Cedric Mayor

Thrilled to announce that we are bringing new innovating memory solution for @STMicroelectronics automotive microcontrollers. Stellar MCUs with an extensible memory will bring simpler, more scalable computing platform for developing software-defined vehicles and evolving electric vehicle architectures. This will future-proof the development of next-gen cars, enabling car makers continuous innovation, including AI applications or other memory-hungry solutions. Engineers can avoid costly hardware redesigns to support more software features, accelerate time to market and companies simplify supply chain logistics. This will bring a significant value to our customers.   xMemory will be available on all upcoming Stellar P & G, with production starting later in 2025. Read more https://lnkd.in/diGDNiVM   This is part of the transformative journey for our automotive microcontrollers which we introduced end of last year: https://lnkd.in/dpeXMuS9   Ready for the next wave of software-defined vehicles? #Semiconductor #automotive #Stellar #PCM #AI

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STMicroelectronics (ST) is one of the most respected and influential Semiconductor companies in the world. When thinking about innovation, ST deserves serious consideration for several key reasons such as #technology leadership, product diversity, #sustainability efforts, and its strategic role in global tech ecosystems. 💪💪💪 1️⃣ Broad Technological Scope and Expertise ST is not a niche semiconductor company—it’s a broad-based technology innovator: • Microcontrollers (MCUs): ST is a global leader in 32-bit ARM Cortex-M microcontrollers with its STM32 family, widely used in everything from consumer electronics to industrial. • Power electronics: Including wide bandgap semicon like #SiC (SiliconCarbide) and #GaN (Gallium Nitride), which are essential for electric vehicles, renewable energy, and power conversion. • MEMS & Sensors: ST is a top supplier of Time-of-flight sensors used in smartphones and MEMS (Micro-Electro-Mechanical Systems) used in smartphones, wearables, automotive, and industrial sensing (accelerometers, gyroscopes, pressure sensors, etc.). • Analog and mixed-signal ICs: Crucial for signal conditioning, power management, and connectivity. 2️⃣ Leadership in Automotive and Industrial Markets ST is deeply embedded in automotive innovation, supplying critical components for: • Advanced Driver Assistance Systems (ADAS) • Electrification (powertrain electrification, battery management) • In-vehicle networking and control systems In industrial applications, ST provides chips for factory automation, robotics, and motor control: key areas for Industry 4.0. 3️⃣ Strategic Innovation in Sustainable Technology ST has positioned itself as a key enabler of sustainability: • SiC and GaN increase energy efficiency across electric vehicles, solar inverters, and fast chargers. • commitment to carbon neutrality by 2027 that is one of the most ambitious in the semiconductor industry. • ST’s chips are used in renewable energy systems and energy-efficient appliances, directly supporting the energy transition. 4️⃣ Deep R&D Investment and Ecosystem Building • ST invests heavily in R&D with several billions $ in past years. • with R&D centers focusing on next-gen technologies. • STM32Cube ecosystem & strong developer community enable faster prototyping and innovation across industries. • Partnerships with leading universities and research labs (like CEA-Leti) allow to stay at the forefront of emerging technologies. 5️⃣ Pioneering Work in Embedded AI & Connectivity: • ST is enabling edge AI: embedding machine learning capabilities directly into microcontrollers for smart sensors, appliances, and IoT nodes. • Bluetooth Low Energy (BLE), NFC, subGHz, WiFi and ultra-wideband (UWB) solutions are helping shape the connected world. • Through solutions like #STM32 AI tools and #TinyML, ST enables intelligent systems without needing cloud computation. ST isn’t just following innovation—it’s enabling it !!😊😊💪💪 Tom's Hardware

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UBM (Under Bump Metallization) Purpose: UBM is a critical layer in advanced semiconductor packaging, enabling reliable electrical and mechanical connections between the chip and solder bumps or copper pillars. Functions: Provides electrical interconnection, wetting for solder, diffusion barrier, and mechanical support. Prevents failures like delamination, solder voids, and electromigration. Applications: Used in Flip-Chip, Wafer-Level Packaging (WLP), Fan-Out WLP, 2.5D/3D IC stacking, and high-end 3D packaging (e.g., HBM, CoWoS). Materials: Multi-layer stacks: adhesion (Ti, TiW, Ta), seed/conductor (Cu), barrier (TiN, Ta, Ni), wetting (Au, Ag), and solder (Sn, SnAgCu). Etching: Selective etchants are used for each metal layer (e.g., HF+H₂O₂ for Ti, H₃PO₄+H₂O₂ for Cu, KI/I₂ for Au). Process control is crucial to avoid over-etching and ensure pad accuracy. Trends: Moving toward finer pitches (<50 μm), eco-friendly chemistries, cost reduction (less Au), and dry/plasma etching for better precision. Conclusion: UBM is foundational for next-gen semiconductor reliability, yield, and performance, especially as packaging becomes more complex and dense.

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🤝 STMicroelectronics and Morse Micro will be hosting a live joint webinar on 17 September 2025 on how to unlock #IoT 2.0 with Wi-Fi #HaLow and #STM32. 💡 In this webinar, ST and Morse Micro will deep dive into the MM6108-EKH05-05US, a powerful Wi-Fi HaLow (IEEE 802.11ah) development board purpose-built for a wide range of IoT applications. Combining Morse Micro’s #MM6108 Wi-Fi HaLow chip with ST’s advanced components, including the #STM32U5 ultra-low-power MCU, BlueNRG-M2 Bluetooth® module, and the #IIS328DQ 3-axis accelerometer, this development board is ready to power smart cities, industrial monitoring, building automation, and more. Key topics/learnings: ----------------------- 🌟 What defines IoT 2.0 and, more importantly, why traditional wireless tech is no longer enough 🌟 Why Wi-Fi HaLow is the key to long-range, high-throughput IoT 2.0 applications 🌟 ST's role is supporting next gen IoT development and platforming 🌟 How to get started with the MM6108-EKH05-05US dev board for rapid prototyping (whether you’re designing a next-gen asset tracker or a connected environmental sensor) 🌟 Application examples across industrial, smart building, and urban IoT use cases (e.g. camera) Register today via https://lnkd.in/gDksyUxq

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The cost-effective QFN package is popular in Analog ICs, but parasitics of the wirebonds can be a challenge in some applications. This is particularly true for RF ICs and DC/DC switching converters. For these applications, the FlipChip QFN package provides a logical solution. By bumping the die and flipping it onto the leadframe, FlipChip QFN combines the benefits of a standard QFN - affordability and standardization - with enhanced electrical performance and a smaller footprint. In automotive applications, FlipChip QFN also offers the option of plated-end leads, which aid in solder fillet formation, further enhancing reliability. Amkor QFN Homepage: https://bit.ly/4dAzAhS

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Dear RF/Microwave Engineers, Today let me introduce another classic book from my bookshelf "Microwave Transistor Amplifiers Analysis and Design" by Guillermo Gonzalez. I don't think there is any RF/Microwave power amplifier designers (especially my contemporaries) who have not referred this book. This book can be read and understood by any RF designer. Very well written, in easy to read font size also 🙂, covering following topics: (1) Representation of two port networks (2) Microwave networks and signal flow graphs (3) Microwave transistor amplifier design (4) Noise, broadband, and high-power design networks (5) Microwave transistor oscillator design Appendix covers very useful concepts such as noise. This book will be very useful if you are going to design RF/ Microwave Amplifiers. Reading from hard copy is more enjoyable than from soft-copy of the book. It is classic book. Must have classic book in your book-shelf. Enjoy reading!

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I’m pleased to announce that NXP has completed the acquisitions of Kinara and Aviva Links, two strategic moves that strengthen our ability to deliver cutting-edge solutions for customers worldwide. Our teams are energized by the possibilities these technologies bring and ready to collaborate with customers on how these compelling offerings can help them simplify complexity and speed time-to-market. From advanced AI acceleration to secure gigabit connectivity, we’re preparing to deliver solutions that will transform mobility and intelligent edge devices. This is an exciting chapter for NXP, and we look forward to sharing progress as we bring these innovations to market. Learn more about Kinara: https://lnkd.in/gePGkfjh Learn more about Aviva Links: https://lnkd.in/gEjWqmVP #BrighterTogether

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Europe’s PCB landscape: 2024’s top 30 manufacturers revealed 🇪🇺🇨🇭🇬🇧💡 Evertiq - Global has previously reported on the long-term decline of the European PCB industry. Back in the 1990s, the EU accounted for around 20–30% of global production. Today, that figure stands at just 2%. But who are the champions still holding strong in the storm? Let’s get some of the most obvious facts out of the way first: #Germany remains the dominant force in European PCB manufacturing. In 2024, Germany accounted for 31.8% of Europe’s total PCB production, valued at EUR 572.2 million. #Austria and #Switzerland together contributed EUR 361.5 million, representing exactly 20.0% of the regional total. Combined, the DACH region made up over half of Europe’s PCB output at 51.8% — or EUR 933.7 million. Other significant regions include #GreatBritain with 13.8% (EUR 249.6 million), Italy at 12.3% (EUR 221.8 million), and #Belgium and #France contributing 10.4% (EUR 188.8 million). Smaller markets across Central Europe, the Iberian Peninsula, #Scandinavia, the Baltics, the #Netherlands, and #EasternEurope accounted for the remaining 11.6%, or EUR 210.8 million. Altogether, these figures bring Europe’s PCB production to approximately EUR 1.8 billion in 2024, excluding Russia and Belarus. A very big thank you again to Dennis Dahlgren and Evertiq - Global for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eBJ7pq3k #semiconductorindustry #semiconductors #chip #chips #geopolitics #it #manufacturing #tech #innovation #ems #electronics #iot #auto #car #ev

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REPOST - 🎙 PASQUALE PISTORIO — The Architect Behind STMicroelectronics In this week's "Semiconductor Leadership Podcast" - I have decided to dedicate it to a Quick Chip Episode. Unfortunately, I was too young to have met the late Pasquale Pistorio. Having seen multiple posts about him last month about his passing, I did some research on him and evidently one can be very fond of what he achieved and created. 🎧 Watch or listen now on YouTube or Spotify — Link is in the comments From Sicily to Silicon Valley, from salesman to semiconductor legend — this week’s Quick Chip episode honors the incredible life of Pasquale Pistorio, the man who turned near-collapse into European strength. 🇮🇹💡 He was more than the CEO who built STMicroelectronics. He was a visionary who proved that Europe could lead in semiconductors, and that sustainability could be strategy, not charity — decades before it became the norm. 🌍 In this short, powerful story, we explore: 🔹 His humble beginnings in Sicily and relentless pursuit of education 🔹 His rise through Motorola, leading global semiconductor operations 🔹 The daring merger that gave birth to STMicroelectronics 🔹 His environmental foresight with the Environmental Decalogue 🔹 His enduring humanitarian legacy through the Pistorio Foundation Pasquale’s journey is a masterclass in resilience, vision, and leadership — a story every semiconductor professional should know.

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