Valentin Muresan

Another big milestone for Zero ASIC! Our Platypus family of open eFPGA just got a major upgrade in the relase of a set of heterogeneous eFPGAs with built in BRAM and DSP blocks. https://lnkd.in/e-HBARnG Platypus is the only eFPGA in the world guaranteeing: 100% open and standardized FPGA architectures 100% open source FPGA bitstream formats 100% open source FPGA development tools For the reasoning behind our open approach, check out the original Platypus announcement from earlier this year. https://lnkd.in/eyPxEUAX This awesome effort was led by Peter Grossmann, with tool chain contributions from Frederick Tombs, Wildebeest synthesis from Thierry Besson, and SiliconCompiler infrastructure from Peter Gadfort. With SoCs taking years to design and costing $100M - $1B to develop, I am always surprised more teams don't dedicate a portion of the silicon area to eFPGA logic. What's holding you back? Appreciate your thoughts and comments below.

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Greece is entering the semiconductor game with the launch of its first-ever Semiconductor Competence Centre. Backed by €7.26 million in joint national and EU funding, the new Hellenic Chips Competence Centre (HCCC) will focus on R&D, industrial collaboration, and innovation, linking key institutions like Demokritos, FORTH, and CERTH under a nonprofit consortium led by HETiA and the Ministry of Development. Greece is also planning a gallium production investment, aiming to supply the entire EU’s gallium needs, which is a critical material for advanced chips. On September 29, they will join 24 EU countries in signing the Semicon Alliance Declaration in Brussels, cementing their role in Europe’s semiconductor future. #Semiconductors #Chips #Innovation #Greece https://lnkd.in/eSkhriNn

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Germany’s automotive industry is taking proactive measures to prevent another semiconductor supply disruption. The German Association of the Automotive Industry (VDA) announced plans to establish a temporary information platform, operated through a neutral third party, to help manufacturers and suppliers manage chip availability. The platform will allow companies to anonymously list available Nexperia semiconductor capacities, facilitating better coordination across the supply chain while ensuring confidentiality. Importantly, the German antitrust authority has approved the initiative, confirming compliance with competition laws. This move comes as automakers and suppliers continue to navigate semiconductor supply risks that have persisted since the global shortages of 2021–2023. By improving transparency and enabling faster resource allocation, the VDA’s platform aims to mitigate potential bottlenecks before they impact production. It’s a notable example of how collaborative digital tools are being used to strengthen industrial resilience and maintain stability in Europe’s automotive ecosystem. Thanks to Yahoo Finance for providing the full article with additional background, charts, and insights at the link below. 👇 https://lnkd.in/gsNGgqaN #Semiconductors #AutomotiveIndustry #Germany #SupplyChain #VDA #ChipShortage

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POLAR ID metalenz DEMO AND DISCUSSION AT MWC BARCELONA 2025. There may be 110,000 people coming to the Mobile World Congress this week. But this invitation from Rob Devlin, Founder and CEO of Boston based metalenz was personal, designed to share ideas with other Optica corporate members. Apart from the demo, in our extended deep-tech interview Robert shares what's happened in the last couple of years, why their process is different, and the development and launch of their Polar ID sensing system. Their metasurface (or metalens) technology is rapidly becoming a game-changer for the optical industry. From invention in the Capasso lab at Harvard, to high volume production ready in the semiconductor foundry, Metalenz is enabling proliferation of compact advanced sensing in mobile and beyond. You will notice 2 "Roberts" in the video. metalenz has developed the world’s only consumer-scale imaging system that can sense the full polarization state of light; Polar ID enables the next level of biometric security. Using breakthrough advances in meta-optic capability, Polar ID accurately captures the unique “polarization signature” of a human face. With this additional layer of information, even the most sophisticated 3D masks (like the lookalike on the table) and spoof instruments are immediately detected as non-human. Polar ID harnesses meta-optic technology to extract additional information such as facial contour details and to detect human tissue liveness from a single image. We hope Robert can join us for the Global Advanced Manufacturing Alliance meeting at Heidelberg Instruments. For more information about this important meeting, check this link https://lnkd.in/dQJMnVCF or reach out to my Optica Colleague Olga Raz.

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🤝 STMicroelectronics and Morse Micro will be hosting a live joint webinar on 17 September 2025 on how to unlock #IoT 2.0 with Wi-Fi #HaLow and #STM32. 💡 In this webinar, ST and Morse Micro will deep dive into the MM6108-EKH05-05US, a powerful Wi-Fi HaLow (IEEE 802.11ah) development board purpose-built for a wide range of IoT applications. Combining Morse Micro’s #MM6108 Wi-Fi HaLow chip with ST’s advanced components, including the #STM32U5 ultra-low-power MCU, BlueNRG-M2 Bluetooth® module, and the #IIS328DQ 3-axis accelerometer, this development board is ready to power smart cities, industrial monitoring, building automation, and more. Key topics/learnings: ----------------------- 🌟 What defines IoT 2.0 and, more importantly, why traditional wireless tech is no longer enough 🌟 Why Wi-Fi HaLow is the key to long-range, high-throughput IoT 2.0 applications 🌟 ST's role is supporting next gen IoT development and platforming 🌟 How to get started with the MM6108-EKH05-05US dev board for rapid prototyping (whether you’re designing a next-gen asset tracker or a connected environmental sensor) 🌟 Application examples across industrial, smart building, and urban IoT use cases (e.g. camera) Register today via https://lnkd.in/gDksyUxq

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UBM (Under Bump Metallization) Purpose: UBM is a critical layer in advanced semiconductor packaging, enabling reliable electrical and mechanical connections between the chip and solder bumps or copper pillars. Functions: Provides electrical interconnection, wetting for solder, diffusion barrier, and mechanical support. Prevents failures like delamination, solder voids, and electromigration. Applications: Used in Flip-Chip, Wafer-Level Packaging (WLP), Fan-Out WLP, 2.5D/3D IC stacking, and high-end 3D packaging (e.g., HBM, CoWoS). Materials: Multi-layer stacks: adhesion (Ti, TiW, Ta), seed/conductor (Cu), barrier (TiN, Ta, Ni), wetting (Au, Ag), and solder (Sn, SnAgCu). Etching: Selective etchants are used for each metal layer (e.g., HF+H₂O₂ for Ti, H₃PO₄+H₂O₂ for Cu, KI/I₂ for Au). Process control is crucial to avoid over-etching and ensure pad accuracy. Trends: Moving toward finer pitches (<50 μm), eco-friendly chemistries, cost reduction (less Au), and dry/plasma etching for better precision. Conclusion: UBM is foundational for next-gen semiconductor reliability, yield, and performance, especially as packaging becomes more complex and dense.

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Mini-Circuits announces product releases for 16 models of connectorized broadband #RF #highpower #amplifier modules. These are in addition to 600+ amplifier models that are already available in stock. This portfolio of broadband amplifier has operating frequencies from 10 MHz up to 2000 MHz and saturated output power levels as low as 1 W and as high as 50W. The products can be ordered with heatsink or without heatsink. The amplifiers are designed using state of the art #RFpower semiconductor technology. Built-in protection circuits for excessive voltage, power & temperature is implemented in these amplifier models to survive open and short conditions at the specified CW power on the data sheet. The high gain, ~50dB specification of the amplifier, allows it to work with any commercially available signal sources. These amplifiers can be used in a broad range of applications which includes RF #EMC testing for #automotive or #Industrial #IoT, Laser Drivers for #QuantumComputing, General Purpose #Instrumentation Amplifier for lab use, #Communications and various #wireless testing. For more information , visit link below. https://lnkd.in/eDMU2z_j #RFEngineering, #testandmeasurements, #radar, #milcom, #satcom, #telecom,

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Despite the rise of GPUs and custom ASICs, Saban emphasized that the core value of FPGAs remains: flexibility, time-to-market, and adaptability. 40 Years of FPGA: From Logic Cleanup to AI Acceleration https://lnkd.in/dbRh-cB3

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