TM 211107: Material Teknik 1
Course Objective...
Memperkenalkan konsep dasar dalam ilmu material
You will learn about:
• struktur material
• bagaimana struktur menentukan sifat
• bagaimana proses dapat merubah struktur
This course will help you to:
• menggunakan material dengan benar
• merealisasikan peluang desain baru dengan material
Chapter 1 - 1
LECTURES
Lecturer: Dr. Kurnia Hastuti
Time: Kamis, 07.20 – 09.50
Location: Gedung A Ruang 3.103
Activities:
• Menyampaikan materi baru
• memberitahukan adanya bahan bacaan dan
pekerjaan rumah/tugas
• Kuis dan ujian
Chapter 1 - 2
REFERENCE
Required text:
• Materials Science and Engineering: An Introduction,
W.D. Callister, Jr. and D.G. Rethwisch, 8th edition,
John Wiley and Sons, Inc. (2010).
Chapter 1 - 3
GRADING
KUIS 10%
TUGAS 25%
UTS 25%
UAS 30%
Chapter 1 - 4
Chapter 1 - Introduction
Objectives :
1. Menyatakan 6 pengelompokan sifat sifat material.
2. Menjelaskan 4 komponen yang terlibat dalam desain,
produksi dan penggunaan material, dan menjelaskan
hubungan antara komponen tersebut.
3. Menyebutkan 3 kriteria yang penting dalam proses
seleksi.
4. (a) Menyebutkan 3 pengelompokan utama material dan
perbedaan kimia masing-masing.
(b) Menyebutkan 2 jeis material maju (advanced materials)
5. (a) Menjelaskan “smart material/system.”
(b) Menjelaskan konsep “nanotechnology”.
Chapter 1 - 5
Chapter 1 - Introduction
Chapter 1 - 6
Chapter 1 - Introduction
• What is materials science?
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Chapter 1 - Introduction
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Chapter 1 - Introduction
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Chapter 1 - Introduction
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Chapter 1 - Introduction
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Chapter 1 - Introduction
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Example – Hip Implant
• With age or certain illnesses joints deteriorate.
Particularly those with large loads (such as hip).
Adapted from Fig. 22.25, Callister 7e. Chapter 1 - 14
Example – Hip Implant
• Requirements
– mechanical
strength (many
cycles)
– good lubricity
– biocompatibility
Adapted from Fig. 22.24, Callister 7e.
Chapter 1 - 15
Example – Hip Implant
Adapted from Fig. 22.26, Callister 7e. Chapter 1 - 16
Hip Implant
• Key problems to overcome
– fixation agent to hold Ball
acetabular cup
– cup lubrication material
– femoral stem – fixing agent
Acetabular
(“glue”)
Cup and Liner
– must avoid any debris in cup
Femoral
Stem
Adapted from chapter-opening photograph,
Chapter 22, Callister 7e.
Chapter 1 - 17
Structure, Processing, & Properties
• Properties depend on structure
ex: hardness vs structure of steel
(d)
600
Hardness (BHN)
30 mm
500 (c)
Data obtained from Figs. 10.30(a)
400 (b) and 10.32 with 4 wt% C composition,
(a) and from Fig. 11.14 and associated
4 mm discussion, Callister & Rethwisch 8e.
300 Micrographs adapted from (a) Fig.
10.19; (b) Fig. 9.30;(c) Fig. 10.33;
30 mm
30 mm and (d) Fig. 10.21, Callister &
200 Rethwisch 8e.
100
0.01 0.1 1 10 100 1000
Cooling Rate (ºC/s)
• Processing can change structure
ex: structure vs cooling rate of steel
Chapter 1 - 18
Types of Materials
• Metals:
– Strong, ductile
– High thermal & electrical conductivity
– Opaque, reflective.
• Polymers/plastics: Covalent bonding → sharing of e’s
– Soft, ductile, low strength, low density
– Thermal & electrical insulators
– Optically translucent or transparent.
• Ceramics: ionic bonding (refractory) – compounds of metallic
& non-metallic elements (oxides, carbides, nitrides, sulfides)
– Brittle, glassy, elastic
– Non-conducting (insulators)
Chapter 1 - 19
The Materials Selection Process
1. Pick Application Determine required Properties
Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative.
2. Properties Identify candidate Material(s)
Material: structure, composition.
3. Material Identify required Processing
Processing: changes structure and overall shape
ex: casting, sintering, vapor deposition, doping
forming, joining, annealing.
Chapter 1 - 20
ELECTRICAL
• Electrical Resistivity of Copper:
6 Adapted from Fig. 18.8, Callister &
Rethwisch 8e. (Fig. 18.8 adapted
5 from: J.O. Linde, Ann Physik 5, 219
(1932); and C.A. Wert and R.M.
Resistivity, r
Thomson, Physics of Solids, 2nd
(10-8 Ohm-m)
4 edition, McGraw-Hill Company, New
York, 1970.)
3
Exp :
2 • Electrical
conductivity
1 • Dielectric constant
0
-200 -100 0 T (ºC)
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
Chapter 1 - 21
THERMAL
• Space Shuttle Tiles: • Thermal Conductivity
-- Silica fiber insulation of Copper:
offers low heat conduction. -- It decreases when
Adapted from chapter- you add zinc!
opening photograph,
Chapter 17, Callister &
Thermal Conductivity
Rethwisch 3e. (Courtesy 400
of Lockheed
Missiles and Space
300
(W/m-K)
Company, Inc.)
200
100
0
0 10 20 30 40
Composition (wt% Zinc)
Adapted from Adapted from Fig. 19.4, Callister & Rethwisch
Fig. 19.4W, Callister 8e. (Fig. 19.4 is adapted from Metals Handbook:
6e. (Courtesy of Properties and Selection: Nonferrous alloys and
Lockheed Aerospace Pure Metals, Vol. 2, 9th ed., H. Baker,
Ceramics Systems, (Managing Editor), American Society for Metals,
Sunnyvale, CA) 1979, p. 315.)
(Note: "W" denotes fig.
100 mm is on CD-ROM.) Chapter 1 - 22
MAGNETIC
• Magnetic Storage: • Magnetic Permeability
-- Recording medium vs. Composition:
is magnetized by -- Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!
Magnetization
Fe+3%Si
Fe
Magnetic Field
Adapted from C.R. Barrett, W.D. Nix, and
Fig. 20.23, Callister & Rethwisch 8e. A.S. Tetelman, The Principles of
Engineering Materials, Fig. 1-7(a), p. 9,
1973. Electronically reproduced
by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.
Chapter 1 - 23
OPTICAL
• Transmittance:
-- Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.
polycrystal: polycrystal:
single crystal low porosity high porosity
Adapted from Fig. 1.2,
Callister & Rethwisch 8e.
(Specimen preparation,
P.A. Lessing; photo by S.
Tanner.)
Chapter 1 - 24
DETERIORATIVE
• Stress & Saltwater... • Heat treatment: slows
-- causes cracks! crack speed in salt water!
crack speed (m/s)
10-8 “as-is”
“held at
160ºC for 1 hr
before testing”
10-10 Alloy 7178 tested in
saturated aqueous NaCl
solution at 23ºC
increasing load
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and
Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John
Adapted from chapter-opening photograph, Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown
Chapter 16, Callister & Rethwisch 3e. Boveri Co.)
(from Marine Corrosion, Causes, and
Prevention, John Wiley and Sons, Inc., 1975.) 4 mm
-- material:
7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)
Adapted from Fig. 11.26,
Callister & Rethwisch 8e. (Provided courtesy of G.H.
Narayanan and A.G. Miller, Boeing Commercial Airplane
Company.) Chapter 1 - 25
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METALS
• Composed of one or more metallic elements (such as
iron, aluminum, copper, titanium, gold, and nickel),
and often also nonmetallic elements (for example,
carbon, nitrogen, and oxygen) in relatively small
amounts.
• Atoms in metals and their alloys are arranged in a
very orderly manner and in comparison to the
ceramics and polymers, are relatively dense.
• With regard to mechanical characteristics, these
materials are relatively stiff and strong yet are ductile
and are resistant to fracture.
• Extremely good conductors of electricity and heat, and
are not transparent to visible light.
• In addition, some of the metals (viz., Fe, Co, and Ni)
have desirable magnetic properties.
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CERAMICS
• Ceramics are compounds between metallic and
nonmetallic elements; they are most frequently oxides,
nitrides, and carbides.
• With regard to mechanical behavior, ceramic materials are
relatively stiff and strong. In addition, ceramics are
typically very hard. On the other hand, they are extremely
brittle (lack ductility), and are highly susceptible to
fracture.
• These materials are typically insulative to the passage of
heat and electricity, and are more resistant to high
temperatures and harsh environments than metals and
polymers.
• With regard to optical characteristics, ceramics may be
transparent, translucent, or opaque and some of the oxide
ceramics (e.g., Fe3O4) exhibit magnetic behavior.
Chapter 1 - 29
POLYMERS
• Polymers include the familiar plastic and rubber materials. Many
of them are organic compounds that are chemically based on
carbon, hydrogen, and other nonmetallic elements (viz. O, N, and
Si).
• Furthermore, they have very large molecular structures, often
chain-like in nature that have a backbone of carbon atoms. Some
of the common and familiar polymers are polyethylene (PE),
nylon, poly(vinyl chloride) (PVC), polycarbonate (PC),
polystyrene (PS), and silicone rubber.
• These materials typically have low densities, whereas their
mechanical characteristics are generally dissimilar to the metallic
and ceramic materials—they are not as stiff nor as strong as these
other material types.
• Extremely ductile and pliable (i.e., plastic), which means they are
easily formed into complex shapes.
• Relatively inert chemically and unreactive in a large number of
environments.
• One major drawback to the polymers is their tendency to soften
and/or decompose at modest temperatures, which, in some
instances, limits their use. Furthermore, they have low electrical
conductivities and are nonmagnetic. Chapter 1 - 30
Chapter 1 - 31
DENSITY
Chapter 1 - 32
STIFFNESS
Chapter 1 - 33
STRENGTH
Chapter 1 - 34
RESISTANCE TO FRACTURE
Chapter 1 - 35
ADVANCED MATERIALS
Semiconductors Biomaterials
• Semiconductors have electrical • Biomaterials are employed in
properties that are intermediate between components implanted into the human
the electrical conductors (viz. metals body for replacement of diseased or
and metal alloys) and insulators (viz. damaged body parts.
ceramics and Polymers). • These materials must not produce toxic
• Extremely sensitive to the presence of substances and must be compatible with
minute concentrations of impurity body tissues (i.e., must not cause
atoms, for which the concentrations adverse biological reactions).
may be controlled over very small • All of the above materials—metals,
spatial regions. ceramics, polymers, composites, and
• Semiconductors have made possible the semiconductors—may be used as
advent of integrated circuitry that has biomaterials.
totally revolutionized the electronics
and computer industries (not to mention
our lives) over the past three decades.
Chapter 1 - 36
ADVANCED MATERIALS
Materials of the Future • Nanoengineered Materials
• Smart Materials • New materials that are built from
• The adjective “smart” implies that these simple atomic-level constituents (i.e.,
materials are able to sense changes in “materials by design”). This ability to
their environments and then respond to carefully arrange atoms provides
these changes in predetermined opportunities to develop mechanical,
manners—traits that are also found in electrical, magnetic, and other
living organisms. properties that are not otherwise
possible. We call this the “bottom-up”
• Components of a smart material (or
approach, and the study of the
system) include some type of sensor
properties of these materials is termed
(that detects an input signal), and an
“nanotechnology”; the “nano” prefix
actuator (that performs a responsive and
denotes that the dimensions of these
adaptive
structural entities are on the order of a
nanometer, as a rule, less than 100
nanometers
Chapter 1 - 37
SUMMARY
Course Goals:
• Use the right material for the job.
• Understand the relation between properties,
structure, and processing.
• Recognize new design opportunities offered
by materials selection.
Chapter 1 - 38