AI’s energy problem isn’t just about how many operations per second we can run. It’s about how often we move data to make those operations possible. For many AI workloads, data movement burns more energy than the compute itself. That’s why compute-in-memory (CIM) is gaining traction. By performing calculations where the data already lives, CIM attacks the biggest efficiency bottleneck. At ISSCC 2024, researchers reported hybrid analog-digital CIM designs pushing 80+ TFLOPS/W. Challenges remain — noise, precision, scaling — but the shift is clear: future accelerators will be measured not just in FLOPS, but in FLOPS per watt of data moved. Read more: IOPLUS: Watt matters in AI hardware — https://lnkd.in/gX-mcT3N Journal of Semiconductors (ISSCC 2024): Energy-efficient ML accelerators — https://lnkd.in/gc6pnvQW #AI #Semiconductors #Accelerators #EnergyEfficiency #ComputeInMemory #AIHardware #EdgeAI #SustainableTech #EmergingTech #MachineLearning
How AI's energy problem is shifting to data movement efficiency
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Semiconductor packaging failures now account for over 65% of field returns in high-performance computing, but traditional reliability methods can’t keep up. AI is stepping in to transform the landscape, enabling predictive analytics, digital twins, and real-time monitoring that drastically reduce downtime and improve performance. Read more to explore how AI is redefining reliability in one of tech’s most critical sectors: https://lnkd.in/evHHVtMK
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Hardware innovation is driving the edge computing revolution. Each new generation of devices must combine AI intelligence, energy efficiency, ruggedness, and secure connectivity within tighter size, power, and cost limits. The ten components listed in this article represent leading solutions already shaping real-world deployments. From ultra-efficient AI accelerators to full-featured system-on-modules, they demonstrate how today’s silicon is evolving to meet tomorrow’s edge requirements. Read the full list: https://bit.ly/43p5gUe #octopart #edgecomputing #AI #components #hardwaredesign
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💡AI Needs Next-Level Cooling — Chemours Is Ready As AI workloads push data center power densities to unprecedented levels, traditional air cooling is no longer enough. The latest IEEE Spectrum feature explores how liquid cooling is emerging as the solution to the AI heat crisis. At Chemours, we’re proud to be part of this transformation. Our Opteon™ two-phase liquid cooling technology is designed to meet the demands of high-performance compute environments, helping data centers reduce energy and water use while enabling next-gen chip capabilities. 📖 Read the full article from Dina Genkina: https://lnkd.in/eibTmUF2 #AI #LiquidCooling #DataCenters #Sustainability
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As Artificial Intelligence workloads surge, traditional data center cooling methods are reaching their limits. Generative AI and GPU-intensive computing are generating up to 5x more heat per rack than conventional IT loads — and this demands a smarter, more sustainable cooling approach. 🌡️ The shift is clear: Air cooling is giving way to liquid cooling and immersion cooling technologies. Direct-to-chip cooling is becoming mainstream in AI clusters. AI-driven DCIM systems are now predicting thermal hotspots before they occur. 💡 What’s driving the change? Efficiency: Every watt saved on cooling boosts total PUE performance. Density: High-performance GPUs need precision thermal control. Sustainability: Reducing carbon footprint while maintaining uptime. As the demand for AI infrastructure scales globally, the future-ready data center isn’t just about compute — it’s about intelligent cooling that learns, adapts, and optimizes in real time. 🌍 Those who master AI + Cooling Integration will define the next generation of digital infrastructure. #DataCenters #liquidcooling #immersioncooling #Sustainability #Innovation #LiquidCooling #EdgeComputing #DigitalInfrastructure #DCIM #AITechnology
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Powering the AI Era, Efficiently As AI workloads continue to grow exponentially, one of the biggest challenges we face is not just compute: it’s power. Delivering energy efficiently to AI processors has become a fundamental bottleneck in scaling next-generation systems. That’s why I’m proud to continue supporting Empower Semiconductor, a company redefining how power is delivered inside AI and data center architectures. Their integrated voltage regulator (IVR) technology brings power delivery directly under the chip, improving efficiency, speed, and density while dramatically reducing energy losses and cooling demands. Congratulations to Tim Phillips, Trey Roessig, and the Empower team on their recent $140M Series D. Exciting to see their vision gain momentum. 👉 Read the full story on the Walden Catalyst blog: https://lnkd.in/eDxT39yu #AI #Semiconductors #DeepTech #EnergyEfficiency #VentureCapital #Sustainability #EmpowerSemiconductor #WaldenCatalyst
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⚡ ABB x NVIDIA: Powering the Future of AI Data Centers 🧠 AI demand is skyrocketing, and with it the need for sustainable and scalable power infrastructure. ABB and NVIDIA have partnered to develop 800 VDC power systems, enabling gigawatt-scale data centers built for high-density GPU workloads. 🔍 In this insight, discover: 💡 Why 800 VDC is transforming data center efficiency 🔋 How solid-state power electronics boost reliability and sustainability 🏗️ The shift toward gigawatt-level AI campuses 🌍 The role of advanced electrification in reducing carbon impact This collaboration is defining how the world will power the next generation of artificial intelligence. 👉 Read the full article to explore the engineering behind AI’s future: 🔗 https://lnkd.in/dwC-C9xh Follow us for more expert insights from Dr. Shahid Masood and the 1950.ai team #DataCenters #AIInfrastructure #SustainableTech #Electrification #NVIDIA #ABB #TechnologyInnovation #1950ai #DrShahidMasood
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🎥 Thad Omura on AI Infrastructure 2.0 with Jun's Economy Lab Astera Labs’ Chief Business Officer, Thad Omura, sat down with Jun's economy lab - 전인구경제연구소 Lab to discuss how Astera Labs is powering the next generation of AI infrastructure. From Scorpio Smart Fabric Switches to PCIe and Ethernet retimers, Thad shared how the company is enabling faster, more scalable, and energy-efficient AI systems deployed by major hyperscalers. He also shared insights on the current hot topic AI Infrastructure 2.0, and how Astera Labs is helping data centers deploy rack-scale AI solutions at speed and scale. Curious to see how Astera Labs is shaping the AI era? Watch the full interview here: https://buff.ly/E7hPLl2 #AIInfrastructure #DataCenters #AIInnovation #TechLeadership #FutureOfAI
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My continuous 100-Day posting Day7. ◆ Core Message Astera Labs, with Thad Omura participating, is advancing AI Infrastructure 2.0, shifting focus to smarter, rack-scale connectivity—that is, connecting compute, memory, and storage with open fabric solutions optimized for next-generation AI. ◆ What This Really Means The next wave of infrastructure will not be about just faster chips—it's about how components interconnect. Through innovations in UALink, CXL®, PCIe®, Ethernet smart modules, and purpose-built switches/retimers, Astera Labs is positioning itself as a key enabler of coherent, low-latency data flow within racks and across AI clusters. ◆ Key Insights At FMS 2025, Astera Labs emphasized innovations in storage, memory, connectivity, demonstrating how interconnect bridges performance gaps in AI workflows. Their product ecosystem includes Aries smart DSP retimers (for PCIe / CXL), Scorpio fabric switches, and Leo smart memory controllers—components enabling seamless connectivity. The company has taken a prominent role in the UALink Consortium, pushing open memory-semantic fabric standards for scale-up AI. Astera Labs is focusing on helping AI architectures evolve from disjointed subsystems to unified, composable systems. ◆ Why This Matters For sales / business teams: You can now position solutions not only on compute specs, but on how well they integrate within a rack or cluster using modern fabrics. For engineering / product teams: Roadmaps must align with connectivity roadmap—knowing that advances in interconnect will constrain or enable performance. Strategic leaders should view Astera Labs as a connectivity infrastructure player with influence in AI system architectures, especially for scale-up clusters. ◆ Final Takeaway Astera Labs, with Thad Omura's role, is pushing AI infrastructure beyond isolated compute or memory pieces—toward integrated, rack-scale systems built around connectivity. AI Infrastructure 2.0 isn't just about speed; it's about coherence, latency, composability, and open standards. ◆ Questions to Reflect / Discuss Within your workloads, where is the biggest friction today—memory bandwidth, latency, I/O bottlenecks, or interconnect? How modular and upgradable is your current architecture to adopt next-gen fabrics like UALink or enhanced CXL/PCIe? Which components (smart retimers, fabric switches, memory controllers) will deliver the most leverage in your system? What partnerships or ecosystem alignment will accelerate adoption of these interconnect standards? How will performance metrics (latency, throughput, power) change when you shift from disjointed subsystems to integrated fabrics?
🎥 Thad Omura on AI Infrastructure 2.0 with Jun's Economy Lab Astera Labs’ Chief Business Officer, Thad Omura, sat down with Jun's economy lab - 전인구경제연구소 Lab to discuss how Astera Labs is powering the next generation of AI infrastructure. From Scorpio Smart Fabric Switches to PCIe and Ethernet retimers, Thad shared how the company is enabling faster, more scalable, and energy-efficient AI systems deployed by major hyperscalers. He also shared insights on the current hot topic AI Infrastructure 2.0, and how Astera Labs is helping data centers deploy rack-scale AI solutions at speed and scale. Curious to see how Astera Labs is shaping the AI era? Watch the full interview here: https://buff.ly/E7hPLl2 #AIInfrastructure #DataCenters #AIInnovation #TechLeadership #FutureOfAI
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Excited to see Chemours featured in IEEE Spectrum, highlighting how next-generation cooling is essential for AI-driven data centers. As power densities rise, traditional air cooling just can’t keep up. That’s why liquid cooling—especially our Opteon™ two-phase liquid cooling portfolio—is leading the way in efficiency and sustainability. Proud to be driving innovation that helps reduce energy and water consumption, while supporting the demands of advanced computing. Check out the full article to learn more: https://lnkd.in/eibTmUF2 #AI #DataCenter #LiquidCooling #Opteon #Chemours #Innovation
💡AI Needs Next-Level Cooling — Chemours Is Ready As AI workloads push data center power densities to unprecedented levels, traditional air cooling is no longer enough. The latest IEEE Spectrum feature explores how liquid cooling is emerging as the solution to the AI heat crisis. At Chemours, we’re proud to be part of this transformation. Our Opteon™ two-phase liquid cooling technology is designed to meet the demands of high-performance compute environments, helping data centers reduce energy and water use while enabling next-gen chip capabilities. 📖 Read the full article from Dina Genkina: https://lnkd.in/eibTmUF2 #AI #LiquidCooling #DataCenters #Sustainability
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Follow my posts closely then. I’ve already hit accuracy on 4bit 99.93% at full speed, 3bit 99.99%, I have stable 2 bit accuracy at 96.12% and I even have 1bit keeping some kind of accuracy but 1bit was always going to be a work in progress. 3bit and lower I need faster processors to run them but they are within grasp in today’s tech.