80Au-20Sn Solder Alloy Data Sheet
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rodrigo80Au-20Sn Solder Alloy Data Sheet
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Powered by AIA reducing agent or atmosphere is vital to prevent oxidation of the solder and substrates, ensuring clean and reliable soldering. The presence of such an agent can enable effective soldering even if the components are slightly oxidized, thereby improving joint integrity and strength .
With an electrical resistivity of 16.4 μΩ cm, the 80Au-20Sn alloy provides low-resistance connections critical for microelectronics, where efficient signal transmission and minimal energy loss are required. This property makes it suitable for applications where conductivity is crucial .
With a thermal conductivity of 57.3 W/m/K, the 80Au-20Sn solder alloy effectively manages heat dissipation in electronic assemblies, reducing the risk of thermal fatigue and ensuring the longevity of soldered joints. This makes it beneficial for applications in high-reliability electronic packaging .
With a Young's Modulus of 68 GPa at 23ºC, the alloy has a reasonable balance between stiffness and flexibility. This characteristic supports its application in electronic assemblies, allowing it to absorb and accommodate thermal and mechanical stresses without significant deformation .
Maintaining impurity levels below specified limits (such as Sb < 0.005, Pb < 0.005%) ensures the alloy's electrical and mechanical properties are not compromised. Excess impurities could degrade performance, leading to issues like poor conductivity, weakened mechanical integrity, and increased potential for corrosion or failure under stress .
At 23ºC, the alloy exhibits a high ultimate tensile strength of 275 MPa, but decreases to 217 MPa at 100ºC and 165 MPa at 150ºC. This indicates good mechanical strength at room temperature but suggests reduced mechanical stability at elevated temperatures, important for ensuring long-term reliability in electronic packaging subjected to thermal cycles .
For slightly oxidized components, a combination of flux or a reducing atmosphere, alongside higher or prolonged soldering temperatures, is necessary. This helps in effectively breaking down oxides and achieving robust soldering connections, ensuring the integrity of the soldered joint .
The eutectic melting point of 280ºC makes the 80Au-20Sn solder alloy suitable for applications that require a precise melting point for controlled soldering processes. This property ensures minimal phase change and uniform melting, crucial for high-precision electronic component soldering .
The CTE of 15.9 ppm/°C indicates how much the solder alloy will expand or contract with temperature changes. A lower CTE is advantageous as it reduces thermal stress between dissimilar materials soldered together, contributing to the durability and reliability of soldered joints in electronic applications .
For flux-less soldering with 80Au-20Sn solder alloy, ideal conditions include using nickel-plated substrates protected with an Au-flash and soldering in a vacuum, inert, or N2/H2 atmosphere. The soldering temperature should be maintained minimally at or above 305-320ºC for 20 seconds. It is crucial that the substrates are free from oxides and oily residues .
