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User’s Guide
60GHz mmWave Sensor EVMs

ABSTRACT
The MMWAVEICBOOST Board is combined with the compatible antenna modules from the starter kit for
Industrial Radar Devices of the xWR68xx family.

Table of Contents
1 Getting Started........................................................................................................................................................................5
1.1 Introduction........................................................................................................................................................................ 5
1.2 Key Features......................................................................................................................................................................5
1.3 What’s Included..................................................................................................................................................................7
2 MMWAVEICBOOST................................................................................................................................................................. 8
2.1 Hardware............................................................................................................................................................................8
2.2 Block Diagram and Features..............................................................................................................................................9
2.3 Muxing Scheme for Multiple Sources...............................................................................................................................10
2.4 Using the MMWAVEICBOOST With the Starter Kit......................................................................................................... 13
2.5 Interfacing with the DCA1000EVM...................................................................................................................................16
2.6 Power Connections.......................................................................................................................................................... 17
2.7 Connectors.......................................................................................................................................................................17
2.8 Jumpers, Switches and LEDs.......................................................................................................................................... 24
3 xWR6843ISK / IWR6843ISK-ODS REV C.............................................................................................................................29
3.1 Hardware..........................................................................................................................................................................29
3.2 xWR6843ISK/IWR6843ISK-ODS Block Diagram............................................................................................................ 32
3.3 PCB Storage and Handling Recommendations............................................................................................................... 32
3.4 Power Connections.......................................................................................................................................................... 32
3.5 Interfaces......................................................................................................................................................................... 33
3.6 xWR6843ISK Antenna..................................................................................................................................................... 37
3.7 IWR6843ISK-ODS Antenna............................................................................................................................................. 40
3.8 Modular Mode.................................................................................................................................................................. 42
3.9 DCA1000EVM Mode........................................................................................................................................................44
3.10 MMWAVEICBOOST Mode.............................................................................................................................................44
4 xWR6843AOPEVM Rev G.....................................................................................................................................................46
4.1 Hardware..........................................................................................................................................................................46
4.2 Block Diagram..................................................................................................................................................................47
4.3 PCB Storage and Handling Recommendations............................................................................................................... 48
4.4 Heat Sink and Temperature............................................................................................................................................. 48
4.5 xWR6843AOPEVM Antenna............................................................................................................................................51
4.6 Switch Settings.................................................................................................................................................................53
4.7 xWR6843AOPEVM Muxing Scheme............................................................................................................................... 54
4.8 Modular, DCA1000EVM and MMWAVEICBOOST Mode.................................................................................................54
4.9 Known Issues: Spurious Performance............................................................................................................................. 58
4.10 PC Connection............................................................................................................................................................... 59
4.11 REACH Compliance....................................................................................................................................................... 60
4.12 Regulatory Statements with Respect to the xWR6843AOPEVM Rev G........................................................................60
5 xWR6843AOPEVM Rev F..................................................................................................................................................... 61
5.1 Hardware..........................................................................................................................................................................61
5.2 Block Diagram..................................................................................................................................................................62
5.3 PCB Storage and Handling Recommendations............................................................................................................... 63
5.4 Heat Sink and Temperature............................................................................................................................................. 63
5.5 xWR6843AOPEVM Antenna............................................................................................................................................67
5.6 Switch Settings.................................................................................................................................................................69
5.7 xWR6843AOPEVM Muxing Scheme............................................................................................................................... 70

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5.8 Modular and MMWAVEICBOOST Mode..........................................................................................................................70

5.9 PC Connection................................................................................................................................................................. 73
5.10 REACH Compliance.......................................................................................................................................................74
6 IWR6843ISK / IWR6843ISK-ODS (deprecated)................................................................................................................... 75
6.1 Hardware..........................................................................................................................................................................75
6.2 IWR6843ISK/IWR6843ISK-ODS Block Diagram............................................................................................................. 78
6.3 PCB Storage and Handling Recommendations............................................................................................................... 78
6.4 Power Connections.......................................................................................................................................................... 78
6.5 Miscellaneous and LEDs..................................................................................................................................................79
6.6 IWR6843ISK Antenna...................................................................................................................................................... 79
6.7 IWR6843ISK-ODS Antenna............................................................................................................................................. 82
7 IWR6843AOPEVM (Deprecated).......................................................................................................................................... 84
7.1 Hardware..........................................................................................................................................................................84
7.2 Block Diagram..................................................................................................................................................................85
7.3 PCB Storage and Handling Recommendations............................................................................................................... 86
7.4 IWR6843AOPEVM Antenna............................................................................................................................................ 86
7.5 Switch Settings.................................................................................................................................................................89
7.6 IWR6843AOPEVM Muxing Scheme................................................................................................................................ 90
7.7 Modular and MMWAVEICBOOST Mode..........................................................................................................................90
7.8 PC Connection................................................................................................................................................................. 93
7.9 REACH Compliance.........................................................................................................................................................94
8 TI E2E Community................................................................................................................................................................ 95
9 Certification Related Information........................................................................................................................................ 96
Revision History.......................................................................................................................................................................96

List of Figures
Figure 2-1. MMWAVEICBOOST Front View................................................................................................................................ 8
Figure 2-2. MMWAVEICBOOST Rear View.................................................................................................................................8
Figure 2-3. Block Diagram of MMWAVEICBOOST......................................................................................................................9
Figure 2-4. Muxing Scheme.......................................................................................................................................................10
Figure 2-5. Front........................................................................................................................................................................ 12
Figure 2-6. Rear.........................................................................................................................................................................12
Figure 2-7. Front........................................................................................................................................................................ 12
Figure 2-8. Uninstalled Devices.................................................................................................................................................13
Figure 2-9. COM Ports After the Driver Installation................................................................................................................... 14
Figure 2-10. Integration of MMWAVEICBOOST and Starter Kit................................................................................................ 15
Figure 2-11. Mechanical Mounting of the PCB.......................................................................................................................... 15
Figure 2-12. IWR6843ISK-MMWAVEICBOOST-DCA1000EVM Test Setup..............................................................................16
Figure 2-13. Power Connector...................................................................................................................................................17
Figure 2-14. P3 Header............................................................................................................................................................. 17
Figure 2-15. P7 Header............................................................................................................................................................. 17
Figure 2-16. J27 Header............................................................................................................................................................17
Figure 2-17. TI Standard LaunchPad........................................................................................................................................ 18
Figure 2-18. 60-Pin HD Connectors.......................................................................................................................................... 19
Figure 2-19. 60-Pin HD Connector (DCA1000)......................................................................................................................... 22
Figure 2-20. 60-Pin MIPI Connector.......................................................................................................................................... 22
Figure 2-21. 14-Pin JTAG Connector.........................................................................................................................................23
Figure 2-22. CAN Connectors................................................................................................................................................... 24
Figure 2-23. UMC Connector.....................................................................................................................................................24
Figure 2-24. SOP Jumpers........................................................................................................................................................ 25
Figure 2-25. J13 Header............................................................................................................................................................26
Figure 2-26. SW1.......................................................................................................................................................................27
Figure 2-27. SW2.......................................................................................................................................................................27
Figure 2-28. S1 Switch.............................................................................................................................................................. 27
Figure 2-29. DS1....................................................................................................................................................................... 28
Figure 2-30. DS2....................................................................................................................................................................... 28
Figure 2-31. LEDs......................................................................................................................................................................28
Figure 2-32. D4 & D9.................................................................................................................................................................28
Figure 2-33. D11 & D14............................................................................................................................................................. 28
Figure 3-1. xWR6843ISK Front View.........................................................................................................................................29
Figure 3-2. xWR6843ISK Rear View......................................................................................................................................... 30
Figure 3-3. PCB Antenna – Top.................................................................................................................................................31
Figure 3-4. PCB Antenna – Bottom........................................................................................................................................... 31

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Figure 3-5. Block Diagram of xWR6843ISK/IWR6843ISK-ODS................................................................................................32

Figure 3-6. LED location and color............................................................................................................................................ 35
Figure 3-7. CAN Connector location and label.......................................................................................................................... 36
Figure 3-8. PCB Antennas.........................................................................................................................................................37
Figure 3-9. IWR6843ISK antenna placement MIMO array........................................................................................................ 38
Figure 3-10. TX1 Antenna Radiation Pattern in Azimuth...........................................................................................................39
Figure 3-11. TX2 Antenna Radiation Pattern in Azimuth........................................................................................................... 39
Figure 3-12. TX3 Antenna Radiation Pattern in Azimuth...........................................................................................................39
Figure 3-13. TX1 Antenna Radiation Pattern in Elevation......................................................................................................... 39
Figure 3-14. TX2 Antenna Radiation Pattern in Elevation......................................................................................................... 39
Figure 3-15. TX3 Antenna Radiation Pattern in Elevation......................................................................................................... 39
Figure 3-16. IWR6843ISK-ODS PCB Antenna..........................................................................................................................40
Figure 3-17. IWR6843ISK-ODS antenna placement MIMO array............................................................................................. 40
Figure 3-18. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included)................. 41
Figure 3-19. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included).................. 42
Figure 3-20. Virtual COM port....................................................................................................................................................42
Figure 3-21. Modular Mode Setup............................................................................................................................................. 43
Figure 3-22. DCA1000EVM mode............................................................................................................................................. 44
Figure 3-23. mmWAVEICBOOST mode.................................................................................................................................... 45
Figure 4-1. xWR6843AOPEVM Top View..................................................................................................................................46
Figure 4-2. xWR6843AOPEVM Bottom View............................................................................................................................ 47
Figure 4-3. Block Diagram of the xWR6843AOPEVM...............................................................................................................47
Figure 4-4. Duty Cycle versus Junction Temperature................................................................................................................48
Figure 4-5. Heat sink CAD drawing........................................................................................................................................... 49
Figure 4-6. Heat sink placement................................................................................................................................................50
Figure 4-7. AOP Antennas.........................................................................................................................................................51
Figure 4-8. IWR6843AOP antenna placement MIMO array...................................................................................................... 51
Figure 4-9. Measured Azimuth Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included)...................... 52
Figure 4-10. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included).................. 52
Figure 4-11. xWR6843AOPEVM Switches................................................................................................................................ 53
Figure 4-12. Switch Configuration for Modular (USB) Mode..................................................................................................... 55
Figure 4-13. Switch Configuration for Modular (Bluetooth) Mode..............................................................................................55
Figure 4-14. Switch Configuration for DCA1000EVM Mode......................................................................................................56
Figure 4-15. Setup with xWR6843AOPEVM and DCA1000EVM.............................................................................................. 56
Figure 4-16. xWR6843AOPEVM Mounted on MMWAVEICBOOST..........................................................................................57
Figure 4-17. Switch Configuration for MMWAVEICBOOST Mode.............................................................................................58
Figure 4-18. ADC spectrum with spread spectrum enabled (blue) vs disabled (red)................................................................ 59
Figure 4-19. CP2105 COM Ports...............................................................................................................................................59
Figure 5-1. xWR6843AOPEVM Top View..................................................................................................................................61
Figure 5-2. xWR6843AOPEVM Bottom View............................................................................................................................ 62
Figure 5-3. Block Diagram of the xWR6843AOPEVM...............................................................................................................63
Figure 5-4. Duty Cycle versus Junction Temperature................................................................................................................64
Figure 5-5. Heat sink CAD drawing........................................................................................................................................... 65
Figure 5-6. Heat sink placement................................................................................................................................................66
Figure 5-7. AOP Antennas.........................................................................................................................................................67
Figure 5-8. IWR6843AOP antenna placement MIMO array...................................................................................................... 67
Figure 5-9. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included)................... 68
Figure 5-10. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included).................. 68
Figure 5-11. xWR6843AOPEVM Switches................................................................................................................................ 69
Figure 5-12. Switch Configuration for Modular Mode................................................................................................................ 71
Figure 5-13. Switch Configuration for Bluetooth Mode.............................................................................................................. 72
Figure 5-14. xWR6843AOPEVM Mounted on MMWAVEICBOOST..........................................................................................72
Figure 5-15. Switch Configuration for MMWAVEICBOOST Mode.............................................................................................73
Figure 5-16. SICP2015 COM Ports........................................................................................................................................... 73
Figure 6-1. IWR6843ISK Front View..........................................................................................................................................75
Figure 6-2. IWR6843ISK Rear View.......................................................................................................................................... 76
Figure 6-3. PCB Antenna – Top.................................................................................................................................................77
Figure 6-4. PCB Antenna – Bottom........................................................................................................................................... 77
Figure 6-5. Block Diagram of IWR6843ISK/IWR6843ISK-ODS................................................................................................ 78
Figure 6-6. PGood LED............................................................................................................................................................. 79
Figure 6-7. PCB Antennas.........................................................................................................................................................80
Figure 6-8. TX1 Antenna Radiation Pattern in Azimuth.............................................................................................................80
Figure 6-9. TX2 Antenna Radiation Pattern in Azimuth.............................................................................................................80

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Figure 6-10. TX3 Antenna Radiation Pattern in Azimuth...........................................................................................................81

Figure 6-11. TX1 Antenna Radiation Pattern in Elevation......................................................................................................... 81
Figure 6-12. TX2 Antenna Radiation Pattern in Elevation......................................................................................................... 81
Figure 6-13. TX3 Antenna Radiation Pattern in Elevation......................................................................................................... 81
Figure 6-14. IWR6843ISK-ODS PCB Antenna..........................................................................................................................82
Figure 6-15. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included)................. 82
Figure 6-16. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included).................. 83
Figure 7-1. IWR6843AOPEVM Top View...................................................................................................................................84
Figure 7-2. IWR6843AOPEVM Bottom View............................................................................................................................. 85
Figure 7-3. Block Diagram of the IWR6843AOPEVM................................................................................................................86
Figure 7-4. AOP Antennas.........................................................................................................................................................87
Figure 7-5. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included)................... 88
Figure 7-6. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs Included).................... 88
Figure 7-7. IWR6843AOPEVM Switches...................................................................................................................................89
Figure 7-8. Switch Configuration for Modular Mode.................................................................................................................. 91
Figure 7-9. Switch Configuration for BT Mode...........................................................................................................................91
Figure 7-10. Switch Configuration for MMWAVEICBOOST Mode.............................................................................................93
Figure 7-11. SICP2015 COM Ports............................................................................................................................................93

List of Tables
Table 2-1. Switch Settings..........................................................................................................................................................11
Table 2-2. Mux Selection Images...............................................................................................................................................12
Table 2-3. Board Power............................................................................................................................................................. 17
Table 2-4. J6 Connector Pinout................................................................................................................................................. 18
Table 2-5. J5 Connector Pinout................................................................................................................................................. 19
Table 2-6. J4 Connector Pinout................................................................................................................................................. 20
Table 2-7. J17 Connector Pinout............................................................................................................................................... 21
Table 2-8. CAN Connectivity......................................................................................................................................................23
Table 2-9. SOP Jumper Information.......................................................................................................................................... 24
Table 2-10. I2C Jumper Settings............................................................................................................................................... 25
Table 2-11. I2C Devices and Addresses.................................................................................................................................... 25
Table 2-12. 3.3-V Rail Options...................................................................................................................................................26
Table 2-13. Miscellaneous Headers...........................................................................................................................................26
Table 2-14. Switches Information...............................................................................................................................................27
Table 2-15. LEDs Information.................................................................................................................................................... 28
Table 3-1. List of LEDs...............................................................................................................................................................35
Table 3-2. IWR6843ISK I2C Devices and Address....................................................................................................................36
Table 3-3. S1 Config Flashing and Functional Mode................................................................................................................. 43
Table 3-4. S1 Config for DCA1000EVM mode...........................................................................................................................44
Table 3-5. S1 Config for mmWAVEICBOOST mode..................................................................................................................45
Table 4-1. Switches....................................................................................................................................................................53
Table 4-2. Pin Mux Settings....................................................................................................................................................... 54
Table 4-3. SOP Configuration.................................................................................................................................................... 54
Table 4-4. REACH Information.................................................................................................................................................. 60
Table 5-1. Switches....................................................................................................................................................................69
Table 5-2. Pin Mux Settings....................................................................................................................................................... 70
Table 5-3. SOP Configuration.................................................................................................................................................... 70
Table 5-4. REACH Information.................................................................................................................................................. 74
Table 6-1. List of LEDs...............................................................................................................................................................79
Table 6-2. IWR6843ISK I2C Devices and Address....................................................................................................................79
Table 7-1. Switches....................................................................................................................................................................89
Table 7-2. Pin Mux Settings I..................................................................................................................................................... 90
Table 7-3. Pin Mux Settings II.................................................................................................................................................... 90
Table 9-1. Declared Maximum Mean Power..............................................................................................................................96

Trademarks
LaunchPad™ and BoosterPack™ are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.

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1 Getting Started
1.1 Introduction
xWR6843ISK/IWR6843ISK-ODS/ IWR6843AOPEVM and MMWAVEICBOOST are part of mmWave EVMs
hardware. The xWR6843 antenna board from Texas Instruments is an easy-to-use evaluation module for the
xWR6843 mmWave sensing device. This board contains 60-GHz mmWave Radar transceiver in which antennas
are etched on PCB or on packager and act as the Radar front-end board. The MMWAVEICBOOST is an add-on
board used with TI's mmWave sensor used in all starter kits to provide more interfaces and PC connectivity
to the mmWave sensors. The MMWAVEICBOOST board provides an interface for the mmWave Studio tool
to configure the Radar device and capture the raw analog-to-digital converter (ADC) data, using a capture
board such as DCA1000 evaluation module (EVM). xWR6843 antenna EVMs and MMWAVEICBOOST contains
everything required to start developing software for on-chip C67x DSP core and low-power ARM R4F controllers.
It provides an interface to the MSP43xx boards through 40-pin LaunchPad™/ BoosterPack™ connectors.
Revision currently available on product page Silicon Version
MMWAVEICBOOST Rev. B -
AWR6843ISK Rev. C ES2
IWR6843ISK Rev. B ES2
IWR6843ISK-ODS Rev. B ES2
IWR6843AOPEVM Rev. F ES2

Note
All older revisions not listed are deprecated and may contain deprecated silicon version

1.2 Key Features

Integrated Antenna 60-GHz High Performance 60-GHz 60-GHz Intelligent Edge Sensor
Intelligent Edge Sensor Intelligent Edge Sensor IWR6843ISK-ODS
IWR6843AoPEVM xWR6843ISK
Tuning Frequency 60-64 GHz 60-64 GHz 60-64 GHz
Number of Receivers 4 4 4
Number of Transmitter 3 3 3
Processing • MCU • MCU • MCU
• FFT accelerator • FFT accelerator • FFT accelerator
• DSP • DSP • DSP

Memory 1.75 MB 1.75 MB 1.75 MB

Antenna Antenna on Package Antenna on PCB Antenna on PCB
Azimuth FOV (deg)2 +/- 60 +/- 60 +/- 60
Azimuth Angular Resolution 29 15 29
(deg)1
Elevation FOV (deg)2 +/- 60 +/- 15 +/- 60
Elevation Angular Resolution 29 58 29
(deg)1
Gain 5dBi 7dBi 5dBi
Modular Mode • Requires mmWaveICBOOST • Requires mmWaveICBOOST • Requires mmWaveICBOOST
for debugging and DCA1000 for debugging for debugging
• Flashing and functional • Flashing and functional • Flashing and functional
mode available without mode available without mode available without
mmWaveICBOOST mmWaveICBOOST mmWaveICBOOST

Raw ADC Data Capture Yes – requires Yes – requires DCA1000 Yes – requires DCA1000
mmWaveICBOOST + DCA1000

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1. Angular resolution is defined as how far apart two objects must be (in angle) for them to be detected as
separate objects. It is different from angular accuracy, which is how accurately the angle of an object is
detected.
2. 6-dB beam width of resultant pattern due to TX and RX combination
1.2.1 Summary of Features
Feature Comment xWR6843ISK IWR6843ISK-ODS IWR6843AOPEVM

For code flashing, Running Demos

Modular Mode √ √ √
mmWaveicboost carrier not needed

Data + Power over USB host.

USB Powered √ √ √
No external 5V Supply needed.

Direct DCA1000 For Raw Data capture direct connection to

√ √ -
mating DCA1000 via 60Pin Samtec Header.
Requires Requires Requires
JTAG Debug Code debug using XDS110 JTAG emulator
MMWAVEICBOOST MMWAVEICBOOST MMWAVEICBOOST
CAN FD Phy. Direct connectivity to CANFD peripheral
2 2 2
Instances on available on Antenna Board

1.2.2 xWR6843ISK
• 60-pin, high-density (HD) connector for raw analog-to-digital converter (ADC) data over LVDS and trace data
capability
• Long range on-board antenna
• Current sensors for all rails
• On-board PMIC
1.2.3 IWR6843ISK-ODS (Overhead Detection Sensing)
• 60-pin, high-density (HD) connector for raw analog-to-digital converter (ADC) data over LVDS and trace data
capability
• Short range on-board antenna
• Current sensors for all rails
• On-board PMIC
1.2.4 IWR6843AOP
• 60-pin, high-density (HD) connector for raw analog-to-digital converter (ADC) data over LVDS and trace data
capability
• Short range on-package antenna
• On-board PMIC
1.2.5 MMWAVEICBOOST
• Hosts starter kit using two 60-pin high-density (HD) connector for the high-speed ADC data over CSI or LVDS
and emulator signals
• FTDI-based JTAG emulation with serial port for programming flash on the starter kit
• XDS110-UART based QSPI flash programming
• 60-pin HD connector to interface with the DCA1000 EVM
• Two 20-pin LaunchPad connectors that leverage the ecosystem of the TI standard Launchpad and have all of
the digital controls from the Radar chip
• Two onboard controller area network (CAN) transceivers
• On-board PMIC
• 60-pin MIPI HD connector for JTAG trace
• On-board FTDI chip to provide PC interface for serial peripheral interface (SPI), general-purpose input/output
(GPIO) controls and universal asynchronous receiver/transmitter (UART) loggers
• On-board current sensors and temperature sensors

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1.3 What’s Included

1.3.1 Kit Contents
The following items are included with the EVM kit.
1.3.1.1 xWR6843ISK
• xWR6843ISK evaluation board
• Warranty card (disclaimer sheet)
• Quick Start Guide
1.3.1.2 IWR6843ISK-ODS
• IWR6843ISK-ODS evaluation board
• Warranty card (disclaimer sheet)
• Quick Start Guide
1.3.1.3 IWR6843AOPEVM
• IWR6843AOPEVM evaluation board
• Warranty card (disclaimer sheet)
• Quick Start Guide
1.3.1.4 MMWAVEICBOOST
• MMWAVEICBOOST evaluation board
• One Micro USB cable for connecting to PC
• Standoffs, screws and nuts for the standalone printed circuit board testing or for mating purpose
• Jumpers

Note
A 5-V, > 2.5-A supply brick with a 2.1-mm barrel jack (center positive) is not included. TI
recommends using an external power supply that complies with applicable regional safety
standards, such as UL, CSA, VDE, CCC, PSE, and more. The length of the power cable should be
< 3 m.

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2 MMWAVEICBOOST
2.1 Hardware
Figure 2-1 and Figure 2-2 shows the front and rear view of EVM, respectively.

Figure 2-1. MMWAVEICBOOST Front View Figure 2-2. MMWAVEICBOOST Rear View

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2.2 Block Diagram and Features

2.2.1 Block Diagram
Figure 2-3 shows the block diagram.
LVDS [3:0] 60 PIN HD CONNECTOR 60 PIN HD CONNECTOR

SPI 1/CAN1 & 2 RS232

JTAG 14PIN
2:1 MUX JTAG LVDS [6:4]
SP1
TX RX From
2:1 60PIN
CAN1 & 2
MUX FROM XDS110 DCA1000

HEADER DMM
DP [7:0] DP [15:8]
TRACE MIPI
USB XDS110 HEADER 60PIN
CONN
GPIO [2:0], NERRIN, NERROUT, SOP [2:0], LOGGERS

FTDI 2m
3.3 V
FT4232 VCC
SPI 1, SPI 2, NRST, INTn, RS232
USB 2m
1.2 V
2:1
MUX 2m
1.8 V
LVDS [6:4] 2:1 LC FIL
MUX PMIC
LP87524J
To 60PIN 2m
1.0 V
HD CONNECTOR LC FIL
60 PIN
CONNECTOR I2C
DCA1000 INA226
TO 60PIN
SPI 1,SPI 2, NRST, INTn, RS232
XDS110 TEMP
SENSOR
2:1
MUX INA226 USB
5V
2m
SPI 1,SPI 2, NRST, INTn, RS232 3.3 V 5V
LM536353 HEADER

60 PIN
CONNECTOR
DCA1000
GPIO [2:0], NERRIN, NERROUT,SOP [2:0], LOGGERS
HEADER HEADER JACK

5V
LOADSW LOADSW LM536255 HEADER
> 5 V to 36 V

Figure 2-3. Block Diagram of MMWAVEICBOOST

2.2.2 Hardware Features

• 1 Micro USB connector for XDS110 Emulator/UART interface
• 1 Micro USB connector for FTDI interface
• One 12-pin dip switch for mux controls
• One push button and two LEDs for basic user interface
• Current sensors for all rails
• 5-V power jack to power the board
• Header for external JTAG connection

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2.3 Muxing Scheme for Multiple Sources

There are multiple sources as shown in Figure 2-4 such as 40 pin LP/BP, DCA1000 EVM, onboard FTDI and
XDS110 that can control the Radar front-end chip in the starter kit. This is done with the help of mux scheme
implemented on the MMWAVEICBOOST. Follow the switch settings as shown in Table 2-1 to avoid the conflicts.
The most used configuration is the default position.
SPI 2 40-PIN LP / BP HEADER

SPI_CLK1
SPI_CS1
GPIO NERR
2:1 MUX SOP[2:0] SPI_MISO1
[2:0] IN/OUT
RS232 SPI_MOSI1
DIP HOST NRST 60 PIN
CLK1 CS1 MISO1 MOSI1 TX/RX
SW INTn HOST INTn CONNECTOR
DCA1000
NRST
GPIO[2:0]
RS232
NERR_IN
CLK2 CS2 MISO2 MOSI2 TX/RX
NERR_OUT
SOP[2:0]

CLK2/UART3 2:1 MUX

SCL SDA
CS2/UART4 CLK1 DIP
SW
MISO2/SCL CS1
MOSI2/SDA FTDI MISO1
FT4232
MOSI1
HOST
2:1 MUX INTn HOST RS232
CLK1 CS1 MISO1 MOSI1 NRST
NRST INTn TX/RX
DIP RS232
SW
MOSI2 MISO2 TX/RX
SCL DIP
/SDA /SCL
SW

SDA JTAG SIGNALS

2:1 MUX
2:1 MUX TX1
GPIO NERR SOP[2:0] TX2
CLK2 CS2 CAN1 & 2 RS232
DIP [2:0] IN/OUT RX1 CLK1 CS1 MISO1 MOSI1
TX/RX
XDS110
SW RX2 HOST
NRST
14PIN INTn
JTAG SIGNALS
HEADER FROM XDS110
2:1 MUX
2:1 MUX
DIP DIP
2:1 MUX
SW RS232 SW
TX/RX
TMS/TCK/TDI DIP
TDO SIGNALS SW

60 PIN HD CONNECTOR

Figure 2-4. Muxing Scheme

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Table 2-1 shows the dip switch settings for multiple sources connecting to mmWave sensing device.
Table 2-1. Switch Settings
Reference (Default Position) Position
Designator for STAND ALONE Mode (1) Position for DCA1000 Mode Position for 40-Pin LP/BP

S1.12 ON ON ON
S1.11 ON ON OFF
S1.10 ON ON OFF
S1.9 OFF OFF ON
S1.8 OFF OFF ON
S1.7 ON OFF OFF
S1.6 ON OFF OFF
S1.5(2) ON ON OFF
S1.4 ON OFF ON
S1.3 ON ON OFF
S1.2 ON ON ON
S1.1 OFF OFF OFF

(1) Standalone mode means starter kit and MMWAVEICBOOST connected together.
(2) S1.5 has RS232 connections from 40 pin/FTDI/60 pin/XDS110, ON postion routes UART to XDS110 (Application/user UART COM
port).

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Table 2-2 shows the images of NRST, DIP switch settings, SOP lines, and power input locations on the physical
board.
Table 2-2. Mux Selection Images
Front Rear

Whole Board

Figure 2-5. Front

Figure 2-6. Rear

Zoomed IN

Figure 2-7. Front

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2.4 Using the MMWAVEICBOOST With the Starter Kit

The MMWAVEICBOOST board is required with the starter kit for the following use cases:
• PC connection is enabled for communicating with the mmWave front end chip
• Connecting to mmWave Studio (mmWave Studio is a tool that provides capability to configure the
MMWAVEICBOOST front end from the PC). This tool is available online.
• The DCA1000 EVM allows users to capture the raw ADC data over the high-speed debug interface and post
process it in the PC.
• Getting DSP trace data through the MIPI 60-pin interface
• DMM interface can be used
2.4.1 PC Connection
Connectivity is provided through the micro USB connector over the onboard FTDI and XDS110 ICs. This
provides the following interfaces to the PC:
• XDS110 provides the default UART interface for application/user port and auxiliary data port
• FTDI Port A -> SPI interface for radar device control using mmWave Studio
• FTDI Port B-> I2C interface and host INTR signal
• FTDI Port C -> BSS Logger port (for internal debug only), NRST control, and Nerror signals
• FTDI Port D -> DSS Logger port, SOP line control signals, and GPIO signals
When the USB is connected for the first time to the PC, Windows® maybe not be able to recognize the device.
This is indicated in the device manager with yellow exclamation marks as shown in Figure 2-8.

Figure 2-8. Uninstalled Devices

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To install the devices:

1. Download the latest FTDI and XDS110 drivers available in the mmWave SDK package.
2. Right click on these devices.
3. Update the drivers by pointing to the location where the FTDI and XDS110 drivers are downloaded.
This must be done for all eight COM ports. When eight COM ports are installed, the device manager recognizes
these devices and indicates the COM port numbers, as shown in Figure 2-9.

Figure 2-9. COM Ports After the Driver Installation

2.4.2 Flashing the QSPI Flash on the Antenna Module

For the flashing, only one USB cable (XDS110 USB) must be connected to the PC; the Uniflash utility must be
used load the binary onto the antenna module. Connecting both XDS110_USB and FTDI_USB can prevent the
uniflash utility from running successfully.
2.4.3 MMWAVEICBOOST and Antenna Module Connections for Modular Testing
A compatible antenna module can be stacked on top of the MMWAVEICBOOST board using the two 60-pin HD
connectors and 12 nuts, four washers, and four M3 screws (for improving the thermal performance). Connectors
have a pin number marking shown in Figure 2-18 to prevent the misalignment of the pins or reverse connection.
Figure 2-10 shows the integration of MMWAVEICBOOST and starter kit. The starter kit is powered by the 3.3-V
supply. There is one micro USB cable to XDS110 (J11) to run the out-of-box demo, and one micro USB cable to
FTDI (J12) for initiating controls from mmWave Studio. Digital controls from the MMWAVEICBOOST are initiated
after the FTDI and XDS110 ports are detected in the device manager shown in Figure 2-9. The configuration of
the MMWAVEICBOOST and starter kit are based on the analog mux settings and mux controls received from
the dip switch (S1). To mux all the digital controls to the FTDI/XDS110 connector, set the mux control switch
positions to ON/OFF, as shown in Table 2-1.

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Figure 2-10. Integration of MMWAVEICBOOST and Starter Kit

Figure 2-11 shows the mechanical mounting of PCB. Spacers and screws can be used as heat sinking elements
to spread the heat from the starter kit to carrier board, as shown in Figure 2-11.

Figure 2-11. Mechanical Mounting of the PCB

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2.5 Interfacing with the DCA1000EVM

The high-speed LVDS data from the radar device can be captured using the DCA1000 EVM. For more
information about the DCA1000 EVM and ordering details, see the Real Time Data Capture Adapter and
the DCA1000EVM Data Capture Card User's Guide. mmWave Studio is required for configuration. For the
installation of the tool, see the mmWave Studio User's Guide.
2.5.1 mmWave Studio Interface
To control the radar device from mmWave Studio, both the starter kit and the MMWAVEICBOOST must be
powered and connected to the PC using the micro USB cable. The UART used to download the firmware is
accessed from the XDS110 device on the MMWAVEICBOOST. The SPI interface used to control the radar
device, SOP controls, and nRST control is performed from the FTDI chip on the MMWAVEICBOOST. For details
on the usage of mmWave Studio, see the Radar Studio User's Guide that is part of the DFP package.
2.5.2 MMWAVEICBOOST and Antenna Module Configuration
The configuration of the MMWAVEICBOOST and starter kit are the same as mentioned in Section 2.4, except
the analog mux settings and the mux controls are received from the 60-pin connector (J10) instead of FTDI. To
mux all the digital controls to the 60-pin connector, the mux control switch positions should be set to ON/OFF, as
shown in Table 2-1,
2.5.3 DCA1000 EVM Connection
The DCA1000 EVM must be powered up with a 5-V supply and the micro-USB Ethernet cable connected to
the same PC as the MMWAVEICBOOST and antenna module. A 60-pin Samtec cable (HQCD-030-02.00-SEU-
TBR-1) is used to connect the 60-pin connector (J10) on the MMWAVEICBOOST to the J3 input connector
on the DCA1000 EVM. Mount the four stand offs, four washers, and pan head screws to mate with the
DCA1000EVM. For more information, see the setup shown in Figure 2-12.

Note
The Samtec cable included in the kit is the HQCD-030-02.00-SEU-TBR-1. "02.00" indicates the length
of the cable in inches; cables with longer length can be ordered by the user if needed.

Figure 2-12. IWR6843ISK-MMWAVEICBOOST-DCA1000EVM Test Setup

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2.6 Power Connections

The board is powered by 5-V power jack (2-A current limit) shown in Figure 2-13.

Figure 2-13. Power Connector

Table 2-3 provides the jumper information for usage of board power input.

Note
TI recommends using an external power supply that complies with applicable regional safety
standards, such as UL, CSA, VDE, CCC, PSE, and more. The length of the power cable should
be < 3 m.

Table 2-3. Board Power

Reference
Designator Description Image

Short(Default) : Input voltage is 5 V and short

R116.
P3
Open : Input voltage is more than 5 V and
remove R116.
Figure 2-14. P3 Header

Short : Input voltage is more than 5 V and

P7 remove R116.
Open : Input voltage is 5 V.

Figure 2-15. P7 Header

Short (1-2): Input voltage is more than 5 V.

J27
Open(2-3): Input voltage is 5V(Default)

Figure 2-16. J27 Header

2.7 Connectors
There are several types of connectors used in the MMWAVEICBOOST board, which are mentioned below.

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2.7.1 20-Pin LaunchPad and Booster Pack Connectors (J5, J6)

The MMWAVEICBOOST has the standard LaunchPad connectors (J5 and J6) that enable it to be
directly connected to all TI MCU LaunchPad's pinout, as shown in Figure 2-17. While connecting the
MMWAVEICBOOST to other LaunchPads, ensure the pin-1 orientation is correct by matching the 3V3 and
5-V signal marking on the boards. Figure 2-17 shows two 20-pin connectors.
Table 2-4 and Table 2-5 provide the connector pin information.

Figure 2-17. TI Standard LaunchPad

Table 2-4. J6 Connector Pinout

Pin Number Description Pin Number Description
1 NERROUT 2 GND
3 NERRIN 4 DSS LOGGER
5 MCUCLKOUT 6 SPI_CS
7 NC 8 GPIO1
9 MSS LOGGER (data from xWR device) (1) 10 nRESET
11 WARMRST 12 SPI_MOSI
13 BSS LOGGER 14 SPI_MISO
15 SOP2 16 HOSTINT
17 SOP1 18 GPIO2
19 SOP0 20 NC

(1) When running the OOB demo, the MSS_Logger pin is used to send data. This is the same pin connected to the XDS110 and displayed
through the emulator as a data COM port.

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Table 2-5. J5 Connector Pinout

Pin Number Description Pin Number Description
1 3V3 2 5V
3 NC 4 GND
5 RS232 (TX from xWR device)(1) 6 NC
7 RS232 (RX into xWR device)(1) 8 NC
9 SYNC_IN 10 NC
11 NC 12 NC
13 SPI_CLK 14 PGOOD (2)
15 GPIO0 16 PMIC_Enable (3)
17 SCL 18 SYNC_OUT
19 SDA 20 PMIC CLKOUT

(1) When running the OOB demo, the RS232 TX and RX pins are used for user and configuration files. This is the same pin connected to
the XDS110 and displayed through the emulator as a Application/User UART COM port.
(2) Indicates that all the powers are stable in the standard LP/BP boards are stable, which enables or disables the power of FTDI and
XDS110 interfaces. A HIGH on the PGOOD signal (3.3 V) indicates the supply is stable. The I/Os of the front-end chip are not safe to
operate by the XDS110/FTDI before this I/O supply is stable, to avoid leakage current into the I/Os.
(3) Controls the PMIC enable for starter kits. The MCU can use this to shut down the PMIC and xWR device during the periods it does not
use the xWR device and save power. The power up of the PMIC takes approximately 5 ms once the enable signal is made high.

2.7.2 60-Pin High Density (HD) Connector (J4 and J17)

The 60-pin HD connector shown in Figure 2-18 provides the high-speed CSI/LVDS data, controls signals (SPI,
UART, I2C, NRST, NERR, and SOPs) and JTAG debug signals from the starter kit. The Trace and DMM
interface lines are also available through this connector.

Figure 2-18. 60-Pin HD Connectors

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Table 2-6 and Table 2-7 list the 60-pin HD connector pinout.
Table 2-6. J4 Connector Pinout
Pin Number Pin Description Pin Number Pin Description
1 1V 31 DP2
2 5V 32 GND
3 1V 33 DP3
4 3.3V 34 LVDS_CLKP
5 1.2V 35 DP4
6 3.3V 36 LVDS_CLKM
7 1.2V 37 DP5
8 DMM_SYNC 38 GND
9 1.8V 39 DP6
10 DMM_CLK 40 LVDS_1P
11 JTAG_TDI 41 DP7
12 NRST 42 LVDS_1M
13 JTAG_TMS 43 BSS_LOGGER
14 PGOOD 44 GND
15 JTAG_TCK 45 OSC_CLKOUT
16 HOST_INTR1 46 LVDS_0P
17 JTAG_TDO/SOP0 47 MCU_CLKOUT
18 MSS_LOGGER 48 LVDS_0M
19 SPI_CS1 49 PMIC_CLKOUT/SOP2
20 GND 50 GND
21 SPI_CLK1 51 WARMRST
22 SYNC_IN 52 NERRIN
23 SPI_MOSI1 53 SDA
24 SYNC_OUT/SOP1 54 NERROUT
25 SPI_MISO1 55 SCL
26 GND 56 GPIO_0
27 DP0 57 RS232_RX
28 LVDS_FRCLKP 58 GPIO_1
29 DP1 59 RS232_TX
30 LVDS_FRCLKM 60 GPIO_2

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Table 2-7. J17 Connector Pinout

Pin Number Pin Description Pin Number Pin Description
1 5V 31 GND
2 5V 32 LVDS_3P
3 5V 33 GND
4 VPP_1.7V 34 LVDS_3M
5 GND 35 NC
6 NC 36 GND
7 3.3V 37 NC
8 NC 38 LVDS_2P
9 3.3V 39 NC
10 NC 40 LVDS_2M
11 PMIC_EN 41 NC
12 NC 42 GND
13 DP8 43 NC
14 NC 44 NC
15 DP9 45 NC
16 NC 46 NC
17 DP10 47 NC
18 GND 48 NC
19 DP11 49 NC
20 LVDS_VALIDP 50 NC
21 DP12 51 NC
22 LVDS_VALIDM 52 NC
23 DP13 53 NC
24 GND 54 NC
25 DP14 55 NC
26 NC 56 NC
27 DP15 57 NC
28 NC 58 NC
29 GND 59 NC
30 GND 60 NC

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2.7.3 60-Pin High Density (HD) Connector (J10)

This connector enables interfacing of LVDS signals to the to the DCA1000 EVM for data capturing purposes, as
shown in Figure 2-19. DIP switch (S1) combinations must be set to ON/OFF, as mentioned in Table 2-1, before
interfacing to the DCA1000 EVM.

Figure 2-19. 60-Pin HD Connector (DCA1000)

2.7.4 MIPI 60-Pin Connector (J9)

This connector provides the standard MIPI 60-pin interface, as shown in Figure 2-20 for JTAG and trace
capability through emulators such as the XDS560pro. To use this interface, the JTAG lines from the onboard
emulator (XDS110) and 14-pin JTAG connector must be disconnected; this is done with S1 (12th position of dip
switch should be open), and the JTAG Debugger should not be connected on the 14-pin connector.

Figure 2-20. 60-Pin MIPI Connector

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2.7.5 TI 14-Pin JTAG Connector (J19)

This connector provides a JTAG interface shown in Figure 2-21 for debug and development through external
XDS emulators. To use this interface, the JTAG lines to the onboard emulator (XDS110) must be disconnected;
this is done with S1 (12th position of DIP switch should be open), and the external emulator on the MIPI 60-pin
connector also must be disconnected.

Figure 2-21. 14-Pin JTAG Connector

2.7.6 CAN Connector (J1 and J2)

The J1 and J2 connectors shown in Table 2-8 provide the CAN_L and CAN_H signals from the onboard
CAND-FD transceiver (TCAN1042HGVDRQ1) and CAN transceiver (SN65HVDA540QDR) independently, as
shown in Figure 2-22. These signals are wired to the CAN bus after muxing with the SPI interface signals; one
of the two paths must be selected. Two CANs are selected by closing the switch S1 (1st position of switch to be
ON).
Table 2-8. CAN Connectivity
Pin Description Device Interface Connector on Board
SPI_CS1 CAN2_TX J2 pin 1 (CAN2 corresponds to Regular CAN)
SPI_CLK1 CAN2_RX J2 pin 3
MISO_1 CAN1_TX J1 pin 1 (CAN1 corresponds to CANFD)
MOSI_1 CAN1_RX J1 pin 3

Figure 2-22 shows the CAN connectors.

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Figure 2-22. CAN Connectors

2.7.7 Ultra-Miniature Coaxial Connector (J3)

This connector provides the interface to monitor the reference clock (OSC_CLKOUT) from the starter kit through
the 60-pin HD connector for debug purposes. The signal can be taken out with a coaxial cable and monitored.
Figure 2-23 shows the UMC jack.

Figure 2-23. UMC Connector

2.8 Jumpers, Switches and LEDs

2.8.1 Sense on Power (SOP) Jumpers
The mmWave sensor device can be set to operate in three different modes based on the state of the SOP lines.
These lines are sensed only during boot up of the mmWave sensor device. The state of the device is detailed by
Table 2-9.
A closed jumper refers to a 1, and an open jumper refers to a 0 state of the SOP signal going to the mmWave
sensor device.
Table 2-9. SOP Jumper Information
Reference Designator Usage Description
P6 SOP0 011 (SOP mode 2) = development mode
P5 SOP1 SOP[2:0] 001 (SOP mode 4) = functional mode
P4 SOP2 101 (SOP mode 5) = flash programming

Figure 2-24 shows the SOP jumpers.

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Figure 2-24. SOP Jumpers

2.8.2 I2C Connections

The board features temperature sensor for measuring onboard temperature. These are connected to the I2C bus
and can be isolated using the zero Ω provided on the hardware.
Table 2-10 provides the jumper settings for I2C.
Table 2-10. I2C Jumper Settings
Reference Designator Usage Comments
1-2(default) :FTDI/60 pin(J10)
J14 I2C SCL
2-3 : XDS110

1-2(default) : FTDI/60 pin(J10)

J15 I2C SDA
Pin 2-3 : XDS110

2.8.2.1 Default I2C Address

Table 2-11 provides the list of I2C devices and its address.
Table 2-11. I2C Devices and Addresses
Reference
Sensor Type Designator Part Number Slave Address
Temp sensor 1 U18 TMP112AIDRLR 100 1001
Temp sensor 2 U19 TMP112AIDRLR 100 1000
Current sensor for 3.3V rail U11 INA226AIDGST 100 0010
Current sensor for 1.8V rail U21 INA226AIDGST 100 0110
Current sensor for 1.2V rail U22 INA226AIDGST 100 0111
Current sensor for 1.0V rail U23 INA226AIDGST 100 1100
Current sensor for 3.3V
U20 INA226AIDGST 100 0011
(PMIC)
PMIC U4 LP87524JRNFRQ1 110 0000

2.8.2.2
PMIC(U4) rails such as 1.8 V, 1.2 V, 1.0 V, and 3.3 V are disabled by default. 3.3 V is derived from input 5-V
jack, on-board micro USB connector, or from the 40-pin LaunchPad, as shown in Table 2-12. 3.3 V is for the
starter kits and the rest of the board to operate.

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2.8.2.3 3.3-V Rail Options

Table 2-12. 3.3-V Rail Options
Reference Designator Description Image

Short (1-2) : 3.3 V from FTDI LDO

J13 Short(2-3) : 3.3 V from 40-pin LP/BP connector
Open (1-2-3) : Default

Figure 2-25. J13 Header

Note
Remove the P3 jumper when using a 3.3-V rail from the 40-pin LP/BP or FTDI LDO, and mount the
R122 resistor if it is from the 40-pin LP/BP. The current rating is limited to 1A, either from the FTDI or
40-pin LP/BP.

2.8.2.4 Miscellaneous Headers

Table 2-13 provides the list of miscellaneous headers and usage.
Table 2-13. Miscellaneous Headers
Reference
Designator Usage Comments
P1 VPP 1.7-V generation for fuse chain 1-2(default) : Closed
Enables/disables the load switch (U31) of 5-V supply
generation either from > 5-V or 5-V circuitry. 1-2 : Open
J27
(1-2) indicates >5 V 2-3 (default) :Closed
(2-3) indicates 5 V
Enables/disables the load switch (U32) of 5-V supply
generation either from 5-V circuitry or 40-pin LP/BP
1-2 : Open
J28 connector.
2-3 (default) :Closed
(1-2) indicates 20-pin LP/BP
(2-3) indicates 5 V
Onboard 10-pin header provides external user control for
J16 LP/BP spare header
configuring the LP/BP pins partially.
Onboard 16-pin header provides external user control for
J18 DMM trace header 1
JTAG trace signals.
Onboard 16-pin header provides external user control for
J20 DMM trace header 2
JTAG trace signals.

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2.8.2.5 Switches and LEDs

2.8.2.5.1 Switches
Table 2-14 shows the list of push buttons and usage.
Table 2-14. Switches Information
Reference
Designator Usage Comments Image

SW1 GPIO_1 When pushed, the GPIO_1 is pulled to Vcc.

Figure 2-26. SW1

This is used to RESET the mmWave Sensor

device. This signal is also output on the 20-
pin, 60-pin connectors and FTDI interfaces so
SW2 RESET
an external processor can control the mmWave
Sensor device. The onboard XDS110 can also
control this reset.
Figure 2-27. SW2

OFF : SPI-1(default)
S1.1 CAN/SPI selection
ON : CAN
OFF : J16 Header
S1.2 Header(J16) and 40 pin
ON : 40 pin (default)
OFF : 40 pin/J16 header
S1.3 Header(J16)/40 pin and FTDI
ON : FTDI (default)
OFF : 60 pin
S1.4 60 pin and FTDI/40 pin/J16
ON : FTDI/J16 header/40 pin (default)
60 pin/FTDI/40 pin and OFF : 40/60 pin/FTDI
S1.5
XDS110 ON : XDS110 (default)
OFF : 60/40 pin
S1.6 60/40 pin and FTDI
ON : FTDI (default)
OFF : 60/40 pin
S1.7 60/40 pin and FTDI
ON : FTDI (default)
OFF : 60 pin (default)
S1.8 40 pin and 60 pin
ON : 40 pin
OFF : 60 pin (default)
S1.9 40 pin and 60 pin
ON : 40 pin

S1.10 40 pin and FTDI

OFF : 40 pin Figure 2-28. S1 Switch
ON : FTDI (default)
OFF : 40 pin
S1.11 40 pin and FTDI
ON : FTDI (default)
OFF : 14 pin
S1.12 XDS110/14 pin
ON : XDS110 (default)

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Table 2-15 provides the list of LEDs and usage.

Table 2-15. LEDs Information
Reference
Designator Color Usage Comments Image

This LED is used to indicate the state of nRESET pin. If

DS1 Yellow nRESET this LED is glowing, the device is out of reset. This LED
will glow only after the 5-V supply is provided. Figure 2-29. DS1

DS2 Yellow GPIO_2 Glows when the GPIO_2 is logic 1

Figure 2-30. DS2

DS3 Red NERROUT Glows if there is any HW error in the xWR device
DS4 Red POWER This LED indicates the presence of the 5-V supply.
D5 Yellow SOR0 SOR0 (SOP2) state
D6 Yellow SOR1 SOR1 (SOP1) state
D7 Yellow SOR2 SOR2 (SOP0) state
This LED is used to indicate the state of NRST pin. If
D8 Red NRST
this LED is glowing, the device is in reset state.

D10 Red POWER 3V3 supply indication

Figure 2-31. LEDs

D4 Yellow FTDI Glows if the USB is in suspend mode

D9 Red POWER 5-V supply indication (from USB bus)

Figure 2-32. D4 & D9

5-V supply indication if the input voltage to board is

D11 Green POWER
more than 5 V

D14 Green POWER 3V3 supply indication Figure 2-33. D11 & D14

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www.ti.com xWR6843ISK / IWR6843ISK-ODS REV C

3 xWR6843ISK / IWR6843ISK-ODS REV C

Figure 3-1 and Figure 3-2 shows the front and rear view of xWR6843ISK EVM, respectively. This EVM includes
onboard etched long range antennas for the four receivers and three transmitters. The xWR6843 operates at
a 4-Ghz bandwidth from 60 to 64 GHz, with a maximum output power of 10 dBm; the xWR6843ISK has an
antenna gain of ~7 dBi and the IWR6843ISK-ODS has an antenna gain of ~5 dBi.

Note
This chapter applies to Rev. C and up of the AWR6843ISK, IWR6843ISK, and IWR6843ISK-ODS.

3.1 Hardware

CAUTION HOT SURFACE

CONTACT MAY CAUSE BURN
DO NOT TOUCH

3.1.1 xWR6843ISK EVM

Note
The xWR6843ISK has been tested in the 60-64GHz band across the temperature range of -20°C to
60°C. The device is intended for use within the aforementioned limits.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

Figure 3-1. xWR6843ISK Front View

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Figure 3-2. xWR6843ISK Rear View

3.1.2 IWR6843ISK-ODS EVM

The IWR6843ISK-ODS includes onboard-etched short range wide field of view antennas for the four receivers
and three transmitters. Figure 3-3 shows the PCB antennas.

Note
The IWR6843ISK-ODS has been tested in the 60-64GHz band across the temperature range of -20°C
to 60°C.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

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Figure 3-3. PCB Antenna – Top

Figure 3-4. PCB Antenna – Bottom

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3.2 xWR6843ISK/IWR6843ISK-ODS Block Diagram

Figure 3-5 shows the functional block diagram.

Figure 3-5. Block Diagram of xWR6843ISK/IWR6843ISK-ODS

3.3 PCB Storage and Handling Recommendations

The immersion silver finish of the PCB provides a better high-frequency performance, but is also prone to
oxidation in open environments. This oxidation causes the surface around the antenna region to blacken.
To avoid oxidation, the PCB should be stored in an ESD cover and kept at a controlled room temperature with
low humidity conditions. All ESD precautions must be taken while using and handling the EVM.
3.4 Power Connections
The antenna module is powered by the 3.3 V from the 60-pin HD connectors. When power is supplied, an
on-board PMIC and LDO generate the voltages. The PGOOD LED glows to indicate all voltage rails are in limits.

Note
After the 3.3-V supply is provided to the EVM, TI recommends toggling the NRST signal once to
ensure a reliable boot-up state; this signal is accessible on the 60-pin HD connector.

3.4.1 Higher Power Applications

For higher power application tespoint T13 (5V) and T12 (GND) can be used to supply power the EVM.

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3.5 Interfaces

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3.5.1 Switches, Buttons and Muxes

Reference Designator Switch ON Switch OFF
S1.1 SOP2 pulled up SOP2 pulled down
S1.2 SOP1 pulled up SOP1 pulled down
S1.3 SOP0 pulled up SOP0 pulled down
S1.4 Muxes to CAN connector J3, J4 Muxes to SPI on 60 pin connector J1, J6
S1.5 Muxes USER UART to 60 pin header J1 Muxes USER UART to USB connector J5
S1.6 - -
S2 Reset Switch
S3 GPIO1 toggle switch

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3.5.2 List of LEDs

Figure 3-6. LED location and color

Table 3-1shows the list of LEDs.

Table 3-1. List of LEDs
Reference
Designator Color Usage Comments
This LED is used to indicate the PGOOD. If this LED is glowing
D3 Orange Power Good
means that all voltage rails are in limits.
D4 Green USB enumeration Turns on while enumerating the USB
LED
D5 Green Reset Toggles when reset button is depressed
D6 Green 5V indicator Indicates the application of 5V power
D7 Green GPIO 2 Connected to GPIO2, can be used when GPIO is set as output

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3.5.3 CANFD

Figure 3-7. CAN Connector location and label

The J3 and J4 connectors shown in Figure 3-7 provide the CAN_L and CAN_H signals from the 2 onboard
CAND-FD transceivers (TCAN1042HGVDRQ1) These signals are wired to the CAN bus after muxing with the
SPI interface signals; one of the two paths must be selected. Two CANs are selected by closing the switch S1.4
(1st position of switch to be ON).
Pin Description Device Interface Connector on Board
SPI_CS1 CAN2_TX J4.1 - CANL, J4.2 -GND, J4.3 - CANH
SPI_CLK1 CAN2_RX
MISO_1 CAN1_TX J3.1 - CANL, J3.2 -GND, J3.3 - CANH
MOSI_1 CAN1_RX

3.5.4 I2C Connections

The board features an EEPROM, current sensor, and temperature sensor for measuring on-board temperature.
These are connected to the I2C bus and can be isolated using the zero Ω provided on the hardware.
3.5.4.1 EEPROM
The board features an EEPROM for storing the board specific IDs (for the identification of the starter kit
connected to the MMWAVEICBOOST).
3.5.4.2 Default I2C Address
Table 2-11 provides the list of I2C devices and its address.
Table 3-2. IWR6843ISK I2C Devices and Address
Sensor Type Reference Designator Part Number Slave Address
Temperature Sensor U3 TMP112AQDRLRQ1 100 1011
EEPROM U11 CAT24C08WI-GT3 101 00XX (1)
Current sensor1 U6 INA226AIDGST 100 0000

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Table 3-2. IWR6843ISK I2C Devices and Address (continued)

Sensor Type Reference Designator Part Number Slave Address
Current sensor2 U7 INA226AIDGST 100 0101
Current sensor3 U8 INA226AIDGST 100 0001
Current sensor4 U10 INA226AIDGST 100 0100
PMIC U4 LP87702DRHBRQ1 110 0000

(1) XX means 00,01,10,11

3.6 xWR6843ISK Antenna

The xWR6843ISK includes onboard-etched long range antennas for the four receivers and three transmitters.
Figure 3-8 shows the PCB antennas.

Figure 3-8. PCB Antennas

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Figure 3-9. IWR6843ISK antenna placement MIMO array

Figure 3-10 through Figure 3-12 shows the antenna radiation pattern with regard to azimuth. Figure 3-13 through
Figure 3-15 show the antenna radiation pattern with regard to elevation for TX1, TX2, and TX3.
All of the measurements were done with a Tx and Rx combination together. Thus, for the -6dB beam width, you
must see a -12db (Tx (-6dB) + Rx(-6dB)) number.

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Figure 3-10. TX1 Antenna Radiation Pattern in Figure 3-11. TX2 Antenna Radiation Pattern in
Azimuth Azimuth

Figure 3-12. TX3 Antenna Radiation Pattern in Figure 3-13. TX1 Antenna Radiation Pattern in
Azimuth Elevation

Figure 3-14. TX2 Antenna Radiation Pattern in Figure 3-15. TX3 Antenna Radiation Pattern in
Elevation Elevation

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3.7 IWR6843ISK-ODS Antenna

The IWR6843ISK-ODS includes on-board-etched short range antennas (approximately 12-15 meters for people
detection) for the four receivers and three transmitters. Figure 3-16 shows the PCB antennas arrangement. This
provides equal angular resolution both in Azimuth and Elevation directions with the help of 4 × 3 virtual antennas
positions.

Figure 3-16. IWR6843ISK-ODS PCB Antenna

Figure 3-17. IWR6843ISK-ODS antenna placement MIMO array

Figure 3-18 shows combined Antenna Radiation pattern in the Azimuth plane for all the transmitter and receiver
pairs together (TX[1-3]-RX[1-4]).

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Figure 3-18. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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Figure 3-19 shows the combined Antenna Radiation pattern in the Elevation plane for all the transmitter and
receiver pairs together, TX[1-3]-RX[1-4].

Figure 3-19. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

3.8 Modular Mode

When used in modular mode as shown in Figure 3-21, the power is supplied through a single USB connector;
the same connector J5 is also used for data transfer through the CP2015 USB to UART emulator.
When enumerated correctly, the 2 UART ports are displayed on the device manager as a Virtual COM Port,
similar to that shown in Figure 3-20.

Figure 3-20. Virtual COM port

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Figure 3-21. Modular Mode Setup

S1 switch setting for functional and flashing mode is shown in Table 3-3.
Table 3-3. S1 Config Flashing and Functional Mode
s1.1 s1.2 s1.3 s1.4 s1.5 s1.6
Flashing On Off On On Off -
Functional Off Off On On Off -

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3.9 DCA1000EVM Mode

The setup for raw data capture using DCA1000EVM is shown in Figure 3-22

Figure 3-22. DCA1000EVM mode

S1 switch settings for this mode is shown in Table 3-4

Table 3-4. S1 Config for DCA1000EVM mode
S1.1 S1.2 S1.3 S1.4 S1.5 S1.6
DCA1000EVM OFF ON ON OFF OFF -
mode

3.10 MMWAVEICBOOST Mode

In this mode the boards are setup as shown in Figure 3-23, UART is routed to the 60 pin connector to the
XDS110 USB. More on the mmWAVEICBOOST, setup and features it provides can be found in Section 2

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Figure 3-23. mmWAVEICBOOST mode

S1 switch settings for mmWAVEICBOOST mode is shown in Table 3-5

Table 3-5. S1 Config for mmWAVEICBOOST mode
S1.1 S1.2 S1.3 S1.4 S1.5 S1.6
mmWAVEICBOO Off Off Off Off On -
ST mode

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4 xWR6843AOPEVM Rev G

CAUTION HOT SURFACE

CONTACT MAY CAUSE BURN
DO NOT TOUCH

Note
RECOMMENDED DUTY CYCLE: The xWR6843AOPEVM operates at a maximum duty cycle of 50%:
running at a higher duty cycle increases the risk of damaging the EVM by exceeding the maximum
operating junction temperature (Tj) of 105°C.

Note
This chapter applies to the AWR6843AOPEVM and IWR6843AOPEVM

4.1 Hardware
The xWR6843AOPEVM includes four receivers and three transmitters with wide field of antennas on the
package of the device. The IWR6843AOP and AWR6843AOP operate at a 4-Ghz bandwidth from 60 to 64
GHz, with a maximum output power of 10 dBm and an antenna gain of ~5 dBi.

Note
The xWR6843AOPEVM has been tested in the 60 - 64GHz frequency range across the ambient
temperature range of -20°C to 60°C.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

Note
Refer to the Thermal Design Guide for Antenna on Package mmWave Sensor application note for
details of thermal dissipation options for xWR6843 AOP devices, particularly for small form factor
designs such as the mission side of the EVM.

Figure 4-1. xWR6843AOPEVM Top View

The following features are available on the mission AOP board of the xWR6843AOPEVM:
• 60-GHz to 64-GHz mmWave sensing for form-factor deployment and testing

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• Functional and flashing SOP Mode

• Emulator USB port for user UART and Data COM ports

Figure 4-2. xWR6843AOPEVM Bottom View

CAUTION
There is a possibility of damage and loss of function to the mission board when it is split. When split,
the board cannot be put back together and many features are lost; see the Section 5.1 section for
features available on the mission board. Raw data capture, JTAG debug and other features requiring
the 60 pin SAMTEC connectors are permanently lost.

4.2 Block Diagram

Figure 4-3 shows the functional block diagram. The mission board side contains the essential components
for the TI radar system namely PMIC, SFLASH, SOP configuration, Filter, TI mmWave Radar chip, and a
USB to UART converter. The Breakaway board sections contain the 60-pin Samtec connector for interfacing
with the MMWAVEICBOOST. On the REVG, an additional 60-pin connector is provided to directly connect to
DCA1000EVM.

Figure 4-3. Block Diagram of the xWR6843AOPEVM

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4.3 PCB Storage and Handling Recommendations

This EVM contains components that can potentially be damaged by electrostatic discharge. Always transport
and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, refer to SSYA010A.
4.4 Heat Sink and Temperature
Users are strongly encouraged to use the xWR6843AOPEVM with the heat sink installed. Due to the smaller
size of the xWR6843AOPEVM, it is likely to get warmer than other larger sized EVMs on the mmWave Radar
portfolio so care must be taken to ensure the junction temperature does not exceed 105°C. Figure 4-4 shows
measurement of junction temperature versus duty cycle taken with and without the heat sink. As seen in the
plot, the EVM can safely operate up to 50% duty cycle with or without the heat sink. Although the heatsink is
not absolutely required, usage of the heat sink provides protection against exceeding the junction temperature at
higher duty cyles.

Figure 4-4. Duty Cycle versus Junction Temperature

When using the EVM for custom applications, the duty cycle can be adjusted as needed, the heat sink provided
with the kit can be used, customers can also design their own heat sink using better heat disippating materials or
one with more surface area such as addition of fins. The CAD drawing for the heat sink is shown in Figure 4-5.

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Figure 4-5. Heat sink CAD drawing

Application of the heat sink is shown in Figure 4-6.

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Figure 4-6. Heat sink placement

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4.5 xWR6843AOPEVM Antenna

The xWR6843AOPEVM includes four receiver and three transmitter short range antennas on the package of the
chip. Figure 4-7 shows the antenna on package.

Figure 4-7. AOP Antennas

Figure 4-8. IWR6843AOP antenna placement MIMO array

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Figure 4-9 shows the antenna radiation pattern with regard to azimuth. Figure 4-10 shows the antenna radiation
pattern with regard to elevation for TX1, TX2, and TX3. Both show the radiation pattern for TX1, TX2, and TX3
and RX1, RX2, RX3, and RX4 together.

Figure 4-9. Measured Azimuth Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

Figure 4-10. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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4.6 Switch Settings

Figure 4-11 shows the part designators and positions of the switches on the xWR6843AOPEVM.

Figure 4-11. xWR6843AOPEVM Switches

Table 4-1. Switches

Reference Designator Switch ON Switch OFF
S1.1 UART routed to 60-pin connector / Bluetooth UART routed to CP2105 UART
S1.2 UART routed to 60-pin connector UART routed to Bluetooth
S1.3 SOP0 pulled down SOP0 pulled up
S1.4 SOP1 pulled up SOP1 pulled down
S2.1 SPI MISO/MOSI routed to CAN Transceiver SPI MISO/MOSI routed to 60-pin connector /
BT/ LCD
S2.2 SPI CS routed to 60-pin connector SPI CS routed to BT/ LCD
S2.3 Bluetooth Enable Bluetooth Disable
S2.4 Not Connected Not Connected
S3 SOP2 Pulled up SOP2 Pulled down
SW2 Reset switch
SW3 User switch

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4.7 xWR6843AOPEVM Muxing Scheme

The xWR6843AOPEVM UART RX/TX can be routed to the Samtec 60-pin connector, USB to UART (CP2105),
and bluetooth (BT) device (CC2640R2F), as detailed in Table 4-2.
Table 4-2. Pin Mux Settings
Modes S1.1 S1.2 S1.3 S1.4 S2.1 S2.2 S2.3 S2.4 S3
Modular OFF NA OFF OFF OFF N/A N/A N/A OFF (Functional
(USB)CP2105, see AOP IC Mode)
Figure 7-8
ON (Flashing AOP
IC Mode)
Modular - ON OFF (Functional OFF OFF OFF OFF OFF (Functional N/A OFF
(Bluetooth)CC2642R Bluetooth Mode) Bluetooth Mode)
2F, see Figure 7-9
ON ON
(Programming (Programming
Bluetooth Mode) Bluetooth Mode)
MMWAVEICBOOST ON ON ON OFF OFF ON N/A N/A OFF
- Samtec 60 Pin
Conn, see Figure
7-10

4.7.1 SOP Configuration

Table 4-3. SOP Configuration
SOP0(S1.3) SOP1(S1.4) SOP2(S3)
Flashing OFF OFF ON
Functional OFF OFF OFF
MMWAVEICBOOST Mode ON OFF OFF
(DCA1000, JTAG, and so forth)

Note
SOP0 is pulled high when switch is on the OFF position and low when the switch is the ON position.
SOP 1 and 2 are pulled low when the switch is OFF and high when the switch is ON.
In MMWAVEICBOOST mode, the xWR6843AOPEVM is mounted on the MMWAVEICBOOST and the
SOP mode is set by the MMWAVEICBOOST.

4.8 Modular, DCA1000EVM and MMWAVEICBOOST Mode

The IWR6843AOP can be used in modular mode or mounted on the MMWAVEICBOOST for debugging.
4.8.1 Modular Mode
When used in Modular mode, the UART can either be routed to the CP2105 device, which displays the data on
the mmWave visualizer, or to other devices connected to the USB interface. The UART data can also be routed
to the CC2642R2F, which transmits data to a wireless device through Bluetooth. Figure 4-12 shows the setup for
CP2105. Figure 4-13 shows the setup for CC2642R2F. 1

1 For higher power application ensure the USB J1 is connected before connecting USB J5.

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Figure 4-12. Switch Configuration for Modular (USB) Mode

Figure 4-13. Switch Configuration for Modular (Bluetooth) Mode

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4.8.2 DCA1000EVM Mode

In REV G, a second 60-pin connector (connector J11) is provided to allow for direct connection to
DCA1000EVM. When in this mode, set the switch settings as shown in figure below

Figure 4-14. Switch Configuration for DCA1000EVM Mode

Figure 4-15. Setup with xWR6843AOPEVM and DCA1000EVM

4.8.3 MMWAVEICBOOST Mode

This mode enables access to debugging tools available on the MMWAVEICBOOST such as the JTAG, ADC
capture, CAN, LaunchPad connector, and so forth.

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Figure 4-16. xWR6843AOPEVM Mounted on MMWAVEICBOOST

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For mounted mode, the UART should be routed to the 60-pin connector. Set up the device as shown in Figure
4-17. When mounted as shown, the SOP mode is overridden by the MMWAVEICBOOST SOP configuration.

Figure 4-17. Switch Configuration for MMWAVEICBOOST Mode

4.9 Known Issues: Spurious Performance

A power vs frequency plot of the raw ADC data captured with DCA100EVM shows a spur near 4MHz that is
12dB above the ADC noise floor. This spur degrades the available spur- free dynamic range (SFDR) of the
frontend receiver.
The spur is as a result of the switching of the power module device (LP87524) at 4MHz which couples via the
power supplies of the IWR6843AOP device.
The power module device (LP87524) has a feature to enable spread spectrum which can be leveraged to reduce
the level of the spur. More on spread spectrum can be found in section 7.3.1.4 of the LP87524 data sheet.
Enabling spread spectrum mode is recommended and it has the effect of reducing the spur level by 10dB,
lowering the noise spectral density and shfting the spur frequency from 4MHz to 3.89MHz.
Spread spectrum mode can be enabled by writing the following to the I2C interface of the power module:
• Write 0x01 to register address 0x2B, I2C address = 0x60
• Write 0xD6 to register address 0x2C, I2C address = 0x60
For help enabling the spread spectrum mode, contact TI support through E2E.

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Figure 4-18. ADC spectrum with spread spectrum enabled (blue) vs disabled (red)

4.10 PC Connection
4.10.1 Installing the Drivers
The CP2105 drivers must be installed to access the UART port. Download and install the drivers here.
When installed correctly, the COM port should be enumerated as shown in .

Figure 4-19. CP2105 COM Ports

The enhanced COM port is the application/user UART and the standard COM port is the data port.

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4.10.2 Flashing the Board

1. Ensure the drivers have been successfully installed and COM ports enumerated.
2. Configure the SOP to flashing mode.
3. Run the UniFlash tool.
4. Press the reset switch to ensure that the board boots up in the right mode.
5. Enter the Enhanced COM Port in UniFlash interface.
6. Load image to serial flash.
4.11 REACH Compliance
In compliance with the Article 33 provision of the EU REACH regulation, this is to notify you that this EVM
includes component(s) containing at least one substance of very high concern (SVHC) above 0.1%. The uses
from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:
Table 4-4. REACH Information
Component Component Part SVHC CAS (when
Manufacturer Component Type Number SVHC Substance available)
1,3,5-tris(oxiranylmethyl)-1,3,5-
Bivar LED SM0402GC 2451-62-9
triazine-2,4,6(1H,3H,5H)-trione

4.12 Regulatory Statements with Respect to the xWR6843AOPEVM Rev G

FCC
1. FCC Interference Statement (Part 15.105 (a))
Note: This equipment has been tested and found to camply with the limits for a Class A digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance
with the instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in which case the user will be required
to correct the interference at his own expense.
2. FCC Part 15 Clause 15.21 [ Do not Modify warning]:
“Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment”.
3. FCC Part 15.19(a) [interference compliance statement], unless the following statement is already provided
on the device label:
“This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.”
4. RF Exposure Guidance Statement (in English, for mobile equipment used a specified distance away from
persons):
“In order to comply with FCC RF Exposure requirements, this device must be installed to provide at least 20
cm separation from the human body at all times.”
5. The xWR6843AIOEVM Rev G per 15.255 rules can only be used in fixed applications.

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5 xWR6843AOPEVM Rev F

CAUTION HOT SURFACE

CONTACT MAY CAUSE BURN
DO NOT TOUCH

Note
RECOMMENDED DUTY CYCLE: The xWR6843AOPEVM operates at a maximum duty cycle of 50%:
running at a higher duty cycle increases the risk of damaging the EVM by exceeding the maximum
operating junction temperature (Tj) of 105°C.

Note
This chapter applies to the AWR6843AOPEVM and IWR6843AOPEVM

5.1 Hardware
The xWR6843AOPEVM includes four receivers and three transmitter wide field of antennas on the package of
the device. The IWR6843AOP and AWR6843AOP operate at a 4-Ghz bandwidth from 60 to 64 GHz, with a
maximum output power of 10 dBm; the xWR6843AOPEVM has an antenna gain of ~5 dBi.

Note
The xWR6843AOPEVM has been tested in the 60 - 64GHz band across the temperature range of
-20°C to 60°C.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

Note
Refer to the Thermal Design Guide for Antenna on Package mmWave Sensor application note for
details of thermal dissipation options for xWR6843 AOP devices, particularly for small form factor
designs such as the mission side of the EVM.

Figure 5-1. xWR6843AOPEVM Top View

When split, the following features are available:

• 60-GHz to 64-GHz mmWave sensing for form-factor deployment and testing
• Functional and flashing SOP Mode

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• Emulator USB port for user UART and Data COM ports

Figure 5-2. xWR6843AOPEVM Bottom View

CAUTION
There is a possibility of damage and lose of function to the mission board when it is split. When split,
the board cannot be put back together and many features are lost; see the Section 5.1 section for
features available on the mission board. Raw data capture, JTAG debug and other features requiring
the 60 pin SAMTEC connectors are permanently lost.

5.2 Block Diagram

Figure 5-3 shows the functional block diagram. The mission board side contains the essential components
for the TI radar system, PMIC, SFLASH, SOP configuration, Filter, TI mmWave Radar chip, and a USB to
UART converter. The Breakaway board sections contain the 60-pin Samtec connector for interfacing with the
MMWAVEICBOOST.

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Figure 5-3. Block Diagram of the xWR6843AOPEVM

5.3 PCB Storage and Handling Recommendations

This EVM contains components that can potentially be damaged by electrostatic discharge. Always transport
and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, refer to SSYA010A.
5.4 Heat Sink and Temperature
Users are strongly encouraged to use the xWR6843AOPEVM with the heat sink installed. Due to the smaller
size of the xWR6843AOPEVM, it is likely to get warmer than other larger sized EVMs on the mmWave Radar
portfolioso care must be taken to ensure the junction temperature does not exceed 105°C. Figure 5-4 shows
measurement of junction temperature versus duty cycle taken with and without the heat sink. As seen in the
plot, the EVM can safely operate up to 50% duty cycle with or without the heat sink. Although the heatsink is
not absolutely required, usage of the heat sink provides protection against exceeding the junction temperature at
higher duty cyles.

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Figure 5-4. Duty Cycle versus Junction Temperature

When using the EVM for custom applications, the duty cycle can be adjusted as needed, the heat sink provided
with the kit can be used, customers can also design their own heat sink using better heat disippating materials or
one with more surface area such as addition of fins. The CAD drawing for the heat sink is shown in Figure 5-5

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Figure 5-5. Heat sink CAD drawing

Application of the heat sink is shown in Figure 5-6

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Figure 5-6. Heat sink placement

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5.5 xWR6843AOPEVM Antenna

The xWR6843AOPEVM includes four receiver and three transmitter short range antennas on the package of the
chip. Figure 5-7 shows the antenna on package.

Figure 5-7. AOP Antennas

Figure 5-8. IWR6843AOP antenna placement MIMO array

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Figure 5-9 shows the antenna radiation pattern with regard to azimuth. Figure 5-10 shows the antenna radiation
pattern with regard to elevation for TX1, TX2, and TX3. Both show the radiation pattern for TX1, TX2, and TX3
and RX1, RX2, RX3, and RX4 together.

Figure 5-9. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

Figure 5-10. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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5.6 Switch Settings

Figure 5-11 shows the part designators and positions of the switches on the xWR6843AOPEVM.

Figure 5-11. xWR6843AOPEVM Switches

Table 5-1. Switches

Reference Designator Switch ON Switch OFF
S1.1 UART routed to 60-pin connector / Bluetooth UART routed to CP2105 UART
S1.2 UART routed to 60-pin connector UART routed to Bluetooth
S1.3 SOP0 pulled down SOP0 pulled up
S1.4 SOP1 pulled up SOP1 pulled down
S2.1 SPI MISO/MOSI routed to CAN Transceiver SPI MISO/MOSI routed to 60-pin connector /
BT/ LCD
S2.2 SPI CS routed to 60-pin connector SPI CS routed to BT/ LCD
S2.3 Bluetooth Enable Bluetooth Disable
S2.4 Not Connected Not Connected
S3 SOP2 Pulled up SOP2 Pulled down
SW2 Reset switch
SW3 User switch

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5.7 xWR6843AOPEVM Muxing Scheme

The xWR6843AOPEVM UART RX/TX can be routed to the Samtec 60-pin connector, USB to UART
(SICP2105), and bluetooth (BT) device (CC2640R2F), as detailed in Table 5-2
Table 5-2. Pin Mux Settings
Modes S1.1 S1.2 S1.3 S1.4 S2.1 S2.2 S2.3 S2.4 S3
Modular OFF NA OFF OFF OFF N/A N/A N/A OFF (Functional
(USB)SICP2015, AOP IC Mode)
see Figure 7-8
ON (Flashing AOP
IC Mode)
Modular - ON OFF (Functional OFF OFF OFF OFF OFF (Functional N/A OFF
(Bluetooth)CC2642R Bluetooth Mode) Bluetooth Mode)
2F, see Figure 7-9
ON ON
(Programming (Programming
Bluetooth Mode) Bluetooth Mode)
MMWAVEICBOOST ON ON ON OFF OFF ON N/A N/A OFF
- Samtec 60 Pin
Conn, see Figure
7-10

5.7.1 SOP Configuration

Table 5-3. SOP Configuration
SOP0(S1.3) SOP1(S1.4) SOP2(S3)
Flashing OFF OFF ON
Functional OFF OFF OFF
MMWAVEICBOOST Mode ON OFF OFF
(DCA1000, JTAG, and so forth)

Note
SOP0 is pulled high when switch is on the OFF position and low when the switch is the ON position.
SOP 1 and 2 are pulled low when the switch is OFF and high when the switch is ON.
In MMWAVEICBOOST mode, the xWR6843AOPEVM is mounted on the MMWAVEICBOOST and the
SOP mode is set by the MMWAVEICBOOST.

5.8 Modular and MMWAVEICBOOST Mode

The IWR6843AOP can be used in modular mode or mounted on the MMWAVEICBOOST for debugging.
5.8.1 Modular Mode
When used in Modular mode, the UART can either be routed to the SICP2015, which displays the data on the
mmWave visualizer, or to other devices connected to the USB interface. The UART data can also be routed to
the CC2642R2F, which transmits data to a wireless device through Bluetooth. Figure 5-12 shows the setup for
SICP2015. Figure 5-13shows the setup for CC2642R2F. 2

2 For higher power application ensure the USB J1 is connected before connecting USB J5.

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Figure 5-12. Switch Configuration for Modular Mode

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Figure 5-13. Switch Configuration for Bluetooth Mode

5.8.2 MMWAVEICBOOST Mode

This mode enables access to debugging tools available on the MMWAVEICBOOST such as the JTAG, ADC
capture, CAN, LaunchPad connector, and so forth.

Figure 5-14. xWR6843AOPEVM Mounted on MMWAVEICBOOST

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For mounted mode, the UART should be routed to the 60-pin connector. Set up the device as shown in Figure
5-15. When mounted as shown, the SOP mode is overridden by the MMWAVEICBOOST SOP configuration.

Figure 5-15. Switch Configuration for MMWAVEICBOOST Mode

5.9 PC Connection
5.9.1 Installing the Drivers
The SICP2105 drivers must be installed to access the UART port. Download and install the drivers here.
When installed correctly, the COM port should be enumerated as shown in .

Figure 5-16. SICP2015 COM Ports

The enhanced COM port is the application/user UART and the standard COM port is the data port.

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5.9.2 Flashing the Board

1. Ensure the drivers have been successfully installed and COM ports enumerated.
2. Configure the SOP to flashing mode.
3. Run the UniFlash tool.
4. Press the reset switch to ensure that the board boots up in the right mode.
5. Enter the Enhanced COM Port in UniFlash interface.
6. Load image to serial flash.
5.9.3 DCA1000
For data capture using the DCA1000, set up the board to MMWAVEICBOOST mode, having the SOP and UART
muxed set correctly. Continue as you would with the IWR6843ISK. For more information, see Section 2.5.3.
5.10 REACH Compliance
In compliance with the Article 33 provision of the EU REACH regulation, this is to notify you that this EVM
includes component(s) containing at least one substance of very high concern (SVHC) above 0.1%. The uses
from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:
Table 5-4. REACH Information
Component Component Part SVHC CAS (when
Manufacturer Component Type Number SVHC Substance available)
1,3,5-tris(oxiranylmethyl)-1,3,5-
Bivar LED SM0402GC 2451-62-9
triazine-2,4,6(1H,3H,5H)-trione

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6 IWR6843ISK / IWR6843ISK-ODS (deprecated)

Figure 6-1 and Figure 6-2 shows the front and rear view of IWR6843ISK EVM, respectively. This EVM includes
onboard etched long range antennas for the four receivers and three transmitters. The IWR6843 operates at a
4-Ghz bandwidth from 60 to 64 GHz, with a maximum output power of 10 dBm; the IWR6843ISK has an antenna
gain of ~7 dBi and the IWR6843ISK-ODS has an antenna gain of ~5 dBi.
6.1 Hardware

CAUTION HOT SURFACE

CONTACT MAY CAUSE BURN
DO NOT TOUCH

6.1.1 IWR6843ISK EVM

Note
The IWR6843ISK has been tested in the 60-64GHz band across the temperature range of -20°C to
60°C. The device is intended for use within the aforementioned limits.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

Figure 6-1. IWR6843ISK Front View

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Figure 6-2. IWR6843ISK Rear View

6.1.2 IWR6843ISK-ODS EVM

The IWR6843ISK-ODS includes onboard-etched short range wide field of view antennas for the four receivers
and three transmitters. Figure 6-3 shows the PCB antennas.

Note
The IWR6843ISK-ODS has been tested in the 60-64GHz band across the temperature range of -20°C
to 60°C.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

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Figure 6-3. PCB Antenna – Top

Figure 6-4. PCB Antenna – Bottom

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6.2 IWR6843ISK/IWR6843ISK-ODS Block Diagram

Figure 6-5 shows the functional block diagram.
INA226

2m
3.3 V LOAD SW
TPS22917
TEMP SENS
INA226 RX
TMP112A

2m
3.3 V 1.8 V
SW B0

QSPI flash
INA226 MX25V1635

SW B1 2m TX
1.24 V
LP8770
PMIC EEPROM
INA226 CAT24C08 IWR6843
CHIP
2m
LDO 1.0/1.24 V
TPS7A53
1.7 V
VPP
XTAL
VOUT_PA
40 MHz

I2C
VOUT_SYNTH

MISC
RESET
RS232
JTAG VOUT_PLL

SPI
LVDS
DP [7:0]
OPTIONAL VBGAP
GPIO [2:0]
1.2 V 1.8 V 1.0 V 5V
DP[15:8] LVDS

60 PIN CONNECTOR 60 PIN CONNECTOR

Figure 6-5. Block Diagram of IWR6843ISK/IWR6843ISK-ODS

6.3 PCB Storage and Handling Recommendations

The immersion silver finish of the PCB provides a better high-frequency performance, but is also prone to
oxidation in open environments. This oxidation causes the surface around the antenna region to blacken.
To avoid oxidation, the PCB should be stored in an ESD cover and kept at a controlled room temperature with
low humidity conditions. All ESD precautions must be taken while using and handling the EVM.
6.4 Power Connections
The Industrial starter kit is powered by the 3.3 V from the 60-pin HD connectors. When power is supplied, an
on-board PMIC and LDO generate the voltages. The PGOOD LED glows to indicate all voltage rails are in limits.

Note
After the 3.3-V supply is provided to the EVM, TI recommends toggling the NRST signal once to
ensure a reliable boot-up state; this signal is accessible on the 60-pin HD connector.

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6.5 Miscellaneous and LEDs

6.5.1 List of LEDs
Table 6-1 shows the list of LEDs.
Table 6-1. List of LEDs
Reference
Designator Color Usage Comments Image

This LED is used to indicate the PGOOD. If this

DS1 Yellow Power Good LED is glowing means that all voltage rails are in
limits.

Figure 6-6. PGood LED

6.5.2 I2C Connections

The board features an EEPROM, current sensor, and temperature sensor for measuring on-board temperature.
These are connected to the I2C bus and can be isolated using the zero Ω provided on the hardware.
6.5.2.1 EEPROM
The board features an EEPROM for storing the board specific IDs (for the identification of the starter kit
connected to the MMWAVEICBOOST).
6.5.2.2 Default I2C Address
Table 6-2 provides the list of I2C devices and its address.
Table 6-2. IWR6843ISK I2C Devices and Address
Sensor Type Reference Designator Part Number Slave Address
Temperature Sensor U3 TMP112AQDRLRQ1 100 1011
EEPROM U11 CAT24C08WI-GT3 101 00XX (1)
Current sensor1 U6 INA226AIDGST 100 0000
Current sensor2 U7 INA226AIDGST 100 0101
Current sensor3 U8 INA226AIDGST 100 0001
Current sensor4 U10 INA226AIDGST 100 0100
PMIC U4 LP87702DRHBRQ1 110 0000

(1) XX means 00,01,10,11

6.6 IWR6843ISK Antenna

The IWR6843ISK includes onboard-etched long range antennas for the four receivers and three transmitters.
Figure 6-7 shows the PCB antennas.

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Figure 6-7. PCB Antennas

Figure 6-8 through Figure 6-10 shows the antenna radiation pattern with regard to azimuth. Figure 6-11 through
Figure 6-13 show the antenna radiation pattern with regard to elevation for TX1, TX2, and TX3.
All of the measurements were done with a Tx and Rx combination together. Thus, for the -6dB beam width, you
must see a -12db (Tx (-6dB) + Rx(-6dB)) number.

Figure 6-8. TX1 Antenna Radiation Pattern in Figure 6-9. TX2 Antenna Radiation Pattern in
Azimuth Azimuth

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Figure 6-10. TX3 Antenna Radiation Pattern in Figure 6-11. TX1 Antenna Radiation Pattern in
Azimuth Elevation

Figure 6-12. TX2 Antenna Radiation Pattern in Figure 6-13. TX3 Antenna Radiation Pattern in
Elevation Elevation

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6.7 IWR6843ISK-ODS Antenna

The IWR6843ISK-ODS includes on-board-etched short range antennas (approximately 12-15 meters for people
detection) for the four receivers and three transmitters. Figure 6-14 shows the PCB antennas arrangement. This
provides equal angular resolution both in Azimuth and Elevation directions with the help of 4 × 3 virtual antennas
positions.

Figure 6-14. IWR6843ISK-ODS PCB Antenna

Figure 6-15 shows combined Antenna Radiation pattern in the Azimuth plane for all the transmitter and receiver
pairs together (TX[1-3]-RX[1-4]).

Figure 6-15. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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Figure 6-16 shows the combined Antenna Radiation pattern in the Elevation plane for all the transmitter and
receiver pairs together, TX[1-3]-RX[1-4].

Figure 6-16. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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7 IWR6843AOPEVM (Deprecated)

CAUTION HOT SURFACE

CONTACT MAY CAUSE BURN
DO NOT TOUCH

Note
RECOMMENDED DUTY CYCLE: The IWR6843AOPEVM operates at a maximum duty cycle of 50%,
running at a higher duty cycle increases the risk of damaging the EVM by exceeding the maximum
operating junction temperature (Tj) of 105°C.

7.1 Hardware
The IWR6843AOPEVM includes four receivers and three transmitter wide field of antennas on the package of
the device. The IWR6843 operates at 4-Ghz bandwidth from 60 to 64 GHz, with a maximum output power of 10
dBm; the IWR6843AOPEVM has an antenna gain of ~6 dBi.

Note
The IWR6843AOPEVM has been tested in the 60-64GHz band across the temperature range of -20°C
to 60°C.

Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
should be maintained between the user and the EVM during operation.

Figure 7-1. IWR6843AOPEVM Top View

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Figure 7-2. IWR6843AOPEVM Bottom View

7.2 Block Diagram

Figure 7-3 shows the functional block diagram. The mission board side contains the essential components
for the TI radar system, PMIC, SFLASH, SOP configuration, Filter, TI mmWave Radar chip, and a USB to
UART converter. The Breakaway board sections contain the 60-pin Samtec connector for interfacing with the
MMWAVEICBOOST.

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Figure 7-3. Block Diagram of the IWR6843AOPEVM

7.3 PCB Storage and Handling Recommendations

This EVM contains components that can potentially be damaged by electrostatic discharge. Always transport
and store the EVM in it's supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on
an antistatic work surface. For more information on proper handling, refer to SSYA010A.
7.4 IWR6843AOPEVM Antenna
The IWR6843AOPEVM includes four receiver and three transmitter short range antennas on the package of the
chip. Figure 7-4 shows the antenna on package.

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Figure 7-4. AOP Antennas

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Figure 7-5 shows the antenna radiation pattern with regard to azimuth. Figure 7-6 shows the antenna radiation
pattern with regard to elevation for TX1, TX2, and TX3. Both show the radiation pattern for TX1, TX2, and TX3,
and RX1, RX2, RX3, and RX4 together.

Figure 7-5. Measured Azimuthal Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

Figure 7-6. Measured Elevation Radiation Pattern for All Tx to Rx Pairs (All 12 Virtual Antenna Pairs
Included)

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7.5 Switch Settings

Figure 7-7 shows the part designators and positions of the switches on the IWR6843AOPEVM.

Figure 7-7. IWR6843AOPEVM Switches

Table 7-1. Switches

Reference Designator Switch ON Switch OFF
S1 60-pin connector Bluetooth
S2 Disable 60-pin to Bluetooth Enable 60-pin to Bluetooth
S3 SOP2 Pull up SOP2 pull down
S4 Breakaway UART Mainboard UART
S5 60-pin connector Bluetooth/LCD
S6 Bluetooth Enable Bluetooth Disable
SW1-1 SOP1 pull up SOP1 pull down
SW1-2 SOP0 pull down SOP0 pull up
SW2 Reset switch
SW3 User switch

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7.6 IWR6843AOPEVM Muxing Scheme

The IWR6843AOPEVM UART RX/TX can be routed to the Samtec 60-pin connector, USB to UART (SICP2105),
and bluetooth (BT) device (CC2640R2F), as detailed in Table 7-2 and Table 7-3.
Table 7-2. Pin Mux Settings I
Reference Designator Switch ON Switch OFF
S1 60-Pin Connector BT
S2 Disable 60-pin to BT Enable 60-pin to BT
S4 Breakaway UART Mainboard UART
S5 60-Pin Connector BT/LCD
S6 BT Enable BT Disable

Table 7-3. Pin Mux Settings II

S1 S2 S4 S5 S6
Modular Mode N/A ON OFF N/A N/A
SICP2015,. see
Figure 7-8
Modular Mode - OFF OFF ON OFF ON
CC2640R2F, see
Figure 7-9
MMWAVEICBOOST - ON ON ON ON OFF
Samtec 60-Pin Conn,
see Figure 7-10

7.6.1 SOP Configuration

SOP0(SW12) SOP1(SW11) SOp2(S3)
Flashing OFF OFF ON
Functional OFF OFF OFF
MMWAVEICBOOST Mode ON OFF OFF
(DCA1000, JTAG, and so forth)

Note
SOP0 is set high when switch is on the OFF position and low when the switch is the ON position. SOP
1 and 2 are set low when the switch is OFF and high when the switch is ON.
In mounted mode, the IWR6843AOPEVM is mounted on the MMWAVEICBOOST and the SOP mode
is set by the MMWAVEICBOOST.

7.7 Modular and MMWAVEICBOOST Mode

The IWR6843AOP can be used in modular mode or mounted on the MMWAVEICBOOST for debugging.
7.7.1 Modular Mode
When used in modular mode, the UART can either be routed to the SICP2015, which displays the data on the
mmWave visualizer, or to other devices connected to the USB interface. The UART data can also be routed to
the CC2640R2F, which transmits data to a wireless device through Bluetooth. Figure 7-8 shows the setup for
SICP2015. Figure 7-9 shows the setup for CC2640R2F. 3

3 For higher power application ensure the USB J1 is connected before connecting USB J5.

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Figure 7-8. Switch Configuration for Modular Mode

Figure 7-9. Switch Configuration for BT Mode

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7.7.2 MMWAVEICBOOST Mode

This mode enables access to debugging tools available on the MMWAVEICBOOST such as the JTAG, ADC
capture, CAN, LaunchPad connector, and so forth.

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For mounted mode, the UART should be routed to the 60-pin connector. Set up the device as shown in Figure
7-10. When mounted as shown, the SOP mode is overridden by the MMWAVEICBOOST SOP configuration.

Figure 7-10. Switch Configuration for MMWAVEICBOOST Mode

When mounted and setup correctly, the MMWAVEICBOOST can be used same as the IWR6843ISK and
IWR6843ODS with DCA1000EVM, LaunchPads, and so forth.
7.8 PC Connection
7.8.1 Installing the Drivers
The SICP2105 drivers must be installed to access the UART port. Download and install the drivers here.
When installed correctly, the COM port should be enumerated as shown in Figure 7-11.

Figure 7-11. SICP2015 COM Ports

The enhanced COM port is the application/user UART and the standard COM port is the data port.

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7.8.2 Flashing the Board

1. Ensure the drivers have been successfully installed and COM ports enumerated.
2. Configure the SOP to flashing mode.
3. Run the UniFlash tool.
4. Press the reset switch to ensure that the board boots up in the right mode.
5. Enter the Enhanced COM Port in the UniFlash interface.
6. Load image to serial flash.
7.8.3 DCA1000
For data capture using the DCA1000, set up the board to mounted mode, having the SOP and UART muxed set
correctly. Continue as you would with the xWR6843ISK. For more information, see Section 2.5.3.
7.9 REACH Compliance
In compliance with the Article 33 provision of the EU REACH regulation, this is to notify you that this EVM
includes component(s) containing at least one substance of very high concern (SVHC) above 0.1%. The uses
from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:
Component Component Part SVHC CAS (when
Manufacturer Component Type Number SVHC Substance available)
1,3,5-tris(oxiranylmethyl)-1,3,5-
Bivar LED SM0402GC 2451-62-9
triazine-2,4,6(1H,3H,5H)-trione

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8 TI E2E Community
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!

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9 Certification Related Information

For certification related information please see certification collateral on TIREX
Per the Radio Equipment Directive (RED) requirement for sales in Europe the evaluation modules operate in the
57 – 64 GHz band with a declared max mean power as detailed in the following table.
Table 9-1. Declared Maximum Mean Power
Model Declared Power (mW EIRP) Declared Power (dBm EIRP)

IWR6843ISK 1 14 11.5

IWR6843ISK-ODS 1 27 14.3

IWR6843AOPEVM 1 23 13.6

1. for more information on test and chirp setup for the test, see TIREXpage

Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from November 1, 2020 to May 30, 2022 (from Revision D (November 2020) to
Revision E (May 2022)) Page
• Added Note to xWR6843ISK / IWR6843ISK-ODS REV C section................................................................... 29
• Added Note to xWR6843AOPEVM Rev F section............................................................................................46
• Added Regulatory Statements with Respect to the xWR6843AOPEVM Rev G section.................................. 60
• Added Note to xWR6843AOPEVM Rev F section............................................................................................61

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