GUC is honored to participate in the TSMC–BIU Innovation Summit at Bar-Ilan University on December 8. Our CTO, Igor Elkanovich will present Advanced Packaging Technologies for Modular and Powerful Compute, highlighting key technologies including CoWoS®, UCIe, HBM, 3DIC SoIC®, DRAM-on-Logic, IVR, 3Dblox, SoW™, and CPO. We look forward to engaging with the Israeli semiconductor community and sharing how GUC enables next-generation AI/HPC innovation. #GUC #TSMC #AdvancedPackaging #3DIC #UCIe #CoWoS #HBM #AI #HPC #Semiconductor #Innovation #ChipDesign
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