IoT Sensor Node PCB Design

Aim:

To design and develop a Printed Circuit Board (PCB) for an IoT sensor node
that can collect environmental data process it using a microcontroller, and
transmit it wirelessly to a remote server or cloud platform for monitoring
and analysis.

objectives

1. Design and fabricate a compact IoT sensor node PCB (single-sided or

double-sided) integrating:
o microcontroller with Wi-Fi/BLE (ESP32)
o environmental sensors (temperature, humidity, pressure)
o gas/light/motion sensing
o RTC and non-volatile logging (optional)
o Li-ion battery power management and charging
2. Implement firmware to:
o read sensor data periodically
o send data via MQTT/HTTP to a server or cloud (e.g., MQTT
broker)
o implement low-power sleep modes to extend battery life
o support OTA firmware updates (optional)
3. Validate the PCB through lab tests: power consumption, sensor
accuracy, wireless range, and reliability over 48–72 hours.

Proposed PCB design & application

Key features to include on PCB

 ESP32-WROOM (or WROOM module footprint) with antenna keepout

 I²C bus breakout for BME280 (temp/pressure/humidity) and RTC
(DS3231)
 SPI / I²C header for expansion
 MPU6050 (I²C) for motion
 Gas sensor footprint (MQ-series) or analog gas sensor input &
optional heater drive circuit
 Analog light sensor (LDR) or TSL2561 (I²C)
 Battery connector (JST) + TP4056 charging IC (or dedicated charger
IC) and fuel gauge option (MAX17048)
  Voltage regulator (e.g., MCP1700 or AMS1117 3.3V — prefer low-
dropout, low-quiescent model)
 USB-C or micro-USB programming connector + CP2102N / CH340
serial USB-to-UART
 SWD / UART programming header
 Power switch and power/charge status LEDs
 Test points for 3.3V, GND, VBAT, SDA, SCL, TX, RX
 Mounting holes and silkscreen labels

Applications

 Environmental monitoring (indoor/outdoor)

 Smart agriculture nodes (soil + environment)
 Asset monitoring and basic vibration detection
 Air-quality sensing in classrooms, labs, or factories
 Prototype node for wireless sensor networks and LPWAN gateway
integration

Required tools & software

PCB design & mechanical

 KiCad (recommended, free) or Autodesk Eagle / Altium

 Fusion 360 (for enclosure/3D fit checks) — optional
 Gerber viewer (e.g., Gerbv, online Gerber viewer)

Fabrication & assembly

 PCB manufacturer account (JLCPCB, PCBWay, local fab)

 Soldering station, hot-air rework (for SMD)
 Multimeter, oscilloscope, bench power supply
 Logic analyzer (optional) / I²C/SPI analyzer
 3D printer (for enclosure) — optional
Circuit diagram

Required components

Main electronics

 ESP32-WROOM module (female footprint or module) — 1

 CP2102N or CH340G USB-to-UART IC + USB-C / micro-USB
connector — 1 each
 3.3V LDO regulator (MCP1700-33 or similar low-Iq) — 1
 TP4056 Li-ion charger module IC or footprint for TP4056 (with
micro-USB) — 1
 Li-ion battery connector JST-SR (2-pin) — 1

Sensors

 BME280 (I²C) or BMP280 + separate humidity sensor — 1

 MPU6050 (accelerometer+gyro, I²C) — 1
 MQ-135 or other gas sensor (or footprint for analog gas sensor) — 1
 LDR resistor or TSL2561 / BH1750 (light sensor, I²C) — 1
 DS3231 RTC (I²C) with coin-cell holder (optional) — 1
Validation / test results

 Power consumption profile: Active vs sleep average current (mA)

and estimate battery lifetime (hours) on a specified battery capacity
(e.g., 2000 mAh)
 Sensor data plots: temperature, humidity, pressure and motion
traces during a 48–72 hour test
 Wireless range test: stable packet delivery at X meters (documented)
 Functional OTA update test (if implemented)

Result :

Thus, the IoT Sensor Node PCB Designhas been done and executed
successful.
 Multi Output Power Supply for PCB

Aim:

To design and develop a multi-output regulated power supply circuit

capable of providing different DC voltage levels from a single AC input
source, suitable for powering various sections of electronic circuits and
PCB prototypes.

Objective
To design and develop a multi-output DC regulated power supply on a PCB.
To generate multiple DC output voltages (e.g., +5V, +12V, -12V, +9V) from a
single AC input.
To design, simulate, and fabricate the PCB layout using Fusion 360
Electronics (Fusion Lab).
To understand the working of voltage regulators and rectifier circuits.

Proposed System / Design Overview

The proposed system converts 230V AC to multiple DC outputs through
these stages:
1. Step-Down Transformer: Converts 230V AC to 15V–0–15V AC.
2. Bridge Rectifier: Converts AC to pulsating DC.
3. Filter Circuit: Smooths the DC voltage using capacitors.
4. Voltage Regulator ICs: Provides regulated output voltages:
LM7805 → +5V
LM7812 → +12V
LM7912 → -12V
LM7809 → +9V
5. PCB Design: The circuit is designed and routed using Fusion 360
Electronics (Fusion Lab).
Schematic Diagram:

Main blocks:
AC Input → Transformer → Bridge Rectifier → Filter Capacitors → Voltage
Regulators → Output Terminals.
Tools and Software Required
Autodesk Fusion 360 (Fusion Lab) – for schematic & PCB layout design
Soldering Kit – for fabrication
PCB Etching Setup / Ready-made PCB Service
Multimeter – for output verification

Components Required
S.No Component Specification Quantity
1 Transformer 230V to 15-0-15V 1
2 Diodes 1N4007 4
3 Capacitors 1000µF, 470µF, 0.1µF 6
4 Voltage Regulator IC LM7805, LM7809, LM7812, LM7912 4
5 LED Indicator 1
6 Resistor 330Ω 1
7 PCB Board FR4 Single Layer 1
8 Output Terminals Banana connectors / female header 4
9 Heat Sink For regulators 4

Expected Output
Regulated DC Voltages:
+5V DC,+9V DC,+12V DC,-12V DC
Ripple-free, stable output suitable for microcontroller and analog circuits.

Applications
Power supply for microcontroller development boards (Arduino, PIC, etc.)
Used in electronics labs for circuit testing
For powering sensors, analog circuits, and op-amps
Useful for educational and prototype PCB testing
Result :
Thus, the Multi Output Power Supply for PCB been done and
executed successful.
 H-Bridge Motor Driver Circuit Using L293D

Aim
To design, simulate, and implement an H-Bridge DC motor driver circuit
using the L293D IC, and to design a Printed Circuit Board (PCB) layout
for controlling the direction and speed of a DC motor.

Objectives
1. To study the working principle of an H-Bridge motor driver circuit.
2. To interface the L293D IC with a microcontroller (Arduino UNO)
for bidirectional control of a DC motor.
3. To design the schematic diagram and PCB layout using a PCB
design tool such as KiCad, Proteus, or EasyEDA.
4. To fabricate and test the designed circuit on PCB.
5. To analyze the performance and efficiency of the circuit under
various operating conditions.

Operation
An H-Bridge circuit consists of four electronic switches (transistors or
MOSFETs) arranged in an “H” configuration. By controlling these switches,
the direction of current through the motor can be reversed, allowing
bidirectional rotation.
Truth Table for Motor Control:

Enable Input 1 Input 2 Motor Action

1 1 0 Rotates Clockwise (Forward)

1 0 1 Rotates Anticlockwise (Reverse)

1 0 0 Stop

1 1 1 Brake
By applying a PWM (Pulse Width Modulation) signal to the Enable pin,
the speed of the motor can also be controlled.

Required Components
Component Specification Quantity

L293D IC Dual H-Bridge Motor Driver 1

DC Motor 6V–12V DC 1

Arduino UNO ATmega328P 1

Resistors 10kΩ 2

Capacitors 100nF, 470µF As required

Diodes 1N4007 4

Power Supply 9V DC Adapter 1

Jumper Wires – As required

Required Tools and Software

Hardware Tools:
• Breadboard or Soldering Station
• Multimeter
• DC Power Supply
• PCB Fabrication Tools (Etching, Drilling, Soldering Equipment)
Software Tools:
• EasyEDA / KiCad / Proteus – For schematic and PCB design
• Arduino IDE – For programming the microcontroller
• LTSpice / Proteus Simulation – For circuit simulation and testing
CIRCUIT DIAGRAM
PCB Design Process
1. Schematic Design
The circuit schematic was drawn using EasyEDA (or KiCad/Proteus).
Components were selected from the library and connected according to the
circuit diagram.
2.Assign Footprints
Each component was assigned an appropriate footprint (e.g., DIP16 for
L293D).
3. PCB Layout
The PCB layout was designed with careful routing of power and signal
traces. Decoupling capacitors were placed near the IC power pins.
4. Design Rule Check (DRC)
The layout was verified to ensure there were no short circuits or
unconnected nets.
5. Gerber File Generation
Gerber files were generated and used for PCB fabrication.
6. PCB Fabrication and Assembly
The board was etched, drilled, and components were soldered. Proper
polarity was maintained for capacitors and diodes.

Working Principle
When the microcontroller sends a HIGH signal to IN1 and a LOW signal to
IN2, the motor rotates in one direction. Reversing these signals reverses the
rotation direction. The Enable pin must be kept HIGH for operation, and by
applying a PWM signal to this pin, motor speed can be varied smoothly.

Testing and Observations

1. The circuit was powered using a 9V DC adapter.
2. Arduino provided control signals for motor direction and speed.
3. The motor rotated smoothly in both directions according to the
programmed logic.
 4. PWM control successfully varied the speed of rotation.
5. The PCB operated efficiently without excessive heating or noise.

Expected Outcomes
• Understanding of H-Bridge motor control principles.
• Successful design and simulation of the circuit on PCB software.
• Implementation of a working motor driver PCB capable of
bidirectional motor control.
• Practical knowledge of PCB design workflow, from schematic to
fabrication.

Applications
• Robotics and automation systems
• Motorized toys and vehicles
• Conveyor and belt drive systems
• Line-following and obstacle-avoidance robots
• Mechatronic and embedded control systems

Results
• The designed H-Bridge circuit successfully controlled the direction
and speed of a DC motor.
• The PCB design was implemented and tested successfully.
• The L293D IC operated reliably within its rated limits of voltage and
current.
 USB Phone Charger

Aim:

To design and implement a regulated 5V USB phone charger circuit on a printed

circuit board (PCB) capable of charging mobile devices safely.

Objectives:

1. To convert AC or DC input into a stable 5V regulated DC output for USB charging.

2. To design and fabricate a PCB layout using software like Proteus / EasyEDA /
Fusion 360.
3. To solder and test all components to ensure correct functionality.
4. To observe the voltage regulation and current output performance.

Problem Statement:

Mobile phones require a 5V DC regulated power supply for charging. Directly

connecting to unregulated or fluctuating sources may damage the device. Therefore, a
stable and efficient USB charger circuit is required, which can be built on a PCB for
compactness and reliability.

Required Components:

Component Specification / Description Quantity

Voltage Regulator LM7805 (5V, 1A) 1
Diodes 1N4007 (for rectifier) 4
Transformer 230V AC to 12V AC, 500mA 1
Capacitors 1000µF, 100µF, 0.1µF As required
LED Power indicator 1
Resistor 330Ω (for LED) 1
USB Female Port Type-A 1
PCB Board Copper Clad Board 1
Connecting Wires — As needed
Soldering materials Solder wire, flux, iron —
Required Tools / Software:

 Circuit Design Software: EasyEDA / Proteus / Autodesk Fusion 360

 Simulation Tool: Proteus / Multisim (optional)
 Fabrication Tools: Etching setup, drilling machine, soldering kit, multimeter

Circuit Description:

1. The AC input (230V) is stepped down to 12V AC using a transformer.

2. The bridge rectifier (1N4007 diodes) converts AC to DC.
3. The filter capacitor (1000µF) smooths out ripples in the rectified DC.
4. The LM7805 regulator IC provides a stable 5V DC output.
5. The output is connected to a USB Type-A port for charging phones.
6. An LED indicator shows power ON status.

Diagram
Working Principle:

When power is supplied, the transformer reduces the voltage to 12V AC, which is
rectified by the diode bridge. The output is filtered and regulated to 5V by LM7805. The
stable 5V DC output is delivered to the USB port, suitable for charging mobile phones
safely.

Expected Output:

 Output Voltage: 5V DC ± 0.2V

 Maximum Current: Up to 1A (depending on transformer rating)
 LED Indicator: ON when power is active

Applications:

 Mobile phone and USB device charging

 Embedded system power supplies
 Portable electronic projects
 Power banks and IoT devices

Result:

The USB phone charger circuit was successfully designed, simulated, fabricated, and
tested. The output voltage was observed to be 5.02V DC, suitable for charging standard
USB devices.
Date :
Ex no:

Digital Thermometer PCB Design

Aim

To design and implement a Printed Circuit Board (PCB) for a Digital

Thermometer using a temperature sensor and a microcontroller to
measure and display temperature digitally.

Objectives:

 To design a schematic for a digital thermometer using suitable

sensors and display modules.
 To develop and simulate the PCB layout using CAD software (e.g.,
Fusion 360, Proteus, KiCAD, or Eagle).
 To fabricate the PCB and test its functionality.
 To understand sensor interfacing and ADC (Analog-to-Digital
Conversion) in microcontrollers.

Required Components:

Component Specification / Example Quantity

Temperature Sensor LM35 or DS18B20 1
Microcontroller ATmega328 / Arduino UNO 1
Display 16x2 LCD 1
Voltage Regulator LM7805 1
Resistors 220Ω, 10Kω As required
Capacitors 100µF, 0.1µF As required
Crystal Oscillator 16 MHz 1
Diodes 1N4007 2
Power Supply 9V battery / adapter 1
PCB board FR-4 1
Connecting Wires / Headers - As required
Required Tools and Software:

 Software:
o Fusion 360 Electronics / KiCAD / Proteus / Eagle (for PCB
design)
o Arduino IDE (for programming)

Tools:

o Soldering kit
o Multimeter
o Breadboard (for testing)
o PCB etching setup (if manually fabricated)
PCB Design Process:

1. Circuit Schematic Design: Draw the circuit using CAD software.

2. Component Placement: Place components logically and compactly.
3. Routing: Connect traces between components; ensure proper
clearance and width.
4. Ground Plane: Add a ground plane for noise reduction.
5. Design Rule Check (DRC): Verify the layout for errors.
6. Gerber Generation: Export Gerber files for fabrication.
7. Fabrication & Assembly: Print, etch, drill, and solder components
on PCB.

Applications:

 Medical thermometers
 Environmental monitoring
 Industrial temperature control
 Smart home automation

Expected Outcomes:

 Accurate temperature measurement in digital form.

 Working PCB circuit capable of displaying real-time temperature.
 Understanding of sensor calibration and PCB design techniques.

Result :
Thus, the digital thermometer PCB design has been done and
executed successful
 IoT Node with Voltage Management System
Content Type: Project Report
INDEX

Section Title Page No.

1 Introduction 1

2 List of Material 2

3 Power Management 3

4 Communication Interfaces 4

5 Sensors – Environmental 5

6 Sensors – Motion & Position 6

7 User Interface Components 7

8 Display & Output 8

9 Power Control & Actuators 9

10 Passive Components – Resistors 10

11 Passive Components – Capacitors 11

12 Inductors & Crystals 12

13 Connectors & Headers 13

14 Essential Core Software 14

15 Flowchart Explanation 15

16 Project Utility and Application 16

17 Step-by-Step Design Process 17

Section Title Page No.

18 Limitations vs. Benefits 18

19 Why Schematic, PCB & 3D View are Crucial 19

20 Cost Comparison 20

21 Conclusion 21
 1. Introduction
This project involves the design and development of a dedicated IoT Node featuring
a core microcontroller unit and a robust, integrated voltage management system. The
primary objective is to create a reliable, standalone PCB that can serve as the central
processing unit for IoT applications, capable of being powered by a variety of
sources (such as a 12V DC input or USB) and providing stable, clean power to the
microcontroller, sensors, and communication modules.
2.List of Material
1. Microcontroller & Core Processing

Component
Part Number Package Quantity Value/Specs Purpose
Type

ESP32-WROOM- Wi-Fi + BT, Main

Main MCU QFN48 1
32 4MB Flash processor

Backup ARM Alternative

STM32F103C8T6 LQFP48 1
MCU Cortex-M3 processor

SOIC- I2C, Battery Real-time

RTC DS3231 1
16 backup clock

Data
EEPROM 24C32 SOIC-8 1 32Kbit I2C
storage

2. Power Managemen
Compone Part Packag Quantit Value/Spe
Purpose
nt Type Number e y cs

Main
Buck MP1584E 12V→5V,
SOP-8 1 power
Converter N 3A
step-down

LDO AMS1117 SOT- 5V→3.3V, 3.3V

2
Regulator -3.3 223 1A regulation

LDO MCP1700 3.3V, Low-

SOT-23 1
Regulator -3302 250mA power rail

Overcurre
PTC Fuse 1812L 1812 2 1A, 6V nt
protection

12V Voltage
TVS Diode SMAJ12A SMA 2
protection spikes

Schottky Reverse
SS34 SMA 2 3A, 40V
Diode polarity

3. Communication Interfaces
 Part
Compone Packa Quanti
Numbe Value/Specs Purpose
nt Type ge ty
r

USB- CH340 SOP- Programmi

1 USB 2.0
UART C 16 ng interface

LQFP- Wired
Ethernet W5500 1 SPI Ethernet
48 networking

MAX48 SOIC- RS485 Industrial

RS485 1
5 8 transceiver comms

MCP25 CAN Automotive

CAN Bus DIP-8 1
51 transceiver comms

LoRa- 433/868/915M Long-range

LoRa SX1276 1
16 Hz wireless

4. Sensors – Environmental

Part
Packa Quant Value/Sp
Component Type Numb Purpose
ge ity ecs
er

Throu -
DHT2 Environme
Temp/Humidity gh- 1 40~80°C,
2 ntal sensing
hole 0-100%
 Part
Packa Quant Value/Sp
Component Type Numb Purpose
ge ity ecs
er

All-in-one
Temp/Humidity/Pr BME2 LGA-
1 I2C/SPI environme
essure 80 8
ntal

CO2,
MQ- Modul Air quality
Air Quality 1 NH3,
135 e detection
smoke

CCS8 LGA- TVOC, Indoor air

Gas Sensor 1
11 10 eCO2 quality

BH17 0-65535 Ambient

Light Sensor SOP-5 1
50 lux light

5. Sensors - Motion & Position

Component Part Packa Quanti Value/Sp

Purpose
Type Number ge ty ecs

Accelerometer/ MPU- QFN- 6-axis Motion

1
Gyro 6050 24 IMU tracking

HMC588 DFN- 3-axis Direction

Magnetometer 1
3L 16 compass sensing
Component Part Packa Quanti Value/Sp
Purpose
Type Number ge ty ecs

Modul GPS Location

GPS NEO-6M 1
e receiver tracking

HC- Modul Human Motion

PIR Motion 1
SR501 e detection sensing

Distance
HC- Modul 2cm-
Ultrasonic 1 measurem
SR04 e 400cm
ent

6. User Interface Components

Part
Component Quantit Value/Spec Purpos
Numbe Package
Type y s e
r

SPST,
Tactile TS-
6x6mm 4 through- User input
Switch 1187A
hole

Rotary Through 15 Rotary

EC11 1
Encoder -hole pulses/360° input

Touch SOT-23- Capacitive Touch

TTP223 2
Sensor 6 touch input
 Part
Component Quantit Value/Spec Purpos
Numbe Package
Type y s e
r

Potentiomete Through Analog

3362P 2 10K linear
r -hole input

2-axis Direction
Joystick PS2-Joy Module 1
analog control

7. Display & Output

Compone Part Packag Quantit Purpos

Value/Specs
nt Type Number e y e

OLED SSD130 Visual

Module 1 128x64, I2C
Display 6 output

Character Text
1602A Module 1 16x2, I2C
LCD display

Status
WS2812 Addressable
RGB LED 5050 4 indicatio
B RGB
n

Red/Green/Bl Status
LED Various 0805 10
ue indicators

EM- Throug Audio

Buzzer 1 5V, passive
27314 h-hole feedback
8. Power Control & Actuators

Compone Part Packag Quantit Value/Spec Purpos

nt Type Number e y s e

SRD- 5V, High

Relay 05VDC- Module 2 10A/250VA power
SL-C C switching

IRLB874 N-channel, Power

MOSFET TO-220 4
3 30V switching

Motor WSON- Dual H- DC motor

DRV8833 1
Driver 10 bridge control

CPC1017 AC power
SSR DIP-4 1 60V, 100mA
N control

Servo
Servo 3-pin,
CONN-3 Header 2 motor
Connector 2.54mm
interface

9. Passive Components - Resistors

 Part
Componen Packag Quantit Value/Spec Purpos
Numbe
t Type e y s e
r

Current
Resistor RC0805 0805 20 10Ω
limiting

Pull-
Resistor RC0805 0805 20 100Ω
up/down

General
Resistor RC0805 0805 20 1KΩ
purpose

Pull-
Resistor RC0805 0805 20 10KΩ
up/down

Sensor
Resistor RC0805 0805 10 100KΩ
dividers

High
Resistor RC0805 0805 10 1MΩ impedanc
e

10. Passive Components – Capacitors

Component Part
Package Quantity Value/Specs Purpose
Type Number

Ceramic 100nF
CC0805 0805 30 Decoupling
Cap (0.1μF)
Component Part
Package Quantity Value/Specs Purpose
Type Number

Ceramic
CC0805 0805 10 10μF Power filtering
Cap

Ceramic Bulk
CC0805 0805 10 22μF
Cap capacitance

Electrolytic ECE-1 Radial 10 100μF/16V Power supply

Electrolytic ECE-2 Radial 5 470μF/25V Input filtering

Stable
Tantalum TC-1 7343 5 47μF/16V
capacitance

11. Inductors & Crystals

Part
Compone Quantit Value/Spe
Numbe Package Purpose
nt Type y cs
r

Power LPS401 Buck

4x4mm 3 10μH
Inductor 2 converter

Power LPS401 Buck

4x4mm 3 22μH
Inductor 2 converter

Through- MCU
Crystal HC-49S 2 16MHz
hole clock
 Part
Compone Quantit Value/Spe
Numbe Package Purpose
nt Type y cs
r

3.2x2.5m
Crystal MC-306 2 32.768kHz RTC clock
m

Noise
Ferrite 600Ω
BLM18 0603 5 suppressio
Bead @100MHz
n

12. Connectors & Headers

Part
Compone Packag Quanti Value/Spe
Numb Purpose
nt Type e ty cs
er

GPIO CONN 2.54m 20-pin,

2 Expansion ports
Header -20 m female

Power DC- 5.5x2.1m

Panel 1 DC power input
Jack 005 m

USB- Throug Power/programm

USB-C 1 USB 2.0
C-31 h-hole ing

Terminal 5.08m
TB-2 2 2-pin Power/sensor I/O
Block m

JST JST-
XH-2 4 2-pin Battery/sensor
Connector XH
 Part
Compone Packag Quanti Value/Spe
Numb Purpose
nt Type e ty cs
er

MicroSD TF- Push-

1 MicroSD Data storage
Slot CARD push

Essential Core Software

 KiCad Official Library (built-in)
 SnapEDA (online component search)
 Ultra Librarian (component generator)
 Component Search Engine (for finding parts)
Flowchart Explanation
The IoT Node with Voltage Management System powers on, regulates the input
voltage, and provides stable 5V and 3.3V outputs for all components. The
microcontroller then initializes, collects sensor data, processes it, and transmits the
information to the cloud or display. If any abnormal conditions are detected, the
system triggers alerts through buzzer or relay while continuing real-time monitoring.
Why the Focus on an IoT Node with Voltage Management?
The title was chosen to highlight the two most critical aspects of a successful IoT
device:
1. The "Brain" (Microcontroller): The IoT node requires a capable
microcontroller to collect sensor data, process information, and handle
communication protocols (like Wi-Fi, Bluetooth, or LoRa).
2. The "Heart" (Voltage Management): IoT devices are often deployed in the
field and powered by unstable sources (batteries, solar, noisy DC adapters). A
robust voltage management system is not an accessory; it is a fundamental
requirement. It ensures:
o Stable Operation: Prevents crashes and resets caused by voltage
fluctuations.
o Component Protection: Shields sensitive ICs from voltage spikes and
incorrect polarity.
o Efficiency: Extends battery life through efficient power conversion.
o Versatility: Allows the same node to be used in different power
environments.
This project focuses on integrating these two systems seamlessly onto a single,
reliable PCB.
Why KiCad was the Ideal Choice
KiCad was selected as the EDA tool for this project for several key reasons:
 Professional-Grade Capabilities for Complex Boards: Designing a mixed-
signal board (with digital MCU and analog power management) requires a
tool that can handle different design rules. KiCad's powerful Design Rule
Checker (DRC) and custom net classes are essential for this.
 Integrated Workflow: The seamless transition from schematic to PCB layout
ensured that the complex connections between the power management ICs
 (like the U2 voltage regulator) and the microcontroller were perfectly
synchronized.
 Library Flexibility: The project required specific components (e.g., specific
switching regulators, MCU packages, USB connectors). KiCad's robust
library system, allowing for easy creation and modification of symbols and
footprints, was invaluable.
 Cost-Effectiveness: As a free and open-source tool, KiCad makes
professional IoT hardware development accessible, aligning with the open
nature of many IoT projects.
Project Utility and Application
This IoT Node PCB is designed to be the foundation for a wide array of applications:
 Smart Agriculture: Monitoring soil moisture, temperature, and humidity.
 Industrial Monitoring: Tracking vibration, temperature, and operational
status of machinery.
 Smart Home Devices: Serving as a hub for sensors and actuators.
 Environmental Sensing: Air quality and weather monitoring stations.
Its core utility lies in providing a pre-validated, ready-to-manufacture design that
handles the critical and often tricky aspects of power and processing, allowing
developers to focus on their specific application code and sensor integration. Step-
by-Step Design Process
The design followed a structured approach to ensure reliability, particularly for the
power system.
Schematic Capture Process
1. Architecture Definition: The system was broken down into blocks: Power
Input/Protection, Voltage Regulation (12V->5V->3.3V), Microcontroller
Core, Programming Interface, and Sensor/Communication Headers.
2. Component Selection:
 o Voltage Management: Components like switching regulators for high-
efficiency step-down (e.g., from 12V to 5V), LDOs for clean 3V3 for
the MCU, and protection elements like fuses (F1, F2) and TVS diodes
were carefully chosen.
o Microcontroller: A capable MCU (like an ESP32 or STM32) was
selected with sufficient I/O pins, as evidenced by the numerous GPIO
nets (/21, /22, /26, etc.).
3. Schematic Design:
o Each block was drawn on the schematic sheet.
o Power Paths were clearly defined: Thick lines and clear net labels
(/12V, /5V, /5V_P, /3V3, GND) were used to trace the power flow from
input to every IC.
o Decoupling Capacitors were placed close to every power pin on the
MCU and other ICs to ensure stable operation.
o The USB-to-Serial interface (CH340C) was included for both
programming and power.
PCB Design Process
This phase was critical for realizing a stable IoT node.
1. Board Outline and Layer Stack-up: A suitable size was defined on
the Edge.Cuts layer. A 2-layer design was likely used, as per the file's layer
setup (F.Cu & B.Cu).
2. Strategic Component Placement:
o Power Section First: The input connector, fuses, and voltage
regulators (U2) were placed first. Their input and output capacitors
were positioned immediately adjacent to the regulator pins to minimize
loop areas and ensure stability.
o MCU Placement: The microcontroller was placed centrally to simplify
routing to all GPIO headers.
 o Noise Separation: The analog and power sections were kept away
from the high-speed digital crystal oscillator circuit.
3. Critical Routing:
o Power Planes: A solid Ground Pour on both layers was created to
provide a low-impedance return path and act as a shield. A pour was
also used for the main 5V or 3V3 rail where possible.
o Wide Traces for High Current: Traces carrying higher current (e.g.,
from the 12V input to the regulator) were drawn with wider widths than
signal traces.
o Sensitive Signal Routing: Signals like the crystal oscillator were kept
short and close to the MCU, with guarding ground traces to prevent
noise coupling.
4. Design Rule Check (DRC): A strict DRC was run with appropriate
clearances for power and voltage settings to ensure manufacturability and
reliability.
3D View and Final Review
1. 3D Model Integration: 3D models were assigned to key components
(connectors, MCU, USB port) to visualize the final assembled board.
2. Mechanical Verification: The 3D viewer was used to check for any
component collisions, especially for taller parts like electrolytic capacitors or
connectors.
3. Assembly Review: The 3D view provided a clear picture for the assembly
house, confirming component placement and orientation. This step was
crucial to verify that the board was not only electrically sound but also
physically practical.
Limitations of the Custom PCB vs. a Breadboard
While a custom PCB is the final, professional solution, it has specific limitations
during the development phase compared to a breadboard.
1. Permanence and Inflexibility:
 o PCB: Once manufactured, the circuit is fixed. Correcting a design error
(like a swapped pin or missing connection) requires cutting traces and
adding "bodge wires," or worse, a completely new board revision
(revising the PCB), which is time-consuming and costly.
o Breadboard: The ultimate flexibility. You can change components,
connections, and the entire circuit layout in minutes.
2. High Initial Cost and Time:
o PCB: There is a significant upfront cost in time (design, layout, waiting
for shipping) and money (manufacturing fees). You cannot test a single
idea instantly.
o Breadboard: Virtually zero cost and time to start prototyping. You can
validate a circuit concept in an afternoon with components you have on
hand.
3. Component Accessibility:
o PCB: Uses Surface-Mount Devices (SMDs) like
the 0805 resistors/capacitors and other ICs. These are difficult or
impossible to hand-solder without practice and the right tools.
o Breadboard: Uses Through-Hole components which are easy to plug
in and remove by hand.
4. Debugging Visibility:
o PCB: All wires are hidden inside layers of the board. Probing signals
requires carefully finding test points. Debugging is more analytical and
less visual.
o Breadboard: All connections are completely visible and easy to probe
with a multimeter or oscilloscope.
Benefits of the Custom PCB vs. a Breadboard
The limitations of the breadboard are precisely why the custom PCB is necessary for
a final product.
1. Reliability and Robustness:
 o PCB: Solid, soldered connections do not come loose due to vibration
or movement. This is non-negotiable for any device deployed in the
field (like an IoT node).
o Breadboard: Connections are prone to becoming loose, intermittent,
or falling out, leading to erratic and unreliable behavior.
2. Performance (Critical for IoT):
o Signal Integrity: PCB allows for controlled impedance, proper
grounding planes, and short traces. This is vital for stable power
delivery and high-speed communication (USB, crystal oscillators).
Breadboards have long, looping wires with high inductance and
capacitance, which can cause noise, signal degradation, and circuit
instability.
o Power Distribution: The PCB uses power planes and wide traces to
deliver clean, stable power with low impedance. A breadboard's power
rails are inadequate for anything but the simplest, low-power circuits.
3. Size and Form Factor:
o PCB: Can be made compact and into any custom shape to fit inside an
enclosure. Your IoT node is a single, integrated unit.
o Breadboard: Bulky, fragile, and not suitable for any product that isn't
permanently sitting on a lab bench.
4. Scalability and Cost at Scale:
o PCB: While the initial cost is high, the cost per unit drops dramatically
when manufacturing in volume. It is the only viable option for
producing more than a handful of devices.
o Breadboard: Impractical and prohibitively expensive to scale beyond
a single prototype.
Why the Subtitle of Schematic, PCB Design, and 3D View is Crucial
This subtitle describes the product development lifecycle. Each stage has a major,
non-negotiable role.
 Schematic (The "Logic & Legal Contract"):
o Role: This is the circuit's blueprint. It defines what components are
used and how they are connected logically.
o Major Role: It is the source of truth for the BOM (Bill of Materials)
and the netlist. Any error here will be replicated and harder to fix later.
It's where you ensure the circuit theory is correct

 PCB Design (The "Physical Reality"):

o Role: This is the physical implementation of the schematic. It
defines where components are placed and how the copper traces are
routed to connect them.
o Major Role: This stage determines the performance, reliability, and
manufacturability of the board. Poor layout can make a perfectly
logical schematic fail completely due to noise, crosstalk, or power
issues. This is where engineering meets artistry.
 3D View (The "Virtual Prototype"):
o Role: This is a three-dimensional visualization of the assembled PCB.
o Major Role: It is critical for Mechanical Verification. You can check
for:
 Component Collisions: Does a tall capacitor hit the USB
connector when soldered?
 Enclosure Fit: Will the board fit inside its intended case? Are
the connectors aligned with the panel cutouts?
 Assembly Guidance: It provides a realistic view for the
assembly house, reducing erro
In summary: You think with the Schematic, you build with the PCB Layout, and
you verify with the 3D View. Skipping or rushing any step leads to a non-functional
or unreliable product.
Cost Comparison: Custom PCB vs. Other Methods

Off-the-
Shelf Dev
Custom Board
Breadboa Perfboard/Stripb
Feature PCB (Your (e.g.,
rd oard
IoT Node) Arduino,
ESP32
DevKit)

High (Design
Initial time + PCB
Very Low Low Very Low
Unit Cost Fab +
Components)
 Off-the-
Shelf Dev
Custom Board
Breadboa Perfboard/Stripb
Feature PCB (Your (e.g.,
rd oard
IoT Node) Arduino,
ESP32
DevKit)

Cost at
Very High (you're
Scale Impractic
Low (per High (labor) buying
(10+ al
unit) retail)
units)

Very High Low

Reliabilit Low (Highly Medium (Depends
(Prone to (Generally
y Cost reliable) on skill)
failure) reliable)

Low/Mediu
High
m (May
Performa Low (Optimi (Noise,
Medium have
nce Cost zed design) instability
features you
)
don't need)

Time &
High upfront, Low Very High (manual Lowest (Rea
Labor
then low upfront labor) dy to use)
Cost

Prototyping,
Final
Prototypi One-off, proof-of-
product,
Best For ng & permanent hobby concept,
scalable
learning projects low-volume
deployment
projects
Conclusion on Cost: For a one-off project, an off-the-shelf development board is
the cheapest and fastest option. However, the moment you plan to deploy multiple
reliable, optimized IoT nodes into the field, the custom PCB becomes the most cost-
effective and professional solution in the long run. Your custom PCB integrates only
the necessary components, potentially lowering the unit cost below that of a generic
dev board while offering superior reliability and a tailored form factor.
Github link: https://github.com/mani-2403/naan_mudhalavan