Fraunhofer Institute for Photonic Microsystems IPMS’ Post

LG Chem has completed the development of a liquid photo-imageable dielectric (PID), a core material for advanced semiconductor packaging, marking its entry into the AI and high-performance semiconductor markets. We are also accelerating the development of film-type PID for advanced IC substrates in collaboration with leading global semiconductor companies, aiming to go beyond material supply and shape new trends in the semiconductor market. 🔗 Learn more: https://lnkd.in/gs8Y7wHH #LGChem #WeConnectScience #ConnectingSolutions

LG Chem has completed the development of a liquid photo-imageable dielectric (PID), a core material for advanced semiconductor packaging, marking its entry into the AI and high-performance semiconductor markets.    We are also accelerating the development of film-type PID for advanced IC substrates in collaboration with leading global semiconductor companies, aiming to go beyond material supply and shape new trends in the semiconductor market.   🔗 Learn more: https://lnkd.in/gs8Y7wHH   #LGChem #WeConnectScience  #ConnectingSolutions

Yesterday, CITC - Chip Integration Technology Center and Neways Electronics International NV took an important step in the POLARIS-NGF program theme ‘Valorization - Technology Providers’. This theme focuses on transforming groundbreaking research into competitive industrial solutions. While CITC provides in-depth research expertise in advanced packaging and die-attach technologies, Neways translates these innovations into manufacturable, reliable solutions for real RF applications. Our joint focus is on sintering, a high-performance die-attach technology with enormous potential for radar and MRI systems, and later for broader applications. By combining research-driven insights with industrial capabilities, we aim to: ✅ Validate sintering for RF demonstrators ✅ Accelerate technology readiness from lab to production ✅ Strengthen strategic autonomy of the Dutch microelectronics ecosystem This is what valorization means: bridging the gap between knowledge and market, thus creating impact for industry and society. We will get back to you once we have moved from trials to demonstrators – stay tuned. #valorization #RFtechnology #advancedpackaging #sintering

At Noviotech Campus, collaboration is more than just a buzzword — it’s what drives innovation forward. The partnership between Neways Electronics International NV and CITC - Chip Integration Technology Center perfectly shows what happens when companies that are only meters apart start working together: new ideas emerge, technologies advance, and the entire ecosystem benefits. Both have been part of our community for years, and their joint work in semiconductors and advanced packaging is a great example of the power of connection. It’s exciting to see how this kind of collaboration keeps pushing the region’s innovation agenda forward. #collaboration #semicon #advancedpackaging #nijmegen #theeconomicboard #innovation #tech

x3 Mobility & Reliable Doping for Next-Gen SiC Devices [PIII Technology – Powering the Future of Semiconductors 3/5] SiC is redefining power devices, but processing challenges remain: high dose, low energy implants, and poor channel mobility. Our PULSion PIII technology provides solutions: ✔ Al doping at up to 500°C → improved surface concentration and optimized contact resistivity ✔ Channel mobility improvement: MOSFETs with PULSion doping showed x10 IDS and x3 effective mobility vs. conventional processes ✔ Uniform doping on 150 & 200 mm wafers, scalable to 300 mm PULSion unlocks SiC’s full potential for high-voltage, high-efficiency devices, from R&D to manufacturing. 📍 Visit us at SEMICON Europa 2025 and explore how we can accelerate your SiC device development. 👉 Contact us now to arrange a meeting. information@ion-beam-services.fr #plasmaforpower #semiconductors #WBG #SiC #GaN #powersemiconductors #innovation

GlobalFoundries and Corning Incorporated Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation #Optical #Connectivity https://lnkd.in/eqXiAMcu Glass-waveguide based detachable fiber connector solutions enabling co-packaged optics will be demonstrated at #ECOC2025 and GF’s Technology Summit Learn more at https://lnkd.in/eqXiAMcu #photonic #semiconductor

MPI Corporation Pushing the Limits of High-Frequency Testing Up to 250 GHz CN Rood introduces the new MPI 250 GHz broadband probe solution that advances precision wafer-level measurements for next-generation semiconductor and sub-terahertz applications. This fully integrated system combines MPI’s TITAN™ Probes with their wafer-level test expertise to deliver industry-leading performance, stability, and repeatability for broadband S-parameter characterization up to 250 GHz. Key Features: ✅ Fully calibrated single-sweep measurements up to 250 GHz ✅ Ultra-low insertion and return loss across the entire frequency range ✅ Unique tip visibility and safe, consistent probe contact ✅ Seamless integration with temperature-controlled probe stations As AI, 5G/6G, and optical communication technologies evolve, this solution enables precise and reliable testing at the forefront of semiconductor innovation. Read the full press release: https://lnkd.in/em_knXvj #Semiconductor #HighFrequency #SubTHz #OnWaferTesting #TestAndMeasurement #Engineering #6G

🚀 CITC - Chip Integration Technology Center becomes part of TNO We’re proud to share that the Chip Integration Technology Center (CITC) will officially become part of TNO on 1 January, 2026. This strategic move ensures the long-term continuity of CITC’s research and operations in advanced chip packaging, further strengthening the semiconductor ecosystem in Nijmegen and beyond. This step reinforces the Netherlands’ ambition to lead in photonic and electronic integration. By joining forces, TNO and CITC will: 🔹 Expand leading advanced chip packaging research 🔹 Secure CITC’s growth and international positioning 🔹 Link key semiconductor hubs, including Nijmegen and Eindhoven Read the full story here: https://bit.ly/47liuTj #PhotonicChips #Semiconductors #ChipPackaging #PhotonDelta #TNO #CITC #Innovation #DeepTech

Wrapping up an inspiring week at the IEEE International Integrated Reliability Workshop (IIRW 2025)! The conference this year had a strong focus on memory chips and 3D integration driven by demand from AI data centers, as well as cryogenic CMOS for quantum computing. A fascinating glimpse into the frontiers of semiconductor reliability. On the final day, I had the chance to present two talks: • The first was on a fast NBTI measurement routine for resolving the reverse antenna effect in plasma-induced damage (PID) in CMOS devices. • The second on well charging effects in PID, a presentation submitted by my colleague Andreas Martin, which I was glad to present on his behalf. It was great to exchange ideas with experts tackling reliability challenges across devices, technologies, and scales. Big thanks to the IIRW organizers and attendees for making this such a collaborative environment. I’m heading home with plenty of new insights and ideas to explore! Infineon Technologies #IIRW #infineon #QualityAtInfineon #reliability #SemiconductorReliability #NBTI #PlasmaInducedDamage #CMOS #3DIntegration

Thrilled to share that our invited article, “Structural and electrical characterization of short-wave infrared GeSn diodes,” is officially published Open Access in Optical Materials Express! 🥂 https://lnkd.in/gznmuZny This work is all about bringing SWIR (Short-Wave Infrared) technology down to the silicon chip level, making it compatible with existing CMOS manufacturing. In this work, we present a comprehensive study on GeSn PIN photodetectors grown on Ge-buffered Si(100) substrates—exploring the intricate relationship between background doping, transport mechanisms, and device performance for short-wave infrared (SWIR) detection near 2 µm. This is a critical step forward for making scalable, high-performance infrared imaging and sensing a reality. Huge thanks to the incredible team! 👇 By deeply understanding the relationship between material characteristics and device performance, we are advancing the pathway for scalable, high-performance infrared imaging and sensing. #SWIR #InfraredPhotonics #GeSn #Semiconductors #CMOScompatible #ResearchPublication #Optics #Photodetector