GUC is honored to participate in the TSMC–BIU Innovation Summit at Bar-Ilan University on December 8. Our CTO, Igor Elkanovich will present Advanced Packaging Technologies for Modular and Powerful Compute, highlighting key technologies including CoWoS®, UCIe, HBM, 3DIC SoIC®, DRAM-on-Logic, IVR, 3Dblox, SoW™, and CPO. We look forward to engaging with the Israeli semiconductor community and sharing how GUC enables next-generation AI/HPC innovation. #GUC #TSMC #AdvancedPackaging #3DIC #UCIe #CoWoS #HBM #AI #HPC #Semiconductor #Innovation #ChipDesign
關於我們
GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC (application-specific integrated circuit) services. Our comprehensive design services include ‘spec-in’ and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs. GUC leads the ASIC service market in the AI (artificial intelligence), HPC (high-performance computing), 5G/networking, SSD (solid-state drive), and several other industrial segments. We are committed to expertly delivering to our customers the most competitive PPA (power, performance, and area) designs, promising quality and yield. We dedicate ourselves to differentiating our ASIC products in the highly competitive market through engineering excellence. Taiwan Semiconductor Manufacturing Co. (TSMC) is our single largest shareholder who holds 35% of the company’s total shares. TSMC is also GUC’s sole foundry supplier as well as the closest partner in advanced process and packaging technologies. Relying on the close relationship with TSMC, GUC is able to conquer various design to manufacturing challenges in order to create excellence in everything we produce. Based in Hsinchu, Taiwan, GUC has a global reputation with presence in North America, Mainland China, Europe, Korea, Japan, and Vietnam. GUC is publicly listed on the Taiwan Stock Exchange (TWSE) under the ticker number “3443”.
- 產業
- 半導體製造
- 公司規模
- 501-1,000 名員工
- 總部
- Hsinchu Science Park
- 類型
- 上市公司
- 創立時間
- 1998
- 專長
- ASIC、Design Service、CoWoS、InFO、SoC、AI、HPC、High Performance Computing、5G、Networking、Data Center、Spec-in、ARM、 RISC-V、TSMC、HBM、GLink、APT和IC Design
地點
創意電子員工
動態消息
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Only Three Days to Go! TSMC China OIP is just around the corner, taking place this year in Nanjing—the final OIP event of 2025. We warmly invite you to visit GUC #Booth25, where our team will showcase cutting-edge innovations in advanced ASIC and 3DIC design. Don’t miss this opportunity to explore how GUC enables next-generation IC design excellence through high-performance IP, advanced packaging, and system-level integration. We look forward to meeting you onsite and discussing how GUC can help accelerate your future designs. See you in Nanjing! 👋🏻 #GUC #TSMCOIP #China #Booth25
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This Thanksgiving, we extend our heartfelt appreciation to our customers, partners, and friends around the world. On this day of gratitude, we reflect on the trust you place in GUC and the many opportunities we have to support your innovations. Your confidence drives us to push boundaries in advanced ASIC design, 2.5D/3D integration, high-performance IP, and next-generation system solutions. 🚀 As the semiconductor industry continues to evolve at an unprecedented pace, your collaboration inspires our commitment to Engineering Excellence, Global Trust, and Forward Together—the core spirit that guides everything we do at GUC. 🤝 Thank you for walking this journey with us and for allowing us to contribute to your success. From all of us at GUC, we wish you and your loved ones a warm, meaningful, and inspiring Thanksgiving. 😊 Happy Thanksgiving! ❤️ #GUC #TheAdvancedASICLeader #HappyThanksgiving
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【TSMC Europe OIP in the Netherlands】 GUC is participating today at the TSMC Europe OIP in Amsterdam, where our leaders and team members are already on-site engaging with attendees. We look forward to meeting you in person and discussing how GUC's latest technologies and solutions can support your next innovation. Join us on-site to explore how our advanced design capabilities, high-performance IP, and system-level expertise can accelerate your roadmap and unlock new engineering potential. We look forward to seeing you there— and be sure not to miss our upcoming presentation. 😊🤝 #TheAdvancedASICLeader #APT #HBM4 #AI *********************************************************************** GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turnkey manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ***********************************************************************
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🎉【GUC Press Release: VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor】🎉 GUC and VSORA achieved the on-schedule tape-out of the Jotunn8 AI inference processor, showcasing advanced 2.5D chiplet integration, HBM3E technology, and full turnkey ASIC design services. This collaboration highlights GUC's leadership in high-performance AI and HPC silicon innovation. 👉 For more information please refer to our website: https://lnkd.in/gC29i5Qk #AI #ASIC #Chiplet #HBM3E #2_5D #AdvancedPackaging #DataCenter #Inference #GUC #VSORA *********************************************************************** GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turnkey manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ***********************************************************************
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【Join us at ICCAD 2025! 🎉】 We warmly welcome you to visit GUC at #Booth_B51_and_B52! On-site, you'll find live demo boards showcasing our successful customer collaborations, and our team will be happy to walk you through our latest technologies and design capabilities. Come meet us, explore what's new, and let's discuss how we can support your next innovation. We look forward to seeing you! 😊 And don't miss our Technical Director's talk tomorrow from 2:10–2:30 p.m. in the "IP & IC Design Service III" session—we warmly invite you to join us!👏 #TheAdvancedASICLeader #2025ICCAD #China #ChengDu *********************************************************************** GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turnkey manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ***********************************************************************
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【GUC will Exhibit at TSMC EU OIP: Nov. 25 (Tue.)】 GUC will be joining the TSMC Europe OIP event in the Netherlands on November 25 with both a booth exhibition and a technical presentation. We warmly invite you to visit our booth and meet our business team in person to learn more about GUC's growth strategy in Europe and upcoming collaboration opportunities. For details about the exhibition and our presentation, please visit: https://lnkd.in/ge-_u4Nj. To register for the event, please sign up via the TSMC website: https://lnkd.in/d7TrBVAn #TheAdvancedASICLeader #TSMCEUOIP #APT *********************************************************************** GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turnkey manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ***********************************************************************
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【GUC's Participation at TSMC TW OIP Was a Great Success】 Thank you to all our executives for joining us on-site and celebrating this year's TSMC TW OIP event together. We were delighted to welcome many distinguished guests and partners to our booth, making it a truly enjoyable and rewarding day for the entire team. We sincerely appreciate your support and guidance, which continue to drive us forward. We look forward to achieving even more milestones together in the upcoming events. #TheAdvancedASICLeader #TSMCTWOIP #APT *********************************************************************** GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turnkey manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ***********************************************************************
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GUC and Ayar Labs have formed a strategic partnership to bring co-packaged optics (CPO) into GUC's advanced ASIC design services. By integrating Ayar Labs' TeraPHY™ optical engines with GUC's advanced packaging flows, the companies are developing a next-generation XPU multi-chip package (MCP) that delivers more than 100 Tbps of full-duplex optical bandwidth—surpassing the limits of electrical interconnects. The design adopts UCIe-S/A interfaces, improves signal and power integrity, enhances thermal performance, and incorporates a new stiffener to enable detachable fiber connections. This collaboration targets the growing electrical I/O bottleneck in AI, HPC, and data center applications. GUC will reveal these advancements tomorrow (Nov. 18) at the 2025 台積電 OIP Ecosystem Forum in Hsinchu, Taiwan. More information please refer to our website: https://lnkd.in/g4cV9Jcu
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