IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds?
Apr 22, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
3D In Context View all
Onshoring Advanced Packaging Update
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...
Meeting Sustainability Goals Hits Political and Technical Headwinds
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Francoise in 3D View all
A Tribute to Paul Werbaneth: Friend and Colleague
Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from a fellow SemiSister, Jane Evans-Ryan, founder and principal of Genuity PR, telling me that she had just learned of Paul Werbaneth’s unexpected death on February 7. 2025 at his home...
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging 2025
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites Awards to eight deserving winners. We donated $70K to the IMAPS Microelectronics Foundation to establish a college fund for women and under-represented minorities seeking a career in microelectronics. Now in...
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
From Different Dimensions View all
Innovation Without Borders: Key Takeaways from ISS Europe 2025
Semiconductors have the power to drive technological breakthroughs and fuel geopolitical tensions. As we stand on the precipice of change, the path we choose will define the industry’s future. I recently attended the Industry Strategy Symposium Europe (ISS Europe 2025) in Sopot Poland, hosted by SEMI. This experience gave me...
March Member News: Shaping the Future of Technology
In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future of technology. New innovations in microelectronics, packaging, and automotive systems highlighted the industry’s focus on efficiency and performance. Major acquisitions reinforced the growing emphasis on secure manufacturing and connectivity, while...
The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects. In Europe, advanced packaging...
Sustainability 101: Making Sense of Sustainability Reporting Requirements
The business news is head-spinning, so it’s understandable that many people feel like they don’t know which way is up. At the risk of publishing something that’s out of date by the time it gets uploaded to the 3D InCites website, I’m going to try to make sense of sustainability...
Interconnectology 101 View all
An Update on AI Development From IMAPS DPC 2025
This year’s IMAPS Device Packaging Conference (DPC) had much to say about AI. As the industry’s golden child, it’s well-known that AI is driving many of the innovations we’re seeing in the advanced packaging space. In my opinion, the biggest takeaway from the event was how AI is creating a...
The Role of AI-Powered 3D X-Rays for Advanced Packaging Test Applications
Semiconductors power AI, AI powers semiconductor manufacturing, and the cycle continues indefinitely. But one area where AI is making a particularly noteworthy contribution is for the test phase of advanced packaging. With advancements in AI, manufacturers can find and address defects within their processes faster than ever, allowing them to...
Navigating the Shortage of Semiconductor Engineers: Tips from the Experts
You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...
How Arizona is Growing its Advanced Packaging Capabilities
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
Packaging IFTLE View all
IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production
TSMC widens edge over Samsung The Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry: “As US semiconductor giant Intel Corp. has faced continuous delays developing its advanced processes, the world’s two major wafer foundries, TSMC and Samsung, have overtaken it and become the main...
IFTLE 623: TSMC Advanced Packaging Coming to the U.S.A.
TSMC Invests Further in Arizona Taiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research...
IFTLE 622: US Joint Consortium; Intel Rumors
When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek” that I would leave that for Cheech and Chong. However, with the recent announcement of 3M joining the consortium and my subsequent understanding of the involvement of my old friend,...
IFTLE 621: TSMC Chip and Package Activity in the U.S.
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process. Monthly capacity is expected to reach 30,000 wafers by mid-year. Construction of Fab 21 Phase 2 and Phase 3 are set to proceed this year and next, with fab...
Latest Posts
Industry Trade Shows and Conferences Strengthen Partnerships and Influence Product Innovation
Conferences and industry trade shows have been the cornerstone of professional networking and educational advancement for as long as I...
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita,...
Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond
The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply...
What You Need to Know About PFAS
You have probably heard about health and environmental concerns related to per- or polyfluoroalkyl substances (PFAS). Companies are being pressured...
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship...
The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a...
US-JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents...
Empowering the Future: New York’s Semiconductor Industry Surge
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards:...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating...
Sustainability 101: 2025 and Progress Toward Sustainability Goals
Happy New Year 2025. How are those 2030 sustainability goals coming along? If you committed to 2025 goals, are you...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid...
2024: A Year of Growth and Innovation
2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments,...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
