How LMEE helps data centers overcome heat barriers

How can data centers keep pace with the rapid evolution of AI and HPC? The demands of extreme density, variable workloads, and constant hardware refreshes require a new approach to infrastructure. Our new report, "The Challenge: Future-Proofing High-Density AI Data Centers," details the technical and operational strategies needed to succeed. Learn how modular designs, scalable liquid cooling, and adaptable architectures are replacing rigid legacy models. Discover how to incrementally scale capacity, streamline deployments, and sustain uptime as computational demands intensify. Download the report to explore how to build a data center that evolves with AI innovation. https://hubs.la/Q03Sv6ns0 #AIDataCenters #HighPerformanceComputing

AI data centers are being built bigger, faster, and more concentrated than ever. These sites do not just use massive power. They draw it in ways the grid was never designed for, with rapid swings that can destabilize local nodes and the wider system. For our customers, speed and reliability are the only moats. They need power systems that let them scale without breaking the grid. That is where AI UPS™ comes in. For data centers: it delivers perfect power quality across the full facility, protecting GPUs and cooling systems. It lowers construction cost, raises total system reliability, and enables grid-interactive operation when required. For the grid: it serves as a validated interface with ISOs and utilities, eliminates transients, improves voltage ride-through, and provides flexibility when the system is most strained. Result: data centers that are cheaper to build, safer to operate, more reliable, faster to connect, more flexible for the grid and safer for all consumers. Learn more: https://lnkd.in/e98h8cRY

💡AI Needs Next-Level Cooling — Chemours Is Ready As AI workloads push data center power densities to unprecedented levels, traditional air cooling is no longer enough. The latest IEEE Spectrum feature explores how liquid cooling is emerging as the solution to the AI heat crisis. At Chemours, we’re proud to be part of this transformation. Our Opteon™ two-phase liquid cooling technology is designed to meet the demands of high-performance compute environments, helping data centers reduce energy and water use while enabling next-gen chip capabilities. 📖 Read the full article from Dina Genkina: https://lnkd.in/eibTmUF2 #AI #LiquidCooling #DataCenters #Sustainability

Excited to see Chemours featured in IEEE Spectrum, highlighting how next-generation cooling is essential for AI-driven data centers. As power densities rise, traditional air cooling just can’t keep up. That’s why liquid cooling—especially our Opteon™ two-phase liquid cooling portfolio—is leading the way in efficiency and sustainability. Proud to be driving innovation that helps reduce energy and water consumption, while supporting the demands of advanced computing. Check out the full article to learn more: https://lnkd.in/eibTmUF2 #AI #DataCenter #LiquidCooling #Opteon #Chemours #Innovation

As Artificial Intelligence workloads surge, traditional data center cooling methods are reaching their limits. Generative AI and GPU-intensive computing are generating up to 5x more heat per rack than conventional IT loads — and this demands a smarter, more sustainable cooling approach. 🌡️ The shift is clear: Air cooling is giving way to liquid cooling and immersion cooling technologies. Direct-to-chip cooling is becoming mainstream in AI clusters. AI-driven DCIM systems are now predicting thermal hotspots before they occur. 💡 What’s driving the change? Efficiency: Every watt saved on cooling boosts total PUE performance. Density: High-performance GPUs need precision thermal control. Sustainability: Reducing carbon footprint while maintaining uptime. As the demand for AI infrastructure scales globally, the future-ready data center isn’t just about compute — it’s about intelligent cooling that learns, adapts, and optimizes in real time. 🌍 Those who master AI + Cooling Integration will define the next generation of digital infrastructure. #DataCenters #liquidcooling #immersioncooling #Sustainability #Innovation #LiquidCooling #EdgeComputing #DigitalInfrastructure #DCIM #AITechnology

【Whitepaper】AI clusters with next-gen accelerators like NVIDIA GB200 are driving rack power beyond 130 kW—air cooling can’t keep up. See how Wiwynn’s Elastic Management Framework powers smarter, faster, more efficient liquid-cooled AI data centers.🚀 https://lnkd.in/gWKHaEGt #LiquidCooling #AIClusters #DataCenters #Innovation #Wiwynn

Keeping cool under fire to accomplish your mission is essential. Make sure your advanced edge computing applications stay cool when you need them most. #AI, #MachineLearning, and sensor data processing is pushing the limits of today's computing cooling capabilities. Ruggedized liquid immersion cooling ensures your critical processing capabilities will stay cool in harsh environments. Learn more at: https://bit.ly/4mxtCCy #LeonardoDRS

Eviden BullSequana XH3000 — Powering the Future of HPC & AI. Eviden’s BullSequana XH3000 represents the next generation of high-performance computing — built for AI, simulation, and exascale workloads. With its modular, energy-efficient design and direct liquid cooling, it delivers unmatched performance and sustainability. A platform designed for flexibility, density, and innovation — ready to take on the world’s most demanding data challenges. Eviden BullSequana XH3000 — where performance meets purpose. Keyur Joshi #Eviden #BullSequanaXH3000 #HPC #AI #Supercomputing #Innovation #Sustainability #Oregonsystems

The new scale of AI and HPC requires a new scale of cooling. As AI workloads continue to scale, data centers must evolve beyond traditional cooling limits. The DCX 5 MW FDU opens a new chapter in data center cooling infrastructure - scalable, efficient, and ready for the future of AI. With up to 5 MW heat transfer, N+1 redundancy, and 360 m³/h flow rate, it supports the most demanding AI and HPC environments with efficiency and reliability. One unit. Facility-scale performance. Scalable. Reliable. Future-ready. If you’d like to learn more or exchange insights on large-scale liquid cooling, feel free to reach out - always happy to connect. 🌐 #LiquidCooling #AI #DataCenters #Scalability #HPC #DCX