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01 MicroNet Overview

The document presents an overview of the MicroNet™ Plus electronic control platform, detailing its modular hardware and software capabilities for speed, load, and process control in various applications. It includes information on the system's architecture, components, environmental specifications, and potential applications in turbine systems. The content is intended for a specific audience and contains proprietary information from Woodward Governor Company.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
149 views183 pages

01 MicroNet Overview

The document presents an overview of the MicroNet™ Plus electronic control platform, detailing its modular hardware and software capabilities for speed, load, and process control in various applications. It includes information on the system's architecture, components, environmental specifications, and potential applications in turbine systems. The content is intended for a specific audience and contains proprietary information from Woodward Governor Company.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

1

MicroNet Platform

November 2020
Leonardo Leal
[email protected]
(19) 3708-4717

Turbine Systems

This presentation is intended only for the individual or entity to which it is addressed and may contain information that is the Confidential and/or Proprietary
Information of Woodward Governor Company, the disclosure of which may be in violation of applicable law. If you are not the intended recipient, or an employee
or agent responsible for delivery to the intended recipient, you are hereby notified that any dissemination, distribution, or copying of this message is strictly
prohibited and you are requested to notify us immediately by telephone.
2

Introduction
3

Instructors Background

Leonardo Leal
• Electrical Engineer

• Woodward Feb 2004 - Present


 Application Engineer
► Projects
► Comissioning and startups
► Steam turbine and Hydro Applications

Proprietary
Information
4

Introduce Yourself

• Name
• Company
• Job Responsibility
• Little bit about yourself
5

Class Hours / Meals and Breaks

• Discuss class hours meals and breaks.


• Informal (Questions not answered in class will be logged
and answered as soon as possible.)
6

MicroNet Overview
7

MicroNet™ Plus Manuals

http://www.woodward.com/pubs/pubpage.cfm
MicroNet™ Plus
8

Electronic Control Platform

What is it?
• The latest in a long line of electronic control system
platform (hardware and software) used to perform speed,
load, and process control for all types of prime movers.
• Modular hardware and software that can be expanded to fit
most any size application.
• A full compliment of standard MicroNet I/O modules are
available to build up a custom control system for any type
or size application.
• Used for custom applications and as a basic platform for
standard products.
9

Woodward.com

• All Woodward manuals available on Woodward.com


• www.woodward.com
 Support\publications
• Searchable by manual number or product name
 i.e. GS6, MicroNet , 3103 etc
10
MicroNet Plus
Electronic Controls 2005

Migration History
MicroNet
1998 Motorola 5200
68040 & Based CPU
(simplex or
MicroNet Pentium CPU
redundant)
on VME bus
TMR with NetCon on VME bus
1997 with MicroNet
style I/O
modules I/O modules
Triple Modular
NetCon Redundant
version MicroNet
Phase A & B with 68040 CPU
1990

Phase A = 68020/030 Based CPU


with 501DCS I/O modules
Phase B = 68030/040 Based CPU
501DCS on VME bus With Larger I/O modules
1985 with face plates
Building on Proven Technology
Zilog (some 68020) Based CPU
with small I/O modules throughout the Generations
without face plates
12

Possible MicroNet™ Plus Application

Micronet - Combined Cycle Plant

Ethernet, RS232, RS422, RS485 Ports


AO Programmable Analog Outputs

DO Programmable Discrete Outputs


AI Programmable Analog Inputs

Programmable Discrete Inputs

Turbine Inlet Temperature

Gas Generator Speed

Compressor Discharge Pressure

Gas Fuel Valve Demand Signal

Power Turbine Speed

Exhaust Gas Temperature


Utility
Bus
Steam Turbine Speed

Steam Valve Demand Signal


MW
TM25LP
Actuator

HRSG
3103/ Generator
TM55P
Gas
Valve

MW

Generator

Load
13

Possible MicroNet™ Plus Application


Main
Chassis
Plant
HMI

Expansion Chassis Expansion Chassis

Distributed I/O
(LinkNet)

Raise/Lower Speed Signals


Gen MW Signal
Generator RTDs
SPM-D
Exhaust Temp

Gas Demand

Liq Demand
Utility
Watt Bus
Xducer
Inlet Air Temp
Turbine Speed

Load

Compressor Discharge Pressure


14

MicroNet™ Plus Hardware

• Chassis
 14 I/O Slots A1 is for CPU only A2-A13 I/O and A14 CPU or I/O.
Capable of Simplex or redundant power supplies.
• Power Supply
 24Vdc, 125VAC or 250VAC
• CPU Modules
 Motorola 5200
• RTN Expansion Modules
• Ethernet Expansion Capabilities
• I/O Modules
 Analog and discrete input/output, Actuator control etc.
15

Chassis and Power


Supplies
16

MicroNet™ Plus Chassis


• Standard Chassis - 18 Slots
 CPU’s and I/O – 14 VME Slots
► 13 I/O modules max with simplex CPU
► 12 I/O modules max with redundant CPU’s
 Power Supplies – 4 Reserved Slots
► Option of redundant or simplex Power Supplies
» 24 VDC (18-36VDC)
» 110 VAC/DC (88-132VAC, 100-150VDC)
» 230 VAC (180-264VAC)
• Short Chassis – 12 Slots
 CPU’s and I/O – 8 VME Slots
► 7 I/O modules max with simplex CPU
► 6 I/O modules max with redundant CPU’s
• Power Supplies – 4 Reserved Slots
• Mounting
 Bulk head mount.
17

Environment Specifications

• System temperature Limits


 0º to +50ºC (32º to 122ºF)
 Humidity up to 95% non-condensing
• UL/CUL Certified
 Hazardous environments: Per NEC article 500 Class 1 Division 2
groups A,B,C,D Temperature Code (T-3C), Pollution degree 2. CE
Certified (24-32 Vdc Systems Only)
 Conforms to EMC Directive 89/336/EEC. Conformity established by
test to EN 50081-2, EN 61000-6-2 when installed in a non-EMI
cabinet.
 Conforms to Low Voltage Directive 73/23/EEC. Conformity
established by testing to EN50178 1997.
• Meets Lloyd’s shock, vibration, and humidity
specifications
• Surge: IEEE 472/ANSI 37.90a
18

MicroNet™ Plus Power Supply

• 2 Slot Power Supply


• Power Inputs
 24 VDC
 115 VAC/125VDC
 220 VAC
• 220 VDC – No longer
supported
19

MicroNet™ Plus Power Supply


• Simplex or Redundant Operation
 Simplex should be located in PS#1
• On-Line replacement
 Power Supplies can be replaced on-line following the cold
swap procedure
 Cold swap procedure.
► Turn off power to “failed” power supply
► Disconnect input power to the power supply
► Remove Power Supply
► Insert new power supply
► Connect input power
► Turn power on to the new power supply

• Phoenix Connector simplifies input power


connection
20

CPU and RTN Modules


21

MicroNet™ Plus CPU Module

• CPU5200 PowerPC Module


 Simplex or Redundant operation
 Motorola MPC5200 Power PC Microprocessor
► 400 MHz
► 128 MB DRAM
► 64 MB Flash
► 1.5X Computing Power of Pentium
22

MicroNet™ Plus CPU Module

• CPU5200 PowerPC Module


 Two Customer Ethernet Ports
► Ports are Isolated
► Ethernet FTM is not required with 5200
► Ports must be on different domains to function as
redundant
 Two Real Time Network ports
► Dedicated for RTN expansion
► No other devices should be connected to these
networks
 Two Can Ports
► Interface to GS6 Valves and DVP Driver
 One Serial Port
► Fully isolated port
► Supports RS-232, RS-422, RS-485
23

MicroNet™ Plus CPU Module


24

MicroNet™ Plus CPU Module Indications


25

Remote Network Module (RTN)

• Remote RTN Module


 Redundant or Simplex Transceiver to the
Expansion Chassis
 Utilizes Motorola 5200 Microprocessor
 Two RTN ports (dedicated for RTN)
 General purpose Ethernet ports do not function
on the RTN module
• Copper Transceiver Module does not
function with the 5200 CPU
• Installed in Slot 1 of each expansion
chassis for simplex mode
• Installed in Slot 1 and 14 of each expansion
chassis for redundant mode
26

Remote Network Module (RTN)

• Jumpers on Module determine


Address configuration
 Chapter 7.1.2 defines jumper setting
► Switch 1 – Left most switch
► Off is toward the board’s edge
» RTN Network address switch
» Off - 172.20.x.x – Factory setting
» On - 10.250.x.x
» Network switches on all CPUs and RTNs
must match for system to function
► Switch 2, 3 and 4 sets module
configuration
» Right most switch is the LSB
» CPU Chassis - 000
» RTN Chassis 1 – 001
» RTN Chassis 2 – 010
 RTN modules in the same chassis have
the same jumper setting
MicroNet™ Plus Expansion
27

Real Time Network

• MicroNet Plus expands to eight total 2-Slot


Power
Fan A1

C
P
S
I
S
P
S
P
A
N
A
N
Fan B1

S
P
A
C
S
P
S
P
D
I
D
I
Fan C1

S
P
C
P
2-Slot
Power

chassis for larger applications


Supply U O A D I I A T A A O O A U Supply
R N N R R R R
E E E E E

 1 Main Chassis
 7 Expansion Chassis PS1 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 PS2

• RTN communicates to expansion


Fan A2 Fan C2

chassis RTN 1
SW
RTN 2
SW

 Simplex or Redundant RTN Fan A1 Fan B1 Fan C1

 CPU5200 provides RTN connection in main


chassis 2-Slot S S S A A S A S S D D S 2-Slot
R R

 Remote RTN module provides RTN


Power T P P P N N P C P P I I P T Power
Supply N A A D I I A T A A O O A N Supply
R R N N R R R R
E E E E E E

connection in expansion chassis PS1 A1 A2

Fan A2
A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13

Fan C2
A14 PS2
MicroNet™ Plus Expansion
28

Real Time Network

• Ethernet switches
Fan A1 Fan B1 Fan C1

2-Slot C S S S A A S A S S D D S C 2-Slot
Power P I P P N N P C P P I I P P Power
Supply U O A D I I A T A A O O A U Supply
R N N R R R R

 Required for redundant CPU/RTN


E E E E E

applications
 Required for 2 simplex expansion chassis PS1 A1 A2

Fan A2
A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13

Fan C2
A14 PS2

 Not required for simplex CPU simplex


RTN applications RTN 1 RTN 2

• Fiber Optic expansion


SW SW

 Allows remote installation of expansion Fan A1 Fan B1 Fan C1

chassis
2-Slot R S S S A A S A S S D D S R 2-Slot
Power T P P P N N P C P P I I P T Power
Supply N A A D I I A T A A O O A N Supply
R R N N R R R R
E E E E E E

PS1 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 PS2

Fan A2 Fan C2
MicroNet™ Plus Expansion
29

Real Time Network


MicroNet™ Plus Expansion
30

Real Time Network


31

2 Chassis Simplex CPU/RTN

RTN 1

CPU CHASSIS 1

RTN 2

RTN 1

RTN CHASSIS 2

RTN 2

NETWORK A - RED
NETWORK B - BLACK
2 Chassis Redundant CPU/RTN

CPU CHASSIS 1 CPU

RTN CHASSIS 2 RTN

Switch A NETWORK A - RED Switch B


NETWORK B - BLACK

32
3 Chassis Simplex CPU/RTN

CPU CHASSIS 1

RTN CHASSIS 2

RTN CHASSIS 3

Switch A NETWORK A - RED Switch B


NETWORK B - BLACK

33
3 Chassis Redundant CPU/RTN

CPU CHASSIS 1 CPU

RTN CHASSIS 2 RTN

RTN CHASSIS 3 RTN

Switch A NETWORK A - RED Switch B


NETWORK B - BLACK

34
35

Fiber Optic RTN


Fiber Optic RTN
• Max length is 2 Km from the main CPU chassis.
• Allows (1) or (2) expansion racks over full-duplex, fiber optic cable.
• Allows (2) remote locations over separate fiber optic cables.
• Extended temperature operation (-10°C to +65°C)
• “SC” Connectors, 62.5/125 multi-mode fiber (ST to SC Adapter available)
• 1711-1069, Hirschmann Fiber Optic Switch (RS2-4TX/1FX)
• 1751-6077, Hirschmann Fiber Optic Switch (RS2-3TX/2FX)
36

Fiber Optic RTN

Example with 1 remote location


• Simplex or redundant requires 4 Fiber Optic switches
• 1711-1069, RS2-4TX/1FX
37

Fiber Optic RTN


Example with 2 remote locations in different locations
• Requires 2 local Fiber Optic switches
• 1751-6077, RS2-3TX/2FX

• Requires 4 remote Fiber Optic switches


• 1711-1069, RS2-4TX/1FX
38

CAN Open Digital Interface

• Coder 4.02 and later


• Maximum wire length - 100 meters @ 500 kbaud
• Interface MicroNet Plus to GS6 On-Board driver
• Interface MicroNet Plus to GS16 On-Board driver
• Interface MicroNet Plus to DVP Driver
• Dual CAN interface to DVP
• Supports simplex or redundant configurations
39

CAN Open Digital Interface


• Requires 120Ω terminators on each end of network
• Two male connectors on CPU module
• Drop cables must be less than 6 meters each
• Cumulative drop length must be less than 39 meters
• Recommend 100 meter max cumulative network length
40

CAN Tees, drop cables and Terminator


41

CAN Connection Types


TOTAL OF
GS6 15
DVP
Resistor

FALCON SPC SPC-R SPC-R DEVICES


MICRONET PLUS DRIVER
DRIVER ON THE
T
A
NETWORK
P

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS ON TRUNK


Resistor

Daisy chain does not count as drops off the trunk

TOTAL OF
GS6 15
DVP
Resistor

FALCON SPC SPC-R SPC-R DEVICES


MICRONET PLUS DRIVER
DRIVER ON THE
T
A NETWORK
P

6m Max 6m Max 6m Max 6m Max 6m Max 6m Max

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS ON TRUNK


T T T T T T
A A A A A A
P P P P P P
Resistor

Maximum distance from TAP to device (Drop) is 6 Meters


Maximum cumulative drop length is 39 Meters

TOTAL OF
GS6 15
DVP
FALCON SPC SPC-R SPC-R DEVICES
DRIVER
DRIVER ON THE
Resistor

MICRONET PLUS NETWORK


T
A
P

6m Max 6m Max 6m Max 6m Max 6m Max 6m Max

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS MULTI-PORT TAP


Resistor

Maximum distance from TAP to device (Drop) is 6 Meters


Maximum cumulative drop length is 39 Meters
42

Simplex CPU Simplex Can Network

TOTAL OF
Resistor

GS6 15
MICRONET PLUS DVP
FALCON SPC SPC-R SPC-R DEVICES
DRIVER
T
A
DRIVER ON THE
P
NETWORK

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS


Resistor
43

Redundant CAN Network


Resistor

MICRONET PLUS
T
A
P
Resistor

TOTAL OF
15
DVP
DEVICES
DRIVER
T
A
P
ON THE
NETWORK

6m Max 6m Max

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS


T T
A A
P P
Resistor

100 METERS MAX DISTANCE BETWEEN TERMINATION POINTS


T T
A A
P P
Resistor
44

MicroNet I/O
45

MicroNet I/O

• MicroNet I/O module overview


 Cables
 Connections & FTM’s

• LinkNet Modules
• Proper Grounding
• The I/O modules include all modules that permit the
CPU both to receive information from the field, and to
control devices and indicators in the field.
46

MicroNet™ Plus I/O

MicroNet Plus – Same Proven I/O as MicroNet Simplex


 Analog Inputs and Outputs
► Speed MPU/Prox Inputs
► Thermocouple and RTD Inputs
► mA and Voltage Inputs and Outputs
► Actuator Controller mA Output with RVDT/LVDT Feedback
 Discrete Inputs and Outputs
► Discrete Contact Inputs
► Relay Driver Outputs and Relay Boxes
 Communications and Network
► LinkNet Controller
» LinkNet Distributed I/O Modules
► Ethernet (on CPU5200)
► Serial I/O
► Real Time SIO (comms to fuel valve drivers)
► Pressure Input (comms to Honeywell DLE Pressure XDCR)
 Compatibility Matrix is in Appendix D
47

I/O Module Compatibility

• NetCon Modules (MicroNet Compatible)


 Speed Sensor (4-channel, MPU type)
 Thermocouple (8-channel, w/N type table)
 RTD (8-channel, 100Ω)
 Actuator Controller (2-channel, 200mA)
 SIO Module (4-port)
 Pressure Input (8-channel)
 Discrete Out (64-channel)
48

I/O Module Types

• I/O module types for turbine control:


 Magnetic Speed Pickups - MPU (4-
channel)
 Thermocouple Inputs (8-channel)
 RTD Inputs (8-channel)
 High-current Actuator Drivers with
LVDT/RVDT Feedback (2- or 4-channel)
 Serial I/O (4-port)
49

I/O Module Types

• I/O module types for turbine control:


 Pressure Transducer Interface Module
(8-channel)
 Discrete Outputs (32- or 64-channel)
 Current and Voltage Inputs (8-channel)
 Current and Voltage Outputs (8-channel)
 Discrete Inputs (48-channel)
 Position Control Module (2-channel)
50

I/O Module Connections


51

Field Termination Modules

Typical I/O Field Termination


Module
52

Cables
• Analog
• Discrete
• High Density Analog
• High Density Discrete
• Various Lengths
• 3,6,8,10,12,14,16,18,20,22,24,26,and 40 ft
53

Connections
• Each I/O module has connectors on the
faceplate.
• For analog and discrete I/O, cables connect
the module to a Field Terminal module
(FTM).
• The FTM is used to connect to the field
wiring.

!
• For communication modules, FTM’s are not
used. Cables are connected directly to the
faceplate of the communications module.
54

Serial I/O (SIO) Module

• Four Independent Serial Ports


 J1 and J2
► RS-232 Communication Protocol Only
► 110–38.4 Kbaud
► Modbus ASCII or RTU
 J3 and J4
► RS-232, RS-422, or RS-485
► Software Selectable
► 110–57.6 Kbaud
► Must be set at same baud rate if 38.4K or 57.6K
► Modbus ASCII or RTU

• Communication Rates from 300 to 57.6


Kbaud
• Run & Fault Indication Lights
55

Serial I/O (SIO) Module

SCADA System
Human-Machine
Interface

Vibration Monitoring
Generator Monitoring
56

Analog Input Modules


57

Digital Speed Sensor Module

• Four Channels MPU or Proximity (P/N


dependant)
 Magnetic Pick-Ups (MPU)
► 50 Hz to 25KHz
► 1 Vrms min, 25 Vrms max, Freq > 20 Hz
 Proximity
► 0.04Hz to 2Khz
► 10 mA

• On-board DSP 56001 Processor provides


well-filtered derivative response
• Speed and Derivative Signals Sent to CPU
• 16 Bits of Resolution
• Accurate to 0.01% of Full Range at 25°C
• Each Channel is Fully Isolated at 500 Vrms
58

Connections
59

MPU/Prox FTM

Analog Input FTM


60

Typical MPU/Prox Wiring


61

RTD Input Module


• Eight Channels
 100Ω Platinum (Available with 10, 100, 200 or 500 ohm inputs)
► Can’t mix and match – defined in hardware
► On-board lookup table does curve linearization
► European or American curve defined in GAP
• Performs Continuous, On-line Self-calibration due to
ambient temperature fluctuations
• 14 Bits of Resolution
• Accurate to 0.5% of Full Scale Range at 25°C
• Semi-Isolated
 Isolated from control common, not from each other
 Each channel is dc semi-isolated, channel to channel
 Each channel has 1500 Vac input to common isolation
62

Connections
63

RTD FTM

Analog Input FTM


64

Typical RTD Wiring


65

RTD Wiring Examples


66

Thermocouple (TC) Input Module

• Eight Channels
 Accepts E, J,K,R,S, and T type TC’s
► Mix and match by channel – defined in GAP Software
► On-board lookup table does curve linearization
• Channel 9, Cold Junction Measurement
• Fail-High or Fail-Low on Open T/C Detection
• Performs Continuous, On-line Self-calibration due
to ambient temperature fluctuations
• 16 Bits of Resolution
• Accurate to 0.5% of Full Scale Range at 25°C
• Fully Isolated
 Each channel is fully dc-isolated
 Each channel has 1500 Vac input to common isolation
67

Connections
68

TC FTM and Cable

Analog TC Input FTM


69

Typical TC Wiring
70

Analog Input Module (Standard)

• Eight Input Channels


 Fully Isolated Channels
 1500 VAC Isolation from Control Common
 0-25 mA
 Input Impedance = 249 Ω
 5 ms Update Rate Capable
 Loop or self powered input devices
• Module Monitors Current Inputs For Failure
• Fault Indication Light
 Channel or Board Fault
71

Connections
72

Analog FTM

Analog Input FTM


73

Typical Analog Input Wiring


74

Voltage Input Module

• Eight Input Channels


 Double Ended - Fully Isolated Channels
 1500 VAC Isolation from Control Common
 0-10 VDC Input
 Input Impedance = >2 MΩ
 5 ms Update Rate Capable
• Monitors Voltage Inputs For Failure
• Fault Indication Light
 Channel or Board Fault
75

Connections
76

Voltage Input FTM

Analog Input FTM


77

Typical Voltage Input Wiring


78

Analog Output Modules


79

Current Output Module


• Two Current Ranges
• 4-20mA and 0-1mA outputs
• (4-20) Eight Output Channels
 Pre-Calibrated at Factory
 0-25 mA Output
 Maximum Load Resistance = 600 Ω
 5 ms Update Rate Capable
• (0-1) Eight Output Channels
 0-1.25 mA Output
 Maximum Load Resistance = 10 kΩ
 5 ms Update Rate Capable
 No Isolation
• Monitors Output Current For Failure
• All Current Drivers Shutdown on “I/O Lock”
• Fault Indication Light
 Channel or Board Fault
80

Connections
81

Current Output FTM

Analog Input FTM


82

Typical Current Output Wiring


83

Voltage Output Module


• Two Output Voltages
• 0-5Vdc and 0-10Vdc outputs
• (0-5Vdc) Eight Output Channels
 0-6.5 Vdc Output
 Maximum Load Resistance = 500 Ω
 5 ms Update Rate Capable
 No Isolation
• (0-10Vdc) Eight Output Channels
 0-12.5 V Output
 Maximum Load Resistance = 500 Ω
 5 ms Update Rate Capable
 No Isolation
• Monitors Output Current For Failure
• All Current Drivers Shutdown on “I/O Lock”
• Fault Indication Light
 Channel or Board Fault
84

Connections
85

Voltage Output FTM

Analog Input FTM


86

Typical Voltage Output Wiring


87

Actuator Controller Module

• Two Channels
 200mA (Available in 10, 25, 50 and 100 mA outputs)
► Can’t mix and match – defined by hardware
 Software configurable by channel
► Integrating or Proportional
► Unipolar or Bipolar Current – limits defined in GAP Software
► 25Hz 25% duty cycle Dither with tunable amplitude
 Up to Two LVDT or RVDT Feedbacks per Channel
 Redundancy Between Channels is Supported
• Position Accuracy 0.25% of Full Scale Range at 25°C
• Channel Shutdown or “I/O Lock” → Interrupts Drive
Current
88

Connections
89

Actuator Controller FTM

Actuator FTM
90

Actuator Driver Module

• Four Channels
 0-200mA (Available in 0-25 mA outputs)
► Can’t mix and match – defined by hardware
 Software configurable by channel
► Proportional
► 25Hz 25% duty cycle Dither with tunable amplitude
 Up to Two LVDT or RVDT Feedbacks per Channel
 Redundancy Between Channels is Supported
• Position Accuracy 0.1% of Full Scale Range at 25°C
• Channel Shutdown or “I/O Lock” → Interrupts Drive
Current
91

Connections
92

Actuator Driver FTM

Actuator Driver FTM


93

Feedback Wiring Options


94

Special Purpose Modules


95

Real Time Serial I/O (RTSIO) Module

• Three Channels
 Digital Actuator Driver Interface
► RS-485
► 5ms rate group capable
► Rate group can be different by channel
 Three modes
RS-485
► Send position demand and configuration to driver plus
Fault
monitor status
Indication ► Send configuration to driver plus monitor status,
I/O Lock
(red) ► Monitor only
 Direct connection from RTSIO to Driver
RS-485

RS-485
96

Connections
97

RTSIO Wiring
98

Pressure Input Module

• Eight Channels
 Two RS422 comunications ports. Each communicates to a
manifold assembly which can house up to four smart
transducers.
• Uses Honeywell proprietary communication protocol.
• Fully Isolated
99

Connections
100

Wiring
101

Smart Pressure Transducer


102

Discrete Input Modules


103

48 Discrete Input Module

• 48 Discrete Inputs
 5 Millisecond Update Rate
 Optically Isolated
 On-Board Processor
• Voltage Threshold
 >16 VDC = “ON” <8 VDC = “OFF”
• Internal 24V Wetting Voltage
 3 mA @ 24VDC per Channel
• Uses 2 FTMs and Cables
104

Connections
105

Discrete Input FTM and Cable

Discrete I/O FTM Discrete I/O FTM w/LEDs


106

Discrete Input Wiring


107

Discrete Output Modules


108

32 ch. Discrete Output Modules

• 32 Discrete Outputs (Relay Outputs)


 5 Millisecond Update Rate
 Non-Isolated (Isolation provided by relays)
• Interface with Woodward Relay Boxes
 Two 16 Channel Relay Boxes
OR
 One 32 Channel Relay Box
109

Connections
110

64 ch. Discrete Output Modules

• 64 Channels
Relay Outputs, Open Drain Drivers
• Interfaces with Woodward
Relay Boxes
Two 32 Channel Relay Boxes (16
Channel Relay Boxes Also
Available)
• Non-Isolated
Isolation Provided by Relays
111

Connections
112

Discrete Output Relay FTMs and Cables

16 Channel Relay FTM

Phoenix contact 16 Channel Relay FTM


113

16 Channel Relay
• 16 Form C relays
 Field-replaceable relays
 The cable that connects the relay box to a Discrete Output module
supports 32 relays. A second 16-relay box can be connected to the
first.
• Contact ratings:
 3.0 A @ 120 Vac, 50/60 Hz (resistive) (meets UL ratings only)
 2.0 A @ 120 Vac, 50/60 Hz (inductive) (meets UL ratings only)
 60 Watt @ 120 Vac, 50/60 Hz (lamp) (meets UL ratings only)
 10.0 A @ 28 Vdc (resistive) (meets LVD and UL ratings)
 3.0 A @ 28 Vdc (inductive) (meets LVD and UL ratings)
 3 A @ 150 Vdc Resistive (meets UL ratings only)
 1.2 A @ 150 Vdc Inductive (meets UL ratings only)
114

Discrete Output Relay FTMs and Cables

32 Channel Relay FTM


115

32 Channel Relay
• 32 non-replaceable relays (32 channels - 1 “Form C”
each).
• The external power source connected to the relay
contacts should be limited to 10 amps to protect the relay
box circuit board. An inductive dc load should be
externally suppressed with an appropriate transient load
suppresser to protect the relay contacts.
• Contact ratings:
•3.0 A @ 120 Vac, 50/60 Hz (resistive) (meets UL ratings only)
•2.0 A @ 120 Vac, 50/60 Hz (inductive) (meets UL ratings only)
•60 Watt @ 120 Vac, 50/60 Hz (lamp) (meets UL ratings only)
•10.0 A @ 28 Vdc (resistive) (meets LVD and UL ratings)
•3.0 A @ 28 Vdc (inductive) (meets LVD and UL ratings)
116

Typical Discrete Output Wiring


117

Combination Modules
118

48/24 High Density Discrete I/O


• 48 Discrete Inputs
 5 Millisecond Update Rate
 Optically Isolated
 On-Board Processor
• Voltage Threshold
 >16 VDC = “ON” <8 VDC = “OFF”
• Internal 24V Wetting Voltage
 3 mA @ 24VDC per Channel
• 24 Discrete Outputs (Relay Outputs)
 5 Millisecond Update Rate
 Non-Isolated (Isolation provided by relays)
• Interface with Woodward Relay
Boxes
119

Connections
120

Discrete Combo FTMs

24/8 Discrete I/O FTM


Low Voltage input
24 Channel Input/
12 Channel Relay FTM 24/8 Discrete I/O FTM
High Voltage input
121

MPU Analog Combo Module

• 4 Speed Sensor Inputs


 MPU or Prox (wiring selected)
• 8 Analog Inputs
 4-20 mA or 0-5 VDC (jumper selected)
 Self- or Loop-Powered Inputs (wiring selected)
• 2 Analog/Actuator Outputs
 4-20 or 20-160 mA (software selected)
• 6 Analog Outputs
 4-20 mA
122

MPU Analog Combo Module

• 5 millisecond Update Rate


• High and Low Setpoint Time Stamping on Speed
Inputs and Analog Inputs - 5ms resolution
• 16-bit Resolution on Analog Inputs
• 11-bit Resolution on Analog Outputs
• Connected to Field Wires via Field Termination
Modules (FTM’s)
• Fault Indication Light
123

Connections
124

Analog Combo FTM

MPU Analog Combo FTM


125

24/8 Analog Module

• 24 Analog Inputs
 4-20 mA or 0-5 VDC (jumper selected)
 Self- or Loop-Powered Inputs (wiring selected)
 Input Impedance = 200 Ω
 100mA fuse on each channel
• 8 Analog Outputs
 4-20 mA
 Maximum load resistance 600 Ω
126

Connections
127

24/8 Analog FTM

24/8 Analog FTM


128

Typical Analog Input Wiring


129

Dataforth 24/8 Analog Module

• 24 Analog Inputs
 Uses DataForth modules
 RTD (100Ω and 200Ω)
 TC (Type K)
 4-20mA
 0-5Vdc
• 8 Analog Outputs
 4-20 mA
 Maximum load resistance 600 Ω
130

Connections
131

Dataforth FTM and Converters

Dataforth
SCM7B
Converters

Dataforth Analog FTM


132

Wiring
133

Wiring
134

Wiring
135

Wiring
136

Wiring
137

Distributed IO
138

LinkNet
139

LinkNet

Main
Chassis

Distributed I/O
(LinkNet)
Four Channel LinkNet® Controller Module

• 4 Independent Networks
 Configurable Update Rate
 Up to 60 modules (Nodes) per network
 Single twisted pair communication per network
• Multiple Node Types
 TC
 RTD
 Discrete input
 Discrete output
 Analog output (4-20ma)
 Analog input (4-20 ma)
 Loop powered inputs
 Self powered inputs
141

LinkNet Termination Network Module

• 1 Per Network required


 Must be last device in network
 Connections on Either end of module
 Do not connect to both ends
142

LinkNet 6Ch RTD Module

• 6 Input Channels
 100 or 200 Ω 3-wire
 European curve
 –65 to +649 °C (–85 to +1200 °F)
 American curve
 –65 to +457 °C (–85 to +854 °F)
• Power requirements
 18 to 32 Vdc, 3.1W
 14 AWG minimum

• Mounting
 DIN rail mount
143

RTD Module Typical Wiring


144

LinkNet 6Ch Thermocouple Module

• 6 Input Channels
 Two input types
 Type J
 Type K
 Two failed sensor types
 Fail Low
 Fail High
• Power requirements
 18 to 32 Vdc, 2.4W
 14 AWG minimum
• Mounting
 DIN rail mount
145

TC Module Typical Wiring


146

LinkNet 6Ch Analog Module

• 6 Input Channels
 Two input types
 Loop Powered
 Self Powered
• Power requirements
 18 to 32 Vdc, 2.4W (self powered)
 18 to 32 Vdc, 5.3W (loop powered)
 14 AWG minimum
• Mounting
 DIN rail mount
147

Self Powered AI Module Typical Wiring


148

Loop Powered AI Module Typical Wiring


149

LinkNet 16Ch Discrete Input Module

• 16 Input Channels
 Low Voltage input
 <8 Vdc = “OFF”
 >16 Vdc = “ON”
• Signal Power
• 24Vdc
• Internal(fused on module)
• External (user supplied)
• Power requirements
 18 to 32 Vdc, 6.5W
 14 AWG minimum
• Mounting
 DIN rail mount
150

Discrete Input Module Typical Wiring


151

LinkNet 6Ch Analog Output Module

• 6 Output Channels
 0-25 mA output
• Power requirements
 18 to 32 Vdc, 6.0W
 14 AWG minimum
• Mounting
 DIN rail mount
152

Analog Output Module Typical Wiring


153

LinkNet 8Ch Discrete Output Module

• 8 Output Channels
 Form C relay outputs
 Rated 5.0 A @ 28Vdc resistive
 Rated 0.5 A @ 115Vac resistive

• Power requirements
 18 to 32 Vdc, 5.0W
 14 AWG minimum
• Mounting
 DIN rail mount
154

Discrete Output Module Typical Wiring


155

LINKnet™ HT
156

LINKnet HT Product Family

Node Types
• 8ch RTD Input (100 Ω, 200 Ω)
• 8ch T/C Input (K, N, E, J, R, S, T, B, mV)
• 10ch AIO 4mA to 20mA In/Out (8AI, 2AO) (Loop and Self-Powered
versions)
• 16ch DI
• 16ch DO Relay Driver
157

LINKnet HT Distributed IO

• Asynchronous distributed I/O


• Single CAN port
• Support MicroNet Plus CPU failover
• Designed to operate in high temperature and high
vibration environments
• CAN requirements
 22 AWG Belden YR58684 (3-wire)
 Use 120 Ω + 10 Ω at each end of the network
 Stub lengths should be as short as possible (<1 m is best)
158

LINKnet HT 8Ch RTD Module

• 8 Input Channels
 100 or 200 Ω 3-wire, 2-wire
 European curve
 American curve
• Power requirements
 18 to 36 Vdc, 5.0W max
 20 AWG
 Limit daisy chain to 16 nodes
• CAN requirements
 22 AWG Belden YR58684 (3-wire)
• Mounting
 DIN rail mount
159

RTD Module Typical Wiring


LINK
160

LINKnet HT 8Ch Thermocouple Module

• 8 Input Channels
 Nine input types
 Type K, J, T, B, E, N, R, S, and
mV input
 Auto CJ compensation (2 sensors)
• Power requirements
 18 to 36 Vdc, 4.3W max
 20 AWG
• Mounting
 DIN rail mount
161

TC Module Typical Wiring


LINK
162

LINKnet HT 4-20mA Analog Module

• 8 Input Channels
 4-20mA Input
 Two input types
 Loop Powered
 Self Powered
• 2 Output Channels
 4-20mA Output
• Power requirements
 18 to 36 Vdc, 5.6W (self powered)
 18 to 36 Vdc, 12.1W (looppowered)
 20 AWG
• Mounting
 DIN rail mount
163

Self Powered AI Module Typical Wiring


LINK
164

Loop Powered AI Module Typical Wiring


LINK
165

LinkNet 16Ch Discrete Input Module

• 16 Input Channels
 +24 DC Voltage input
• Signal Power
 24Vdc
 Internal (on module)
 External (user supplied)
• Power requirements
 18 to 36 Vdc, 5.8W max
 20 AWG
• Mounting
 DIN rail mount
166

Discrete Input Module Typical Wiring


LINK
167

LINKnet HT 16Ch DO Driver Module

• 16 Output Driver Channels


• Power requirements
 18 to 36 Vdc, 4.2 W max
 20 AWG
• Mounting
 DIN rail mount
168

Discrete Output Module Typical Wiring


LINK
169

RTCnetTM
170

RTCnet Product Family

Node Types
• 8ch RTD Input (100 Ω, 200 Ω)
• 8ch High Accuracy T/C Input (K, N, E, J, R, S, T, B, mV)
• 10ch AIO 4mA to 20mA In/Out (8AI, 2AO) (Loop and Self-Powered
versions)
• 16ch DI
• 16ch DO Relay Driver
171

RTCnet Distributed IO

• Real-Time deterministic distributed I/O


• Redundant CAN ports
• Support MicroNet Plus CPU failover
• Designed to operate in high temperature and high
vibration environments
172

RTCnet 8Ch RTD Module

• 8 Input Channels
 100 or 200 Ω 3-wire, 2-wire
 European curve
 American curve
• Power requirements
 18 to 36 Vdc, 5.0W max
 20 AWG
 Limit daisy chain to 16 nodes
• CAN requirements
 22 AWG Belden YR58684 (3-wire)
• Mounting
 DIN rail mount
173

RTD Module Typical Wiring


174

RTCnet 8Ch High Accuracy T/C Module

• 8 Input Channels
 Nine input types
 Type K, J, T, B, E, N, R, S, and
mV input
 Auto CJ compensation (8 senors)
• Power requirements
 18 to 36 Vdc, 4.3W max
 20 AWG
• Mounting
 DIN rail mount
175

TC Module Typical Wiring


176

RTCnet 4-20mA Analog Module

• 8 Input Channels
 4-20mA Input
 Two input types
 Loop Powered
 Self Powered
• 2 Output Channels
 4-20mA Output
• Power requirements
 18 to 36 Vdc, 5.6W (self powered)
 18 to 36 Vdc, 12.1W (looppowered)
 20 AWG
• Mounting
 DIN rail mount
177

Self Powered AI Module Typical Wiring


178

Loop Powered AI Module Typical Wiring


179

RTCnet 16Ch Discrete Input Module

• 16 Input Channels
 +24 DC Voltage input
• Signal Power
 24Vdc
 Internal (on module)
 External (user supplied)
• Power requirements
 18 to 36 Vdc, 5.8W max
 20 AWG
• Mounting
 DIN rail mount
180

Discrete Input Module Typical Wiring


181

RTCnet 16Ch DO Driver Module

• 16 Output Driver Channels


• Power requirements
 18 to 36 Vdc, 4.2 W max
 20 AWG
• Mounting
 DIN rail mount
182

Discrete Output Module Typical Wiring

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