Okmetic

Semiconductors play a crucial role in Finland’s tech landscape, yet the industry is often poorly known. As the industry grows, so does the need for skilled professionals. In a recent article by Teknologiateollisuus - Technology Industries of Finland, Research and Development Director Heikki Holmberg and Senior Vice President, Human Resources, Sustainability and Communications Jaska Tuominen share how we at Okmetic have been working for years to address the expert shortage and build a stronger future for the sector.   👉 See link in comments to read the article (in Finnish). #PiinkovatAmmattilaiset #TopnotchProfessionals

Okmetic is participating in the European Chips Skills Academy (ECSA), a strategic EU initiative tackling the critical shortage of semiconductor professionals. The newly published ECSA Skills Strategy 2025 highlights key challenges: over 320,000 open roles and 30% of the workforce retiring by 2030. These trends threaten the growth and resilience of Europe’s semiconductor sector. Coordinated by SEMI Europe, the four-year project brings together 18 partners from 13 EU countries to: - Strengthen collaboration between industry and education - Promote digital and inclusive learning - Share best practices across the ecosystem Together, we’re helping build a more skilled and resilient semiconductor workforce, one that supports Europe’s strategic autonomy and long-term competitiveness. See link in comments to learn more about the ECSA project. #ECSA #Semiconductorindustry #Microelectronics #EUChipsAct

Okmetic is proud to be part of the TimeZero project, a Business Finland-funded initiative under ChipZero Veturi ecosystem. The project brings together 8 companies and research organisations to build a Finnish ecosystem for high-performance timing systems. In this project, Okmetic develops high-performance C-SOI® wafers for MEMS resonators. The advanced C-SOI® structure enables smaller, more stable, and energy-efficient devices by improving the performance of the resonators that generate the fundamental clock frequency for timing circuits in electronics. 🕑 We look forward to driving next-generation timing technology together! See link in comments to learn more about Okmetic’s high-performance C-SOI® wafers. #MEMS #CSOI #Innovation #Electronics #semiconductor

We’re pleased to announce our participation in two exciting events this November in Munich: SEMICON Europa 2025 and MEMS & Imaging Sensors Summit! SEMICON Europa brings together leaders and innovators from across the semiconductor value chain to explore the technologies and partnerships shaping the future of the European semiconductor industry. This year’s theme, Global Collaborations for European Economic Resilience, highlights the importance of international cooperation in building a stronger and more resilient European ecosystem. Alongside SEMICON Europa, we’re also joining the MEMS & Imaging Sensors Summit, a key gathering for experts driving innovation in sensor technologies, which are essential to the advancement of smart systems and applications. We look forward to insightful conversations and new connections throughout the week. See link in comments to learn more about Okmetic silicon wafer solutions. #SEMICONEuropa #Innovation #RFTechnologies #MEMS

We’re pleased to announce our participation in the European ARCTIC consortium, developing cutting-edge cryogenic technologies for quantum computing. This three-year initiative, coordinated by IMEC and funded by the EU and Business Finland, unites 36 partners from 11 countries to advance the frontiers of cryogenic microelectronics. Together with partners such as Bluefors, VTT, and Incize, Okmetic contributes by developing specialized silicon wafers that enable reliable and scalable quantum devices. 🔗 Read more about the ARCTIC project, link in comments. #QuantumComputing #Cryogenics #Semiconductors #Innovation #siliconwafers

🎓 Last weekend, Aalto University Alumni Days 2025 brought together alumni to explore innovation, leadership, and AI and to celebrate lifelong connections. Our Chief Commercial Officer, Anna-Riikka Vuorikari-Antikainen, took the stage at Dipoli, Espoo, with her talk “40 Years of Innovation in Silicon Wafers: From Aalto Spin-off to Powering Semiconductor Technologies.” She highlighted Okmetic’s four-decade journey from an Aalto University spin-off to a global leader in advanced silicon solutions for MEMS, RF, and Power applications and how continuous innovation drives the semiconductor industry forward. A warm thank-you to Aalto University for hosting such an inspiring event and fostering a strong community of technology and entrepreneurship. #technology, #innovation, #semiconductor

It’s a pleasure to announce our participation in the TECHCET Fall 2025 CMC Seminar! The seminar, held in Dresden, Germany, brings together experts from across the semiconductor supply chain to tackle critical topics like material sourcing resiliency, sustainability, and quality-driven innovation. We’re looking forward to engaging with industry peers, gaining insights, and contributing to the conversations shaping the future of semiconductor materials. At Okmetic, we continuously strengthen our supply chain resilience, quality standards, and sustainability practices to ensure reliable delivery and high-quality silicon wafers for semiconductor devices. 🌱 Learn more about how sustainability drives our work at Okmetic and read our sustainability report, link in comments #Semiconductors #Silicon #Sustainability #TECHCET

Did you know that selecting the right wafer for your MEMS design can offer several advantages, including lower manufacturing costs? SSP wafers are typically the most budget-friendly option, while DSP wafers provide improved precision at a slightly higher cost. However, prices for both can vary based on specifications and order quantities. Bonded SOI, Enhanced SOI (E-SOI®), and Cavity SOI (C-SOI®) wafers may require a higher upfront investment, but they deliver clear advantages by streamlining device processing, boosting performance in demanding applications, offering shorter lead times and lowering total cost of ownership. Bonded SOI wafers bring cost advantages in several ways: 🔵 These advanced wafers can shrink chip sizes to as little as one-third of traditional designs. 🔵 The buried oxide layer simplifies device processing and improves device yield. 🔵 C-SOI® wafers with pre-etched cavities facilitate the production of complex MEMS devices, leading to improved functionality and more streamlined production. 🔵 Terrace Free SOI wafer capability available for Bonded SOI and E-SOI® wafers further add cost-efficiency through increased usable wafer area, reduced edge exclusion as well as improved yield and handling enabling also easier stacking of the silicon wafers.   Discover how to choose the ideal wafer for your MEMS devices, link in comments. #MEMS #Semiconductors #Innovation

Celebrate Global Hydropower Day this Saturday! 🌍💧 Did you know that we purchase most of our electricity from hydropower sources? We have set our goal to reduce our scope 1 & 2 emissions by 90 % by 2030. To advance this goal, we are purchasing 80% of our electricity this year as low-carbon hydropower. Let's power a greener future together! 🌿 #Sustainability #HydroPower

Okmetic is currently attending Semicon West in Phoenix, Arizona. Jim Reed, VP of Key Account Development and President of Okmetic Inc., shared insights on how Okmetic advances both GaN-on-Si and GaN-on-SOI technology. As a leading supplier of engineered silicon substrates, our wafers help address critical challenges such as thermal and lattice mismatch. This enables high-performance power and RF applications. With more than 500,000 silicon substrates for GaN growth shipped worldwide, Okmetic brings proven experience and scale to the industry. At the event, Mr. Reed gave a speech titled “Powering the Future: Optimized Silicon Substrates for GaN Power & RF devices.” The talk focused on how holistic wafer optimization can resolve key GaN-on-Si challenges, including lattice and thermal mismatch, wafer bowing, and GaN layer quality. These factors are critical to device reliability and manufacturing scalability. Okmetic’s Power GaN Silicon Substrates were highlighted for supporting high current handling in power applications. GaN-on-SOI substrates were presented as a promising platform for monolithic integration, enabling more compact and efficient device architectures. In RF applications, the presentation emphasized how RF GaN Substrates contribute to lower insertion losses and improved signal integrity. This supports high-frequency systems such as 5G, 6G, and satellite communications. For more technical insights, discover our recently published white paper titled “Enabling Next-Gen Power and RF GaN Devices with Optimized Silicon and SOI Substrates.” You can find the link in the comments. #GaN #Silicon #SOI