Prateek Sikka

𝐈𝐧𝐝𝐢𝐚’𝐬 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐇𝐢𝐫𝐢𝐧𝐠 𝐒𝐮𝐫𝐠𝐞 𝐢𝐬 𝐑𝐞𝐝𝐞𝐟𝐢𝐧𝐢𝐧𝐠 𝐂𝐚𝐫𝐞𝐞𝐫𝐬! The semiconductor industry in India is experiencing an unprecedented hiring boom — gradually chipping away at IT placements and opening exciting opportunities for engineers across domains. 🔹 End-to-end hiring: RTL/SoC design, verification, embedded systems, manufacturing (process, packaging, yield). 🔹 Freshers’ salaries: ₹6–12 LPA (vs. ₹3–4 LPA in IT). 🔹 Aggressive campus recruitment from tier-2 & tier-3 colleges, not just IITs. 🔹 Internships: ₹40k–50k/month stipends to build hands-on chip design skills. 🔹 Hiring scale: ~12,000 freshers annually (up from 8,000 last year). 🔹 Career growth: Roles extend up to ₹20–120 LPA for architects & leaders. Fuelled by global supply chain shifts, EVs, telecom, defence, and government initiatives (DLI, PLI, ECMS), this hiring surge is reshaping student aspirations, especially in ECE and core engineering branches. With India projected to hit $103B semiconductor market by 2030, this is the right time for students and professionals to align their skills with VLSI, Embedded Systems, AI/ML hardware, and semiconductor manufacturing. The future is semiconductor — and India is powering ahead as a global hub! https://lnkd.in/gKtU5Gn2 #Semiconductor #VLSI #ChipDesign #EmbeddedSystems #Electronics #SoC #SemiconductorIndia #SemiconductorJobs #SemiconductorTalent #HiringTrends #Careers #ECE #Engineering #SemiconductorEcosystem #MakeInIndia #Innovation #ElectronicsManufacturing #FutureOfWork #AI #ML #Hardware #Manufacturing #IndiaSemiconductorMission

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Are you interested in understanding bare-metal development for microcontrollers? This mini-cookbook, authored by EmbeddedExpertIO, provides step-by-step instructions for writing bare-metal peripheral drivers for the STM32F4 family of microcontrollers. It covers essential topics like GPIO, timers, ADC, and UART. Each section includes practical code examples tested on the STM32F411 Nucleo . Save it for future use or reference 🤓 #Embedded_C #EmbeddedDev #EmbeddedSoftware

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Analog vs. Digital Layout in VLSI Design – What Sets Them Apart? When it comes to chip design, layout is where theory meets silicon. While both analog and digital layouts aim to achieve functionality, their design philosophies differ drastically. 1. Nature of Signals Digital Layout: Deals with logic levels (0s and 1s). As long as timing and noise margins are satisfied, small variations don’t matter. Analog Layout: Sensitive to continuous signal variations. Even slight mismatches or parasitics can degrade performance. 2. Design Goals Digital → Maximize speed, density, and power efficiency. Analog → Ensure precision, matching, low noise, stability, and reliability. 3. Symmetry & Matching Digital: Focus on compactness and routing efficiency. Symmetry isn’t critical. Analog: Device matching (current mirrors, differential pairs, capacitors) is vital. Techniques like common-centroid and interdigitated layouts are used. 4. Sensitivity to Parasitics Digital: Parasitics matter mainly for timing (delay). Tools can optimize these automatically. Analog: Parasitics (capacitance, resistance, coupling) directly affect gain, bandwidth, and offset. Careful manual tuning is required. 5. Automation vs. Manual Effort Digital: Highly automated with P&R (Place & Route) tools. Designers focus more on RTL and synthesis. Analog: Still heavily manual, requiring deep circuit understanding + layout expertise. Tools assist, but human judgment is key. 6. Scaling with Technology Digital: Scales well with Moore’s Law. Shrinking nodes → faster & smaller chips. Analog: Scaling is tricky. Precision, voltage headroom, and device matching don’t always improve with smaller nodes. Digital layout is about automation, density, and speed, while analog layout is about art, precision, and intuition. Both are indispensable, but analog layout remains a craft that demands experience and meticulous attention to detail. 📩 Want to Master Analog Design? Apply here → https://lnkd.in/dZi8JDQA 📱 WhatsApp → https://lnkd.in/g9wNMycs 📡 Telegram → https://t.me/AnalogIC_RFIC #Semiconductor #VLSI #AnalogDesign #DigitalDesign #ChipDesign #ICLayout #Cadence #SemiconductorJobs #FutureOfWork #Electronics #MixedSignal

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India’s digital economy will touch $1T by 2030. We’ll need chips for everything—from smart remotes to rockets. But despite a ₹76,000 Cr incentive, a $100Bn domestic electronics market, and the world's largest VLSI talent pool, India still isn’t building its own semiconductors at scale. Here’s why the “garage startup” mindset doesn’t work for fabless semicon. And what we must do to break the cycle. 👇 BigEndian Semiconductors #semiconductors #makeinindia #fabless #ic #startupindia #startup

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EMIR Checks in VLSI : As process nodes scale to 7nm, 5nm, and beyond, power delivery challenges become critical. EMIR (Electro-Migration & IR drop) analysis isn’t just a signoff formality—it’s the difference between reliable silicon and expensive respins. 🔹 IR Drop Static IR drop: Caused by average current → impacts DC voltage levels, reducing noise margin. Dynamic IR drop: Caused by instantaneous switching activity → leads to timing failures & setup/hold violations. 🔹 Electro-Migration (EM) High current density displaces metal atoms. Leads to void formation (open circuits) or hillocks (shorts). Reliability degradation follows Black’s Equation → failure rate ~ J^n * exp(-Ea/kT), where J is current density. 🔹 Why EMIR Checks Matter ✅ Ensure power integrity across standard cells & macros ✅ Capture voltage droop under realistic switching scenarios ✅ Validate reliability margins of interconnects & vias ✅ Provide lifetime projections for SoCs under actual workloads 🔹 Best Practices Use vector-based dynamic analysis for realistic IR stress conditions. Perform early in-design EMIR closure (not just signoff). Apply localized decap insertion & grid reinforcement where droop hotspots appear. Correlate RTL activity → gate-level simulation → signoff IR analysis for accuracy. With billion-transistor SoCs, EMIR is no longer just a backend task—it’s a design co-pilot. #VLSI #SoC #Semiconductors #ChipDesign #Reliability #EMIR

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DDR5 DRAM MODULE TECHNOLOGY DDR5 DRAM technology, the fifth generation of Double Data Rate Synchronous Dynamic Random Access Memory, offers significant performance improvements over DDR4 with higher bandwidth, lower power consumption, and enhanced data integrity, including on-die error correction code (ECC). Key Features and Advantages: 1. Increased Bandwidth: DDR5 delivers up to twice the bandwidth compared to DDR4, enabling faster data transfer rates and improved system performance. 2. Lower Power Consumption: DDR5 operates at a lower voltage (1.1V) and incorporates on-module power management integrated circuits (PMICs) for better energy efficiency. 3. Enhanced Data Integrity: DDR5 features on-die ECC, which detects and corrects errors before they reach the CPU, leading to more robust and reliable memory performance. 4. Dual 32-bit Subchannels: DDR5 utilizes two independent 32-bit subchannels on a single module, allowing for increased data transfer efficiency and improved scaling performance. 5. Increased Banks and Burst Length: DDR5 doubles the number of banks (16 to 32) and the minimum burst length (8 to 16), further enhancing data bus efficiency and reducing the number of reads/writes to access the same cache data line. 6. Scalable Memory: DDR5 is designed to support higher capacities and speeds, making it suitable for demanding applications like gaming, content creation, and data centers. 7. Improved Performance: DDR5 offers a significant performance boost for CPUs and platforms that require more cores and memory bandwidth. 8. On-die ECC: All DDR5 chips have on-die error-correction code, that detects and corrects errors before sending data to the CPU, to improve reliability and allow denser RAM chips which lowers per-chip defect rate. 9. Power Management Integrated Circuits (PMIC): Regulates the power required by the various components of the memory module. 

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