Foxconn Interconnect Technology (FIT)’s Post

What an incredible experience at OCP Global Summit 2025 in San Jose! 🎉 https://lnkd.in/gr4zjG_y We were proud to have our Development Engineering Manager -Terry Little present a joint keynote with Intel on "SI in Immersion Cooling Technology," underscoring FIT's leadership in this critical area. Let’s meet at the next event! 🎉 #OCPSummit2025 #AIDataCenter #HighSpeedConnectivity #LiquidCooling #FIT  #LCBusbar   

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