Ramu Orsu

𝐈𝐧𝐝𝐢𝐚’𝐬 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐇𝐢𝐫𝐢𝐧𝐠 𝐒𝐮𝐫𝐠𝐞 𝐢𝐬 𝐑𝐞𝐝𝐞𝐟𝐢𝐧𝐢𝐧𝐠 𝐂𝐚𝐫𝐞𝐞𝐫𝐬! The semiconductor industry in India is experiencing an unprecedented hiring boom — gradually chipping away at IT placements and opening exciting opportunities for engineers across domains. 🔹 End-to-end hiring: RTL/SoC design, verification, embedded systems, manufacturing (process, packaging, yield). 🔹 Freshers’ salaries: ₹6–12 LPA (vs. ₹3–4 LPA in IT). 🔹 Aggressive campus recruitment from tier-2 & tier-3 colleges, not just IITs. 🔹 Internships: ₹40k–50k/month stipends to build hands-on chip design skills. 🔹 Hiring scale: ~12,000 freshers annually (up from 8,000 last year). 🔹 Career growth: Roles extend up to ₹20–120 LPA for architects & leaders. Fuelled by global supply chain shifts, EVs, telecom, defence, and government initiatives (DLI, PLI, ECMS), this hiring surge is reshaping student aspirations, especially in ECE and core engineering branches. With India projected to hit $103B semiconductor market by 2030, this is the right time for students and professionals to align their skills with VLSI, Embedded Systems, AI/ML hardware, and semiconductor manufacturing. The future is semiconductor — and India is powering ahead as a global hub! https://lnkd.in/gKtU5Gn2 #Semiconductor #VLSI #ChipDesign #EmbeddedSystems #Electronics #SoC #SemiconductorIndia #SemiconductorJobs #SemiconductorTalent #HiringTrends #Careers #ECE #Engineering #SemiconductorEcosystem #MakeInIndia #Innovation #ElectronicsManufacturing #FutureOfWork #AI #ML #Hardware #Manufacturing #IndiaSemiconductorMission

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🚀 𝐔𝐧𝐥𝐨𝐜𝐤𝐢𝐧𝐠 𝐭𝐡𝐞 𝐅𝐮𝐭𝐮𝐫𝐞 𝐰𝐢𝐭𝐡 𝐕𝐋𝐒𝐈 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫𝐬 𝐃𝐨𝐰𝐧𝐥𝐨𝐚𝐝 𝐏𝐃𝐅 𝐁𝐫𝐨𝐜𝐡𝐮𝐫𝐞:https://lnkd.in/gS4e6WWA The VLSI Semiconductor Market is on a strong growth trajectory, valued at USD 60.71 Bn in 2024 and projected to reach nearly USD 97.49 Bn by 2032 at a CAGR of 6.1%. Very-large-scale integration (VLSI) technology revolutionizes integrated circuits by fitting millions of MOS transistors onto a single chip, optimizing space, efficiency, and performance. With rising demand in consumer electronics, automotive, healthcare, and communication sectors, the market is fueled by smart device adoption, electric and hybrid vehicle growth, and the increasing need for advanced semiconductor manufacturing. As industries embrace cutting-edge innovation, VLSI continues to power the backbone of modern electronics. 𝐕𝐋𝐒𝐈 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐌𝐚𝐫𝐤𝐞𝐭 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬 Applied Materials  NVIDIA  Intel Corporation  Texas Instruments  Micron Technology  Qualcomm  Broadcom Inc.  Advanced Micro Devices (AMD)  Marvell Technology  Synopsys Inc. #VLSI #Semiconductor #ICDesign #Microelectronics #TechInnovation #SmartDevices #AutomotiveElectronics #BoycottHDFCBank #MusicUrZone #Cardi #TamannaahBhatia #ConsumerElectronics #HealthcareTech #CommunicationTechnology #HybridVehicles #ElectricVehicles #MEMS #ChipDesign #NextGenTechnology #ElectronicsIndustry #DigitalTransformation #SemiconductorMarket #AdvancedTechnology #FutureOfTech

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DDR5 DRAM MODULE TECHNOLOGY DDR5 DRAM technology, the fifth generation of Double Data Rate Synchronous Dynamic Random Access Memory, offers significant performance improvements over DDR4 with higher bandwidth, lower power consumption, and enhanced data integrity, including on-die error correction code (ECC). Key Features and Advantages: 1. Increased Bandwidth: DDR5 delivers up to twice the bandwidth compared to DDR4, enabling faster data transfer rates and improved system performance. 2. Lower Power Consumption: DDR5 operates at a lower voltage (1.1V) and incorporates on-module power management integrated circuits (PMICs) for better energy efficiency. 3. Enhanced Data Integrity: DDR5 features on-die ECC, which detects and corrects errors before they reach the CPU, leading to more robust and reliable memory performance. 4. Dual 32-bit Subchannels: DDR5 utilizes two independent 32-bit subchannels on a single module, allowing for increased data transfer efficiency and improved scaling performance. 5. Increased Banks and Burst Length: DDR5 doubles the number of banks (16 to 32) and the minimum burst length (8 to 16), further enhancing data bus efficiency and reducing the number of reads/writes to access the same cache data line. 6. Scalable Memory: DDR5 is designed to support higher capacities and speeds, making it suitable for demanding applications like gaming, content creation, and data centers. 7. Improved Performance: DDR5 offers a significant performance boost for CPUs and platforms that require more cores and memory bandwidth. 8. On-die ECC: All DDR5 chips have on-die error-correction code, that detects and corrects errors before sending data to the CPU, to improve reliability and allow denser RAM chips which lowers per-chip defect rate. 9. Power Management Integrated Circuits (PMIC): Regulates the power required by the various components of the memory module. 

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Importance of Testcase in ASIC Verification in VLSI (Complete details with Categorization): A Testcase in any language is used to verify the functional correctness and the integrity of the design. Its basic functionality is to check whether the design is meeting its requirement as per the specification [1] Functional Tests --> In this type of test, the functionality or feature of an IP/module or a subsystem is verified a. Data transfer like read and write cycle, address and data phase, wait states. b. Protocol checks or feature specific to IP, FSM verification c. Command based training, sequence checks and Data Path checks d. Fault and error injection tests, calibration tests [2] Register-based Tests --> RW Tests, RO/WO Tests, Default Read/Hard reset Tests, Soft reset tests, Negative RO/WO Tests, Aliasing, Broadcasting, Special Register test. [3] Connectivity Tests [4] Clock and Reset Tests [5] Boot up Tests, wake up sequence, training sequence tests. For eg. In the case of DDR – MPC Training, RD DQ Calibration, Command Bus training, Write leveling, etc [6] Command and Sequence-based Tests. [7] Overlapping and Unallocated Region tests. [8] Back-to-back data transfer-based tests. [9] UPF Tests --> Power domain, Level Shifter, etc [10] Code Coverage Tests --> In this test toggle, expression, branch, FSM, and conditional coverage holes are measured, and depending on the holes, tests are being written to completely exercise the DUT [11] Functional Coverage Tests --> In these types of test categories, the functionality of DUT is being measured with the help of bins. There are several ways to do it. If there are coverage holes, more bins are coded to cover those areas, complex scenarios are covered with cross coverage. [12] Assertion checks --> Can be thought of as a check against the design. Basically, these are insertion points within the design which improve the observability and debugging ability. [13] C based test for processors and CPU. [14] GLS But to achieve all the above features, testcases are broadly classified into the following two types: [1] Directed Testcase: These are the scenarios that the verification engineers can think of or can anticipate. [2] RandomTestcase: These are the scenarios where the maximum amount of bugs can be caught. The random seeds will hit many different use cases which can not be anticipated earlier and has the probability to catch the design issues. Ideally, random tests can be classified into the following two categories: [1] Corner cases --> This is the bug that is only possible to catch when many different scenarios are processed together or they overlap and the best way to catch this type of scenario is to run more repeated regression with more seeds. [2] Stress testing -->These types of tests are useful to check the performance and the scalability of the DUT under multiple concurrent activities and unpredictable scenarios. #vlsi #asic #electronics #engineering

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EMIR Checks in VLSI : As process nodes scale to 7nm, 5nm, and beyond, power delivery challenges become critical. EMIR (Electro-Migration & IR drop) analysis isn’t just a signoff formality—it’s the difference between reliable silicon and expensive respins. 🔹 IR Drop Static IR drop: Caused by average current → impacts DC voltage levels, reducing noise margin. Dynamic IR drop: Caused by instantaneous switching activity → leads to timing failures & setup/hold violations. 🔹 Electro-Migration (EM) High current density displaces metal atoms. Leads to void formation (open circuits) or hillocks (shorts). Reliability degradation follows Black’s Equation → failure rate ~ J^n * exp(-Ea/kT), where J is current density. 🔹 Why EMIR Checks Matter ✅ Ensure power integrity across standard cells & macros ✅ Capture voltage droop under realistic switching scenarios ✅ Validate reliability margins of interconnects & vias ✅ Provide lifetime projections for SoCs under actual workloads 🔹 Best Practices Use vector-based dynamic analysis for realistic IR stress conditions. Perform early in-design EMIR closure (not just signoff). Apply localized decap insertion & grid reinforcement where droop hotspots appear. Correlate RTL activity → gate-level simulation → signoff IR analysis for accuracy. With billion-transistor SoCs, EMIR is no longer just a backend task—it’s a design co-pilot. #VLSI #SoC #Semiconductors #ChipDesign #Reliability #EMIR

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VLSI Industry Pulse – June 2025 Curated by Thousif Shaik VLSI Physical Design & STA Engineer 🔹 Intel’s Legal Win Energizes Hiring Intel’s $3B court victory over VLSI Technology frees up resources for R&D and hiring, with increased activity expected across its India centers. The growth of Intel Foundry Services opens backend and physical design opportunities across FinFET and advanced nodes. 📍 Aligned to India’s growing design hub role. 🔹 TSMC Expands 2nm+ Development TSMC is scaling 2nm GAA (nanosheet) node manufacturing for 2025–26, with heavy investments in EDA co-optimization and DFM/DFY. This is pushing up demand for engineers skilled in floorplanning, IR/EM, DRC and multi-corner STA. 📍 Indian EDA partners and chip design GCCs are hiring aggressively for these roles. 🔹 Synopsys & Cadence Accelerate AI in EDA Synopsys launched AI-driven flow tuning tools that reduce tape-out cycles by 20–30%. Cadence’s new Jasper AI Formal Platform boosts assertion coverage. 📍 DV, PNR, and STA engineers with ML scripting or automation experience are in high demand. 🔹 India’s Semiconductor Push Continues Micron’s packaging plant in Gujarat, Tata’s fab initiative in Dholera, and ongoing OSAT proposals are building local ecosystems. New chip design CoEs in IITs and NITs are creating internship + fresher roles. spoiler : Great time for freshers & early-career engineers to step in.(this is 🤞) © Thousif Shaik, 2025

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🔍 Why Is VLSI Recruitment So Challenging? 🤔 If you've ever tried hiring in the VLSI domain, you know it’s no walk in the park. From sourcing to onboarding, it’s a tough game—and here’s why: 💡 1. Niche Skill Set: VLSI isn't just another tech buzzword—it’s a highly specialized field requiring deep knowledge in areas like digital design, verification, physical design, and semiconductor fundamentals. Not every engineer can make the cut. 📉 2. Limited Talent Pool: The number of engineers trained in VLSI (especially hands-on experience) is much smaller compared to general software roles. Even fewer have experience with industry tools like Synopsys, Cadence, or Mentor. 🏫 3. Gap Between Academia & Industry: Universities often focus on theoretical aspects, while the industry demands practical expertise. This disconnect makes it harder for fresh grads to be job-ready, slowing down the hiring funnel. ⚙️ 4. Long Training Time: Even if you find good candidates, ramping them up takes months. Companies are cautious because hiring the wrong candidate in a chip design role is costly—literally. 📍 5. High Competition: Big players, startups, and fabs alike are all fishing from the same pond. Good candidates are often snapped up before you even get through the interview process. 🎯 What's the way forward? Partner closely with academic institutions for curriculum alignment Offer internships & co-op programs to create a future talent pipeline Invest in upskilling passionate engineers from adjacent domains Streamline and speed up your hiring process Let’s talk about how we can make VLSI hiring more sustainable and scalable. Are you facing the same challenges? Drop your thoughts below! 👇 #VLSI #Semiconductors #HiringChallenges #TalentAcquisition #ChipDesign #EDA #VLSIHiring #Recruitment

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