Table Of Contents
- 5 -
datasheet
KLMxGxGE4A-A001
e·MMC
Rev. 1.1
1.0 PRODUCT LIST..........................................................................................................................................................4
2.0 KEY FEATURES.........................................................................................................................................................4
3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5
3.1 169 Ball Pin Configuration .......................................................................................................................................5
3.1.1 12mm x 16mm x 1.0mm Package Dimension...................................................................................................6
3.1.2 12mm x 16mm x 1.2mm Package Dimension...................................................................................................7
3.2 Product Architecture ................................................................................................................................................8
4.0 e.MMC 4.41 features ..................................................................................................................................................9
4.1 Data Write................................................................................................................................................................9
4.2 Reliable Write ..........................................................................................................................................................10
4.3 Secure Trim .............................................................................................................................................................10
4.4 High Priority Interrupt...............................................................................................................................................10
4.5 Background Operation.............................................................................................................................................12
5.0 Technical Notes ..........................................................................................................................................................13
5.1 S/W Agorithm ..........................................................................................................................................................13
5.1.1 Partition Management .......................................................................................................................................13
5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................13
5.1.1.2 Enhanced Partition (Area) ..........................................................................................................................13
5.1.2 Write protect management................................................................................................................................14
5.1.2.1 User Area Write Protection .........................................................................................................................14
5.1.2.2 Boot Partition Write Protection....................................................................................................................14
5.1.3 Boot operation...................................................................................................................................................15
5.1.4 Wear Leveling ...................................................................................................................................................16
5.1.5 User Density......................................................................................................................................................16
5.1.6 Auto Power Saving Mode..................................................................................................................................17
5.1.7 End of Life Management ...................................................................................................................................17
5.2 Smart Report ...........................................................................................................................................................17
5.2.1 Smart Report Sequence....................................................................................................................................17
5.2.2 Smart Report Output Data (For Customer) .......................................................................................................18
5.2.3 Performance......................................................................................................................................................18
6.0 REGISTER VALUE.....................................................................................................................................................19
6.1 OCR Register ..........................................................................................................................................................19
6.2 CID Register ............................................................................................................................................................19
6.2.1 Product name table (In CID Register) ...............................................................................................................19
6.3 CSD Register...........................................................................................................................................................20
6.4 Extended CSD Register ..........................................................................................................................................21
7.0 AC PARAMETER........................................................................................................................................................24
7.1 Time Parameter.......................................................................................................................................................24
7.2 Bus Timing Parameter.............................................................................................................................................24
7.3 Bus timing for DAT signals during 2x data rate operation .......................................................................................26
7.3.1 Dual data rate interface timings ........................................................................................................................26
7.4 Bus signal levels......................................................................................................................................................27
7.4.1 Open-drain mode bus signal level.....................................................................................................................27
7.4.2 Push-pull mode bus signal level.high-voltage MultiMediaCard.........................................................................27
7.4.3 Push-pull mode bus signal level.dual-voltage MultiMediaCard.........................................................................27
7.4.4 Push-pull mode bus signal level.e·MMC...........................................................................................................28
8.0 DC PARAMETER .......................................................................................................................................................29
8.1 Active Power Consumption during operation ..........................................................................................................29
8.2 Standby Power Consumption in auto power saving mode and standby state........................................................29
8.3 Sleep Power Consumption in Sleep State..............................................................................................................29
8.4 Supply Voltage .............................................................................................................
........................................... 29
8.5 Bus Operating Conditions........................................................................................................................................29
8.6 Bus Signal Line Load...............................................................................................................................................30
9.0 e·MMC Connection Guide ..........................................................................................................................................31
9.1 x8 support Host connection Guide ..........................................................................................................................31
9.2 x4 support Host connection Guide ..........................................................................................................................31
tj_cgj2015-10-06三星的资料难找，这个很不错，谢谢楼主分享！
