Laurent Giai-Miniet

EU Approves €920M in State Aid for Infineon Technologies’s €3.5B Chip Plant in Dresden The European Commission has approved €920 million in German state aid to support Infineon’s €3.5 billion MEGAFAB-DD project in Dresden. This plant, set to reach full capacity by 2031, will manufacture a broad range of semiconductors for industrial, automotive, and consumer applications. This move aligns with the European Chips Act, which aims to strengthen Europe’s semiconductor supply chain, resilience, and technological autonomy. The EU has allocated €15 billion for public and private semiconductor projects by 2030, reinforcing its commitment to securing advanced chip manufacturing. Infineon, in turn, has committed to R&D investment in next-generation chips and supporting crisis preparedness through priority-rated orders in supply shortages. As global chipmakers continue expanding capacity with government support, how will this impact Europe's position in the semiconductor race? Thanks again to Reuters for the full article with more background and insights click the source link in the comments below. #ChipDesign,#SemiconductorManufacturing, #VLSI, #Lithography, #ICPackaging #Semiconductors #Infineon #ChipsAct #Manufacturing #EU

448

12 Kommentare

Europe’s PCB landscape: 2024’s top 30 manufacturers revealed 🇪🇺🇨🇭🇬🇧💡 Evertiq - Global has previously reported on the long-term decline of the European PCB industry. Back in the 1990s, the EU accounted for around 20–30% of global production. Today, that figure stands at just 2%. But who are the champions still holding strong in the storm? Let’s get some of the most obvious facts out of the way first: #Germany remains the dominant force in European PCB manufacturing. In 2024, Germany accounted for 31.8% of Europe’s total PCB production, valued at EUR 572.2 million. #Austria and #Switzerland together contributed EUR 361.5 million, representing exactly 20.0% of the regional total. Combined, the DACH region made up over half of Europe’s PCB output at 51.8% — or EUR 933.7 million. Other significant regions include #GreatBritain with 13.8% (EUR 249.6 million), Italy at 12.3% (EUR 221.8 million), and #Belgium and #France contributing 10.4% (EUR 188.8 million). Smaller markets across Central Europe, the Iberian Peninsula, #Scandinavia, the Baltics, the #Netherlands, and #EasternEurope accounted for the remaining 11.6%, or EUR 210.8 million. Altogether, these figures bring Europe’s PCB production to approximately EUR 1.8 billion in 2024, excluding Russia and Belarus. A very big thank you again to Dennis Dahlgren and Evertiq - Global for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eBJ7pq3k #semiconductorindustry #semiconductors #chip #chips #geopolitics #it #manufacturing #tech #innovation #ems #electronics #iot #auto #car #ev

510

25 Kommentare

UBM (Under Bump Metallization) Purpose: UBM is a critical layer in advanced semiconductor packaging, enabling reliable electrical and mechanical connections between the chip and solder bumps or copper pillars. Functions: Provides electrical interconnection, wetting for solder, diffusion barrier, and mechanical support. Prevents failures like delamination, solder voids, and electromigration. Applications: Used in Flip-Chip, Wafer-Level Packaging (WLP), Fan-Out WLP, 2.5D/3D IC stacking, and high-end 3D packaging (e.g., HBM, CoWoS). Materials: Multi-layer stacks: adhesion (Ti, TiW, Ta), seed/conductor (Cu), barrier (TiN, Ta, Ni), wetting (Au, Ag), and solder (Sn, SnAgCu). Etching: Selective etchants are used for each metal layer (e.g., HF+H₂O₂ for Ti, H₃PO₄+H₂O₂ for Cu, KI/I₂ for Au). Process control is crucial to avoid over-etching and ensure pad accuracy. Trends: Moving toward finer pitches (<50 μm), eco-friendly chemistries, cost reduction (less Au), and dry/plasma etching for better precision. Conclusion: UBM is foundational for next-gen semiconductor reliability, yield, and performance, especially as packaging becomes more complex and dense.

251

3 Kommentare

🤝 STMicroelectronics and Morse Micro will be hosting a live joint webinar on 17 September 2025 on how to unlock #IoT 2.0 with Wi-Fi #HaLow and #STM32. 💡 In this webinar, ST and Morse Micro will deep dive into the MM6108-EKH05-05US, a powerful Wi-Fi HaLow (IEEE 802.11ah) development board purpose-built for a wide range of IoT applications. Combining Morse Micro’s #MM6108 Wi-Fi HaLow chip with ST’s advanced components, including the #STM32U5 ultra-low-power MCU, BlueNRG-M2 Bluetooth® module, and the #IIS328DQ 3-axis accelerometer, this development board is ready to power smart cities, industrial monitoring, building automation, and more. Key topics/learnings: ----------------------- 🌟 What defines IoT 2.0 and, more importantly, why traditional wireless tech is no longer enough 🌟 Why Wi-Fi HaLow is the key to long-range, high-throughput IoT 2.0 applications 🌟 ST's role is supporting next gen IoT development and platforming 🌟 How to get started with the MM6108-EKH05-05US dev board for rapid prototyping (whether you’re designing a next-gen asset tracker or a connected environmental sensor) 🌟 Application examples across industrial, smart building, and urban IoT use cases (e.g. camera) Register today via https://lnkd.in/gDksyUxq

76

2 Kommentare

The cost-effective QFN package is popular in Analog ICs, but parasitics of the wirebonds can be a challenge in some applications. This is particularly true for RF ICs and DC/DC switching converters. For these applications, the FlipChip QFN package provides a logical solution. By bumping the die and flipping it onto the leadframe, FlipChip QFN combines the benefits of a standard QFN - affordability and standardization - with enhanced electrical performance and a smaller footprint. In automotive applications, FlipChip QFN also offers the option of plated-end leads, which aid in solder fillet formation, further enhancing reliability. Amkor QFN Homepage: https://bit.ly/4dAzAhS

159

7 Kommentare

Another big milestone for Zero ASIC! Our Platypus family of open eFPGA just got a major upgrade in the relase of a set of heterogeneous eFPGAs with built in BRAM and DSP blocks. https://lnkd.in/e-HBARnG Platypus is the only eFPGA in the world guaranteeing: 100% open and standardized FPGA architectures 100% open source FPGA bitstream formats 100% open source FPGA development tools For the reasoning behind our open approach, check out the original Platypus announcement from earlier this year. https://lnkd.in/eyPxEUAX This awesome effort was led by Peter Grossmann, with tool chain contributions from Frederick Tombs, Wildebeest synthesis from Thierry Besson, and SiliconCompiler infrastructure from Peter Gadfort. With SoCs taking years to design and costing $100M - $1B to develop, I am always surprised more teams don't dedicate a portion of the silicon area to eFPGA logic. What's holding you back? Appreciate your thoughts and comments below.

528

26 Kommentare

POLAR ID metalenz DEMO AND DISCUSSION AT MWC BARCELONA 2025. There may be 110,000 people coming to the Mobile World Congress this week. But this invitation from Rob Devlin, Founder and CEO of Boston based metalenz was personal, designed to share ideas with other Optica corporate members. Apart from the demo, in our extended deep-tech interview Robert shares what's happened in the last couple of years, why their process is different, and the development and launch of their Polar ID sensing system. Their metasurface (or metalens) technology is rapidly becoming a game-changer for the optical industry. From invention in the Capasso lab at Harvard, to high volume production ready in the semiconductor foundry, Metalenz is enabling proliferation of compact advanced sensing in mobile and beyond. You will notice 2 "Roberts" in the video. metalenz has developed the world’s only consumer-scale imaging system that can sense the full polarization state of light; Polar ID enables the next level of biometric security. Using breakthrough advances in meta-optic capability, Polar ID accurately captures the unique “polarization signature” of a human face. With this additional layer of information, even the most sophisticated 3D masks (like the lookalike on the table) and spoof instruments are immediately detected as non-human. Polar ID harnesses meta-optic technology to extract additional information such as facial contour details and to detect human tissue liveness from a single image. We hope Robert can join us for the Global Advanced Manufacturing Alliance meeting at Heidelberg Instruments. For more information about this important meeting, check this link https://lnkd.in/dQJMnVCF or reach out to my Optica Colleague Olga Raz.

120

13 Kommentare

Mini-Circuits announces product releases for 16 models of connectorized broadband #RF #highpower #amplifier modules. These are in addition to 600+ amplifier models that are already available in stock. This portfolio of broadband amplifier has operating frequencies from 10 MHz up to 2000 MHz and saturated output power levels as low as 1 W and as high as 50W. The products can be ordered with heatsink or without heatsink. The amplifiers are designed using state of the art #RFpower semiconductor technology. Built-in protection circuits for excessive voltage, power & temperature is implemented in these amplifier models to survive open and short conditions at the specified CW power on the data sheet. The high gain, ~50dB specification of the amplifier, allows it to work with any commercially available signal sources. These amplifiers can be used in a broad range of applications which includes RF #EMC testing for #automotive or #Industrial #IoT, Laser Drivers for #QuantumComputing, General Purpose #Instrumentation Amplifier for lab use, #Communications and various #wireless testing. For more information , visit link below. https://lnkd.in/eDMU2z_j #RFEngineering, #testandmeasurements, #radar, #milcom, #satcom, #telecom,

34

1 Kommentar

Despite the rise of GPUs and custom ASICs, Saban emphasized that the core value of FPGAs remains: flexibility, time-to-market, and adaptability. 40 Years of FPGA: From Logic Cleanup to AI Acceleration https://lnkd.in/dbRh-cB3

104

3 Kommentare