We’re pleased to announce that Hidenori Abe, CTO for semiconductor materials and Executive Director of the Electronics Business Headquarters at Resonac, will be speaking at I.S.E.S. Japan 2025 in Tokyo.
Presentation: “Open Innovation Strategy of Resonac, Co-Creative Chemical Company”
Day 1 | Dec 2, 16:30–16:50
As AI demands push semiconductor performance, packaging complexity — especially with chiplet architectures and 2.xD/3D stacking — is rapidly increasing. In this talk, Abe will present Resonac’s open innovation approach to accelerating materials and equipment development, including the Packaging Solution Center, the JOINT2 co-creative evaluation platform, the new JOINT3 initiative, and the US-JOINT program in Silicon Valley launched in 2025.
Panel: “How Far Can Package and Substrate Scaling Go Beyond 2028?”
Day 2 | Dec 3, 11:25–12:10
Venue:
Grand Prince Hotel Takanawa (https://lnkd.in/g8GTrgiF)
Conference Venue and Recommended Hotel
Venue Address: 3-13-1 Takanawa, Minato-ku Tokyo, 108-8612 Japan
About the speaker:
Hidenori Abe leads R&D and strategy for electronic materials across semiconductors, substrates, and displays. He spearheaded JOINT2 in 2021 and has driven open-innovation efforts to advance advanced packaging technologies. Mr. Abe holds a Master’s in Chemical Engineering from Tokyo Institute of Technology and an Executive MBA from the University of Oxford.
About Resonac:
Resonac aims to “Change society through the power of chemistry” by delivering world-class functional chemicals and co-creative solutions that enable technological innovation. We welcome collaboration — from consortium projects to one-on-one co-development — and continue to expand global co-creation activities through initiatives such as the Packaging Solution Center, JOINT2, JOINT3, and US-JOINT.
If you’ll be attending I.S.E.S. Japan 2025, we’d love to connect — please reach out to arrange a meeting or stop by our session.
https://lnkd.in/gXTEGhsk