devices. Normally, the active board is working
and services are transmitted in the two directions of the active link. On the standby link, the
EGS4A disables the transmission of all ports. In this case, the ports of the opposite board are in

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the Linkdown state. At the same time, the opposite board enables the transmission and does not
transmit services. In this way, the receive ports of the standby EGS4A are not in the Linkdown
state. The solid lines in Figure 7-28 show how the EGS4A normally works.

Figure 7-28 Normal working of the EGS4A

Active
communication
No.1 equipment
A
Active Standby
EGS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EGS4 No.3 communication
equipment
C
Standby
communication
equipment

BPS Protection
For the BPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The lines in Figure 7-29 show how the BPS protection is performed. The
services numbered 1, 2 and 3 are all switched to the standby EGS4A and corresponding
communication equipment.

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Figure 7-29 Principle of the BPS protection for the EGS4A

Active
communication
No.1 equipment
A
Active Standby
EGS4 communication
No.2 equipment

No.3
Active
communication
equipment
XCS
B
Standby
No.1 communication
equipment
No.2

Standby Active
EGS4 No.3 communication
equipment
C
Standby
communication
equipment

The conditions that trigger the protection for the EGS4A are as follows:

l Fault at at the PHY layer of the MAC port, also Linkdown

l Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex
modes.

Board Configuration
Two EGS4A boards should be configured for the protection. One EGS4A is the active board
and the other is the standby board. For the protection, the access capacity of the slot for the
standby board must be larger than that of the slot for the active board.

7.10.8 Board Configuration Reference

You can use the T2000 to set parameters for the EGS4A.

You can use the T2000 to set the following parameters for the EGS4A:

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l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.10.9 Technical Specifications

The specifications of the EGS4A cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-42 lists the specifications of the interfaces of the EGS4A.

Table 7-42 Specifications of the optical interfaces of the EGS4A

Item Specification

Optical interface 1000Base-ZX 1000Base-ZX 1000Base-LX 1000Base-SX

type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched optical –4 to +2 –2 to +5 –9 to –3 –9.5 to 0

power (dBm)

Central 1480–1580 1270–1355 1270–1355 770–860

wavelength (nm)

Overload optical –3 –3 –3 0
power (dBm)

Receiver –22 –23 –19 –17

sensitivity (dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS4A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

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Hardware Description 7 Data Processing Boards

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGS4A is 53 W.

7.11 EGR2
This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.11.1 Version Description

The functional version of the EGR2 board is N2.
7.11.2 Function and Feature
The EGR2 supports Layer 2 switching, port convergence, and RPR.
7.11.3 Working Principle and Signal Flow
The EGR2 consists of the ethernet processing module, network processor module, RPR protocol
processing module and so on.
7.11.4 Front Panel
On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class
label.
7.11.5 Valid Slots
The EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.11.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGR2 indicates the optical interface type.
7.11.7 Board Configuration Reference
You can use the T2000 to set parameters for the EGR2.
7.11.8 Technical Specifications
The technical specifications of the EGR2 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.11.1 Version Description

The functional version of the EGR2 board is N2.

7.11.2 Function and Feature

The EGR2 supports Layer 2 switching, port convergence, and RPR.

Table 7-43 lists the functions and features of the EGR2.

Table 7-43 Functions and features of the EGR2

Function and EGR2

Feature

Basic function Accesses and processes 2 x GE services. Supports the RPR feature.

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Function and EGR2

Feature

Specification of the The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

optical interface interfaces. The optical interfaces support the auto-negotiation,
compliant with IEEE 802.3z.
The optical interfaces use the hot-swappable optical module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km. The optical modules can be
used for different requirements for the transmission distance, such as
40 km and 70 km.

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.
frames Supports frames with a length ranging from 64 bytes to 9600 bytes.
Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink 2.5 Gbit/s.

bandwidth

Mapping Supports VC-3, VC3-2v, VC-4, and VC4-Xv (X≤8).

granularity

Encapsulation Supports GFP-F and LAPS.

format

EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE
802.3, IEEE 802.1q TAG, or MPLS Martini.
Supports the MPLS encapsulation and forwarding based on port and
port+VLAN.
Supports five types of LSP, including ingress LSP, egress LSP, transit
LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.

EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.
Supports the function of self-learning the source MAC address. For the
N2EGR2, the capacity of the MAC address table is 64k. The aging time
of the MAC address can be set and queried.
Supports the configuration of static MAC routes (maximum: 4k).
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16. The maximum number of logical ports for
each VB is 32.

MTU The packet length can be set from 1518 bytes to 9600 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

MPLS Supports MartinioE.

Stack VLAN Supported.

VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,
and the switching function, compliant with IEEE 802.1q/p.

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Function and EGR2

Feature

VLAN Supported (4k VLAN).

convergence

VLAN switching Supports the replacement of VLAN in Ethernet signal frames.

Port convergence Supports the convergence at a maximum of two GE ports.

RPR Supports RPR, compliant with IEEE 802.17.

The ring network supports a maximum of 255 nodes, and it supports
the dropping of sink nodes and weighted fairness algorithm.
Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.
Provides topology automatic discovery function, and detects the
network status in real time.
Supports three protection modes, including Steering, Wrapping, and
Wrapping+Steering. The invalid time for signals is less than 50 ms.
Supports the manual configuration of the ringlet route in the RPR ring
network.
Supports the ringlet self-learning, which learns the mapping relation
between the MAC address and node number.

RSTP Supports broadcast packet suppression and RSTP, compliant with

IEEE 802.1w.

Multicast (IGMP Supported.

Snooping)

CAR Supported.
The granularity is 64 kbit/s.

Flow classification Supports the port flow, port+VLAN ID flow, and port+VLAN ID
+VLAN PRI flow.

LCAS Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

Flow control Supports the IEEE 802.3x flow control based on port.
function

Echo test frame Supports the Echo function of the PRP OAM, which is used to test the
availability of the link.

Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance event maintenance of the equipment.

Weighted fairness Supported.

algorithm

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Function and EGR2

Feature

Topology Supported.
automatic
discovery

Max. number of 255.

nodes

Service priority Supports A0, A1, B_CIR, B_EIR and C.

level

7.11.3 Working Principle and Signal Flow

The EGR2 consists of the ethernet processing module, network processor module, RPR protocol
processing module and so on.
Figure 7-30 shows the block diagram for the functions of the EGR2.

Figure 7-30 Block diagram for the functions of the EGR2

E Cross-
Control N
singnal connect
C
P unit
GE/FE Ethernet RPR RPR V
Network Switch C Interface
access processor fabric MAC MAC P conversion
module east west D
module
Data N Cross-
C
P connect
unit
Network processor module RPR protocol
process module Mapping module

Laser shut down

Communication
SCC unit
LOS Communication and
control module Reference clock and frame header
Cross-connect
unit

50 MHZ
77 MHZ

125 MHZ Clock module

100 MHZ
+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
+2.5 V DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

RPR: resilient package ring

The function modules are described as follows:

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Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:

l MPLS
l L2MPLS VPN
l Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection
switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module
controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features
spatial reuse and statistic multiplex. Bandwidth utilization is then improved.

Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable means to fast find topologies of all nodes
and the changes to these topologies.

RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused
spatially.

The entire RPR ring accommodates 255 nodes to the maximum.

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Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation
formats are LAPS and GFP-F.
In the downstream direction, virtual concatenations are received. The time delay of virtual
concatenation is compensated. After aligning, packets are decapsulated as per encapsulation
format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.11.4 Front Panel

On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class
label.

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Appearance of the Front Panel

Figure 7-31 shows the appearance of the front panel of the EGR2.

Figure 7-31 Front panel of the EGR2

EGR2

STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1

LASER

PRODUCT
OUT1 IN1
OUT2 IN2

EGR2

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two optical interfaces on the front panel of the EGR2. Table 7-44 lists the type and
usage of the optical interfaces.

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Table 7-44 Optical interfaces of the EGR2

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.11.5 Valid Slots

The EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.11.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGR2 indicates the optical interface type.
Table 7-45 lists the relation between the board feature code and optical interface type for the
EGR2.

Table 7-45 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN2EGR210 10 1000Base-SX (0.55 km)

SSN2EGR211 11 1000Base-LX (10 km)

SSN2EGR212 12 1000Base-ZX (40 km)

SSN2EGR213 13 1000Base-ZX (70 km)

7.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGR2.
You can use the T2000 to set the following parameters for the EGR2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.11.8 Technical Specifications

The technical specifications of the EGR2 cover the optical interface specifications, board
dimensions, weight and power consumption.

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Table 7-46 lists the specifications of the interfaces of the EGR2.

Table 7-46 Specifications of the interfaces of the EGR2

Optical Optical Launched Central Overloa Receiver Extin
Interface Type Source Optical Wavele d Optical Sensitivit ction
Type Power ngth Power y (dBm) Ratio
(dBm) (nm) (dBm) (dB)

1000Base-ZX MLM –4 to +2 1480 to –3 –22 9

(70 km) 1580

1000Base-ZX MLM –2 to +5 1270 to –3 –23 9

(40 km) 1355

1000Base-LX MLM –9 to –3 1270 to –3 –19 9

(10 km) 1355

1000Base-SX MLM –9.5 to 0 770 to 0 –17 9

(0.55 km) 860

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGR2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGR2 is 40 W.

7.12 EMR0
This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms
of the version, function, principle, front panel, configuration and specifications.

7.12.1 Version Description

The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.
7.12.2 Function and Feature
The EMR0 supports Layer 2 switching, port convergence, and RPR.
7.12.3 Working Principle and Signal Flow
The EMR0 consists of the ethernet processing module, network processor module, RPR protocol
processing module, mapping module and so on.

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7.12.4 Front Panel

On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class
label.
7.12.5 Valid Slots
The EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the
interface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN
1500B subrack.
7.12.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EMR0 indicates the optical interface type.
7.12.7 Board Configuration Reference
You can use the T2000 to set parameters for the EMR0.
7.12.8 Technical Specifications
The technical specifications of the EMR0 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.12.1 Version Description

The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.

Table 7-47 lists the details on the versions of the EMR0 board.

Table 7-47 Version description of the EMR0

Item Description

Functional The EMR0 has two versions, N1 and N2.

version

Difference The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 also
has some new functions and extends some functions of the N1EMR0. For
details, see Table 7-48.

Replaceability The N2EMR0 can replace the N1EMR0.

Table 7-48 Comparison of features of the N1EMR0 and N2EMR0

Item N1EMR0 N2EMR0

Port convergence - Supports the convergence function at a

function maximum of eight FE ports.

VLAN label - Supports the VLAN label switching for

switching the Ethernet data.

EVPLAN services Supports EVPLAN services Supports EVPLAN services and uses
and uses the stack VLAN the stack VLAN encapsulation.
encapsulation.

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Item N1EMR0 N2EMR0

MAC address table Supports the 16k MAC Supports the 64k MAC address table.
address table.

VB features Supports the creation, Supports the creation, deletion and

deletion and query of the VB. query of the VB. The maximum number
The maximum number of the of the VBs is 16. The maximum number
VBs is 32. The maximum of logical ports for each VB is 32.
number of logical ports for
each VB is 16.

PRP ring network - Supports the manual configuration of

the ringlet route in the RPR ring
network.

RPR OAM - Supports the Echo function of the PRP

OAM, which is used to test the
availability of the link.

CAR Supported. Supported.

Flow classification Supports the port flow, port Supports the port flow, port+VLAN ID
+VLAN ID flow, and port flow, and port+VLAN ID+VLAN PRI
+VLAN PRI flow. flow.

7.12.2 Function and Feature

The EMR0 supports Layer 2 switching, port convergence, and RPR.
Table 7-49 lists the functions and features of the EMR0.

Table 7-49 Functions and features of the EMR0

Function and EMR0
Feature

Basic function Accesses and processes 12 x FE services and 1 x GE services. Supports

the RPR feature.

Used with the Supports four FE ports and one GE ports.

interface board Accesses 12 x FE signals at the electrical interface when used with the
ETF8.
Accesses 8 x FE signals at the optical interface when used with the
EFF8.

Specification of the Supports the 10Base-T/100Base-TX signals when used with the ETF8.
optical interface The maximum transmission distance is 100 m.
Supports the 100Base-FX signals when used with the EFF8, compliant
with IEEE 802.3u.

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Function and EMR0

Feature

Format of service Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supports
frames frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink 2.5 Gbit/s.

bandwidth

Mapping VC-3, VC3-2v, VC-4, and VC4-Xv (X≤8).

granularity

Encapsulation Supports GFP-F and LAPS.

format

EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE
802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services support
the MPLS encapsulation and forwarding based on port and port
+VLAN. Supports five types of LSP, including ingress LSP, egress
LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512
LSPs.

EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.
Supports the function of self-learning the source MAC address. For the
N2EMR0, the capacity of the MAC address table is 16k. The aging time
of the MAC address can be set and queried.
Supports the configuration of static MAC routes (maximum: 4k).
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The N2EMR0
supports a maximum of 16 VBs. The maximum number of logical ports
for each VB is 32.

MTU The packet length can be set from 1518 bytes to 9600 bytes. After the
packet length setting takes effect, the maximum length of the packets
entering or going out from the IP port are limited by the MTU setting.

MPLS Supports MartinioE.

Stack VLAN Supported.

VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,
and the switching function, compliant with IEEE 802.1q/p.

VLAN Supported (4k VLAN).

convergence

VLAN switching Supports the replacement of VLAN in Ethernet signal frames.

Port convergence Supports the convergence function at a maximum of eight FE ports.

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Function and EMR0

Feature

RPR Supported and compliant with IEEE 802.17.

Supports a maximum of 255 nodes in the ring network, and the dropping
of sink nodes.
Supports weighted fairness algorithm.
Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.
Provides topology automatic discovery function, and detects the
network status in real time. Supports three protection modes, including
Steering, Wrapping, and Wrapping+Steering. The invalid time for
signals is less than 50 ms.
Supports the ringlet self-learning, which learns the mapping relation
between the MAC address and node number.
The N2EMR0 supports the manual configuration of the ringlet route in
the RPR ring network.

RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE
802.1w.

Multicast (IGMP Supported.

Snooping)

CAR Supported.
The granularity is 64 kbit/s.

Flow classification The N2EMR0 supports the port flow, port+VLAN ID flow, and port
+VLAN ID+VLAN PRI flow.

LCAS Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

Flow control Supports the IEEE 802.3x flow control based on port.
function

Echo test frame Supports the Echo function of the PRP OAM, which is used to test the
availability of the link.

Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet Supports Ethernet performance monitoring at the port level.

performance
monitoring

Alarm and Provides rich alarms and performance events for easy management and
performance maintenance of the equipment.
events

Weighted fairness Supported.

algorithm

Topology Supported.
automatic
discovery

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Function and EMR0

Feature

Max. number of 255.

nodes

Service priority Supports A0, A1, B_CIR, B_EIR and C.

levels

7.12.3 Working Principle and Signal Flow

The EMR0 consists of the ethernet processing module, network processor module, RPR protocol
processing module, mapping module and so on.

Figure 7-32 shows the block diagram for the functions of the EMR0.

Figure 7-32 Block diagram for the functions of the EMR0

E Cross-
Control N
singnal connect
C
P unit
GE/FE Ethernet RPR RPR V
Network Switch C Interface
access processor fabric MAC MAC P conversion
module east west D
module
Data N Cross-
C
P connect
unit
Network processor module RPR protocol
process module Mapping module

Laser shut down

Communication
SCC unit
LOS Communication and
control module Reference clock and frame header
Cross-connect
unit

50 MHZ
77 MHZ

125 MHZ Clock module

100 MHZ
+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V
converter -48 V/ -60 V
+2.5 V DC/DC
+1.8 V converter Fuse
+3.3 V backup
power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS

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alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l MPLS
l L2MPLS VPN
l Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection
switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module
controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features
spatial reuse and statistic multiplex. Bandwidth utilization is then improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable means to fast find topologies of all nodes
and the changes to these topologies.
RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused
spatially.
The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation
formats are LAPS and GFP-F.

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In the downstream direction, virtual concatenations are received. The time delay of virtual
concatenation is compensated. After aligning, packets are decapsulated as per encapsulation
format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.12.4 Front Panel

On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-33 shows the appearance of the front panel of the N1EMR0.
Figure 7-34 shows the appearance of the front panel of the N2EMR0.

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Figure 7-33 Front panel of the N1EMR0

EMR0

STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT
OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

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Figure 7-34 Front panel of the N2EMR0

EMR0

STAT
ACT
PROG

SRV
LINK

ACT

CLASS 1

LASER

PRODUCT
OUT1
IN1

FE1

FE2

FE3

FE4

EMR0

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
There are five interfaces on the front panel of the EMR0. Table 7-50 lists the type and usage of
the interfaces.

Table 7-50 Optical interfaces of the EMR0

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZX

signals.

FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TX

signals.

7.12.5 Valid Slots

The EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without the
interface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN
1500B subrack.

The EMR0 can be used with the ETF8 and EFF8.

Table 7-51 and Table 7-52 list the valid slots for the EMR0 and corresponding slots for the
ETF8 and EFF8.

Table 7-51 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500A subrack

Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8

Slot 12 Without the interface board

Slot 13 Without the interface board

Table 7-52 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500B subrack

Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8

Slot 11 Without the interface board

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Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8

Slot 12 Slot 15

Slot 13 Slot 17

7.12.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EMR0 indicates the optical interface type.
Table 7-53 lists the relation between the board feature code and optical interface type for the
EMR0.

Table 7-53 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN2EMR010 10 1000Base-SX (0.55 km)

SSN2EMR011 11 1000Base-LX (10 km)

SSN2EMR012 12 1000Base-ZX (40 km)

SSN2EMR013 13 1000Base-ZX (70 km)

7.12.7 Board Configuration Reference

You can use the T2000 to set parameters for the EMR0.
You can use the T2000 to set the following parameters for the EMR0:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.12.8 Technical Specifications

The technical specifications of the EMR0 cover the optical interface specifications, board
dimensions, weight and power consumption.
Table 7-54 lists the specifications of the interfaces of the EMR0.

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Table 7-54 Specifications of the optical interfaces of the EMR0

Item Specification

Optical interface 1000Base-ZX 1000Base-ZX 1000Base-LX 1000Base-SX

type (70 km) (40 km) (10 km) (0.55 km)

Optical source MLM MLM MLM MLM

type

Launched optical –4 to +2 –2 to +5 –9 to –3 –9.5 to 0

power (dBm)

Central 1480 to 1580 1270 to 1355 1270 to 1355 770 to 860

wavelength (nm)

Overload optical –3 –3 –3 0
power (dBm)

Receiver –22 –23 –19 –17

sensitivity (dBm)

Extinction ratio 9 9 9 9
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMR0 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.2

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EMR0 is 50 W.

7.13 ADL4
This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.13.1 Version Description

The functional version of the ADL4 board is N1.
7.13.2 Function and Feature
The ADL4 supports the ATM switching and ATM protection.
7.13.3 Working Principle and Signal Flow

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The ADL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.13.4 Front Panel
On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class
label.
7.13.5 Valid Slots
The ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.13.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the ADL4 indicates the optical interface type.
7.13.7 Board Configuration Reference
You can use the T2000 to set parameters for the ADL4.
7.13.8 Technical Specifications
The technical specifications of the ADL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.13.1 Version Description

The functional version of the ADL4 board is N1.

7.13.2 Function and Feature

The ADL4 supports the ATM switching and ATM protection.

Table 7-55 lists the functions and features of the ADL4.

Table 7-55 Functions and features of the ADL4

Function and ADL4

Feature

Basic function Accesses and processes 1 x STM-4 ATM services.

Optical interface type Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2
types.

Connector type LC.

Optical module type SFP.

E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/

N1PL3A.

IMA function Not supported.

Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching 1.2 Gbit/s.

capability

Mapping granularity Supports VC-3, VC-4, or VC4-Xv (X: 1–4).

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Function and ADL4

Feature

Service type Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection 2048.

Statistical multiplexing Supported.

Flow type and QoS Supports IETF RFC2514, ATM forum TM4.0.

ATM multicast Supports spacial multicast and logical multicast.

connection

ATM protection (ITU- Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-
T I.630) Ring protection schemes.

OAM function (ITU-T Supports AIS, RDI, LB , and CC.

I.610)

Maintenance feature Supports inloop and outloop at the ATM layer levels and the optical
interface (except the outloop at external port), which are used for
maintenance and fault locating.

Alarm and performance Provides rich alarms and performance events. The loopback is used
event for maintenance and fault locating.

7.13.3 Working Principle and Signal Flow

The ADL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-35 shows the block diagram for the functions of the ADL4.

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Figure 7-35 Block diagram for the functions of the ADL4

622Mbit/s 622Mbit/s high speed bus

E/O Cross-connet unit A

PHY ATM Mapping

module module module

high speed bus

O/E E3 Cross-connet unit B
module
622Mbit/s 622Mbit/s

LOS Reference clock and frame header Cross-connet unit

Laser shut down Communication

and control module Communication
Scc unit

50 MHz

77 MHz
Clock module
100 MHz
3.3 V DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V

+1.2 V
Fuse
+1.5 V +3.3 V backup
power
DC/DC
+1.8 V converter
+2.5 V

The function modules are described as follows.

O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit
direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation of
HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:
l Flow control
l Extraction and generation of cell headers
l ATM switching

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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:

l Mappings the ATM cells into E3 containers

l Demappings E3 containers to ATM cells
l Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:

l Mappings ATM cells into SDH frame payload

l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC4-Xv (X≤4) virtual concatenation

Communication and Control Module

The communication and control module:

l Controls writing and reading of each chip

l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.13.4 Front Panel

On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-36 shows the appearance of the front panel of the ADL4.

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Figure 7-36 Front panel of the ADL4

ADL4

STAT
ACT
PROG
SRV

CLASS 1

LASER

PRODUCT
OUT1 IN1

ADL4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one optical interface on the front panel of the ADL4. Table 7-56 lists the type and usage
of the optical interface.

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Table 7-56 Optical interface of the ADL4

Interface Interface Usage

Type

OUT1/IN1 LC Transmits and receives STM-4 optical signals.

(pluggable)

7.13.5 Valid Slots

The ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the ADL4 indicates the optical interface type.

Table 7-57 lists the relation between the board feature code and optical interface type of the
ADL4.

Table 7-57 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN1ADL410 10 S-4.1

SSN1ADL411 11 L-4.1

SSN1ADL412 12 L-4.2

SSN1ADL413 13 Ve-4.2

7.13.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADL4.

You can use the T2000 to set the following parameters for the ADL4:

l Port type
l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)

For details on these parameters, refer to F Board Configuration Reference.

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7.13.8 Technical Specifications

The technical specifications of the ADL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-58 lists the specifications of the optical interfaces of the ADL4.

Table 7-58 Specifications of the optical interfaces of the ADL4

Item Specification

Optical interface S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source MLM SLM SLM SLM

type

Transmission 2–15 15–40 40–80 80–100

distance (km)

Wavelength (nm) 1274–1356 1280–1335 1480–1580 1480–1580

Overload optical –8 –8 –8 –8
power (dBm)

Receiver –23 –28 –28 –33

sensitivity (dBm)

Launched optical –15 to –8 –3 to +2 –3 to +2 –2 to +2

power (dBm)

Minimum 8.2 10 10 10.5

extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADL4 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ADL4 is 41 W.

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7.14 ADQ1
This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.14.1 Version Description

The functional version of the ADQ1 board is N1.
7.14.2 Function and Feature
The ADQ1 supports the ATM switching and ATM protection.
7.14.3 Working Principle and Signal Flow
The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.14.4 Front Panel
On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class
label.
7.14.5 Valid Slots
The ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.14.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the ADQ1 indicates the optical interface type.
7.14.7 Board Configuration Reference
You can use the T2000 to set parameters for the ADQ1.
7.14.8 Technical Specifications
The technical specifications of the ADQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.14.1 Version Description

The functional version of the ADQ1 board is N1.

7.14.2 Function and Feature

The ADQ1 supports the ATM switching and ATM protection.

Table 7-59 lists the functions and features of the ADQ1.

Table 7-59 Functions and features of the ADQ1

Function and ADQ1

Feature

Basic function Accesses and processes 4 x STM-1 ATM services.

Optical interface type Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and
Ve-1.2 types.

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Function and ADQ1

Feature

Connector type LC.

Optical module type SFP.

E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/

N1PL3A.

IMA function Not supported.

Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching 1.2 Gbit/s.

capability

Mapping granularity Supports VC-3, VC-4, or VC4-Xv (X: 1–4).

Service type Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection 2048.

Statistical Supported.
multiplexing

Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast Supports spacial multicast and logical multicast.

connection

ATM protection (ITU- Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-
T I.630) Ring protection schemes.

OAM function (ITU-T Supports AIS, RDI, LB , and CC.

I.610)

Maintenance feature Supports inloop and outloop at the ATM layer levels and the optical
interface (except the outloop at external port), which are used for
maintenance and fault locating.

Alarm and Provides rich alarms and performance events, which are used for
performance event maintenance and fault locating.

7.14.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-37 shows the block diagram for the functions of the ADQ1.

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Figure 7-37 Block diagram for the functions of the ADQ1

4x155 Mbit/s 4x155Mbit/s high speed bus

E/O Cross-connet unit A

PHY ATM Mapping

module module module

4x155Mbit/s 4x155Mbit/s high speed bus

O/E E3 Cross-connet unit B
module

LOS Reference clock and frame header Cross-connet unit

Laser shut down Communication

and control module Communication
Scc unit

50 MHz

77 MHz
Clock module
100 MHz
3.3 V DC/DC Fuse -48 V/ -60 V
converter -48 V/ -60 V

+1.2 V
Fuse
+1.5 V +3.3 V backup
power
DC/DC
+1.8 V converter
+2.5 V

The function modules are described as follows.

O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit
direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation of
HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:
l Flow control
l Extraction and generation of cell headers
l ATM switching

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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:

l Mappings the ATM cells into E3 containers

l Demappings E3 containers to ATM cells
l Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:

l Mappings ATM cells into SDH frame payload

l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC4-Xv (X≤4) virtual concatenation

Communication and Control Module

The communication and control module:

l Controls writing and reading of each chip

l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.14.4 Front Panel

On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-38 shows the appearance of the front panel of the ADQ1.

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Figure 7-38 Front panel of the ADQ1

ADQ1

STAT
ACT
PROG
SRV

CLASS 1

LASER

PRODUCT
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

ADQ1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-60 lists the
type and usage of the optical interfaces.

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Table 7-60 Optical interfaces of the ADQ1

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT2/IN2 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT3/IN3 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT4/IN4 LC (pluggable) Transmits and receives STM-1 optical signals.

7.14.5 Valid Slots

The ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the ADQ1 indicates the optical interface type.

Table 7-61 lists the relation between the board feature code and optical interface type for the
ADQ1.

Table 7-61 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN1ADQ110 10 S-1.1

SSN1ADQ111 11 L-1.1

SSN1ADQ112 12 L-1.2

SSN1ADQ113 13 Ve-1.2

SSN1ADQ114 14 Ie-1

7.14.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADQ1.

You can use the T2000 to set the following parameters for the ADQ1:

l Port type
l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)

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l Maximum cell burst size

l Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.14.8 Technical Specifications

The technical specifications of the ADQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-62 lists the specifications of the optical interfaces of the ADQ1.

Table 7-62 Specifications of the optical interfaces of the ADQ1

Item Specification

Optical Ie-1 S-1.1 L-1.1 L-1.2 Ve-1.2

interface type

Optical source MLM MLM MLM, SLM SLM SLM

type

Wavelength 1260 to 1261 to 1360 1263 to 1360 1480 to 1480 to 1580

(nm) 1360 1580

Transmission 0 to 0.5 2 to 15 15 to 40 40 to 80 80 to 100

distance (km)

Launched –19 to –14 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical power
(dBm)

Receiving –31 –28 –34 –34 –34

optical power
(dBm)

Overload –14 –8 –10 –10 –10

optical power
(dBm)

Minimum 10 8.2 10 10 10
extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADQ1 are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ADQ1 is 37 W.

7.15 IDL4
This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.15.1 Version Description

The functional version of the IDL4 board is N1.
7.15.2 Function and Feature
The IDL4 supports the ATM switching, IMA, and ATM protection.
7.15.3 Working Principle
The IDL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.15.4 Front Panel
On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class
label.
7.15.5 Valid Slots
The IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.15.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the IDL4 indicates the optical interface type.
7.15.7 Board Protection
The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be
housed in paired slots.
7.15.8 Board Configuration Reference
You can use the T2000 to set parameters for the IDL4.
7.15.9 Technical Specifications
The technical specifications of the IDL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.15.1 Version Description

The functional version of the IDL4 board is N1.

7.15.2 Function and Feature

The IDL4 supports the ATM switching, IMA, and ATM protection.
Table 7-63 lists the functions and features of the IDL4.

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Table 7-63 Functions and features of the IDL4

Function and IDL4
Feature

Basic function Accesses and processes 1 x STM-4 ATM services.

Optical interface Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2
type types.

Connector type LC.

Optical module SFP.

type

E3 ATM interface Not supported.

IMA function Accesses and processes IMA services when used with E1 service
(ATM Forum IMA processing board N1PQ1/N1PQM.
1.1 standard) Supports a maximum of 63 IMA E1 services.
One ATM port supports a maximum of 16 IMA groups. Each IMA group
supports 1–32 E1 signals.
One ATM port supports a maximum of E1 links of 16 non-IMA groups.
The maximum IMA multichannel delay is 226 ms.

Max. uplink Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4.

bandwidth

ATM switching 1.0 Gbit/s.

capability

Mapping Supports VC-12, VC-4, or VC4-Xc (X:1–4), VC12-Xv (X:1–32).

granularity

IMA feature Accesses and processes IMA services when used with E1 service
processing board.
Processes IMA services for a maximum of 63 x E1 signals.
Supports a maximum of 16 IMA groups. Each IMA group supports 1–
32 E1 signals.
The maximum IMA multichannel delay is 226 ms.

Service type Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection 2048.

Statistical Supported.
multiplexing

Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast Supports spacial multicast and logical multicast.

connection

ATM protection Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring

(ITU-T I.630) protection schemes.

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Function and IDL4

Feature

Board level 1+1 Supported.

protection

OAM function Supports AIS, RDI, LB , and CC.

(ITU-T I.610)

Maintenance Supports inloop and outloop at the ATM layer levels and the optical
feature interface (except the outloop at external port), which are used for
maintenance and fault locating.

Alarm and Provides rich alarms and performance events, which are used for
performance event maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth
to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can
connect to other IMA equipment.

7.15.3 Working Principle

The IDL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-39 shows the block diagram for the functions of the IDL4.

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Figure 7-39 Block diagram for the functions of the IDL4

622 Mbit/s 622 Mbit/s high speed bus

E/O Cross-connet unit A

PHY ATM Mapping

module module module
high speed bus
O/E IMA
Cross-connet unit B
module
622 Mbit/s 622 Mbit/s

LOS Reference clock and frame header

Communication Cross-connet unit
Laser shut down and control module Communication
Scc unit

50 MHz
77 MHz Clock
module
100 MHz
+3.3 V Fuse -48 V/ -60 V
DC/DC
converter -48 V/ -60 V

+1.2 V
+1.5 V Fuse
+3.3 V backup
+1.8 V DC/DC power
+2.5 V converters

E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:

l Mappings ATM cells into SDH frames

l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation of
header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:

l Flow control
l Extraction and generation of cell headers
l ATM switching

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IMA Module
This module mainly performs IMA protocol functions. These functions are:

l Separation and re-creation of ATM cells

l Frame synchronization
l Insertion and extraction of IMA control protocol (ICP) cells
l Management of IMA groups

Mapping Module
The mapping module:

l Mappings ATM cells into SDH frame payload

l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC4-Xv (X≤4) virtual concatenation

Communication and Control Module

The communication and control module:

l Controls writing and reading of each chip

l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.15.4 Front Panel

On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-40 shows the appearance of the front panel of the IDL4.

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Figure 7-40 Front panel of the IDL4

IDL4

STAT
ACT
PROG
SRV

CLASS 1

LASER

PRODUCT
OUT1 IN1

IDL4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are one optical interface on the front panel of the IDL4. Table 7-64 lists the type and
usage of the optical interface.

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Table 7-64 Optical interface of the IDL4

Interface Interface Usage

Type

OUT1/IN1 LC Transmits and receives STM-4 optical signals.

(pluggable)

7.15.5 Valid Slots

The IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 can
be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the IDL4 indicates the optical interface type.

Table 7-65 lists the relation between the board feature code and optical interface type for the
IDL4.

Table 7-65 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN1IDL410 10 S-4.1

SSN1IDL411 11 L-4.1

SSN1IDL412 12 L-4.2

SSN1IDL413 13 Ve-4.2

7.15.7 Board Protection

The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be
housed in paired slots.

The paired slots for the IDL4 are slots 13 and 12.

7.15.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDL4.

You can use the T2000 to set the following parameters for the IDL4:

l Port type
l Flow type
l Service type
l Peak cell rate (PCR)

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l Sustainable cell rate (SCR)

l Maximum cell burst size
l Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.15.9 Technical Specifications

The technical specifications of the IDL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-66 lists the specifications of the optical interfaces of the IDL4.

Table 7-66 Specifications of the optical interfaces of the IDL4

Item Specification

Optical interface S-4.1 L-4.1 L-4.2 Ve-4.2

type

Optical source type MLM SLM SLM SLM

Wavelength (nm) 1274 to 1356 1280 to 1335 1480 to 1580 1480 to 1580

Transmission 2 to 15 15 to 40 40 to 80 80 to 100
distance (km)

Launched optical –15 to –8 –3 to +2 –3 to +2 –3 to +2

power (dBm)

Receiver sensitivity –28 –28 –28 –33

(dBm)

Overload optical –8 –8 –8 –13

power (dBm)

Minimum extinction 8.2 10 10 10.5

ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDL4 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the IDL4 is 41 W.

7.16 IDQ1
This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.

7.16.1 Version Description

The functional version of the IDQ1 board is N1.
7.16.2 Function and Feature
The IDQ1 supports the ATM switching, IMA, and ATM protection.
7.16.3 Working Principle and Signal Flow
The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.16.4 Front Panel
On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class
label.
7.16.5 Valid Slots
The IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.16.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the IDQ1 indicates the optical interface type.
7.16.7 Board Protection
The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
7.16.8 Board Configuration Reference
You can use the T2000 to set parameters for the IDQ1.
7.16.9 Technical Specifications
The technical specifications of the IDQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.16.1 Version Description

The functional version of the IDQ1 board is N1.

7.16.2 Function and Feature

The IDQ1 supports the ATM switching, IMA, and ATM protection.
Table 7-67 lists the functions and features of the IDQ1.

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Table 7-67 Functions and features of the IDQ1

Function and IDQ1
Feature

Basic function Accesses and processes 4 x STM-1 ATM services.

Optical interface Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2
type types.

Connector type LC.

Optical module SFP.

type

E3 ATM interface Not supported.

IMA function Accesses and processes IMA services when used with E1 service
(ATM Forum IMA processing board N1PQ1/N1PQM.
1.1 standard) Supports a maximum of 63 IMA E1 services.
One ATM port supports a maximum of 16 IMA groups. Each IMA group
supports 1–32 E1 signals.
One ATM port supports a maximum of E1 links of 16 non-IMA groups.
The maximum IMA multichannel delay is 226 ms.

Max. uplink Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4.

bandwidth

ATM switching 1.0 Gbit/s.

capability

Mapping Suppports VC-12, VC-4, or VC4-Xc (X:1–4), VC12-Xv (X:1–32).

granularity

IMA feature Accesses and processes IMA services when used with E1 service
processing board.
Processes IMA services for a maximum of 63 x E1 signals.
Supports a maximum of 16 IMA groups. Each IMA group supports 1–
32 E1 signals.
The maximum IMA multichannel delay is 226 ms.

Service type Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection 2048.

Statistical Supported.
multiplexing

Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast Supports spacial multicast and logical multicast.

connection

ATM protection Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring

(ITU-T I.630) protection schemes.

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Function and IDQ1

Feature

Board level 1+1 Supported.

protection

OAM function Supports AIS, RDI, LB , and CC.

(ITU-T I.610)

Maintenance Supports inloop and outloop at the ATM layer levels and the optical
feature interface (except the outloop at external port), which are used for
maintenance and fault locating.

Alarm and Provides rich alarms and performance events, which are used for
performance event maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth
to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can
connect to other IMA equipment.

7.16.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-41 shows the block diagram for the functions of the IDQ1.

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Figure 7-41 Block diagram for the functions of the IDQ1

4 x 155 4 x 155
high speed bus
Mbit/s Mbit/s
E/O Cross-connet unit A

PHY ATM Mapping

module module module
4 x 155 4 x 155
high speed bus
Mbit/s Mbit/s IMA
O/E Cross-connet unit B
module

LOS Reference clock and frame header

Communication Cross-connet unit
Laser shut down and control module Communication
Scc unit

50 MHz
77 MHz Clock
module
100 MHz
+3.3 V Fuse -48 V/ -60 V
DC/DC
converter -48 V/ -60 V

+1.2 V
+1.5 V Fuse
+3.3 V backup
+1.8 V DC/DC power
+2.5 V converters

E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:

l Mappings ATM cells into SDH frames

l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation of
header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:

l Flow control
l Extraction and generation of cell headers
l ATM switching

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IMA Module
This module mainly performs IMA protocol functions. These functions are:

l Separation and re-creation of ATM cells

l Frame synchronization
l Insertion and extraction of IMA control protocol (ICP) cells
l Management of IMA groups

Mapping Module
The mapping module:

l Mappings ATM cells into SDH frame payload

l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC4-Xv (X≤4) virtual concatenation

Communication and Control Module

The communication and control module:

l Controls writing and reading of each chip

l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.16.4 Front Panel

On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-42 shows the appearance of the front panel of the IDQ1.

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Figure 7-42 Front panel of the IDQ1

IDQ1

STAT
ACT
PROG
SRV

CLASS 1

LASER

PRODUCT
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

IDQ1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four optical interfaces on the front panel of the IDQ1. Table 7-68 lists the type and
usage of the optical interfaces.

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Table 7-68 Optical interfaces of the IDQ1

Interface Interface Type Usage

OUT1/IN1 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT2/IN2 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT3/IN3 LC (pluggable) Transmits and receives STM-1 optical signals.

OUT4/IN4 LC (pluggable) Transmits and receives STM-1 optical signals.

7.16.5 Valid Slots

The IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the IDQ1 indicates the optical interface type.
Table 7-69 lists the relation between the board feature code and optical interface type for the
IDQ1.

Table 7-69 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSN1IDQ110 10 S-1.1

SSN1IDQ111 11 L-1.1

SSN1IDQ112 12 L-1.2

SSN1IDQ113 13 Ve-1.2

SSN1IDQ114 14 Ie-1

7.16.7 Board Protection

The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
The paired slots for the IDQ1 are slots 13 and 12.

7.16.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDQ1.
You can use the T2000 to set the following parameters for the IDQ1:
l Port type

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l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.16.9 Technical Specifications

The technical specifications of the IDQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-70 lists the specifications of the optical interfaces of the IDQ1.

Table 7-70 Specifications of the optical interfaces of the IDQ1

Item Specification

Optical interface Ie-1 S-1.1 L-1.2 Ve-1.2 L-1.1

type

Optical source MLM MLM SLM SLM MLM, SLM

type

Wavelength 1260 to 1261 to 1480 to 1480 to 1580 1263 to 1360

(nm) 1360 1360 1580

Transmission 0 to 0.5 2 to 15 40 to 80 80 to 100 15 to 40

distance (km)

Launched optical –19 to –14 –15 to –8 –5 to 0 –3 to 0 –5 to 0

power (dBm)

Receiver –31 –28 –34 –34 –34

sensitivity
(dBm)

Overload optical –14 –8 –10 –10 –10

power (dBm)

Minimum 10 8.2 10 10 10
extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
The mechanical specifications of the IDQ1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the IDQ1 is 41 W.

7.17 MST4
This section describes the MST4, a 4-channel multi-service transparent transmission board, in
terms of the version, function, principle, front panel, configuration and specifications.

7.17.1 Version Description

The functional version of the MST4 board is N1.
7.17.2 Function and Feature
The MST4 is used to access multiple services, and to maintain alarms.
7.17.3 Working Principle and Signal Flow
The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, Communication and control module and so on.
7.17.4 Front Panel
On the front panel of the MST4, there are indicators, interfaces and barcode.
7.17.5 Valid Slots
The MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.17.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the MST4 indicates the service type, optical interface type and transmission distance.
7.17.7 Board Configuration Reference
You can use the T2000 to set parameters for the MST4.
7.17.8 Technical Specifications
The specifications of the MST4 cover the optical interface specifications, mechanical
specifications and power consumption.

7.17.1 Version Description

The functional version of the MST4 board is N1.

7.17.2 Function and Feature

The MST4 is used to access multiple services, and to maintain alarms.

Table 7-71 lists the functions and features of the MST4.

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Table 7-71 Functions and features of the MST4

Function and MST4
Feature

Basic function Provides four independent ports to access multiple services, and supports
the transparent transmission of the SAN and Video services.

Connector type LC.

Optical module SFP.

type

Service type Supports the FC100/FICON, FC200, ESCON, and DVB-ASI

services.Table 7-72 lists types and rates of the services.
Accesses four-channel FC services (FC100/FICON and FC200) at the
same time, and the total bandwidth is less than 2.5 Gbit/s.
Supports the full-rate transmission of the FC services (one-channel FC200
services or two-channel FC100 services).
Accesses four-channel ESCON or DVB-ASI services, and the total
bandwidth is less than 2.5 Gbit/s.

Distance The first and second ports support the distance extension function at the
extension SDH side. (FC100: 3000 km; FC200: 1500 km)

Max. uplink 2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directly
bandwidth connect to the cross-connect unit.)

Mapping Supports VC4-Xc (X: 4, 8, 16).

granularity

ESCON Accesses four-channel ESCON services, and the total bandwidth is less
than 2.5 Gbit/s.

DVB-ASI Accesses four-channel DVB-ASI services, and the total bandwidth is less
than 2.5 Gbit/s.

Encapsulation Supports GFP-T, compliant with ITU-T G.7041.

format

Maintenance Supports the inloop at the port level of the client side. The loopack is used
feature for maintenance and fault locating.

Alarm and Provides rich alarms and performance events, which are used for
performance maintenance and fault locating.
event

Table 7-72 Services and service rates provided by the MST4

Service Type Rate Remarks

FC100/FICON 1062.5 Mbit/s SAN service

FC200 2125 Mbit/s SAN service

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Service Type Rate Remarks

ESCON 200 Mbit/s. SAN service.

DVB-ASI 270 Mbit/s Video service

7.17.3 Working Principle and Signal Flow

The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, Communication and control module and so on.

Figure 7-43 shows the block diagram for the functions of the MST4.

Figure 7-43 Block diagram for the functions of the MST4

Encaps Cross-connect
FC1_ FC2 FC1_
RCV SND ulation unit A/B
FC50 Client-
FC100 side Interface
FC200 access Mapping conversion
FICON module Cross-connect
module FC1_ FC1_ Decaps
DVB-ASI FC2 RCV ulation unit A/B
ESCON
SND

FC processing module
Encapsulation and
mapping module
Communication SCC unit
Communication and control
module Reference clock and frame header Cross-
connect unit

100 MHz
125 MHz
135 MHz Clock
212.5 MHz module
622 MHz
+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.2 V converter -48 V/ -60 V
+1.5 V DC/DC
+1.8 V
+2.5 V converter Fuse
+3.3 V backup
power

The function modules are described as follows:

Client-side Access Module

The client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCON
services. The client-side interface unit performs O/E conversion for services and monitors the
optical signals at client side.

In the upstream direction, the client-side data interface (CDI) receives serial data signals input
by the SFP optical module. The serial data signals are then transmitted to the PCS function
module for physical layer and 8B/10B line performance monitoring.

In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. The
signals are then adapted into client reference clock by inserting or discarding idle packets. After
being converted from parallel signals to serial signals, the signals are transmitted through the
CDI interface to the optical module at client side.

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FC protocol Processing Module

The FC protocol processing unit mainly extends the distance the FC services. This module
supports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km.
The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer
functions include:
l 8B/10B conversion
l Synchronous processing
l Extraction of primitive signal and primitive sequence

The FC2 layer functions include:

l Check and statistics of all special frames
l Modification of values of some special frames (FLOG1, PLOG1 and ELP)
l CRC check

Encapsulation and Mapping Module

The encapsulation and mapping module mainly:
l Encapsulates and mappings data
l Decapsulates and demappings data

According to signal flow direction, the function modules inside the chip can be classified into
modules in ingress direction and ones in egress direction. The ingress direction is for processing
from client side to line side. The egress direction is for line-side processing.
Ingress direction:
Through GFP encapsulation, 64B/65B conversion is performed to data bytes after decoding.
The data bytes are then mapped under GFP protocol.
Egress direction:
SDH data frames are received from the line-side interface module. After the overhead is
processed, GFP data frames are extracted from SDH concatenated channels and then are
transmitted to the decapsulating module for decapsulation.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module manages and configures other modules of the boards. This module contains
basic logic units:
l Writes and reads register
l Provides interface for CPU
l Checks and selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Checks reset control circuits of each chip

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l Controls the shutting down of the optical module

l Processes communications
l Controls indicators

System Clock Module

This module provides required reference clocks for boards. The clock frequencies are 100 MHz,
125 MHz and so on.

DC/DC Converter Module

Through the DC/DC module, the power unit generates direct currents for each chip on the board.
The –48 V/ –60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5
V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.

7.17.4 Front Panel

On the front panel of the MST4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-44 shows the appearance of the front panel of the MST4.

Figure 7-44 Front panel of the MST4

MST4

STAT
ACT
PROG
SRV
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

MST4

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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the MST4. Table 7-73 lists the
type and usage of the optical interfaces.

Table 7-73 Optical interfaces of the MST4

Interface Interface Usage
Type

IN1-IN4 LC Receives multi-service optical signals.

OUT1-OUT4 LC Transmits multi-service optical signals.

7.17.5 Valid Slots

The MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4
can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.17.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the MST4 indicates the service type, optical interface type and transmission distance.
Table 7-74 lists the relation between the board feature code and service type.

Table 7-74 Relation between the board feature code and service type
Board Barcode Feature Service Type (Optical Interface Transmission
Code Type) Distance

SSN1MST410 10 2 x FC (SM) 2 km

SSN1MST411 11 2 x FC (SM) 15 km

SSN1MST412 12 2 x FC (MM) 0.5 km

SSN1MST413 13 4 x ESCON/DVB-ASI (SM) 15 km

SSN1MST414 14 4 x ESCON/DVB-ASI (MM) 2 km

SSN1MST415 15 1 x FC2 (MM) -

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Board Barcode Feature Service Type (Optical Interface Transmission

Code Type) Distance

ESCON/DVB-ASI (MM)

SSN1MST416 16 1 x FC2 (MM) -

ESCON/DVB-ASI (SM)

SSN1MST417 17 1 x FC (SM) 2 km

2 x ESCON/DVB-ASI (SM) -

SSN1MST418 18 1 x FC (SM) 2 km

2 x ESCON/DVB-ASI (MM) -

7.17.7 Board Configuration Reference

You can use the T2000 to set parameters for the MST4.

You can use the T2000 to set the following parameters for the MST4:

l J1 byte
l C2 byte

For details on the parameters, refer to F Board Configuration Reference.

7.17.8 Technical Specifications

The specifications of the MST4 cover the optical interface specifications, mechanical
specifications and power consumption.

Optical Interface Specifications

The optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-75
lists the specifications of the optical interfaces.

Table 7-75 Specifications of the optical interfaces of the MST4

Item Specification

Optical interface X3.296/(DVB-ASI )

type EN50083-9
200-M5-SN-I 200-SM-LC-I

Optical module 34060277 34060287 34060325 34060288 34060278

code

Service type ESCON/DVB FC200, FC100

Service rate STM-4 STM-1 2.125 Gbit/s STM-16

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Item Specification

Optical source SLM LED LED MLM SLM

type

Wavelength 1310 850 1310

(nm)

Transmission 15 2 0.5 2 15
distance (km)

Max. launched –8 –14 -2.5 -3 0

optical power
(dBm)

Min. launched –15 –19 -9.5 -10 -5

optical power
(dBm)

Receiver –31 –30 –17 –21

sensitivity
(dBm)

Overload optical –8 –14 0 –3 0

power (dBm)

Mechanical Specifications
The mechanical specifications of the MST4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the MST4 is 26 W.

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8 Interface Boards and Switching Boards

About This Chapter

This chapter describes the interface and switching boards. The interface boards are used to access
cables and fibers. The switching boards are used to provide the TPS protection.

8.1 L12S
This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.2 D12B
This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,
function, principle, front panel and specifications.
8.3 D12S
This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.4 L75S
This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.5 D75S
This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.6 D34S
This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.7 C34S
This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.8 EU04
This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.9 EU08

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This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.10 OU08
This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
8.11 MU04
This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the
version, function, principle, front panel and specifications.
8.12 TSB4
This section describes the TSB4, a 4-channel interface switching board.
8.13 TSB8
This section describes the TSB8, an 8-channel optical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.14 EFF8
This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the
version, function, principle, front panel and specifications.
8.15 ETF8
This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of
the version, function, principle, front panel and specifications.
8.16 ETS8
This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,
in terms of the version, function, principle, front panel and specifications.
8.17 DM12
This section describes the DM12, a DDN interface board, in terms of the version, function,
principle, front panel and specifications.

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8.1 L12S
This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.1.1 Version Description
The functional version of the L12S is R1.
8.1.2 Function and Feature
The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be
used with the PD1.
8.1.3 Working Principle and Signal Flow
The L12S consists of the interface module, switch matrix module, and power supply module.
8.1.4 Front Panel
On the front panel of the L12S, there are interfaces and barcode.
8.1.5 Valid Slots
As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX
OSN 1500A subrack.
8.1.6 Technical Specifications
The technical specifications of the L12S cover the board dimensions, weight and power
consumption.

8.1.1 Version Description

The functional version of the L12S is R1.

8.1.2 Function and Feature

The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be
used with the PD1.

8.1.3 Working Principle and Signal Flow

The L12S consists of the interface module, switch matrix module, and power supply module.
Figure 8-1 shows the block diagram for the functions of the L12S.

Figure 8-1 Block diagram for the functions of the L12S

Backplane
Cross-
connect
board
E1/T1 PD1
Swictch
Interface matrix
module module

E1/T1 PD1

+3.3 V Power Fuse

supply +3.3 V Power
module

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Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the protection board for bridging.

In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.1.4 Front Panel

On the front panel of the L12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-2 shows the appearance of the front panel of the L12S.

Figure 8-2 Front panel of the L12S

L12S
1-16

Interfaces
On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16
x E1/T1 electrical signals.

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8.1.5 Valid Slots

As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX
OSN 1500A subrack.
Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housed
in the slot with a smaller number accesses the first 16 (1–16) channels of E1/T1 electrical signals.
The L12S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1/
T1 electrical signals.

Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A
subrack
Valid Slot for the PD1 Corresponding Slot for the L12S

Slot 12 Slots 6 and 7

8.1.6 Technical Specifications

The technical specifications of the L12S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the L12S are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.27

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the L12S is 4.5 W.

8.2 D12B
This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,
function, principle, front panel and specifications.

8.2.1 Version Description

The functional version of the D12B board is N1.
8.2.2 Function and Feature
The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be
used with the PQ1 or PQM.
8.2.3 Working Principle and Signal Flow
The D12B consists of the interface module and power supply module.
8.2.4 Front Panel
On the front panel of the D12B, there are interfaces and barcode.
8.2.5 Valid Slots

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The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12B
can be used as the interface board for the PQ1 or PQM.
8.2.6 Technical Specifications
The technical specifications of the D12B cover the board dimensions, weight and power
consumption.

8.2.1 Version Description

The functional version of the D12B board is N1.

8.2.2 Function and Feature

The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be
used with the PQ1 or PQM.

8.2.3 Working Principle and Signal Flow

The D12B consists of the interface module and power supply module.
Figure 8-3 shows the block diagram for the functions of the D12B.

Figure 8-3 Block diagram for the functions of the D12B

Backplane

E1/T1 PQ1/PQM
Interface
module

E1/T1 PQ1/PQM

+3.3 V Power Fuse +3.3 V

supply Power
module

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.2.4 Front Panel

On the front panel of the D12B, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-4 shows the appearance of the front panel of the D12B.

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Figure 8-4 Front panel of the D12B

D12B

1～8
9～16
17～24
25～32

D12B

Interfaces
There are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type and
usage of the interfaces.

Table 8-2 Interfaces on the front panel of the D12B

Interface Interface Usage
Type

1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.

9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.

17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.

25–32 DB44 Receive eight channels (25-32) of E1/T1 signals.

Table 8-3 lists the pins of the DB44 interfaces.

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Table 8-3 Pins of the DB44 interfaces of the D12B

Front View Pin Usage Pin Usage

1 38 R1 to receive the 34 R5 to receive the

first channel of fifth channel of
23 signals. 19 signals.

37 R2 to receive the 33 R6 to receive the

second channel of sixth channel of
22 signals. 18 signals.

36 R3 to receive the 32 R7 to receive the

third channel of seventh channel of
21 signals. 17 signals.

44 35 R4 to receive the 31 R8 to receive the

fourth channel of eighth channel of
20 signals. 16 signals.

15 T1 to transmit the 11 T5 to transmit the

first channel of fifth channel of
30 signals. 26 signals.

14 T2 to transmit the 10 T6 to transmit the

second channel of sixth channel of
29 signals. 25 signals.

13 T3 to transmit the 9 T7 to transmit the

third channel of seventh channel of
28 signals. 24 signals.

12 T4 to transmit the 8 T8 to transmit the

fourth channel of eighth channel of
27 signals. 7 signals.

8.2.5 Valid Slots

The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12B
can be used as the interface board for the PQ1 or PQM.
Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12B
housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical
signals. The D12B housed in the slot with a larger number accesses the last 31 (33–63) channels
of E1/T1 electrical signals.

Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN
1500B subrack
Valid Slot for the PQ1/PQM Corresponding Slot for the D12B

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

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8.2.6 Technical Specifications

The technical specifications of the D12B cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D12B are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.3

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D12B is 0 W.

8.3 D12S
This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.

8.3.1 Version Description

The functional version of the D12S board is N1.
8.3.2 Function and Feature
The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be
used with the PQ1 or PQM.
8.3.3 Working Principle and Signal Flow
The D12S consists of the interface module, switch matrix module, and power supply module.
8.3.4 Front Panel
On the front panel of the D12S, there are interfaces and barcode.
8.3.5 Valid Slots
The D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12S
can be used as the interface board for the PQ1 or PQM.
8.3.6 Technical Specifications
The technical specifications of the D12S cover the board dimensions, weight and power
consumption.

8.3.1 Version Description

The functional version of the D12S board is N1.

8.3.2 Function and Feature

The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be
used with the PQ1 or PQM.

8.3.3 Working Principle and Signal Flow

The D12S consists of the interface module, switch matrix module, and power supply module.

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Figure 8-5 shows the block diagram for the functions of the D12S.

Figure 8-5 Block diagram for the functions of the D12S

Backplane
Cross-
connect
board
E1/T1 PQ1/
Swictch PQM
Interface matrix
module module
PQ1/
E1/T1 PQM

+3.3 V Power Fuse

supply +3.3 V Power
module

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 or PQM board. When the TPS protection is performed,
the switch matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.3.4 Front Panel

On the front panel of the D12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-6 shows the appearance of the front panel of the D12S.

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Figure 8-6 Front panel of the D12S

D12S

1～8
9～16
17～24
25～32

D12S

Interfaces
There are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usage
of the optical interfaces.

Table 8-5 Interfaces on the front panel of the D12S

Interface Interface Usage
Type

1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.

9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.

17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.

25–32 DB44 Receive eight channels (25–32) of E1/T1 signals.

Table 8-6 lists the pins of the DB44 interfaces.

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Table 8-6 Pins of the DB44 interfaces of the D12S

Front View Pin Usage Pin Usage

1 38 R1 to receive the 34 R5 to receive the fifth

first channel of channel of signals.
23 signals. 19

37 R2 to receive the 33 R6 to receive the sixth

second channel of channel of signals.
22 signals. 18

36 R3 to receive the 32 R7 to receive the

third channel of seventh channel of
21 signals. 17 signals.

44 35 R4 to receive the 31 R8 to receive the

fourth channel of eighth channel of
20 signals. 16 signals.

15 T1 to transmit the 11 T5 to transmit the

first channel of fifth channel of
30 signals. 26 signals.

14 T2 to transmit the 10 T6 to transmit the

second channel of sixth channel of
29 signals. 25 signals.

13 T3 to transmit the 9 T7 to transmit the

third channel of seventh channel of
28 signals. 24 signals.

12 T4 to transmit the 8 T8 to transmit the

fourth channel of eighth channel of
27 signals. 7 signals.

8.3.5 Valid Slots

The D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12S
can be used as the interface board for the PQ1 or PQM.
Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12S
housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical
signals. The D12S housed in the slot with a larger number accesses the last 31 (33–63) channels
of E1/T1 electrical signals.

Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN
1500B subrack
Valid Slot for the PQ1/PQM Corresponding Slot for the D12S

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

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8.3.6 Technical Specifications

The technical specifications of the D12S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D12S are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D12S in the switching
state is 9 W and that of the D12S in the normal state is 0 W.

8.4 L75S
This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the
version, function, principle, front panel and specifications.

8.4.1 Version Description

The functional version of the L75S is R1.
8.4.2 Function and Feature
The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used
with the PD1.
8.4.3 Working Principle and Signal Flow
The L75S consists of the interface module, switch matrix module, and power supply module.
8.4.4 Front Panel
On the front panel of the L75S, there are interfaces and barcode.
8.4.5 Valid Slots
The L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interface
board for the PD1.
8.4.6 Technical Specifications
The technical specifications of the L75S cover the board dimensions, weight and power
consumption.

8.4.1 Version Description

The functional version of the L75S is R1.

8.4.2 Function and Feature

The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used
with the PD1.

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8.4.3 Working Principle and Signal Flow

The L75S consists of the interface module, switch matrix module, and power supply module.

Figure 8-7 shows the block diagram for the functions of the L75S.

Figure 8-7 Block diagram for the functions of the L75S

Backplane
Cross-
connect
board
E1
Swictch PD1
Interface matrix
module module

E1 PD1

+3.3 V Power Fuse

supply +3.3 V Power
module

Interface Module
The interface module receives and transmits the E1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the protection board for bridging.

In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.4.4 Front Panel

On the front panel of the L75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-8 shows the appearance of the front panel of the L75S.

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Figure 8-8 Front panel of the L75S

L75S

1-16

Interfaces
On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16
x E1 electrical signals.

8.4.5 Valid Slots

The L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interface
board for the PD1.

Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housed
in the slot with a smaller number accesses the first 16 (1–16) channels of E1 electrical signals.
The L75S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1
electrical signals.

Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S

Valid Slot for the PD1 Corresponding Slot for the L75S

Slot 12 Slots 6 and 7

8.4.6 Technical Specifications

The technical specifications of the L75S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the L75S are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.24

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the L75S is 2.7 W.

8.5 D75S
This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.

8.5.1 Version Description

The functional version of the D75S board is N1.
8.5.2 Function and Feature
The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be
used with the PQ1.
8.5.3 Working Principle and Signal Flow
The D75S consists of the interface module, switch matrix module, and power supply module.
8.5.4 Front Panel
On the front panel of the D75S, there are interfaces and barcode.
8.5.5 Valid Slots
As the interface board for the PQ1, the D75S can be housed in any of slots 14–17 in the OptiX
OSN 1500B subrack.
8.5.6 Technical Specifications
The technical specifications of the D75S cover the board dimensions, weight and power
consumption.

8.5.1 Version Description

The functional version of the D75S board is N1.

8.5.2 Function and Feature

The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be
used with the PQ1.

8.5.3 Working Principle and Signal Flow

The D75S consists of the interface module, switch matrix module, and power supply module.
Figure 8-9 shows the block diagram for the functions of the D75S.

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Figure 8-9 Block diagram for the functions of the D75S

Backplane
Cross-
connect
board
E1/T1 PQ1/
Swictch PQM
Interface matrix
module module
PQ1/
E1/T1
PQM

+3.3 V Power Fuse

supply +3.3 V Power
module

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PQ1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.5.4 Front Panel

On the front panel of the D75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-10 shows the appearance of the front panel of the D75S.

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Figure 8-10 Front panel of the D75S

D75S

1～8
9～16
17～24
25 ～32

D75S

Interfaces
There are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usage
of the DB44 interfaces.

Table 8-9 Interfaces on the front panel of the D75S

Interface Interface Usage
Type

1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.

9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.

17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.

25–32 DB44 Receive eight channels (25–32) of E1/T1 signals.

Table 8-10 lists the pins of the DB44 interface.

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Table 8-10 Pins of the DB44 interfaces of the D75S

Front View Pin Usage Pin Usage

1 38 R1 to receive the 34 R5 to receive the fifth

first channel of channel of signals.
23 signals. 19

37 R2 to receive the 33 R6 to receive the sixth

second channel of channel of signals.
22 signals. 18

36 R3 to receive the 32 R7 to receive the

third channel of seventh channel of
21 signals. 17 signals.

44 35 R4 to receive the 31 R8 to receive the

fourth channel of eighth channel of
20 signals. 16 signals.

15 T1 to transmit the 11 T5 to transmit the

first channel of fifth channel of
30 signals. 26 signals.

14 T2 to transmit the 10 T6 to transmit the

second channel of sixth channel of
29 signals. 25 signals.

13 T3 to transmit the 9 T7 to transmit the

third channel of seventh channel of
28 signals. 24 signals.

12 T4 to transmit the 8 T8 to transmit the

fourth channel of eighth channel of
27 signals. 7 signals.

8.5.5 Valid Slots

As the interface board for the PQ1, the D75S can be housed in any of slots 14–17 in the OptiX
OSN 1500B subrack.
Table 8-11 lists the valid slots for the PQ1 and corresponding slots for the D75S. The D75S
housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electrical
signals. The D75S housed in the slot with a larger number accesses the last 31 (33–63) channels
of E1/T1 electrical signals.

Table 8-11 Valid slots for the PQ1 and corresponding slots for the D75S in the OptiX OSN
1500B subrack
Valid Slot for the PQ1 Corresponding Slot for the D75S

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

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8.5.6 Technical Specifications

The technical specifications of the D75S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D75S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D75S in the switching
state is 6 W and that of the D75S in the normal state is 0 W.

8.6 D34S
This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.

8.6.1 Version Description

The functional version of the D34S board is N1.
8.6.2 Function and Feature
The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be
used with the PD3 and PQ3.
8.6.3 Working Principle and Signal Flow
The D34S consists of the interface module, switch matrix module, and power supply module.
8.6.4 Front Panel
On the front panel of the D34S, there are interfaces and barcode.
8.6.5 Valid Slots
the D34S can be housed in any of slots 14-17 in the OptiX OSN 1500B subrack.
8.6.6 Technical Specifications
The technical specifications of the D34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.6.1 Version Description

The functional version of the D34S board is N1.

8.6.2 Function and Feature

The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be
used with the PD3 and PQ3.

8.6.3 Working Principle and Signal Flow

The D34S consists of the interface module, switch matrix module, and power supply module.

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Figure 8-11 shows the block diagram for the functions of the D34S.

Figure 8-11 Block diagram for the functions of the D34S

Backplane
Cross-
connect
board
E3/T3 PD3
Interface Swictch TSB8
module matrix
module TSB8
E3/T3 PD3

+3.3 V Power Fuse

supply +3.3 V Power
module

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD3 or PQ3 board. When the TPS protection is performed,
the switch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.6.4 Front Panel

On the front panel of the D34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-12 shows the appearance of the front panel of the D34S.

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Figure 8-12 Front panel of the D34S

D34S

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6

D34S

Interfaces
There are six pairs of electrical interfaces on the front panel of the D34S.

Table 8-12 lists the type and usage of interfaces on the D34S.

Table 8-12 Interfaces of the D34S

Interface Interface Usage

Type

IN1–IN6 SMB Receive six channels (1–6) of E3/T3 electrical signals.

OUT1–OUT6 SMB Transmit six channels (1–6) of E3/T3 electrical signals.

8.6.5 Valid Slots

the D34S can be housed in any of slots 14-17 in the OptiX OSN 1500B subrack.

8.6.6 Technical Specifications

The technical specifications of the D34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

Table 8-13 lists the specifications of the electrical interfaces of the D34S.

Table 8-13 Specifications of the electrical interfaces of the D34S

Item Specification

Interface type 34368 kbit/s and 44736k bit/s

Code HDB3 (E3) and B3ZS (T3)

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequency

deviation

Allowed input attenuation

Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the D34S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D34S in the switching
state is 2 W and that of the D34S in the normal state is 0 W.

8.7 C34S
This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.

8.7.1 Version Description

The functional version of the C34S board is N1.
8.7.2 Function and Feature
The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be
used with the PL3.
8.7.3 Working Principle and Signal Flow
The C34S consists of the interface module, switch matrix module, and power supply module.
8.7.4 Front Panel
On the front panel of the C34S, there are interfaces and barcode.
8.7.5 Valid Slots
As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX
OSN 1500B subrack.

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8.7.6 Technical Specifications

The technical specifications of the C34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.7.1 Version Description

The functional version of the C34S board is N1.

8.7.2 Function and Feature

The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be
used with the PL3.

8.7.3 Working Principle and Signal Flow

The C34S consists of the interface module, switch matrix module, and power supply module.
Figure 8-13 shows the block diagram for the functions of the C34S.

Figure 8-13 Block diagram for the functions of the C34S

Backplane
Cross-
connect
board
E3/T3 PL3
Swictch TSB8
Interface
matrix
module
module TSB8
E3/T3 PL3

+3.3 V Power Fuse

-48 V/-60 V
supply
Power module
-48 V/-60 V
supply Fuse +3.3 V
module backeup
power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PL3 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

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8.7.4 Front Panel

On the front panel of the C34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-14 shows the appearance of the front panel of the C34S.

Figure 8-14 Front panel of the C34S

C34S
OUT1
IN1
OUT2
IN2
OUT3
IN3

C34S

Interfaces
There are three pairs of electrical interfaces on the front panel of the C34S.

Table 8-14 lists the type and usage of interfaces on the C34S.

Table 8-14 Interfaces of the C34S

Interface Interface Usage

Type

IN1–IN3 SMB Receive the first three channels (1–3) of E3/T3 electrical
signals.

OUT1–OUT3 SMB Transmit the first three channels (1–3) of E3/T3 electrical
signals.

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8.7.5 Valid Slots

As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX
OSN 1500B subrack.

Table 8-15 lists the valid slots for the PL3 and corresponding slots for the C34S.

Table 8-15 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN
1500B subrack

Valid Slot for the PL3 Corresponding Slot for the C34S

Slot 12 Slot 14

Slot 13 Slot 16

8.7.6 Technical Specifications

The technical specifications of the C34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-16 lists the specifications of the electrical interfaces of the C34S.

Table 8-16 Specifications of the electrical interfaces of the C34S

Item Specification

Interface type 34368 kbit/s and 44736 kbit/s

Code HDB3 (E3) and B3ZS (T3)

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequency

deviation

Allowed input attenuation

Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the C34S are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.3

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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the C34S in the switching
state is 2 W and that of the C34S in the normal state is 0 W.

8.8 EU04
This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.

8.8.1 Version Description

The functional version of the EU04 board is N1.
8.8.2 Function and Feature
The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be
used with the SEP.
8.8.3 Working Principle and Signal Flow
The EU04 consists of the interface module, switch matrix module, and power supply module.
8.8.4 Front Panel
On the front panel of the EU04, there are interfaces and barcode.
8.8.5 Valid Slots
As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.8.6 Technical Specifications
The technical specifications of the EU04 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.8.1 Version Description

The functional version of the EU04 board is N1.

8.8.2 Function and Feature

The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be
used with the SEP.

8.8.3 Working Principle and Signal Flow

The EU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1
signals.

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Figure 8-15 Block diagram for the functions of the EU04

Backplane
Cross-
connect
board
STM-1(e)
SEP
Swictch TSB8
Interface
matrix
module
module TSB8
STM-1(e)
SEP

+3.3 V Power Fuse

-48 V/-60 V
supply
Power module
-48 V/-60 V
supply Fuse +3.3 V
module backeup
power

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SEP board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.8.4 Front Panel

On the front panel of the EU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-16 shows the appearance of the front panel of the EU04.

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Figure 8-16 Front panel of the EU04

EU04

OUT1 IN1
OUT2 IN2
OUT3 IN3 OUT4
IN4

EU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the EU04.

Table 8-17 lists the type and usage of interfaces on the EU04.

Table 8-17 Interfaces of the EU04

Interface Interface Usage

Type

IN1–IN4 SMB Receive four (1–4) channels of electrical interfaces.

OUT1–OUT4 SMB Transmit four (1–4) channels of electrical interfaces.

8.8.5 Valid Slots

As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.

Table 8-18 lists the valid slots for the SEP and corresponding slots for the EU04.

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Table 8-18 Valid slots for the SEP and corresponding slots for the EU04
Valid Slot for the SEP Corresponding Slot for the EU04

Slot 12 Slot 14

Slot 13 Slot 16

8.8.6 Technical Specifications

The technical specifications of the EU04 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-19 lists the specifications of the electrical interfaces of the EU04.

Table 8-19 Specifications of the electrical interfaces of the EU04

Item Specification

Interface Type 155520 kbit/s

Code CMI

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequency

deviation

Allowed input attenuation

Mechanical Specifications
The mechanical specifications of the EU04 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EU04 is 6 W.

8.9 EU08
This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.

8.9.1 Version Description

The functional version of the EU08 board is N1.

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8.9.2 Function and Feature

The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be
used with the SEP.
8.9.3 Working Principle and Signal Flow
The EU08 consists of the interface module, switch matrix module, and power supply module.
8.9.4 Front Panel
On the front panel of the EU08, there are interfaces and barcode.
8.9.5 Valid Slots
As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.9.6 Technical Specifications
The technical specifications of the EU08 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.9.1 Version Description

The functional version of the EU08 board is N1.

8.9.2 Function and Feature

The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be
used with the SEP.

8.9.3 Working Principle and Signal Flow

The EU08 consists of the interface module, switch matrix module, and power supply module.
Figure 8-17 shows the block diagram for the functions of the EU08.

Figure 8-17 Block diagram for the functions of the EU08

Backplane
Cross-
connect
board
STM-1(e)
SEP
Swictch TSB8
Interface
matrix
module
module TSB8
STM-1(e)
SEP

+3.3 V
+3.3 V Power Fuse backeup
supply power
module

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals

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from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SEP board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.9.4 Front Panel

On the front panel of the EU08, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-18 shows the appearance of the front panel of the EU08.

Figure 8-18 Front panel of the EU08

EU08
OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8

EU08

Interfaces
There are eight pairs of electrical interfaces on the front panel of the EU08.

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Table 8-20 lists the type and usage of interfaces on the EU08.

Table 8-20 Interfaces of the EU08

Interface Interface Usage

Type

IN1–IN8 SMB Receive eight (1–8) channels of electrical interfaces.

OUT1–OUT8 SMB Transmit eight (1–8) channels of electrical interfaces.

8.9.5 Valid Slots

As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.

Table 8-21 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiX
OSN 1500B.

NOTE

The OptiX OSN 1500A does not support the EU08 board.

Table 8-21 Valid slots for the SEP and corresponding slots for the EU08

Valid Slot for the SEP Corresponding Slot for the EU08

Slot 12 Slot 14

Slot 13 Slot 16

8.9.6 Technical Specifications

The technical specifications of the EU08 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-22 lists the specifications of the electrical interfaces of the EU08.

Table 8-22 Specifications of the electrical interfaces of the EU08

Item Specification

Interface type 155520 kbit/s

Code CMI

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequency deviation

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Item Specification

Allowed input attenuation

Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the EU08 are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EU08 is 11 W.

8.10 OU08
This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.

8.10.1 Version Description

The OU08 has two versions, N1 and N2. The main difference between the two versions lies in
the connector type for optical interfaces and the pluggability of the optical modules.
8.10.2 Function and Feature
The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be
used with the SEP.
8.10.3 Working Principle and Signal Flow
The OU08 consists of the interface module and power supply module.
8.10.4 Front Panel
On the front panel of the OU08, there are interfaces and barcode.
8.10.5 Valid Slots
As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.10.6 Technical Specifications
The technical specifications of the OU08 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.10.1 Version Description

The OU08 has two versions, N1 and N2. The main difference between the two versions lies in
the connector type for optical interfaces and the pluggability of the optical modules.

Table 8-23 lists the details on the two versions of the OU08 board.

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Table 8-23 Version description of the OU08

Item Specification

Functional The OU08 has two versions, N1 and N2.

version

Commonness The N1 and N2 versions share the same working principle.

Difference The optical interface of the N1OU08 uses the LC connector. The optical
interface of the N2OU08 uses the SC connector. The N1OU08 uses the
pluggable optical module. The N2OU08 does not use the pluggable
optical module.

Replaceability None.

8.10.2 Function and Feature

The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be
used with the SEP.

8.10.3 Working Principle and Signal Flow

The OU08 consists of the interface module and power supply module.

Figure 8-19 shows the block diagram for the functions of the OU08.

Figure 8-19 Block diagram for the functions of the OU08

Backplane

STM-1(o) SEP
Interface
module
STM-1(o)
SEP

+3.3 V Power Fuse

+3.3 V
supply Power
module

Interface Module
In the receive direction, the interface module performs O/E convertion for the STM-1 signals,
and transmits the signals to the SEP board.

In the transmit direction, the interface module performs the E/O convertion for the STM-1
signals, and transmits the signals to the optical interface.

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Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.10.4 Front Panel

On the front panel of the OU08, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 and
N2OU08 respectively.

Figure 8-20 Front panel of the N1OU08

OU08
OUT1IN1OUT2 IN2 OUT3IN3 OUT4 IN4OUT5IN5 OUT6IN6 OUT7IN7OUT8 IN8

OU08

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Figure 8-21 Front panel of the N2OU08

OU08

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
OUT8
IN7
IN8

OU08

Interfaces
There are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08.
Table 8-24 lists the interface type and usage for the N1OU08. Table 8-25 lists the interface type
and usage for the N2OU08.

Table 8-24 Interfaces of the N1OU08

Interface Interface Usage
Type

IN1–IN8 LC Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8 LC Transmit eight (1–8) channels of STM-1 optical signals.

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Table 8-25 Interfaces of the N2OU08

Interface Interface Usage

Type

IN1–IN8 SC Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8 SC Transmit eight (1–8) channels of STM-1 optical signals.

8.10.5 Valid Slots

As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.

Table 8-26 lists the valid slots for the SEP and corresponding slots for the OU08.

Table 8-26 Valid slots for the SEP and corresponding slots for the OU08

Valid Slot for the SEP Corresponding Slot for the OU08

Slot 12 Slot 14

Slot 13 Slot 16

8.10.6 Technical Specifications

The technical specifications of the OU08 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-27 lists the specifications of the optical interfaces of the OU08.

Table 8-27 Specifications of the optical interfaces of the OU08

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface type S-1.1

Working wavelength N1OU08 (1260–1360)

(nm) N2OU08 (1261–1360)

Optical source type MLM

Mean launched optical –15 to –8

power (dBm)

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Item Specification

Receiver sensitivity –28

(dBm)

Mechanical Specifications
The mechanical specifications of the OU08 are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the OU08 is 6 W.

8.11 MU04
This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the
version, function, principle, front panel and specifications.

8.11.1 Version Description

The functional version of the MU04 board is N1.
8.11.2 Function and Feature
The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must
be used with the SPQ4.
8.11.3 Working Principle and Signal Flow
The MU04 consists of the interface module, switch matrix module, and power supply module.
8.11.4 Front Panel
On the front panel of the MU04, there are interfaces and barcode.
8.11.5 Valid Slots
As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.11.6 Technical Specifications
The technical specifications of the MU04 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.11.1 Version Description

The functional version of the MU04 board is N1.

8.11.2 Function and Feature

The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must
be used with the SPQ4.

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8.11.3 Working Principle and Signal Flow

The MU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-22 shows the block diagram for the functions of the MU04.

Figure 8-22 Block diagram for the functions of the MU04

Backplane
Cross-
connect
board
E4/STM-1(e)
SPQ4
Swictch TSB8
Interface
matrix
module
module TSB8
E4/STM-1(e)
SPQ4

+3.3 V
+3.3 V Power Fuse backeup
supply power
module

Interface Module
The interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SPQ4 board. When the TPS protection is performed, the
switch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.11.4 Front Panel

On the front panel of the MU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-23 shows the appearance of the front panel of the MU04.

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Figure 8-23 Front panel of the MU04

MU04

OUT1
IN1
OUT2
IN2
OUT3 IN3
OUT4
IN4

MU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the MU04.

Table 8-28 lists the type and usage of interfaces on the MU04.

Table 8-28 Interfaces of the MU04

Interface Interface Usage

Type

IN1–IN4 SMB Receive four (1–4) channels of E4/STM-1 electrical

interfaces.

OUT1–OUT4 SMB Transmit four (1–4) channels of E4/STM-1 electrical

interfaces.

8.11.5 Valid Slots

As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.

Table 8-29 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

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Table 8-29 Valid slots for the SPQ4 and corresponding slots for the MU04
Valid Slot for the SPQ4 Corresponding Slot for the MU04

Slot 12 Slot 14

Slot 13 Slot 16

8.11.6 Technical Specifications

The technical specifications of the MU04 cover the optical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-30 lists the specifications of the electrical interfaces of the MU04.

Table 8-30 Specifications of the electrical interfaces of the MU04

Item Specification

Interface Type 139264 kbit/s and 155520 kbit/s

Code CMI

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequency deviation

Allowed input attenuation

Mechanical Specifications
The mechanical specifications of the MU04 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the MU04 is 2 W.

8.12 TSB4
This section describes the TSB4, a 4-channel interface switching board.

8.12.1 Version Description

The functional version of the TSB4 board is N1.
8.12.2 Function and Feature

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The TSB4, an four-channel electrical interface switching board, is used to provide the TPS
protection.
8.12.3 Working Principle and Signal Flow
The TSB4 consists of the switch matrix module and power supply module.
8.12.4 Front Panel
On the front panel of the TSB4, there is the barcode.
8.12.5 Valid Slots
When used with different processing boards and interface boards to realize the TPS protection,
the TSB4 can be housed in different slots.The OptiX OSN 1500A does not support the TSB4.
8.12.6 Technical Specifications
The technical specifications of the TSB4 cover the board dimensions, weight and power
consumption.

8.12.1 Version Description

The functional version of the TSB4 board is N1.

8.12.2 Function and Feature

The TSB4, an four-channel electrical interface switching board, is used to provide the TPS
protection.
l When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.
l When used with the C34S, the TSB8 provides the TPS protection for the PL3.
l When used with the EU04, the TSB8 provides the TPS protection for the SEP.

8.12.3 Working Principle and Signal Flow

The TSB4 consists of the switch matrix module and power supply module.

Figure 8-24 shows the block diagram for the functions of the TSB4.

Figure 8-24 Block diagram for the functions of the TSB4

Backplane
Backplane
Cross-
connect
board
Interface
board 1 Standby
Interface processing
board 2
Interface board
board 3 Swictch
matrix
module

+3.3 V Power Fuse +3.3 V

supply backup
module power

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Switch Matrix Module

In the receive direction, the switch matrix module selects signals from one of the three interface
boards according to the TPS protection control signals from the cross-connect board, and outputs
the signals to the backup processing board.

In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.12.4 Front Panel

On the front panel of the TSB4, there is the barcode.

Appearance of the Front Panel

Figure 8-25 shows the appearance of the front panel of the TSB4.

Figure 8-25 Front panel of the TSB4

TSB4

TSB4

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8.12.5 Valid Slots

When used with different processing boards and interface boards to realize the TPS protection,
the TSB4 can be housed in different slots.The OptiX OSN 1500A does not support the TSB4.

Table 8-31 lists the valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04.

Table 8-31 Valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04

Valid Slot for the TSB4 Valid Slot for the SPQ4 Corresponding Slot for
the MU04

Slot 14 Slot 13 Slot 16

Table 8-32 lists the valid slots for the TSB4 and corresponding slots for the SEP and EU04.

Table 8-32 Valid slots for the TSB4 and corresponding slots for the SEP and EU04

Valid Slot for the TSB4 Valid Slot for the SEP Corresponding Slot for
the EU04

Slot 14 Slot 13 Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel
of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board
to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-33 lists the valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8.

Table 8-33 Valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8

Valid Slot for the TSB4 Valid Slot for the EFS0 Corresponding Slot for
the ETS8

Slot 14 Slot 13 Slot 16

8.12.6 Technical Specifications

The technical specifications of the TSB4 cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the TSB4 are as follows:

l Dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

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l Weight (kg): 0.28

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the TSB4 is 2.5 W.

8.13 TSB8
This section describes the TSB8, an 8-channel optical interface switching board, in terms of the
version, function, principle, front panel and specifications.

8.13.1 Version Description

The functional version of the TSB8 board is N1.
8.13.2 Function and Feature
The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS
protection.
8.13.3 Working Principle and Signal Flow
The TSB8 consists of the switch matrix module and power supply module.
8.13.4 Front Panel
On the front panel of the TSB8, there is the barcode.
8.13.5 Valid Slots
When used with different processing boards and interface boards to realize the TPS protection,
the TSB8 can be housed in different slots.The OptiX OSN 1500A does not support the TSB8.
8.13.6 Technical Specifications
The technical specifications of the TSB8 cover the board dimensions, weight and power
consumption.

8.13.1 Version Description

The functional version of the TSB8 board is N1.

8.13.2 Function and Feature

The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS
protection.
l When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.
l When used with the C34S, the TSB8 provides the TPS protection for the PL3.
l When used with the D34S, the TSB8 provides the TPS protection for the PD3.
l When used with the D34S, the TSB8 provides the TPS protection for the PQ3.
l When used with the EU04, the TSB8 provides the TPS protection for the SEP1.
l When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1.
l When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.

8.13.3 Working Principle and Signal Flow

The TSB8 consists of the switch matrix module and power supply module.

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Figure 8-26 shows the block diagram for the functions of the TSB8 when it processes one-
channel signals.

Figure 8-26 Block diagram for the functions of the TSB8

Backplane Backplane
Cross-
connect
board
Interface
board 1 Standby
Interface
board 2 processing
Interface board
board 3 Swictch
matrix
module

+3.3
Power Fuse
V +3.3 V
module Power

Switch Matrix Module

In the receive direction, the switch matrix module selects signals from one of the three interface
boards according to the TPS protection control signals from the cross-connect board, and outputs
the signals to the backup processing board.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.13.4 Front Panel

On the front panel of the TSB8, there is the barcode.

Appearance of the Front Panel

Figure 8-27 shows the appearance of the front panel of the TSB8.

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Figure 8-27 Front panel of the TSB8

TSB8

TSB8

8.13.5 Valid Slots

When used with different processing boards and interface boards to realize the TPS protection,
the TSB8 can be housed in different slots.The OptiX OSN 1500A does not support the TSB8.
Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04.

Table 8-34 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04
Valid Slot for the TSB8 Valid Slot for the SPQ4 Corresponding Slot for
the MU04

Slot 14 Slot 13 Slot 16

Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S.

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Table 8-35 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S
Valid Slot for the TSB8 Valid Slot for the PD3 Corresponding Slot for
the D34S

Slot 14 Slot 13 Slot 16

Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04.

Table 8-36 Valid slots for the TSB8 and corresponding slots for the SEP and EU04
Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot for
the EU04

Slot 14 Slot 13 Slot 16

Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08.

Table 8-37 Valid slots for the TSB8 and corresponding slots for the SEP and EU08
Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot for
the EU08

Slot 14 Slot 13 Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel
of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board
to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-38 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.

Table 8-38 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8
Valid Slot for the TSB8 Valid Slot for the EFS0 Corresponding Slot for
the ETS8

Slot 14 Slot 13 Slot 16

Table 8-39 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S.

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Table 8-39 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S

Valid Slot for the TSB8 Valid Slot for the PL3 Corresponding Slot for
the C34S

Slot 14 Slot 13 Slot 16

Table 8-40 lists the valid slots for the TSB8 and corresponding slots for the PQ3 and D34S.

Table 8-40 Valid slots for the TSB8 and corresponding slots for the PQ3 and D34S

Valid Slot for the TSB8 Valid Slot for the PQ3 Corresponding Slot for the
D34S

Slot 14 and 15 Slot 12 and 13 Slot 16 and 17

8.13.6 Technical Specifications

The technical specifications of the TSB8 cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the TSB8 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.3

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the TSB8 in the
switching state is 5 W and that of the TSB8 in the normal state is 0 W.

8.14 EFF8
This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the
version, function, principle, front panel and specifications.

8.14.1 Version Description

The functional version of the EFF8 board is N1.
8.14.2 Function and Feature
The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must
be used with the Ethernet processing board.
8.14.3 Working Principle and Signal Flow
The EFF8 consists of the interface module, switch matrix module, and power supply module.
8.14.4 Front Panel

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On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class
label.
8.14.5 Valid Slots
When used with different Ethernet processing boards, the EFF8 can be housed in different slots.
8.14.6 Technical Specifications
The technical specifications of the EFF8 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.14.1 Version Description

The functional version of the EFF8 board is N1.

8.14.2 Function and Feature

The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must
be used with the Ethernet processing board.

8.14.3 Working Principle and Signal Flow

The EFF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-28 shows the block diagram for the functions of the EFF8 when it processes 1 x 100M
Ethernet signals.

Figure 8-28 Block diagram for the functions of the EFF8

Backplane

100M EFT8/ EFS0/EMS4/EMR0

Interface
module

100M EFT8/EFS0/EMS4/EMR0

+3.3 V Power Fuse

+3.3 V Backup Power
module

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet
signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernet
signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

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8.14.4 Front Panel

On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 8-29 shows the appearance of the front panel of the EFF8.

Figure 8-29 Front panel of the EFF8

EFF8
1
2
3
4
5
6
7
8
LINKACT
OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8

CLASS 1
LASER
PRODUCT

EFF8

Indicators
For indication of indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the EFF8.

Table 8-41 lists the type and usage of interfaces on the EFF8.

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Table 8-41 Interfaces of the EFF8

Interface Interface Usage

Type

IN1–IN8 LC Receives eight (1–8) channels of Ethernet optical signals.

OUT1 – OUT8 LC Transmits eight (1–8) channels of Ethernet optical

signals.

8.14.5 Valid Slots

When used with different Ethernet processing boards, the EFF8 can be housed in different slots.

The slots valid for the EFF8 are as follows:

l As the interface board for the EFT8, the EFF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EFS0, the EFF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EMS4, the EFF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EMR0, the EFF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.

Table 8-42 lists the valid slots for the EFT8 and corresponding slots for the EFF8.

Table 8-42 Valid slots for the EFT8 and corresponding slots for the EFF8

Valid Slot for the EFT8 Corresponding Slot for the EFF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-43 lists the valid slots for the EFS0 and corresponding slots for the EFF8.

Table 8-43 Valid slots for the EFS0 and corresponding slots for the EFF8

Valid Slot for the EFS0 Corresponding Slot for the EFF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-44 lists the valid slots for the EMS4 and corresponding slots for the EFF8.

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Table 8-44 Valid slots for the EMS4 and corresponding slots for the EFF8

Valid Slot for the EMS4 Corresponding Slot for the EFF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-45 lists the valid slots for the EMR0 and corresponding slots for the EFF8.

Table 8-45 Valid slots for the EMR0 and corresponding slots for the EFF8

Valid Slot for the EMR0 Corresponding Slot for the EFF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

8.14.6 Technical Specifications

The technical specifications of the EFF8 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-46 lists the specifications of the optical interfaces of the EFF8.

Table 8-46 Specifications of the optical interfaces of the EFF8

Item Specification

Nominal bit rate 10 Mbit/s or 100 Mbit/s

Line code Manchester encoding signal (10M) or MLT-3 encoding signal

(100M)

Optical interface type 100Base-FX

Working wavelength 100Base-FX (15 km): 1261 to 1360

(nm)
100Base-FX (2 km): 1270 to 1380

Optical source type MLM

Mean launched 100Base-FX (15 km): –15 to –8

optical power (dBm)
100Base-FX (2 km): –19 to –14

Receiver sensitivity 100Base-FX (15 km): –28

(dBm)
100Base-FX (2 km): –30

Min. overload (dBm) 100Base-FX (15 km): –7

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Item Specification

100Base-FX (2 km): –14

Min. extinction ratio 10

(dB)

Mechanical Specifications
The mechanical specifications of the EFF8 are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFF8 is 6 W.

8.15 ETF8
This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of
the version, function, principle, front panel and specifications.

8.15.1 Version Description

The functional version of the ETF8 board is N1.
8.15.2 Function and Feature
The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8
must be used with the Ethernet processing board.
8.15.3 Working Principle and Signal Flow
The ETF8 consists of the interface module, switch matrix module, and power supply module.
8.15.4 Front Panel
On the front panel of the ETF8, there are interfaces and barcode.
8.15.5 Valid Slots
When used with different Ethernet processing boards, the ETF8 can be housed in different slots.
8.15.6 Technical Specifications
The technical specifications of the ETF8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.15.1 Version Description

The functional version of the ETF8 board is N1.

8.15.2 Function and Feature

The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8
must be used with the Ethernet processing board.

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8.15.3 Working Principle and Signal Flow

The ETF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-30 shows the block diagram for the functions of the ETF8 when it processes 1 x 100M
Ethernet signals.

Figure 8-30 Block diagram for the functions of the ETF8

Backplane

100M EFT8/ EFS0/EMS4/EMR0

Interface
module

100M EFT8/EFS0/EMS4/EMR0

+3.3 V Fuse
Power
+3.3 V Power
module

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet
signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernet
signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.15.4 Front Panel

On the front panel of the ETF8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-31 shows the appearance of the front panel of the ETF8.

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Figure 8-31 Front panel of the ETF8

ETF8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETF8

Interfaces
There are eight electrical interfaces on the front panel of the ETF8.
Table 8-47 lists the type and usage of interfaces on the ETF8.

Table 8-47 Interfaces of the ETF8

Interface Interface Usage
Type

FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electrical

signals.

Table 8-48 lists the pins of the RJ-45 connector of the ETF8.

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Table 8-48 Pins of the RJ-45 connector of the ETF8

Front View Pin Specification

1 Transmitting
positive

2 Transmitting
negative

3 Receiving positive
8 7 6 5 4 3 2 1
4 Grounding

5 Grounding

6 Receiving
negative

7 Grounding

8 Grounding

8.15.5 Valid Slots

When used with different Ethernet processing boards, the ETF8 can be housed in different slots.
The slots valid for the ETF8 are as follows:
l As the interface board for the EFT8, the ETF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EFS0, the ETF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EMS4, the ETF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
l As the interface board for the EMR0, the ETF8 can be housed in any of slots 14–17 in the
OptiX OSN 1500B subrack.
Table 8-49 lists the valid slots for the EFT8 and corresponding slots for the ETF8.

Table 8-49 Valid slots for the EFT8 and corresponding slots for the ETF8
Valid Slot for the EFT8 Corresponding Slot for the ETF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-50 lists the valid slots for the EFS0 and corresponding slots for the ETF8.

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Table 8-50 Valid slots for the EFS0 and corresponding slots for the ETF8

Valid Slot for the EFS0 Corresponding Slot for the ETF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-51 lists the valid slots for the EMS4 and corresponding slots for the ETF8.

Table 8-51 Valid slots for the EMS4 and corresponding slots for the ETF8

Valid Slot for the EMS4 Corresponding Slot for the ETF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

Table 8-52 lists the valid slots for the EMR0 and corresponding slots for the ETF8.

Table 8-52 Valid slots for the EMR0 and corresponding slots for the ETF8

Valid Slot for the EMR0 Corresponding Slot for the ETF8

Slot 12 Slots 14 and 15

Slot 13 Slots 16 and 17

8.15.6 Technical Specifications

The technical specifications of the ETF8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-53 lists the specifications of the electrical interfaces of the ETF8.

Table 8-53 Specifications of the electrical interfaces of the ETF8

Item Specification

Rate 10 Mbit/s or 100 Mbit/s

Code Manchester encoding signal (10M) or MLT-3 encoding signal

(100M)

Interface standard Compliant with IEEE 802.3u

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Mechanical Specifications
The mechanical specifications of the ETF8 are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ETF8 is 2 W.

8.16 ETS8
This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,
in terms of the version, function, principle, front panel and specifications.

8.16.1 Version Description

The functional version of the ETS8 board is N1.
8.16.2 Function and Feature
The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and
the ETS8 must be used with the EFS0.
8.16.3 Working Principle and Signal Flow
The ETS8 consists of the interface module, switch matrix module, and power supply module.
8.16.4 Front Panel
On the front panel of the ETS8, there are interfaces and barcode.
8.16.5 Valid Slots
As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.16.6 Technical Specifications
The technical specifications of the ETS8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.16.1 Version Description

The functional version of the ETS8 board is N1.

8.16.2 Function and Feature

The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and
the ETS8 must be used with the EFS0.

8.16.3 Working Principle and Signal Flow

The ETS8 consists of the interface module, switch matrix module, and power supply module.

Figure 8-32 shows the block diagram for the functions of the ETS8 when it processes 1 x 100M
Ethernet signals.

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Figure 8-32 Block diagram for the functions of the ETS8

Backplane
Cross-
connect
board
100M
EFS0
Swictch TSB8
Interface
matrix
module
module TSB8
100M
EFS0

+3.3 V
+3.3 V Power Fuse backeup
supply power
module

Interface Module
The interface module receives and transmits the Ethernet optical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the EFS0 board. When the TPS protection is performed, the
switch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.16.4 Front Panel

On the front panel of the ETS8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-33 shows the appearance of the front panel of the ETS8.

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Figure 8-33 Front panel of the ETS8

ETS8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETS8

Interfaces
There are eight electrical interfaces on the front panel of the ETS8.
Table 8-54 lists the type and usage of interfaces on the ETS8.

Table 8-54 Interfaces of the ETS8

Interface Interface Usage
Type

FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electrical

signals.

Table 8-55 lists the pins of the RJ-45 connector of the ETS8.

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Table 8-55 Pins of the RJ-45 connector of the ETS8

Front View Pin Specification

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

8 7 6 5 4 3 2 1 6 Receiving negative

7 Grounding

8 Grounding

8.16.5 Valid Slots

As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.

Table 8-56 lists the valid slots for the EFS0 and corresponding slots for the ETS8.

Table 8-56 Valid slots for the EFS0 and corresponding slots for the ETS8

Valid Slot for the EFS0 Corresponding Slot for the ETS8

Slot 12 Slot 14

Slot 13 Slot 16

8.16.6 Technical Specifications

The technical specifications of the ETS8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-57 lists the specifications of the electrical interfaces of the ETS8.

Table 8-57 Specifications of the electrical interfaces of the ETS8

Item Specification

Rate 10 Mbit/s or 100 Mbit/s

Code Manchester encoding signal (10M) or MLT-3 encoding

signal (100M)

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Item Specification

Interface standard Compliant with IEEE 802.3u

Mechanical Specifications
The mechanical specifications of the ETS8 are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.37

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ETS8 in the switching
state is 3 W and that of the ETS8 in the normal state is 0 W.

8.17 DM12
This section describes the DM12, a DDN interface board, in terms of the version, function,
principle, front panel and specifications.

8.17.1 Version Description

The functional version of the DM12 board is N1.
8.17.2 Function and Feature
The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1
electrical signals, and the DM12 must be used with the DX1.
8.17.3 Working Principle and Signal Flow
The DM12 consists of the interface module, switch matrix module, and power supply module.
8.17.4 Front Panel
On the front panel of the DM12, there are interfaces and barcode.
8.17.5 Valid Slots
As the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiX
OSN 1500B subrack.
8.17.6 Technical Specifications
The technical specifications of the DM12 cover the board dimensions, weight and power
consumption.

8.17.1 Version Description

The functional version of the DM12 board is N1.

8.17.2 Function and Feature

The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1
electrical signals, and the DM12 must be used with the DX1.

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8.17.3 Working Principle and Signal Flow

The DM12 consists of the interface module, switch matrix module, and power supply module.

Figure 8-34 shows the block diagram for the functions of the DM12 when it processes one
channel of N x 64 kbit/s or framed E1 electrical signals.

Figure 8-34 Block diagram for the functions of the DM12

Backplane
Cross-
connect
Nx64kbit/s / board
Frame E1
DX1
Swictch
Interface
matrix
module
Nx64kbit/s / module
Frame E1
DX1

+3.3 V Power Fuse

+3.3 V
supply Power
module

Interface Module
The interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electrical
signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the DX1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the DX1 board for bridging.

In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.17.4 Front Panel

On the front panel of the DM12, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-35 shows the appearance of the front panel of the DM12.

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Figure 8-35 Front panel of the DM12

DM12

E1(1-8)
DDN1
DDN2
DDN3
DDN4

DM12

Interfaces
On the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-58 lists the
specifications of the interfaces.

Table 8-58 Interfaces on the front panel of the DM12

Interface Interface Usage
Type

E1 (1–8) DB44 Access 8 x framed E1 signals.

DDN1–DDN4 DB28 Access four channels of N x 64 kbit/s signals.

Table 8-59 lists the pins of the DB44 interfaces.

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Table 8-59 Pins of the DB44 interfaces of the DM12

Front View Pin Specification Pin Specification

1 30 T1 to transmit 8 T8 to transmit the

the first channel eighth channel of
15 of signals. 7 signals.

29 T2 to transmit 36 R3 to receive the

the second third channel of
14 channel of 21 signals.
signals.

28 T3 to transmit 35 R4 to receive the

the third channel fourth channel of
13 of signals. 20 siganls.
44
27 T4 to transmit 34 R5 to receive the
the fourth fifth channel of
12 channel of 19 signals.
signals.

26 T5 to transmit 33 R6 to receive the

the fifth channel sixth channel of
11 of signals. 18 signals.

25 T6 to transmit 32 R7 to receive the

the sixth channel seventh channel of
10 of signals. 17 signals.

24 T7 to transmit 31 R8 to receive the

the seventh eighth channel of
9 channel of 16 signals.
signals.

38 R1 to receive the 44–39, 6–1 Grounding

first channel of
23 signals.

37 R2 to receive the
second channel
22 of signals.

Table 8-60 lists the pins of the DB28 interfaces.

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Table 8-60 Pins of the DB28 interfaces of the DM12

Front View Pin Specification Pin Specification

1 1 Transmits data 19 Receives data signals.

signals.
2 20

3 Transmits the 21 Grounds.

clock signals.
4 22 Loopbacks the
control signals.

11 Detects the 23 Permits the

carrier. transmission.
12 24

28 13 Requests for 25 Prepares the

transmission. terminating
14 26 equipment.

15 Transmits the 27 Prepares the terminal

clock of the equipment.
16 external 28
equipment.

17 Receives the - -
clock signals.
18

8.17.5 Valid Slots

As the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiX
OSN 1500B subrack.

Table 8-61 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12
housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channels
of N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only four
channels of N x 64 kbit/s signals.

Table 8-61 Valid slots for the DX1 and corresponding slots for the DM12

Valid Slot for the DX1 Corresponding Slot for the DM12

Slot 12 Slots 1 and 2

Slot 13 Slots 3 and 4

8.17.6 Technical Specifications

The technical specifications of the DM12 cover the board dimensions, weight and power
consumption.

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Mechanical Specifications
The mechanical specifications of the DM12 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the DM12 in the
switching state is 8 W and that of the DM12 in the normal state is 0 W.

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Hardware Description 9 Cross-Connect and System Control Boards

9 Cross-Connect and System Control Boards

About This Chapter

The chapter describes the integrated boards of the cross-connect, SCC and line units at different
rates.

9.1 CXL1
This section describes the CXL1, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.
9.2 CXL4
This section describes the CXL4, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.
9.3 CXL16
This section describes the CXL16, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.
9.4 CXLL1
This section describes the CXLL1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.5 CXLL4
This section describes the CXLL4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.6 CXLL16
This section describes the CXLL16, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.7 CXLD1
This section describes the CXLD1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.8 CXLD4
This section describes the CXLD4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.9 CXLQ1

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9 Cross-Connect and System Control Boards Hardware Description

This section describes the CXLQ1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.
9.10 CXLQ4
This section describes the CXLQ4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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Hardware Description 9 Cross-Connect and System Control Boards

9.1 CXL1
This section describes the CXL1, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.

9.1.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.
9.1.2 Function and Feature
The CXL1 is used to process SDH signals, control communication, groom services, and to input
and output the clock.
9.1.3 Working Principle and Signal Flow
The CXL1 consists of the SDH overhead processing module, RST, MST and so on.
9.1.4 Jumper and DIP Switch
On the CXL1, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.1.5 Front Panel
On the front panel of the Q2CXL1, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL1 board, there are indicators,
interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
9.1.6 Valid Slots
The CXL1 can be housed in any of or slots 4–5 in the subrack.
9.1.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL1 indicates the optical interface type.
9.1.8 Board Configuration Reference
The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL1.
9.1.9 Technical Specifications
The technical specifications for the CXL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.1.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.
Table 9-1lists the version description of the CXL1 board.

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Table 9-1 Version description of the CXL1 board

Item Description

Functional Version The CXL1 board has two functional versions, Q2 and Q3.

Difference The Q3CXL1 board supports transmitting the DCC information at

a two-channel external clock interface.
The Q3CXL1 hardware supports the CF card, and the Q3CXL1
supports software package loading function.
Q3CXL1 supports transparently transmitting DCC bytes in TPS
group.

Replaceability The Q3CXL1 board can fully replace the Q2CXL1 board.

9.1.2 Function and Feature

The CXL1 is used to process SDH signals, control communication, groom services, and to input
and output the clock.

SDH Processing Unit

Table 9-2 lists the function and feature of the SDH processing unit of the CXL1.

Table 9-2 Function and feature of the SDH processing unit of the CXL1

Function and CXL1

Feature

Basic function Transmits and receives 1 x STM-1 optical signals.

Specification of the Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and
optical interface Ve-1.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

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Function and CXL1

Feature

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The Q3CXL1 board hardware supports the CF card, and the
Q3CXL1 software supports the package loading function. The CF
card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

SCC Unit
Table 9-3 lists the function and feature of the SCC unit of the CXL1.

Table 9-3 Function and feature of the SCC unit of the CXL1
Function and CXL1
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface.

optical interface l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on the auxiliary
interface board to connect to the PC or workstation. Supports the
remote maintenance by using the RS232 DCE modem.
l The Q3CXL1 board supports receiving the BIP-8 check for the
overhead of the SCC unit, and provides the interface to query the
check result.

DCC processing Q2CXL1 processes 40-channel DCC, Q3CXL1 processes 80-channel

capability DCC.

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

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Function and CXL1

Feature

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-4 lists the function and feature of the cross-connect unit of the CXL1.

Table 9-4 Function and feature of the cross-connect unit of the CXL1

Function and CXL1

Feature

Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-5 lists the function and feature of the clock unit of the CXL1.

Table 9-5 Function and feature of the clock unit of the CXL1

Function and CXL1

Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
The Q3CXL1 board supports transmitting the DCC overhead
information at a two-channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.1.3 Working Principle and Signal Flow

The CXL1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-1 shows the block diagram for the functions of the Q2CXL1.

Figure 9-1 Block diagram for the functions of the Q2CXL1

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

Figure 9-2 shows the block diagram for the functions of the Q3CXL1 board.

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Figure 9-2 Block diagram for the functions of the Q3CXL1 board

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous

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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.

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l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.
l The Q3CXL1 board supports receiving the BIP-8 check for the overhead of the SCC unit,
and provides the interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-3 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-3 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
SEI

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface SAP

OAM interface
SAP
F&f interface

Phone interface
Power monitor

SEI
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

9.1.4 Jumper and DIP Switch

On the CXL1, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-4 shows the layout of the J3 jumper and DIP switch SW1 on the CXL1 board.

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Figure 9-4 Jumper and DIP switch of the CXL1 board

3 2 1
J3

CF

card

SCC Unit
1
2
3 SW1
4

Table 9-6 lists the jumper on the CXL1 board.

Table 9-6 Jumper on the CXL1 board

Jumper Function Description

J3 Enable the battery. 1-2: When jumpers 1 and 2 are capped, the battery is
enabled.

Table 9-7 lists the DIP switch on the CXL1 board.

Table 9-7 DIP switch on the CXL1 board

DIP Switch Function Description

SW1 Set the board On: indicates the binary value 1.

running state The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-8.

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Table 9-8 Description of the DIP switch SW1

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.1.5 Front Panel

On the front panel of the Q2CXL1, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL1 board, there are indicators,
interfaces, barcode, functional button switch, laser safety class label, and CF card slot.

Appearance of the Front Panel

Figure 9-5 shows the front panel of the Q2CXL1.

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Figure 9-5 Front panel of the Q2CXL1

CXL1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

RESET

ALM CUT

CXL1

Figure 9-6 shows the front panel of the Q3CXL1 board.

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Figure 9-6 Front panel the Q3CXL1 board

CXL1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT
IN

RESET

ALM CUT

CF R/W

CF ON/OFF

CXL1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL1, there are one optical interface and two switches. Table 9-9 lists
the type and usage of the optical interface and switches on the CXL1.

Table 9-9 Optical interface and switches on the CXL1

Interface Interface Usage
Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

CF ON/OFF CF card Changes the state of the CF card.

insersion / l When the CF card is in the read/write state, or when
removal switch it is reading or writing data, the indicator changes to
red and then the CF card changes to the read/write
prohibited state if the switch is pressed for five
seconds. In this case, you can remove the CF card.
l When the CF card is in the read/write prohibited state,
the indicator changes to green if the switch is pressed
for five seconds. Then the CF card restores to the read/
write state.

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9.1.6 Valid Slots

The CXL1 can be housed in any of or slots 4–5 in the subrack.

9.1.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL1 indicates the optical interface type.
Table 9-10 lists the relation between the board feature code and optical interface type of the
CXL1.

Table 9-10 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSQ3CXL110, 10 S-1.1 (LC)

SSQ2CXL110,
SSQ1CXL110

SSQ3CXL111, 11 L-1.1 (LC)

SSQ2CXL111,
SSQ1CXL111

SSQ3CXL112, 12 L-1.2 (LC)

SSQ2CXL112,
SSQ1CXL112

SSQ3CXL113, 13 Ve-1.2 (LC)

SSQ2CXL113,
SSQ1CXL113

SSQ2CXL114, 14 I-1 (LC)

SSQ2CXL114,
SSQ1CXL114

9.1.8 Board Configuration Reference

The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL1.

Displayed Slot
The CXL1 is housed in one slot in the subrack.
The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC.
Table 9-11 lists the logical slots displayed on the T2000.

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Table 9-11 Logical slots displayed on the T2000 for the CXL1

Board Logical Board Logical Slot

CXL1 Q1SL1 Slots 4–5

ECXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.1.9 Technical Specifications

The technical specifications for the CXL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-12 lists the specifications for the optical interfaces of the CXL1.

Table 9-12 Specifications for the optical interfaces of the CXL1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

type

Working 1260 to 1261 to 1263 to 1480 to 1480 to

wavelength (nm) 1360 1360 1360 1580 1580

Optical source MLM, LED MLM MLM, SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity (dBm)

Min. overload –8 –8 –10 –10 –10

(dBm)

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Item Specification

Min. extinction 8.2 8.2 10 10 10

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXL1 is as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL1 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):
– Q2CXL1: 1.1kg
– Q3CXL1: 1.2kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXL1 is as follows:
l Q2CXL1: 40W
l Q3CXL1: 46W

9.2 CXL4
This section describes the CXL4, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.

9.2.1 Version Description

The CXL4 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at

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a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.
9.2.2 Function and Feature
The CXL4 is used to process SDH signals, control communication, groom services, and to input
and output the clock.
9.2.3 Working Principle and Signal Flow
The CXL4 consists of the SDH overhead processing module, RST, MST and so on.
9.2.4 Jumper and DIP Switch
On the CXL4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.2.5 Front Panel
On the front panel of the Q2CXL4, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL4 board, there are indicators,
interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
9.2.6 Valid Slots
The CXL4 can be housed in any of or slots 4–5 in the subrack.
9.2.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL4 indicates the optical interface type.
9.2.8 Board Configuration Reference
The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL4.
9.2.9 Technical Specifications
The technical specifications for the CXL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.2.1 Version Description

The CXL4 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.

Table 9-13 lists the version description of the CXL4 board.

Table 9-13 Version description of the CXL4 board

Item Description

Functional Version The CXL4 board has two functional versions, Q2 and Q3.

Difference The Q3CXL4 board supports transmitting the DCC information at

a two-port external clock interface.
The Q3CXL4 hardware supports the CF card, and the Q3CXL4
software supports package loading function.
Q3CXL4 supports transparently transmitting DCC bytes in TPS
group.

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Item Description

Replaceability The Q3CXL4 board can fully replace the Q2CXL4 board.

9.2.2 Function and Feature

The CXL4 is used to process SDH signals, control communication, groom services, and to input
and output the clock.

SDH Processing Unit

Table 9-14 lists the function and feature of the SDH processing unit of the CXL4.

Table 9-14 Function and feature of the SDH processing unit of the CXL4
Function and CXL4
Feature

Basic function Transmits and receives 1 x STM-4 optical signals.

Specifications of Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and
optical interfaces Ve-4.2 types.

Specifications of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation
services.

Overhead processing l Supports the processing of the SOH bytes of the STM-4 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarms and Provides rich alarms and performance events for easy management
performance events and maintenance of the equipment.

Protection schemes Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

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Function and CXL4

Feature

Maintenance l Supports inloop and outloop for optical interfaces.

features l Supports warm reset and cold reset. The warm reset does not affect
services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The Q3CXL4 board hardware supports the CF card, and the
Q3CXL1 software supports the package loading function. The CF
card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

SCC Unit
Table 9-15 lists the function and feature of the SCC unit of the CXL4

Table 9-15 Function and feature of the SCC unit of the CXL4

Function and CXL4

Feature

Basic function Configures and monitors services, monitors the service performance,
and collencts performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface.

optical interface l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on on the
auxiliary interface board to connect to the PC or workstation.
Supports the remote maintenance by using the RS232 DCE
modem.
l The Q3CXL4 board supports receiving the BIP-8 check for the
overhead of the SCC unit, and provides the interface to query the
check result.

DCC processing Q2CXL4 processes 40-channel DCC, Q3CXL4 processes 80-channel

capability DC.

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

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Function and CXL4

Feature

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-16 lists the function and feature of the cross-connect unit of the CXL4.

Table 9-16 Function and feature of the cross-connect unit of the CXL4
Function and CXL4
Feature

Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports concatenation services at the VC4-4c level.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-17 lists the function and feature of the clock unit of the CXL4.

Table 9-17 Function and feature of the clock unit of the CXL4
Function and CXL4
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
The Q3CXL4 board supports transmitting the DCC overhead
information at a two-port external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.2.3 Working Principle and Signal Flow

The CXL4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-7 shows the block diagram for the functions of the Q2CXL4.

Figure 9-7 Block diagram for the functions of the Q2CXL4

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
SEI

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface SAP

OAM interface
SAP
F&f interface

Phone interface
Power monitor

SEI
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

Figure 9-8shows the block diagram for the functions of the Q3CXL4 board.

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Figure 9-8 Block diagram for the functions of the Q3CXL4 board

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous

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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.

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l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.
l The Q3CXL4 board supports receiving the BIP-8 check for the overhead of the SCC unit,
and provides the interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-9 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-9 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
SEI

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface SAP

OAM interface
SAP
F&f interface

Phone interface
Power monitor

SEI
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

9.2.4 Jumper and DIP Switch

On the CXL4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-10 shows the layout of the J3 jumper and DIP switch SW1 on the CXL4 board.

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Figure 9-10 Jumper and DIP switch of the CXL4 board

3 2 1
J3

CF

card

SCC Unit
1
2
3 SW1
4

Table 9-18 lists the jumper on the CXL4 board.

Table 9-18 Jumper on the CXL4 board

Jumper Function Description

J3 Enable the battery. 1-2: When jumpers 1 and 2 are capped, the battery is
enabled.

Table 9-19 lists the DIP switch on the CXL board.

Table 9-19 DIP switch on the CXL4 board

DIP Switch Function Description

SW1 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-20.

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Table 9-20 Description of DIP switch SW1

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.2.5 Front Panel

On the front panel of the Q2CXL4, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL4 board, there are indicators,
interfaces, barcode, functional button switch, laser safety class label, and CF card slot.

Appearance of the Front Panel

Figure 9-11 shows the front panel of the Q2CXL4.

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Figure 9-11 Front panel of the Q2CXL4

CXL4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

RESET

ALM CUT

CXL4

Figure 9-12shows the front panel of the Q3CXL4 board.

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Figure 9-12 Front panel the Q3CXL4 board

CXL4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT
IN

RESET

ALM CUT

CF R/W

CF ON/OFF

CXL4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL4, there are one optical interface and two switches. Table 9-21
lists the type and usage of the optical interface and switches on the CXL4.

Table 9-21 Optical interface and switches on the CXL4

Interface Interface Usage
Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm
sound.

CF ON/OFF CF card Changes the state of the CF card.

insertion / l When the CF card is in the read/write state, or when
removal switch it is reading or writing data, the indicator changes to
red and then the CF card changes to the read/write
prohibited state if the switch is pressed for five
seconds. In this case, you can remove the CF card.
l When the CF card is in the read/write prohibited state,
the indicator changes to green if the switch is pressed
for five seconds. Then the CF card is restored to the
read/write state.

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9.2.6 Valid Slots

The CXL4 can be housed in any of or slots 4–5 in the subrack.

9.2.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL4 indicates the optical interface type.
Table 9-22 lists the relation between the board feature code and optical interface type of the
CXL4.

Table 9-22 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSQ3CXL410, 10 S-4.1 (LC)

SSQ2CXL410,
SSQ1CXL410

SSQ3CXL411, 11 L-4.1 (LC)

SSQ2CXL411,
SSQ1CXL411

SSQ3CXL412, 12 L-4.2 (LC)

SSQ2CXL412,
SSQ1CXL412

SSQ3CXL413, 13 Ve-4.2 (LC)

SSQ2CXL413,
SSQ1CXL413

SSQ3CXL414, 14 I-4 (LC)

SSQ2CXL414,
SSQ1CXL414

9.2.8 Board Configuration Reference

The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL4.

Displayed Slot
The CXL4 is housed in one slot in the subrack.
The logical boards for the CXL4 are the Q1SL4, EXCL and GSCC.
Table 9-23 lists the logical slots displayed on the T2000.

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Table 9-23 Logical slots displayed on the T2000 for the CXL4

Board Logical Board Logical Slot

CXL4 Q1SL4 Slots 4–5

ECXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.2.9 Technical Specifications

The technical specifications for the CXL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-24 lists the specifications for the optical interfaces of the CXL4.

Table 9-24 Specifications for the optical interfaces of the CXL4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Working 1261 to 1274 to 1280 to 1480 to 1480 to

wavelength (nm) 1360 1356 1335 1580 1580

Optical source MLM MLM SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

Min. overload –8 –8 –8 –8 –13

(dBm)

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Item Specification

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXL4 is described as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL4 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):
– Q2CXL4: 1.1kg
– Q3CXL4: 1.2kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption of the CXL4 is:
l Q2CXL4: 40W
l Q3CXL4: 46W

9.3 CXL16
This section describes the CXL16, an integrated board of the SCC, cross-connect, clock and line
units, in terms of the version, principle, function, principle, front panel and specifications.

9.3.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at

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a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.
9.3.2 Function and Feature
The CXL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.3.3 Working Principle and Signal Flow
The CXL16 consists of the SDH overhead processing module, RST, MST and so on.
9.3.4 Jumper and DIP Switch
On the CXL16, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.3.5 Front Panel
On the front panel of the Q2CXL16, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL16 board, there are
indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card
slot.
9.3.6 Valid Slots
The CXL16 can be housed in any of slots 4–5 in the subrack.
9.3.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL16 indicates the optical interface type.
9.3.8 Board Configuration Reference
The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL16.
9.3.9 Technical Specifications
The technical specifications for the CXL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.3.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2
and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group
and supports the CF card and package loading function.

Table 9-25lists the version description of the CXL16 board.

Table 9-25 Version description of the CXL16 board

Item Description

Functional Version The CXL16 board has two functional versions, Q2 and Q3.

Difference The Q3CXL16 board supports transmitting the DCC information

at a two-port external clock interface.
The Q3CXL16 hardware supports the CF card, and the Q3CXL16
software supports package loading function.
Q3CXL16 supports transparently transmitting DCC bytes in TPS
group.

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Item Description

Replaceability The Q3CXL16 board can fully replace the Q2CXL16 board.

9.3.2 Function and Feature

The CXL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

SDH Processing Unit

Table 9-26 lists the function and feature of the SDH processing unit of the CXL16.

Table 9-26 Function and feature of the SDH processing unit of the CXL16
Function and CXL16
Feature

Basic function Transmits and receives 1 x STM-16 optical signals.

Specification of the Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2
optical interface types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and
VC4-16c concatenation services.

Overhead processing l Supports the processing of the SOH bytes of the STM-16 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP
protection ring, linear MSP protection, and SNCP.

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Function and CXL16

Feature

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports warm reset and cold reset. The warm reset does not affect
services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.
l The Q3CXL16 board hardware supports the CF card, and the
Q3CXL16 software supports the package loading function. The CF
card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

SCC Unit
Table 9-27 lists the function and feature of the SCC unit of the CXL16

Table 9-27 Function and feature of the SCC unit of the CXL16

Function and CXL16

Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface.

optical interface l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on on the
auxiliary interface board to connect to the PC or workstation.
Supports the remote maintenance by using the RS232 DCE
modem.
l The Q3CXL16 board supports receiving the BIP-8 check for the
overhead of the SCC unit, and provides the interface to query the
check result.

DCC processing Q2CXL16 processes 40-channel DCC, Q3CXL16 processes 80-

capability channel DCC.

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

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Function and CXL16

Feature

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-28 lists the function and feature of the cross-connect unit of the CXL16.

Table 9-28 Function and feature of the cross-connect unit of the CXL16
Function and CXL16
Feature

Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

Service processing l Dynamically grooms services, such as the cross-connect and

broadcast services.
l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports concatenation services at the VC4-4c, VC4-8c and
VC4-16c levels.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-29 lists the function and feature of the clock unit of the CXL16.

Table 9-29 Function and feature of the clock unit of the CXL16
Function and CXL16
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
The Q3CXL16 board supports transmitting the DCC overhead
information at a two-port external clock interface.

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Function and CXL16

Feature

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.3.3 Working Principle and Signal Flow

The CXL16 consists of the SDH overhead processing module, RST, MST and so on.

Figure 9-13 shows the block diagram for the functions of the Q2CXL16.

Figure 9-13 Block diagram for the functions of the Q2CXL16

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
SEI

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface SAP

OAM interface
SAP
F&f interface

Phone interface
Power monitor

SEI
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

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Figure 9-14shows the block diagram for the functions of the Q3CXL16 board.

Figure 9-14 Block diagram for the functions of the Q3CXL16 board

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock

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sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.

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– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,

AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering
– HP_RDI detection (path status monitoring
– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.
l The Q3CXL16 board supports receiving the BIP-8 check for the overhead of the SCC unit,
and provides the interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-15 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-15 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
SEI

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface SAP

OAM interface
SAP
F&f interface

Phone interface
Power monitor

SEI
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l Responses to and processes K bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC Converter Module
This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded
to 1 GB.

9.3.4 Jumper and DIP Switch

On the CXL16, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-16 shows the layout of the J3 jumper and DIP switch SW1 on the CXL16 board.

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Figure 9-16 Jumper and DIP switch of the CXL16 board

3 2 1
J3

CF

card

SCC Unit
1
2
3 SW1
4

Table 9-30 lists the jumper on the CXL16 board.

Table 9-30 Jumper on the CXL16 board

Jumper Function Description

J3 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-31 lists the DIP switch on the CXL board.

Table 9-31 DIP switch on the CXL16 board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer toTable
9-32.

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Table 9-32 Description of the DIP switch SW1

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.3.5 Front Panel

On the front panel of the Q2CXL16, there are indicators, interfaces, functional button switch,
barcode and laser safety class label. On the front panel of the Q3CXL16 board, there are
indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card
slot.

Appearance of the Front Panel

Figure 9-17 shows the front panel of the Q2CXL16.

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Figure 9-17 Front panel of the Q2CXL16

CXL16
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

RESET

ALM CUT

CXL16

Figure 9-18 shows the front panel of the Q3CXL16 board.

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Figure 9-18 Front panel the Q3CXL16 board

CXL16
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT
IN

RESET

ALM CUT

CF R/W

CF ON/OFF

CXL16

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL16, there are one optical interface and two switches. Table 9-33
lists the type and usage of the optical interface and switches on the CXL16.

Table 9-33 Optical interface and switches on the CXL16

Interface Interface Usage
Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

CF ON/OFF CF card Changes the state of the CF card.

insertion / l When the CF card is in the read/write state, or when it
removal switch is reading or writing data, the indicator changes to red
and then the CF card changes to the read/write
prohibited state if the switch is pressed for five
seconds. In this case, you can remove the CF card.
l When the CF card is in the read/write prohibited state,
the indicator changes to green if the switch is pressed
for five seconds. Then the CF card is restored to the
read/write state.

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9.3.6 Valid Slots

The CXL16 can be housed in any of slots 4–5 in the subrack.

9.3.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL16 indicates the optical interface type.

Table 9-34 lists the relation between the board feature code and optical interface type of the
CXL16.

Table 9-34 Relation between the board feature code and the optical interface type

Board Barcode Feature Code Optical Interface Type

SSQ3CXL1610, 10 S-16.1
SSQ2CXL1610,
SSQ1CXL1610

SSQ3CXL1611, 11 L-16.1
SSQ2CXL1611,
SSQ1CXL1611

SSQ3CXL1612, 12 L-16.2
SSQ2CXL1612,
SSQ1CXL1612

SSQ3CXL1614, 14 I-16
SSQ2CXL1614,
SSQ1CXL1614

9.3.8 Board Configuration Reference

The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL16.

Displayed Slot
The CXL16 is housed in one slot in the subrack.

The logical boards for the CXL16 are the Q1SL16, EXCL and GSCC.

Table 9-35 lists the logical slots displayed on the T2000.

Table 9-35 Logical slots displayed on the T2000 for the CXL16

Board Logical Board Logical Slot

CXL16 Q1SL16 Slots 4–5

ECXL Slots 80–81

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Board Logical Board Logical Slot

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.3.9 Technical Specifications

The technical specifications for the CXL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-36 lists the specifications for the optical interfaces of the CXL16.

Table 9-36 Specifications for the optical interfaces of the CXL16

Item Specification

Nominal bit rate 2488320 kbit/s

Line code NRZ

Optical interface I-16 S-16.1 L-16.1 L-16.2

type

Working 1266 to 1360 1260 to 1360 1280 to 1335 1500 to 1580

wavelength (nm)

Optical source MLM SLM SLM SLM

type

Mean launched –10 to –3 –5 to 0 –2 to 3 –2 to 3

optical power
(dBm)

Receiver –18 –18 –27 –28

sensitivity (dBm)

Min. overload –3 0 –9 –9
(dBm)

Min. extinction 8.2 8.2 8.2 8.2

ratio (dB)

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Cross-Connect Capacity
The cross-connect capacity of the CXL16 described as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL16 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL16 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):
– Q2CXL16: 1.1kg
– Q3CXL16: 1.2kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption of the CXL16 is as follows:
l Q2CXL16: 40W
l Q3CXL16: 46W

9.4 CXLL1
This section describes the CXLL1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.4.1 Version Description

The functional version of CXLL1 board is R1.
9.4.2 Function and Feature
The CXLL1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.4.3 Working Principle and Signal Flow
The CXLL1 consists of the SDH overhead processing module, RST, MST and so on.
9.4.4 Jumper and DIP Switch

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On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.4.5 Front Panel
On the front panel of the CXLL1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.4.6 Valid Slots
The CXLL1 can be housed in any of slots 4–5 in the subrack.
9.4.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL1 indicates the optical interface type.
9.4.8 Board Configuration Reference
The physical slot that houses the CXLL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXLL1.
9.4.9 Technical Specifications
The technical specifications for the CXLL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.4.1 Version Description

The functional version of CXLL1 board is R1.

9.4.2 Function and Feature

The CXLL1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

SDH Processing Unit

Table 9-37 lists the function and feature of the SDH processing unit of the CXLL1.

Table 9-37 Function and feature of the SDH processing unit of the CXLL1

Function and CXLL1

Feature

Basic function Transmits and receives 1 x STM-1 optical signals.

Specification of the Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and
optical interface Ve-1.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

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Function and CXLL1

Feature

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-38 lists the function and feature of the SCC unit of the CXLL1.

Table 9-38 Function and feature of the SCC unit of the CXLL1

Function and CXLL1

Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on the AUC board.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and is present on the AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and is
present on the AUX board.
l Provides the RS232 OAM interface that is present on the AUX
board to connect to the PC or workstation. Supports the remote
maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

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Function and CXLL1

Feature

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-39 lists the function and feature of the cross-connect unit of the CXLL1.

Table 9-39 Function and feature of the cross-connect unit of the CXLL1
Function and CXLL1
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports VC--4-4c, VC-4-8c and VC-4-16c concatenation
services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-40 lists the function and feature of the clock unit of the CXLL1.

Table 9-40 Function and feature of the clock unit of the CXLL1
Function and CXLL1
Feature

Basic function Provides standard system synchronization clock.

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Function and CXLL1

Feature

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.4.3 Working Principle and Signal Flow

The CXLL1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-19 shows the block diagram for the functions of the CXLL1.

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Figure 9-19 Block diagram for the functions of the CXLL1

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-20 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-20 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.4.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-21 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board.

Figure 9-21 Jumper and DIP switch of the CXL board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-41 lists the jumper on the CXL board.

Table 9-41 Jumper on the CXL board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-42 lists the DIP switch on the CXL board.

Table 9-42 DIP switch on the CXL board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-43.

Table 9-43 Description of the DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.4.5 Front Panel

On the front panel of the CXLL1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-22 shows the front panel of the CXLL1 board.

Figure 9-22 Front panel the CXLL1 board

CXLL1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

CF R/W

RESET

ALM CUT

CXLL1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL1, there are one optical interface and two switches. Table 9-44
lists the type and usage of the optical interface and switches on the CXLL1.

Table 9-44 Optical interface and switches on the CXLL1

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.4.6 Valid Slots

The CXLL1 can be housed in any of slots 4–5 in the subrack.

9.4.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL1 indicates the optical interface type.

Table 9-45 lists the relation between the board feature code and optical interface type of the
CXLL1.

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Table 9-45 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLL110 10 S-1.1 (LC)

SSR1CXLL111 11 L-1.1 (LC)

SSR1CXLL112 12 L-1.2 (LC)

SSR1CXLL113 13 Ve-1.2 (LC)

SSR1CXLL114 14 I-1 (LC)

9.4.8 Board Configuration Reference

The physical slot that houses the CXLL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXLL1.

Displayed Slot
The CXLL1 is housed in one slot in the subrack.
The logical boards for the CXLL1 are the R1SLN, RCXL and GSCC.
Table 9-46 lists the logical slots displayed on the T2000.

Table 9-46 Logical slots displayed on the T2000 for the CXLL1
Board Logical Board Logical Slot

CXLL1 R1SLN Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.4.9 Technical Specifications

The technical specifications for the CXLL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-47 lists the specifications for the optical interfaces of the CXLL1.

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Table 9-47 Specifications for the optical interfaces of the CXLL1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

type

Working 1260 to 1261 to 1263 to 1480 to 1480 to

wavelength (nm) 1360 1360 1360 1580 1580

Optical source MLM, LED MLM MLM, SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity (dBm)

Min. overload –8 –8 –10 –10 –10

(dBm)

Min. extinction 8.2 8.2 10 10 10

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLL1 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL1 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLL1 are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg):1.0kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLL1 is 50W.

9.5 CXLL4
This section describes the CXLL4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.5.1 Version Description

The functional version of CXLL4 board is R1.
9.5.2 Function and Feature
The CXLL4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.5.3 Working Principle and Signal Flow
The CXLL4 consists of the SDH overhead processing module, RST, MST and so on.
9.5.4 Jumper and DIP Switch
On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.5.5 Front Panel
On the front panel of the CXLL4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.5.6 Valid Slots
The CXLL4 can be housed in any of slots 4–5 in the subrack.
9.5.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL4 indicates the optical interface type.
9.5.8 Board Configuration Reference
The physical slot that houses the CXLL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXLL4.
9.5.9 Technical Specifications
The technical specifications for the CXLL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.5.1 Version Description

The functional version of CXLL4 board is R1.

9.5.2 Function and Feature

The CXLL4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

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SDH Processing Unit

Table 9-48 lists the function and feature of the SDH processing unit of the CXLL4.

Table 9-48 Function and feature of the SDH processing unit of the CXLL4
Function and CXLL4
Feature

Basic function Transmits and receives 1 x STM-4 optical signals.

Specification of the Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and
optical interface Ve-4.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3, VC-4 services and
VC4-4c concatenation services..

Overhead processing l Supports the processing of the SOH bytes of the STM-4 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-49 lists the function and feature of the SCC unit of the CXLL4.

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Table 9-49 Function and feature of the SCC unit of the CXLL4
Function and CXLL4
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on AUX.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and present on AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and
present on AUX board.
l Provides the RS232 OAM interface that is present on the AUX
board to connect to the PC or workstation. Supports the remote
maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-50 lists the function and feature of the cross-connect unit of the CXLL4.

Table 9-50 Function and feature of the cross-connect unit of the CXLL4
Function and CXLL4
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

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Function and CXLL4

Feature

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports a maximum of 1024 SNCP protection pairs.
l Supports VC-4-4c concatenation services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-51 lists the function and feature of the clock unit of the CXLL4.

Table 9-51 Function and feature of the clock unit of the CXLL4
Function and CXLL4
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.5.3 Working Principle and Signal Flow

The CXLL4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-23 shows the block diagram for the functions of the CXLL4.

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Figure 9-23 Block diagram for the functions of the CXLL4

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-24 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-24 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.5.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-25 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board.

Figure 9-25 Jumper and DIP switch of the CXL board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-52 lists the jumper on the CXL board.

Table 9-52 Jumper on the CXL board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-53 lists the DIP switch on the CXL board.

Table 9-53 DIP switch on the CXL board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-54.

Table 9-54 Description of DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.5.5 Front Panel

On the front panel of the CXLL4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-26 shows the front panel of the CXLL4 board.

Figure 9-26 Front panel the CXLL4 board

CXLL4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

CF R/W

RESET

ALM CUT

CXLL4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL4, there are one optical interface and two switches. Table 9-55
lists the type and usage of the optical interface and switches on the CXLL4.

Table 9-55 Optical interface and switches on the CXLL4

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.5.6 Valid Slots

The CXLL4 can be housed in any of slots 4–5 in the subrack.

9.5.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL4 indicates the optical interface type.

Table 9-56 lists the relation between the board feature code and optical interface type of the
CXLL4.

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Table 9-56 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLL410 10 S-4.1 (LC)

SSR1CXLL411 11 L-4.1 (LC)

SSR1CXLL412 12 L-4.2 (LC)

SSR1CXLL413 13 Ve-4.2 (LC)

SSR1CXLL414 14 I-4 (LC)

9.5.8 Board Configuration Reference

The physical slot that houses the CXLL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXLL4.

Displayed Slot
The CXLL4 is housed in one slot in the subrack.
The logical boards for the CXLL4 are the R1SLN, RCXL and GSCC.
Table 9-57 lists the logical slots displayed on the T2000.

Table 9-57 Logical slots displayed on the T2000 for the CXLL4
Board Logical Board Logical Slot

CXLL4 R1SLN Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.5.9 Technical Specifications

The technical specifications for the CXLL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-58 lists the specifications for the optical interfaces of the CXLL4.

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Table 9-58 Specifications for the optical interfaces of the CXLL4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Working 1260 to 1274 to 1280 to 1480 to 1480 to

wavelength (nm) 1360 1356 1335 1580 1580

Optical source MLM MLM SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

Min. overload –8 –8 –18 –8 –13

(dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLL4 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL4 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLL4 are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg):1.0kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLL4 is 50W.

9.6 CXLL16
This section describes the CXLL16, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.6.1 Version Description

The functional version of CXLL16 board is R1.
9.6.2 Function and Feature
The CXLL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.6.3 Working Principle and Signal Flow
The CXLL16 consists of the SDH overhead processing module, RST, MST and so on.
9.6.4 Jumper and DIP Switch
On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.6.5 Front Panel
On the front panel of the CXLL16 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.6.6 Valid Slots
The CXLL16 can be housed in any of slots 4–5 in the subrack.
9.6.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL16 indicates the optical interface type.
9.6.8 Board Configuration Reference
The physical slot that houses the CXLL16 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLL16.
9.6.9 Technical Specifications
The technical specifications for the CXLL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.6.1 Version Description

The functional version of CXLL16 board is R1.

9.6.2 Function and Feature

The CXLL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

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SDH Processing Unit

Table 9-59 lists the function and feature of the SDH processing unit of the CXLL16.

Table 9-59 Function and feature of the SDH processing unit of the CXLL16
Function and CXLL16
Feature

Basic function Transmits and receives 1 x STM-16 optical signals.

Specification of the Supports the optical interfaces of the I-16, S-16.1, L-16.1 and L-16.2
optical interface types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3, VC-4 services, and
VC-4-4c, VC-4-8c, VC-4-16c concatenation services.

Overhead processing l Supports the processing of the SOH bytes of the STM-16 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-60 lists the function and feature of the SCC unit of the CXLL16.

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Table 9-60 Function and feature of the SCC unit of the CXLL16
Function and CXLL16
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on the AUX board.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and is present on the AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and is
present on the AUX board.
l Provides the RS232 OAM interface that is present on the auxiliary
interface board to connect to the PC or workstation. Supports the
remote maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-61 lists the function and feature of the cross-connect unit of the CXLL16.

Table 9-61 Function and feature of the cross-connect unit of the CXLL16
Function and CXLL16
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

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Function and CXLL16

Feature

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports a maximum of 1024 SNCP protection pairs.
l Supports VC-4-4c, VC-4-8c and VC-4-16c services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-62 lists the function and feature of the clock unit of the CXLL16.

Table 9-62 Function and feature of the clock unit of the CXLL16
Function and CXLL16
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.6.3 Working Principle and Signal Flow

The CXLL16 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-27 shows the block diagram for the functions of the CXLL16.

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Figure 9-27 Block diagram for the functions of the CXLL16

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-28 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-28 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.6.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-29 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board.

Figure 9-29 Jumper and DIP switch of the CXL board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-63 lists the jumper on the CXL board.

Table 9-63 Jumper on the CXL board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-64 lists the DIP switch on the CXL board.

Table 9-64 DIP switch on the CXL board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer toTable
9-65.

Table 9-65 Description of the DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.6.5 Front Panel

On the front panel of the CXLL16 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-30 shows the front panel of the CXLL16 board.

Figure 9-30 Front panel the CXLL16 board

CXLL16
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT IN

CF R/W

RESET

ALM CUT

CXLL16

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL16, there are one optical interface and two switches. Table
9-66 lists the type and usage of the optical interface and switches on the CXLL16.

Table 9-66 Optical interface and switches on the CXLL16

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.6.6 Valid Slots

The CXLL16 can be housed in any of slots 4–5 in the subrack.

9.6.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLL16 indicates the optical interface type.

Table 9-67 lists the relation between the board feature code and optical interface type of the
CXLL16.

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Table 9-67 Relation between the board feature code and the optical interface type

Board Barcode Feature Code Optical Interface Type

SSR1CXLL1601 01 I-16 (LC)

SSR1CXLL1602 02 S-16.1 (LC)

SSR1CXLL1603 03 S-16.2(LC)

SSR1CXLL1604 04 L-16.2 (LC)

9.6.8 Board Configuration Reference

The physical slot that houses the CXLL16 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLL16.

Displayed Slot
The CXLL16 is housed in one slot in the subrack.

The logical boards for the CXLL16 are the R1SLN, RCXL and GSCC.

Table 9-68 lists the logical slots displayed on the T2000.

Table 9-68 Logical slots displayed on the T2000 for the CXLL16

Board Logical Board Logical Slot

CXLL16 R1SLN Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.6.9 Technical Specifications

The technical specifications for the CXLL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-69 lists the specifications for the optical interfaces of the CXLL16.

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Table 9-69 Specifications for the optical interfaces of the CXLL16

Item Specification

Nominal bit rate 2488320 kbit/s

Line code NRZ

Optical interface type I-16 S-16.1 L-16.1 L-16.2

Working wavelength 1266 to 1360 1260 to 1360 1280 to 1335 1500 to 1580
(nm)

Optical source type MLM SLM SLM SLM

Mean launched –10 to –3 –5 to 0 –2 to 3 –2 to 3

optical power (dBm)

Receiver sensitivity –18 –18 –27 –28

(dBm)

Min. overload (dBm) –3 0 –9 –9

Min. extinction ratio 8.2 8.2 8.2 8.2

(dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLL16 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL16 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLL16 is as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

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Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLL4 is 50W.

9.7 CXLD1
This section describes the CXLD1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.7.1 Version Description

The functional version of CXLD1 board is R1.
9.7.2 Function and Feature
The CXLD1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.7.3 Working Principle and Signal Flow
The CXLD1 consists of the SDH overhead processing module, RST, MST and so on.
9.7.4 Jumper and DIP Switch
On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.7.5 Front Panel
On the front panel of the CXLD1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.7.6 Valid Slots
The CXLD1 can be housed in any of slots 4–5 in the subrack.
9.7.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLD1 indicates the optical interface type.
9.7.8 Board Configuration Reference
The physical slot that houses the CXLD1 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLD1.
9.7.9 Technical Specifications
The technical specifications for the CXLD1 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.7.1 Version Description

The functional version of CXLD1 board is R1.

9.7.2 Function and Feature

The CXLD1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

SDH Processing Unit

Table 9-70 lists the function and feature of the SDH processing unit of the CXLD1.

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Table 9-70 Function and feature of the SDH processing unit of the CXLD1
Function and CXLD1
Feature

Basic function Transmits and receives 2 x STM-1 optical signals.

Specification of the Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and
optical interface Ve-1.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-71 lists the function and feature of the SCC unit of the CXLD1.

Table 9-71 Function and feature of the SCC unit of the CXLD1
Function and CXLD1
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

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Function and CXLD1

Feature

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on the AUX board.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and is present on the AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and is
present on the AUX board.
l Provides the RS232 OAM interface that is present on the auxiliary
interface board to connect to the PC or workstation. Supports the
remote maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-72 lists the function and feature of the cross-connect unit of the CXLD1.

Table 9-72 Function and feature of the cross-connect unit of the CXLD1

Function and CXLD1

Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports VC-4-4c, VC-4-8c and VC-4-16c concatenation services.

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Function and CXLD1

Feature

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-73 lists the function and feature of the clock unit of the CXLD1.

Table 9-73 Function and feature of the clock unit of the CXLD1
Function and CXLD1
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.7.3 Working Principle and Signal Flow

The CXLD1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-31 shows the block diagram for the functions of the CXLD1.

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Figure 9-31 Block diagram for the functions of the CXLD1

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-32 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-32 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.7.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-33 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board.

Figure 9-33 Jumper and DIP switch of the CXL board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-74 lists the jumper on the CXL board.

Table 9-74 Jumper on the CXL board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-75 lists the DIP switch on the CXL board.

Table 9-75 DIP switch on the CXL board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-76.

Table 9-76 Description of DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.7.5 Front Panel

On the front panel of the CXLD1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-34 shows the front panel of the CXLD1 board.

Figure 9-34 Front panel the CXLD1 board

CXLD1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

CF R/W

RESET

ALM CUT

CXLD1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLD1, there are one optical interface and two switches. Table
9-77 lists the type and usage of the optical interface and switches on the CXLD1.

Table 9-77 Optical interface and switches on the CXLD1

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.7.6 Valid Slots

The CXLD1 can be housed in any of slots 4–5 in the subrack.

9.7.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLD1 indicates the optical interface type.

Table 9-78 lists the relation between the board feature code and optical interface type of the
CXLD1.

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Table 9-78 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLD110 10 S-1.1 (LC)

SSR1CXLD111 11 L-1.1 (LC)

SSR1CXLD112 12 L-1.2 (LC)

SSR1CXLD113 13 Ve-1.2 (LC)

SSR1CXLD114 14 I-1 (LC)

9.7.8 Board Configuration Reference

The physical slot that houses the CXLD1 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLD1.

Displayed Slot
The CXLD1 is housed in one slot in the subrack.
The logical boards for the CXLD1 are the R1SLD41, RCXL and GSCC.
Table 9-79 lists the logical slots displayed on the T2000.

Table 9-79 Logical slots displayed on the T2000 for the CXLD1
Board Logical Board Logical Slot

CXLL1 R1SLD41 Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.7.9 Technical Specifications

The technical specifications for the CXLD1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-80 lists the specifications for the optical interfaces of the CXLD1.

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Table 9-80 Specifications for the optical interfaces of the CXLD1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

type

Working 1260 to 1261 to 1263 to 1480 to 1480 to

wavelength (nm) 1360 1360 1360 1580 1580

Optical source MLM, LED MLM MLM, SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity (dBm)

Min. overload –8 –8 –10 –10 –10

(dBm)

Min. extinction 8.2 8.2 10 10 10

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLD1 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLD1 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLD1 is as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLD1 is 50W.

9.8 CXLD4
This section describes the CXLD4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.8.1 Version Description

The functional version of CXLD4 board is R1.
9.8.2 Function and Feature
The CXLD4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.8.3 Working Principle and Signal Flow
The CXLD4 consists of the SDH overhead processing module, RST, MST and so on.
9.8.4 Jumper and DIP Switch
On the CXLD4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.8.5 Front Panel
On the front panel of the CXLD4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.8.6 Valid Slots
The CXLD4 can be housed in any of slots 4–5 in the subrack.
9.8.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLD4 indicates the optical interface type.
9.8.8 Board Configuration Reference
The physical slot that houses the CXLD4 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLD4.
9.8.9 Technical Specifications
The technical specifications for the CXLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.8.1 Version Description

The functional version of CXLD4 board is R1.

9.8.2 Function and Feature

The CXLD4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

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SDH Processing Unit

Table 9-81 lists the function and feature of the SDH processing unit of the CXLD4.

Table 9-81 Function and feature of the SDH processing unit of the CXLD4
Function and CXLD4
Feature

Basic function Transmits and receives 2 x STM-4 optical signals.

Specification of the Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and
optical interface Ve-4.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3, VC-4 services and
VC4-4c concatenation services..

Overhead processing l Supports the processing of the SOH bytes of the STM-4 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-82 lists the function and feature of the SCC unit of the CXLD4.

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Table 9-82 Function and feature of the SCC unit of the CXLD4
Function and CXLD4
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on AUX.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and present on AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and
present on AUX board.
l Provides the RS232 OAM interface that is present on the AUX
board to connect to the PC or workstation. Supports the remote
maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-83 lists the function and feature of the cross-connect unit of the CXLD4.

Table 9-83 Function and feature of the cross-connect unit of the CXLD4
Function and CXLD4
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

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Function and CXLD4

Feature

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports a maximum of 1024 SNCP protection pairs.
l Supports VC-4-4c concatenation services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-84 lists the function and feature of the clock unit of the CXLD4.

Table 9-84 Function and feature of the clock unit of the CXLD4
Function and CXLD4
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.8.3 Working Principle and Signal Flow

The CXLD4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-35 shows the block diagram for the functions of the CXLD4.

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Figure 9-35 Block diagram for the functions of the CXLD4

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-36 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-36 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.8.4 Jumper and DIP Switch

On the CXLD4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-37 shows the layout of the J7 jumper and DIP switch SW2 on the CXLD4 board.

Figure 9-37 Jumper and DIP switch of the CXLD4 board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-85 lists the jumper on the CXLD4 board.

Table 9-85 Jumper on the CXLD4 board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-86 lists the DIP switch on the CXLD4 board.

Table 9-86 DIP switch on the CXLD4 board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-87.

Table 9-87 Description of DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.8.5 Front Panel

On the front panel of the CXLD4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-38 shows the front panel of the CXLD4 board.

Figure 9-38 Front panel the CXLD4 board

CXLD4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2

CF R/W

RESET

ALM CUT

CXLD4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLD4, there are one optical interface and two switches. Table
9-88 lists the type and usage of the optical interface and switches on the CXLD4.

Table 9-88 Optical interface and switches on the CXLD4

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.8.6 Valid Slots

The CXLD4 can be housed in any of slots 4–5 in the subrack.

9.8.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLD4 indicates the optical interface type.

Table 9-89 lists the relation between the board feature code and optical interface type of the
CXLD4.

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Table 9-89 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLD410 10 S-4.1 (LC)

SSR1CXLD411 11 L-4.1 (LC)

SSR1CXLD412 12 L-4.2 (LC)

SSR1CXLD413 13 Ve-4.2 (LC)

SSR1CXLD414 14 I-4 (LC)

9.8.8 Board Configuration Reference

The physical slot that houses the CXLD4 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLD4.

Displayed Slot
The CXLD4 is housed in one slot in the subrack.
The logical boards for the CXLD4 are the R1SLD41, RCXL and GSCC.
Table 9-90 lists the logical slots displayed on the T2000.

Table 9-90 Logical slots displayed on the T2000 for the CXLD1
Board Logical Board Logical Slot

CXLD4 R1SLD41 Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.8.9 Technical Specifications

The technical specifications for the CXLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-91 lists the specifications for the optical interfaces of the CXLD4.

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Table 9-91 Specifications for the optical interfaces of the CXLD4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Working 1260 to 1274 to 1280 to 1480 to 1480 to

wavelength (nm) 1360 1356 1335 1580 1580

Optical source MLM MLM SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

Min. overload –8 –8 –18 –8 –13

(dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLD4 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLD4 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLD4 are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg):1.0kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLD4 is 50W.

9.9 CXLQ1
This section describes the CXLQ1, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.9.1 Version Description

The functional version of CXLQ1 board is R1.
9.9.2 Function and Feature
The CXLQ1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.9.3 Working Principle and Signal Flow
The CXLQ1 consists of the SDH overhead processing module, RST, MST and so on.
9.9.4 Jumper and DIP Switch
On the CXLQ1, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.9.5 Front Panel
On the front panel of the CXLQ1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.9.6 Valid Slots
The CXLQ1 can be housed in any of slots 4–5 in the subrack.
9.9.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLQ1 indicates the optical interface type.
9.9.8 Board Configuration Reference
The physical slot that houses the CXLQ1 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLQ1.
9.9.9 Technical Specifications
The technical specifications for the CXLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.9.1 Version Description

The functional version of CXLQ1 board is R1.

9.9.2 Function and Feature

The CXLQ1 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

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SDH Processing Unit

Table 9-92 lists the function and feature of the SDH processing unit of the CXLQ1.

Table 9-92 Function and feature of the SDH processing unit of the CXLQ1
Function and CXLQ1
Feature

Basic function Transmits and receives 4 x STM-1 optical signals.

Specification of the Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and
optical interface Ve-1.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-93 lists the function and feature of the SCC unit of the CXLQ1.

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Table 9-93 Function and feature of the SCC unit of the CXLQ1
Function and CXLQ1
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on the AUX board.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and is present on the AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and is
present on the AUX board.
l Provides the RS232 OAM interface that is present on the auxiliary
interface board to connect to the PC or workstation. Supports the
remote maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-94 lists the function and feature of the cross-connect unit of the CXLQ1.

Table 9-94 Function and feature of the cross-connect unit of the CXLQ1
Function and CXLQ1
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

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Function and CXLQ1

Feature

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports VC-4-4c, VC-4-8c and VC-4-16c concatenation services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-95 lists the function and feature of the clock unit of the CXLQ1.

Table 9-95 Function and feature of the clock unit of the CXLQ1
Function and CXLQ1
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.9.3 Working Principle and Signal Flow

The CXLQ1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-39 shows the block diagram for the functions of the CXLQ1.

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Figure 9-39 Block diagram for the functions of the CXLQ1

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-40 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-40 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.9.4 Jumper and DIP Switch

On the CXLQ1, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-41 shows the layout of the J7 jumper and DIP switch SW2 on the CXLQ1 board.

Figure 9-41 Jumper and DIP switch of the CXLQ1 board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-96 lists the jumper on the CXL board.

Table 9-96 Jumper on the CXLQ1 board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-97 lists the DIP switch on the CXLQ1 board.

Table 9-97 DIP switch on the CXLQ1 board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-98.

Table 9-98 Description of DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.9.5 Front Panel

On the front panel of the CXLQ1 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-42 shows the front panel of the CXLQ1 board.

Figure 9-42 Front panel the CXLQ1 board

CXLQ1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

CF R/W

RESET

ALM CUT

CXLQ1

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLQ1, there are one optical interface and two switches. Table
9-99 lists the type and usage of the optical interface and switches on the CXLQ1.

Table 9-99 Optical interface and switches on the CXLQ1

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.9.6 Valid Slots

The CXLQ1 can be housed in any of slots 4–5 in the subrack.

9.9.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLQ1 indicates the optical interface type.

Table 9-100 lists the relation between the board feature code and optical interface type of the
CXLQ1.

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Table 9-100 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLQ110 10 S-1.1 (LC)

SSR1CXLQ111 11 L-1.1 (LC)

SSR1CXLQ112 12 L-1.2 (LC)

SSR1CXLQ113 13 Ve-1.2 (LC)

SSR1CXLQ114 14 I-1 (LC)

9.9.8 Board Configuration Reference

The physical slot that houses the CXLQ1 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLQ1.

Displayed Slot
The CXLQ1 is housed in one slot in the subrack.
The logical boards for the CXLQ1 are the R1SLQ41, RCXL and GSCC.
Table 9-101 lists the logical slots displayed on the T2000.

Table 9-101 Logical slots displayed on the T2000 for the CXLQ1
Board Logical Board Logical Slot

CXLQ1 R1SLQ41 Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.9.9 Technical Specifications

The technical specifications for the CXLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-102 lists the specifications for the optical interfaces of the CXLQ1.

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Table 9-102 Specifications for the optical interfaces of the CXLQ1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interface I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

type

Working 1260 to 1261 to 1263 to 1480 to 1480 to

wavelength (nm) 1360 1360 1360 1580 1580

Optical source MLM, LED MLM MLM, SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

optical power
(dBm)

Receiver –23 –28 –34 –34 –34

sensitivity (dBm)

Min. overload –8 –8 –10 –10 –10

(dBm)

Min. extinction 8.2 8.2 10 10 10

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLQ1 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLQ1 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLQ1 is as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLQ1 is 50W.

9.10 CXLQ4
This section describes the CXLQ4, an integrated board of the SCC, cross-connect, clock and
line units, in terms of the version, principle, function, principle, front panel and specifications.

9.10.1 Version Description

The functional version of CXLQ4 board is R1.
9.10.2 Function and Feature
The CXLQ4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.10.3 Working Principle and Signal Flow
The CXLQ4 consists of the SDH overhead processing module, RST, MST and so on.
9.10.4 Jumper and DIP Switch
On the CXLQ4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.
9.10.5 Front Panel
On the front panel of the CXLQ4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.
9.10.6 Valid Slots
The CXLQ4 can be housed in any of slots 4–5 in the subrack.
9.10.7 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLQ4 indicates the optical interface type.
9.10.8 Board Configuration Reference
The physical slot that houses the CXLD4 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLQ4.
9.10.9 Technical Specifications
The technical specifications for the CXLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.10.1 Version Description

The functional version of CXLQ4 board is R1.

9.10.2 Function and Feature

The CXLQ4 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

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SDH Processing Unit

Table 9-103 lists the function and feature of the SDH processing unit of the CXLQ4.

Table 9-103 Function and feature of the SDH processing unit of the CXLQ4
Function and CXLQ4
Feature

Basic function Transmits and receives 4 x STM-4 optical signals.

Specification of the Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and
optical interface Ve-4.2 types.

Specification of the l Supports detection and query of the information on the optical
optical module module.
l Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing Supports the processing of the VC-12, VC-3, VC-4 services and
VC4-4c concatenation services..

Overhead processing l Supports the processing of the SOH bytes of the STM-4 signals.
l Supports the transparent transmission and termination of the POH
bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and Provides rich alarms and performance events for easy management
performance event and maintenance of the equipment.

Protection scheme Supports multiple protection modes such as two-fiber MSP protection
ring, four-fiber MSP protection ring, linear MSP protection, and
SNCP..

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does not
affect services.
l Supports the function of querying the manufacturing information
of the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affecting
services.

SCC Unit
Table 9-104 lists the function and feature of the SCC unit of the CXLQ4.

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Table 9-104 Function and feature of the SCC unit of the CXLQ4
Function and CXLQ4
Feature

Basic function Configures and monitors services, monitors the service performance,
and collects performance events and alarm information.

Specification of the l Provides 10M/100M compatible Ethernet NMS interface, which is

optical interface present on AUX.
l Provides one 10M/100M Ethernet interface, which is used for
inter-board communication and present on AUX board.
l Provides one 10M Ethernet interface, which is used for
communication between the active and standby SCC boards and
present on AUX board.
l Provides the RS232 OAM interface that is present on the AUX
board to connect to the PC or workstation. Supports the remote
maintenance by using the RS232 DCE modem.
l Supports receiving the BIP-8 check for the overhead of the SCC
unit, and provides the interface to query the check result.

Maintenance feature Supports the CF card, and supports the package loading function. The
capacity is 512 MB and can be expanded to 1 GB.

DCC processing Processes 40-channel DCC.

capability

Fan alarm Manages fan alarms.

management

PIU management Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-105 lists the function and feature of the cross-connect unit of the CXLQ4.

Table 9-105 Function and feature of the cross-connect unit of the CXLQ4
Function and CXLQ4
Feature

Basic function Completes 15 Gbit/s non-blocking full cross-connection at the VC-4

level, and 5 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency Provides two 4M HDLC fast emergency channels, which are used for
channel the MSP and SNCP protection switching.

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Function and CXLQ4

Feature

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports a maximum of 1024 SNCP protection pairs.
l Supports VC-4-4c concatenation services.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connect
unit.

Clock Unit
Table 9-106 lists the function and feature of the clock unit of the CXLQ4.

Table 9-106 Function and feature of the clock unit of the CXLQ4
Function and CXLQ4
Feature

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM and
clock ID.
Supports transmitting the DCC overhead information at a two-
channel external clock interface.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and
selects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.10.3 Working Principle and Signal Flow

The CXLQ4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-43 shows the block diagram for the functions of the CXLQ4.

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Figure 9-43 Block diagram for the functions of the CXLQ4

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
STM-1 unit
Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-1
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connect
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:

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l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

l RST
– In receiving direction, performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
– In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
l MST
– In receiving direction, performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.
– In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI,
MS_RDI and MS_AIS insertion.
– Provides extraction or insertion of K1 byte and K2 byte.
l MSA
– In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
– In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration,
AU_AIS generation.
l HPT
– OH termination
– J1 path trace message recovery
– REI information recovering

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– HP_RDI detection (path status monitoring

– UNEQ and AIS detection (signal label monitoring)
– VC-4 BIP-8 errored block count

Communication and Control Module

l Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXLL unit.
l Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the
interface to query the check result.

Cross-connect Module
The cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching
l Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.
Figure 9-44 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-44 Block diagram of higher and lower order cross-connect modules

Time & T1
synchronizaton Line units
(SETS)
38MHz T2
Tributary units
OSC
SETG T3
PIU

T4(Clock external output)

AUX

T0
Frame header
Service units

155MHz PLL T0 (reference clock)

Service units

155 MHz

16x155
SDH overhead processing module high speed bus Another CXL
unit
STM-16 Mbit/s data
DEMUX
O/E Cross-connect
RST MST MSA HPT unit A
XC
high speed bus

STM-16
16x155
Mbit/s data
Cross Connect
O/E (HPC)
MUX
K1/K2 high speed bus
insertion/ Another
extration connect unit
SCC unit

XC
Performance report
Laser shut down

K1/K2 bytes DCC Cross Connect

(LPC)
high speed bus Cross-connec
unit B

Laser control K1/K2 bytes DCC DCC Line unit

process process

ETH channels comunication

Other unit

Communication and Master and slaver board comunication

Another CXL
control module
ETH interface AUX

OAM interface
AUX
F&f interface

Phone interface
Power monitor

EOW
S1-S4 interface
Boot ROM FLASH RAM NVRAM

+3.3 V DC/DC Fuse -48 V/-60V

+5V converter -48 V/-60V

+1.6V
DC/DC
+1.8V converter
+1.2V

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher
order services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order
services.

Other Functions
l Responses to and processes k bytes

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l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package,
logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.10.4 Jumper and DIP Switch

On the CXLQ4, there are a jumper and a DIP switch, which are used to set the input voltage and
running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random.
Otherwise, the board may become faulty.

Figure 9-45 shows the layout of the J7 jumper and DIP switch SW2 on the CXLQ4 board.

Figure 9-45 Jumper and DIP switch of the CXLQ4 board

Power
module

1
2
CPU 3 SW2
4

1
2 J7
3

CF
card

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Table 9-107 lists the jumper on the CXLQ4 board.

Table 9-107 Jumper on the CXLQ4 board

Jumper Function Description

J7 Enable the battery. 1-2: When jumpers 2 and 3 are capped, the battery is
enabled.

Table 9-108 lists the DIP switch on the CXLQ4 board.

Table 9-108 DIP switch on the CXLQ4 board

DIP Switch Function Description

SW2 Set the board On: indicates the binary value 1.

running state. The DIP switch adopts four bits, which are queued
according to the switch numbering. The number 4
indicates the highest bit. For details, refer to Table
9-109.

Table 9-109 Description of DIP switch SW2

Value Description

0b0000 Indicates the running state when the watchdog is started. It is the default
state.

0b0001 Changes to the self-test state of the SDRAM Burst.

0b0011 Indicates the commissioning state.

0b0100 Indicates the running state when the watchdog is stopped.

0b1011 Erases the database.

0b1100 Erases the NE software, including the patch.

0b1101 Erases the database and NE software (including the patch).

0b1110 Erases the database, NE software and NE.ini file.

0b1111 Erases the extended BIOS and system parameter zone in the file system
and FLASH memory.

9.10.5 Front Panel

On the front panel of the CXLQ4 board, there are indicators, interfaces, barcode, functional
button switch, laser safety class label, and CF card slot.

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Appearance of the Front Panel

Figure 9-46 shows the front panel of the CXLQ4 board.

Figure 9-46 Front panel the CXLQ4 board

CXLQ4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC

CLASS 1
LASER
PRODUCT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

CF R/W

RESET

ALM CUT

CXLQ4

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State Description

On (green) The CF card is in the read/write state of the system.

Flash (green) The system is reading data from or writing data to the CF
card.

On (red) The CF card is off-line or is in the read/write prohibited state.

The CF card is in the pluggable state.

Flash (red) The system is processing the data after receiving the
instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLQ4, there are one optical interface and two switches. Table
9-110 lists the type and usage of the optical interface and switches on the CXLQ4.

Table 9-110 Optical interface and switches on the CXLQ4

Interface Interface Usage

Type

IN LC Receives optical signals. The pluggable optical module

is used for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module

is used for easy maintenance.

RESET Warm reset Press the switch to reset the SCC unit.
switch

ALM CUT Alarm cut Press the switch to mute the alarm. Press the switch for
switch three seconds to mute the alarm permanently. Press the
switch again for three seconds to resume the alarm sound.

9.10.6 Valid Slots

The CXLQ4 can be housed in any of slots 4–5 in the subrack.

9.10.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXLQ4 indicates the optical interface type.

Table 9-111 lists the relation between the board feature code and optical interface type of the
CXLQ4.

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Table 9-111 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type

SSR1CXLQ410 10 S-4.1 (LC)

SSR1CXLQ411 11 L-4.1 (LC)

SSR1CXLQ412 12 L-4.2 (LC)

SSR1CXLQ413 13 Ve-4.2 (LC)

SSR1CXLQ414 14 I-4 (LC)

9.10.8 Board Configuration Reference

The physical slot that houses the CXLD4 is different from the logical slot displayed on the
T2000. You can use the T2000 to set parameters for the CXLQ4.

Displayed Slot
The CXLQ4 is housed in one slot in the subrack.
The logical boards for the CXLQ4 are the R1SLQ41, RCXL and GSCC.
Table 9-112 lists the logical slots displayed on the T2000.

Table 9-112 Logical slots displayed on the T2000 for the CXLQ1
Board Logical Board Logical Slot

CXLQ4 R1SLQ41 Slots 4–5

RCXL Slots 80–81

GSCC Slots 82–83

Board Parameters
l J1 byte
l C2 byte
l Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.10.9 Technical Specifications

The technical specifications for the CXLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-113 lists the specifications for the optical interfaces of the CXLQ4.

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Table 9-113 Specifications for the optical interfaces of the CXLQ4

Item Specification

Nominal bit rate 622080 kbit/s

Line code NRZ

Optical interface I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

type

Working 1260 to 1274 to 1280 to 1480 to 1480 to

wavelength (nm) 1360 1356 1335 1580 1580

Optical source MLM MLM SLM SLM SLM

type

Mean launched –15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2

optical power
(dBm)

Receiver –23 –28 –28 –28 –34

sensitivity (dBm)

Min. overload –8 –8 –18 –8 –13

(dBm)

Min. extinction 8.2 8.2 10 10 10.5

ratio (dB)

Cross-Connect Capacity
The cross-connect capacity of the CXLQ4 is as follows:

l Higher order cross-connect capacity: 15 Gbit/s

l Lower order cross-connect capacity: 5 Gbit/s
l Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLQ4 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLQ4 are as follows:

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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg):1.0kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption for the CXLQ4 is 50W.

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Hardware Description 10 Auxiliary Boards

10 Auxiliary Boards

About This Chapter

This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA.

10.1 EOW
This section describes the EOW, an orderwire processing board, in terms of the version, function,
principle, front panel and specifications.
10.2 AUX
This section describes the AUX, a system auxiliary interface board, in terms of the version,
function, working principle, front panel and specifications.
10.3 AMU
This section describes the AMU, an orderwire processing and alarm concatenation board, in
terms of the version, function, principle, front panel and specifications.
10.4 FAN
This section describes the FAN, a fan control board, in terms of the version, function, principle,
front panel, configuration and specifications.

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10.1 EOW
This section describes the EOW, an orderwire processing board, in terms of the version, function,
principle, front panel and specifications.

10.1.1 Version Description

The functional version of the EOW is R1.
10.1.2 Function and Feature
The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data
bytes.
10.1.3 Working Principle and Signal Flow
The EOW consists of the clock module, switch module, OHP module, and DC/DC converter
module.
10.1.4 Front Panel
On the front panel of the EOW, there are indicators and interfaces.
10.1.5 Valid Slots
The EOW can be housed in slot 9 in the subrack.
10.1.6 Technical Specifications
The technical specifications of the EOW cover the board dimensions, weight and power
consumption.

10.1.1 Version Description

The functional version of the EOW is R1.

10.1.2 Function and Feature

The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data
bytes.
Table 10-1 lists the functions and features of the EOW.

Table 10-1 Functions and features of the EOW

Function and EOW
Feature

Auxiliary interface Provides four broadcast data interfaces (Serial 1–4).

Orderwire interface Provides one orderwire interface.

Overhead Processes the E1, E2, and Serial 1–4 bytes.

processing

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10.1.3 Working Principle and Signal Flow

The EOW consists of the clock module, switch module, OHP module, and DC/DC converter
module.
Figure 10-1 shows the block diagram for the functions of the EOW.

Figure 10-1 Block diagram for the functions of the EOW

Clock Reference clock and frame header

CXL unit A/B
module

S1~S4
interface S1~S4

Switch
Phone interface OHP module CXL unit A/B
E1/E2
module
SLIC

+3.3 V +3.3 V
DC/DC Fuse -48 V/ -60 V
+5 V converter -48 V/ -60 V
DC/DC
+1.8 V converter Fuse
+3.3 V backup
power from AUX

Clock Module
The clock module first divides frequencies of the system clock and header sent from the cross-
connect board. The system clock and header are then transmitted to other modules as OHP
Process module and the switch module.

Switch Module
The switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslots
under control of micro processor. The switch module can switch any timeslot of overhead signal
sent from the SCC to any timeslot of output overhead signals.

OHP Module
l Processes E1 and E2 bytes sent by the CXL board.
l Realizes interconnection between orderwire audio interface.
l Interconnects with orderwire phone port through SLIC unit.
l Processes serial1–serial4 sent from the CXL board.
l Provides S1–S4 as RS232/RS422 serial transparent data interfaces, the level of which can
be set by software.

DC/DC Converter
Through the DC/DC converter module, the power converting module generates required DC
voltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. In
addition, protection is provided to board +3.3 V power supply.

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10.1.4 Front Panel

On the front panel of the EOW, there are indicators and interfaces.

Appearance of the Front Panel

Figure 10-2 shows the appearance of the front panel of the EOW.

Figure 10-2 Front panel of the EOW

EOW
STAT
PROG
PHONE
S1
S2
S3
S4

EOW

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage of
these interfaces.

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Table 10-2 Interfaces on the front panel of the EOW

Interface Interface Usage

Type

PHONE RJ-11 Orderwire phone interface

S1 RJ-45 Broadcast data interface S1

S2 RJ-45 Broadcast data interface S2

S3 RJ-45 Broadcast data interface S3

S4 RJ-45 Broadcast data interface S4

Table 10-3 lists the pins of the PHONE interface.

Table 10-3 Pins of the PHONE interface of the EOW

Front View Pin Usage

4 Signal 1

5 Signal 2

1–3 and 6–8 Not defined

8 7 6 5 4 3 2 1

Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces.

Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW

Front View Pin Usage

1 RS-422 data transmitting positive

2 RS-422 data transmitting negative

3 RS-422 data receiving positive

4 RS232 data receive end

8 7 6 5 4 3 2 1
5 Grounding

6 RS-422 data receiving negative

7 Not defined

8 RS232 data transmit end

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10.1.5 Valid Slots

The EOW can be housed in slot 9 in the subrack.

10.1.6 Technical Specifications

The technical specifications of the EOW cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the EOW are as follows:

l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.4

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EOW is 10 W.

10.2 AUX
This section describes the AUX, a system auxiliary interface board, in terms of the version,
function, working principle, front panel and specifications.

10.2.1 Version Description

The AUX has two versions, R1 and R2.
10.2.2 Function and Feature
The AUX is used to provide various management and auxiliary interfaces, and to provide the
central backup of the +3.3 V power supply for the boards in the subrack.
10.2.3 Working Principle and Signal Flow
The AUX consists of the control module, communication module, DC/DC converter module
and so on.
10.2.4 Front Panel
On the front panel of the AUX, there are many types of interfaces.
10.2.5 Valid Slots
The AUX can be housed in slot 10 in the subrack.
10.2.6 Technical Specifications
The technical specifications of the AUX cover the board dimensions, weight and power
consumption.

10.2.1 Version Description

The AUX has two versions, R1 and R2.

The R1AUX and R2AUX are two versions developed in different periods. The two versions can
be replaced by each other.

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10.2.2 Function and Feature

The AUX is used to provide various management and auxiliary interfaces, and to provide the
central backup of the +3.3 V power supply for the boards in the subrack.
Table 10-5 lists the functions and features of the AUX.

Table 10-5 Functions and features of the AUX

Item AUX

Management Provides the OAM/F&f interface, which supports the X.25 protocol.
interface Provides the ETH NMS interface.

Clock interface Provides two BITS clock input interfaces and two BITS clock output
interfaces (impedance: 120 ohms).

Alarm interface Provides three alarm input and one alarm output interfaces.

Commissioning Provides one commissioning COM interface.

interface

Internal Realizes the inter-board communication among boards in the

communication subrack.

Backup and check of Monitors the two independent –48 power supplies in the subrack,
the power supply and performs the overvoltage (–72 V) check and undervoltage (–38.4
V) check.
Provides the central backup of the +3.3 V power supply for the
boards in the subrack, which is the 1:N protection for the secondary
power supply of each board. The power of the +3.3 V power supply
is 80 W.
Performs the overvoltage (3.8 V) check and undervoltage (3.1 V)
check on the output of the +3.3 V backup power supply.

Audible alarm Supports the audible alarm and the clearing of the audible alarm.

10.2.3 Working Principle and Signal Flow

The AUX consists of the control module, communication module, DC/DC converter module
and so on.
Figure 10-3 shows the block diagram for the functions of the R1AUX.

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Figure 10-3 Block diagram for the functions of the R1AUX

F&f/OAM
interface CXL

CLK
interface CXL

-48 V/BAK 3.3 V

3 x input and Housekeeping
1 x output power test & -48 V/ -60 V
input/output
thunder-proof test

Control module

COM 100/10 Mbit/s 2 X 100/10 Mbit/s

interface CXL
Communication module
100/10 Mbit/s
ETH 100/10 Mbit/s Ehernet bus
interface Other unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.8 V converter
DC/DC -48 V/ -60 V
converter
+3.3 V backup
power

Figure 10-4 shows the block diagram for the functions of the R2AUX.

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Figure 10-4 Block diagram for the functions of the R2AUX

F&f/OAM
interface CXL

CLK
interface CXL

-48 V/BAK 3.3 V

3 x input and Housekeeping
1 x output power test & -48 V/ -60 V
input/output
thunder-proof test

Control module CXL

COM 100/10 Mbit/s 2 x 100/10 Mbit/s

interface CXL
Communication module
ETH 100/10 Mbit/s
interface 100/10 Mbit/s Ehernet bus Other
unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.8 V converter
DC/DC -48 V/ -60 V
converter
+3.3 V backup
power

The function modules of the R1AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX
OSN 1500. This module provides:

l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect
the SCC, the cross-connect, the line and the tributary boards for inter-board communication
of the OptiX OSN 1500.
l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning
network interface for service slots, which forms a VLAN with the 13 inter-board
communication network interfaces. The other interface is the interface for network
management.
l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB
boards. These two interfaces and one network interface on the front panel are of the same
VLAN.

Control Module
The control module mainly consists of CPUs and monitors the running state of the board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.

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Detection of –48 V and Backup +3.3 V Powers and Lightening Protection Module
This module detects:

l Over-voltage and under-voltage of –48 V and backup +3.3 V powers

l System lightening protection fault

Other Function
l F&f interface
l OAM serial interface for network management
l Two-in and two-out BITS clock interface (120 ohms)
l COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides
40 W/+3.3 V backup power supply for the system.

The function modules of the R2AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX
OSN 1500. This module provides:

l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect
the SCC, the cross-connect, the line and the tributary boards for inter-board communication
of the OptiX OSN 1500.
l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning
network interface for service slots, which forms a VLAN with the 13 inter-board
communication network interfaces. The other interface is the interface for network
management.
l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB
boards. These two interfaces and one network interface on the front panel are of the same
VLAN.

Control Module
The control module mainly consists of CPLDs and reports the local board state to the CXL board
through the control bus with the CXL board. This module also obtains the control information
of the local board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.

Detection of –48 V and Backup +3.3 V Powers and Lightening Protection Module
This module detects:

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l Over-voltage and under-voltage of –48 V and backup +3.3 V powers

l System lightening protection fault

Other Function
l F&f interface
l OAM serial interface for network management
l Two-in and two-out BITS clock interface (120 ohms)
l COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides
40 W/+3.3 V backup power supply for the system.

10.2.4 Front Panel

On the front panel of the AUX, there are many types of interfaces.

Appearance of the Front Panel

Figure 10-5 shows the appearance of the front panel of the AUX.

Figure 10-5 Front panel of the AUX

AUX
ETH
COM
CLK
ALM
OAM/F&f

AUX

Interfaces
There are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage of
these interfaces.

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Table 10-6 Interfaces on the front panel of the AUX

Interface Interface Usage

Type

ETH RJ-45 NM interface

COM RJ-45 Commissioning interface

CLK RJ-45 120-ohm external clock input/output interface

ALM RJ-45 3 x input and 1 x output alarm interface

OAM/F&f RJ-45 Serial NM and management interface

Table 10-7 lists the pins of the CLK interface.

Table 10-7 Pins of the CLK interface of the AUX

Front View Pin Usage

1 Receiving negative for 120-ohm clock 1

2 Receiving positive for 120-ohm clock 1

3 Receiving negative for 120-ohm clock 2

4 Transmitting negative for 120-ohm clock 1

8 7 6 5 4 3 2 1
5 Transmitting positive for 120-ohm clock 1

6 Receiving positive for 120-ohm clock 2

7 Transmitting negative for 120-ohm clock 2

8 Transmitting positive for 120-ohm clock 2

Table 10-8 lists the pins of the ETH and COM interfaces.

Table 10-8 Pins of the ETH and COM interfaces of the AUX

Front View Pin Usage

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Not defined
8 7 6 5 4 3 2 1
5 Not defined

6 Receiving negative

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Front View Pin Usage

7–8 Not defined

Table 10-9 lists the pins of the ALM interface.

Table 10-9 Pins of the ALM interface of the AUX

Front View Pin Usage

1 Positive for critical and major alarm signal

output

2 Negative for critical and major alarm signal

output

3 Positive for minor and warning alarm signal

8 7 6 5 4 3 2 1
output

4 Positive for alarm signal output 1

5 Negative for alarm signal output 1

6 Negative for minor and warning alarm signal

output

7 Positive for alarm signal output 2

8 Negative for alarm signal output 2

Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table
10-10 lists pins of the interface used as the OAM interface.

Table 10-10 Pins of the OAM interface of the AUX

Front View Pin Usage

1 Requests for transmission.

2 Prepares the DTE.

3 Transmits data.

4 Grounds.
8 7 6 5 4 3 2 1
5 Grounds.

6 Receives data.

7 Prepare the DCE.

8 Prepares for the receiving of

signals.

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Table 10-11 lists the pins of the interface used as the F&f interface.

Table 10-11 Pins of the F&f interface of the AUX

Front View Pin Usage

4 RS232 receive end

5 Grounding end

8 RS232 transmit end

1–3 and 6–7 Not defined

8 7 6 5 4 3 2 1

10.2.5 Valid Slots

The AUX can be housed in slot 10 in the subrack.

10.2.6 Technical Specifications

The technical specifications of the AUX cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the AUX are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the AUX is 19 W.

10.3 AMU
This section describes the AMU, an orderwire processing and alarm concatenation board, in
terms of the version, function, principle, front panel and specifications.

10.3.1 Version Description

The functional version of the AMU board is R1.
10.3.2 Function and Feature
The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the
equipment.
10.3.3 Working Principle and Signal Flow
The AMU consists of the clock module, overhead processing module and power supply module.
10.3.4 Front Panel

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On the front panel of AMU, there are board indicators and interfaces of many types.
10.3.5 Valid Slots
The AMU can be housed in slot 9 in the subrack.
10.3.6 Technical Specifications
The technical specifications of the AMU cover the board dimensions, weight and power
consumption.

10.3.1 Version Description

The functional version of the AMU board is R1.

10.3.2 Function and Feature

The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the
equipment.
Table 10-12 lists the functions and features of the AMU.

Table 10-12 Functions and features of the AMU

Item AMU

Auxiliary interface Provides two broadcast data interfaces (Serial 1–2).

Cabinet alarm Drives and concatenates the four cabinet indicators.

indicator

Orderwire interface Provides one orderwire interface.

Commissioning Supports the commissioning serial port and 100M commissioning

interface network port, when connected to the AUX.

Overhead processing Processes the E1, E2, and Serial 1–2 bytes.

Backup and check of Performs the overvoltage/undervoltage check on the output of the
the power supply power supply modules.

10.3.3 Working Principle and Signal Flow

The AMU consists of the clock module, overhead processing module and power supply module.
Figure 10-6 shows the block diagram for the functions of the AMU.

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Figure 10-6 Block diagram for the functions of the AMU

Backplane

Clock Reference clock

CXL unit
module

S1~S4
Overhead
E1/E2 process CXL unit
module

Power
supply -48 V
module

＋3.3 V +3.3 V power backup

from AUX

Clock Module
The clock module extracts and processes the reference clock signals from the CXL.

Overhead Processing Module

The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, and
uses the orderwire bytes for the connection of the orderwire phones. This module also processes
Serial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives and
concatenates the cabinet indicators. Figure 10-7 shows the positions of the orderwire bytes in
the SDH frame.

Figure 10-7 Positions of orderwire bytes in the SDH frame

A1 A1 A1 A2 A2 A2 J0

B1 E1

D1 D2 D3 Serial 1 Serial 2

AU_PTR

B2 B2 B2 K1 K2

D4 D5 D6

D7 D8 D9

D10 D11 D12

S1 M1 E2

Power Supply Module

The power supply module provides supplies power to the AMU board and provides centralized
+3.3 V power backup for other boards.

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10.3.4 Front Panel

On the front panel of AMU, there are board indicators and interfaces of many types.

Appearance of the Front Panel

Figure 10-8 shows the appearance of the front panel of the AMU.

Figure 10-8 Front panel of the AMU

AMU
STAT
PROG
PHONE
S1
S2
LAMP1
LAMP2

AMU

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usage
of these interfaces.

Table 10-13 Interfaces on the front panel of the AMU

Interface Interface Type Usage

PHONE RJ-11 Orderwire phone interface

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Interface Interface Type Usage

S1 RJ-45 Broadcast data interface S1

S2 RJ-45 Broadcast data interface S2

LAMP1 RJ-45 Cabinet alarm indicator output interface

LAMP2 RJ-45 Cabinet concatenated alarm indicator input

interface

Table 10-14 lists the pins of the PHONE interface.

Table 10-14 Pins of the PHONE interface of the AMU

Front View Pin Usage

4 Signal 1

5 Signal 2

1–3 and 6–8 Not defined

8 7 6 5 4 3 2 1

Table 10-15 lists the pins of the S1 and S2 interfaces.

Table 10-15 Pins of the S1 and S2 interfaces of the AMU

Front View Pin Usage

1 RS-422 data transmitting

positive

2 RS-422 data transmitting

negative

3 RS-422 data receiving positive

8 7 6 5 4 3 2 1

4 RS232 data receive end

5 Grounding

6 RS-422 data receiving negative

7 Not defined

8 RS232 data transmit end

Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces.

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Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU

Front View Pin Usage

1 Positive for critical alarm

signals

2 Negative for critical alarm

signals

3 Positive for major alarm

8 7 6 5 4 3 2 1
signals

4 Positive for power indicator

signals

5 Negative for power indicator

signals

6 Negative for major alarm

signals

7 Positive for minor alarm

signals

8 Negative for minor alarm

signals

Connection for Alarm Concatenation

The AMU provides the concatenation interface for the cabinet alarm indicators. Connect the
LAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of the
subrack 1 to the indicator interface on the top of the cabinet.

Figure 10-9 shows how to connect the cabinet alarm indicators.

Figure 10-9 Connection of the cabinet alarm indicators

Cabinet
indicators

LAMP1 LAMP2

Subrack 2

LAMP1 LAMP2

Subrack 1

Cabinet

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10.3.5 Valid Slots

The AMU can be housed in slot 9 in the subrack.

10.3.6 Technical Specifications

The technical specifications of the AMU cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the AMU are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the AMU is 8 W.

10.4 FAN
This section describes the FAN, a fan control board, in terms of the version, function, principle,
front panel, configuration and specifications.

10.4.1 Version Description

The functional version of the FAN board is R1.
10.4.2 Function and Feature
The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control
board, and to report the off-service alarm of the fan.
10.4.3 Working Principle and Signal Flow
The FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
10.4.4 Front Panel
There are no indicators on the front panel of the FAN.
10.4.5 Valid Slots
The FAN can be housed in slot 20 in the subrack.
10.4.6 Technical Specifications
The technical specifications of the FAN cover the board dimensions, weight, power consumption
and working voltage.

10.4.1 Version Description

The functional version of the FAN board is R1.

10.4.2 Function and Feature

The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control
board, and to report the off-service alarm of the fan.
Table 10-17 lists the functions and features of the FAN.

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Table 10-17 Functions and features of the FAN

Function and FAN
Feature

Hot swap function Provides the hot swap function for the fan frame.

Status check Provides the function of fan status check.

function

Alarm check Reports the fan alarm and in-service information.

function

10.4.3 Working Principle and Signal Flow

The FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
Figure 10-10 shows the block diagram for the functions of the FAN.

Figure 10-10 Block diagram for the functions of the FAN

- 48 V 1
GND GND
- 48 V 2
Power
GND1 access Delay
Fan
unit start unit
GND2 - 48 V - 48 V
-
GND

48 V

Fan alarm
signals
Status
Voltage detection
drop unit unit
- 48 V GND

Power Interface Unit

The power interface unit accesses the –48 V power supply for the FAN.

State Detecting Unit

This unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarm
to the CXL to indicate the off state of the fan and drives the alarm indicator.

10.4.4 Front Panel

There are no indicators on the front panel of the FAN.

Appearance of the Front Panel

The OptiX OSN equipment applies a modular fan platform.

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One OptiX OSN 1500 subrack uses one fan tray assembly.

Figure 10-11 shows the appearance of the front panel of the FAN.

Figure 10-11 Front panel of the FAN

FAN
RUN

ALM

Indicators
The following indicators are present on the front panel of the board:

l Board running state (RUN), which is green when lit.

l Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

10.4.5 Valid Slots

The FAN can be housed in slot 20 in the subrack.

10.4.6 Technical Specifications

The technical specifications of the FAN cover the board dimensions, weight, power consumption
and working voltage.

Mechanical Specifications
The mechanical specifications of the FAN are as follows:

l Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃) and with –48 V input voltage, the maximum power
consumption of the FAN is 20 W.

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Working Voltage
The working voltage for the FAN can be –48 V±20% DC.

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Hardware Description 11 WDM Processing Boards

11 WDM Processing Boards

About This Chapter

This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A,
MR2B, MR2C, MR4, LWX, OBU1, and FIB.

11.1 CMR2
This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.2 CMR4
This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.3 MR2
This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.4 MR2A
This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.5 MR2B
This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.6 MR2C
This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.7 MR4
This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.8 LWX
This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.9 OBU1

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This section describes the TN11OBU1, an optical booster amplifier board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.10 FIB
This section describes the FIB, a wavelength filter and isolation board, in terms of the version,
function, principle, front panel, configuration and specifications.

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11.1 CMR2
This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.

11.1.1 Version Description

The functional version of the CMR2 board is TN11.
11.1.2 Function and Feature
The CMR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing
and channel expansion.
11.1.3 Working Principle and Signal Flow
The CMR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.1.4 Front Panel
On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.
11.1.5 Valid Slots
The CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.
11.1.6 Board Feature Code
The board feature code of the CMR2 contains eight characters, which indicate the wavelengths
for the 2-channel optical signals processed by the board.
11.1.7 Technical Specifications
The technical specifications of the CMR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.1.1 Version Description

The functional version of the CMR2 board is TN11.

11.1.2 Function and Feature

The CMR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing
and channel expansion.
Table 11-1 lists the functions and features of the CMR2.

Table 11-1 Functions and features of the CMR2

Function and CMR2
Feature

Basic function Adds/Drops two wavelengths to/from the multiplexed signals.

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Function and CMR2

Feature

Channel expansion Provides the intermediate port used for expansion. Under certain
conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

11.1.3 Working Principle and Signal Flow

The CMR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-1 shows the block diagram for the functions of the CMR2.

Figure 11-1 Block diagram for the functions of the CMR2

D01 D02 MO MI A01 A02

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The CMR2 is a passive board that has no interface with the
backplane.

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OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.1.4 Front Panel

On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-2 shows the appearance of the front panel of the CMR2.

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Figure 11-2 Front panel of the CMR2

CMR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT
OUT
IN
MO
MI
D1
A1
D2
A2

CMR2

Indicator
On the front panel of the CMR2, there is one board hardware state indicator (STAT), which is
red or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type and
usage of the optical interfaces.

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Table 11-2 Optical interfaces of the CMR2

Interface Interface Usage

Type

A1–A2 LC Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1–D2 LC Transmit signals to the optical wavelength converting board

or centralized client-side equipment.

IN LC Receives multiplexed signals.

OUT LC Transmits multiplexed signals.

MO LC Acts as a concatenation output optical interface and connects

to the input optical interfaces of other OADM boards.

MI LC Acts as a concatenation input optical interface and connects

to the output optical interfaces of other OADM boards.

11.1.5 Valid Slots

The CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.

11.1.6 Board Feature Code

The board feature code of the CMR2 contains eight characters, which indicate the wavelengths
for the 2-channel optical signals processed by the board.

Table 11-3 lists the details on the board feature code.

Table 11-3 Feature code of the CMR2

Barcode Indication Description

First four characters Wavelength for the optical The wavelength is for the
signals first channel of optical
signals processed by the
board.

Last four characters Wavelength for the optical The wavelength is for the
signals second channel of optical
signals processed by the
board.

For example, the feature code of the TN11CMR2 is 14711571.

l "1471" indicates that the wavelength for the first channel of optical signals is 1471 nm.
l "1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.

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11.1.7 Technical Specifications

The technical specifications of the CMR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-4 lists the specifications of optical interfaces of the CMR2.

Table 11-4 Specifications of the optical interfaces of the CMR2

Optical Item Specification
Interface

- Working wavelength range 1271–1611

(nm)

- Channel spacing (GHz) 20

IN-D1 0.5 dB passband bandwidth ≥ ±6.5

IN-D2 (nm)

Insertion loss (dB) in the ≤ 1.5

channel for dropping
wavelengths

Adjacent channel isolation > 25

(dB)

Non-adjacent channel > 35

isolation (dB)

A1-OUT 0.5 dB passband bandwidth ≥ ±6.5

A2-OUT (nm)

Insertion loss (dB) in the ≤ 1.5

channel for adding
wavelengths

IN-MO Insertion loss (dB) ≤ 1.0

MI-OUT
Isolation (dB) > 13

- Return loss (dB) > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power
of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.8

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Power Consumption
l In the normal temperature (25℃), the maximum power consumption of the CMR2 is 0.2
W.
l In the high temperature (55℃), the maximum power consumption of the CMR2 is 0.3 W.

11.2 CMR4
This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.

11.2.1 Version Description

The functional version of the CMR4 board is TN11.
11.2.2 Function and Feature
The CMR4 is used to dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing
and channel expansion.
11.2.3 Working Principle and Signal Flow
The CMR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.2.4 Front Panel
On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.
11.2.5 Valid Slots
The CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.
11.2.6 Board Feature Code
The board feature code of the CMR4 contains eight characters, which indicate the wavelengths
for the 4-channel optical signals processed by the board.
11.2.7 Technical Specifications
The technical specifications of the CMR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.2.1 Version Description

The functional version of the CMR4 board is TN11.

11.2.2 Function and Feature

The CMR4 is used to dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing
and channel expansion.
Table 11-5 lists the functions and features of the CMR4.

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Table 11-5 Functions and features of the CMR4

Function and CMR4
Feature

Basic function Adds/Drops four wavelengths to/from the multiplexed signals.

Channel expansion Provides the intermediate port used for expansion. Under certain
conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

11.2.3 Working Principle and Signal Flow

The CMR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-3 shows the block diagram for the functions of the CMR4.

Figure 11-3 Block diagram for the functions of the CMR4

D01 D02 D03 D04 MO MI A01 A02 A03 A04

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01–D04 four wavelengths
from the signal. These four dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds four wavelengths through optical interfaces A01–A04 and

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multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.2.4 Front Panel

On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-4 shows the appearance of the front panel of the CMR4.

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Figure 11-4 Front panel of the CMR4

CMR4
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT
OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

CMR4

Indicator
One the front panel of the CMR4, there is one board hardware state indicator (STAT), which is
red or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the type
and usage of these optical interfaces.

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Table 11-6 Optical interfaces of the CMR4

Interface Interface Usage
Type

A1–A4 LC Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1–D4 LC Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN LC Receives multiplexed signals.

OUT LC Transmits multiplexed signals.

MI LC Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

MO LC Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

11.2.5 Valid Slots

The CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.

11.2.6 Board Feature Code

The board feature code of the CMR4 contains eight characters, which indicate the wavelengths
for the 4-channel optical signals processed by the board.
Table 11-7 lists the details on the board feature code.

Table 11-7 Feature code of the CMR4

Barcode Indication Description

Characters 1–2 Wavelength for the optical The characters are two
signals middle characters of the four
that indicate the wavelength
for the first channel of optical
signals.

Characters 3–4 Wavelength for the optical The characters are two
signals middle characters of the four
that indicate the wavelength
for the second channel of
optical signals.

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Barcode Indication Description

Characters 5–6 Wavelength for the optical The characters are two
signals middle characters of the four
that indicate the wavelength
for the third channel of
optical signals.

Characters 7–8 Wavelength for the optical The characters are two
signals middle characters of the four
that indicate the wavelength
for the fourth channel of
optical signals.

For example, the feature code of the TN11CMR4 is 47495961.

l "47" indicates that the wavelength for the first channel of optical signals is 1471 nm.
l "49" indicates that the wavelength for the second channel of optical signals is 1491 nm.
l "59" indicates that the wavelength for the third channel of optical signals is 1591 nm.
l "61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.

11.2.7 Technical Specifications

The technical specifications of the CMR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-8 lists the specifications of the optical interfaces of the CMR4.

Table 11-8 Specifications of the optical interfaces of the CMR4

Optical Item Specification

Interface

– Working wavelength range 1291 to 1611 (1371 nm excluded)

(nm)

– Channel spacing (GHz) 20

IN-D1 0.5 dB passband bandwidth ≥ ±6.5

IN-D2 (nm)
IN-D3 Insertion loss (dB) in the ≤2
IN-D4 channel for dropping
wavelengths

Adjacent channel isolation > 25

(dB)

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Optical Item Specification

Interface

Non-adjacent channel > 35

isolation (dB)

A1-OUT 0.5 dB passband bandwidth ≥ ±6.5

A2-OUT (nm)
A3-OUT Insertion loss (dB) in the ≤2
A4-OUT channel for adding
wavelengths

IN-MO Insertion loss (dB) ≤ 1.5

MI-OUT
Isolation (dB) > 13

– Return loss (dB) > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power
of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
l In the normal temperature (25℃), the maximum power consumption of the CMR4 is 0.2
W.
l In the high temperature (55℃), the maximum power consumption of the CMR4 is 0.3 W.

11.3 MR2
This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.

11.3.1 Version Description

The functional version of the MR2 board is TN11.
11.3.2 Function and Feature
The MR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing
and channel expansion.
11.3.3 Working Principle and Signal Flow
The MR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.3.4 Front Panel

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On the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
11.3.5 Valid Slots
The MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.
11.3.6 Board Feature Code
The board feature code of the MR2 contains eight characters, which indicate the frequency for
the 2-channel optical signals processed by the board.
11.3.7 Technical Specifications
The technical specifications of the MR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.3.1 Version Description

The functional version of the MR2 board is TN11.

11.3.2 Function and Feature

The MR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing
and channel expansion.
Table 11-9 lists the functions and features of the MR2.

Table 11-9 Functions and features of the MR2

Function and MR2
Feature

Basic function Adds/Drops two wavelengths to/from the multiplexed signals.

Channel expansion Provides the intermediate port used for expansion. Under certain
conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

11.3.3 Working Principle and Signal Flow

The MR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-5 shows the block diagram for the functions of the MR2.

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Figure 11-5 Block diagram for the functions of the MR2

D01 D02 MO MI A01 A02

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.

The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.3.4 Front Panel

On the front panel of the MR2, there are board indicators, interfaces and laser safety class label.

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Appearance of the Front Panel

Figure 11-6 shows the appearance of the front panel of the MR2.

Figure 11-6 Front panel of the MR2

MR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT
OUT
IN
MO
MI
D1
A1
D2
A2

MR2

Indicator
On the front panel of the MR2, there is one board hardware state indicator (STAT), which is red
or green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type and
usage of the optical interfaces.

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Table 11-10 Optical interfaces of the MR2

Interface Interface Usage
Type

A1–A2 LC Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1–D2 LC Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN LC Receives multiplexed signals.

OUT LC Transmits multiplexed signals.

MO LC Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

MI LC Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

11.3.5 Valid Slots

The MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.

11.3.6 Board Feature Code

The board feature code of the MR2 contains eight characters, which indicate the frequency for
the 2-channel optical signals processed by the board.
Table 11-11 lists the details on the board feature code.

Table 11-11 Feature code of the MR2

Barcode Indication Description

First four (1–4) characters Frequency of optical signals The four characters are the
last four characters of the
figure that marks the
frequency of the first channel
of optical signals.

Last four (5–8) characters Frequency of optical signals The four characters are the
last four characters of the
figure that marks the
frequency of the second
channel of optical signals.

For example, the feature code of the TN11MR2 is 93609370.

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l "9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.
l "9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.

11.3.7 Technical Specifications

The technical specifications of the MR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-12 lists the specifications of the optical interfaces of the MR2.

Table 11-12 Specifications of the optical interfaces of the MR2

Optical Item Specification

Interface

- Working wavelength range 1529 to 1561

(nm)

- Channel spacing (GHz) 100

IN-D1 0.5 dB passband bandwidth ≥ ±0.11

IN-D2 (nm)

Insertion loss (dB) in the ≤ 1.5

channel for dropping
wavelengths

Adjacent channel isolation > 25

(dB)

Non-adjacent channel > 35

isolation (dB)

A1-OUT 0.5 dB passband bandwidth ≥ ±0.11

A2-OUT (nm)

Insertion loss (dB) in the ≤ 1.5

channel for adding
wavelengths

IN-MO Insertion loss (dB) ≤ 1.0

MI-OUT
Isolation (dB) > 13

- Return loss (dB) > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
l In the normal temperature (25℃), the maximum power consumption of the MR2 is 0.2 W.
l In the high temperature (55℃), the maximum power consumption of the MR2 is 0.3 W.

11.4 MR2A
This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.

11.4.1 Version Description

The functional version of the MR2A board is N1.
11.4.2 Function and Feature
The MR2A is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.4.3 Working Principle and Signal Flow
The MR2A consists of the OADM module, control and communication module, and DC/DC
converter module.
11.4.4 Front Panel
On the front panel of the MR2A, there are interfaces and laser safety class label.
11.4.5 Valid Slots
The MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.
11.4.6 Technical Specifications
The technical specifications of the MR2A cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.4.1 Version Description

The functional version of the MR2A board is N1.

11.4.2 Function and Feature

The MR2A is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-13 lists the functions and features of the MR2A.

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Table 11-13 Functions and features of the MR2A

Function and MR2A
Feature

Basic function Adds/Drops two arbitrary adjacent wavelengths, which are compliant
with ITU-T G.692 (DWDM). The signals are transparently
transmitted, and the working wavelength ranges from 1535.82 nm to
1560.61 nm.

OTM function The MR2A can be used as the two-channel wavelength adding/
dropping OTM station. Two MR2C boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-7.

OADM function Realizes the two-channel wavelength adding/dropping OADM station,

when used with the LWX. See Figure 11-8.

Central wavelength Supports the ITU-T-compliant standard wavelength with a channel

spacing of 100 GHz.

Figure 11-7 MR2A used as the OTM station

D1 D2 D1 D2 D1 D2

IN MO IN MO IN MO
Drop Drop Drop

OUT OUT
MI MI OUT MI
Add Add Add

MR2A MR2A MR2A

A1 A2 A1 A2 A1 A2

(1) (2)

(1) MR2A can serve as an OTM station adding/dropping two channels.

(2) Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.

Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM
station

LWX

A2 D2
Out MO

In MR2A MI

D1 A1

LWX

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11.4.3 Working Principle and Signal Flow

The MR2A consists of the OADM module, control and communication module, and DC/DC
converter module.
Figure 11-9 shows the block diagram for the functions of the MR2A.

Figure 11-9 Block diagram for the functions of the MR2A

D01 D02 MO MI A01 A02

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2A is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

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Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.4.4 Front Panel

On the front panel of the MR2A, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-10 shows the appearance of the front panel of the MR2A.

Figure 11-10 Front panel of the MR2A

MR2A

CLASS 1
LASER
PRODUCT
OUT AO1
AO2 M I
M O DO2
DO1 IN

MR2A

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Interfaces
There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 lists
the type and usage of the optical interfaces.

Table 11-14 Optical interfaces of the MR2A

Interface Interface Usage

Type

A01–A02 LC Adds two wavelengths of signals from the local.

D01–D02 LC Drops two wavelengths of signals to the local.

IN LC Receives multiplexed signals of two wavelengths.

OUT LC Transmits multiplexed signals of two wavelengths.

MO/MI LC Acts as a concatenation optical interface and concatenates

several MR2A boards.

11.4.5 Valid Slots

The MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.

11.4.6 Technical Specifications

The technical specifications of the MR2A cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-15 lists the specifications of the optical interfaces of the MR2A.

Table 11-15 Specifications of the optical interfaces of the MR2A

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.692
(DWDM).

Line code NRZ

Channel spacing (GHz) 100

Insertion loss (dB) in the <2

channel for adding or
dropping wavelengths

Adjacent channel isolation > 25

(dB)

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Item Description

Non-adjacent channel > 35

isolation (dB)

–0.5 dB channel bandwidth < ±0.11

(nm)

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power
of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the MR2A are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the MR2A does not consume power.

11.5 MR2B
This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.

11.5.1 Version Description

The functional version of the MR2B board is N1.
11.5.2 Function and Feature
The MR2B is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.5.3 Working Principle and Signal Flow
The MR2B consists of the OADM module, control and communication module, and DC/DC
converter module.
11.5.4 Front Panel
On the front panel of the MR2B, there are interfaces and laser safety class label.
11.5.5 Valid Slots
The MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,
or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.
11.5.6 Technical Specifications
The technical specifications of the MR2B cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

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11.5.1 Version Description

The functional version of the MR2B board is N1.

11.5.2 Function and Feature

The MR2B is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-16 lists the functions and features of the MR2B.

Table 11-16 Functions and features of the MR2B

Function and MR2B
Feature

Basic function Adds/Drops two arbitrary adjacent wavelengths, which are

compliant with ITU-T G.692 (DWDM). The signals are
transparently transmitted, and the working wavelength ranges from
1535.82 nm to 1560.61 nm.

OTM function The MR2B can be used as the two-channel wavelength adding/
dropping OTM station. Two MR2B boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-11.

OADM function Realizes the two-channel wavelength adding/dropping OADM

station, when used with the LWX. See Figure 11-12.

Central wavelength Supports the ITU-T-compliant standard central wavelength with a

channel spacing of 100 GHz.

Figure 11-11 MR2B used as the OTM station

D1 D2 D1 D2 D1 D2

IN MO IN MO IN MO
Drop Drop Drop

OUT OUT
MI MI OUT MI
Add Add Add

MR2B MR2B MR2B

A1 A2 A1 A2 A1 A2

(1) (2)

(1) MR2B can serve as an OTM station adding/dropping two channels.

(2) Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM
station

LWX

A2 D2
Out MO

In MR2B MI

D1 A1

LWX

11.5.3 Working Principle and Signal Flow

The MR2B consists of the OADM module, control and communication module, and DC/DC
converter module.

Figure 11-13 shows the block diagram for the functions of the MR2B.

Figure 11-13 Block diagram for the functions of the MR2B

D01 D02 MO MI A01 A02

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also

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provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2B is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.5.4 Front Panel

On the front panel of the MR2B, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-14 shows the appearance of the front panel of the MR2B.

Figure 11-14 Front panel of the MR2B

MR
MR2B
2B
CLASS 1
LASER
PRODUCT
OUT AO1 AO2 M I
MO DO2 DO1 IN

MR2B

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Interfaces
There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists the
type and usage of the optical interfaces.

Table 11-17 Optical interfaces of the MR2B

Interface Interface Usage

Type

A01–A02 LC Adds two wavelengths of signals from the local.

D01–D02 LC Drops two wavelengths of signals to the local.

IN LC Receives multiplexed signals of two wavelengths.

OUT LC Transmits multiplexed signals of two wavelengths.

MO/MI LC Acts as a concatenation optical interface and concatenates

several MR2B boards.

11.5.5 Valid Slots

The MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,
or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.

11.5.6 Technical Specifications

The technical specifications of the MR2B cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-18 lists the specifications of the optical interfaces of the MR2B.

Table 11-18 Specifications of the optical interfaces of the MR2B

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.
692.

Line code NRZ

Channel spacing (GHz) 100

Insertion loss in the <2

wavelength-adding
channel (dB)

Adjacent channel isolation > 25

(dB)

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Item Description

Non-adjacent channel > 35

isolation (dB)

–0.5 dB channel bandwidth < ±0.11

(nm)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2B are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the MR2B does not consume power.

11.6 MR2C
This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.

11.6.1 Version Description

The functional version of the MR2C board is N1.
11.6.2 Function and Feature
The MR2C is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.6.3 Working Principle and Signal Flow
The MR2C consists of the OADM module, control and communication module, and DC/DC
converter module.
11.6.4 Front Panel
On the front panel of the MR2C, there are interfaces and laser safety class label.
11.6.5 Valid Slots
The MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2C
can be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,
the MR2C can also be housed in any of slots 69–76 and 79–86.
11.6.6 Technical Specifications
The technical specifications of the MR2C cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

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11.6.1 Version Description

The functional version of the MR2C board is N1.

11.6.2 Function and Feature

The MR2C is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-19 lists the functions and features of the MR2C.

Table 11-19 Functions and features of the MR2C

Function and MR2C
Feature

Basic function Adds/Drops two arbitrary adjacent wavelengths, which are

compliant with ITU-T G.692 (DWDM). The signals are
transparently transmitted, and the working wavelength ranges from
1535.82 nm to 1560.61 nm.

OTM function The MR2C can be used as the two-channel wavelength adding/
dropping OTM station. Two MR2C boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-15.

OADM function Realizes the two-channel wavelength adding/dropping OADM

station, when used with the LWX. See Figure 11-16.

Central wavelength Supports the ITU-T-compliant standard wavelength with a channel

spacing of 100 GHz.

Figure 11-15 MR2C used as the OTM station

D1 D2 D1 D2 D1 D2

IN MO IN MO IN MO
Drop Drop Drop

OUT OUT
MI MI OUT MI
Add Add Add

MR2C MR2C MR2C

A1 A2 A1 A2 A1 A2

(1) (2)

(1) MR2C can serve as an OTM station adding/dropping two channels.

(2) Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C
and LWX

LWX

A2 D2
Out MO

In MR2C MI

D1 A1

LWX

11.6.3 Working Principle and Signal Flow

The MR2C consists of the OADM module, control and communication module, and DC/DC
converter module.

Figure 11-17 shows the block diagram for the functions of the MR2C.

Figure 11-17 Block diagram for the functions of the MR2C

D01 D02 MO MI A01 A02

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also

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provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2C is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.6.4 Front Panel

On the front panel of the MR2C, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-18 shows the appearance of the front panel of the MR2C.

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Figure 11-18 Front panel of the MR2C

MR2C

CLASS 1
LASER
PRODUCT
OUT AO1
AO2 M I
M O DO2
DO1 IN

MR2C

Interfaces
There is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists the
type and usage of the optical interfaces.

Table 11-20 Optical interfaces of the MR2C

Interface Interface Usage
Type

A01–A02 LC Adds two wavelengths of signals from the local.

D01–D02 LC Drops two wavelengths of signals to the local.

IN LC Receives multiplexed signals of two wavelengths.

OUT LC Transmits multiplexed signals of two wavelengths.

MO/MI LC Acts as a concatenation optical interface and concatenates

several MR2C boards.

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11.6.5 Valid Slots

The MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2C
can be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,
the MR2C can also be housed in any of slots 69–76 and 79–86.

11.6.6 Technical Specifications

The technical specifications of the MR2C cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-21 lists the specifications of the optical interfaces of the MR2C.

Table 11-21 Specifications of the optical interfaces of the MR2C

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.
692.

Line code NRZ

Channel spacing (GHz) 100

Insertion loss in the add/ <2

drop channel (dB)

Adjacent channel isolation > 25

(dB)

Non-adjacent channel > 35

isolation (dB)

–0.5 dB channel bandwidth < ±0.11

(nm)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power
of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2C are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 1.0

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Power Consumption
In the normal temperature (25℃), the MR2C does not consume power.

11.7 MR4
This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.

11.7.1 Version Description

The functional version of the MR4 board is TN11.
11.7.2 Function and Feature
The MR4 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing
and channel expansion.
11.7.3 Working Principle and Signal Flow
The MR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.7.4 Front Panel
On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.
11.7.5 Valid Slots
The MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.
11.7.6 Board Feature Code
The feature code of the MR4 has eight numbers, which identify the frequency of the first and
fourth channels of optical signals the board process.
11.7.7 Technical Specifications
The technical specifications of the MR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.7.1 Version Description

The functional version of the MR4 board is TN11.

11.7.2 Function and Feature

The MR4 is used to the dense wavelength division multiplexing (DWDM) system. The spacing
wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing
and channel expansion.

Table 11-22 lists the functions and features of the MR4.

Table 11-22 Functions and features of the MR4

Function and MR4

Feature

Basic function Adds/Drops four wavelengths to/from the multiplexed signals.

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Function and MR4

Feature

Channel expansion Provides the intermediate port used for expansion. Under certain
conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

11.7.3 Working Principle and Signal Flow

The MR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-19 shows the block diagram for the functions of the MR4.

Figure 11-19 Block diagram for the functions of the MR4

D01 D02 D03 D04 MO MI A01 A02 A03 A04

IN Drop Add OUT

OADM module

Control and communication module

Power supply module

+5 V DC/DC
converter

Delayed
startup
Fuse
SCC

Back plane
-48 V/-60 V -48 V/-60 V SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01–D04 four wavelengths
from the signal. These four dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds four wavelengths through optical interfaces A01–A04 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

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Control and communication module

l Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.
l Communicates data with the SCC.

DC/DC converter module

Converts –48 V DC or –60 V DC to a voltage required by each module of the board.

11.7.4 Front Panel

On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-20 shows the appearance of the front panel of the MR4.

Figure 11-20 Front panel of the MR4

MR4
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT
OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

MR4

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Indicator
On the front panel of the MR4, there is one board hardware state indicator (STAT), which is red
or green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type and
usage of the optical interfaces.

Table 11-23 Optical interfaces of the MR4

Interface Interface Usage
Type

A1–A4 LC Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1–D4 LC Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN LC Receives multiplexed signals.

OUT LC Transmits multiplexed signals.

MI LC Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

MO LC Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

11.7.5 Valid Slots

The MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.

11.7.6 Board Feature Code

The feature code of the MR4 has eight numbers, which identify the frequency of the first and
fourth channels of optical signals the board process.
Table 11-24 lists the details on the board feature code.

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Table 11-24 Board feature code

Barcode Indication Description

First four characters Frequency of optical signals The four characters are the
last four characters of the
figure that marks the
frequency of the first channel
of optical signals.

Last four characters Frequency of optical signals The four characters are the
last four characters of the
figure that marks the
frequency of the fourth
channel of optical signals.

For example, the feature code of the TN11MR4 is 92109240.

l "9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.
l "9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals the MR4 processes are successive:

l The frequency of the second channel of optical signals is 192.20 THz.

l The frequency of the third channel of optical signals is 192.30 THz.

11.7.7 Technical Specifications

The technical specifications of the MR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-25 lists the specifications of the optical interfaces of the MR4.

Table 11-25 Specifications of the optical interfaces of the MR4

Optical Item Specification

Interface

- Working wavelength range 1529 to 1561

(nm)

- Channel spacing (GHz) 100

IN-D1 0.5 dB passband bandwidth ≥ ±0.11

IN-D2 (nm)
IN-D3 Insertion loss in the ≤ 2.2
IN-D4 wavelength-dropping
channel (dB)

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Optical Item Specification

Interface

Adjacent channel isolation > 25

(dB)

Non-adjacent channel > 35

isolation (dB)

A1-OUT 0.5 dB passband bandwidth ≥ ±0.11

A2-OUT (nm)
A3-OUT Insertion loss in the ≤ 2.2
A4-OUT wavelength-adding channel
(dB)

IN-MO Insertion loss (dB) ≤ 1.5

MI-OUT
Isolation (dB) > 13

- Return loss (dB) > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power
of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9

Power Consumption
l In the normal temperature (25℃), the maximum power consumption of the MR4 is 0.2 W.
l In the high temperature (55℃), the maximum power consumption of the MR4 is 0.3 W.

11.8 LWX
This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the
version, function, principle, front panel, configuration and specifications.

11.8.1 Version Description

The functional version of the LWX board is N1.
11.8.2 Function and Feature
The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/
s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
11.8.3 Working Principle and Signal Flow
The LWX consists of the O/E conversion module, cross-connect module, CDR module and so
on.

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11.8.4 Front Panel

On the front panel of the LWX, there are indicators and interfaces.
11.8.5 Valid Slots
The LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.
11.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The feature code of
the LWX indicates the schemes the optical interfaces use to receive and transmit signals.
11.8.7 Technical Specifications
The technical specifications of the LWX cover the optical interface specifications, board
dimensions, weight and power consumption.

11.8.1 Version Description

The functional version of the LWX board is N1.

11.8.2 Function and Feature

The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/
s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
The LWX supports the optical wavelength convertion, 3R, protection, and loopback.
Table 11-26 lists the functions and features of the LWX.

Table 11-26 Functions and features of the LWX

Function LWX
and Feature

Basic Realizes the convertion between the wavelength at an arbitrary rate at the
function client side and the wavelength compliant with ITU-T G.692 (DWDM).
Transparently transmits signals.

3R function Provides the 3R function for the signals at the client side ranging from 10
Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate.

Protection Single fed and single Supports the inter-board protection and 1+1 inter-
scheme receiving board hot backup. The switching time is less than 50
ms.

Dual fed and Supports the intra-board protection. The optical

selective receiving channel protection can be realized by one board. The
switching time is less than 50 ms.

ALS function Supports the ALS function. When no signals are received, the corresponding
optical transmit module is automatically turned off.

Loopback Provides the inloop and outloop at the optical interface level, which are used
function for locating faults.

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Function LWX
and Feature

Performance Provides rich alarms and performance events for easy maintenance.
and alarm
monitoring

Central Supports the ITU-T-compliant standard wavelength with a channel spacing

wavelength of 100 GHz.

11.8.3 Working Principle and Signal Flow

The LWX consists of the O/E conversion module, cross-connect module, CDR module and so
on.
Figure 11-21 shows the block diagram for the functions of the LWX.

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Figure 11-21 Block diagram for the functions of the LWX

Loopback control
Reference clock

10 Mbit/s~2.7 Gbit/s
O/
E 2×2 Cross- Multi-rate
WDM side
Optical module at
loopback connection
CDR
client side

10 Mbit/s~2.7 Gbit/s O/
E Data
LOS
Laser shut down
communication
and control
module
LOS

10 Mbit/s~2.7 Gbit/s Client side loopback

O/
E
Optical module 2
at WDM side
2×2 Cross- Multi-rate
connection CDR

Loopback control
Reference
clock
10 Mbit/s~2.7 Gbit/s
O/
E
Optical module 1
at WDM side
Clock
10 Mbit/s~2.7 Gbit/s
O/
Optical E Data
splitter

LOS
communication
and control
Laser shut down
module Communication
SCC Unit

+3.3 V
DC/DC Fuse -48 V/ -60 V
+1.5 V converter
DC/DC module -48 V/ -60 V
+5V converter
+1.8 V module Fuse
+3.3 V backup
power

O/E Conversion Module

l The optical module at client side applies SFP encapsulation and can be configured as
different types of optical module. This module supports accessing optical signals at the rate
of 10 Mbit/s-2.7 Gbit/s.
l At WDM side, the module can be configured as an optical tranceiver module or an optical
tranceiver module and an optical receiver module. When two modules are configured at
WDM side, an optical splitter is used to realize dual feeding.
l In the receive direction, the module converts the received optical signals into electrical
signals.

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l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then send optical signals to fibers for transmission.
l Detect the R_LOS alarm and provide the function to shut down the laser.

Cross-connect Module
l Supports data selection from client side to WDM side and from WDM side to client side
l Supports WDM side optical module selection
l Supports loopback of client side signals
l Supports loopback of WDM side signals

CDR Module
l Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s
l Supports reading rates of accessed services

Communication and Control Module

l Supports Ethernet communication
l Supports reference clock of the CDR module
l Selects and configures services of other modules
l Implements laser controlling function
l Selects the clock from the active or the standby cross-connect board
l Control the indicator on the board

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The –48 V/–60 V voltage is converted to the following
voltages: +1.5 V, +3.3 V, +1.8 V and ±5 V. In addition, this module provides protection for the
board +3.3 V power supply.

11.8.4 Front Panel

On the front panel of the LWX, there are indicators and interfaces.

Appearance of the Front Panel

Figure 11-22 shows the appearance of the front panel of the LWX.

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Figure 11-22 Front panel of the LWX

LWX

STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCTTX RX
OUT1 IN1
OUT2 IN2

LWX

Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type and
usage of the optical interfaces.

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Table 11-27 Optical interfaces on the front panel of the LWX

Interface Interface Usage
Type

IN1/IN2 LC Receives signals from the optical add/drop multiplexing

board, MR2A.

OUT1/OUT2 LC Transmits signals to the optical add/drip multiplexing

board, MR2A.

TX LC Transmits signals to the client-side equipment.

RX LC Receives signals from the client-side equipment.

Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.

11.8.5 Valid Slots

The LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The feature code of
the LWX indicates the schemes the optical interfaces use to receive and transmit signals.
Table 11-28 lists the relation between the board feature code and the receive/transmit scheme.

Table 11-28 Relation between the board feature code and the receive/transmit scheme
Board Barcode Feature Code Receive/Transmit Scheme

SSN1LWX01 01 Single-fed single selective

SSN1LWX02 02 Dual-fed single selective

11.8.7 Technical Specifications

The technical specifications of the LWX cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 11-29 and Table 11-30 list the specifications of the client-side and WDM-side optical
interfaces of the LWX.

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Table 11-29 Specifications of the client-side optical interfaces of the LWX

Item Specification

Nominal bit rate 10 Mbit/s to 2.7 Gbit/s

Line code NRZ

Optical source type SLM SLM SLM

Transmission 15 40 80
distance (km)

Feature of the transmitter at S point

Working wavelength 1260 to 1360 1260 to 1360 1500 to 1580

range (nm)

Max. mean launched 0 +3 +3

optical power (dBm)

Min. mean launched –5 –2 –2

optical power (dBm)

Min. extinction ratio +8.2 +8.2 +8.2

(dB)

Side mode 30 30 30
suppression ratio
(dB)

Eye pattern Compliant with the Compliant with the Compliant with the
template defined in template defined in template defined in
ITU-T G.957 ITU-T G.957 ITU-T G.957
Recommendations Recommendations Recommendations

Feature of the receiver at S point

Receiver type PIN PIN APD

Wavelength range 1200 to 1600 1200 to 1600 1200 to 1600

(nm) of the received
signals

Receiver sensitivity –18 –18 –28

(dBm)

Min. overload (dBm) 0 –9 –9

Max. reflection –27 –27 –27

coefficient (dB)

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Table 11-30 Specifications of the WDM-side optical interfaces of the LWX

Item Specification

Channel 100
spacing (GHz)

Line code NRZ

Feature of the transmitter at Sn point

Target 640 170 (2 mW) 170 (10 mW) 360

transmission
distance (km) of
optical
interfaces

Max. mean –2 –2 +7 –2
launched optical
power (dBm)

Min. mean +3 +3 +5 +3
launched optical
power (dBm)

Min. extinction +10 +10 +10 +10

ratio (dB)

Nominal central 192.10 to 192.10 to 192.10 to 192.10 to

frequency 196.00 196.00 196.00 196.00
(THz)

Central ±12.5 ±12.5 ±12.5 ±12.5

frequency
deviation (GHz)

Max. –20 dB 0.2 0.4 0.4 0.4

spectral width
(nm)

Min. side mode 35 35 35 35

suppression
ratio (dB)

Dispersion 12800 2400 3200 1600

compensation
(ps/nm)

Eye pattern Compliant with Compliant with Compliant with Compliant with
the template the template the template the template
defined in ITU- defined in ITU- defined in ITU- defined in ITU-
T G.957 T G.957 T G.957 T G.957
Recommendati Recommendati Recommendati Recommendati
ons ons ons ons

Feature of the receiver at Rn point

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Item Specification

Receiver type APD PIN

Receiving 1200 to 1600 1200 to 1600

wavelength
range (nm)

Receiver –28 –18

sensitivity
(dBm)

Min. overload –9 0
(dBm)

Max. reflection –27 –27

coefficient (dB)

Mechanical Specifications
The mechanical specifications of the LWX are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the LWX is 30 W.

11.9 OBU1
This section describes the TN11OBU1, an optical booster amplifier board, in terms of the
version, function, principle, front panel, configuration and specifications.

11.9.1 Version Description

The functional version of the OBU1 is TN11.
11.9.2 Function and Feature
The OBU1 supports the in-service optical performance monitoring, gain-locking technology,
and transient control technology.
11.9.3 Working Principle and Signal Flow
The OBU1 consists of the EDFA optical module, optical splitter, and the control and
communication module.
11.9.4 Front Panel
On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.
11.9.5 Valid Slots
The OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.
11.9.6 Board Feature Code

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The feature code of the OBU1 contains six characters and indicates the gain and maximum
nominal input optical power of the optical signals.
11.9.7 Technical Specifications
The technical specifications of the OBU1 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.9.1 Version Description

The functional version of the OBU1 is TN11.

11.9.2 Function and Feature

The OBU1 supports the in-service optical performance monitoring, gain-locking technology,
and transient control technology.
Table 11-31 lists the functions and features of the OBU1.

Table 11-31 Functions and features of the OBU1

Function and OBU1
Feature

Basic function Amplifies a maximum of 40-channel optical signals (channel spacing:

100 GHz) at the same time.
Supports the transmission without electrical trunks for different spans.

Typical gain The typical gain of the OBU101 is 20 dB. The typical gain of the
OBU102 is 23 dB.

In-service optical Provides in-service performance monitoring optical interface. A small

performance volume of optical signals are output at the optical interface to the optical
monitoring spectrum analyzer or optical spectrum analyzing board. The optical
spectrum analyzer or optical spectrum analyzing board monitors the
multiplexed optical signals and optical performance without
interrupting services.

Gain-locking The EDFA of the board has the gain-locking function. When one or
technology more channels are added or dropped, or optical signals of certain
channels fluctuate, the signal gains of other channels are not affected.

Transient control The EDFA of the board has the transient control function. When
technology channels are added or dropped, the system can be upgraded or expanded
without interrupting services if the optical power fluctuation is
suppressed.

Performance and Checks and reports the optical power.

alarm monitoring Controls the temperature of the pumping laser.
Checks the pumping drive current, back facet current, cooling current,
temperature of the pumping laser, and the ambient temperature of the
board.

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NOTE

The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102
is used at the transmit end.

11.9.3 Working Principle and Signal Flow

The OBU1 consists of the EDFA optical module, optical splitter, and the control and
communication module.
Figure 11-23 shows the block diagram for the functions of the OBU1.

Figure 11-23 Block diagram for the functions of the OBU1

EDFA optical module

Splitter
IN

Detecting for
Pumping PIN temperature and
current
pumping current

Pumping and detection module

Control and communication module

Power supply module

+5 V DC/DC
+5 V converter

+5 V DC/DC
converter
Delayed
startup

Fuse

Backplane
-48 V/-60 V -48 V/-60 V SCC

Signal Flow
The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA optical
module. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1
also outputs few monitoring signals to the test instrument for performance analysis.

EDFA Optical Module

The EDFA module is used to amplify the input optical signals. The EDFA optical module applies
the gain auto-adjustment technology. With this technology, the EDFA can change the gain of
working wavelength signals in the allowed range.

Optical Splitter
The splitter is used to split the optical signals received from the EDFA optical module into two
channels of signals with different power. One channel of signlas are output from OUT optical

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interface and then transmitted in the main optical channel. The other channel of signals are output
to the MON port for sepctrum detection and monitoring. The power of signals at the MON is
one ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is
20 dB lower than that at the OUT interface.

Control and Communication Module

The control and communication module is used to control and monitor the functional modules
of the board, and to manage the communication.
This module collects the information on alarms and performance events, and data of working
status and voltage detection of each functional module. This module then reports the information
and data to the SCC.
The control and communication module receives commands from the SCC to control and
coordinate the working of each functional module.

11.9.4 Front Panel

On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

Appearance of the Front Panel

Figure 11-24 shows the appearance of the front panel of the OBU1.

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Figure 11-24 Front panel of the OBU1

OBU1
STAT
ACT
PROG
SRV
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT
MON
OUT
IN

OBU1

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists the
type and usage of the optical interfaces.

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Table 11-32 Optical interfaces of the OBU1

Interface Interface Usage

Type

IN LC Inputs multiplexed signals to be amplified.

OUT LC Outputs the amplified multiplexed signals.

MON LC Connects to the test instrument to monitor the in-

service performance.

11.9.5 Valid Slots

The OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of
slots 11–13 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature Code

The feature code of the OBU1 contains six characters and indicates the gain and maximum
nominal input optical power of the optical signals.

Table 11-33 lists the details on the board feature code.

Table 11-33 Feature code of the OBU1

Barcode Indication Description

First character – Fixed as G

Next two (2–3) characters Gain Gain

Fourth character – Fixed as I

Last two (5–6) characters Maximum nominal input Maximum nominal input
optical power optical power

For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that the
gain is 23 dB and the maximum nominal input optical power is –3 dBm.

11.9.7 Technical Specifications

The technical specifications of the OBU1 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-34 lists the specifications of the optical interfaces of the OBU1.

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Table 11-34 Specifications of optical interfaces of the OBU1

Item Specification

OBU1C01 OBU1C02

Working wavelength range (nm) 1529 to 1561 1529 to 1561

Range of input optical power –32 to –4 –32 to –3

(dBm)

Range of output optical power –12 to 16 –9 to 20

(dBm)

Input power (dBm) of a typical –20 –19

single wavelength

Maximum nominal output optical 0 4

power (dBm) of a single
wavelength

Path gain (dB) 20±1.5 23±1.5

Noise figure (dB) ≤ 5.5 ≤ 6.0

Gain flatness (dB) ≤ 2.0 ≤ 2.0

Pre-incline of the gain spectral 0±0.2 1.0±0.2

form

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power
of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.3

Power Consumption
l The power consumption of OBU101:
– In the normal temperature (25℃), the maximum power consumption of the OBU1 is
16 W.
– In the high temperature (55℃), the maximum power consumption of the OBU1 is 17.6
W.
l The power consumption of OBU102:
– In the normal temperature (25℃), the maximum power consumption of the OBU1 is
18 W.
– In the high temperature (55℃), the maximum power consumption of the OBU1 is 19.8
W.

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11 WDM Processing Boards Hardware Description

11.10 FIB
This section describes the FIB, a wavelength filter and isolation board, in terms of the version,
function, principle, front panel, configuration and specifications.

11.10.1 Version Description

The functional version of the FIB board is N1.
11.10.2 Function and Feature
The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.
11.10.3 Working Principle and Signal Flow
The FIB consists of an isolator and a filter.
11.10.4 Front Panel
On the front panel of the FIB, there are two pairs of optical interfaces.
11.10.5 Valid Slots
The FIB can be housed in any of slots 12–13 in the subrack.
11.10.6 Technical Specifications
The technical specifications of the FIB cover the optical interface specifications, board
dimensions, weight and power consumption.

11.10.1 Version Description

The functional version of the FIB board is N1.

11.10.2 Function and Feature

The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.
The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, a
single-wavelength long distance board, the FIB can realize long-distance optical regeneration
transmission. Figure 11-25 shows the position of the FIB in an optical transmission system.

Figure 11-25 Location of the FIB in the optical transmission system.

C (single span)

FIB
a(54dB) b(18dB)

BA17 à Filter Optical receiver

Single span Erbium doped ROP ISO
G.652 G.652 1550.12

Table 11-35 lists the functions and features of the FIB.

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Table 11-35 Functions and features of the FIB

Function and FIB
Feature

Optical isolator The isolator lets optical signals pass in a unidirectional manner. The
working wavelength ranges from 1529 nm to 1561 nm.

Optical filter The filter filters all signals carried in wavelengths except those in the
1550.12 nm wavelength.

11.10.3 Working Principle and Signal Flow

The FIB consists of an isolator and a filter.
Figure 11-26 shows the block diagram for the functions of the FIB.

Figure 11-26 Block diagram for the working principle of the FIB

Isolator Filter

After travelling for a long distance in fibers, optical signals are heavily attenuated and then
degraded. The degraded signals cannot be normally received by optical receiver. In this case,
the ROP should be used to amplify the gain of the optical signals. The ROP has high optical
power. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths.
The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters all
signals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way,
the optical receiver can normally receive optical signals.

11.10.4 Front Panel

On the front panel of the FIB, there are two pairs of optical interfaces.

Appearance of the Front Panel

Figure 11-27 shows the appearance of the front panel of the FIB.

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Figure 11-27 Front panel of the FIB

FIB

CLASS1
LASER
PRODUCT
OUT
IN

FIB

Interfaces
On the front panel of the FIB, there are a LC optical interface and a LSH optical interface, which
are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfaces use
pluggable optical modules for easy maintenance.

Table 11-36 Optical interfaces of the FIB

Interface Interface Usage
Type

IN LSH Receive 1-channel 2.5 Gbit/s optical signals.

OUT LC Transmit 1-channel 2.5 Gbit/s optical signals.

11.10.5 Valid Slots

The FIB can be housed in any of slots 12–13 in the subrack.

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11.10.6 Technical Specifications

The technical specifications of the FIB cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 11-37 lists the specifications of the optical interfaces of the FIB.

Table 11-37 Specifications of the optical interfaces of the FIB

Item Specification

Nominal bit rate 2488320 kbit/s

Line code NRZ

Central wavelength 1550.12±0.05

(nm)

–0.5 dB bandwidth > 0.4

(nm)

Mechanical Specifications
The mechanical specifications of the FIB are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.4

Power Consumption
The FIB does not consume power.

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Hardware Description Boards

12 Optical Amplifier Boards and

Dispersion Compensation Boards

About This Chapter

This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and the
dispersion compensation boards, such as the DCU.

12.1 BA2
This section describes the BA2, 2-channel optical booster amplifier board, in terms of the
version, function, working principle, front panel and specifications.
12.2 BPA
This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in
terms of the version, function, principle, front panel and specifications.
12.3 COA
This section describes the COA, a case-shaped optical amplifier, in terms of the version, function,
principle, front panel, installation position and specifications.

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Boards Hardware Description

12.1 BA2
This section describes the BA2, 2-channel optical booster amplifier board, in terms of the
version, function, working principle, front panel and specifications.

12.1.1 Version Description

The functional version of the BA2 board is N1.
12.1.2 Function and Feature
During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
should be used, and thus the optical receiver can normally receive optical signals.
12.1.3 Working Principle and Signal Flow
The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
12.1.4 Front Panel
On the front panel of the BA2, there are indicators and interfaces.
12.1.5 Valid Slots
The BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.
12.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the BA2 indicates the output optical power of the optical interfaces.
12.1.7 Technical Specifications
The technical specifications of the BA2 cover the optical interface specifications, board
dimensions, weight and power consumption.

12.1.1 Version Description

The functional version of the BA2 board is N1.

12.1.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
should be used, and thus the optical receiver can normally receive optical signals.

Figure 12-1 shows the location of the BA in the optical transmission system.

Figure 12-1 Location of the BA in the optical transmission system

Transmit BA Receive

The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions and
features of the BA2.

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Table 12-1 Functions and features of the BA2

Function and BA2
Feature

Basic function Increases the launched optical power of the line board to 13–15 dBm
or 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275
dB/km is used, the transmission distance can be 120 km, 130 km, or
above.

EDFA Automatically controls the optical power and laser temperature of the
EDFA module.
Automatically monitors the input and output optical power of the EDFA
module and queries the optical power.
Protects the EDFA module. When no optical signals are input, the laser
is automatically turned off. When optical signals are input, the laser is
automatically turned on.

Performance and Reports the performance parameters of the laser. Provides rich alarms
alarm monitoring and performance events for easy management and maintenance of the
equipment.

Software upgrade Supports the software upgrade and expansion without interrupting
services.

NOTE

The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off if
no input signals are detected on the receive end of the line board. Thus, this function is used to prevent the
high laser power from damaging eyes.

12.1.3 Working Principle and Signal Flow

The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 12-2 shows the block diagram for the functions of the BA2.

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Boards Hardware Description

Figure 12-2 Block diagram for the functions of the BA2

EDFA module
Doped
erbium
Optical input fiber Optical output
Fiber Input WDM Output Filter Optical
distributor isolate coupler isolate splitter

Input Output
power power
monitor Laser pump monitor
(Pin1) (Pin2)

Pump
Input Pump Output
current Temperature
power current power
detect
Laser Pump
shutdown temperature
Manual control
control LOS in

AD/DA

Control&Generation alarms

Control module

Communication
Communication SCC unit
module

+3.3 V DC/DC
Fuse -48 V/ -60 V
converter
5V DC/DC module -48 V/ -60 V
converter
module Fuse
+3.3 V backup
power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When
the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central
wavelength is added to the optical output end of the module. A booster amplifier (BA) does not
have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the
erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the
erbium fiber through an optical coupler. The input and output optical signals of the module are
led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted
to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA
module are determined as per the optical signals. The module also applies optical isolating
measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l Detects and drives bump electricity
l Controls the pump temperature of laser
l Detects input and output power
l Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D
converting unit converts the temperature value of the cooling electricity and the input/output

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Hardware Description Boards

optical power from analog values to digital values. The converted values are then sent to CPU,
which generates performance reporting event or alarm. The A/D converting unit also converts
bump electricity from analog values to digital values. The converted values are then sent to CPU.
After the CPU processes the converted values, the D/A converting unit controls precisely the
driving analog circuit of the bump laser of the EDFA optical module. The internal temperature
of the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputs
temperature change to drive cooler to keep the internal temperature of the bump laser module
at 25℃.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. In
addition, this module provides protection to the board +3.3 V power supply.

12.1.4 Front Panel

On the front panel of the BA2, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-3 shows the appearance of the front panel of the single-interface BA2.

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Boards Hardware Description

Figure 12-3 Front panel of the single-interface BA2

BA2
STAT
ACT
PROG
SRV

OUT
IN

BA2

Figure 12-4 shows the appearance of the front panel of the double-interface BA2.

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Figure 12-4 Front panel of the double-interface BA2

BA2
STAT
ACT
PROG
SRV

OUT1 IN1
OUT2 IN2

BA2

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the single-interface BA2, there are a pair of optical interfaces, which
transmit and receive one channel of optical signals. A pluggable optical module is used for easy
maintenance.

On the front panel of the double-interface BA2, there are two pairs of optical interfaces, which
transmit and receive two channels of optical signals. Two pluggable optical modules are used
for easy maintenance.

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WARNING
In practical engineering, if two LC optical interfaces are available on the front panel of the single-
interface BA2, only one optical interface (IN1/OUT1) is available. In the case of the BA2 with
two LC optical interfaces on the front panel, determine whether the BA2 is a single-interface
BA2 or a double-interface BA2 according to 12.1.6 Board Feature Code.

Table 12-2 lists the type and usage of the single-interface BA2.

Table 12-2 Optical interfaces of the single-interface BA2

Interface Interface Usage
Type

IN LC Receives the first channel of optical signals.

OUT LC Transmits the first channel of optical signals.

Table 12-3 lists the type and usage of the double-interface BA2.

Table 12-3 Optical interfaces of the double-interface BA2

Interface Interface Usage
Type

IN1 LC Receives the first channel of optical signals.

OUT1 LC Transmits the first channel of optical signals.

IN2 LC Receives the second channel of optical signals.

OUT2 LC Transmits the second channel of optical signals.

12.1.5 Valid Slots

The BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the BA2 indicates the output optical power of the optical interfaces.
Table 12-4 lists the relation between the board feature code and the output optical power.

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Table 12-4 Relation between the board feature code and output optical power for the BA2
Board Barcode Feature Code Output Optical Power

SSN1BA201 01 14 dBm for dual-channel

optical power amplification

SSN1BA202 02 17 dBm for dual-channel

optical power amplification

SSN1BA203 03 14 dBm for optical power

amplification

SSN1BA204 04 17 dBm for optical power

amplification

SSN1BA205 05 14 or 17 dBm for dual-channel

optical power amplification

12.1.7 Technical Specifications

The technical specifications of the BA2 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-5 lists the specifications of the optical interfaces of the BA2.

Table 12-5 Specifications of the optical interfaces of the BA2

Item Specification

Nominal bit rate 2488320 kbit/s and 9953280 kbit/s

Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code NRZ

Input wavelength (nm) BA: 1530 to 1565

Range of input optical BA: –6 to +3

power (dBm)

Output optical power BA: 13 to 15 or 15 to 17

(dBm)

Noise figure (dB) BA: < 6.5

Mechanical Specifications
The mechanical specifications of the BA2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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Boards Hardware Description

l Weight (kg): 1.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the BA2 is 20 W.

12.2 BPA
This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in
terms of the version, function, principle, front panel and specifications.

12.2.1 Version Description

The BPA board has two versions, N1 and N2. The difference between the two versions lies in
the components of the EDFA optical module.
12.2.2 Function and Feature
During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
and PA should be used, and thus the optical receiver can normally receive optical signals.
12.2.3 Working Principle and Signal Flow
The BPA consists of the EDFA module, control module, communication module, and DC/DC
converter module.
12.2.4 Front Panel
On the front panel of the BPA, there are indicators and interfaces.
12.2.5 Valid Slots
The BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.
12.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the BPA indicates the output optical power of the optical interfaces.
12.2.7 Technical Specifications
The technical specifications for the BPA cover the optical interface specifications, board
dimensions, weight and power consumption.

12.2.1 Version Description

The BPA board has two versions, N1 and N2. The difference between the two versions lies in
the components of the EDFA optical module.

Table 12-6 lists the version description of the BPA board.

Table 12-6 Version description of the BPA board

Item Description

Functional Version The BPA board has two functional versions, N1 and N2.

Difference The N1BPA board consists of two EDFA optical modules, but
the N2BPA board consists of one EDFA optical module only.

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Item Description

Replaceability The two versions can fully replace each other. If the ALS
function is used, the N2BPA board is used to replace the
N1BPA board. In this case, the ALS function needs to be
enabled on the BPA board. If the N1BPA board is used to
replace the N2BPA board, the ALS function needs to be enabled
on the line board. If the ALS function is disabled, this restriction
is not required.

12.2.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
and PA should be used, and thus the optical receiver can normally receive optical signals.
Figure 12-5 shows the location of the BA and PA in the optical transmission system.

Figure 12-5 Location of the BA and PA in the optical transmission system

Transmit BA Receive

Transmit PA Receive

Table 12-7 lists the functions and features of the BPA.

Table 12-7 Functions and features of the BPA

Function and BPA
Feature

Basic function Increases the launched optical power of the line board to 13–15 dBm
or 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275
dB/km is used, the transmission distance can be 120 km, 130 km, or
above.

Function of the PA Provides the PA module to preamplify the received optical signals.
Increases the power of the small volume of optical signals by 22–25
dB(N1BPA), 22dB–33dB(N2BPA), and thus enhances the sensitivity
of the receiver to –37 dBm.

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Boards Hardware Description

Function and BPA

Feature

EDFA l Automatically controls the optical power and laser temperature of

the EDFA module.
l Automatically monitors the input and output optical power of the
EDFA module and queries the optical power.
l Protects the EDFA module. When no optical signals are input, the
laser is automatically turned off. When optical signals are input, the
laser is automatically turned on.

Performance and Reports the performance parameters of the laser. Provides rich alarms
alarm monitoringa and performance events for easy management and maintenance of the
equipment.

Software upgrade Supports the software upgrade and expansion without interrupting
services.

a: The BPA does not support the alarm in the test state and the query of the power supply
voltage.

12.2.3 Working Principle and Signal Flow

The BPA consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 12-6 shows the block diagram for the functions of the N1BPA.

Figure 12-6 Block diagram for the working principle of the N1BPA
Optical input Optical output Optical input Optical output

EDFA optical module Optical

part

Module Input/output Pump Module Input/output Driving

Pump current Drive Drive
temperature power current temperature power and
check module module
control check check control check detecting
part

A/D or D/A conversion

Data processing and

Communication Control communication part
SCC module module

Figure 12-7 shows the block diagram for the functions of the N2BPA board.

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Figure 12-7 Block diagram for the working principle of the N2BPA
Optical input Optical output Optical input Optical output

EDFA optical module 1 EDFA optical module 2 Optical

part

Output
power
Module Input/output Pump Module Input check Driving
Pump current Drive Drive
temperature power current temperature power and
check module module
control check check control check detecting
Fixed filter part

A/D or D/A conversion

Data processing and

Communication Control communication part
SCC module module

Optical Part
The N1BPA board consists of two EDFA optical modules, but the N2BPA board consists of one
EDFA optical module only. The EDFA optical module magnifies the optical power.

Driving and Detecting Part

The driving and detecting part provides the driving current for the EDFA optical module. It also
checks the working state of each part in the EDFA optical module. Moreover, it predicts and
handles the possible faults.
In addition, it implements these functions such as checking the pumping current, driving the
optical module, controlling the temperature of the optical module, and checking the input and
output optical power.

Data Processing and Communication Part

The data processing and communication part consists of central processing unit (CPU) and
peripheral chip. It analyzes the test result of the tested circuit. Then it adjusts the driving circuit
based on the analysis result so that the gain or output optical power of the EDFA module keeps
in the range of the rated value. It also sorts the abnormal states represented by the measured
values and reports these abnormal states to the T2000.

12.2.4 Front Panel

On the front panel of the BPA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-8 shows the appearance of the front panel of the BPA.

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Figure 12-8 Front panel of the BPA

BPA
STAT
ACT
PROG
SRV

BOUT BIN
POUT
PIN

BPA

Indicators
The following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the BPA, there are two pairs of LC optical interfaces.Table 12-8 lists the
type and usage of these optical interfaces.

Table 12-8 Optical interfaces of the BPA

Interface Interface Type Usage

BIN LC Receives one channel of optical signals for

amplification.

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Interface Interface Type Usage

BOUT LC Transmits one channel of amplified optical signals.

PIN LC Receives one channel of optical signals for pre-

amplification.

POUT LC Transmits one channel of pre-amplified optical

signals.

12.2.5 Valid Slots

The BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots
11–13 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the BPA indicates the output optical power of the optical interfaces.
Table 12-9 lists the relation between the board feature code and the output optical power.

Table 12-9 Relation between the board feature code and output optical power of the BPA
Board Barcode Feature Code Description

SSN1BPA01, 01 Receiver sensitivity of the PA module: –

SSN2BPA01 37 dBm
Output optical power of the BA module:
14 dBm

SSN1BPA02 02 Receiver sensitivity of the PA module: –

37 dBm
Output optical power of the BA module:
17 dBm

12.2.7 Technical Specifications

The technical specifications for the BPA cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-10 lists the specifications for the optical interfaces of the BPA.

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Table 12-10 Specifications for the optical interfaces of the BPA

Item Specification

Nominal bit rate 2488320 kbit/s and 9953280 kbit/s

Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code NRZ

Input wavelength (nm) BA: 1530 to 1565

PA: 1550.12

Range of input optical BA: –6 to +3

power (dBm) PA：–28 to –10 (working with the 10G line board)
PA：–38 to–10 (woking with the line board of less than 10G)

Output optical power N1BPA：+13 to +15 or +15 to +17 (BA)

(dBm) N2BPA：+13 to +15 (BA)

Sensitivity (dBm) PA: –37

Noise figure (dB) BA: < 6.5

PA: < 6

NOTE

When performing loopback to the PA module of the BPA, prevent the damage caused by high input optical
power to the optical module.

Mechanical Specifications
The mechanical specifications for the BPA are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):
– N1BPA: 1.0kg
– N2BPA: 1.2kg

Power Consumption
At the normal temperature (25℃), the maximum power consumption of the BPA is as follows:
l N1BPA: 20W
l N2BPA: 11W

12.3 COA
This section describes the COA, a case-shaped optical amplifier, in terms of the version, function,
principle, front panel, installation position and specifications.

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12.3.1 Version Description

The COA has three versions, 61, 62 and N1.
12.3.2 Function and Feature
The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an
aluminium case.
12.3.3 Working Principle and Signal Flow
The 61COA and N1COA consist of the EDFA module, control module, communication module,
and DC/DC converter module.
12.3.4 Front Panel
On the front panel of the COA, there are indicators and interfaces.
12.3.5 Installation Position
The COA is case-shaped, and thus it is does not occupy a slot in the subrack.
12.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the 61COA indicates the output optical power of the optical interfaces.
12.3.7 Technical Specifications
The technical specifications of the COA cover the dimensions, weight and power consumption.

12.3.1 Version Description

The COA has three versions, 61, 62 and N1.
The 62COA, 61COA and N1COA share the working principle. The difference among them lies
in the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module.
The 61COA and N1COA use the EDFA optical amplifier module.
Table 12-11 lists the details on the versions of the COA.

Table 12-11 Version Description of the COA

Item Description

Functional The COA has three versions, 61, 62, and N1.
version

Difference The 61COA is the EDFA optical amplifier in the 1550-nm fiber
communication window.
The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nm
fiber communication window.
The N1COA does not have the filter and is a multi-wavelength amplifier.
The 62COA uses the Raman optical amplifier module.

Replaceability The versions cannot be replaced by each other.

12.3.2 Function and Feature

The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an
aluminium case.

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The COA is an external and independent amplifier, which does not occupy a slot and can work
independently. The maximum numbers of the 61COA, N1COA, and 62COA that can be
configured in a system are two, two, and one respectively.

61COA and N1COA

The 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFA
optical module and be used as the BA, PA, or LA. Figure 12-9 shows the appearance of the
61COA and N1COA.

The optical features of the 61COA are the same as those of the BPA and BA2. The main
difference is that the 61COA and N1COA are external optical amplifier units, which are directly
installed in the ETSI cabinetwithout occupying slots in the subrack and are independently
powered.

Figure 12-9 Appearance of the case-shaped 61COA and N1COA (PA)

The application of the 61COA and N1COA in the optical transmission system is the same as
that of the BA2 and BPA. Table 12-12 lists the functions and features of the 61COA and N1COA.

Table 12-12 Functions and features of the 61COA and N1COA

Function and 61COA and N1COA

Feature

Function of the BA The 61COA enhances the launched optical power to 13–15 dBm or
15–17 dBm, and thus the valid transmission distance of optical
signals can be extended.

Function of the PA The N1COA is a PA, with a receiver sensitivity of –38 dBm.

Automatic laser shut- Supports the ALS function.

down

Function of the serial Communicates with the CXL through the RS232 serial port, reports
communication the alarms and performance events from the COA to the T2000, and
receives the configuration commands issued by the T2000.

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62COA
The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDH
equipment.
The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Raman
amplification. Different from that of the 61COA, the gain medium of Raman amplification is
the line fiber that can realize better noise performance. Thus, the 62COA can extend the
transmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission for
a single span.
Figure 12-10 lists the appearance of the 62COA.

Figure 12-10 Appearance of the case-shaped 62COA

4

1
2
3

1. Captive screw 2. Ejector lever 3. COA board

4. ESD jack 5. Power access board

The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmission
system. During the transmission, the 62COA amplifies optical signals based on the stimulated
Raman scattering of the fiber. The 62COA provides optical transmission for more than 170 km,
when used with the EDFA. See Figure 12-11.

Figure 12-11 Application of the optical Raman amplifier (62COA)

Raman Amplifier
Signal light
Optical
EDFA Pump light receiver
Pump light
Fiber Laser

Transmitting end Coupler Receiving end

During the optical transmission, the Raman amplifier amplifies optical signals by inputing
counter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus,
the phase of optical signals is significantly different from that of pumping signals. The power

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Boards Hardware Description

fluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise caused
by the pumping can be effectively suppressed.
Table 12-13 lists the functions and features of the 62COA.

Table 12-13 Functions and features of the 62COA

Function and 62COA
Feature

Basic function Configured at the receive end of the SDH system, and provides extra
long-haul transmission (more than 170 km), when used with an
EDFA at the transmit end with an output power of 17 dBm.

Function of the PA The 62COA is a PA, with a receiver sensitivity of -39 dBm.

Automatic laser shut- Supports the ALS function.

down

Function of the serial Communicates with the CXL through the RS232 serial port, reports
communication the alarms and performance events from the COA to the T2000, and
receives the configuration commands issued by the T2000.

12.3.3 Working Principle and Signal Flow

The 61COA and N1COA consist of the EDFA module, control module, communication module,
and DC/DC converter module.
The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filter
unit but the N1COA does not.
Figure 12-12 shows the block diagram for the functions of the 61COA and N1COA.

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Figure 12-12 Block diagram for the functions of the 61COA and N1COA
EDFA module
Doped
erbium
Optical input fiber Optical output
Fiber Input WDM Output Filter Optical
distributor isolate coupler isolate splitter

Input Output
power power
monitor Laser pump monitor
(Pin1) (Pin2)

Pump
Input Pump Output
current Temperature
power current power
detect
Laser Pump
shutdown temperature
Manual control
control LOS in

AD/DA

Control&Generation alarms

Control module

Communication
Communication SCC unit
module

+3.3 V DC/DC
Fuse -48 V/ -60 V
converter
5V DC/DC module -48 V/ -60 V
converter
module Fuse
+3.3 V backup
power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When
the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central
wavelength is added to the optical output end of the module. A booster amplifier (BA) does not
have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the
erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the
erbium fiber through an optical coupler. The input and output optical signals of the module are
led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted
to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA
module are determined as per the optical signals. The module also applies optical isolating
measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l Detects and drives bump electricity
l Controls the pump temperature of laser
l Detects input and output power
l Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D
converting unit converts the temperature value of the cooling electricity and the input/output

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optical power from analog values to digital values. The converted values are then sent to CPU,
which generates performance reporting event or alarm. The A/D converting unit also converts
bump electricity from analog values to digital values. The converted values are then sent to CPU.
After the CPU processes the converted values, the D/A converting unit controls precisely the
driving analog circuit of the bump laser of the EDFA optical module. The internal temperature
of the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputs
temperature change to drive cooler to keep the internal temperature of the bump laser module
at 25℃.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. In
addition, this module provides protection to the board +3.3 V power supply.

12.3.4 Front Panel

On the front panel of the COA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-13 shows the appearance of the front panels of the 61COA and N1COA.

Figure 12-13 Front panel of the 61COA and N1COA

8 9 10

1 2 3 4 5 6 7 11

1. ID DIP switch 2. Running indicator 3. Alarm indicator 4. RS232-1

5. RS232-2 6. MONITOR-1 7. MONITOR-2 8. IN optical port
9. OUT optical port 10. Power switch 11. –48 V power interface

Figure 12-14 shows the appearance of the front panel of the 62COA.

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Figure 12-14 Front panel of the 62COA

1. SC/PC optical interface 2. LSH optical interface 3. Air filter

4. Fan board 5. RJ-45 6. RS232-1
7. RS232 -2 8. DIP switch (8–5 bits) 9. DIP switch (4–1 bits)
10. Power input interface 11. Power switch

Indicators
The following indicators are present on the front panel of the board:
l Board running state (RUN), which is green when lit.
l Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces,
which are used to input or output one channel of optical signals. The input optical interface of
the 62COA is connected to the LSH flange and the output optical interface is connected to the
SC flange. Figure 12-15 shows the SC/PC optical interfaces of the 61COA and N1COA.

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Figure 12-15 SC/PC fiber connector

Figure 12-16 shows the flange and fiber connector used at the input optical interface of the
62COA.

Figure 12-16 LSH flange and fiber connector

NOTE

The dust cap is specially designed for the LSH fiber jumper. Do not remove the cap during fiber connection.
For normal fiber connection, directly insert the fiber jumper into the LSH flange.

The COA has two RS232 serial interfaces, which are connected to the SCC unit for reporting
of alarms and performance events.
Table 12-14 lists the pins of the RS232 interface.

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Table 12-14 Pins of the RS232 interface

Front View RS232-1 RS232-2 Definition

2 2 Pin for receiving

data

3 3 Pin for
9

transmitting data

1
5 5 Pin for common
grounding

TIP

For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interface
through the serial control cable.

The RS232-2 interface is used in the case of several COA on one NE.
Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to the
RS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COA
numbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2
interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 to
communicate with the SCC unit in the subrack.
The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces are
the alarm output interfaces when the 61COA is used separately. The two interfaces are the same.
Table 12-15 lists the pins of the MONITOR-1 and MONITOR-2 interfaces.

Table 12-15 Pins of the MONITOR-1 and MONITOR-2 interfaces

Front View MONITOR- MONITOR-2 Definition
1

1, 6 1, 6 The input optical power of the

EDFA module is too low.

2, 7 2, 7 The working current of the pump

9

laser of the EDFA module crosses

1

the threshold.

3, 8 3, 8 The cooling current of the pump

laser of the EDFA module crosses
the threshold.

4, 9 4, 9 The ambient temperature of the

EDFA crosses the threshold.

5 5 Digital ground.

The 62COA has one RJ-45 connector, through which the 62COA is connected to the computer
for software loading. Table 12-16 lists the pins of the RJ-45 connector of the 62COA.

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Table 12-16 Pins of the RJ-45 connector of the 62COA

Front View Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Not defined
8 7 6 5 4 3 2 1
5 Not defined

6 Receiving negative

7–8 Not defined

The COA has a DIP switch.

l The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set the
ID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside,
it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA.
l The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. The
DIP switch has eight bits, from the left to right. The most left one is 8 and the most right
one is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, it
means 1. The first four bits (1–4) are used to set the board ID, which ranges from 20 to 35
and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turned
as 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is of
the G.655 type.

12.3.5 Installation Position

The COA is case-shaped, and thus it is does not occupy a slot in the subrack.
In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA is
installed directly in the cabinet with the mounting ears. On the T2000, the logical slots of the
61COA, N1COA, and 62COA are slots 101–102.

Installation of the 61COA or N1COA

The installation of the 61COA is taken as an example. The bracket with guide rails is fixed on
the crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guide
rails and then fixed. One bracket can house two 61COA horizontally. The front panel of the
61COA is at the front side of the cabinet. Figure 12-17 shows the installation of the 61COA.

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Figure 12-17 Position of the 61COA in the ETSI cabinet

Installation of the 62COA

The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mounting
ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottom
of the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied,
the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet which
is not fully configured.

12.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the 61COA indicates the output optical power of the optical interfaces.
Table 12-17 lists the relation between the board feature code and the output optical power.

Table 12-17 Relation between the board feature code and output optical power for the 61COA
Board Barcode Feature Code Output Optical Power

SS61COA01 01 14 dBm

SS61COA02 02 17 dBm

12.3.7 Technical Specifications

The technical specifications of the COA cover the dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-18 lists the specifications of the optical interfaces of the COA.

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Table 12-18 Specifications of the optical interfaces of the COA

Item Specification

61COA N1COA 62COA

Line code NRZ

Working wavelength 1550 1550.12

(nm)

Range of input optical BA: -6 to +3 -10 to -37 –39 to –20 (2.5 Gbit/s signals
power (dBm) PA: -10 to -37 without FEC)

Output optical power +13 to +15 +15 to +17 NA

(dBm)

Pump wavelength NA 1451.2

(nm)

Max. on/off gain (dB) NA > 15 (for the G.652 fiber)

Noise figure (dB) NA < –1.5

Mechanical Specifications
The mechanical specifications of the 61COA and N1COA are as follows:
l Board dimensions (mm): 50 (H) x 190 (D) x 240 (W)
l Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:

l Board dimensions (mm): 86 (H) x 436 (D) x 294 (W)
l Weight (kg): 8.0

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the 61COA and N1COA
is 10 W.
In the normal temperature (25℃), the maximum power consumption of the 62COA is 75 W.

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Hardware Description 13 Power Interface Boards

13 Power Interface Boards

About This Chapter

This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA.

13.1 UPM
This section describes the UPM, an uninterruptable power module, in terms of the version,
function, principle, front panel and specifications.
13.2 PIU
This section describes the PIU, a power interface unit, in terms of the version, function, principle,
front panel, configuration and specifications.
13.3 PIUA
This section describes the PIUA, a power interface unit, in terms of the version, function,
principle, front panel, configuration and specifications.

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13 Power Interface Boards Hardware Description

13.1 UPM
This section describes the UPM, an uninterruptable power module, in terms of the version,
function, principle, front panel and specifications.

13.1.1 Version Description

None
13.1.2 Function and Feature
The UPM, a special power supply system, is coded GIE4805S.
13.1.3 Working Principle and Signal Flow
The UPM receives power from one channel of 220 V AC mains supply, which is rectified to –
48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC
power supplies and one channel of battery power supply.
13.1.4 Rear Panel
On the rear panel of UPM, there are indicators and interfaces of many types.
13.1.5 Valid Slots
The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the
logical slot of the UPM is slot 50.
13.1.6 Technical Specifications
The technical specifications of the UPM cover dimensions and weight.

13.1.1 Version Description

None

13.1.2 Function and Feature

The UPM, a special power supply system, is coded GIE4805S.
The UPM directly converts the 110 V or 220 V AC mains to the –48 DC communication voltage.
As a result, the requirements of telecommunication carriers who cannot provide the –48 DC
power to communication equipment or who require the usage of the storage battery can be met.
The UPM consists of the power supply case (110 V or 220 V to –48 V) and storage battery. The
output power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supply
case with a height of 1U. The power supply case of the UPM can be directly installed in a 19-
inch or ETSI cabinet.

Figure 13-1 Appearance of the power supply case

5S
80
E4
GI

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NOTE

One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage and
maintain the UPM.

The storage battery of the UPM is used with the power supply case. If the external AC current
normally charges the storage battery, the storage battery can provide power for four hours when
the external 110 V or 220 V AC current is interrupted. When the UPM provides power supply
for the OptiX OSN equipment, only one power supply case should be connected to the storage
battery group.
The OptiX OSN equipment requires two power supply cases and one storage battery group
composed of four 12 V –40 Ah storage batteries. If the equipment does not require the storage
battery, only configure one power supply case. The standard full configuration for each power
supply case requires two rectifier modules and one monitoring module.
Table 13-1 lists the functions and features of the UPM.

Table 13-1 Functions and features of the UPM

Item UPM

Two-channel hot The converting portion of the UPM has the hot backup function of
backup two-channel AC/DC rectifier modules. In addition, the two rectifier
modules with the function of load balance can work at the same. If
one rectifier module fails, the other one immediately takes over the
entire load. As a result, the working equipment is not affected, and
the system stability is enhanced.

Hot swap function In the UPM power supply system, the AC/DC rectifier modules have
the hot swap function. When the faulty rectifier module is removed,
the other rectifier module is not affected. Thus, the system
maintainability is enhanced.

Protection function The UPM can protect the storage battery. When the mains supply is
for the storage interrupted, the power supply system can automatically switch to the
battery storage battery. Thus, the normal running of equipment is not
affected. The capacity of the storage battery module is 40 Ah.

Function of The UPM integrates the monitoring module and T2000 monitoring
monitoring module. The monitoring module monitors and controls the
parameters and states of the rectifier module, AC/DC power
distribution, and storage battery group in real time, and then reports
the parameters and states to the T2000. The storage battery
automaticallly realizes the floating charging and current limiting
management.

Band loading The band loading capacity of each rectifier module is 270 W.
capacity

13.1.3 Working Principle and Signal Flow

The UPM receives power from one channel of 220 V AC mains supply, which is rectified to –
48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC
power supplies and one channel of battery power supply.

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When the UPM works normally, the monitoring module controls the rectifier module, battery
loop circuit and loading loop circuit, which then work according to the preset parameters and
user settings. The monitoring module also monitors their status and data.

When the mains power supply goes faulty, the battery power supply system supplies power to
the equipment. Before the mains power supply goes faulty, the battery power supply system
must be present. When the mains power supply fails and the battery starts discharging, the
monitoring module reports the alarms indicating the fault of the mains power supply. As the
battery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V,
the monitoring module reports the alarm indicating the undervoltage. When the battery voltage
decreases to 43 V, the battery cuts off the connection to the equipment and protects itself.

When the mains power supply recovers, the UPM works normally.

13.1.4 Rear Panel

On the rear panel of UPM, there are indicators and interfaces of many types.

Appearance of the Front Panel

Figure 13-2 shows the rear view of the UPM (subject to the UPM on site ).

Figure 13-2 Rear view of the UPM

4
BAT
! CAUTION
BAT- DO NOT INVERT POLARITY
注意极性 防止反接
BAT+

48V+

48V-

LOAD1 LOAD2

5 6

AC100~240 RUN ALM

ALM Vout ALM Vout

RS232

1 2 3

1. AC input 2. Rectifier module/air outlet 3. Communication interface 4. Battery interface

5. Load 6. Load

Indicators
The following indicators are for the rectifier module on the left of the UPM.

l Rectifier module fault indicator (ALM), which is red when lit.

l Rectifier module output state indicator (Vout), which is green when lit.

The following indicators are for the monitoring module on the top panel of the UPM.

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l Power supply system fault indicator (ALM), which is red when lit.
l Power supply system indicator (RUN), which is green when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage of
these interfaces.

Table 13-2 Interfaces on the rear panel of the UPM

Interface Interface Type Usage

AC100–240 Power interface Acts as a socket for the AC mains supply and
accesses 110 V or 220 V AC power supply.

Red switch button Button Locates on the right of the panel of the rectifier
module. Press the switch button to enable or
disable the functioning of the rectifier module.

RS232 RS232 The power supply system can connect to the

communication SCC of the OptiX OSN equipment through this
interface interface to realize the functions such as the
alarm reporting and remote control. Connect the
RS232 serial interface of one power box to the
F&f interface of the OptiX OSN equipment. The
T2000 then can monitor the battery and the
power box. Connect the RS232 interface of the
other power box to the ALM1 interface of the
OptiX OSN equipment. The T2000 then can
monitor the other power box.

Power output Power interface Three power output interfaces are on the most
interface right of the power box. The top interface is a
battery interface, which can be connected to the
socket on the battery by using battery cables.
The bottom two are loading interfaces, which
can be connected to the OptiX OSN equipment
and supply power to the equipment.

Table 13-3 lists the pins of the RS232 interface.

Table 13-3 Pins of the RS232 interface of the UPM

Item Pin Usage or on/off State

Pin for receiving data 2 Receives data.

Pin for transmitting data 3 Transmits data.

Pin for common grounding 5 Grounds.

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Item Pin Usage or on/off State

Pins for alarms indicating 8–9 On

faults of the rectifier
module

Pins for normal state of the 8–9 Off

rectifier module

Pins for alarms indicating 8–7 On

the off state of the AC
power supply

Pins for the normal state of 8–7 Off

the AC power supply

Pins for the alarm 8–6 On

indicating undervoltage
discharged from the battery

Pins for the alarm 8–6 Off

indicating no discharge
from the battery

13.1.5 Valid Slots

The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the
logical slot of the UPM is slot 50.

13.1.6 Technical Specifications

The technical specifications of the UPM cover dimensions and weight.

Specifications of the power supply

Table 13-4 lists the specifications of the power supply of the UPM.

Table 13-4 Specifications of the power supply of the UPM

Item Specification

Input AC voltage range 90–264 V AC

AC input One channel of monophase three-wire AC power: 47 Hz–

63 Hz

Rated input current ≤ 3.5 A

Nominal output voltage 54.0±0.5 V

Rated output current 8 A (Two loading outputs, each of which has the loading
voltage not more than 5 A)

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Item Specification

Number of backup battery groups 1 (40 Ah)

Charging current of the backup ≤3A

battery

Fuse of the backup battery 10 A

Undervoltage DC point of the 46±0.5 V

battery

Termination voltage point of the 43.5±0.5V

battery

Floating charge voltage of the -54.0±0.5 V

battery

Regulated voltage precision ≤ ±1%

Non-balance of load sharing ≤ ±5% (50%–100% loading)

Rated efficiency of the integrated ≥ 80%

device

Peak stray noise voltage ≤ 200 mV

Voltage drop in the power panel ≤ 500 mV

(20℃)

Electrical network adjustment ≤ ±0.1%

rate

Mechanical Specifications
The mechanical specifications of the UPM are as follows:

l Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W)

l Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)

13.2 PIU
This section describes the PIU, a power interface unit, in terms of the version, function, principle,
front panel, configuration and specifications.

The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not.
13.2.1 Version Description
The functional version of the PIU is R1.
13.2.2 Function and Feature
The PIU is used to access the power supply, and to provide the lightning protection and filtering.
13.2.3 Working Principle and Signal Flow

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The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting
unit.
13.2.4 Front Panel
On the front panel of the PIU, there are indicators and power interfaces.
13.2.5 Valid Slots
The PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.
13.2.6 Technical Specifications
The technical specifications of the PIU cover the dimensions, weight, power consumption, input
voltage and fuse tube.

13.2.1 Version Description

The functional version of the PIU is R1.

13.2.2 Function and Feature

The PIU is used to access the power supply, and to provide the lightning protection and filtering.

Table 13-5 lists the functions and features of the PIU.

Table 13-5 Functions and features of the PIU

Function and PIU

Feature

Function of Provides the lightning protection, and reports the alarm indicating the
lightning protection failure of the lightning protection module.

Function of Enhances the electromagnetic compatibility of the system by filtering

filtering the power supply port and shielding the board.

Power supply Provides one 50 W power interface for external devices, such as the
interface COA.

Power supply of the Provides –48 V ± 20% voltage for the FAN.
FAN

Clock interface Provides 75-ohm clock input and output interfaces, and protects clock
signals.

Alarm monitoring Reports the board in-service alarm.

Power supply Supports the 1+1 hot backup. Any one PIU can provide power for the
backup entire subrack by itself.

13.2.3 Working Principle and Signal Flow

The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting
unit.

Figure 13-3 shows the block diagram for the functions of the PIU.

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Figure 13-3 Block diagram for the functions of the PIU

NEG(-)
NEG(-)
Protecting Filter
unit unit

RTN(+) RTN(+)

Power
detecting
unit

Clock input Clock Clock output

protecting
LED unit
indication

Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic
interference signals and thus to keep the equipment running in a stable manner.

Protecting Unit
This unit is used to prevent the equipment from overcurrent and lightning.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to
indicate the status of the input power supply.

Clock Protecting Unit

This unit is used to protect the input clock signals.

13.2.4 Front Panel

On the front panel of the PIU, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-4 shows the appearance of the front panel of the PIU.

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Figure 13-4 Front panel of the PIU

PIU

O
I

POWER
NEG(-)

PWR

PWS
RTN(+)
CLK OUT

CLK IN

PIU

Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when
lit..
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type and
usage of the interfaces.

Table 13-6 Interfaces on the front panel of the PIU

Interface Interface Usage
Type

PWR Power input Inputs the –48 V power supply.

interface

ClK IN SMB 75-ohm clock input interface (SMB)

ClK OUT SMB 75-ohm clock output interface (SMB)

13.2.5 Valid Slots

The PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.

13.2.6 Technical Specifications

The technical specifications of the PIU cover the dimensions, weight, power consumption, input
voltage and fuse tube.

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Mechanical Specifications
The mechanical specifications of the PIU are as follows:

l Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W)

l Weight (kg): 1.3

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PIU is 1.5 W.

Input Voltage
The input voltage of the PIU ranges from –38.4 V to –72 V.

Fuse Tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

13.3 PIUA
This section describes the PIUA, a power interface unit, in terms of the version, function,
principle, front panel, configuration and specifications.

The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not.
13.3.1 Version Description
The functional version of the PIUA is R1.
13.3.2 Function and Feature
The PIUA is used to access the power supply, and to provide the lightning protection and
filtering.
13.3.3 Working Principle and Signal Flow
The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting
unit, fan power supply unit and external power supply interface unit.
13.3.4 Front Panel
On the front panel of the PIUA, there are indicators and power interfaces.
13.3.5 Valid Slots
The PIUA can be housed in any of slots 1–11 in the subrack.
13.3.6 Technical Specifications
The technical specifications of the PIUA cover the dimensions, weight, power consumption,
input voltage and fuse tube.

13.3.1 Version Description

The functional version of the PIUA is R1.

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13.3.2 Function and Feature

The PIUA is used to access the power supply, and to provide the lightning protection and
filtering.

Table 13-7 lists the functions and features of the PIUA.

Table 13-7 Functions and features of the PIUA

Function and PIUA

Feature

Function of Provides the lightning protection, and reports the alarm indicating the
lightning protection failure of the lightning protection module.

Function of Enhances the electromagnetic compatibility of the system by filtering

filtering the power supply port and shielding the board.

Power supply Provides one 50 W power interface for external devices, such as the
interface COA.

Power supply of the Provides 48 V ± 20% voltage for the FAN.

FAN

Alarm monitoring Reports the board in-service alarm.

Power supply Supports the 1+1 hot backup. Any one PIU can provide power for the
backup entire subrack by itself.

13.3.3 Working Principle and Signal Flow

The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting
unit, fan power supply unit and external power supply interface unit.

Figure 13-5 shows the block diagram for the functions of the PIUA.

Figure 13-5 Block diagram for the functions of the PIUA

External
power supply
interface
NEG(-) Lightning NEG(-)
Filter
protection
RTN(+) module
module RTN(+)

Power Fan power

detection module

LED
indication

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Power Interface Unit

This unit accesses the –48 V or –60 V power supply for the system.

Protection Unit
This unit is used to prevent the equipment from overcurrent and lightning.

Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic
interference signals and thus to keep the equipment running in a stable manner.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to
indicate the status of the input power supply.

Fan Power Supply Unit

This unit is used to supply stable power to the fans.

External Power Supply Interface Unit

This unit supplies –48 V power to the external equipment, such as the COA. The interfaces are
present on the panel.

13.3.4 Front Panel

On the front panel of the PIUA, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-6 shows the appearance of the front panel of the PIUA.

Figure 13-6 Front panel of the PIUA

PIUA
POWER
PWS
I

ON

OFF
O
NEG(-)
RTN(+)

PIUA

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Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when
lit..

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists the
type and usage of the interfaces and switch.

Table 13-8 Interfaces and switch on the front panel of the PIUA

Interface Interface Type Usage

PWR Inputs the –48 V Inputs the –48 V power supply.

power supply.

PWS Output interface Outputs the 50 W power supply for the COA or HUB.
for the 50 W
power supply

Power switch Switch Turn the switch to position 1 or ON to supply power

to the equipment. Turn the switch to position 0 or OFF
to shut the power supply to the equipment.

13.3.5 Valid Slots

The PIUA can be housed in any of slots 1–11 in the subrack.

13.3.6 Technical Specifications

The technical specifications of the PIUA cover the dimensions, weight, power consumption,
input voltage and fuse tube.

Mechanical Specifications
The mechanical specifications of the PIUA are as follows:

l Board dimensions (mm): 111.8 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.5

Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PIUA is 3 W.

Input Voltage
The input voltage of the PIUA ranges from –38.4 V to –72 V.

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Fuse tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

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Hardware Description 14 Cables

14 Cables

About This Chapter

This chapter describes the cables used for the equipment. The cables include the fiber jumpers,
power cables, alarm cables, management cables, signal cables and clock cables.

14.1 Fiber Jumper

The following section describes the types of fiber jumpers and connectors.
14.2 Power Cables and Grounding Cables
The power cables and grounding cables include the cabinet power cable, equipment supply cable,
and UPM power cable.
14.3 Alarm Cable
The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,
alarm concatenation cable and alarm input/output cable.
14.4 Management Cable
The management cable includes the serial port cable, ordinary phone wire, COA concatenating
cable and network cable.
14.5 Signal Cable
The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal
cable. The OptiX OSN 1500A supports only the E1/E3 signal cable.
14.6 Clock Cable
The clock cable includes the clock cable and clock transfer cable.

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14 Cables Hardware Description

14.1 Fiber Jumper

The following section describes the types of fiber jumpers and connectors.

14.1.1 Types of Fiber Jumpers

The OptiX OSN equipment can use various types of fiber jumpers.
14.1.2 Connector
The OptiX OSN equipment can use various types of connectors.

14.1.1 Types of Fiber Jumpers

The OptiX OSN equipment can use various types of fiber jumpers.
Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment.

Table 14-1 Types of fiber jumpers

Usage Connector Connector Cable Length
1 2

Optical fiber that LC/PC FC/PC 2 mm SLM 6 m, 10 m, 20 m, 30 m,

connects the optical fiber 50 m
OptiX OSN
equipment to the 2 mm MLM 3 m, 5 m, 10 m, 20 m,
ODF or connects optical fiber 30 m, 50 m
the interface LC/PC SC/PC 2 mm SLM 5m, 10 m, 20 m, 30 m,
board of the optical fiber 50 m
OptiX OSN
equipment to the 2 mm MLM 10 m, 20 m, 30 m, 50
optical fiber of optical fiber m
other equipment
SC/PC SC/PC 2 mm SLM 2m, 5 m, 10 m, 20 m,
optical fiber 30 m, 50 m, 80 m

Optical fiber that LC/PC LC/PC 2 mm SLM 1.5 m, 3 m, 5 m, 10 m,

interconnects the optical fiber 20 m, 30 m
OptiX OSN
equipment 2 mm MLM 3 m, 5 m, 10 m, 20 m,
optical fiber 30 m

LC/PC FC/PC 2 mm SLM 6 m, 10 m, 20 m, 30 m,

optical fiber 50 m

LC/PC SC/PC 2 mm SLM 5m, 10 m, 20 m, 30 m,

optical fiber 50 m

Select the fiber connector and the fiber length according to the on-site survey.

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CAUTION
When selecting the fiber connector, make sure that the single-longitudinal mode or multi-
longitudinal mode optical transmitting module is connected to the single-mode fiber.

14.1.2 Connector
The OptiX OSN equipment can use various types of connectors.
The four types of fiber connectors are listed as follows:
l Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure
14-1.
l The N2OU08 and 61COA provide the SC/PC optical interfaces.
l The "IN" interface on the externally-installed case-shaped 62COA uses the LSH/APC
connector. See Figure 14-4.
l The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 and
Figure 14-2 show the corresponding FC/PC and SC/PC optical connectors.
Table 14-2 lists the description of the four optical connectors.

Table 14-2 Types of connectors

Internal Fiber Description
Connector

LC/PC Plug-in square fiber connector/protruding polished

LSH/APC Connector with dust-proof cover/protruding polished (8 degrees)

FC/PC Round fiber connector/protruding polished

SC/PC Square fiber connector/protruding polished

LC/PC Optical Connector

Figure 14-1 shows the appearance of the LC/PC optical connector.

Figure 14-1 LC/PC optical connector

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The axial operation instead of rotation is required to insert or remove the LC/PC optical interface.
Align the head of the fiber jumper with the optical interface with proper strength to insert the
fiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip,
and then push fiber connector inward slightly, and pull out the connector.

SC/PC Optical Connector

Figure 14-2 shows the appearance of the SC/PC optical connector.

Figure 14-2 SC/PC optical connector

FC/PC Optical Connector

Figure 14-3 shows the appearance of the FC/PC optical connector.

Figure 14-3 FC/PC optical connector

LSH/APC Optical Interface

Figure 14-4 shows the appearance of the LSH/APC optical interface.

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Hardware Description 14 Cables

Figure 14-4 LSH/APC optical connector

14.2 Power Cables and Grounding Cables

The power cables and grounding cables include the cabinet power cable, equipment supply cable,
and UPM power cable.

14.2.1 Cabinet –48 V/BGND/PGND Power Cable

The –48 V, BGND and PGND power cables are used to supply power to the equipment in the
cabinet. One end of the power cable connects to the power distribution cabinet and grounding
bar in the equipment room, and the other end connects to the power distribution unit at the cabinet
top.
14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable
The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to the
external –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet
top and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to the
OptiX OSN 1500 equipment.
14.2.3 UPM Power Cable
This section describes the UPM power cable in terms of the structure, connection and technical
specifications.

14.2.1 Cabinet –48 V/BGND/PGND Power Cable

The –48 V, BGND and PGND power cables are used to supply power to the equipment in the
cabinet. One end of the power cable connects to the power distribution cabinet and grounding
bar in the equipment room, and the other end connects to the power distribution unit at the cabinet
top.

Structure
Figure 14-5 shows the structure of the –48 V cabinet power cable/BGND power grounding
cable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.

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Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable
1 2

3
1. Cord end terminal 2. Bare connector-OT type 3. Cable tie

Figure 14-6 Cabinet PGND protection grounding cable (JG2)

1. Bare connector-OT type 2. Cable tie 3. Bare connector (JG2)

4. Heat-shrink tube 5. Main tag 6. Wire
7. Heat-shrink tube

Figure 14-7 Cabinet PGND protection grounding cable (OT)

1. Bare connector-OT type 2. Cable tie 3. Bare connector (OT)

4. Heat-shrink tube 5. Main tag 6. Wire
7. Heat-shrink tube

Pin Assignment
None

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Technical Specifications
Item Description

–48 V cabinet Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-

power cable bare ring terminal

Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12

mm deep-80A-green

Cable type Power cable-450 V/750 V-16 mm2-round and bllue-85A

Cabinet BGND Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-

power bare ring terminal
grounding cable
Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12
mm deep-80A-green

Cable type Power cable-450 V/750 V-16 mm2-round and black-85A

Cabinet PGND Connector 1 Bare crimping terminal-OT type-25mm2-M8-tin plating-

protection bare ring terminal
grounding cable
Connector 3 Bare crimping connector-JG2-25 mm2-M6-95A-tin
plating, or bare crimping connector-JG2-25 mm2-M8-95A-
tin plating, or bare crimping terminal-OT type-25 mm2-M8-
tin plating-bare ring terminal

Cable type Power cable-450 V/750 V-25 mm2-yellow and green-85 A

Fireproof level CM

Length 10 m, 20 m, 30 m

14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding

Cable
The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to the
external –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet
top and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to the
OptiX OSN 1500 equipment.

Structure
Figure 14-8 shows the structure of the equipment –48 V/–60 V power cable. Figure 14-9 shows
the structure of the PGND grounding cable.

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Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable

A3
A
A2

A1

Figure 14-9 PGND power cable

1. Bare connector-OT type 2. Cable tie 3. Bare connector 4. Heat-shrink tube

5. Main tag 6. Wire 7. Heat-shrink tube

Pin Assignment
For details on the pin assignment, refer to Table 14-3.

Table 14-3 Equipment –48 V/–60 V power cable

Cable connector Corresponding cable Core color

A1 W1 Blue (–48 V/–60 V power)

A3 W2 Black (power ground)

Technical Specifications
Item Equipment –48 V/–60 V PGND grounding cable
power cable

Cable connector Cable connector-D Bare crimping connector-OT-6 mm2-

type-3PIN-female M4-tin plating-pre-insulated ring
terminal-12–10AWG bare crimping
connector-OT-6 mm2-M8-tin plating-
insulated ring terminal-12–10AWG

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Item Equipment –48 V/–60 V PGND grounding cable

power cable

Cable Type Wire-300 V-16AWG- Wire-600 V-10AWG-yellow/green-50A

black (the core is blue and
black)-13A

Number of 2 1
cores

Fireproof CM CM
level

Color Blue or black Yellow and green

Length 15 m, 30 m 15 m, 30 m

14.2.3 UPM Power Cable

This section describes the UPM power cable in terms of the structure, connection and technical
specifications.

Structure
Figure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500.

Figure 14-10 Structure of the UPM power cable

A

B
A1 A B 1
A2 2
A3

X1 X2

Connection of the UPM Power Cable

Table 14-4 lists the connections of the UPM power cables.

Table 14-4 Connection of the UPM power cable

Cable Correspondi Cable Connector Core Color

Connector X1 ng Cable X2

A1 W1 1 Blue (–48 V/–60 V power

supply)

A3 W2 2 Black (ground for the power

supply)

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Specifications of the UPM Power Cable

Table 14-5 Specifications of the UPM power cable

Item UPM Power Cable

Cable connector X1 Cable connector-D type-3PIN-female (two female and one male)

Cable connector X2 Common plug-2PIN-single row

Cable Type Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A

Number of 2
cores

Fireproof CM
class

Color Core: blue or black

Length 2.5 m

14.3 Alarm Cable

The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,
alarm concatenation cable and alarm input/output cable.

14.3.1 Alarm Input/Output Cable

The alarm input cable is used to input the alarm signals of the external equipment to the OptiX
OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm
monitoring equipment.

14.3.1 Alarm Input/Output Cable

The alarm input cable is used to input the alarm signals of the external equipment to the OptiX
OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm
monitoring equipment.
One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/
output interface of the equipment. The other end uses a connector to connect to the external
equipment or central alarm monitoring equipment. The connector should be made according to
the on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarm
signals.

Structure
Figure 14-11 shows the structure of the alarm input/output cable.

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Figure 14-11 Structure of the alarm input/output cable

1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A

Pin Assignment
Table 14-6 lists the pin assignment of the alarm input/output cable.

Table 14-6 Pin assignment of the alarm input/output cable

Connect Color Relation Alarm Output Alarm Input
or X1

X1.1 Blue Twisted pair Positive for critical and major SW_INPUT 1+
alarms

X1.2 White Negative for critical and SW_INPUT 1–

major alarms

X1.3 Orange Twisted pair Positive for minor and SW_INPUT 2+

warning alarms

X1.6 White Negative for minor and SW_INPUT 2–

warning alarms

X1.4 Green Twisted pair Positive for alarm signal SW_INPUT 3+

output 1

X1.5 White Negative for alarm signal SW_INPUT 3–

output 1

X1.7 Brown Twisted pair Positive for alarm signal SW_INPUT 4+

output 2

X1.8 White Negative for alarm signal SW_INPUT 4–

output 2

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Technical Specifications
Item Description

Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug

Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 cores-

PANTONE 430U
Twisted pair cable-100±15 ohms-shielded enhanced type 5 CAT5E
SFTP-24AWG-8 core-PANTONE445U

Number of 8
cores

Fireproof class CM

Core diameter 0.5 mm

Length 10 m, 20 m, 30 m

14.4 Management Cable

The management cable includes the serial port cable, ordinary phone wire, COA concatenating
cable and network cable.

14.4.1 OAM Serial Port Cable

The OAM serial port cable is used for management and remote maintenance of the OptiX OSN
equipment.
14.4.2 Serial 1–4/F1/F&f Serial Port Cable
Use the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,
F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting
device or managed external device.
14.4.3 RS232/RS422 Serial Port Cable
The RS232/RS422 serial port cable is used to transmit the management signaling between
different subnets.
14.4.4 Ordinary Telephone Wire
The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.
Connect one end to PHONE interface of the equipment and connect the other end to the interface
of the orderwire phone.
14.4.5 COA Concatenating Cable
When several COA are installed in one cabinet, use the RS232 or RS422 serial port cables to
connect these COA.
14.4.6 Straight Through Cable
The straight through cable is used for the communication between the OptiX OSN equipment,
the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.
14.4.7 Crossover Cable
The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

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14.4.1 OAM Serial Port Cable

The OAM serial port cable is used for management and remote maintenance of the OptiX OSN
equipment.
Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment.
Use the DB25 connector to connect the other end to a laptop, T2000 computer or modem.

Structure
Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector).

Figure 14-12 Structure of the OAM serial port cable

1. Network interface 2. Main tag 3. Cable connector- A-A. Sectional view in B-B. Sectional view in
connector–RJ-45 DB25 male direction A direction B

Pin Assignment
Table 14-7 lists the pin assignment of the alarm input/output cable.

Table 14-7 Pin assignment of the OAM serial port cable

Connector Connector X2 Relation Description
X1

X1.2 X2.20 Single Data terminal ready (DTR)

X1.3 X2.2 Single Transmit data (TD)

X1.6 X2.3 Single Receive data (RD)

X1.4 X2.7 Twisted pair Signaling ground (SG)

X1.5

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Technical Specifications
Item Description

Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2 Cable connector-D type-25PIN-male or cable connector-D type-9PIN-

male

Type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-

PANTONE 430U

Number of 8
cores

Fireproof class CM

Length 5000 mm

14.4.2 Serial 1–4/F1/F&f Serial Port Cable

Use the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,
F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting
device or managed external device.

The Serial 1–4/F1/F&f serial port cable is used for the following functions:

l Transparently transmits the environment detecting data signals.

l Manages the external device such as the COA.

Structure
Figure 14-13 shows the structure of the Serial 1–4/F1/F&f serial port cable.

Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable

1. Network interface 2. Main tag 3. Cable connector- A-A. Sectional view in B-B. Sectional view in
connector–RJ-45 DB25 male direction A direction B

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Pin Assignment
Table 14-8 lists the pin assignment of the Serial 1–4/F1/F&f cable.

Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable

Connector X1 Connector X2 Relation Description

X1.1 X2.8 Twisted pair RS422RX+

X1.2 X2.9 RS422RX–

X1.3 X2.6 Twisted pair RS422TX+

X1.6 X2.7 RS422TX–

X1.4 X2.3 Twisted pair RS232RX

X1.8 X2.2 RS232TX

X1.5 X2.5 Single SG

Technical Specifications
Item Description

Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2 Cable connector-D type-9 PIN-male

Cable type 1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE

430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black

Number of 8
cores

Fireproof class CM

Length 15 m for cable type 1 and 3 m for cable type 2

14.4.3 RS232/RS422 Serial Port Cable

The RS232/RS422 serial port cable is used to transmit the management signaling between
different subnets.

Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port of
the equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment that
requires the orderwire phone communication.

Structure
Figure 14-14 shows the structure of the RS232/RS422 serial port cable.

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Figure 14-14 Structure of the RS232/RS422 serial port cable

1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A

Pin Assignment
Table 14-9 lists the pin assignment of the RS232/RS422 serial port cable.

Table 14-9 Pin assignment of the RS232/RS422 serial port cable

Connector Connector X2 Relation Description

X1

X1.3 X2.1 Twisted pair RX+

X1.6 X2.2 RX–

X1.1 X2.3 Twisted pair TX+

X1.2 X2.6 TX–

X1.5 X2.5 Twisted pair SG

X1.4 X2.8 232RX

X1.8 X2.4 Single 232TX

Technical Specifications
Item Description

Connector X1/X2 Network interface connector-8PIN-8 bit-shielded-crystal plug

Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-

PANTONE 430U

Number of cores 8

Fireproof class CM

Length 15 m

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14.4.4 Ordinary Telephone Wire

The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.
Connect one end to PHONE interface of the equipment and connect the other end to the interface
of the orderwire phone.

Structure
Figure 14-15 shows the structure of the ordinary telephone wire.

Figure 14-15 Structure of the ordinary telephone wire

1. Phone connector-RJ-11crystal plug 2. Main tag

Pin Assignment
Table 14-10 lists the pin assignment of the ordinary telephone wire.

Table 14-10 Pin assignment of the ordinary telephone wire

Connector X1 Connector X2 Description

X1.1 X2.1 No connected

X1.2 X2.2 No connected

X1.3 X2.3 TIP

X1.4 X2.4 RING

X1.5 X2.5 No connected

X1.6 X2.6 No connected

Technical Specifications
Item Description

Connector X1/X2 Network interface connector-6PIN-26 to 28AWG

Cable type Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-core

telephone wire

Number of cores 2

Fireproof class CM

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Item Description

Length 15 m

14.4.5 COA Concatenating Cable

When several COA are installed in one cabinet, use the RS232 or RS422 serial port cables to
connect these COA.

Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connect
the other end to the RS232-2 of another COA.

Structure
Figure 14-16 shows the structure of the COA concatenating cable.

Figure 14-16 Structure of the COA concatenating cable

1. Cable connector-DB25 male 2. Tag A-A. Sectional view in direction A

Pin Assignment
Table 14-11 lists the pin assignment of the COA concatenating cable.

Table 14-11 Pin assignment of the COA concatenating cable

Connector X1 Connector X2 Remarks

3 2 One pair

2 3

5 5 Grounding

Technical Specifications
Item Description

Connector X1/X2 Cable connector-D type-9 PIN-male

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Item Description

Cable type Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huawei

gray

Number of cores Two pairs

Fireproof class CM

Length 0.6 m, 2.5 m

14.4.6 Straight Through Cable

The straight through cable is used for the communication between the OptiX OSN equipment,
the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

Structure
Figure 14-17 shows the structure of the straight through cable.

Figure 14-17 Structure of the straight through cable

1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Tag 2

Pin Assignment
Table 14-12 lists the pin assignment of the straight through cable.

Table 14-12 Pin assignment of the straight through cable

Connector Connector X2 Color Relation

X1

X1.1 X2.1 White or orange Twisted pair

X1.2 X2.2 Orange

X1.3 X2.3 White or orange Twisted pair

X1.6 X2.6 Green

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Connector Connector X2 Color Relation

X1

X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or orange

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown

Technical Specifications
Item Description

Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to

26AWG-CAT 6/used with SFTP network cable

Cable type Communication cable-10015 ohms-shielded enhance type 5-

CAT5E-SFTP 24AWG-8 cores-PANTONE 445U

Number of cores 8

Fireproof class CM

Length 5 m, 10 m, 20 m, 30 m

14.4.7 Crossover Cable

The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipment
and connect the other end to the network interface of the computer.

Structure
Figure 14-18 shows the structure of the crossover cable.

Figure 14-18 Structure of the crossover cable

1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Network cable 5. Tag 2

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Pin Assignment
Table 14-13 lists the pin assignment of the crossover cable.

Table 14-13 Pin assignment of the crossover cable

Connector Connector X2 Color Relation
X1

X1.6 X2.2 Orange Twisted pair

X1.3 X2.1 White or orange

X1.1 X2.3 White or green Twisted pair

X1.2 X2.6 Green

X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or blue

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown

Technical Specifications
Item Description

Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to

26AWG-CAT 6/used with SFTP network cable

Cable type Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 cores-

PANTONE 445U

Number of cores 8

Fireproof class CM

Length 5 m, 30 m

14.5 Signal Cable

The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal
cable. The OptiX OSN 1500A supports only the E1/E3 signal cable.

14.5.1 75-ohm 8 x E1 Cable

The 75-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.2 75-ohm 16 x E1 Cable
The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to
the interface of the L75S interface board.
14.5.3 120-ohm 8 x E1 Cable

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The 120-ohm 8 x E1 cable is used to input and output E1 signals.

14.5.4 120-ohm 16 x E1 Cable
The 120-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.5 E3/T3/STM-1 Cable
The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB
connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector
to connect the other end to the DDF. The connector should be made according to the on-site
requirements.
14.5.6 Framed E1 Cable
The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1
signals.
14.5.7 N x 64 kbit/s Cables
The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel
of N x 64 kbit/s services.

14.5.1 75-ohm 8 x E1 Cable

The 75-ohm 8 x E1 cable is used to input and output E1 signals.

Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interface
board. Use a connector to connect the other end to the digital distribution frame (DDF). The
connector should be made according to the on-site requirements. Each cable can transmit eight
channels of E1 signals.

Structure
Figure 14-19 shows the structure of the 75-ohm 8 x E1 cable.

Figure 14-19 Structure of the 75-ohm 8 x E1 cable

1. Cable connector-D type-44 PIN-male 2. Tag 1, marked: "W1 (E1:1 to 4)"

3. Tag 3, marked: "W2 (E1:5 to 8)" 4. Main tag

Pin Assignment
Table 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable.

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Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable

Conne Cable W1 Remarks Connector Cable W2 Remark
ctor s
Core No. Core No.

38 Ring 1 R1 34 Ring 1 R5

23 Tip 19 Tip

37 Ring 3 R2 33 Ring 3 R6

22 Tip 18 Tip

36 Ring 5 R3 32 Ring 5 R7

21 Tip 17 Tip

35 Ring 7 R4 31 Ring 7 R8

20 Tip 16 Tip

15 Ring 2 T1 11 Ring 2 T5

30 Tip 26 Tip

14 Ring 4 T2 10 Ring 4 T6

29 Tip 25 Tip

13 Ring 6 T3 9 Ring 6 T7

28 Tip 24 Tip

12 Ring 8 T4 8 Ring 8 T8

27 Tip 7 Tip

Shell External braid shield layer Shell External braid shield layer

Technical Specifications
Item Description

Connector X Cable connector-D type-44 PIN-male

Cable type Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2

mm-0.252 mm-Huawei white

Fireproof class CM

Number of cores 8 x E1

Cover diameter- 9.65 mm-1.2 mm-0.252 mm

insulation diameter-
conductor diameter

Length 3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m

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CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do
not discard it before installation.

14.5.2 75-ohm 16 x E1 Cable

The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to
the interface of the L75S interface board.
Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interface
board. Use a connector to connect the other end to the DDF. The connector should be made
according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure
Figure 14-20 shows the structure of the 75-ohm 16 x E1 cable.

Figure 14-20 Structure of the 75-ohm 16 x E1 cable

Main tag

1. Cable connector 2. Terminal

Pin Assignment
Table 14-15 lists the pin assignment of the 75-ohm 16 x E1 cable.

Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable

Connec Cable W Remar Connec Cable W Remark

tor X ks tor X s
Core No. Core No.

a1 Tip 1 R1 a10 Tip 17 R9

a2 Ring a11 Ring

a3 Tip 2 T1 a12 Tip 18 T9

a4 Ring a13 Ring

a6 Tip 3 R2 a15 Tip 19 R10

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Connec Cable W Remar Connec Cable W Remark

tor X ks tor X s
Core No. Core No.

a7 Ring a16 Ring

a8 Tip 4 T2 a17 Tip 20 T10

a9 Ring a18 Ring

b1 Tip 5 R3 b10 Tip 21 R11

b2 Ring b11 Ring

b3 Tip 6 T3 b12 Tip 22 T11

b4 Ring b13 Ring

b6 Tip 7 R4 b15 Tip 23 R12

b7 Ring b16 Ring

b8 Tip 8 T4 b17 Tip 24 T12

b9 Ring b18 Ring

c1 Tip 9 R5 c10 Tip 25 R13

c2 Ring c11 Ring

c3 Tip 10 T5 c12 Tip 26 T13

c4 Ring c13 Ring

c6 Tip 11 R6 c15 Tip 27 R14

c7 Ring c16 Ring

c8 Tip 12 T6 c17 Tip 28 T14

a9 Ring c18 Ring

d1 Tip 13 R7 d10 Tip 29 R15

d2 Ring d11 Ring

d3 Tip 14 T7 d12 Tip 30 T15

d4 Ring d13 Ring

d6 Tip 15 R8 d15 Tip 31 R16

d7 Ring d16 Ring

d8 Tip 16 T8 d17 Tip 32 T16

d9 Ring d18 Ring

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Technical Specifications
Item Description

Connector X 2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp

Cable type W Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2

mm-0.254 mm-Huawei gray

Fireproof class CM

Number of cores 16 x E1

Cover diameter- 18mm-1.2 mm-0.254mm

insulation diameter-
conductor diameter

Length 10 m, 15 m, 20 m, 25 m, 30 m

CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do
not discard it before installation.

14.5.3 120-ohm 8 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interface
board. Use a connector to connect the other end to the DDF. The connector should be made
according to the on-site requirements. Each cable can transmit 8 channels of E1 signals.

Structure
Figure 14-21 shows the structure of the 120-ohm 8 x E1 cable.

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Figure 14-21 Structure of the 120-ohm 8 x E1 cable

1. Cable connector-D type-44PIN-male 2. Tag 1, marked:" W1 (TX1~8) "

3. Tag 3, marked:" W2 (RX1~8) " 4. Main tag

Pin Assignment
Table 14-16 lists the pin assignment of the 120-ohm 8 x E1 cable.

Table 14-16 Pin assignment of the 120-ohm E1 cable

Connecto Cable W1 Remar Connecto Cable W2 Remar

r ks r ks
Core No. Core No.

15 Blue Twisted Tx1 38 Blue Twisted Rx1

pair pair
30 White 23 White

14 Orang Twisted T×2 37 Orang Twisted R×2

e pair e pair

29 White 22 White

13 Green Twisted T×3 36 Green Twisted R×3

pair pair
28 White 21 White

12 Brow Twisted T×4 35 Brown Twisted R×4

n pair pair

27 White 20 White

11 Grey Twisted T×5 34 Grey Twisted R×5

pair pair
26 White 19 White

10 Blue Twisted T×6 33 Blue Twisted R×6

pair pair
25 Red 18 Red

9 Orang Twisted T×7 32 Orang Twisted R×7

e pair e pair

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Connecto Cable W1 Remar Connecto Cable W2 Remar

r ks r ks
Core No. Core No.

24 Red 17 Red

8 Green Twisted T×8 31 Green Twisted R×8

pair pair
7 Red 16 Red

Shell External braid shield layer Shell External braid shield layer

Technical Specifications
Item Description

Connector X Cable connector-D type-44PIN-male

Cable type Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16

core-PANTONE 430U

Number of cores 16

Inner conductor 0.5 mm

diameter

Fireproof class CM

Length 10 m, 15 m, 20 m, 30 m, 40 m

14.5.4 120-ohm 16 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interface
board, L12S or PL1B. Use a connector to connect the other end to the DDF. The connector
should be made according to the on-site requirements. Each cable can transmit 16 channels of
E1 signals.

Structure
Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable.

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Figure 14-22 Structure of the 120-ohm 16 x E1 cable

3

W2

X
W1
2

1. Cable connector 2. Terminal 3. Main tag

Pin Assignment
Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable.

Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable

Conne Cable W1 Remark Connect Cable W2 Remarks

ctor X s or X
Core No. Core No.

a1 Blue Twiste Rx1 a3 Blue Twiste Tx1

d pair d pair
a2 White a4 White

a6 Orange Twiste Rx2 a8 Orange Twiste Tx2

d pair d pair
a7 White a9 White

b1 Green Twiste Rx3 b3 Green Twiste Tx3

d pair d pair
b2 White b4 White

b6 Brown Twiste Rx4 b8 Brown Twiste Tx4

d pair d pair
b7 White b9 White

c1 Grey Twiste Rx5 c3 Grey Twiste Tx5

d pair d pair
c2 White c4 White

c6 Blue Twiste Rx6 c8 Blue Twiste Tx6

d pair d pair
c7 Red c9 Red

d1 Orange Twiste Rx7 d3 Orange Twiste Tx7

d pair d pair
d2 Red d4 Red

d6 Green Twiste Rx8 d8 Green Twiste Tx8

d pair d pair
d7 Red d9 Red

a10 Brown Twiste Rx9 a12 Brown Twiste Tx9

d pair d pair
a11 Red a13 Red

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Conne Cable W1 Remark Connect Cable W2 Remarks

ctor X s or X
Core No. Core No.

a15 Grey Twiste Rx10 a17 Grey Twiste Tx10

d pair d pair
a16 Red a18 Red

b10 Blue Twiste Rx11 b12 Blue Twiste Tx11

d pair d pair
b11 Black b13 Black

b15 Orange Twiste Rx12 b17 Orange Twiste Tx12

d pair d pair
b16 Black b18 Black

c10 Green Twiste Rx13 c12 Green Twiste Tx13

d pair d pair
c11 Black c13 Black

c15 Brown Twiste Rx14 c17 Brown Twiste Tx14

d pair d pair
c16 Black c18 Black

d10 Grey Twiste Rx15 d12 Grey Twiste Tx15

d pair d pair
d11 Black d13 Black

d15 Blue Twiste Rx16 d17 Blue Twiste Tx16

d pair d pair
d16 Yellow d18 Yellow

a5 Shell External braid shield a14 Shell External braid shield

layer layer

Technical Specifications
Item Description

Connector X 2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp

Cable type Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32

W1/W2 core-PANTONE 430U

Number of 32
cores

Inner 0.5 mm
conductor
diameter

Fireproof class CM

Length 10 m, 15 m, 20 m, 25 m, 30 m

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14.5.5 E3/T3/STM-1 Cable

The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB
connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector
to connect the other end to the DDF. The connector should be made according to the on-site
requirements.

Structure
Figure 14-23 shows the structure of the E3/T3/STM-1 cable.

Figure 14-23 Structure of the E3/T3/STM-1 cable

1. Coaxial connector-SMB 2. Main tag 3. Coaxial cable

Pin Assignment
None

Technical Specifications
Item Description

Connector Coaxial connector-SMB-75 ohms-straight and female

Cable I Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34

mm

Length: 10 m, 15 m, 20 m, 30 m

Cable II Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray

Cover diameter 4.4 mm-insulation diameter 2.4 mm-conductor diameter 0.4

mm

Length: 15 m, 20 m, 25 m, 30 m, 40 m

Cable III Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray

Cover diameter 6.7 mm-insulation diameter 3.8 mm-conductor diameter 0.61

mm

Length: 15 m, 20 m, 25 m, 30 m, 130 m

Cable IV Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black

Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter

0.643 mm

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Item Description

Length: 30 cm

Fireproof CM
class

14.5.6 Framed E1 Cable

The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1
signals.

The framed E1 cables of 75 ohms and 120 ohms are available.

l See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pin
assignment and technical specifications of the 75-ohm framed E1 cable.
l See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pin
assignment and technical specifications of the 120-ohm framed E1 cable.

14.5.7 N x 64 kbit/s Cables

The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel
of N x 64 kbit/s services.

Table 14-18 lists the pin assignment of the DB28 connector.

Table 14-18 Pin assignment of the DB28 connector of the DM12

Pin Signal Directi Description

on

1 TXD+ ---> Transmits data.

2 TXD– ---> Transmits data.

3 TXC+ <--> The DCE provides the transmitting clock to the

DTE.

4 TXC– <--> The DCE provides the transmitting clock to the

DTE.

5 NC - -

6 GND ----- Circuit_GND

7 MODE0 <--- Identifies the cable type.

8 MODE1 <--- Identifies the cable type.

9 MODE2 <--- Identifies the cable type.

10 MODE_DCE <--- Identifies the DCE/DTE cable type.

11 DCD+ <--> Detects the carrier.

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Pin Signal Directi Description

on

12 DCD– <--> Detects the carrier.

13 RTS+ ---> Requests for transmission.

14 RTS– ---> Requests for transmission.

15 TXCE+ ---> Transmitting data clock for DCE and loopback

clock for DTE.

16 TXCE– ---> Transmitting data clock for DCE and loopback

clock for DTE.

17 RXC+ <--- Receives clock.

18 RXC– <--- Receives clock.

19 RXD+ <--- Receives data.

20 RXD– <--- Receives data.

21 GND ----- Shield_GND

22 LL <--> Loopback control signals.

23 CTS+ <--- Prepares for transmission.

24 CTS– <--- Prepares for transmission.

25 DSR+ <--- Prepares the DCE.

26 DSR– <--- Prepares the DCE.

27 DTR+ ---> Prepares the DTE.

28 DTR– ---> Prepares the DTE.

According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classified
into the following ten types.

l V.35 DCE cable

l V.35 DTE cable
l V.24 DCE cable
l V.24 DTE cable
l X.21 DCE cable
l X.21 DTE cable
l RS449 DCE cable
l RS449 DTE cable
l RS530 DCE cable
l RS530 DTE cable

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V.35 DCE Cable

Figure 14-24 shows the structure of the V.35 DCE cable.

Figure 14-24 Structure of the V.35 DCE cable

A-A B-B
1 2 3

Pos.28

A W B

Pos.1
A B
C D
E F
H J

X1 X2 M
K

P
N
L

R
S T
U V
W X
Y Z
AA BB
CC DD
EE FF
HH JJ
KK LL
MM NN

1. Cable connector-D28 male 2. Main tag

3. Cable connector-D34 female + D34 plastic shell

Table 14-19 lists the pin assignment of the V.35 DCE cable.

Table 14-19 Pin assignment of the V.35 DCE cable

Connector X1 Connector X2 Relation

19 P Twisted pair

20 S

1 R Twisted pair

2 T

15 V Twisted pair

16 X

3 Y Twisted pair

4 AA

17 U Twisted pair

18 W

11 F -

22 J -

23 C -

13 D -

25 H -

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Connector X1 Connector X2 Relation

27 E -

21 B -

6+7+8 A Short circuiting for 6–8

The technical specifications of the V.35 DCE cable are as follows.

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable

solder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM

Connector X2 Cable connector-V35 plug-34PIN-injection molding shell-tube,

exclusively used for OEM

Cable connector-V35 DCE plug-34PIN-female-cable crimping-core,

exclusively used for OEM

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of cores 5 pairs and 8 cores

Core diameter 0.32 mm

Length 3m

V.35 DTE Cable

Figure 14-25 shows the structure of the V.35 DTE cable.

Figure 14-25 Structure of the V.35 DTE cable

A-A B-B
1 2 3 4 5

Pos.28

A W B

Pos.1
B A
X1 X2 F
D
J
E
L N K M
C
H
R T P S
V X U W
Z BB Y AA
DD FF CC EE
JJ LL HH KK
NN MM

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D34 plastic shell

4. Ordinary terminal 5. Cable connector-D34 male

Table 14-20 lists the pin assignment of the V.35 DTE cable.

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Table 14-20 Pin assignment of the V.35 DTE cable

Connector X1 Connector X2 Relation

1 P Twisted pair

2 S

19 R Twisted pair

20 T

17 V Twisted pair

18 X

3 Y Twisted pair

4 AA

15 U Twisted pair

16 W

11 F -

22 J -

13 C -

23 D -

27 H -

25 E -

21 B -

6+10+7+8 A Short circuiting 6, 7, 8 and 10

The technical specifications of the V.35 DTE cable are as follows.

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively

X2 used for OEM

Cable connector-V35 DTE plug-34PIN-male-cable crimping-core,

exclusively used for OEM

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of 5 pairs and 8 cores

cores

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Item Description

Core 0.32 mm
diameter

Length 3m

V.24 DCE Cable

Figure 14-26 shows the structure of the V.24 DCE cable.

Figure 14-26 Structure of the V.24 DCE cable

A-A B-B
1 2 3
Pos.25
Pos.1

A
W B

Pos.28

Pos.1 X1
X2

1. Cable connector-D25 female 2. Main tag 3. Cable connector-D28 male

Table 14-21 lists the pin assignment of the V.24 DCE cable.

Table 14-21 Pin assignment of the V.24 DCE cable

Connector X1 Connector X2 Relation

19 2 Twisted pair

1 3

23 4 Twisted pair

13 5

25 20 Twisted pair

27 6

11 8 Twisted pair

22 18

3 15 Twisted pair

17 24

15 17 -

21 1 Single

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Connector X1 Connector X2 Relation

6+7 7 Short circuiting 6 and 7

The technical specifications of the V.24 DCE cable are as follows.

Table 14-22 Technical specifications of the V.24 DCE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2 Cable connector-D type-25PIN-female-cable solder

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of 5 pairs and 8 cores

cores

Core diameter 0.32 mm

Length 3m

V.24 DTE Cable

Figure 14-27 shows the structure of the V.24 DTE cable.

Figure 14-27 Structure of the V.24 DTE cable

A-A B-B
1 2 3
Pos.1
Pos.1

A
W B

Pos.28
Pos.25 X1
X2

1. Cable connector-D25 male 2. Main tag 3. Cable connector-D28 male

Table 14-23 lists the pin assignment of the V.24 DTE cable.

Table 14-23 Pin assignment of the V.24 DTE cable

Connector X1 Connector X2 Relation

1 2 Twisted pair

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Connector X1 Connector X2 Relation

19 3

13 4 Twisted pair

23 5

27 20 Twisted pair

25 6

11 8 Twisted pair

22 18

3 15 Twisted pair

15 24

17 17 -

21 1 Single

6+10+7 7 Short circuiting 6, 10 and 7

The technical specifications of the V.24 DTE cable are as follows.

Table 14-24 Technical specifications of the V.24 DTE cable

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-D type-25PIN-male-cable solder

X2

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of 5 pairs and 8 cores

cores

Core 0.32 mm
diameter

Length 3m

X.21 DCE Cable

Figure 14-28 shows the structure of the X.21 DCE cable.

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Figure 14-28 Structure of the X.21 DCE cable

A-A B-B

1 2 3
Pos.15
Pos.1

W B
A

Pos.28
Pos.1
X2 X1

1. Cable connector-D15 female 2. Main tag 3. Cable connector-D28 male

Table 14-25 lists the pin assignment of the X.21 DCE cable.

Table 14-25 Pin assignment of the X.21 DCE cable

Connector X1 Connector X2 Relation

13 5 Twisted pair

14 12

23 3 Twisted pair

24 10

19 2 Twisted pair

20 9

1 4 Twisted pair

2 11

15 6 Twisted pair

16 13

21 1 –

6+9 8 Short circuiting 6 and 9

The technical specifications of the X.21 DCE cable are as follows.

Table 14-26 Technical specifications of the X.21 DCE cable

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-D type-15PIN-female-cable solder

X2

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Item Description

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of 5 pairs and 8 cores

cores

Core 0.32 mm
diameter

Length 3m

X.21 DTE Cable

Figure 14-29 shows the structure of the X.21 DTE cable.

Figure 14-29 Structure of the X.21 DTE cable

A-A B-B
1 2 3
Pos.1 Pos.1

W
B
A

Pos.28
Pos.15
X2 X1

1. Cable connector-D15 male 2. Main tag 3. Cable connector-D28 male

Table 14-27 lists the pin assignment of the X.21 DTE cable.

Table 14-27 Pin assignment of the X.21 DTE cable

Connector X1 Connector X2 Relation

13 3 Twisted pair

14 10

23 5 Twisted pair

24 12

19 4 Twisted pair

20 11

1 2 Pair

2 9

15 6 Twisted pair

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Connector X1 Connector X2 Relation

16 13

17 6 Twisted pair

18 13

21 1 –

6+10+9 8 Short circuiting 6, 10 and 9

The technical specifications of the X.21 DTE cable are as follows.

Table 14-28 Technical specifications of the X.12 DTE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2 Cable connector-D type-15PIN-male-cable solder

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-
PANTONE 296U-exclusively used by OEM

Number of 5 pairs and 8 cores

cores

Core diameter 0.32 mm

Length 3m

RS449 DCE Cable

Figure 14-30 shows the structure of the RS449 DCE cable.

Figure 14-30 Structure of the RS449 DCE cable

A-A B-B
1 2 3
Pos.1 Pos.1

W
B
A

Pos.28
Pos.15
X2 X1

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 female-I

Table 14-29 lists the pin assignment of the RS449 DCE cable.

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Table 14-29 Pin assignment of the RS449 DCE cable

Connector X1 Connector X2 Relation

27 11 Twisted pair

28 29

25 12 Twisted pair

26 30

13 9 Twisted pair

14 27

23 7 Twisted pair

24 25

11 13 Twisted pair

12 31

19 4 Twisted pair

20 22

1 6 Twisted pair

2 24

15 8 Twisted pair

16 26

17 17 Twisted pair

18 35

3 5 Twisted pair

4 23

22 10 –

21 1 –

6+8 19 Short circuiting 6 and 8

The technical specifications of the RS449 DCE cable are as follows.

Table 14-30 Specifications of the RS449 DCE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable

solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

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Item Description

Connector X2 Cable connector-D type-37PIN-female-cable solder-exclusively used

for OEM

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26

core-PANTONE 296U-exclusively used for OEM

Number of cores 26

Core diameter 0.32 mm

Length 3m

RS449 DTE Cable

Figure 14-31 shows the structure of the RS449 DTE cable.

Figure 14-31 Structure of the RS449 DTE cable

A-A B-B

1 2 3
Pos.37
Pos.28

A
W B

Pos.1 X1
X2 Pos.1

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 male-I

Table 14-31 lists the pin assignment of the RS449 DTE cable.

Table 14-31 Pin assignment of the RS449 DTE cable

Connector X1 Connector X2 Relation

27 12 Twisted pair

28 30

25 11 Twisted pair

26 29

13 7 Twisted pair

14 25

23 9 Twisted pair

24 27

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Connector X1 Connector X2 Relation

11 13 Twisted pair

12 31

19 6 Twisted pair

20 24

1 4 Twisted pair

2 22

15 17 Twisted pair

16 35

17 8 Twisted pair

18 26

3 5 Twisted pair

4 23

22 10 -

21 1 -

6+8+10 19 Short circuiting 6, 8 and 10

The technical specifications of the RS449 DTE cable are as follows.

Table 14-32 Specifications of the RS449 DTE cable

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row,

X2 standard installation hole, exclusively used for OEM

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-

PANTONE 296U-exclusively used for OEM

Number of 26
cores

Core 0.32 mm
diameter

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RS530 DCE Cable

Figure 14-32 shows the structure of the RS530 DCE cable.

Figure 14-32 Structure of the RS530 DCE cable

A-A B-B

1 2 3
Pos.25
Pos.1

A W B

X1 Pos.28

Pos.1 X2

1. Cable connector-D25 female 2. Main tag 3. Cable connector-D28 male

Table 14-33 lists the pin assignment of the RS530 DCE cable.

Table 14-33 Pin assignment of the RS530 DCE cable

Connector X1 Connector X2 Relation

28 22 Twisted pair

27 6

26 23 Twisted pair

25 20

24 19 Twisted pair

23 4

22 18 Single

21 1 Single

20 14 Twisted pair

19 2

18 11 Twisted pair

17 24

16 9 Twisted pair

15 17

14 13 Twisted pair

13 5

12 10 Twisted pair

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Connector X1 Connector X2 Relation

11 8

4 12 Twisted pair

3 15

2 16 Twisted pair

1 3

6+7+9 7 Short circuiting 6, 7 and 9

The technical specifications of the RS530 DCE cable are as follows.

Table 14-34 Specifications of the RS530 DCE cable

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-D type-25PIN-female-cable solder

X2

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-

PANTONE 296U-exclusively used for OEM

Number of 26
cores

Core 0.32 mm
diameter

Length 3m

RS530 DTE Cable

Figure 14-33 shows the structure of the RS530 DTE cable.

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Figure 14-33 Structure of the RS530 DTE cable

A-A B-B
1 2 3
Pos.1
Pos.1

A W B

Pos.28
X1
Pos.25 X2

1. Cable connector-D25 male 2. Main tag 3. Cable connector-D28 male

Table 14-35 lists the pin assignment of the RS530 DTE cable.

Table 14-35 Pin assignment of the RS530 DTE cable

Connector X1 Connector X2 Relation

27 20 Twisted pair

28 23

25 6 Twisted pair

26 22

13 4 Twisted pair

14 19

23 5 Twisted pair

24 13

11 8 Twisted pair

12 10

19 3 Twisted pair

20 16

1 2 Twisted pair

2 14

15 24 Twisted pair

16 11

17 17 Twisted pair

18 9

3 15 Twisted pair

4 12

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Connector X1 Connector X2 Relation

22 18 –

21 1 –

6+7+9+10 7 Short circuiting 6, 7, 9 and 10

The technical specifications of the RS530 DTE cable are as follows.

Table 14-36 Specifications of the RS530 DTE cable

Item Description

Connector Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-

X1 spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector Cable connector-D type-25PIN-male-cable solder

X2

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-

PANTONE 296U-exclusively used for OEM

Number of 26
cores

Core 0.32 mm
diameter

Length 3m

14.6 Clock Cable

The clock cable includes the clock cable and clock transfer cable.

14.6.1 Clock Cable

The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input
and output external clock signals.
14.6.2 One-Channel and Two-Channel Clock Transfer Cables
The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and
two-channel clock transfer cable (75 ohms to 120 ohms).

14.6.1 Clock Cable

The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input
and output external clock signals.
For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the external
clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the
external clock equipment. The connector should be made according to the on-site requirements.
For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to the

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external clock interface of the OptiX OSN equipment. Use a connector to connect the other end
to the external clock equipment. The connector should be made according to the on-site
requirements.

Structure
Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohm
clock cable respectively.

Figure 14-34 Structure of the 75-ohm clock cable

1. Coaxial connector-SMB 2. Tag

Figure 14-35 Structure of the 120-ohm clock cable

A-A
8
1
1 2 3

X1
A

1. Network port connector-RJ-45 2. Main tag 3. Communication cable

Pin Assignment
Table 14-37 lists the pin assignment of the 120-ohm clock cable.

Table 14-37 Pin assignment of the 120-ohm clock cable

X1 W Remark

X1.1 Blue R1

X1.2 White

X1.3 Orange R2

X1.6 White

X1.4 Green T1

X1.5 White

14-50 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 14 Cables

X1 W Remark

X1.7 Brown T2

X1.8 White

Technical Specifications
Item Description

75 Connector Coaxial connector-SMB-75 ohms-straight and

ohms female
clock
cable Cable Model Coaxial cable-75 ohms-3.9 mm-2.1mm-0.34
mm-shielded

Diameter cover diameter 3.9 mm-insulation diameter 2.1

mm-conductor diameter 0.34 mm

Length 10 m, 15 m, 20 m, 30 m

120 Connector X1 Network interface cable-8PIN-8bit-shielded-

ohms crystal model connector
clock
cable Cable Model Twisted pair-120ohms-SEYVP-24AWG-4
pairs- Pantone 430U

Conductor 0.5 mm/24AWG

diameter

Length 10 m, 20 m, 30 m

14.6.2 One-Channel and Two-Channel Clock Transfer Cables

The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and
two-channel clock transfer cable (75 ohms to 120 ohms).

Structure
Figure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable and
two-channel clock transfer cable respectively.

Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Main tag 3. 75 ohms/120 ohms transfer PCB

Issue 02 (2007-03-29) Huawei Proprietary and Confidential 14-51

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 OptiX OSN 1500 Intelligent Optical Transmission System
14 Cables Hardware Description

Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag

5. 75 ohms/120 ohms transfer PCB 6. Tag 3:"1#" 7. Tag 4:"2#"

Pin Assignment
Table 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120
ohms).

Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)

Connector 75-ohm Cable Color 120-ohm Cable

X1 Core Blue W3

Shielding layer White

X2 Core Blue W4

Shielding layer White

Technical Specifications
Item Description

One Connector: coaxial connector-SMB-75 ohms-straight and female

channel
75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor

diameter 0.34 mm

120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2

pairs-Pantone 430U

Inner conductor diameter: 0.4 mm/26AWG

Length: 30 m

Two Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female

channels
75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

14-52 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description 14 Cables

Item Description

75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor

diameter 0.34 mm

120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2

pairs-Pantone 430U

Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG

Length: 30 m

Issue 02 (2007-03-29) Huawei Proprietary and Confidential 14-53

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description A Equipment and Board Alarm Indicators

A Equipment and Board Alarm Indicators

This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment.

A.1 Indicators on the Cabinet

This section describes the indicators on the cabinet for the OptiX OSN equipment.
A.2 Board Alarm Indicator
This section describes the board alarm indicators and their indications.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential A-1

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
A Equipment and Board Alarm Indicators Hardware Description

A.1 Indicators on the Cabinet

This section describes the indicators on the cabinet for the OptiX OSN equipment.

Indicator Indication

Normal power supply indicator: Power When it is lit, it indicates that the power is supplied
(green) to the equipment.

When it is unlit, it indicates that no power is

supplied to the equipment.

Critical alarm indicator: Critical (red) When it is lit, it indicates that critical alarms are
generated in the equipment.

When it is unlit, it indicates that no critical alarms

are generated in the equipment.

Major alarm indicator: Major (orange) When it is lit, it indicates that major alarms are
generated in the equipment.

When it is unlit, it indicates that no major alarms are

generated in the equipment.

Minor alarm indicator: Minor (yellow) When it is lit, it indicates that minor alarms are
generated in the equipment.

When it is unlit, it indicates that no minor alarms

are generated in the equipment.

A.2 Board Alarm Indicator

This section describes the board alarm indicators and their indications.

Board Hardware State Indicator (STAT)

Status Description Indication

Lit (green) The board is working normally.

Lit (red) The board hardware is faulty.

Unlit No power is supplied to the board.

Service Activating State Indicator (ACT)

Status Description Indication

Lit (green) The service is in the activating state and the board is
working.

A-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description A Equipment and Board Alarm Indicators

Status Description Indication

Unlit The service is in the non-activating state.

Board Software State Indicator (PROG)

Status Description Indication

Lit (green) The board software or software for FPGA is loaded

successfully, or the board software is initialized
normally.

Circularly lit for 100 ms and unlit for The board software or FPGA is being loaded to the
100 ms (green) FLASH.

Circularly lit for 300 ms and unlit for The board software is being initialized and is in the
300 ms (green) BIOS boot state.

Lit (red) The board software or FPGA in the FLASH is lost.

The loading and initialization of the board software
fails.

Unlit No power is input.

Service Alarm Indicator (SRV)

Status Description Indication

Lit (green) The service is running normally and no service alarms

are generated.

Lit (red) Critical or major alarms occur to the service.

Lit (yellow) Minor or remote alarms occur to the service.

Unlit The board is not configured with services and no

alarms is generated, or no power is supplied to the
board.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential A-3

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 OptiX OSN 1500 Intelligent Optical Transmission System
A Equipment and Board Alarm Indicators Hardware Description

Synchronization Clock State Indicator

Status Description Indication

Lit (green) l The clock is working in the free-run mode and the
system clock priority list is not set. By default, the
system clock priority list contains only the internal
source.
l The clock is working in the tracing mode and
tracing the clock source rather than the internal
source in the priority list.

Lit (red) The system clock priority list is set. Except the
internal clock source, all clock sources are lost. The
clock is working in the hold-over or free-run mode.

Alarm Cutting Indicator (ALMC)

Status Description Indication

Lit (yellow) The board is in the alarm cutting state.

Unlit Sound is generated to indicate the alarm.

Ethernet Indicator
Indicator Status Indication
Description

Connection status indicator Lit The network cable is successfully

(LINK), which is green when connected to the equipment.
lit.
Unlit The network cable is not connected to
the equipment.

Data receiving and Flashing The data is being transmitted or

transmitting indicator (ACT), received.
which is orange when lit.
Unlit No data is being transmitted or
received.

Service activating state indicator of the cross-connect unit (ACTX)

Status Description Indication

Lit (green) The cross-connect unit is in the active state.

Unlit The cross-connect unit is in the standby state.

A-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description A Equipment and Board Alarm Indicators

Active/standby state indicator (ACTC) of the SCC unit

Status Description Indication

Lit (green) The cross-connect unit is in the active state.

Unlit The cross-connect unit is in the standby state.

Service alarm indicator of the line unit (SRVL)

Status Description Indication

Lit (green) The line service is normal and no alarms are

generated.

Lit (red) Critical alarms or major alarms occur to the line

service.

Lit (yellow) Minor or remote alarms occur to the line service.

Unlit The unit is not configured with services and no alarms

is generated, or no power is supplied to the unit.

Fan tray assembly indicator

Indicator Status Description Indication

Board running Lit (green) The board is working normally.

state indicator
(RUN) Unlit The board is not powered on.

Fan alarm Lit (red) The fan stops.

indicator (ALM)
Unlit The fan is running normally.

Indicator on the panel of the COA

Indicator Status Description Indication

Green running Flash once every two The COA is running normally.
indicator (RUN) seconds (green)

Flash once every four The COA in in the database protection

seconds (green) mode. The communication between the
COA and the SCC fails.

Flash five times every The program is starting or being loaded.

second (green)

Issue 02 (2007-03-29) Huawei Proprietary and Confidential A-5

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 OptiX OSN 1500 Intelligent Optical Transmission System
A Equipment and Board Alarm Indicators Hardware Description

Indicator Status Description Indication

Alarm indicator Lit (red) The self-check of the memory fails.

(ALM)
Flash thrice every other Critical alarms are generated.
second (red)

Flash twice every other Major alarms are generated.

second (red)

Flash once every other Minor alarms are generated.

second (red)

Power indicator (POWER)

Status Description Indication

Lit (green) The input of the power supply is normal.

Unlit No power supply is input or the power supply fails.

Indicator on the UPM

Module Indicator Status Indication
Description

Rectifier ALM Lit (red) The rectifier module fails. Normally, it is unlit.
module
Vout Lit (green) The output of the rectifier module is normal.

Monitorin RUN Flashes (green) The entire power supply system is normal.
g module
ALM Lit (red) The entire power supply system becomes
faulty. Normally, it is unlit.

A-6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description B Labels

B Labels

This chapter describes various labels for the OptiX OSN equipment, including the safety labels,
optical module labels, and cable labels.

B.1 Safety Label

Many safety labels are stuck on the equipment. This section describes the suggestions and
locations of these safety labels.
B.2 Optical Module Labels
Optical module labels are used to recognize different types of optical modules. Optical module
label is stuck to the optical module.
B.3 Engineering Labels
The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential B-1

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
B Labels Hardware Description

B.1 Safety Label

Many safety labels are stuck on the equipment. This section describes the suggestions and
locations of these safety labels.
B.1.1 Label Description
On the subrack, there are labels such as the ESD protection label, subrack grounding label and
fan warning label.
B.1.2 Label Position
The ESD protection label and the subrack grounding label are stuck on the subrack. The laser
class label and the APD warning label are stuck on the front panel of each board.

B.1.1 Label Description

On the subrack, there are labels such as the ESD protection label, subrack grounding label and
fan warning label.

Table B-1 Labels on the equipment

Label Type Suggestion

ESD protection label The equipment is electrostatic

sensitive.

LASER
Laser safety class The label suggests the class of
RADIATION the laser source.
DO NOT VIEW DIRECTLY
CLASS 1 WITH OPTICAL
INSTRUMENTS
LASER CLASS 1M
LASER
PRODUCT PRODUCT

Subrack grounding label This label suggests the

grounding position.

! ATTENTION 警告 Regular cleaning label Regularly clean the air filter.

CLEAN PERIODICALLY 定期清洗

严禁在风扇高速旋转时接触叶片 Fan warning label Do not the fan leaves before

DON'T TOUCH THE the fan stops.
FANLEAVESBEFORE
THEYSLOW DOWN !

APD warning label The overload point of the

! APD indicator is –9 dBm.
Receiver
MAX:-9dBm

B-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description B Labels

Label Type Suggestion

RoHS label The equipment is in line with

the RoHS-related
environment-friendly
requirements.

OptiX OSN 1500A

Product nameplate label The label suggests the
product name and
电源额定值 POWER RATING: -48－ -60V ; 4.5A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference

certification.
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

OptiX OSN 1500

电源额定值 POWER RATING: -48－ -60V ; 6A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

For the enhanced subrack:

OptiX OSN 1500A
电源额定值 POWER RATING: -48－ -60V ; 8.2A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

OptiX OSN 1500

电源额定值 POWER RATING: -48－ -60V ; 10.4A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

合格证/QUALIFICATION CARD
Qualification card label The equipment is qualified.

HUAWEI
华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

B.1.2 Label Position

The ESD protection label and the subrack grounding label are stuck on the subrack. The laser
class label and the APD warning label are stuck on the front panel of each board.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential B-3

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
B Labels Hardware Description

Figure B-1 Labels on the OptiX OSN 1500B subrack

合格证/QUALIFICATION CARD

HUAWEI
华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

OptiX OSN 1500

电源额定值 POWER RATING: -48－ -60V ; 6A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

严禁在风扇高速旋转时接触叶片

DON'T TOUCH THE

FAN LEAVES BEFORE
THEY SLOW DOWN !

ATTENTION 警告
CLEAN PERIODICALLY 定期清洗

Figure B-2 Labels on the OptiX OSN 1500A subrack

合格证/QUALIFICATION CARD

HUAWEI
华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA

OptiX OSN 1500A

电源额定值 POWER RATING: -48－ -60V ; 4.5A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

N14036

华为技术有限公司 中国制作
HUAWEI TECHNOLOGIES CO.,LTD. MADE IN CHINA
严禁在风扇高速旋转时接触叶片

DON'T TOUCH THE

FAN LEAVES BEFORE
THEY SLOW DOWN !

ATTENTION 警告
CLEAN PERIODICALLY 定期清洗

B-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description B Labels

Figure B-3 Labels on a board

SL16

CLASS 1
LASER
PRODUCT
! APD
Receiver
MAX:-9dBm

BA2

LASER
RADIATION

DO NOT VIEW DIRECTLY

WITH OPTICAL
INSTRUMENTS
CLASS 1M LASER
PRODUCT

B.2 Optical Module Labels

Optical module labels are used to recognize different types of optical modules. Optical module
label is stuck to the optical module.

Figure B-4 shows the optical module labels.

Figure B-4 Optical module labels

As shown in Table B-2, different types of optical module have different codes.

Table B-2 Optical module code and type mapping table

Optical Optical Type

Module Code

34060288 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-16-–3 dBm-–10 dBm-–21 dBm-LC-2 km

Issue 02 (2007-03-29) Huawei Proprietary and Confidential B-5

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 OptiX OSN 1500 Intelligent Optical Transmission System
B Labels Hardware Description

Optical Optical Type

Module Code

34060278 Optical transceiver-ESFP (internal and external alignment)-1310-

STM-16-0 dBm-–5 dBm-–21 dBm-LC-15 km

34060289 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-16-3 dBm-–2 dBm-–30 dBm-LC-40 km

34060279 Optical transceiver-ESFP (internal and external alignment)-1550-

STM-16-3 dBm-–2 dBm-–30 dBm-LC-80 km

34060277 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-4-–8 dBm-–15 dBm-–31 dBm-LC-15 km

34060280 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-4-2 dBm-–3 dBm-–30 dBm-LC-40 km

34060284 Optical transceiver-ESFP (internal and external alignment)-1550 nm-

STM-4-2 dBm-–3 dBm-–30 dBm-LC-80km

34060285 Optical transceiver-ESFP (internal and external alignment)-1550 nm-

STM-4-2 dBm-–3 dBm--36 dBm-LC-100km

34060276 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-1-–8 dBm-–15 dBm-–31 dBm-LC-15 km

34060281 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM–1-0 dBm-–5 dBm-–37 dBm-LC-40 km

34060282 Optical transceiver-ESFP (internal and external alignment)-1550-

STM-1-0 dBm-–5 dBm-–37 dBm-LC-80 km

34060299 Optical transceiver-ESFP (internal and external alignment)-1310 nm-

STM-1-–8 dBm-–15 dBm-–31 dBm-LC (private)-15 km

34060286 Optical transceiver-ESFP (internal and external alignment)-850

nm-2.125G multirate-–2.5 dBm-–9.5 dBm-–17 dBm-LC-0.5 km

34060219 Optical transceiver-ESFP (internal and external alignment)-1310

nm-1.25 Gbit/s-–3 dBm-–9.5 dBm-–20 dBm-LC-10 km

34060298 Optical transceiver-ESFP (internal and external alignment)-1310

nm-1.25 Gbit/s-3 dBm-–4.5 dBm-–22.5 dBm-LC-40 km

34060274 Optical transceiver-ESFP (internal and external alignment)-1550

nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-80 km

34060325 Optical transceiver-ESFP (internal and external alignment)-850

nm-2.125 G multirate-–2.5 dBm-–9.5dBm-–17 dBm-LC (private)-
multimode-0.5 km

34060049 Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-–9.5 dBm-–17

dBm-LC-–0.55 km

34060050 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-–3 dBm-–9 dBm-–20

dBm-LC-–10 km

B-6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description B Labels

Optical Optical Type

Module Code

34060207 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-

LC-–40 km

34060051 Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-–4 dBm-–22 dBm-

LC-–70 km

34060287 Optical transceiver-SFP-1310 nm-STM-1-–14 dBm-–19 dBm-–30 dBm-

LC (TX disable)-2 km

34060053 Optical transceiver-SFP-1310 nm-STM-1-–8 dBm-–15 dBm-–28 dBm-

LC-15 km

34060209 Optical transceiver-SFP-1310 nm-STM-1-0 dBm-–5 dBm-–34 dBm-

LC-40 km

B.3 Engineering Labels

The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications.

The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications. Table B-3 lists the Huawei engineering specifications for
engineering labels.

For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent Optical
Transmission System Installation Guide.

Table B-3 Huawei specifications for engineering labels

Label Illustration Suggestion

Engineer (1) On the loaded cabinet side, the label

TO:
ing A01 -48V2
TO: marked "A01/B08-–48V2" on the cable
B03 -48V2
labels for B08 indicates that the cable is –48V2 DC power
power supply, which is from the eighth connecter
cables on the second row of the –48V bus bar in
the cabinet on Row A, and Column 1 in the
(1) (2)
equipment room.
(1) Indicates the label on the loaded (2) On the distribution unit side, the label
cabinet side, which carries the marked "B03--48V2" indicates that the
information about the position of cable is –48V2 DC power supply, which is
the cable on the power distribution from the loaded cabinet on Row B, Column
unit. 03 in the equipment room. For PGND and
(2) Indicates the label on the BGND, it is only necessary to give the row
distribution unit side, which carries and column of the power distribution unit,
the information about the position instead of the specific serial number of the
of the cable on the loaded cabinet terminal block on the copper bar.
side.

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 OptiX OSN 1500 Intelligent Optical Transmission System
B Labels Hardware Description

Label Illustration Suggestion

Engineer The external alarm cables are connected to

ing the first subscriber cabinet of each row
labels for (used for power distribution). Engineering
alarm labels posted on the first cabinet of each
external row should indicate which equipment is
cables using the access terminal. Engineering
labels are not needed on the equipment side
unless there are special requirements.
The label marked "A01" indicates that the
alarm cable connects the first cabinet and
the cabinet on Row A, Column 01 in the
equipment room.

Engineer "A01-03-06-05" indicates that on the local

ing end of the Ethernet cable is connected to
labels for Ethernet Port 05, Slot 6, Frame 03 of the
Ethernet cabinet on Row A, Column 01 in the
cables equipment room.
"B02-03-12" indicates that the other end of
the Ethernet cable is connected to Ethernet
Port 12, Frame 03 of the cabinet on Row
B, Column 02 in the equipment room. No
slot number is specified.

Engineer "A01-01-05-05-R" indicates that the local

ing end of the fiber jumper is connected with
labels for Optical Receiving Interface 05 on Slot 5,
fibers Frame 01 in the cabinet on Row A, Column
that 01 in the equipment room.
connect "G01-01-01-01-T" indicates that the
equipme opposite end of the fiber jumper is
nt connected with optical transmitting
interface 01 on Slot 01, Frame 01 in the
cabinet on Row G, Column 01 in the
equipment room.

Labels "ODF-G01-01-01-R" indicates that the

for fibers local end of the fiber jumper is connected
that to the optical receiving terminal on Row
connect 01, Column 01 of the ODF in Row G
the Column 01 in the equipment room.
equipme "A01-01-05-05-R" indicates that the other
nt to the end of the fiber jumper is connected to
ODF optical receiving interface 5 on Slot 05,
frame 01 in the cabinet on Row A, Column
01 in the equipment room.

B-8 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description B Labels

Label Illustration Suggestion

Labels "A01-03-01-01-R" indicates that local end

for trunk of the trunk cable connects with the
cables receiving terminal of Trunk Cable 01 in
that Slot 01, Frame 03 of the cabinet on Row
connect A, Column 01 in the equipment room.
the "DDF-G01-01-01-AR" indicates that the
equipme opposite end of the trunk cable connects
nt to the the receiving terminal of Direction A
ODF (connected to optical network equipment)
on Row 01, Column 01 of the DDF on Row
G and Column 01 in the equipment room.

Engineer "A01-03-01-01" indicates that the local

ing end of the subscriber cable connects with
labels for TO:
Terminal 01 on Slot 1, Frame 03 of the
subscrib cabinet on Row A, Column 01 in the
er cables equipment room.
"MDF-G01-01-01" indicates that the
opposite end of the cable connects with the
terminal on Row 01, Column 01 of the
MDF on Row G, Column 01 in the
equipment room.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential B-9

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description C Power Consumption and Weight of Boards

C Power Consumption and Weight of Boards

Different boards have different power consumption and weight.

Table C-1 lists the power consumption and weight of the boards.

Table C-1 Power consumption and weight of the boards

Board Power Weight Board Power Weig
Consumption (W) (kg) Consumption ht
(W) (kg)

SDH Processing Boards

N1SLT1 15 1.2 N1SLQ4 16 1.0

N1SLQ1 15 1.0 N1SLQ4A 17 1.0

N1SLQ1A 17 1.0 N2SLQ4 16 1.0

N2SLQ1 15 1.0 N1SLD4 15 1.0

R1SLQ1 12 0.54 N1SLD4A 17 1.0

N1SL1, 14 1.0 N2SLD4 15 1.0

N2SL1

N1SL1A 17 1.0 R1SLD4 11 0.5

R1SL1 10 0.5 N1SL4, 15 1.0

N2SL4

N1SF16 26 1.1 N1SL4A 17 1.0

N1SL16, 20 1.1 R1SL4 10 0.5

N2SL16

N3SL16 22 1.1 N1SL16A, 20 1.1

N2SL16A

N1SEP1 17 1.0 N3SL16A 17 0.9

Interface Boards and Protection Switching Boards

Issue 02 (2007-03-29) Huawei Proprietary and Confidential C-1

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 OptiX OSN 1500 Intelligent Optical Transmission System
C Power Consumption and Weight of Boards Hardware Description

Board Power Weight Board Power Weig

Consumption (W) (kg) Consumption ht
(W) (kg)

N1EU08 11 0.4 N1ETS8 0 (before the TPS 0.4

switching); 3 (after
the TPS switching)

N1MU04 2 0.4 N1TSB4 3 0.3

N1OU08 6 0.4 N1TSB8 0 (before the TPS 0.3

switching); 5 (after
the TPS switching)

N2OU08 6 0.4 N1C34S 0 (before the TPS 0.3

switching); 2 (after
the TPS switching)

N1EU04 6 0.4 N1D12S 0 (before the TPS 0.4

switching); 9 (after
the TPS switching)

R1L75S 5 0.3 N1D34S 0 (before the TPS 0.4

switching); 2 (after
the TPS switching)

R1L12S 3 0.2 N1D75S 0 (before the TPS 0.4

switching); 6 (after
the TPS switching)

N1DM12 0 (before the TPS 0.5 N1D12B 0 0.3

switching); 8 (after
the TPS switching)

N1ETF8 2 0.4 - - -

Data Processing Boards

N1EGS4 70 1.1 N1EFF8 6 0.4

N3EGS4 70 1.1 N1EFS0 35 1.0

N2EGS4A 53 1.1 N2EFS0 35 1.0

N2EGR2 40 1.1 N4EFS0 35 1.0

N2EGS2 43 1.0 N1EFS4 30 1.0

N1EGT2 29 0.9 N2EFS4 30 1.0

N2EMR0 50 1.2 N1ADQ1 41 1.0

N1EMS4 65 (without an 1.1 N1ADL4 41 0.9

interface board); 75
(with an interface
board)

R1EFT4 14 0.5 N1MST4 26 0.9

C-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description C Power Consumption and Weight of Boards

Board Power Weight Board Power Weig

Consumption (W) (kg) Consumption ht
(W) (kg)

N1EFT8 26 1.0 N1IDL4 41 1.0

N1EFT8A 26 1.0 N1IDQ1 41 1.0

Cross-connect and System Control Boards

Q2CXL16 40 1.1 R1CXLQ 50 1.0

, Q2CXL4, 4,
Q2CXL1 R1CXLQ
1,
R1CXLD
4,
R1CXLD
1,
R1CXLL1
6,
R1CXLL4
,
R1CXLL1

Q3CXL16 46 1.2 - - -
, Q3CXL4,
Q3CXL1

Other Boards

N1LWX 30 1.1 TN11CM 0.2 0.8

R2

N1MR2B 0 1.0 TN11CM 0.2 0.9

R4

N1MR2C 0 1.0 N1FIB 0 0.4

TN11MR 0.2 0.9 TN11OB 16 1.3

2 U1

TN11MR 0.2 0.9 R1FAN 20 1.0

4

N1BA2 20 1.0 AUX 19 1.0

N1BPA 20 1.0 R1AMU 8 0.5

N2BPA 11 1.2 EOW 10 0.4

PIU, PIUA 2 1.3 - - -

Issue 02 (2007-03-29) Huawei Proprietary and Confidential C-3

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description D Board Version Configuration

D Board Version Configuration

This chapter describes the version compatibility for each board.

Table D-1 lists the board versions that are compatible with the OptiX OSN products.

Table D-1 Board versions that are compatible with the OptiX OSN products

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

N1SL64 Y Y Y N Y N N

N2SL64 N Y Y N Y N N

T2SL64 Y N N N N N N

T2SL64A Y N N N N N N

N1SF64 Y Y Y N Y N N

N1SLD64 Y Y Y N N N N

N1SL16 Y Y Y Y N Y Y

N2SL16 Y Y Y Y Y Y Y

N3SL16 Y Y Y Y Y Y Y

N1SL16A Y Y Y Y N Y Y

N2SL16A Y Y Y Y N Y Y

N3SL16A Y Y Y Y Y Y Y

N1SLD16 N Y Y N N N N

N1SLQ16 Y Y Y N N N N

N2SLQ16 Y Y Y N N N N

N1SF16 Y Y Y Y Y Y Y

Issue 02 (2007-03-29) Huawei Proprietary and Confidential D-1

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
D Board Version Configuration Hardware Description

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

N1SL4 Y Y Y Y N Y Y

N2SL4 Y Y Y Y N Y Y

N1SL4A Y Y Y Y N Y Y

R1SL4 N N N Y N Y Y

N1SLQ4 Y Y Y Y N Y Y

N2SLQ4 Y Y Y Y N Y Y

N1SLQ4A Y Y Y Y N Y Y

N1SLD4 Y Y Y Y N Y Y

N2SLD4 Y Y Y Y N Y Y

N1SLD4A Y Y Y Y N Y Y

R1SLD4 N N N Y N Y Y

N1SLT1 Y Y Y Y N Y Y

N1SLQ1 Y Y Y Y N Y Y

N2SLQ1 Y Y Y Y N Y Y

N1SLQ1A Y Y Y Y N Y Y

R1SLQ1 N N N Y N Y Y

N1SL1 Y Y Y Y N Y Y

N2SL1 Y Y Y Y N Y Y

N1SL1A Y Y Y Y N Y Y

R1SL1 N N N Y N Y Y

N1SLH1 Y Y Y N N N N

N1SEP1 Y Y Y Y N Y Y

N2SLO1 Y Y Y Y N Y Y

R1PL1 N N N N N Y Y

R1PD1 N N N Y N Y Y

R2PD1 N N N Y N Y Y

N1PQ1 Y Y Y Y N N Y

N2PQ1 Y Y Y Y N N Y

D-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description D Board Version Configuration

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

N1PQM Y Y Y Y N N Y

N1PL3 Y Y Y Y N N Y

N2PL3 Y Y Y Y N N Y

N1PL3A Y Y Y Y N Y Y

N2PL3A Y Y Y Y N Y Y

N1PD3 Y Y Y Y N N Y

N2PD3 Y Y Y Y N N Y

N2PQ3 Y Y Y Y N N Y

N1DX1 Y Y Y Y N N Y

N1DXA Y Y Y Y N Y Y

N1SPQ4 N Y Y Y N N Y

N2SPQ4 Y Y Y Y N N Y

R1EFT4 N N N Y N Y Y

N1EFT8 Y Y Y Y N Y Y

N1EFT8A Y Y Y Y N Y Y

N1EGT2 Y Y Y Y N Y Y

N1EFS0 N Y Y Y N N Y

N2EFS0 Y Y Y Y N N Y

N4EFS0 Y Y Y Y N N Y

N1EFS4 Y Y Y Y N Y Y

N2EFS4 Y Y Y Y N Y Y

N2EGS2 Y Y Y Y N Y Y

N1EMS4 Y Y Y Y N Y Y

N1EGS4 Y Y Y Y N Y Y

N2EGR2 Y Y Y Y N Y Y

N2EMR0 Y Y Y Y N Y Y

N1EAS2 Y Y Y N N N N

N1ADL4 Y Y Y Y N Y Y

Issue 02 (2007-03-29) Huawei Proprietary and Confidential D-3

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
D Board Version Configuration Hardware Description

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

N1ADQ1 Y Y Y Y N Y Y

N1IDL4 Y Y Y Y N Y Y

N1IDQ1 Y Y Y Y N Y Y

N1MST4 Y Y Y Y N Y Y

N1EU08 Y Y Y Y N N Y

N1OU08 Y Y Y Y N N Y

N2OU08 Y Y Y Y N N Y

N1D75S Y Y Y Y N N Y

N1MU04 Y Y Y Y N N Y

N1D34S Y Y Y Y N N Y

N1C34S Y Y Y Y N N Y

N1EU04 N Y Y Y N N Y

N1D12S Y Y Y Y N N Y

N1D12B Y Y Y Y N N Y

R1L12S N N N N N Y N

R1L75S N N N N N Y N

N1EFF8 Y Y Y Y N N Y

N1ETF8 Y Y Y Y N N Y

N1ETS8 Y Y Y Y N N Y

N1DM12 Y Y Y Y N N Y

N1TSB4 N Y Y Y N N Y

N1TSB8 Y Y Y Y N N Y

Q2CXL1 N N N Y N Y Y

Q3CXL1 N N N Y N Y Y

Q2CXL4 N N N Y N Y Y

Q3CXL4 N N N Y N Y Y

Q2CXL16 N N N Y N Y Y

Q3CXL16 N N N Y N Y Y

D-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description D Board Version Configuration

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

T1GXCSA Y N N N N N N

N1GXCSA N Y Y N N N N

T1EXCSA Y N N N N N N

N1EXCSA N Y Y N N N N

T2UXCSA Y N N N N N N

N1UXCSA N Y Y N N N N

N1UXCSB N Y Y N N N N

T1SXCSA Y N N N N N N

T2SXCSA Y N N N N N N

N1SXCSA N Y Y N N N N

N1SXCSB N Y Y N N N N

T1IXCSA Y N N N N N N

N1IXCSA N Y Y N N N N

N1IXCSB N Y Y N N N N

N1XCE N Y Y N N N N

N1GSCC N Y N N N N N

N2GSCC Y N N N N N N

N3GSCC Y Y Y N N N N

N4GSCC Y Y Y N N N N

CRG N N N N Y N N

T1EOW Y N N N N N N

R1EOW N N N N N Y Y

T1AUX Y N N N N N N

N1AUX N Y Y N N N N

R1AUX N N N N N Y Y

R2AUX N N N N N Y Y

R1AMU N N N N N Y Y

Q1SAP N N N Y Y N N

Issue 02 (2007-03-29) Huawei Proprietary and Confidential D-5

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
D Board Version Configuration Hardware Description

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

Q2SAP N N N Y Y N N

Q1SEI N N N Y Y N N

N1FAN N Y Y Y Y N N

R1FAN N N N N N Y Y

N1FANA Y Y Y N N N N

TN11CMR Y Y Y Y N Y Y
2

TN11CMR Y Y Y Y N Y Y
4

TN11MR2 Y Y Y Y N Y Y

TN11MR4 Y Y Y Y N Y Y

N1MR2A Y Y Y Y N Y Y

N1MR2B N N N Y N Y Y

N1MR2C Y Y Y Y N N Y

N1LWX Y Y Y Y N Y Y

TN11OBU1 Y Y Y Y Y Y Y

N1FIB Y Y Y Y Y Y Y

N1BA2 Y Y Y Y Y Y Y

N1BPA Y Y Y Y Y Y Y

N2BPA Y Y Y Y Y Y Y

61COA Y Y Y Y Y Y Y

62COA Y Y Y Y Y Y Y

N1COA Y Y Y Y Y Y Y

N1DCU Y Y Y N Y N N

N2DCU Y Y Y N Y N N

UPM N N N Y Y Y Y

T1PIU Y N N N N N N

N1PIU N Y Y N N N N

Q1PIU N N N Y Y N N

D-6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description D Board Version Configuration

Product OptiX OptiX OptiX OptiX OptiX OptiX OptiX

OSN OSN OSN OSN OSN OSN OSN
7500 3500 3500T 2500 2500 1500A 1500B
REG

R1PIU N N N N N Y Y

R1PIUA N N N N N Y N

Issue 02 (2007-03-29) Huawei Proprietary and Confidential D-7

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description E Board Loopbacks

E Board Loopbacks

The SDH, PDH, data processing board for the OptiX OSN equipment support various types of
loopbacks.
In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of
supporting the loopbacks.

Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment
Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop

Q2SL1 Supported. Supported. Supported. Not supported.

Q2SL4 Supported. Supported. Supported. Not supported.

Q2SL16 Supported. Supported. Supported. Not supported.

N1SL64 Supported. Supported. Supported. Supported.

N2SL64 Supported. Supported. Not supported. Not supported.

T2SL64 Supported. Supported. Not supported. Not supported.

T2SL64A Supported. Supported. Not supported. Not supported.

N1SF64 Supported. Supported. Supported. Supported.

N1SLD64 Supported. Supported. Supported. Supported.

N1SL16 Supported. Supported. Supported. Not supported.

N2SL16 Supported. Supported. Not supported. Not supported.

N3SL16 Supported. Supported. Supported. Supported.

N1SL16A Supported. Supported. Supported. Not supported.

N2SL16A Supported. Supported. Not supported. Not supported.

N3SL16A Supported. Supported. Supported. Supported.

N1SLD16 Supported. Supported. Supported. Supported.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential E-1

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 OptiX OSN 1500 Intelligent Optical Transmission System
E Board Loopbacks Hardware Description

Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop

N1SLQ16 Supported. Supported. Supported. Supported.

N2SLQ16 Supported. Supported. Not supported. Not supported.

N1SF16 Supported. Supported. Supported. Not supported.

N1SL4 Supported. Supported. Supported. Not supported.

N1SL4A Supported. Supported. Supported. Supported.

N2SL4 Supported. Supported. Not supported. Not supported.

R1SL4 Supported. Supported. Supported. Not supported.

N1SLQ4 Supported. Supported. Supported. Not supported.

N1SLQ4A Supported. Supported. Supported. Supported.

N2SLQ4 Supported. Supported. Not supported. Not supported.

N1SLD4 Supported. Supported. Supported. Not supported.

N1SL4DA Supported. Supported. Supported. Supported.

N2SLD4 Supported. Supported. Not supported. Not supported.

R1SLD4 Supported. Supported. Supported. Not supported.

N1SLT1 Supported. Supported. Supported. Not supported.

N1SLQ1 Supported. Supported. Supported. Not supported.

N1SLQ1A Supported. Supported. Supported. Supported.

N2SLQ1 Supported. Supported. Not supported. Not supported.

R1SLQ1 Supported. Supported. Supported. Not supported.

N1SL1 Supported. Supported. Supported. Not supported.

N1SL1A Supported. Supported. Supported. Supported.

N2SL1 Supported. Supported. Not supported. Not supported.

R1SL1 Supported. Supported. Supported. Not supported.

N1SLH1 Supported. Supported. Supported. Not supported.

N1SEP1 Supported. Supported. Supported. Not supported.

N2SLO1 Supported. Supported. Not supported. Not supported.

In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of
inserting the AUAIS to port.

E-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description E Board Loopbacks

Table E-2 the capability of inserting the AUAIS to port

Board insert the insert the insert the insert the
AUAIS to port AUAIS to port AUAIS to port AUAIS to
(Port Inloop) (Port Outloop) (VC-4 Inloop) port(VC-4
Outloop)

Q2SL1 Not supported. Supported. Not supported. Not supported.

Q2SL4 Not supported. Supported. Not supported. Not supported.

Q2SL16 Not supported. Supported. Not supported. Not supported.

N1SL64 Supported. Supported. Supported. Supported.

N2SL64 Not supported. Supported. Not supported. Not supported.

T2SL64 Not supported. Supported. Not supported. Not supported.

T2SL64A Not supported. Supported. Not supported. Not supported.

N1SF64 Supported. Supported. Supported. Supported.

N1SLD64 Supported. Supported. Supported. Supported.

N1SL16 Not supported. Supported. Not supported. Not supported.

N2SL16 Not supported. Supported. Not supported. Not supported.

N3SL16 Supported. Supported. Supported. Supported.

N1SL16A Not supported. Supported. Not supported. Not supported.

N2SL16A Not supported. Supported. Not supported. Not supported.

N3SL16A Supported. Supported. Supported. Supported.

N1SLD16 Supported. Supported. Supported. Supported.

N1SLQ16 Supported. Supported. Supported. Supported.

N2SLQ16 Not supported. Supported. Not supported. Not supported.

N1SF16 Not supported. Supported. Not supported. Not supported.

N1SL4 Not supported. Supported. Not supported. Not supported.

N1SL4A Not supported. Supported. Not supported. Supported.

N2SL4 Not supported. Supported. Not supported. Not supported.

R1SL4 Not supported. Supported. Not supported. Not supported.

N1SLQ4 Not supported. Supported. Not supported. Not supported.

N1SLQ4A Not supported. Supported. Not supported. Supported.

N2SLQ4 Not supported. Supported. Not supported. Not supported.

N1SLD4 Not supported. Supported. Not supported. Not supported.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential E-3

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 OptiX OSN 1500 Intelligent Optical Transmission System
E Board Loopbacks Hardware Description

Board insert the insert the insert the insert the

AUAIS to port AUAIS to port AUAIS to port AUAIS to
(Port Inloop) (Port Outloop) (VC-4 Inloop) port(VC-4
Outloop)

N1SL4DA Not supported. Supported. Not supported. Supported.

N2SLD4 Not supported. Supported. Not supported. Not supported.

R1SLD4 Not supported. Supported. Not supported. Not supported.

N1SLT1 Not supported. Supported. Not supported. Not supported.

N1SLQ1 Not supported. Supported. Not supported. Not supported.

N1SLQ1A Not supported. Supported. Not supported. Supported.

N2SLQ1 Not supported. Supported. Not supported. Not supported.

R1SLQ1 Not supported. Supported. Not supported. Not supported.

N1SL1 Not supported. Supported. Not supported. Not supported.

N1SL1A Not supported. Supported. Not supported. Supported.

N2SL1 Not supported. Supported. Not supported. Not supported.

R1SL1 Not supported. Supported. Not supported. Not supported.

N1SLH1 Not supported. Supported. Not supported. Not supported.

N1SEP1 Not supported. Supported. Not supported. Not supported.

N2SLO1 Not supported. Supported. Not supported. Not supported.

In the case of the PDH boards for the OptiX OSN equipment, Table E-3 lists the capability of
supporting the loopbacks.

Table E-3 Loopbacks of the PDH boards for the OptiX OSN equipment
Board Port Inloop Port Outloop

R1PL1 Supported. Supported.

R1PD1 Supported. Supported.

N1PQ1 Supported. Supported.

N1PQM Supported. Supported.

N1PD3 Supported. Supported.

N1PL3 Supported. Supported.

N2PQ3 Supported. Supported.

N2SPQ4 Supported. Supported.

E-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description E Board Loopbacks

In the case of the Ethernet boards for the OptiX OSN equipment, Table E-4 lists the capability
of supporting the loopbacks.

Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment
Board MAC MAC PHY PHY VC-4 VC-3
Layer Layer Layer Layer Inloop, Inloop,
Outloop Inloop Outloop Inloop VC-4 VC-3
Outloop Outloop

N1EFS Not Supported. Not Supported. Not Supported.

4 supported. supported. supported.

N2EFS Not Supported. Not Supported. Not Supported.

4 supported. supported. supported.

N1EFS Not Supported. Not Supported. Not Supported.

0 supported. supported. supported.

N2EFS Not Supported. Not Supported. Not Supported.

0 supported. supported. supported.

N4EFS Not Supported. Not Supported. Not Supported.

0 supported. supported. supported.

N1EGT Not Supported. Not Supported. Not Not

2 supported. supported. supported. supported.

N1EFT Not Supported. Not Supported. Not Supported.

8 supported. supported. supported.

N1EFT Not Supported. Not Supported. Not Supported.

8A supported. supported. supported.

R1EFT Not Supported. Not Supported. Not Supported.

4 supported. supported. supported.

N1EMS Not Not Not Supported. Not Not

4 supported. supported. supported. supported. supported.

N1EGS Not Not Not Supported. Not Not

4 supported. supported. supported. supported. supported.

N3EGS Not Not Not Supported. Not Not

4 supported. supported. supported. supported. supported.

N2EGR Not Supported. Not Supported. Not Not

2 supported. supported. supported. supported.

N1EAS Not Supported. Not Supported. Not Not

2 supported. supported. supported. supported.

N2EMR Not Supported. Not Supported. Not Not

0 supported. supported. supported. supported.

N1MST Not Not Not Supported. Not Not

4 supported. supported. supported. supported. supported.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential E-5

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 OptiX OSN 1500 Intelligent Optical Transmission System
E Board Loopbacks Hardware Description

In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-5 lists the capability
of supporting the loopbacks.

Table E-5 Loopbacks of the ATM/IMA boards for the OptiX OSN equipment
Board External Port External Port Internal Port Internal Port
Outloop Inloop Outloop Inloop

N1ADL4 Not supported. Supported. Supported. Supported.

N1ADQ1 Not supported. Supported. Supported. Supported.

N1IDL4 Not supported. Supported. Supported. Supported.

N1IDQ1 Not supported. Supported. Supported. Supported.

E-6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description F Board Configuration Reference

F Board Configuration Reference

The T2000 can be used to configure various parameters for SDH boards, PDH boards, data
processing boards, and cross-connect and timing boards.

F.1 SDH Processing Boards

The parameters that can be configured for the SDH processing boards include the J0 byte, J1
byte and C2 byte.
F.2 PDH Processing Board
The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2
byte , V5 byte and tributary loopback.
F.3 Data Processing Board
The parameters that should be set for data processing boards include SDH parameters, Ethernet
parameters and ATM parameters.
F.4 Cross-Connect and Timing Unit
The clock parameters should be set on the cross-connect and timing unit.

Issue 02 (2007-03-29) Huawei Proprietary and Confidential F-1

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 OptiX OSN 1500 Intelligent Optical Transmission System
F Board Configuration Reference Hardware Description

F.1 SDH Processing Boards

The parameters that can be configured for the SDH processing boards include the J0 byte, J1
byte and C2 byte.

J0 Byte
J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receive
end learns that it is in the continuous connection with the specified transmit end. The value of
J1 is "□" by default.

J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection with the specified transmit end in this channel. When the receive end
detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm.

Set the J1 byte as " HuaWei SBS " for the SL01 and as "□" for all other boards.

NOTE

By default, the J1 byte is " HuaWei SBS ". One space is present before "HuaWei SBS" and five behind.

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.

Table F-1 lists the mapping relation between the service type and setting of the C2.

Table F-1 Mapping relation between the service type and setting of the C2

Input Service Type C2 Byte (in Hex)

TUG structure 02

34M/45M asynchronously mapped into 04

a C-3

140M asynchronously mapped into a 12

C-4

Unequipped 00

F.2 PDH Processing Board

The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2
byte , V5 byte and tributary loopback.

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J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the higher order access point
identifiers in a successive manner. Hence, the receive end learns that it is in the continuous
connection with the specified transmit end. When the receive end detects the J1 mismatch, the
corresponding VC-4 channel generates an HP_TIM alarm.

By default, the J1 byte is set to "□".

NOTE

By default, the J1 byte is "HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.

Table F-2 lists the mapping relation between the service type and setting of the C2.

Table F-2 Mapping relation between the service type and setting of the C2

Input Service Type C2 Byte (in Hex)

TUG structure 02

34M/45M asynchronously mapped into 04

a C-3

140M asynchronously mapped into a 12

C-4

Unequipped 00

J2 Byte
The J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lower
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection to the specified transmit end in this channel.

V5 Byte
The V5 is a channel status and signal identification byte. This byte is used to detect bit error and
indicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms are
generated accordingly. Table F-3 lists the mapping relation between the service type and setting
of the V5.

Table F-3 Mapping relation between the service type and setting of the V5

Input Service Type V5 Byte (in Hex)

Asynchronization 02

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F Board Configuration Reference Hardware Description

Input Service Type V5 Byte (in Hex)

Byte synchronization 04

HDLC/PPP mapping 0A

Unequipped or Supervisory-Unequipped 00

Equipping Indication
When a service channel just carries the service and does not process the service, select
Unequipped or Supervisory-Unequipped.
When a service channel carries the service and also processes the service, select Equipped-
Unspecific Payload.

Tributary Loopback
The tributary loopback function is used to locate faults in the service channels.
The tributary loopback is also a diagnosis function. When the tributary loopback is performed,
related services are interrupted.

Path Service Type

This parameter is set to specify service type for the channel.
l Select E1 or T1 for E1/T1 processing boards according to the actual service type in the
channel.
l Select E3 or T3 for E3/T3 processing boards according to the actual service type in the
channel.

Serial Port Protocol Mode

For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includes
V.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source Management

The timing scheme and working clock source can be set for the DX1.
l Set the timing scheme of the DDN channels 10–12 and 14–16 to the DCE internal scheme,
DCE slave scheme or DTE external scheme.
l Set the timing scheme of the DDN channels 9 and 13 to the DCE internal scheme, DCE
slave scheme, DTE external scheme, DTE internal scheme, DTE slave scheme or DCE
external scheme. By default, the timing scheme is the DCE internal scheme for channels 9
and 13 is the DCE internal scheme.

F.3 Data Processing Board

The parameters that should be set for data processing boards include SDH parameters, Ethernet
parameters and ATM parameters.

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F.3.1 SDH Parameters

The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,
J2 byte and V5 byte.
F.3.2 Ethernet Parameters
The Ethernet parameters that should be set for the Ethernet boards include the working mode
and LCAS state.
F.3.3 ATM Parameter
The ATM parameters that the ATM boards should be set include port type and flow type.

F.3.1 SDH Parameters

The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,
J2 byte and V5 byte.

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner.
Hence, the receive end learns that it is in the continuous connection to the specified transmit end
in this path.
When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3
path and the HP_TIM in the VC-4 path.
If the J1 byte is of the default value, "□", these alarms are not reported.

NOTE

l For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1
byte is "□".
l For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
In case of the C2 mismatch, the LP_SLM alarm is generated in the VC-3 path and the HP_SLM
alarm is generated in the VC-4 path.

J2 Byte
The J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lower
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection to the specified transmit end in this path.
In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path.
If the J1 byte is of the default value, "□", these alarms are not reported.

V5 Byte
The V5 is a path status and signal identification byte. This byte is used to detect bit error and
indicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms are
generated accordingly.

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When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12
path.
Table F-4 lists the mapping relation between the service type and setting of the V5.

Table F-4 Mapping relation between the service type and setting of the V5
Input Service Type V5 Byte (in Hex)

Asynchronization 02

Byte synchronization 04

HDLC/PPP mapping 0A

Unequipped or Supervisory-Unequipped 00

F.3.2 Ethernet Parameters

The Ethernet parameters that should be set for the Ethernet boards include the working mode
and LCAS state.

Working Mode
Generally, the interconnected equipment should work in the same fixed working mode. If the
working modes at both ends mismatch, packets may be lost or the rate becomes less. In case of
large volume of data, services may be even interrupted.
For EAS2, set the working mode 10G full-duplex.
For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex.
For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex.
For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M full-
duplex, 100M half full-duplex or 100M full-duplex.
For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or
1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex,
10M full-duplex, 100M half full-duplex or 100M full-duplex.

LCAS State
Enable or disable the LCAS.

Maximum Packet Length

For external ports, set the maximum packet length, which is 1522-byte by default.

Mapping Protocol
The mapping protocols of the interconnected equipment should be the same.
For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS and
GFP-F. By default, the mapping protocol is GFP-F.

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Choose the GFP-F mapping protocol for the EGS2, EFS4, EFS0 and EAS2.
For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mapping
protocol is GFP-F.
Choose the GFP-T mapping protocol for the MST4.

TAG Flag
The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware,
Access and Hybrid.
1. When the TAG flag is set as the TAG Aware for a port, the port transparently transmits the
packets with a TAG and discards the packets without a TAG.
2. When the TAG flag is set as Access for a port, the port adds a TAG to the received packets
that does not contain any TAG according to the VLAN ID of the port, and discards the
packets that contain a TAG.
3. When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAG
or without any TAG. In this case, the port adds a TAG to the received packets that does
not contain any TAG according to the VLAN ID of the port.

VLAN ID
Set the default VLAN ID of the local port.

Port Type
For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE)
indicates the edge port of the service provider and provider (P) indicates the core network port
of the service provider. When configuring the EVPL and EVPLAN services, set this parameter.
Set the external port to PE and the internal port to P.

Port Encapsulation Format

The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the P
type, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. For
EVPLAN services, set the encapsulation format to stack VLAN.

Port Attribute
For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Aware
or C-Aware.

F.3.3 ATM Parameter

The ATM parameters that the ATM boards should be set include port type and flow type.

Port Type
The port types include NNI and UNI (default).

Flow Type
The flow type should meet the requirements of the port.

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Service Type
There are four service types, CBR, rt-VBR, nrt-VBR, and UBR.

Peak Cell Rate

Set the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.

Sustainable Cell Rate

Set the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrt-
VBR services.

Maximum Cell Burst Size

Set the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBR
and nrt-VBR services.

Cell Delay Variation Tolerance

Set the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set on
CBR, rt-VBR and UBR services.

F.4 Cross-Connect and Timing Unit

The clock parameters should be set on the cross-connect and timing unit.
Set the following parameters when synchronization status message (SSM) is not enabled and
the external clock is unavailable.
l Reference clock source
l Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled.
l Reference clock source
l Reference clock source level
l Building integrated timing supply (BITS) type
l S1 byte
l Threshold for selecting the clock in case of the switching protection

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Hardware Description G Glossary

G Glossary

This document defines the following terms:

1:N protection A 1:N protection architecture has N normal traffic signals, N working
SNCs/trails and one protection SNC/trail. It may have one extra traffic
signal.

1+1 protection A 1+1 protection architecture has one normal traffic signal, one working
SNC/trail, one protection SNC/trail and a permanent bridge.

100Base-TX Physical Layer specification for a 100 Mbit/s CSMA/CD local area
network over two pairs of Category 5 unshielded twisted-pair (UTP) or
shielded twisted-pair (STP) wire.

10BASE-T Physical Layer specification for a 10 Mb/s CSMA/CD local area

network over two pairs of twisted-pair telephone wire.

19-inch cabinet A cabinet which is 19 inches in width and 600mm in depth, compliant
with the standards of the IEC297.

Add/Drop A multiplexer capable of extracting and inserting lower-rate signals

Multiplexer from a higher-rate multiplexed signal without completely
demultiplexing the signal.

ADM add/drop multiplexer. see add/drop multiplexer.

Administrator A user who has authority to access all the Management Domains of the
EML Core product. He has access to the whole network and to all the
management functionalities.

AIS Alarm Indication Signal. A signal sent downstream in a digital network

if an upstream failure has been detected and persists for a certain time.

Alarm cable The cable which is used to transmit alarm signals.

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Alarm A visible or an audible indication to notify the person concerned that a

failure or an emergency has occurred. See also Event.

AMI Alternate Mark Inversion. The line-coding format in transmission

systems where successive ones (marks) are alternatively inverted (sent
with polarity opposite that of the preceding mark).

APD Avalanche Photodiode. A semiconductor photodetector with integral

detection and amplification stages. Electrons generated at a p/n junction
are accelerated in a region where they free an avalanche of other
electrons. APDs can detect faint signals but require higher voltages than
other semiconductor electronics.

Asynchronous A network where transmission system payloads are not synchronized

and each network terminal runs on its own clock.

ATM Asynchronous Transfer Mode. A transfer mode in which the information

is organized into cells. It is asynchronous in the sense that the recurrence
of cells containing information from an individual user is not necessarily
periodic. It is a protocol within the OSI layer 1. An ATM cell consists
of a 5 octet header followed by 48 octets of data.

Attenuation Reduction of signal magnitude or signal loss, usually expressed in

decibels.

Attenuator A passive component that attenuates an electrical or optical signal.

Attribute Property of an object.

AU administrative unit. see administrative unit

Auto-negotiation The rate/work mode of the communication party set as self-negotiation

is specified through negotiation according to the transmission rate of the
opposite party.

Back up A method to copy the important data into a backing storage in case that
the original is damaged or corrupted.

Backplane A PCB circuit board in the subrack, which is connected with all the
boards in position.

Bandwidth Information-carrying capacity of a communication channel. Analog

bandwidth is the range of signal frequencies that can be transmitted by
a communication channel or network.

BITS Building Integrated Timing Supply. A building timing supply that

minimises the number of synchronization links entering an office.
Sometimes referred to as a synchronization supply unit.

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Board Version A function that enables a board supporting several board IDs. Generally,
Replacement a board of an old version is used to the NE also of an old version, which
Function does not support the board of a new version. When a board of a new
version is used to replace a board of an old version, the former should
work with the ID of the board of the old version. The board of a new
version works on the NE of a new version with the ID of the board of
new version. In this way, the board of the new version has several board
IDs.

Bridge The action of transmitting identical traffic (SPE contents) on both the
working and protection channels.

Broadcast The act of sending a frame addressed to all stations on the network

Cable tie The tape used to bind the cables.

CBR Constant Bit Rate. The Constant Bit Rate service category is used by
connections that request a static amount of bandwidth that is
continuously available during the connection lifetime. This amount of
bandwidth is characterized by a peak cell Rate (PCR) value.

CDVT Cell Delay Variation Tolerance. Information sent in the forward and
backward direction to determine the upper bound of the tolerance
admitted for the time interval between cells pertaining to a given cell
flow. The backward CDVT values included in the IAM and MOD shall
be interpreted as maximum acceptable values for the cell flow in the
backward direction.

Channel spacing The center to center difference in frequency or wavelength between

adjacent channels in a WDM device.

Channel The smallest subdivision of a circuit that provides a type of

communication service; usually a path with only one direction.

Circuit A communications path or network; usually a pair of channels providing

bi-directional communication.

Client A kind of terminal (PC or workstation) connected to a network that can

send instructions to a server and get results through a user interface. See
also server.

Coded Mark This is the STS-3 line code. This is a two level non-return to zero code.
Inversion A binary 1 is coded by either of the amplitude levels, +A or -A, for one
full unit time interval (T) in such a way that the level alternates for
successive binary ones. For a binary zero there is always a positive
transition (-A to +A) at the mid point of the binary unit interval (T/2).

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Configuration data The data that configures the NE hardware for coordination between this
NE and other NEs in the entire network, and for operation of specified
services. Configuration data is the instruction file of NEs, and it is a key
element to ensure that the network runs efficiently. The typical
configuration data includes board configuration, clock configuration
and protection relationship.

Configure To set the basic parameters of an operation object.

Connection A "transport entity" which consists of an associated pair of

"unidirectional connections" capable of simultaneously transferring
information in opposite directions between their respective inputs and
outputs.

Convergence The process of developing a model of the echo path which will be used
in the echo estimator to produce the estimate of the circuit echo.

Conversion In the context of message handling, a transmittal event in which an MTA

transforms parts of a message content from one encoded information
type to another, or alters a probe so it appears that the described messages
were so modified.

Cyclic A technique for using overhead bits to detect transmission errors.

Redundancy
Check

DDF Digital Distribution Frame. A frame which is used to transfer cables.

Dense The higher capacity version of WDM, which is a means of increasing

Wavelength the capacity of fiber-optic data transmission systems through the
Division multiplexing of multiple wavelengths of light. Commercially available
Multiplexing DWDM systems support the multiplexing of from 8 to 40 wavelengths
of light.

Drop The port on a network element where the service to an end customer
may be connected, e.g., a tributary card on a SONET ADM. For
example, a drop for a DS1 customer service may be provided by a VT1.5
card terminating a VT1.5 trail.

Dual-Fed A description of a ring that has entry nodes that add traffic to the ring
via the bridging function.

DWDM Dense Wavelength Division Multiplexing. The technology utilizes the

characteristics of broad bandwidth and low attenuation of single mode
optical fiber, employs multiple wavelengths with specific frequency
spacing as carriers, and allows multiple channels to transmit
simultaneously in the same fiber.

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E13 A funciton used to multiplex E1 signals into E3 signals or to demultipex

E3 signals into E1 signals.

ECC Embedded Control Channel. An ECC provides a logical operations

channel between SDH NEs, utilizing a data communications channel
(DCC) as its physical layer.

EDFA Erbium-Doped Fiber Amplifier. The optical amplifier that its fiber
doped with the rare earth element erbium, which can amplify at 1530 to
1610 nm when the optical amplifier is pumped by an external light
source.

Ejector lever A component at the two ends of the front panel of a board, which is used
for inserting or removing the board.

Encapsulation In 1000BASE-X, the process by which a MAC packet is enclosed within

a PCS code-group stream

EPL Ethernet Private Line. An EPL service is a point-to-point

interconnection between two UNIs without SDH bandwidth
sharing.Transport bandwidth is never shared between different
customers.

ESCON Enterprise System Connection. A path protocol which connects the host
with various control units in an storage system. It is a serial bit stream
transmission protocol. The transmission rate is 200 Mbit/s.

ESD jack Electrostatic discharge jack. A hole in the cabinet or subrack, which
connect the subrack or cabinet to the insertion of ESD wrist strap.

ESD Electrostatic Discharge. The phenomena the energy being produced by

electrostatic resource discharge instantly.

Ethernet A data link level protocol comprising the OSI model's bottom two layers.
It is a broadcast networking technology that can use several different
physical media, including twisted pair cable and coaxial cable. Ethernet
usually uses CSMA/CD. TCP/IP is commonly used with Ethernet
networks.

ETSI European Telecommunications Standards Institute

EVPL Ethernet Virtual Private Line. An EVPL service is a service that is both
a line service and a virtual private service.

Eye pattern A graphic presentation formed by the superimposition of the waveforms

of all possible pulse sequences.

Fan tray assembly A module which contains fans used for heat dissipation.

Fault A fault is the inability of a function to perform a required action. This

does not include an inability due to preventive maintenance, lack of
external resources, or planned actions.

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FC Fiber Channel. A standard of data storage network for transmitting

signals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.

Fiber connector A device mounted on the end of a fiber-optic cable, light source,
receiver, or housing that mates to a similar device to couple light into
and out of optical fibers. A connector joins two fiber ends, or one fiber
end and a light source or detector.

Fiber jumper The fiber which is used to connect the subrack with the ODF.

FICON Fibre Connect. A new generation connection protocol which connects

the host with various control units. It carries single byte command
protocol through the physical path of fiber channel, and provides higher
rate and better performance than ESCON.

Flow An aggregation of packets that have the same characteristics. On the

T2000 or NE software, flow is a group of classification rules. On boards,
it is a group of packets that have the same quality of service (QoS)
operation. At present, two flows are supported: port flow and port +
VLAN flow. Port flow is based on port ID and port + VLAN flow is
based on port ID and VLAN ID. The two flows cannot coexist in the
same port.

Frame A cyclic set of consecutive time slots in which the relative position of
each time slot can be identified.

Free-run mode An operating condition of a clock, the output signal of which is strongly
influenced by the oscillating element and not controlled by servo phase-
locking techniques. In this mode the clock has never had a network
reference input, or the clock has lost external reference and has no access
to stored data, that could be acquired from a previously connected
external reference. Free-run begins when the clock output no longer
reflects the influence of a connected external reference, or transition
from it. Free-run terminates when the clock output has achieved lock to
an external reference.

Full duplex Pertaining to both parties that can send and receive data at the same time
on the communication link.

Gain The ratio between the optical power from the input optical interface of
the optical amplifier and the optical power from the output optical
interface of the jumper fiber, which expressed in dB.

Grooming Consolidating or segregating traffic for efficiency.

Guide rail A groove in the subrack, which ensures the correct connection of a board
to the backplane.

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Half duplex Pertaining to, both parties that only one party can send data, while the
other party can only receive data on the communication link.

IMA frame The IMA frame is used as the unit of control in the IMA protocol. It is
a logical frame defined as M consecutive cells, numbered 0 to M-l,
transmitted on each of the N links in an IMA group.

IMA Inverse Multiplexing for ATM. The ATM inverse multiplexing

technique involves inverse multiplexing and de-multiplexing of ATM
cells in a cyclical fashion among links grouped to form a higher
bandwidth logical link whose rate is approximately the sum of the link
rates. This is referred to as an IMA group.

Interface board The area for the interface boards on the subrack.
area

Isolation A nonreciprocal optical device intended to suppress backward

reflections along an optical fiber transmission line while having
minimum insertion loss in the forward direction.

Jitter Short waveform variations caused by vibration, voltage fluctuations,

control system instability, etc.

Label A mark on a cable, a subrack, or a cabinet for identification.

Laser The device that generates the directional light covering a narrow range
of wavelengths. Laser light is more coherent than ordinary light.
Semiconductor diode lasers are the used light source in fiber-optic
system.

Layer A concept used to allow the transport network functionality to be

described hierarchically as successive levels; each layer being solely
concerned with the generation and transfer of its characteristic
information.

LCAS Link Capacity Adjustment Scheme. A solution features flexible

bandwidth and dynamic adjustment. In addition, it provides a failure
tolerance mechanism, which enhances the viability of virtual
concatenations and enables the dynamic adjustment to bandwidth (non-
service affecting).

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Link A "topological component" that provides transport capacity between

two endpoints in different subnetworks via a fixed (i.e., inflexible
routing) relationship. The endpoints are "subnetwork termination point
pools" for SONET, and link termination points for ATM. Multiple links
may exist between a pair of subnetworks. A link also represents a set of
"link connections".

Loopback The fault of each path on the optical fiber can be located by setting
loopback for each path of the line. There are three kinds of loopback
modes: No loopback, Outloop, Inloop.

Lower subrack The subrack close to the bottom of the cabinet when a cabinet contains
several subracks.

M13 A function used to multiplex T1 signals into T3 signals or to demultiplex

T3 signals into T1 signals.

MAC Media Access Control. The data link sublayer that is responsible for
transferring data to and from the Physical Layer.

Mapping A procedure by which tributaries are adapted into virtual containers at

the boundary of an SDH network.

Mean launched The average power of a pseudo-random data sequence coupled into the
power fiber by the transmitter.

Mounting ear A component on the side of a subrack, which is used to install the subrack
in a cabinet.

MPLS Multiprotocol Label Switching. Multi-protocol label switching. It is a

standard routing and switching technology platform, capable of
supporting various high level protocols and services. The data
transmission over an MPLS network is independent of route calculating.
MPLS, as a connection-oriented transmission technology, guarantees
QoS effectively, supports various network level technologies, and is
independent of the link layer.

MSP The MSP function provides capability for switching a signal between
and including two MST functions, from a working to a protection
channel.

Multicast Transmission of a frame to stations specified by a group address.

Multiplex section A function provides capability for switching a signal between and
protection including two MST functions, from a working to a protection channel.

Multiplex To transmit two or more signals over a single channel.

Multiplexer An equipment which combines a number of tributary channels onto a

fewer number of aggregate bearer channels, the relationship between
the tributary and aggregate channels being fixed.

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Multiplexing A procedure by which multiple lower order path layer signals are
adapted into a higher order path or the multiple higher order path layer
signals are adapted into a multiplex section.

NNI Network Node Interface. NNI identifies the interface between the ATM
network nodes. Compare SDH NNI.

Noise figure The specification to scale the random signal in the system presenting in
addition to any wanted signal.

Non-revertive In non-revertive mode, when a protection switch occurs, the working

service will be switched to the protection service and the status will
remain after it returns normal.

NRZ Non Return to Zero. A digital code in which the signal level is low for
a 0 bit and high for a 1 bit and dose not return to 0 between successive
1 bits.

OADM Optical Add/Drop Multiplexer. A device that can be used to add the
optical signals of various wavelengths to one channel and drop the
optical signals of various wavelengths from one channel.

ODF Optical Distribution Frame. A frame which is used to transfer and spool
fibers.

ONE Optical Network Element. A stand-alone physical entity in an optical

transmission network that supports at least network element functions.

Optical add/drop A process that add the optical signals of various wavelengths to one
multiplexing channel and drop the optical signals of various wavelengths from one
channel.

Optical Amplifier A device or subsystem in which optical signals can be amplified by

means of stimulated emission taking place in an suitable active medium.
It is used to amplify the optical signal of the optical transmission system.

Optical connector A component normally attached to an optical cable or piece of apparatus

for the purpose of providing frequent optical interconnection/
disconnection of optical fibers or cables.

Optical interface A device to allow two or more corresponding optical transmitting units
to be connected.

OTM Optical Terminal Multiplexer. A device that multiplex or demultiplex

optical signals into a transmission link or into the client side.

OTU Optical Transponder Unit. A device that access service signals

compliant with standards at the client side and convert them into
standard DWDM or CWDM wavelengths.

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Output optical The ranger of optical energy level of output signals.

power

Overhead Extra bits in a digital stream used to carry information besides traffic
signals. Orderwire, for example, would be considered overhead
information.

Packing case A case which is used for packing the board or subrack.

Paired Slots Two slots of which the overheads can be passed through by using the
bus on the backplane. When the SCC unit is faulty or offline, the
overheads can be passed through between the paired slots by using the
directly connected overhead bus. When two SDH boards form an MSP
ring, the boards need to be inserted in paired slots so that the K bytes
can be passed through.

Pass-Through The action of transmitting by a node exactly what is received by that

node for any given direction of transmission. A pass-through can be
unidirectional or bidirectional. For BLSRs, a pass-through refers to the
K1 and the K2 bytes and the protection channels. Three types of pass-
through are used in BLSRs: K byte pass through, unidirectional full
pass-through, and bidirectional full pass-through.

Path protection The working principle of path protection: When the system works in
path protection mode, the PDH path uses the dual-fed and signal
selection mode. Through the tributary unit and cross-connect unit, the
tributary signal is sent simultaneously to the east and west lines.
Meanwhile, the cross-connect matrix sends the signal dually sent from
the opposite end to the tributary board through the active and standby
buses, and the hardware of the tributary board automatically and
selectively receive the signal from the two groups of buses automatically
according to the AIS number of the lower order path.

Path A logical connection between the point at which a standard frame format
for the signal at the given rate is assembled, and the point at which the
standard frame format for the signal is disassembled.

PCR Peak Cell Rate. An upper limit on the rate at which cells can be submitted
on an ATM connection.

PDH Plesiochronous Digital Hierarchy. PDH is the digital networking

hierarchy that was used before the advent of Sonet/SDH.

PIN Photodiode. A semiconductor detector with an intrinsic (i) region

separating the p- and n-doped regions. It has fast linear response and is
used in fiber-optic receivers.

Plesiochronous A network with nodes timed by separate clock sources with almost the
same timing.

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Hardware Description G Glossary

Pointer An indicator whose value defines the frame offset of a virtual container
with respect to the frame reference of the transport entity on which it is
supported.

Power unit A direct current power distribution unit at the upper part of a cabinet,
which supplies power for the subracks in the cabinet.

PRBS When there are cross-connections between a line board and a tributary/
data board, many alarms are raised on the tributary/data board if alarms
are raised on the line board. These alarms are all reported to the T2000.
Such a large number of alarms can disturb the troubleshooting and affect
the problem solution efficiency. Therefore, the inter-board alarm
suppression function is used to solve this problem.

Private line Both communication parties are connected permanently.

Procedure A generic term for an action.

Process A generic term for a collection of actions.

Processing board An area for the processing boards on the subrack.

area

Provisioning The process of making available various telecommunications resources

(such as switching systems and transport facilities) for
telecommunication services. Provisioning includes forecasting the
demand for services, determining the additions or changes to the
network that will be needed, determining where and when they will be
needed, and installing all the necessary network elements to provide
such services.

Receiver overload Receiver overload is the maximum acceptable value of the received
average power at point R to achieve a 1 x 10-10 BER.

Receiver Receiver sensitivity is defined as the minimum acceptable value of

sensitivity average received power at point R to achieve a 1 x 10-10 BER.

Reference clock A clock of very high stability and accuracy that may be completely
autonomous and whose frequency serves as a basis of comparison for
the frequency of other clocks.

REG A device that performs regeneration.

Regeneration The process of receiving and reconstructing a digital signal so that the
amplitudes, waveforms and timing of its signal elements are constrained
within specified limits.

Revertive In revertive switching, there is a working and protection line, board and
switching so on. Services always revert back to the original working line or board
if the switch requests are terminated; that is, when the working line or
board has recovered from the fault or the external request is cleared.

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G Glossary Hardware Description

RPR Resilient Packet Ring. A metropolitan area network (MAN) technology

supporting data transfer among stations interconnected in a dual-ring
configuration.

RS232 In the asynchronous transfer mode and there is no hand-shaking signal.

It can communicate with RS232 and RS422 of other stations in point-
to-point mode and the transmission is transparent. Its highest speed is
19.2 kbit/s.

S1 byte The byte defined in ITU-T to transmit the network synchronization

status information.

SAN Storage Area Network. A dedicated high-speed data storage network

which interconnects multiple independent storage systems with multiple
servers through fiber path switch or other switch equipment.

SDH Synchronous Digital Hierarchy. A hierarchical set of digital transport

structures, standardized for the transport of suitably adapted payloads
over physical transmission networks.

Section The portion of a SONET transmission facility, including terminating

points, between (i) a terminal network element and a regenerator or (ii)
two regenerators. A terminating point is the point after signal
regeneration at which performance monitoring is (or may be) done.

Settings Parameters of an operation that can be selected by the user.

SF signal fail.See signal fail.

SFP small form-factor pluggable.see small form-factor pluggable.

Side mode The ratio of the largest peak of the total source spectrum to the second
suppression ratio largest peak.

Side panel The panel on the side of the cabinet.

Signal cable The cable which is used to transmit electrical signals, different from the
power cable or fiber.

Signal fail A signal indicating the associated data has failed in the sense that a near-
end defect condition (not being the degraded defect) is active.

SNCP SubNetwork Connection Protection. A working subnetwork connection

is replaced by a protection subnetwork connection if the working
subnetwork connection fails, or if its performance falls below a required
level.

SNCMP Subnetwork Connection Multi-protection. The source broadcasts

services to multiple paths, and the sink determines which service to
receive according to the service priority and then the service quality.

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Hardware Description G Glossary

SNCTP Subnetwork Connection Tunnel Protection. It provides protection paths

at the VC-4 level. When the working path is faulty, all services in the
working path are switched to the protection path.

Span The set of SONET lines between two adjacent nodes on a ring.

SSM Synchronization Status Message. ITU-T defines S1 byte to transmit the

network synchronization status information. It uses the lower four bits
of the multiplex section overhead S1 byte to indicate 16 types of
synchronization quality grades.

Synchronous A network where transmission system payloads are synchronized to a

master (network) clock and traced to a reference clock.

T2000 The T2000 is a subnet management system (SNMS). In the

telecommunication management network architecture, the T2000 is
located between the NE level and network level, which can supports all
NE level functions and part of the network level management functions.
See also NM.

TCM Tandem Connection Monitor. In the SDH transport hierarchy, the TCM
is located between the AU/TU management layer and HP/LP layer. It
uses the N1/N2 byte of POH overhead to monitor the quality of the
transport channels on a transmission section (TCM section).

TPS Tributary Protection Switching. A function provided by the equipment,

is intended to protect N tributary processing boards through a standby
tributary processing board.

Tray A discal component in the cabinet, which is used to place the chassis or
other equipment.

Tributary A fault location method. A fault can be located for each service path by
loopback performing loopback on each path of the tributary board. There are three
types of loopback modes: Non-loopback, Outloop and Inloop.

TUG tributary unit group.see tributary unit group.

Upload To report all or part of the configuration data of the NE to the T2000
and overwrite the configuration data saved in the NE layer on the T2000.

Upper subrack The subrack close to the top of the cabinet when a cabinet contains
several subracks.

VC virtual container. see virtual container.

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 OptiX OSN 1500 Intelligent Optical Transmission System
G Glossary Hardware Description

Virtual The payload whose transmission bandwidth is bigger than VC4. Virtual
concatenation concatenation combines multiple VC4 payloads (successive or non-
successive) to form a virtual large structure VC4-Xv in cascade mode
for transmission. The transmission of the broadband cascaded payload
is implemented via the virtual cascade, thus improving the SDH
transmission payload bandwidth capability from VC4 to VC4-4C.

VLAN Virtual local area network. A subset of the active topology of a Bridged
Local Area Network. Associated with each VLAN is a VLAN Identifier
(VID).

VPN Virtual Private Network. Enables IP service to be transmitted securely

over a public TCP/IP network by encrypting all service from one
network to another.

Wavelength A means of increasing the capacity of fiber-optic data transmission

Division systems through the multiplexing of multiple wavelengths of light.
Multiplexing WDM systems support the multiplexing of as many as four wavelengths.

G-14 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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Hardware Description H Acronyms and Abbreviations

H Acronyms and Abbreviations

ADM Add/Drop Multiplexer

AMI Alternate Mark Inversion

APS Automatic Protection Switching

ATM Asynchronous Transfer Mode

BITS Building Integrated Timing Supply

CAR Committed Access Rate

CBR Constant Bit Rate

CC Continuity Check

CMI Coded Mark Inversion

COA Case-shaped Optical Amplifier

CPU Central Processing Unit

CRC Cyclic Redundancy Check

DC Direct Current

DCC Data Communication Channel

DCE Data Circuit-terminal Equipment

DCU Dispersion Compensation Unit

DDF Digital Distribution Frame

DTR Data Terminal Ready

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 OptiX OSN 1500 Intelligent Optical Transmission System
H Acronyms and Abbreviations Hardware Description

DVB-ASI Digital Video Broadcast-Asynchronous Serial Interface

DWDM Dense Wavelength Division Multiplexing

ECC Embedded Control Channel

EDFA Erbium-Doped Fiber Amplifier

EMC Electromagnetic Compatibility

EMI Electro Magnetic Interference

EPL Ethernet Private Line

EPLAN Ethernet Private LAN

ESCON Enterprise Systems Connection

ETS European Telecommunication Standards

ETSI European Telecommunications Standards Institute

EVPL Ethernet Virtual Private Line

EVPLAN Ethernet Virtual Private LAN

FC Fiber Channel

FE Fast Ethernet

FEC Forward Error Correction

FICON Fiber Connection

FPGA Field Programmable Gate Array

GE Gigabit Ethernet

GFP Generic Framing Procedure

HDB3 High Density Bipolar of order 3 code

HDLC High level Data Link Control

IEEE Institute of Electrical and Electronics Engineers

IS-IS Intermedia System-Intermedia System

ITU-T International Telecommunication Union - Telecommunication

Standardization Sector

H-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description H Acronyms and Abbreviations

LAPS Link Access Procedure-SDH

LB LoopBack

LCAS Link Capacity Adjustment Scheme

LCT Local Craft Terminal

MPLS Multi-protocol Label Switch

MSP Multiplex Section Protection

MLM Multi-Longitudinal Mode

NA Not available

NRZ Non Return to Zero

OAM Operation Administration and Maintenance

OSPF Open Shortest Path First

PA Power Amplifier

PDH Plesiochronous Digital Hierarchy

PRBS Pseudo-Random Binary Sequence

RAM Random-access Memory

RD Receive Data

RIP Routing Information Protocol

RSTP Rapid Spanning Tree Protocol

SDH Synchronous Digital Hierarchy

SG Signaling Ground

SLM Single- Longitudinal Mode

SNCP Sub-Network Connection Protection

SNCMP Subnetwork Connection Multi-protection

SNCTP Subnetwork Connection Tunnel Protection

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 OptiX OSN 1500 Intelligent Optical Transmission System
H Acronyms and Abbreviations Hardware Description

SSM Synchronization Status Message

TD Transmit Data

TPS Tributary Protection Switching

UBR Unspecified Bit Rate

UPM Uninterruptible Power Modules

VBR Variable Bit Rate

VLAN Virtual Local Area Network

VPN Virtual Private Network

WDM Wavelength Division Multiplexing

H-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Index

Index

A version, 12-2
board
ADL4 barcode, 4-3
configuration reference, 7-119 classification
feature code, 7-119 Amplifier, 4-12
front panel, 7-117 Auxiliary, 4-10
function and feature, 7-114 Compensation, 4-12
principle and signal flow, 7-115 Control, 4-10
technical specifications, 7-120 Data, 4-7
valid slots, 7-119 Interface, 4-9
version, 7-114 PDH, 4-6
ADQ1 Power, 4-12
configuration reference, 7-126 SDH, 4-4
feature code, 7-126 Switching, 4-9
front panel, 7-124 WDM, 4-11
function and feature, 7-121 loopbacks, E-1
principle and signal flow, 7-122 version configuration, D-1
technical specifications, 7-127 BPA
valid slots, 7-126 board feature code, 12-15
version, 7-121 Front Panel, 12-13
AMU function and feature, 12-11
front panel, 10-17 principle and signal flow, 12-12
function and feature, 10-15 technical specification, 12-15
principle and signal flow, 10-15 valid slot, 12-15
technical specification, 10-20 version, 12-10
valid slot, 10-20
version, 10-15 C
AUX
front panel, 10-11 C34S
function and feature, 10-7 front panel, 8-25
principle and signal flow, 10-7 function and feature, 8-24
technical specification, 10-14 principle and signal flow, 8-24
valid slot, 10-14 technical specification, 8-26
version, 10-6 valid slot, 8-26
version, 8-24
B cabinet
configuration, 2-2
BA2 DC PDU, 2-3
board feature code, 12-8 indicator, 2-3
front panel, 12-5 technical specifications, 2-5
function and feature, 12-2 type, 2-2
principle and signal flow, 12-3 Cabinet Configuration
technical specification, 12-9 Other, 2-4
valid slot, 12-8 CMR2

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 OptiX OSN 1500 Intelligent Optical Transmission System
Index Hardware Description

feature code, 11-7 function and feature, 9-99

front panel, 11-5 principle and signal flow, 9-102
function and feature, 11-3 technical specification, 9-111
principle and signal flow, 11-4 valid slot, 9-110
technical specification, 11-8 version, 9-99
valid slot, 11-7 CXLD4
version, 11-3 board configuration reference, 9-125
CMR4 board feature code, 9-124
board feature code, 11-13 front panel, 9-122
front panel, 11-11 function and feature, 9-113
function and feature, 11-9 jumper, 9-121
principle and signal flow, 11-10 principle and signal flow, 9-116
technical specification, 11-14 technical specification, 9-125
valid slot, 11-13 valid slot, 9-124
version, 11-9 version, 9-113
COA CXLL1
board feature code, 12-27 board configuration reference, 9-69
front panel, 12-22 board feature code, 9-68
function and feature, 12-18 front panel, 9-66
installation position, 12-26 function and feature, 9-57
principle and signal flow, 12-20 principle and signal flow, 9-60
technical specification, 12-27 technical specification, 9-69
version, 12-17 valid slot, 9-68
CXL version, 9-57
jumper, 9-65, 9-79, 9-93, 9-107 CXLL16
CXL1 board configuration reference, 9-97
board configuration reference, 9-18 board feature code, 9-96
board feature code, 9-18 front panel, 9-94
front panel, 9-14 function and feature, 9-85
function and feature, 9-4 jumper, 9-48
jumper, 9-12 principle and signal flow, 9-88
principle and signal flow, 9-7 technical specification, 9-97
technical specification, 9-19 valid slot, 9-96
valid slot, 9-18 version, 9-85
version, 9-3 CXLL4
CXL16 board configuration reference, 9-83
board configuration reference, 9-54 board feature code, 9-82
board feature code, 9-54 front panel, 9-80
front panel, 9-50 function and feature, 9-71
function and feature, 9-40 principle and signal flow, 9-74
principle and signal flow, 9-43 technical specification, 9-83
technical specification, 9-55 valid slot, 9-82
valid slot, 9-54 version, 9-71
version, 9-39 CXLQ1
CXL4 board configuration reference, 9-139
board configuration reference, 9-36 board feature code, 9-138
board feature code, 9-36 front panel, 9-136
front panel, 9-32 function and feature, 9-127
function and feature, 9-22 jumper, 9-135
jumper, 9-30 principle and signal flow, 9-130
principle and signal flow, 9-25 technical specification, 9-139
technical specification, 9-37 valid slot, 9-138
valid slot, 9-36 version, 9-127
version, 9-21 CXLQ4
CXLD1 board configuration reference, 9-153
board configuration reference, 9-111 board feature code, 9-152
board feature code, 9-110 front panel, 9-150
front panel, 9-108 function and feature, 9-141

i-2 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Index

jumper, 9-149 technical specification, 6-76

principle and signal flow, 9-144 valid slot, 6-75
technical specification, 9-153 version, 6-72
valid slot, 9-152
version, 9-141 E
D EFF8
front panel, 8-52
D12B function and feature, 8-51
front panel, 8-6 principle and signal flow, 8-51
function and feature, 8-6 technical specification, 8-54
principle and signal flow, 8-6 valid slot, 8-53
technical specification, 8-9 version, 8-51
valid slot, 8-8 EFS0
version, 8-6 configuration reference, 7-38
D12S front panel, 7-36
front panel, 8-10 function and feature, 7-31
function and feature, 8-9 principle and signal flow, 7-33
principle and signal flow, 8-10 technical specifications, 7-38
technical specification, 8-13 TPS protection, 7-37
valid slot, 8-12 valid slots, 7-37
version, 8-9 version, 7-30
D34S EFS4
front panel, 8-21 configuration reference, 7-46
function and feature, 8-20 front panel, 7-44
principle and signal flow, 8-21 function and feature, 7-39
technical specification, 8-22 principle and signal flow, 7-41
valid slot, 8-22 technical specifications, 7-46
version, 8-20 valid slots, 7-46
D75S version, 7-39
front panel, 8-17 EFT4
function and feature, 8-16 configuration reference, 7-8
principle and signal flow, 8-16 front panel, 7-6
technical specification, 8-20 function and feature, 7-3
valid slot, 8-19 principle and signal flow, 7-4
version, 8-16 technical specifications, 7-8
DM12 valid slots, 7-8
front panel, 8-65 version, 7-3
function and feature, 8-64 EFT8
principle and signal flow, 8-65 configuration reference, 7-15
technical specification, 8-68 front panel, 7-12
valid slot, 8-68 function and feature, 7-9
version, 8-64 principle and signal flow, 7-11
DX1 technical specifications, 7-15
board configuration reference, 6-71 valid slots, 7-14
board feature code, 6-69 version, 7-9
front panel, 6-68 EFT8A
function and feature, 6-66 configuration reference, 7-22
principle and signal flow, 6-66 front panel, 7-19
technical specification, 6-71 function and feature, 7-16
TPS Protection, 6-70 principle and signal flow, 7-17
valid slot, 6-69 technical specifications, 7-22
version, 6-66 valid slots, 7-22
DXA version, 7-16
board configuration reference, 6-76 EGR2
front panel, 6-74 configuration reference, 7-100
function and feature, 6-73 feature code, 7-100
principle and signal flow, 6-73 front panel, 7-99

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 OptiX OSN 1500 Intelligent Optical Transmission System
Index Hardware Description

function and feature, 7-93 technical specifications, 7-68

principle and signal Flow, 7-96 valid slots, 7-63
technical specifications, 7-101 version, 7-56
valid slots, 7-100 EOW
version, 7-93 front panel, 10-4
EGS2 function and feature, 10-2
configuration reference, 7-54 principle and signal flow, 10-3
feature code, 7-54 technical specification, 10-6
front panel, 7-52 valid slot, 10-6
function and feature, 7-48 version, 10-2
principle and signal flow, 7-50 ETF8
technical specifications, 7-55 front panel, 8-56
valid slots, 7-54 function and feature, 8-55
version, 7-47 principle and signal flow, 8-56
EGS4 technical specification, 8-59
configuration reference, 7-80 valid slot, 8-58
feature code, 7-77 version, 8-55
front panel, 7-75 ETS8
function and feature, 7-70 front panel, 8-61
principle and signal flow, 7-72 function and feature, 8-60
protection, 7-77, 7-89 principle and signal flow, 8-60
technical specifications, 7-81 technical specification, 8-63
valid slots, 7-77 valid slot, 8-63
version, 7-69 version, 8-60
EGS4A EU04
configuration reference, 7-91 front panel, 8-28
feature code, 7-89 function and feature, 8-27
front panel, 7-87 principle and signal flow, 8-27
function and feature, 7-82 technical specification, 8-30
principle and signal flow, 7-84 valid slot, 8-29
technical specifications, 7-92 version, 8-27
valid slots, 7-89 EU08
version, 7-82 front panel, 8-32
EGT2 function and feature, 8-31
configuration reference, 7-28 principle and signal flow, 8-31
feature code, 7-28 technical specification, 8-33
front panel, 7-26 valid slot, 8-33
function and feature, 7-23 version, 8-31
principle and signal flow, 7-24
technical specifications, 7-29 F
valid slots, 7-28
version, 7-23 FAN
EMR0 front panel, 10-21
configuration reference, 7-112 function and feature, 10-20
feature code, 7-112 principle and signal flow, 10-21
front panel, 7-108 technical specification, 10-22
function and feature, 7-103 valid slot, 10-22
principle and pignal Flow, 7-106 version, 10-20
technical Specifications, 7-112 FIB
valid slots, 7-111 front panel, 11-59
version, 7-102 function and feature, 11-58
EMS4 principle and signal flow, 11-59
configuration reference, 7-67 technical specification, 11-61
feature code, 7-64 valid slot, 11-60
front panel, 7-62 version, 11-58
function and feature, 7-56
principle and signal flow, 7-59
protection, 7-64

i-4 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

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OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Index

I M
IDL4 MR2
board protection, 7-134 board feature code, 11-19
configuration reference, 7-134 front panel, 11-17
feature code, 7-134 function and feature, 11-16
front panel, 7-132 principle and signal flow, 11-16
function and feature, 7-128 technical specification, 11-20
principle and signal flow, 7-130 valid slot, 11-19
technical specifications, 7-135 version, 11-16
valid slots, 7-134 MR2A
version, 7-128 front panel, 11-24
IDQ1 function and feature, 11-21
configuration reference, 7-142 principle and signal flow, 11-23
feature code, 7-142 technical specification, 11-25
front panel, 7-140 valid slot, 11-25
function and feature, 7-136 version, 11-21
principle, 7-138 MR2B
protection, 7-142 front panel, 11-29
signal flow, 7-138 function and feature, 11-27
technical specifications, 7-143 principle and signal flow, 11-28
valid slots, 7-142 technical specification, 11-30
version, 7-136 valid slot, 11-30
indicators version, 11-27
alarm, A-2 MR2C
cabinet, A-2 front panel, 11-34
function and feature, 11-32
L principle and signal flow, 11-33
technical specification, 11-36
L12S valid slot, 11-36
front panel, 8-4 version, 11-32
function and feature, 8-3 MR4
principle and signal flow, 8-3 board feature code, 11-40
technical specification, 8-5 front panel, 11-39
valid slot, 8-5 function and feature, 11-37
version, 8-3 principle and signal flow, 11-38
L75S technical specification, 11-41
front panel, 8-14 valid slot, 11-40
function and feature, 8-13 version, 11-37
principle and signal flow, 8-14 MST4
technical specification, 8-15 configuration reference, 7-150
valid slot, 8-15 feature code, 7-149
version, 8-13 front panel, 7-148
Label function and feature, 7-144
description, B-2 principle and pignal Flow, 7-146
Position, B-3 technical specifications, 7-150
Safety Label, B-2 valid slots, 7-149
LWX version, 7-144
board feature code, 11-48 MU04
front panel, 11-46 front panel, 8-40
function and feature, 11-43 function and feature, 8-39
principle and signal flow, 11-44 principle and signal flow, 8-40
technical specification, 11-48 technical specification, 8-42
valid slot, 11-48 valid slot, 8-41
version, 11-43 version, 8-39

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 OptiX OSN 1500 Intelligent Optical Transmission System
Index Hardware Description

function and feature, 6-3

O principle and signal flow, 6-4
technical specification, 6-8
OBU1 valid slot, 6-7
feature code, 11-56 version, 6-3
front panel, 11-54 PL3
function and feature, 11-52 board configuration reference, 6-42
principle and signal flow, 11-53 front panel, 6-39
technical specification, 11-56 function and feature, 6-36
valid slot, 11-56 principle and signal flow, 6-36
version, 11-52 technical specification, 6-42
OU08 TPS protection, 6-40
front panel, 8-36 valid slot, 6-40
function and feature, 8-35 version, 6-35
principle and signal flow, 8-35 PL3A
technical specification, 8-38 board configuration reference, 6-49
valid slot, 8-38 front panel, 6-47
version, 8-34 function and feature, 6-44
principle and signal flow, 6-45
P technical specification, 6-49
valid slot, 6-48
PD1 version, 6-43
board configuration reference, 6-17 power consumption and weight, C-1
board feature code, 6-14 PQ1
front panel, 6-13 board configuration reference, 6-26
function and feature, 6-9 board feature code, 6-24
principle and signal flow, 6-10 front panel, 6-22
technical specification, 6-17 function and feature, 6-19
TPS protection, 6-15 principle and signal flow, 6-20
valid slot, 6-13 technical specification, 6-26
version, 6-9 TPS protection, 6-24
PD3 valid slot, 6-23
board configuration reference, 6-57 version, 6-18
front panel, 6-54 PQ3
function and feature, 6-51 board configuration reference, 6-64
principle and signal flow, 6-51 front panel, 6-61
technical specification, 6-57 function and feature, 6-58
TPS protection, 6-55 principle and signal flow, 6-59
valid slot, 6-55 technical specification, 6-65
version, 6-50 TPS protection, 6-63
PIU valid slot, 6-62
front panel, 13-9 version, 6-58
function and feature, 13-8 PQM
principle and signal flow, 13-8 board configuration reference, 6-34
technical specifications, 13-11 front panel, 6-31
valid slot, 13-10 function and feature, 6-27
version, 13-8 principle and signal flow, 6-28
PIUA technical specification, 6-34
front panel, 13-13 TPS protection, 6-32
function and feature, 13-12 valid slot, 6-32
principle and signal flow, 13-12 version, 6-27
technical specifications, 13-14
valid slot, 13-14
version, 13-11
S
PL1 SEP1
board configuration reference, 6-7 configuration reference, 5-53
board feature code, 6-7 front panel, 5-50
front panel, 6-6 function and feature, 5-46

i-6 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd
OptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description Index

principle and signal flow, 5-47 SL4A

technical specifications, 5-54 Board Configuration Reference, 5-67
TPS Protection, 5-52 Board Feature Code, 5-67
valid slot, 5-52 Front Panel, 5-65
version, 5-46 Function and Feature, 5-63
SF16 Principle and Signal Flow, 5-64
configuration reference, 5-118 Technical Specifications, 5-67
front panel, 5-116 Valid Slots, 5-67
function and feature, 5-113 Version Description, 5-63
principle and signal flow, 5-114 SLD4
technical specifications, 5-118 board feature code, 5-75
valid slots, 5-118 configuration reference, 5-75
version, 5-113 front panel, 5-73
SL1 function and feature, 5-70
board configuration reference, 5-9 principle and signal flow, 5-71
board feature code, 5-9 technical specifications, 5-76
front panel, 5-7 valid slots, 5-74
function and feature, 5-4 version, 5-69
principle and signal flow, 5-5 SLD4A
technical specification, 5-9 Board Configuration Reference, 5-81
valid slot, 5-8 Board Feature Code, 5-81
version, 5-3 Front Panel, 5-79
SL16 Function and Feature, 5-78
board feature code, 5-102 Principle and Signal Flow, 5-78
configuration reference, 5-102 Technical Specifications, 5-81
front panel, 5-100 Valid Slots, 5-81
function and feature, 5-97 Version Description, 5-77
principle and signal flow, 5-98 SLO1
technical specifications, 5-102 board feature code, 5-37
valid slot, 5-102 configuration reference, 5-37
version, 5-96 front panel, 5-35
SL16A function and feature, 5-32
board feature code, 5-110 principle and signal flow, 5-34
configuration reference, 5-111 technical specifications, 5-38
front panel, 5-109 valid slot, 5-37
function and feature, 5-105 version, 5-32
principle and signal flow, 5-106 slot
technical specifications, 5-111 allocation, 3-4, 3-13
valid slot, 5-110 SLQ1
version, 5-105 board configuration reference, 5-23
SL1A feature Code, 5-23
Board Configuration Reference, 5-15 front panel, 5-21
Board Feature Code, 5-15 function and feature, 5-18
Front Panel, 5-14 principle and signal flow, 5-19
Function and Feature, 5-11 technical specification, 5-24
Principle and Signal Flow, 5-12 valid slot, 5-22
Technical Specifications, 5-15 version, 5-17
Valid Slots, 5-15 SLQ1A
version, 5-11 Board Configuration Reference, 5-30
SL4 Board Feature Code, 5-30
board feature code, 5-60 Front Panel, 5-28
configuration reference, 5-61 Function and Feature, 5-26
front panel, 5-58 Principle and Signal Flow, 5-27
function and feature, 5-55 Technical Specifications, 5-30
principle and signal flow, 5-56 Valid Slots, 5-30
technical specifications, 5-61 Version Description, 5-26
valid slot, 5-60 SLQ4
version, 5-55 board feature code, 5-88

Issue 02 (2007-03-29) Huawei Proprietary and Confidential i-7

Copyright © Huawei Technologies Co., Ltd
 OptiX OSN 1500 Intelligent Optical Transmission System
Index Hardware Description

configuration reference, 5-89

front panel, 5-87 U
function and feature, 5-84
principle and signal flow, 5-85 UPM
technical specifications, 5-89 function and feature, 13-2
valid slot, 5-88 principle and signal flow, 13-4
version, 5-83 rear panel, 13-4
SLQ4A technical specifications, 13-6
Board Configuration Reference, 5-94 valid slot, 13-6
Board Feature Code, 5-94
Front Panel, 5-93
Function and Feature, 5-91
Principle and Signal Flow, 5-92
Technical Specifications, 5-95
Valid Slots, 5-94
Version Description, 5-90
SLT1
configuration reference, 5-44
front panel, 5-42
function and feature, 5-39
principle and signal flow, 5-40
technical specifications, 5-44
valid slot, 5-44
version, 5-39
SPQ4
board configuration reference, 6-85
front panel, 6-82
function and feature, 6-77
principle and signal flow, 6-78
technical specification, 6-85
TPS protection, 6-84
valid slot, 6-83
version, 6-77
Subrack
Structure, 3-2
subrack
capacity, 3-3
technical specifications, 3-24

T
TSB4
Front Panel, 8-44
Function and Feature, 8-43
Principle, 8-43
Signal Flow, 8-43
Technical Specifications, 8-45
Valid Slots, 8-45
Version, 8-43
TSB8
front panel, 8-47
function and feature, 8-46
principle and signal flow, 8-46
technical specification, 8-50
valid slot, 8-48
version, 8-46

i-8 Huawei Proprietary and Confidential Issue 02 (2007-03-29)

Copyright © Huawei Technologies Co., Ltd