PCB

• Printed circuit boards (PCBs) are the boards

that are used as the base in most electronics.
• foundation of most electronic devices.
• It is a board with conductive lines printed on a
non-conductive material.
• Electronic components are mounted on the
board
• The lines connect these components to create a
working circuit.
 Types of PCBs
1. Single layer PCB : single sided PCB. It has a
conductive layer on one side of the board.
• Used for simple devices like home appliances,
printers, etc.
• Simple, can be produced at higher speeds in
larger quantities
2. Double layer PCB : These have conductive
layers on both sides of the board.
• Used for devices like LED lighting, automotive
dashboards.
• The base of a double-sided PCB is composed
of insulating material also known as a
substrate
3. Multilayer PCBs: These have more than two
layers of conductive material
• Used for more complex devices like computer
motherboards, graphic cards.
4. Rigid PCBs: These are made of solid substrate
material. Not flexible.
• Used in computer mother boards.
5. Flexible PCBs: These are flexible and can bend
to fit space requirements.
• They can withstand high temperatures.
• Can be used in harsh conditions.
 How PCBs are Made

• Design: Engineers use specialized software to design

the circuit layout.
• Printing: The circuit pattern is printed onto a copper-
clad board.
• Etching: Unwanted copper is removed, leaving
behind the desired conductive pathways.
• Drilling: Holes are drilled for component placement.
• Component Placement: Electronic components are
placed and soldered onto the board.
 Applications of PCBs
• Computers: Motherboards, graphics cards, and
other internal components.
• Consumer electronics: TVs, stereos, gaming
consoles.
• Automotive: Engine control units, dashboard
electronics.
• Industrial equipment: Control systems, power
supplies.
• Medical devices: Diagnostic equipment, patient
monitoring systems.
 Standard Specifications (PCBs)
1. Material Specifications:
Base Material (Substrate):
• FR-4: The most common, fiber glass epoxy
laminate, offering a good balance of cost, electrical
properties, and mechanical strength.
• Other materials: FR-5 (higher temperature
resistance), CEM-1 (Composite Epoxy material -1)
(lower cost alternative to FR-4), polyimide (flexible
PCBs, high-temperature applications), etc.
• Materials:
• Substrate (base material): Type (e.g., FR-4,
CEM-1, polyimide), thickness, flammability
rating
• Copper foil: Thickness, type (rolled or
electrodeposited)
• Solder mask: Type, color, thickness
• Surface finish: Type (e.g., HASL, ENIG, ImAg),
thickness
• HASL (Hot Air Solder Leveling): Traditional,
provides a solderable finish but can have thickness
variations.
• ENIG (Electroless Nickel Immersion Gold): Popular,
flat surface, good for fine pitch components.
• Other finishes: Immersion silver (ImAg),
immersion tin (ImSn), organic solderability
preservative (OSP). Specifications will outline the
thickness and properties of the chosen finish.
• Electrical:
• Impedance control (for high-speed signals)
• Dielectric properties (permittivity, loss
tangent)
• Insulation resistance
• Voltage rating
• Mechanical:
• Dimensions and tolerances
• Thickness
• Hole sizes and tolerances
• Warpage and twist
• Manufacturing:
• Trace width and spacing
• Pad sizes and shapes
• Via sizes and types
• Solder mask registration
• Quality/Reliability:
• IPC Standards: Industry standards developed by the IPC
(Association Connecting Electronics Industries) provide
guidelines for design, manufacturing, and quality control.
• Examples include:
• IPC-A-600: Acceptability of Printed Circuit Boards
• IPC-6012: Qualification and Performance Specification for
Rigid Printed Boards
• IPC-6018: Qualification and Performance Specification for
High-Frequency (Microwave) Printed Boards
• Testing: Specifications may include requirements for
electrical testing (continuity, isolation), visual inspection,
and other quality assurance procedures.
 Laminate
• a laminate refers to the layers of material that make up the
board.
• laminate is the combined structure of the core material and
the copper layers, all bonded together to form the base of the
PCB.
• Core: This is the central insulating layer, often made of
fiberglass epoxy resin (like FR-4).
• Copper Layers: Thin sheets of copper foil are bonded to one
or both sides of the core (or multiple layers within the core in
multilayer PCBs).
• These copper layers are etched to create the conductive
pathways (traces) that connect electronic components.
 Types of laminates
1. FR-4 (Flame Retardant 4):
• Material: Woven fiberglass cloth impregnated with epoxy resin.
• Properties: Good balance of cost, mechanical strength, electrical
properties, and flame retardancy (UL94 V-0 rated).
• Applications: Used in a wide range of applications, from consumer
electronics to industrial equipment.
2. CEM-1 (Composite Epoxy Material 1):
• Material: Similar to FR-4 but typically uses a paper-based core
• Properties: Lower cost, but generally lower performance in terms
of mechanical strength and temperature resistance compared to
FR-4.
• Applications: Basic electronics, low-cost consumer goods.
3. CEM-3 (Composite Epoxy Material 3):
Material: A composite material with properties between FR-4 and CEM-1.
Applications: Mid-range electronics, appliances.

4. Polyimide:
• Material: A flexible plastic material.
• Properties: Excellent thermal stability, good electrical properties,
flexible (can be used for flexible PCBs).
• Applications: Aerospace, automotive, high-reliability electronics.

[Link] Laminates
Materials: Polyimide, polyester, or other flexible plastics.
Applications: Flexible circuits, wearable electronics, displays.

[Link] (PTFE) laminates: Used in microwave and RF applications due to

their excellent electrical properties.
 PCB Layout Planning
PCB Layout:
• Printed Circuit Board (PCB) layout is the process of arranging
components and traces on a PCB according to the circuit
design.
• Schematic Capture: The first step in PCB layout planning is to
create a schematic diagram of the circuit. This diagram shows
the components and their connections.
• Component Placement: The next step is to place the
components on the PCB. This is a critical step, as the
placement of components can affect the performance of the
circuit. For example, components that generate heat should
be placed away from other components.
• Routing: Once the components are placed, the
next step is to route the traces. Traces are the
conductive paths that connect the components.
Routing is a complex process, as the traces must
be routed in a way that minimizes noise and
interference.
• Design Rule Check (DRC): After the routing is
complete, a design rule check (DRC) is performed.
This check ensures that the layout meets the
design rules.
• Manufacturing: Once the layout is complete and
the DRC is passed, the PCB can be manufactured.
 Grid system
• A grid system in PCB layout planning is like a
set of imaginary lines that help you organize
and place components on your board.
• Think of it as graph paper for your circuit
design.
• Precision: Grids make it easier to align components
accurately and consistently. This is crucial for ensuring
proper connections and preventing errors.
• Efficiency: With a grid, you can quickly estimate distances
and spacing between components, speeding up the
layout process.
• Organization: Grids bring structure to your design,
making it easier to understand and modify.
• Design Rule Check (DRC): Some design software uses
grids to enforce design rules, such as minimum spacing
between traces.
 Component Hole Spacing

• Minimum Hole-to-Hole Spacing: This is the minimum distance between

the edges of adjacent holes.
It's essential to prevent drill breakage, especially with small holes.

• Hole-to-Edge Spacing: This is the minimum distance between the edge

of a hole and the edge of the PCB.
• It's critical for board strength and preventing breakouts during
manufacturing.
• Pad-to-Hole Spacing: This refers to the distance between the edge of a
pad and the edge of a hole.
• It's important for ensuring proper solderability and preventing shorts.
• *Pad--- exposed area of copper on a circuit board where a component
lead will be soldered.
 Conductor Widths and Spacing
• Trace Width: The width of a conductor (trace) is determined by the amount of
current it needs to carry. Wider traces can handle higher currents. However, wider
traces take up more space on the board.
• Trace Spacing: The distance between adjacent traces is crucial for preventing
signal interference (crosstalk).
The required spacing depends on the signal speed, voltage levels, and the desired
impedance.
• Minimum Trace Width and Spacing: PCB manufacturers have minimum limits for
trace width and spacing, typically around (0.1mm).
However, it's generally recommended to use wider traces and greater spacing
whenever possible to improve signal integrity (quality and reliability of electrical
signals ) and manufacturability.
• "3W Rule": A common guideline is the "3W rule," which suggests that the spacing
between traces should be at least three times the width of the traces themselves.
This helps to reduce crosstalk and signal interference.
 Methods to transfer Layout on copper clad
sheet
1. Manual Printing
• Print the Layout: Print the PCB layout onto glossy paper using a laser
printer. Ensure the toner is dark and dense.
• Prepare the Copper Clad: Clean the copper-clad board thoroughly with
fine-grade steel wool or a scouring pad to remove any oxidation or
contaminants.
• Transfer the Toner: Place the printed layout face-down onto the clean
copper-clad board. Secure it with tape to prevent movement.
• Apply Heat: Use a hot iron (no steam) to apply heat and pressure to the
back of the paper. This will melt the toner and transfer it onto the copper.
• Remove the Paper: Carefully peel off the paper, leaving the toner image
on the copper.
• Touch-ups: If necessary, use a permanent marker to touch up any broken
or weak areas in the transferred image.
2. photo printing method, also known as the photo resist method:
• 1. Prepare the Copper Clad Board:
Clean the copper-clad board thoroughly, just like with the manual method. It needs to
be free of any oxidation or contaminants.
• 2. Apply Photoresist:
This is the key difference. Instead of transferring toner, you apply a light-sensitive film
called photoresist to the copper-clad board. This can be done by spraying, dipping, or
laminating the film onto the board.
• 3. Create the Mask:
You'll need a transparent film with your PCB layout printed on it in black ink. This acts as
a mask.
• 4. Expose to UV Light:
Place the mask on top of the photoresist-coated board.
Expose the board to ultraviolet (UV) light. The UV light will harden the photoresist in the
areas that are not blocked by the black ink on the mask. The areas under the black ink
remain soft.
• 5. Develop the Board:
Immerse the board in a developer solution. This will remove the unhardened
photoresist, leaving behind the hardened photoresist that matches your PCB layout.
• 6. Etching:
Just like with toner transfer, the hardened photoresist now acts as a mask. Immerse the
board in an etching solution to remove the exposed copper.
• 7. Remove the Photoresist:
Once the etching is complete, remove the remaining photoresist with a solvent.
3. Screen Printing Method:
Screen Preparation: Mesh stretched on a frame,
coated with light-sensitive emulsion, layout mask
applied, exposed to UV light, unhardened emulsion
washed away.
Board Cleaning: Copper-clad board thoroughly
cleaned.
Printing: Screen placed on the board, ink (etch resist)
squeezed through the open areas of the screen (the
layout) onto the copper.
Etching: Board immersed in etching solution to
remove exposed copper (not covered by ink).
Ink Removal: Remaining ink removed with a solvent.