Electroplating: Electroplating is the process of deposition
of a thin layer of metal on another metal, alloy or any
other conducting material by passing direct electric
current through an electrolytic solution containing
suitable salt of the metal to be plated.
The principal components of electroplating process are
1. Electroplating bath: It contains a suitable salt
solution of the metal being deposited. it also contain
other additives to improve the electrodeposition.
2. Anode: Anode should be electrically conducting, it
may be inert electrode or the metal to be plated. The
reaction occur at anode is
M Mn+ + ne-
Cathode: The object to be plated is made as
cathode. It should have an electrically conducting
surface. The reaction occurring at the cathode is
Mn+ + ne- M
Inert vessel: It is basically container and contains
above mentioned materials. It may be a vessel
made of rubber lined steel, plastic concrete or
wood.
5. D.C. power supply: The positive terminal of the
power supply is connected to the anode and the
negative terminal is connected to the cathode.
Surface preparation:
Importance of surface preparation before electroplating: A
good adherent deposit is obtained only if the substrate
surface is free from dirt, grease, oxide scale and rust.
Therefore it is necessary to clean the surface thoroughly
before electrodeposition. If bright deposits are required,
the surface must be smooth.
Surface cleaning involves following steps:
Removal of organic substances – solvent cleaning,
alkali cleaning.
Removal of inorganic substances – mechanical
cleaning, pickling.
Rinsing with water.
1. Removal of organic substances – degreasing
process:
a) Organic solvent cleaning: It is used to remove
oils, greases etc. from the surface. For cleaning,
organic solvents such as trichloro ethylene (CCl2
= CHCl), methylene chloride ( CH2Cl2 ), carbon
tetra chloride ( CCl4 )etc. are used.
In vapour phase degreasing method, vapours
of the solvent (trichloro ethylene) are allowed to
condense on the metal surface. The condensed
liquid washes away the oil, grease and other
organic matter from the surface.
b) Alkali cleaning: Residual oil and grease from the
surface is removed by treatment with alkaline solutions
(NaOH, Na2CO3 etc.) Alkali cleaning is made more
effective by making the metal cathodic in a hot alkali
solution. The hydrogen gas liberated at the cathode
helps to dislodge the greasy matter.
2. Removal of inorganic substances – descaling process:
a) Mechanical cleaning: It is used to remove oxide scales
and rust from the metal surface. Simple mechanical
cleaning involves hand cleaning using sand paper, bristle
brush etc. Other methods involve polishing the surface i)
using grinding wheels, ii) by sand blasting and iii) by
electropolishing.
b) Pickling: It is used to remove oxide scales and rust
present on the metal surface by dissolution. Pickling
involves dipping the object in dilute acids (HCl, HNO3,
H2SO4 or a mixture) for considerable period of time.
Electroless plating
Definition: the process in which a thin layer of metal
from its salt solution is deposited on the catalytically
active surface of the material, in presence of a
suitable reducing agent without using electricity is
called as electroless plating. Reduction of the metal
ions and oxidation of the reducing agent occurs
simultaneously on the catalytic active surface of the
material.
Mn+ + reducing agent catalytic surface of
the material
M + oxidized
product
Electroless plating of Copper
Before electroless plating, the surface is
cleaned thoroughly. Insulators such as plastics
and printed circuit boards are activated by
dipping first in stannous chloride (SnCl2) and then
in palladium chloride (PdCl2). Then, the
electroless plating is done under the following
conditions:
1. Plating bath solution : CuSO4
2. Reducing agent : Formaldehyde (HCHO)
3. Complexing agent and exaltant : EDTA
4. Buffer (pH = 11) : Sodium hydroxide and
Rochelle salt (Na-K-tartrate)
5. Temperature : 25 oC
Formaldehyde and copper sulphate are added to the plating
bath periodically.
Applications: 1. Used for metalizing printed circuit boards.
2. Used to produce through-hole connections.
Distinction between electroplating and electroless plating:
Property Electroplating Electroless plating
Driving force Direct electric current Autocatalytic redox reaction
Anode Separate anode Catalytic surface of substrate
Cathode Object to be plated (pretreated to clean
Object to be plated and make the surface catalytically
(pretreated to clean active)
the surface)
Nature of the Uniform on all region
deposit Non-uniform or
irregular region
Reducing agents Electrons Chemical Reagents
Applicability Only to conductors Conductors and non-conductors
Advantages of electroless plating:
1. Electrical equipment is not required.
2. Semiconductors and insulators can also be plated.
3. Electroless plating baths have better throwing
power.
4. Electroless coatings are harder than the
electrodeposited coatings.
5. No levellers are required
6. Electroless deposits are free from holes and have
unique chemical, mechanical & magnetic properties.
